JP2006140085A - Manufacturing method of organic el display device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an annealing method suitable for an organic EL display device. <P>SOLUTION: A mask 10 is arranged on a film-forming object 71 and an organic film layer is formed by vapor of an organic film material passing through holes 11, then laser beams 29 are irradiated on the mask 10 without changing the relative positions between the mask 10 and the film-forming object 71. The laser beams 29 which have passed through the holes 11 are irradiated on the organic film layer exposed to the bottom face of the holes 11, and the organic film layer is annealed. After annealing, another organic film layer is formed on the surface of the organic film layer after the annealing by vapor of the organic vapor deposition material which has passed the holes 11. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to the technical field of organic EL display devices, and more particularly to a technology for forming an organic thin film layer having no defects.

In recent years, an organic EL display device using an organic thin film layer has attracted attention.
Reference numeral 102 in FIG. 6 is a conventional organic vapor deposition apparatus.
The organic vapor deposition apparatus 102 has a vacuum chamber 103, an organic vapor deposition source 155 is disposed on the bottom wall side in the vacuum chamber 103, and a substrate holder 130 is disposed on the ceiling side.

  When forming the panel of the organic EL display device, the vacuum chamber 103 is evacuated in advance, and the glass substrate is held by the substrate holder 130. Reference numeral 108 denotes the glass substrate in that state. A transparent electrode film 109 is formed on the surface of the glass substrate 108 in advance, and is held on the substrate holder 130 so that the transparent electrode film 109 faces the organic vapor deposition source 155.

The organic vapor deposition source 155 includes a container 121 and a heater 123 wound around the container 121, and an organic material 122 is disposed in the container 121 in advance.
When the heater 123 of the organic vapor deposition source 155 is energized to raise the temperature of the organic material 122, vapor of the organic material 122 is generated and released from the opening of the container 121 into the vacuum chamber 103.

  In the organic vapor deposition apparatus 102, a mask 110 is disposed at a position between the glass substrate 108 and the organic vapor deposition source 155. The mask 110 includes a shielding member 113 made of a plate-like nickel alloy and a plurality of holes 111 formed in the shielding member 113.

  From the organic vapor deposition source 155, the vapor of the organic material as the base material and the vapor of the organic material (dopant) added in a small amount in the base material are released, and the organic thin film layer formed by the vapor is The organic material serving as a dopant emits one of the three primary colors RGB.

When the vapor of the organic material 122 released into the vacuum chamber 103 passes through the hole 111 and reaches the surface of the transparent electrode film 109 on the glass substrate 108, a pattern corresponding to the pattern of the hole 111 is formed on the transparent electrode film 109. An organic thin film layer is formed.
When the organic thin film layer is formed to a predetermined thickness in the vacuum chamber 103, the glass substrate 108 is transferred to another organic vapor deposition apparatus.

  As described above, in order to perform color display, it is necessary to shift the mask 110 so that the dots of the three primary colors do not overlap each time an organic thin film layer corresponding to each of the three primary colors is formed.

However, the organic thin film layer formed by the above prior art has a defect, there is a drawback that a leak current that does not contribute to light emission flows and the lifetime is short.
In order to make a dense film without defects, the film formation rate may be slowed down.However, if the film formation time is long, moisture contained in the vacuum atmosphere is mixed during the growth of the organic thin film layer, and the film quality deteriorates. End up. Further, when the film formation time is long, the throughput is lowered.

  In order to improve the film quality, it is conceivable to heat anneal the organic thin film layer. However, when the glass substrate 108 is heated with a heater disposed in the substrate holder 130, the mask 110 is also heated together, and the warp of the mask 110 is caused. And distortion will occur.

On the other hand, when the mask 110 is removed for heating, the alignment of the mask 110 and the substrate 108 is required again, and the throughput is significantly reduced.
In addition, there exists the following patent document 1 which attached the laser irradiation apparatus to the vapor deposition apparatus for organic thin film layers like this invention mentioned later.
JP 2002-241925 A

  The present invention has been made to solve the above-described problems, and an object thereof is to provide an annealing method suitable for an EL panel for color display.

