JP2006148646A - Non-reciprocal circuit element - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an inexpensive non-reciprocal circuit element which can be miniaturized and has satisfactory performance. <P>SOLUTION: In this non-reciprocal circuit element, a chip type capacitor C is used for capacitors C1, C2 and C3 connected to ports 6a, 7a and 8a of first, second, third center conductors 6, 7 and 8. A third electrode 12c is provided opposite to a second electrode 12b of the chip type capacitor C on the top surface of a multilayer substrate 5. Each capacitors C1, C2 and C3 is formed of capacities between the first and second electrodes 12a and 12b, and between the second and third electrodes 12b and 12c. Thus, the existing chip type capacitor C can be used, and a product smaller and more inexpensive than a conventional product can be obtained and a product having larger capacitance value can be provided by the third electrode 12c. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an irreversible circuit element including an isolator or a circulator applied to an antenna duplexer or the like.

  FIG. 7 is a plan view of a conventional non-reciprocal circuit element, FIG. 8 is an exploded perspective view of the conventional non-reciprocal circuit element, and the configuration of the conventional non-reciprocal circuit element will be described with reference to FIGS. Then, a plurality of holes 51 b are provided in the upper plate 51 a of the box-shaped first yoke 51, and the magnet 52 is disposed in the first yoke 51 and the U-shaped second The yoke 53 is coupled to the first yoke 51, and the first and second yokes 51 and 53 form a magnetic closed circuit.

  The first, second, and third center conductors 55, 56, and 57 made of a thin metal plate are wound around the outer periphery of the flat ferrite member 54, and the first, second, and third centers are provided. Port portions 55a, 56a, 57a are provided on one end side of the conductors 55, 56, 57, and an earth portion (not shown) grounded to the second yoke 53 is provided on the other end side.

  The multilayer substrate 58 is formed by laminating a plurality of ceramics. The multilayer substrate 58 includes a hole 58a provided at the center, electrodes 59a, 59b, 59c provided on the upper surface, electrodes 59a, 59b, A common electrode (not shown) provided on the lower surface in a state of facing the 59c is provided, and three capacitors are formed between the electrodes 59a, 59b, 59c and the common electrode.

The multilayer substrate 58 is disposed in the second yoke 53, and the ferrite member 54 to which the first, second, and third center conductors 55, 56, and 57 are attached is disposed in the hole 58a. The port portions 55a, 56a, and 57a are connected to the electrodes 59a, 59b, and 59c, respectively.
The electrodes 59a, 59b, and 59c are exposed from the hole 51b of the first yoke 51, and the matching capacitance is adjusted by trimming the electrodes 59a, 59b, and 59c. (For example, see Patent Document 1)

However, the conventional non-reciprocal circuit device requires the multilayer substrate 58 to form a capacitor, which not only increases the cost of the capacitor but also increases the size and cannot be reduced in size.
Further, since the central conductors 55, 56, and 57 are wound around and attached to the ferrite member 54, the center conductors 55, 56, and 57 are not only misaligned due to vibrations, but also the positions of the central conductors 55, 56, and 57 are varied. Deteriorate.

JP-A-9-289402

The conventional non-reciprocal circuit device requires a laminated substrate 58 to form a capacitor, which not only increases the cost of the capacitor but also increases the size of the capacitor and cannot be reduced in size.
Further, since the central conductors 55, 56, and 57 are wound around and attached to the ferrite member 54, the center conductors 55, 56, and 57 are not only misaligned due to vibrations, but also the positions of the central conductors 55, 56, and 57 are varied. There is a problem of getting worse.

  Therefore, an object of the present invention is to provide a nonreciprocal circuit device that can be reduced in size, is inexpensive, and has good performance.

