JP2006156207A - Socket for electric component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an IC socket allowing the arrangements of signal pins and ground pins to be easily changed. <P>SOLUTION: This socket 10 for an electric component is so structured that a socket body 9 is provided with: an upper plate 13 and a lower plate 14 having insertion holes 13a and 14a for inserting the ground pins 12 and the signal pins 11 formed therein and formed of an insulating material; and an intermediate plate 15 interlaid between the upper plate 13 and the lower plate 14, having insertion holes 15a for loosely inserting the respective pins 11 and 12 formed and made of a conductive material; and includes conductive members 16 installed around the ground pins 12 inserted into the insertion holes 15a of the intermediate plate 15 and electrically connected to the inside wall surfaces 15b of the insertion holes. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an electrical component socket (hereinafter referred to as an “IC socket”) that detachably accommodates an electrical component such as a semiconductor device (hereinafter referred to as an “IC package”), in particular, a signal pin for transmitting a signal and a ground. The present invention relates to a socket for an electrical component that is inserted through a ground pin that performs the above.

  Conventionally, an IC socket that is a “socket for electrical parts” includes a signal pin and a ground pin. Signal transmission is performed by the signal pin, and the signal pin is provided so as to surround and surround the signal pin. Some are configured so as to produce a so-called coaxial effect in which the generation of noise is reduced by being grounded by a plurality of ground pins. (See Patent Document 1)

  The IC socket has a first plurality of holes formed in a substrate made of an insulating material, and signal pins for transmitting signals from the IC package to the terminals of the circuit board are inserted and fixed in the first plurality of holes. The A grid pattern made of a metal mesh or a conductive material so as to surround and separate from the first plurality of holes and cover both the first surface and the second surface of the substrate of insulating material Further, the substrate is formed with a second plurality of holes which are covered with a conductive material and electrically connected to the metal mesh or grid pattern, and ground pins are formed in the second plurality of holes. Has been inserted.

Such an IC socket can provide an improved impedance matched signal path from the IC package to the circuit board, thereby reducing noise generation.
Special table flat 8-504997

  However, in the invention described in Patent Document 1, the IC socket is provided with an insertion hole (through hole) in the socket body (body), and a signal pin (signal path member) or ground is provided in the insertion hole (through hole). Since the pin (ground pin) is configured to be press-fitted, the pin (signal path member, ground pin) may be bent during press-fitting, and the pin (signal path member, ground pin) is attached to or detached from the socket body (body). Was not easy.

  Also, when performing performance tests on IC packages with different types of signal transmission terminals and grounding terminals, signal pins (signal path members) and ground pins (grounding) are selected according to the IC package. Since it is necessary to prepare IC sockets with different pin arrangements, the cost increases, and in order to share the IC socket, if the position of the signal pin and the ground pin is changed, the above press-fit structure Then there was a problem that it was not easy.

  Accordingly, an object of the present invention is to provide an IC socket that can easily change the arrangement of signal pins and ground pins.

  In order to achieve the above object, the invention according to claim 1 is a socket for an electrical component in which a plurality of ground pins for grounding and a plurality of signal pins for signal transmission are inserted and arranged in the socket body. The socket body is formed with insertion holes through which the respective pins are inserted, and is interposed between an upper plate and a lower plate made of an insulating material, and between the upper plate and the lower plate, and a first surface and a second surface An insertion hole that communicates the first surface and the second surface, and each pin is inserted away from the inner wall surface of the insertion hole, and at least the first surface and the An intermediate plate having a second surface and the inner wall surface of the insertion hole made of a conductive material, and disposed around the ground pin inserted through the insertion hole of the intermediate plate, the inner wall surface of the insertion hole, the ground pin, Between the continuity It characterized by having a conductive member that.

  The invention according to claim 2 is characterized in that, in addition to the configuration according to claim 1, the conducting member is a coil spring having conductivity.

  The invention according to claim 3 is characterized in that, in addition to the configuration according to claim 2, the coil spring is formed such that the diameter of the central portion in the vertical direction is larger than the diameter of the upper and lower ends.