In order to solve the above-mentioned problems, the present invention is an organic EL display device manufacturing method in which one or two or more organic thin film layers are stacked to form display dots between an evaporation source and a film formation target. A mask is disposed, discharged from the vapor deposition source, passed through the hole of the mask, and after forming the organic thin film layer under the bottom of the hole by the vapor of the organic vapor deposition material that has reached the film formation target, It is a method for manufacturing an organic EL display device in which a temperature of the organic thin film layer is increased by irradiating the organic thin film layer below the hole bottom with laser light without changing a relative position between the mask and the film formation target. .
Further, the present invention is a method for manufacturing an organic EL display device, wherein the formation of the organic thin film layer to be irradiated with the laser light and the irradiation of the laser light on the organic thin film layer are performed in the same vacuum chamber.
Further, the present invention provides an organic EL display device in which another organic thin film layer is laminated on the organic thin film layer irradiated with the laser light without changing a relative position between the mask and the film formation target. Manufacturing method.
4. The method of manufacturing an organic EL display device according to claim 3, wherein the laser light irradiation and the lamination of the other organic thin film layer are performed in the same vacuum chamber.
In the present invention, after the organic thin film layer irradiated with the laser beam is formed, the relative position between the mask and the film formation target is changed, and another organic material is further formed on the film formation target. It is the manufacturing method of the organic electroluminescence display which forms a thin film layer.

  The present invention is configured as described above, and laser light is irradiated immediately after an organic thin film layer to be irradiated with laser light is formed, and immediately after the laser light irradiation, formation of the next organic thin film layer can be started. Therefore, not only the film quality of the organic thin film layer is improved, but also the interface state between the organic thin film layers is good.

  In particular, since the laser light is irradiated without removing the mask, even when another organic thin film layer is laminated on the organic thin film layer irradiated with the laser light, there is no need to re-align and throughput is improved. high.

  In addition, the organic thin film layer of the color to be irradiated with the laser light is exposed under the bottom surface of the hole, whereas the organic thin film layers of other colors are located under the bottom surface of the mask shielding member, Laser light is not irradiated. Therefore, the laser light is not repeatedly irradiated to the previously formed organic thin film layer of the color.

  The film quality of the organic thin film layer can be improved by annealing the laser beam. Since it is not necessary to remove, attach and align the mask during annealing, throughput is not reduced.

Referring to FIG. 1, reference numeral 2 denotes an organic vapor deposition apparatus according to an example of the present invention, and the organic vapor deposition apparatus 2 includes a vacuum chamber 3.
In general, a color organic EL display device displays a desired image by combining dots for displaying three colors of red, green, and blue.
Since the organic vapor deposition device 2 forms an organic EL display device for performing color display, an organic vapor deposition source capable of supporting three colors of RGB is disposed on the bottom wall in the vacuum chamber 3.

  Reference numeral 70 in FIG. 3 is a diagram schematically showing an organic EL display device formed by using the organic vapor deposition device 2, and R, G, and B in FIG. 3 are dots corresponding to three colors of RGB. Is shown.

  In the organic EL display device 70, a transparent anode layer 72 made of an ITO film is patterned and disposed on a film formation target 71 made of a transparent substrate such as a glass substrate. A red dot hole injection layer 74R, a green dot hole injection layer 74G, and a blue dot hole injection layer 74B formed by the organic vapor deposition device 2 are formed on the top.

  On the red dot hole injection layer 74R, a red dot hole transport layer 75R, a red dot light emission layer 76R, and a red dot electron transport layer 77R are laminated in this order. On the green dot hole injection layer 74G, a green dot hole transport layer 75G, a green dot light-emitting layer 76G, and a green dot electron transport layer 77G are laminated in this order, and a blue dot hole injection layer 74B. On top, a blue dot hole transport layer 75B, a blue dot light emitting layer 76B, and a blue dot electron transport layer 77B are stacked in this order.

  The emission color is determined by a small amount of additives contained in the emission layers 76R, G, and B. In this organic EL display device 70, in order to improve the color developability and life of each RGB color, the emission layers 76R, G, For each layer other than B (hole injection layer, hole transport layer, electron transport layer), an optimal organic material is selected for each color. Therefore, as will be described later, organic thin film layers of different materials are laminated for each color.

  On the electron transport layers 77R, G, and B, a cathode buffer layer 78 and a cathode layer 79 formed by another vapor deposition apparatus or a sputtering apparatus are laminated in this order, and the whole is placed in a container 81, It is sealed with an adhesive 82.

