JP2006148216A - Non-reciprocal circuit element - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a non-reciprocal circuit element which has satisfactory productivity and is inexpensive. <P>SOLUTION: This non-reciprocal circuit element is provided with a planar ferrite member 6; first, second, third center conductors 7, 8, 9; a magnet 2 disposed on the center conductors; a first yoke 1 covering the top surface of the magnet 2; and a second yoke 3 forming a magnetically closed circuit in cooperation with the first yoke 1. The second yoke 3 has ground terminals 4 formed of one part of the second yoke 3, and the region of each of the ground terminals 4 is formed of a solder flow preventing portion 5 in which the second yoke 3 is oxidized. Thus, in forming the portion 5, the number of manufacturing steps is reduced, compared to a conventional case where a solder resist film is used, and a product which has satisfactory productivity and is inexpensive can be obtained. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an irreversible circuit element including an isolator or a circulator applied to an antenna duplexer or the like.

  FIG. 5 is an exploded perspective view of a conventional non-reciprocal circuit element. FIG. 6 is a bottom view of the conventional non-reciprocal circuit element. Next, the configuration of the conventional non-reciprocal circuit element will be described with reference to FIGS. Then, the conventional non-reciprocal circuit element includes a box-shaped first yoke 51, a square plate-like magnet 52 disposed in the first yoke 51, and a U-shape coupled to the first yoke 51. A second yoke 53 having a shape is provided.

  The second yoke 53 includes a bottom plate 53a and a ground terminal 54 formed by a part of the second yoke 53. The ground terminal 54 includes a projecting piece 54a extending from the bottom plate 53a in a flush state. The bent portion 54b is bent upward from the protruding piece 54a.

  In addition, the conventional non-reciprocal circuit element includes a resin case 55 integrated with the second yoke 53 by insert molding, a ferrite member 56 accommodated in the resin case 55, and the ferrite member 56. A chip-type chip that is disposed on the upper surface of the resin case 55 and is connected to the port portion 57a of the center conductor 57, which are made of metal plates partially crossing each other at intervals of 120 degrees. A capacitor 58 is provided.

  When the resin case 55 is integrated with the second yoke 53, the lower surface of the bottom plate 53 a of the second yoke 53 and the lower surface of the protruding piece 54 a of the ground terminal 54 are exposed from the resin case 55. In addition, a solder resist film 59 is provided at the boundary between the bottom plate 53a of the second yoke 53 and the protruding piece 54a of the ground terminal 54 to prevent the solder from flowing out from the ground terminal 54 to the bottom plate 53a. The nonreciprocal circuit device is configured. (For example, see Patent Document 1)

  Such a conventional non-reciprocal circuit element is not shown here, but the lower surface of the second yoke 53 is placed on the mother board of the external device, and the ground terminal 54 is soldered to a wiring pattern provided on the mother board. In addition, the solder resist film 59 prevents the solder from flowing out from the ground terminal 54 to the bottom plate 53a.

  However, in the conventional non-reciprocal circuit device, the solder resist film 59 is used to prevent the outflow of solder. Therefore, in order to form the solder resist film 59, many processes such as mask fabrication, printing, exposure, and etching are performed. This process is necessary, resulting in poor productivity and high cost.

JP 2001-24406 A

  In the conventional nonreciprocal circuit element, the solder resist film 59 is used to prevent the outflow of solder. Therefore, in order to form the solder resist film 59, a number of processes such as mask fabrication, printing, exposure, and etching are performed. There is a problem that productivity is poor and cost is high.

  Accordingly, an object of the present invention is to provide an inexpensive nonreciprocal circuit device with high productivity.

  As a first means for solving the above problems, a flat ferrite member and a ferrite member positioned on the ferrite member, provided on different surfaces in the vertical direction across the dielectric, and partially in the vertical direction First, second, and third center conductors that intersect, a magnet disposed on the center conductor, a first yoke disposed to cover the upper surface of the magnet, and a lower surface side of the ferrite member And a second yoke that forms a magnetic closed circuit with the first yoke, and the second yoke has a ground terminal formed by a part of the second yoke, The area of the ground terminal is formed on the outer surface of the second yoke by a solder outflow prevention portion in which the second yoke is oxidized.

  As a second solution, the second yoke has a bottom plate and a side plate bent from the bottom plate, and the ground terminal is formed across the bottom plate and the side plate, and the solder outflow The prevention part is configured to be formed across the bottom plate and the side plate.

As a third solution, the second yoke has a bottom plate and the ground terminal extending flush with the bottom plate, and the solder outflow prevention portion is formed on the bottom plate.
As a fourth solution, the solder outflow prevention portion is formed by laser light.