  As a first solving means for solving the above-mentioned problems, a flat ferrite member and first and second insulating members located on the ferrite member and insulated from each other at a predetermined angle through a dielectric layer are provided. A multilayer substrate having second and third center conductors, a magnet disposed on the center conductor, a first yoke disposed to cover the upper surface of the magnet, and a lower surface side of the ferrite member are mounted. And a second yoke that forms a magnetic closed circuit with the first yoke, and is disposed in the second yoke, and has a center plate that is bent from the bottom plate and extends upward. A chip-type capacitor connected to a conductor, wherein the center conductor has a port portion connected to the chip-type capacitor and a ground portion grounded to the second yoke, With insulator The first electrode of the chip type capacitor is connected to the bottom plate and grounded, and the lower surface of the multilayer substrate is provided. The port portion of the central conductor drawn out to the second electrode is connected to the second electrode, provided on the upper surface of the multilayer substrate at a position facing the second electrode, and grounded to the second yoke The capacitor formed on the side of the port portion is provided with a capacitance between the first and second electrodes and between the second and third electrodes. .

As a second solution, the capacitor has a configuration in which the matching capacitance is adjusted by cutting or cutting the third electrode.
As a third solution, the third electrode is provided with a capacity adjustment protrusion, and the capacity is adjusted at the position of the protrusion.

As a fourth solution, the projecting portion is formed of a conductor for forming the third electrode or a slit portion provided in the conductor and the multilayer substrate.
As a fifth solution, the ground portion of the first, second, and third central conductors is provided on the upper surface of the multilayer substrate, and the third electrode and the ground portion are the second portion. The yoke is connected to the side plate and grounded.

The nonreciprocal circuit device of the present invention includes a flat ferrite member and first, second, and third insulating members located on the ferrite member and insulated from each other at a predetermined angle through a dielectric layer. A multilayer substrate having a central conductor, a magnet disposed on the central conductor, a first yoke disposed to cover the upper surface of the magnet, a bottom plate on which the lower surface side of the ferrite member is placed, and the bottom plate A second yoke that has a side plate that is bent upward and extends upward, and forms a magnetic closed circuit with the first yoke, and a chip-type capacitor that is disposed in the second yoke and is connected to the central conductor; The center conductor has a port portion connected to the chip capacitor and a ground portion grounded to the second yoke, and the chip capacitor is opposed to the insulator across the insulator The first and second electric power provided A first electrode of the chip capacitor is connected to the bottom plate and grounded, and a port portion of the central conductor led to the lower surface of the multilayer substrate is connected to the second electrode, and the upper surface of the multilayer substrate Is provided with a third electrode which is provided at a position facing the second electrode and is grounded to the second yoke, and the capacitor formed on the port side is provided between the first and second electrodes. And a capacitance formed between the second and third electrodes.
That is, a chip-type capacitor is used, and a third electrode facing the second electrode is provided on the upper surface of the multilayer substrate. 3 is formed with a capacitance between the three electrodes, an existing chip-type capacitor can be used, and a smaller and less expensive one than the conventional one can be obtained. The third electrode has a larger capacitance value. Can be provided.
Further, since the central conductor is formed by being laminated on the multilayer substrate, there is no positional deviation between the central conductors and no positional deviation due to vibration or the like as compared with the conventional one, and a product with good performance can be obtained.

  Further, since the matching capacity of the capacitor is adjusted by cutting or cutting the third electrode, the matching capacity can be easily adjusted from the upper surface side of the multilayer substrate.

  Further, since the third electrode is provided with a capacity adjustment protrusion, and the capacity is adjusted at the protrusion, the matching capacity can be adjusted more easily.

  In addition, the protrusion is formed of a conductor for forming the third electrode, or a slit portion provided in the conductor and the multilayer substrate. Therefore, the protrusion can be easily formed, and the protrusion has various shapes. The formation of is excessive.

  In addition, the ground surface of the first, second, and third center conductors is provided on the upper surface of the multilayer substrate, and the third electrode and the ground portion are connected to the side plate of the second yoke and are grounded. Work can be easily performed from the same side, and a product with good productivity can be obtained.

  Referring to the drawings of the non-reciprocal circuit device of the present invention, FIG. 1 is a cross-sectional view of the main part of the first embodiment of the non-reciprocal circuit device of the present invention, and FIG. 2 is the first embodiment of the non-reciprocal circuit device of the present invention. FIG. 3 is a bottom view of the multilayer substrate according to the first embodiment of the nonreciprocal circuit device of the present invention, and FIG. 4 is a nonreciprocal circuit of the present invention. FIG. 5 is a plan view of the main part according to the third embodiment of the nonreciprocal circuit element of the present invention, and FIG. 6 is a capacitance adjustment of the nonreciprocal circuit element of the present invention. It is explanatory drawing for demonstrating a method.