  The cathode buffer layer 78 and the cathode layer 79 are patterned, an external power source 85 is connected to the anode layer 72 and the cathode layer 79, a desired anode layer 72 and the cathode layer 79 are selected, and a voltage is applied between them. Then, a voltage is applied to the dot sandwiched between the selected anode layer 72 and cathode layer 79, and light is emitted in a color corresponding to that dot. The emitted light passes through the film formation target 71 and is emitted to the outside.

  As described above, the organic vapor deposition source of the organic vapor deposition apparatus 2 has vapor deposition sources for various layers, and different holes for each color with respect to the three colors of red dot R, green dot G, and blue dot B. An injection layer deposition source, a hole transport layer deposition source, a light emitting layer deposition source, and an electron transport layer deposition source are provided.

  Reference numerals 41R to 44R in FIG. 1 indicate a hole injection layer deposition source, a hole transport layer deposition source, a light emitting layer deposition source, and an electron transport layer deposition source of red dots R, respectively. The vapor deposition sources for the green and blue dots G and B are omitted.

  Inside the red dot hole injection layer deposition source 41R, the hole transport layer deposition source 42R, the light emitting layer deposition source 43R, and the electron transport layer deposition source 44R, the hole injection layer deposition material 51R and the hole transport layer deposition The vapor deposition material 52R, the light emitting layer vapor deposition material 53R, and the electron transport layer vapor deposition material 54R are respectively disposed.

A substrate holder 30 is disposed on the ceiling side in the vacuum chamber 3.
The substrate holder 30 includes a mask moving device 31, a mask suspension plate 32, and a substrate suspension plate 33.

  One end of the mask moving device 31 is attached to the ceiling of the vacuum chamber 3, and a mask suspension plate 32 and a substrate suspension plate 33 are attached to the other end in a horizontal state.

  The mask moving device 31 is connected to a motor arranged outside the vacuum chamber 3, and the driving force of this motor moves the mask suspension plate 32 and the substrate suspension plate 33 in the horizontal direction. It is configured to rotate within.

  At the four corners of the mask suspension plate 32 and the substrate suspension plate 33, hooks 35 and 36 are vertically attached downward. The lower ends of the hooks 35 and 36 are bent in the horizontal direction along the sides of the mask suspension plate 32 and the substrate suspension plate 33, and a plate-like shape is formed on the bent portions. It is comprised so that a member can be mounted.

  Reference numeral 10 in FIG. 1 indicates a mask placed in the substrate holder 30 by the hook 35 of the mask suspension plate 32. Reference numeral 71 denotes a film formation target made of a glass substrate placed in the substrate holder 30 by the hook 36 of the substrate suspension plate 33.

  The lower end portion of the hook 35 attached to the mask suspension plate 32 is positioned below the lower end portion of the hook 36 attached to the substrate suspension plate 33, and the film formation target 71 is directly above the mask 10. It is supposed to be located in.

The film formation target 71 and the mask 10 are leveled by hooks 35 and 36, and the film formation target 71 is arranged at a position close to the mask 10.
The process of laminating an organic thin film using the organic vapor deposition apparatus 2 as described above will be described.

  First, the film evacuation apparatus 48 connected to the vacuum chamber 3 is operated with the mask 10 mounted without placing the film formation target 71 on the substrate holder 30 to evacuate the vacuum chamber 3 in advance.

  Next, after reaching a predetermined pressure, the film forming object 71 is carried into the vacuum chamber 3 by the substrate transfer robot while maintaining the vacuum atmosphere in the vacuum chamber 3. This film formation target 71 is a transparent substrate such as glass, and an anode layer 72 patterned in advance is formed on the surface thereof. The anode layer 72 is exposed and the organic thin film layer is not formed.

The film formation target 71 is inserted into the substrate holder 30 with the surface on which the anode layer 72 is formed facing down, and is placed on the lower end of the hook 36 as described above.
Reference numeral 34 denotes a pressing plate which is lowered from above the film formation target 71 and is brought into close contact with the surface of the film formation target 71 so that the film formation target 71 does not move on the hook 36.

A CCD camera 38 is disposed on the ceiling of the vacuum chamber 3, and a mask moving device is observed while observing the alignment mark formed on the mask 10 and the alignment mark formed on the film formation target 71 by the CCD camera 38. By 31, the mask 10 and the film formation target 71 are relatively moved to perform alignment.
Here, assuming that the dots of the respective colors are formed in the order of red, green, and blue, the alignment is performed so that the hole 11 is positioned immediately above the place where the red dot is to be formed.