  According to a fourth aspect of the present invention, in addition to the configuration according to any one of the first to third aspects, an insertion hole through which the ground pin of the intermediate plate is inserted includes the inner wall surface of the insertion hole and the A cylindrical member having conductivity, which is interposed between the conductive member and is in contact with the conductive member, is detachably disposed.

  According to a fifth aspect of the present invention, in addition to the configuration according to the fourth aspect, the cylindrical member is formed such that a contact portion where the conductive member is in contact with the cylindrical end portion is bent inward of the cylindrical shape. It is characterized by that.

  The invention described in claim 6 is characterized in that, in addition to the configuration described in claim 4 or 5, the cylindrical member is plated with gold.

  According to the first aspect of the present invention, the socket for an electrical component has a socket body including an upper plate, a lower plate, and an intermediate plate, which is divided into three parts and is arranged around the ground pin so as to be within the insertion hole. Since there is a conducting member that is connected to the wall surface, the plates are separated, and the conducting member placed around the ground pin is replaced with the surrounding signal pin, so that what was originally the ground pin is signaled. It can be easily changed to a pin, or a signal pin that was originally a signal pin to a ground pin.

  According to the second aspect of the present invention, since the conductive member is a conductive coil spring, the outer periphery of the coil spring easily contacts the inner wall surface of the insertion hole when the ground pin expands and contracts. The continuity by the member can be improved and the grounding can be surely performed. Further, since the conducting member is a coil spring, the structure of the conducting member is simple, so that the arrangement of the signal pin and the ground pin can be changed more easily.

  According to the third aspect of the present invention, the coil spring is formed such that the diameter of the central portion in the vertical direction is larger than the diameter of the upper and lower end portions, so that the diameter portion of the central portion in the vertical direction is formed on the inner wall surface of the insertion hole. Since it becomes easy to contact | abut, conduction | electrical_connection can be performed still more easily.

  According to the fourth aspect of the present invention, in the insertion hole through which the ground pin of the intermediate plate is inserted, the conductive cylindrical member that comes into contact with the inner wall surface of the insertion hole and the ground pin is detachably disposed. Therefore, if a cylindrical member having excellent conductivity is used, the conductivity by the inner wall surface of the insertion hole, the cylindrical member, and the conducting member is improved, so that the grounding by the ground pin can be more reliably performed.

  According to the fifth aspect of the present invention, since the cylindrical member is formed so that the contact portion where the conductive member comes into contact with the cylindrical end portion is bent inward of the cylindrical shape, the outer peripheral portion of the conductive member is inserted. In addition to abutting laterally on the inner wall surface of the hole, the lower end portion can be pressed against the abutting portion of the cylindrical member and can also be abutted downward, so that the conductivity between the cylindrical member and the conducting member is improved, The grounding by the ground pin can be more reliably performed.

  According to the invention described in claim 6, since the cylindrical member is gold-plated, it is possible to improve the conduction with the conducting member.

Embodiments of the present invention will be described below.
Embodiment 1 of the Invention

  1 to 4 show a first embodiment of the present invention.

  First, the configuration will be described. Reference numeral 10 in FIG. 1 denotes a surface mount IC socket as an “electrical component socket”. The IC socket 10 is used to perform a performance test of the IC package 40 as an “electrical component”. The solder balls 40b which are “terminals” of the IC package 40 and the circuit board P on the IC test apparatus side are electrically connected.

  The IC package 40 is a so-called BGA (Ball Grid Array) type package, and a large number of solder balls 40b protrude in a matrix form at a predetermined pitch downward from the bottom surface of the rectangular plate-shaped package body 40a. (See FIG. 3).

  On the other hand, the IC socket 10 is provided with a plurality of signal pins 11 for transmitting signals and ground pins 12 for grounding inserted in the socket body 9.