  Next, regarding the first embodiment of the non-reciprocal circuit device of the present invention, the configuration when applied to an isolator will be described with reference to FIGS. 1 to 3. A U-shaped or box-shaped magnetic plate (iron plate or the like) The first yoke 1 is made up of a square (rectangular) upper plate 1a and a side plate 1b bent downward from the side of the upper plate 1a.

  The rectangular (rectangular) magnet 2 is positioned in the first yoke 1, and the upper surface thereof is in contact with the inner surface of the upper plate 1a. It is attached.

The second yoke 3 made of a U-shaped or box-shaped magnetic plate (iron plate or the like) includes a rectangular bottom plate 3a, a side plate 3b bent upward from the side of the bottom plate 3a, and the vicinity of the outer periphery of the bottom plate 3a. Provided with a plurality of protruding portions 3c protruding upward.
In the second yoke 3, the side plate 3b is coupled to the side plate 1b of the first yoke 1 in a state where the bottom plate 3a is disposed facing the upper plate 1a, thereby forming a magnetic closed circuit. .

A flat ferrite member 4 made of YIG (Yttrium iron garnet) or the like is disposed on the bottom plate 3 a in the second yoke 3 in a state of facing the magnet 2.
The multilayer substrate 5 made of a flexible substrate or the like is formed by laminating a plurality of dielectric layers, and has a plurality of holes 5a penetrating in the thickness direction.

  The first, second, and third center conductors 6, 7, and 8 made of a thin conductive plate are insulated from each other in a state of crossing at a predetermined angle (120 degrees) through the dielectric layer of the multilayer substrate 5. The first center conductor 6 is formed on the lower surface of the multilayer substrate 5, the second center conductor 7 is provided in the stack of the multilayer substrate 5, and the third center conductor 8 is It is provided on the upper surface of the multilayer substrate 5.

  These first, second, and third center conductors 6, 7, and 8 include port portions 6a, 7a, and 8a provided on one end side, and ground portions 6b and 7b provided on the other end side. 8b, and the port portions 7a and 8a of the second and third center conductors 7 and 8 are connected to the multilayer substrate 5 via connection conductors 9a such as through holes provided in the holes 5a of the multilayer substrate 5. The port portions 6 a, 7 a, 8 a of the first, second, and third center conductors 6, 7, 8 are arranged on the lower surface of the multilayer substrate 5.

  The ground portions 6 b and 7 b of the first and second center conductors 6 and 7 are drawn to the upper surface of the multilayer substrate 5 through connection conductors 9 b such as through holes provided in the holes 5 a of the multilayer substrate 5. The ground portions 6 b, 7 b, 8 b of the first, second, and third center conductors 6, 7, 8 are arranged on the upper surface of the multilayer substrate 5.

The multilayer substrate 5 having such a configuration is placed on the ferrite member 4 with the first central conductor 6 side facing down, and the respective ground portions 6b, 7b, 8b are side plates of the second yoke 3. Solder 10 is attached to 3b and grounded.
The connection conductors 9a and 9b have been described in the form of through holes in this embodiment, but may be formed by side electrodes.

  Further, on the upper surface of the multilayer substrate 5, three protruding third electrodes 12 c made of a conductor are provided, and the third electrodes 12 c are attached to the side plates 3 b of the second yoke 3 by the solder 10. It is grounded and constitutes a part of first, second and third capacitors C1, C2 and C3 which will be described later.

The three chip capacitors C include a first electrode 12a provided on the insulator 11, and a second electrode 12b provided opposite to the first electrode 12a with the insulator 11 interposed therebetween.
Each of the three chip-type capacitors C is arranged on the outer periphery of the ferrite member 4, and the first electrode 12a is placed on the top of the protruding portion 3c provided on the bottom plate 3a. 12a is in a state of being grounded to the protruding portion 3c by soldering.