  After the alignment, in the state where the film formation target 71 and the mask 10 are relatively stationary, first, for the red dots, the film formation target 71 and the mask 10 are rotated in a horizontal plane around the central axis 64. The vapor of the hole injection layer deposition material 51R is released from the hole injection layer deposition source 41R.

  As shown in FIG. 4, the mask 10 has a shielding member 13 made of a plate-like nickel alloy, and the shielding member 13 has a pattern in which a plurality of holes 11 are arranged close to each other in a row. It is repeatedly provided in parallel at intervals. The organic thin film layer is formed by the vapor of the organic vapor deposition material that has passed through the hole 11 and reached the film formation target 71.

  When the vapor of the hole injection layer vapor deposition material 51R passes through the hole 11, a red dot hole injection layer 74R is formed on the surface of the anode layer 72 of the film formation target 71 where the red dot is to be formed. .

  Next, when the vapor emission of the hole injection layer deposition material 51R is stopped and the vapor of the hole transport layer deposition material 52R is released from the hole transport layer deposition source 42R for the red dots, the vapor passes through the holes 11. Then, it reaches the surface of the red dot hole injection layer 74R, and the red dot hole transport layer 75R is formed thereon.

The organic vapor deposition apparatus 2 of the present invention includes a laser beam generator 27, a reflection means 21, and a reflection means moving device 24.
The laser beam generator 27 is disposed outside the vacuum chamber 3, and the laser beam emitted from the laser beam generator 27 enters the vacuum chamber 3 through a transparent window 26 provided in the vacuum chamber 3. Is configured to do.

  The reflection means 21 is disposed in the vacuum chamber 3 and on the optical path of the laser beam incident on the vacuum chamber 3. Therefore, the laser beam incident on the vacuum chamber 3 is irradiated on the reflecting means 21.

The reflecting means 21 is attached to the reflecting means moving device 37 via the support member 23, and the reflecting means moving device 37 is operated so that the supporting member 23 can be expanded and contracted so that it can move on the optical path of the laser light. It is configured.
The laser beam irradiated by the reflecting means 21 is reflected on the ceiling side of the vacuum chamber 3, that is, on the side where the mask 10 is disposed.

  During the formation of the organic thin film layer, the reflecting means 21 is retracted from the position between the vapor deposition source and the film formation target 71, the reflecting means 21 is moved by the reflecting means moving device 37, and the reflecting means 21 is masked. When the laser beam is irradiated in a state of being positioned below 10, the reflected laser beam is irradiated onto the mask 10.

  Reference numeral 29 in FIG. 2 indicates the laser light emitted from the laser light generator 27 and reflected by the reflecting means 21, and the laser light 29 reflected toward the mask 10 is applied to the shielding member 13. When the hole 11 is irradiated without irradiating the film formation target 71, it passes through the hole 11 and is irradiated to the hole transport layer 75R for red dots located behind the hole 11. The red dot hole transport layer 75R is heated and annealed by the irradiation of the laser beam 29. By this annealing, the film quality of the red dot hole transport layer 75R is improved and defects are eliminated.

  The reflecting means 21 is moved while irradiating the laser beam 29, the irradiation position of the laser beam 29 on the mask 10 is scanned, and the laser beam 29 is applied to all the red dot hole transport layers 75R located below the bottom surface of the hole 11. Irradiate and anneal. When the laser beam 29 is irradiated, the rotation of the mask 10 and the film formation target 71 around the rotation axis 64 is stopped, and when the formation of the organic thin film layer is resumed as described later, the rotation is also performed. Resume.

While the laser beam 29 is being irradiated, the vacuum exhaust device 48 is operating, and the impurity gas component emitted from the red dot hole transport layer 75R is vacuum exhausted.
Since the laser beam 29 passes through the same hole 11 as the vapor of the vapor transport material for hole transport layer 52R has passed, it is not irradiated to the portion where the red dot hole transport layer 75R is not formed.

  The following Tables 1 and 2 are tables in which an example of the substance of the hole transport layer deposition material 52R and some characteristic values thereof are described.

The hole transport layer is annealed at a temperature lower than the glass transition temperature (Tg) of the hole transport layer deposition material. While the red dot hole transport layer 75R is irradiated with the laser light 29, each evaporation source on which the organic material is disposed closes the shutter above it, and the impurity component released into the vacuum chamber 3 is evaporated. Keep out of the source.
Reference numeral 22 in FIGS. 1 and 2 is a housing member that houses the reflecting means 21, and is provided on the wall surface of the vacuum chamber 3.