  As shown in FIGS. 1 and 2, the socket body 9 includes an upper plate 13 and a lower plate 14 formed of a resin that is an insulating material, and a conductive material interposed between the upper plate 13 and the lower plate 14. An intermediate plate 15 made of aluminum as a material is provided.

  Further, each of the upper plate 13 and the lower plate 14 is formed with insertion holes 13a and 14a through which the pins 11 and 12 are inserted. Further, as shown in FIG. 3, the intermediate plate 15 has a first surface 15c that is an upper surface and a second surface 15d that is a lower surface, and the first surface 15c and the second surface 15d communicate with each other. The insertion hole 15a is provided, and the pins 11 and 12 are inserted away from the insertion hole inner wall surface 15b. The intermediate plate 15 is entirely made of aluminum and has conductivity, so that the first surface 15c, the second surface 15d, and the insertion hole inner wall surface 15b are electrically connected.

  As shown in FIG. 3, the signal pin 11 and the ground pin 12 are formed in the same structure, and move up and down in contact portions 11 a and 12 a that contact the solder balls 40 b of the IC package 40 and the insertion holes 13 a of the upper plate 13. Freely inserted sleeve cylinders 11b and 12b and annular sleeve protrusions 11c and 12c formed on the outer periphery of the sleeve cylinders 11b and 12b to restrict the upward movement of the pins 11 and 12 are provided. .

  In addition, the signal pin 11 and the ground pin 12 are fitted with plungers 11d and 12d at lower end portions of the sleeve cylindrical portions 11b and 12b, and the contact portions 11a and 12a are brought into contact with the solder balls 40b so that the plungers 11d and 12d are It is configured to be electrically connected when it comes into contact with the substrate P.

  In the signal pin 11 and the ground pin 12, the upper portions of the sleeve cylinder portions 11b and 12b are fitted into the insertion holes 13a of the upper plate 13, and the lower portions of the plungers 11d and 12d are inserted into the insertion holes 14a of the lower plate 14. Are inserted in the insertion hole 15a of the intermediate plate 15 so that the lower side portions of the sleeve cylinder portions 11b and 12b and the upper side portion of the plungers 11d and 12d are inserted into the insertion holes 15a of the intermediate plate 15. It is inserted away from the wall surface 15b.

  The contact portions 11a and 12a are configured such that a crest formed in an annular shape on the outer peripheral side surrounds a central portion that forms a recess, and when the solder ball 40b of the IC package 40 is placed from above. The solder balls 40b are configured to be easily contacted.

  The sleeve cylinder portions 11b and 12b are provided with contact portions 11a and 12a at the upper end portions thereof, and are inserted through the insertion holes 13a of the upper plate 13, and the solder balls 40b of the IC package 40 are placed on the contact portions 11a and 12a. Then, it moves downward, and when the solder ball 40b is removed from the contact portions 11a, 12a, it moves upward.

  The plungers 11d and 12d are fitted at their upper ends to the lower ends of the sleeve cylinders 11b and 12b and joined to springs (not shown) built in the sleeve cylinders 11b and 12b.

  When the lower end portions of the plungers 11d and 12d are in contact with the circuit board P, and when the contact portions 11a and 12a are in contact with the solder balls 40b, the plungers 11d and 12d are moved into the sleeve cylindrical portions 11b and 12b. At this time, due to the elastic expansion and contraction force of a spring (not shown) built in the sleeve cylindrical portions 11b and 12b, the plungers 11d and 12d and the circuit board P are connected between the contact portions 11a and 12a and the solder balls 40b. A moderate contact pressure is applied between the two.

  In the state where the lower end portions of the plungers 11d and 12d are not in contact with the circuit board P, or in the state where the contact portions 11a and 12a are not in contact with the solder balls 40b, the sleeve cylinder portions 11b and 12b are illustrated. Since the spring not to be extended is extended, the pins 11 and 12 are in the extended state.

  Therefore, the signal pin 11 and the ground pin 12 are configured to exhibit predetermined elasticity in a state where both ends are sandwiched between the IC package 40 and the substrate P.