  Each of the second electrodes 12b of the three chip capacitors C is connected to the port portions 6a, 7a, 8a of the first, second, and third center conductors 6, 7, 8, and Each of the second electrodes 12b connected to the port portions 6a, 7a, 8a is opposed to the third electrode 12c through the multilayer substrate 5, and each of the port portions 6a, 7a, 8a side has a second electrode 12b. The first, second, and third capacitors C1, C2, and C3 are matching capacitors formed by the capacitance between the first and second electrodes 12a and 12b and the second and third electrodes 12b and 12c.

Further, the third electrode 12c can be adjusted in capacity (matching capacity) between the third electrode 12c and the second electrode 12b by cutting or cutting, as will be described later.
In addition, the multilayer substrate 5 is placed on the upper surface of the ferrite member 4 with the first electrodes 12a of the first, second, and third capacitors C1, C2, and C3 placed and soldered on the top of the projecting portion 3c. The height of the protruding portion 3c is formed so that the top surfaces of the first, second, and third capacitors C1, C2, and C3 and the bottom surface of the multilayer substrate 5 are flush with each other.

The chip-type resistor R has a pair of electrodes 13a and 13b provided on opposite end surfaces, and the resistor R is disposed in the vicinity of the third capacitor C3 and has one electrode 13a. Is placed on the top of the protrusion 3 provided on the bottom plate 3a, the first electrode 13a is grounded to the protrusion 3c by soldering, and the other electrode 13b is insulated from the bottom plate 3a. It is in a state.
The port portion 8a of the third central conductor 8 is connected to the other electrode 13b of the resistor R by solder together with the second electrode 12b of the third capacitor C3.

  With such a configuration, the nonreciprocal circuit device of the present invention made of an isolator is formed, and the nonreciprocal circuit device of the present invention is surface-mounted on a mother board of an external device and incorporated.

  Next, a method for adjusting the matching capacity of the non-reciprocal circuit device of the present invention will be described with reference to FIG. 6. First, as shown in FIG. Capacitors C1, C2, C3 and resistor R are incorporated, and the first, second, and third central conductors 6, 7, and 8 on the ferrite member 5 incorporated in the second yoke 3 are the first ones. , Semi-finished product member H connected to second and third capacitors C1, C2, C3 and resistor R is prepared.

  Then, as shown in FIG. 6, this semi-finished product H is connected to the measuring device 15 while being supported on a jig (not shown), and is used for adjusting the matching capacity composed of a laser device or the like on the upper part. The adjusting device 16 is arranged, and a pseudo magnet (neotech) 17 which is a substitute for the magnet is provided.

Next, in a state where a magnetic bias is applied to the first, second, and third center conductors 6, 7, and 8 by the pseudo magnet (neomatec) 17, measurement of electrical characteristics such as matching capacitance is performed by the measuring device 15. If the matching capacitor is adjusted by cutting or cutting the third electrode 12c by the adjusting device 16 while monitoring the electrical characteristic data, the adjustment is completed.
And after this adjustment is completed, when the 1st yoke 1 which attached the magnet 2 is combined with the semi-finished product member H, the nonreciprocal circuit element of this invention comes to be manufactured.

  FIG. 4 shows a second embodiment of the non-reciprocal circuit device according to the present invention. The configuration of the second embodiment will be described. A wide width for forming the third electrode 12 c is formed on the upper surface of the multilayer substrate 5. The conductor 14 is formed so as to face the second electrode 12b connected to the port portions 6a, 7a, 8a and to have a larger area than the second electrode 12b. The conductor 14 or the conductor 14 and the multilayer substrate 5 are provided with a linear slit portion 14a, and a third electrode 12c including a capacitance adjusting projection 14b is provided. At the position of the projection 14b, a capacitor is provided. The matching capacity is adjusted.

  Other configurations are the same as those in the first embodiment, and the same parts are denoted by the same reference numerals, and the description thereof is omitted here.