  After annealing by irradiating the laser beam 29 as described above, the reflecting means 21 is retracted from the lower position of the mask 10 and stored in the storage member 22, and the vapor of the organic vapor deposition material of each layer is stored in the vacuum chamber. When the light is released into the film 3, the reflection means 21 does not interfere with the vapor reaching the film formation target 71.

  Then, vapor of the red light emitting layer deposition material 53R and the electron transport layer deposition material 54R is sequentially released into the vacuum chamber 3 from the red light emitting layer deposition source 43R and the electron transport layer deposition source 44R. The red dot light emitting layer 76R and the red dot electron transport layer 77R are formed in this order on the surface of the red dot hole transport layer 75R.

  Between the formation of the red dot hole injection layer 74R and the formation of the red dot electron transport layer 77R, the mask 10 does not move relative to the film formation target 71, that is, the mask 10 and the film formation target 71. Maintain relatively the same positional relationship.

  Therefore, the annealed red dot hole transport layer 75R, the remaining red dot light emitting layer 76R, and the red dot electron transport layer 77 are formed in this order on the red dot hole injection layer 74R formed first. Laminated.

  After the red dot electron transport layer 77 is formed, the mask 10 is moved, the mask 10 and the film formation target 71 are relatively aligned, and the hole 11 is directly above the place where the green dot is to be formed. Position.

  In this state, from the green dot hole injection layer deposition source (41G), the hole transport layer deposition source (42G), the light emitting layer deposition source (43G), and the electron transport layer deposition source (44G) The vapors of the hole injection layer deposition material (51G), the hole transport layer deposition material (52G), the light emitting layer deposition material (53G), and the electron transport layer deposition material (54G) are released into the vacuum chamber 3, respectively. Then, the green dot hole injection layer 74G, the green dot hole transport layer 75G, the green dot light emitting layer 76G, and the green dot electron transport layer 77G are laminated in this order.

  After the green dot hole transport layer 75G to be annealed is formed and before the green dot light emitting layer 76G is disposed in close contact with the organic thin film layer, the laser beam generator 27 is moved while moving the reflecting means 21. Then, the laser beam 29 is emitted from the laser beam and irradiated to the green dot hole transport layer 75G located under the bottom surface of the hole 11 by reflection to perform annealing.

  At this time, the shielding member 13 is positioned on the already formed red dots (red dot electron transport layer 77R and other red organic thin film layers), and the red dot electron transport layer 77R has a laser. The light 29 is not irradiated.

  The mask 10 is not moved with respect to the film formation target 71 from the formation of the green dot hole injection layer 74G to the formation of the green dot electron transport layer 77G. Are disposed at the same relative positions, and the green organic thin film layers 74G to 77G are stacked at the same position.

  Next, after the green dots are formed, the mask 10 is moved, the mask 10 and the film formation target 71 are relatively aligned, as in the case of the green dots, and the blue dots are to be formed. The hole 11 is positioned right above the surface.

  From the blue dot hole injection layer deposition source (41B), the hole transport layer deposition source (42B), the light emitting layer deposition source (43B), and the electron transport layer deposition source (44B), When the vapor of the hole injection layer vapor deposition material (51B), the hole transport layer vapor deposition material (52B), the light emitting layer vapor deposition material (53B), and the electron transport layer vapor deposition material (54B) is released, respectively, a blue dot A hole injection layer 74B, a blue dot hole transport layer 75B, a blue dot light-emitting layer 76B, and a blue dot electron transport layer 77B are laminated in this order.

After the blue dot hole transport layer 75B to be annealed is formed and before the blue dot light-emitting layer 76B disposed in close contact with the surface thereof, the laser beam generator 27 moves the laser while moving the reflecting means 21. Light 29 is emitted, reflected, and irradiated to the blue dot hole transport layer 75B located below the bottom surface of the hole 11 to perform annealing.
At this time, the shielding member 13 is positioned on the already formed red and green dots, and the laser beam 29 is not irradiated.

  As described above, since shielding with respect to vapor deposition and shielding with respect to laser light are performed by the same mask 10, after the mask is moved, the laser light 29 is not irradiated onto the dots of the already formed color.