  The sleeve protrusions 11c and 12c are annular protrusions formed on the outer periphery at substantially the center in the length direction of the sleeve cylinders 11b and 12b, and the signal pin 11 and the ground pin 12 move upward. It has a function to limit.

  Further, as shown in FIG. 3, the ground pin 12 is located between the sleeve projection 12c and the plunger 12d in the length direction, between the sleeve cylindrical portion 12b and the plunger 12d, and the insertion hole inner wall surface 15b. A coil spring 16 is disposed in the space as a conducting member that is electrically connected to the inner surface 15b of the insertion hole.

  Further, as shown in FIG. 3, the coil spring 16 is formed such that the diameter of the central portion in the vertical direction is larger than the diameter of the upper and lower ends. The coil spring 16 is grounded on the substrate P through the intermediate plate 15 by connecting the outer peripheral portion having a large diameter to the inner wall surface 15 b of the insertion hole. From this, it can be said that the ground pin 12 exhibits the earth function only when the coil spring 16 is disposed around it.

  Since the upper end portion of the coil spring 16 is substantially the same diameter as the sleeve cylinder portion 12b and smaller than the sleeve cylinder portion 12c, the coil spring 16 also has a function of restricting the sleeve protrusion 12c from descending. It can be said that there is.

  Next, a method for using the IC socket 10 according to the first embodiment of the present invention will be described.

  With the IC socket 10 attached to the circuit board P in advance, the lower ends of the plungers 11d and 12d of the signal pin 11 and the ground pin 12 come into contact with the circuit board P and rise.

  In this state, the IC package 40 and the circuit board P are electrically connected as follows.

  The IC package 40 is transported by an automatic machine or the like and stored in a predetermined position on the IC socket 10.

  Thereafter, when the IC package 40 is pressed downward, the solder balls 40b are brought into contact with the contact portions 11a and 12a of the signal pins 11 and the ground pins 12, and the sleeve cylindrical portions 11b and 12b are lowered, and the solder balls 40b are lowered. Electrical contact between the ball 40b and the contact portions 11a and 12a is ensured. Due to the lowering of the sleeve cylinder portions 11b and 12b, the urging force of a spring (not shown) is further increased, and the contact pressure between the solder ball 40b and the pins 11a and 12a and the contact pressure between the plungers 11d and 12d and the circuit board P are further increased. It will be moderate.

  Therefore, since the sleeve cylinder portions 11b and 12b and the plungers 11d and 12d slide relative to each other and rub against each other, electrical connection can be established between them. High frequency performance can be improved by adding to the path which conducts between 12b, the spring which is not illustrated in sleeve cylinder parts 11b and 12b, and plunger 11d and 12d.

  On the signal pin 11 side, the signal transmission solder ball 40 b of the IC package 40 is electrically connected to the signal transmission electrode portion of the circuit board P through the signal pin 11. On the ground pin 12 side, a plurality of grounding solder balls 40 b of the IC package 40 are electrically connected to the grounding electrode portion of the circuit board P via the ground pin 12, the coil spring 16 and the intermediate plate 15. It becomes a state.

  In this way, the IC package 40 and the circuit board P are electrically connected via the IC socket 10 to perform a performance test or the like of the IC package 40. At this time, the coaxial effect is obtained by providing the signal pin 11 and the ground pin 12, and the generation of noise is reduced.

  Next, a method for changing the arrangement of the signal pins 11 and the ground pins 12 in the IC socket 10 will be described.

  First, the lower plate 14 of the IC socket 10 is removed, and the intermediate plate 15 is exposed. Then, the signal pin 11 and the ground pin 12 inserted through the insertion hole 15a are removed from the coil spring 16 or attached in accordance with a position where the signal transmission of the IC package 40 is required or a position where the ground is required. I do.