  FIG. 5 shows a third embodiment of the non-reciprocal circuit device according to the present invention. The configuration of the third embodiment will be described. A wide width for forming the third electrode 12c is formed on the upper surface of the multilayer substrate 5. FIG. The conductor 14 is formed so as to face the second electrode 12b connected to the port portions 6a, 7a, 8a and to have a larger area than the second electrode 12b. The conductor 14 or the conductor 14 and the multilayer substrate 5 are provided with a U-shaped slit portion 14a, and a third electrode 12c including a capacitance adjusting projection 14b is provided. At the position of the projection 14b, The matching capacity of the capacitor is adjusted.

  Other configurations are the same as those in the first embodiment, and the same parts are denoted by the same reference numerals, and the description thereof is omitted here.

  Moreover, although the said Example was demonstrated as what was applied to the isolator, you may apply to the circulator which eliminated the resistor R.

The principal part sectional drawing which concerns on 1st Example of the nonreciprocal circuit device of this invention. The top view which concerns on 1st Example of the nonreciprocal circuit device of this invention, and shows the state which removed the 1st yoke and the magnet. The bottom view of the multilayer substrate concerning the 1st example of the nonreciprocal circuit device of the present invention. The top view of the principal part which concerns on 2nd Example of the nonreciprocal circuit device of this invention. The top view of the principal part which concerns on 3rd Example of the nonreciprocal circuit device of this invention. Explanatory drawing for demonstrating the capacity | capacitance adjustment method of the nonreciprocal circuit element of this invention. The top view of the conventional nonreciprocal circuit device. The disassembled perspective view of the conventional nonreciprocal circuit device.

Explanation of symbols

1: First yoke 1a: Upper plate 1b: Side plate 2: Magnet 3: Second yoke 3a: Bottom plate 3b: Side plate 3c: Projection part 4: Ferrite member 5: Multilayer substrate 5a: Hole 6: First central conductor 6a: Port portion 6b: Ground portion 7: Second central conductor 7a: Port portion 7b: Ground portion 8: Third central conductor 8a: Port portion 8b: Ground portion 9a, 9b: Connection conductor 10: Solder C1: No. 1 capacitor C2: second capacitor C3: third capacitor C: chip capacitor 11: insulator 12a: first electrode 12b: second electrode 12c: third electrode R: resistor 13a: electrode 13b : Electrode 14: Conductor 14a: Slit part 14b: Protruding part H: Semi-finished product member 15: Measuring device 16: Adjustment device 17: Pseudo magnet

Claims (5)

A multi-layer substrate having a flat ferrite member and first, second, and third central conductors located on the ferrite member and insulated from each other at a predetermined angle through a dielectric layer; A magnet disposed on the central conductor, a first yoke disposed so as to cover the upper surface of the magnet, a bottom plate on which the lower surface side of the ferrite member is placed, and bent upward from the bottom plate. A second yoke having a side plate and constituting a magnetic closed circuit with the first yoke; and a chip capacitor disposed in the second yoke and connected to the central conductor; The conductor has a port portion connected to the chip-type capacitor and a ground portion grounded to the second yoke, and the chip-type capacitor is provided to face the insulator with the insulator interposed therebetween. 1st, 1st The first electrode of the chip capacitor is connected to the bottom plate and grounded, and the port portion of the central conductor drawn to the lower surface of the multilayer substrate includes the second electrode Connected to an electrode, provided on the upper surface of the multilayer substrate at a position facing the second electrode, and provided with a third electrode grounded to the second yoke and formed on the port portion side The nonreciprocal circuit device is characterized in that the capacitor is formed by a capacitance between the first and second electrodes and between the second and third electrodes. 2. The nonreciprocal circuit device according to claim 1, wherein the capacitor is configured to adjust a matching capacitance by cutting or cutting the third electrode. 3. 3. The nonreciprocal circuit device according to claim 2, wherein the third electrode is provided with a protruding portion for adjusting a capacitance, and the capacitance is adjusted at the protruding portion. 4. The nonreciprocal circuit device according to claim 3, wherein the protruding portion is formed of a conductor for forming the third electrode, or a slit portion provided in the conductor and the multilayer substrate. . The ground portion of the first, second and third center conductors is provided on the upper surface of the multilayer substrate, and the third electrode and the ground portion are connected to the side plate of the second yoke. The nonreciprocal circuit device according to any one of 1 to 4, wherein the nonreciprocal circuit device is grounded.

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