  When the optimum annealing temperature varies depending on the types of the hole transport layers 75R, G, and B, the intensity of the laser beam may be changed for each color. When the mask 10 is scanned with the laser beam 29 having an appropriate intensity, the laser beam 29 having an optimal intensity is irradiated on the hole transport layers 75R, G, and B below the bottom surface of the hole 11 to raise the temperature to an optimal temperature. it can.

  4 is the distance between the centers of the holes 11 in adjacent rows, and R, G, and B in FIG. 5 are red dot rows and green dot rows formed by the mask 10 in FIG. And a row of blue dots. The distance d between the centers of the adjacent color dots is 1 / (number of colors = 3) of the distance D between the holes 11 of the mask 10. The distance d is a relative movement amount between the mask 10 and the film formation target 71 during alignment. The moving direction is a direction perpendicular to the longitudinal direction of the dot row.

  After the blue dot electron transport layer 77B is formed, the film formation target 71 is taken out of the organic vapor deposition apparatus 2, and the cathode buffer layer 78 and the cathode layer 79 are formed in this order by another film formation apparatus, and patterned. After that, when the container 81 is sealed, the organic EL display device 70 is obtained.

  Although the case where the hole transport layer is annealed with laser light has been described above, the object of annealing of the present invention is not limited thereto, and other layers can be annealed.

  The organic EL display device to which the present invention can be applied is not limited to a color display organic EL display device, and can also be applied to a monocolor organic EL display device.

  Further, in the case of a color organic EL display device, the present invention is not limited to one in which dots of the same color are arranged in a line, but widely used for those in which dots of different colors can be formed using the same mask. Can do.

  The organic vapor deposition apparatus 2 forms RGB three-color dots in one vacuum chamber 3, but the present invention includes a case where dots are formed in different vacuum chambers. For example, an organic vapor deposition apparatus in which a vacuum chamber for red dots R, a vacuum chamber for green dots, and a vacuum chamber for blue dots are individually provided can also be used in the present invention.

Organic vapor deposition apparatus that can be used in the present invention Diagram for explaining the annealing method using the organic vapor deposition device Organic EL display device manufactured by the present invention Example of mask used in the present invention The figure for demonstrating the color dot formed by this invention Diagram for explaining the prior art

Explanation of symbols

2 ... Organic vapor deposition apparatus 3 ... Vacuum chamber 10 ... Mask 11 ... Hole 13 ... Shield member 29 ... Laser light 41R-44R ... Organic vapor deposition source for red dots (Organic vapor deposition source for green dots ( (41G) to (44G) and organic vapor deposition sources (41B) to (44B) for blue dots are not shown)
51R to 54R: organic vapor deposition material for red dots (organic vapor deposition materials (51G) to (54G) for green dots and organic vapor deposition materials (51B) to (54B) for blue dots are not shown))
70 …… Organic EL display device 71 …… Film formation objects 74R to 77R …… Organic thin film layers 74G to 77G for red dots …… Organic thin film layers 74B to 77B for green dots …… Organic thin film layers for blue dots

Claims (5)

An organic EL display device manufacturing method in which one or two or more organic thin film layers are laminated to form display dots,
A mask is placed between the deposition source and the film formation target,
After forming the organic thin film layer under the bottom of the hole by the vapor of the organic vapor deposition material that is released from the vapor deposition source, passes through the hole of the mask, and reaches the film formation target,
A method of manufacturing an organic EL display device, wherein the organic thin film layer under the hole bottom is irradiated with laser light without changing a relative position between the mask and the film formation target, and the organic thin film layer is heated.   The method of manufacturing an organic EL display device according to claim 1, wherein the formation of the organic thin film layer to be irradiated with the laser light and the irradiation of the laser light on the organic thin film layer are performed in the same vacuum chamber.   3. The organic thin film layer according to claim 1, wherein another organic thin film layer is laminated on the organic thin film layer irradiated with the laser light without changing a relative position between the mask and the film formation target. 2. A method for producing an organic EL display device according to item 1.   4. The method of manufacturing an organic EL display device according to claim 3, wherein the laser light irradiation and the lamination of the other organic thin film layer are performed in the same vacuum chamber.   After forming the organic thin film layer irradiated with the laser beam, the relative position between the mask and the film formation target is changed, and another organic thin film layer is formed on the film formation target. The manufacturing method of the organic electroluminescence display of any one of claim | item 1 thru | or 4.

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