  The nonreciprocal circuit device of the present invention includes a flat ferrite member and first and second portions that are located on the ferrite member and are provided on different surfaces in the vertical direction across the dielectric, and partially cross in the vertical direction. Second and third center conductors, a magnet disposed on the center conductor, a first yoke disposed to cover the upper surface of the magnet, and a lower surface side of the ferrite member, A second yoke that forms a magnetic closed circuit with the yoke, and the second yoke has a ground terminal formed by a part of the second yoke. Since the second yoke is formed on the outer surface of the yoke 2 by the oxidized solder outflow prevention portion, the solder outflow prevention portion can be formed by oxidizing the second yoke, which is compared with the conventional solder resist film. The manufacturing process is reduced and the productivity is good. , Inexpensive can be obtained.

  Further, the second yoke has a bottom plate and a side plate bent from the bottom plate, and the ground terminal is formed over the bottom plate and the side plate, and the solder outflow prevention portion is formed over the bottom plate and the side plate. The second yoke does not require a ground terminal that is cut and bent, so that a workable and inexpensive one can be obtained.

  In addition, the second yoke has a bottom plate and a ground terminal extending flush with the bottom plate, and the solder outflow prevention portion is formed on the bottom plate. Is good and inexpensive.

  In addition, since the solder outflow prevention portion is formed by the laser beam, the workability is improved and the existing equipment can be used, and the equipment cost can be reduced.

  Referring to the non-reciprocal circuit device of the present invention, FIG. 1 is a cross-sectional view of the main part of the non-reciprocal circuit device of the present invention, and FIG. 2 relates to the non-reciprocal circuit device of the present invention. 3 is a plan view showing the removed state, FIG. 3 is a perspective view of the second yoke according to the first embodiment of the non-reciprocal circuit device of the present invention, and a second yoke viewed from the back, and FIG. It is the perspective view which looked at the 2nd yoke from the back concerning 2 Example.

  Next, the configuration when the non-reciprocal circuit device of the present invention is applied to an isolator will be described with reference to FIGS. 1 to 4. A first yoke made of a U-shaped or box-shaped magnetic plate (iron plate or the like). 1 has a square (rectangular) upper plate 1a and a side plate 1b bent downward from a side of the upper plate 1a.

  The rectangular (rectangular) magnet 2 is positioned in the first yoke 1, and the upper surface thereof is in contact with the inner surface of the upper plate 1a. It is attached.

  The second yoke 3 made of a U-shaped or box-shaped magnetic plate (iron plate or the like) includes a rectangular bottom plate 3a, a side plate 3b bent upward from a side of the bottom plate 3a, a bottom plate 3a, and a side plate 3a. And a plurality of ground terminals 4 formed across the bottom plate 3a and the side plate 3b.

As shown in FIG. 3, a region of the ground terminal 4 is formed by the solder outflow prevention portion 5 provided on the outer peripheral portion of the ground terminal 4 which is the outer surface of the bottom plate 3a and the side plate 3b. This prevents the outflow of solder from the ground terminal 4 to the bottom plate 3a and the side plate 3b.
Further, the solder outflow prevention portion 5 is constituted by an oxide film formed by oxidizing the second yoke 3 with laser light or the like.

  In the second yoke 3, the side plate 3b is coupled to the side plate 1b of the first yoke 1 in a state where the bottom plate 3a is disposed facing the upper plate 1a, thereby forming a magnetic closed circuit. .

A flat ferrite member 6 made of YIG (Yttrium iron garnet) or the like is disposed in the second yoke 3 so as to face the magnet 2.
The first, second, and third center conductors 7, 8, and 9 made of a thin conductive plate such as copper are formed by stamping a metal plate, and the first, second, and third center conductors 7, 8 are formed. , 9 are provided with port portions 7a, 8a, 9a, and the other end portions are provided with ground portions 7b, 8b, 9b.

  These first, second, and third central conductors 7, 8, and 9 are arranged on the ferrite member 6 at intervals of 120 degrees on different surfaces in the vertical direction across a dielectric (not shown). Provided, and a part of the first, second, and third center conductors 7, 8, and 9 is connected to the bottom plate 3a while being partially crossed in the vertical direction. It is in a grounded state.

The chip-type first, second, and third capacitors C1, C2, and C3 are respectively opposed to the first electrode 11a provided on the insulator 10 and the first electrode 11a across the insulator 10. A second electrode 11b is provided.
The first, second, and third capacitors C1, C2, and C3 are arranged on the outer periphery of the ferrite member 4, and the first electrode 11a is connected to the bottom plate 3a and grounded.

