JP2006164249A5 - - Google Patents

Claims (25)

  A laminate in which at least a belt-like or linear conductive film, a first resin film, an integrated circuit, and a second resin film are laminated is wound in a roll shape with the second resin film on the outside, The IC chip, wherein the strip-shaped or linear conductive film is electrically connected to the integrated circuit.   A laminate in which at least a belt-like or linear conductive film, a first resin film, an integrated circuit, and a second resin film are laminated is wound in a roll shape with the second resin film on the outside, The IC chip, wherein the conductive film is electrically connected to the integrated circuit, and the surface is covered with the first and second resin films.   A laminate in which at least an integrated circuit, a first resin film, a strip-like or linear conductive film, and a second resin film are laminated is wound in a roll shape with the second resin film on the outside, The IC chip, wherein the strip-shaped or linear conductive film is electrically connected to the integrated circuit.   A laminate in which at least an integrated circuit, a first resin film, a strip-like or linear conductive film, and a second resin film are laminated is wound in a roll shape with the second resin film on the outside, The IC chip, wherein the conductive film is electrically connected to the integrated circuit, and the surface is covered with the first and second resin films.   A laminate in which at least the conductive film, the first resin film, the integrated circuit, and the second resin film are laminated is wound around the second resin film to form a roll. An IC chip, wherein the conductive film is formed by cutting along the direction in which the conductive film appears, and the conductive film is electrically connected to the integrated circuit.   A laminate in which at least the conductive film, the first resin film, the integrated circuit, and the second resin film are laminated is wound in a roll shape with the second resin film on the outside. It is formed by cutting along the direction in which the body roll appears, and the cut surface is composed of the first and second resin films, and the conductive film is electrically connected to the integrated circuit. IC chip characterized by the above.   A laminated body in which at least the integrated circuit, the first resin film, the conductive film, and the second resin film are laminated is formed by rolling the second resin film outward to form a roll. An IC chip, wherein the conductive film is formed by cutting along the direction in which the conductive film appears, and the conductive film is electrically connected to the integrated circuit.   A laminated body in which at least the integrated circuit, the first resin film, the conductive film, and the second resin film are laminated is formed by rolling the second resin film outward to form a roll. The cut surface is formed of the first and second resin films, and the conductive film is electrically connected to the integrated circuit. IC chip characterized by Any one to Oite of claims 1 to 8, wherein the first and second resin films IC chip characterized by comprising the same material. 10. The IC chip according to claim 1 , wherein the IC chip is further sealed with a film on the outside thereof . 11.   A laminate in which at least a conductive film, a first resin film, a plurality of integrated circuits, and a second resin film are laminated is wound around the second resin film side to form a roll, and the first and second resins In a state where the film is softened and the conductive film is electrically connected to the integrated circuit, the laminated body is fixed in a roll shape, and the laminated body is cut along a direction in which the roll of the laminated body appears in a cross section. A method for manufacturing an IC chip, characterized by:   A laminated body in which a plurality of integrated circuits, a first resin film, a conductive film, and a second resin film are laminated is wound into a roll shape with the second resin film side outside, and the first and first In the state where the resin film of 2 is softened and the conductive film is electrically connected to the integrated circuit, the laminated body is fixed in a roll shape, and the roll of the laminated body appears in a cross section of the laminated body. A method for manufacturing an IC chip, which is cut along the cut.   13. The method for manufacturing an IC chip according to claim 11, wherein the conductive film has a sheet shape.   A laminate in which a plurality of conductive films, a first resin film, a plurality of integrated circuits, and a second resin film are stacked is wound into a roll shape with the second resin film side outside, and the first And the second resin film is softened, and the laminated body is fixed in a roll shape in a state where the conductive film is electrically connected to the integrated circuit, and the roll of the laminated body appears in a cross section of the laminated body A method for manufacturing an IC chip, characterized by cutting along a direction.   A laminated body in which a plurality of integrated circuits, a first resin film, a plurality of strip-like or linear conductive films, and a second resin film are laminated is wound in a roll shape with the second resin film side facing outside. And softening the first and second resin films and electrically connecting the plurality of conductive films to one of the integrated circuits, and fixing the stacked body in a roll shape. A method of manufacturing an IC chip, wherein the body is cut along a direction in which a roll of the laminate appears in a cross section. Any one to Oite of claims 11 to 15, wherein the first and second resin films IC chip manufacturing method of which is characterized by comprising the same material.   An antenna, wherein a resin film and a belt-shaped or linear conductive film stacked at least one layer are wound in a roll shape.   A laminate of at least one layer of a resin film and a belt-like or linear conductive film is wound in a roll shape, and the surface is covered with the resin film except for a connection portion of the conductive film. antenna.   An antenna, comprising: a resin film and a conductive film that are overlapped at least one layer and wound in a roll shape, cut along a direction in which the roll appears in a cross section.   A resin film and a conductive film that are overlapped at least one layer and wound in a roll shape, cut along the direction in which the roll appears in the cross section, except for the connection part of the conductive film, the surface is the above An antenna that is covered with a resin film. 21. An IC chip to which the antenna according to any one of claims 17 to 20 is connected. Oite to claim 21, wherein the IC chip with pre SL antenna, an IC chip, characterized in that are sealed to the outside with a film.   At least one layer of the resin film and the conductive film is overlapped to form a roll, the resin film is softened, the resin film and the conductive film are fixed in a roll, and the roll of the conductive film appears in a cross-section in a direction where the roll appears. The method for manufacturing an antenna is characterized in that the laminate is cut.   24. The method for manufacturing an antenna according to claim 23, wherein the conductive film has a sheet shape.   A laminated body in which at least one layer of a resin film and a conductive film are stacked is wound into a roll shape, and the conductive film is formed between a pair of strip-shaped or linear first patterns arranged opposite to each other. A plurality of parallel second patterns arranged in parallel are integrated, and after winding the laminate, the resin film is softened and the laminate is fixed in a roll shape. A method for manufacturing an antenna, comprising: cutting the laminated body along a direction in which the roll of the laminated body appears, avoiding a portion of the second pattern of the conductor.