  In order to change the insertion hole 15a through which the ground pin 12 is inserted so that a signal can be transmitted, the coil spring 16 is removed, and the removed coil spring 16 needs to ground the IC package 40. It is moved and arranged in the insertion hole 15a at a location corresponding to the position. If the IC package 40 requires more grounding parts than the original IC socket 10, the coil spring 16 is appropriately replenished, and if less is required, it is excluded. The

  Finally, the lower plate 14 is put on the intermediate plate 15 with the signal pin 11 and the ground pin 12 inserted through the insertion hole 14a.

  In the ground pin 12, when the solder ball 40 b comes into contact with the contact portion 11 a, the coil spring 16 and the insertion hole inner wall surface 15 b are electrically connected to each other, whereby the signal pin 11 and the ground pin 12 are electrically connected. The coaxial structure is completed again.

  By using the IC socket 10 in this way, the socket body 9 includes an upper plate 13, a lower plate 14 and an intermediate plate 15, and is divided into three parts. Since the coil spring 16 that is electrically connected to the inner wall surface 15 b is provided, the plates 13, 14, and 15 are separated, and the coil spring 16 disposed around the ground pin 12 is replaced with the signal pin 11. Thus, it is possible to easily change what was originally the ground pin 12 to the signal pin 11 and what was originally the signal pin 11 to the ground pin 12.

  Further, since the outer periphery of the coil spring 16 easily comes into contact with the inner wall surface 15b of the insertion hole when the ground pin 12 expands and contracts, the continuity by the coil spring 16 is improved and the grounding can be surely performed. . Further, since the structure of the coil spring 16 is simple, it is possible to further easily change the arrangement of the signal pin 11 and the ground pin 12.

  Since the coil spring 16 is formed such that the diameter of the central portion in the vertical direction is larger than the diameter of the upper and lower end portions, the diameter portion of the central portion in the vertical direction can easily come into contact with the inner wall surface 15b of the insertion hole. It can be done easily.

In the first embodiment of the present invention, the intermediate plate 15 is formed of aluminum as a whole so as to have conductivity. However, the present invention is not limited to the above embodiment, and the first surface 15c If the second surface 15d and the insertion hole inner wall surface 15b can be electrically connected, at least the first surface 15c, the second surface 15d, and the insertion hole inner wall surface 15b are formed of a conductive material. You may make it.
[Embodiment 2]

5 and 6 show a second embodiment of the present invention.
The second embodiment of the present invention is different from the first embodiment of the present invention in that a cylindrical member 17 is provided. The same components as those in the first embodiment of the present invention will be described below with the same reference numerals.

  First, the configuration will be described. The IC socket 20 is inserted in the insertion hole 15a through which the ground pin 12 of the intermediate plate 15 is inserted, between the inner wall surface 15b of the insertion hole and the coil spring 16 which is a conductive member. A cylindrical member 17 having conductivity contacting the inner wall surface 15b of the hole and the coil spring 16 is detachably disposed. The cylindrical member 17 is gold-plated, and is configured to have conductivity when the outer periphery of the coil spring 16 is in contact with the cylindrical member inner wall 17b.

  The arrangement of the signal pins 11 and the ground pins 12 in the IC socket 20 is changed by attaching and detaching the cylindrical member 17 together with the attachment and detachment of the coil spring 16 described in the first embodiment of the present invention. Is changed to the ground pin 12, or the ground pin 12 is changed to the signal pin 11.

  That is, when it is desired to change the ground position by the ground pin 12 in the socket body 9, the coil spring 16 and the cylindrical member 17 of the ground pin 12 are eliminated to form the signal pin 11, or the coil spring 16 and the cylindrical member are connected to the signal pin 11. 17 is provided as a ground pin 12.

According to such an IC socket 20, the conductive cylindrical member 17 that comes into contact with the inner wall surface 15 b of the insertion hole and the ground pin 12 is attached to and detached from the insertion hole 15 a through which the ground pin 12 of the intermediate plate 15 is inserted. Since the cylindrical member 17 provided with the gold plating is excellent in conductivity, the grounding by the ground pin 12 can be more reliably performed.
[Embodiment 3]

7 and 8 show a third embodiment of the present invention.
The third embodiment of the present invention is different from the second embodiment of the present invention in that the shape of the cylindrical member 18 is that the bottom surface side of the cylindrical member 17 is bent to form the contact portion 18a. . The same components as those in the second embodiment of the present invention will be described below with the same reference numerals.