  The chip-type resistor R has a pair of electrodes 12a and 12b provided on opposite end surfaces, and the resistor R is disposed in the vicinity of the third capacitor C3 and is connected to one electrode 12a. Is connected to the bottom plate 3a to be grounded, and the other electrode 12b is insulated from the bottom plate 3a.

  The port portion 7a of the first center conductor 7 is connected to the second electrode 11b of the first capacitor C1, and the port portion 8a of the second center conductor 8 is connected to the second capacitor C2. 2 and the port portion 9a of the third central conductor 9 is connected to the second electrode 11b of the third capacitor C3 and the other electrode 12b of the resistor R.

  With such a configuration, the nonreciprocal circuit element of the present invention made of an isolator is formed. The nonreciprocal circuit element of the present invention is not shown here, but the lower surface of the second yoke 3 is a mother substrate of an external device. The ground terminal 4 is soldered to the wiring pattern provided on the mother board, and the solder outflow prevention unit 5 prevents the solder from flowing out of the area of the ground terminal 4. A non-reciprocal circuit element is surface-mounted on a mother board of an external device and incorporated.

  FIG. 4 shows a second embodiment of the non-reciprocal circuit device according to the present invention. This second embodiment has a plurality of ground terminals 4 made of projecting pieces protruding flush with the bottom plate 3a. The ground terminal 4 includes a projecting piece 4a and an extension 4b that is connected to the projecting piece 4a and extends toward the bottom plate 3a. An area of the ground terminal 4 is formed on the outer periphery of the extension 4b.

Other configurations are the same as those of the first embodiment, and the description thereof is omitted here.
In the second embodiment, the ground terminal 4 is provided with the extended portion 4b. However, the extended portion 4b is eliminated, and the solder outflow preventing portion 5 is provided at the base portion of the protruding piece portion 4a. The ground terminal 4 may be formed only by the projecting piece 4a.

  Moreover, although the said Example was demonstrated as what was applied to the isolator, you may apply to the circulator which eliminated the resistor R.

The principal part sectional drawing concerning the nonreciprocal circuit device of this invention. The top view which shows the state which concerns on the nonreciprocal circuit element of this invention, and removed the 1st yoke and the magnet. The perspective view which looked at the 2nd yoke from the back according to 1st Example of the nonreciprocal circuit device of this invention. The perspective view which looked at the 2nd yoke from the back according to 2nd Example of the nonreciprocal circuit device of this invention. The disassembled perspective view of the conventional nonreciprocal circuit device. The bottom view of the conventional nonreciprocal circuit device.

Explanation of symbols

1: First yoke 1a: Top plate 1b: Side plate 2: Magnet 3: Second yoke 3a: Bottom plate 3b: Side plate 4: Ground terminal 4a: Projection piece 4b: Extension portion 5: Solder outflow prevention portion 6: Ferrite Member 7: 1st center conductor 7a: Port part 7b: Earth part 8: 2nd center conductor 8a: Port part 8b: Earth part 9: 3rd center conductor 9a: Port part 9b: Earth part C1: 1st Capacitor C2: second capacitor C3: third capacitor 10: insulator 11a: first electrode 11b: second electrode R: resistor 12a: electrode 12b: electrode

Claims (4)

A flat ferrite member and first, second, and third central conductors that are located on the ferrite member and are provided on different surfaces in the vertical direction across the dielectric, and partially intersect in the vertical direction; The magnet disposed on the central conductor, the first yoke disposed so as to cover the upper surface of the magnet, and the lower surface of the ferrite member, and the first yoke forms a magnetic closed circuit. And the second yoke has a ground terminal formed by a part of the second yoke, and a region of the ground terminal is an outer surface of the second yoke. Further, the nonreciprocal circuit device is characterized in that the second yoke is formed by an oxidized solder outflow prevention portion. The second yoke includes a bottom plate and a side plate bent from the bottom plate, the ground terminal is formed across the bottom plate and the side plate, and the solder outflow prevention portion is provided on the bottom plate and the side plate. The nonreciprocal circuit device according to claim 1, wherein the nonreciprocal circuit device is formed so as to straddle. 2. The nonreciprocal circuit according to claim 1, wherein the second yoke has a bottom plate and the ground terminal extending flush with the bottom plate, and the solder outflow prevention portion is formed on the bottom plate. element. 4. The nonreciprocal circuit device according to claim 1, wherein the solder outflow prevention portion is formed by a laser beam.

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