  The IC socket 30 is formed such that the tubular member 18 is bent inwardly at the abutting portion 18a where the coil spring 16 contacts the end of the tubular portion.

  The arrangement of the signal pin 11 and the ground pin 12 in the IC socket 30 is changed by attaching / detaching the tubular member 18 instead of the tubular member 17 when attaching / detaching the coil spring 16 described in the second embodiment of the present invention. Thus, the signal pin 11 and the ground pin 12 are changed, or the ground pin 12 is changed to the signal pin 11.

  According to such an IC socket 30, the cylindrical member 18 is formed so that the contact portion 18a with which the coil spring 16 comes into contact with the cylindrical end is bent inward of the cylindrical shape. Not only is the portion abutting laterally against the cylindrical member inner wall 18b and the outer wall of the cylindrical member 18 further laterally contacting the insertion hole inner wall surface 15b, but the lower end is pressed against the abutting portion 18a of the cylindrical member 18. Since it can contact also in the downward direction, the grounding by the ground pin 12 can be more reliably performed.

It is a top view of the IC socket which concerns on Embodiment 1 of this invention. FIG. 2 is a cross-sectional view taken along line AA of FIG. 1 according to the first embodiment. It is an expanded sectional view of the IC socket according to the first embodiment. It is a block diagram of the coil spring arrange | positioned around the ground pin of the IC socket which concerns on the same Embodiment 1. FIG. It is an expanded sectional view of the IC socket which concerns on Embodiment 2 of this invention. It is a block diagram of the coil spring and cylinder member which are arrange | positioned around the ground pin of the IC socket which concerns on the same Embodiment 2. FIG. It is an expanded sectional view of the IC socket which concerns on Embodiment 3 of this invention. It is a block diagram of the coil spring and cylindrical member which are arrange | positioned around the ground pin of the IC socket which concerns on the same Embodiment 3. FIG.

Explanation of symbols

10,20,30 IC socket
11 Signal pin
12 Ground pin
13 Upper plate
14 Lower plate
15 Intermediate plate
15a Insertion hole
15b Insertion wall
15c First side
15d Second side
16 Coil spring
17,18 Tube member

Claims (6)

In the socket for electrical parts in which a plurality of ground pins for grounding and a plurality of signal pins for signal transmission are inserted and arranged in the socket body,
The socket body is formed with an insertion hole through which each pin is inserted, and an upper plate and a lower plate made of an insulating material,
Each pin is interposed between the upper plate and the lower plate, has a first surface and a second surface, and is provided with an insertion hole that communicates the first surface and the second surface. An intermediate plate in which at least the first surface, the second surface, and the inner surface of the insertion hole are made of a conductive material, and are inserted separately from the inner wall surface of the insertion hole,
An electrical component socket, comprising: a conductive member disposed around the ground pin inserted through the insertion hole of the intermediate plate and configured to conduct between the inner wall surface of the insertion hole and the ground pin.   The electrical component socket according to claim 1, wherein the conductive member is a coil spring having conductivity.   3. The electrical component socket according to claim 2, wherein the coil spring is formed such that the diameter of the central portion in the vertical direction is larger than the diameter of the upper and lower ends.   In the insertion hole through which the ground pin of the intermediate plate is inserted, a conductive cylindrical member that is interposed between the inner wall surface of the insertion hole and the conductive member and is in contact with both is detachably disposed. The electrical component socket according to claim 1, wherein the electrical component socket is provided.   The socket for an electrical component according to claim 4, wherein the cylindrical member is formed such that a contact portion with which the conducting member contacts a cylindrical end is bent inward of the cylindrical shape. 6. The electrical component socket according to claim 4, wherein the cylindrical member is plated with gold.

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