JP2006137442A - Iron for thermocompression bonding and apparatus for thermocompression bonding - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an iron for thermocompression bonding capable of suppressing heat dissipation from an iron main body with a thermocompression bonding face to be thermocompression-bonded on a material to be thermocompression-bonded to rapidly elevate a temperature of the thermocompression bonding face, and shortening a repeating cycle of a thermocompression bonding process, an iron for thermocompression bonding with a holding member and an apparatus for thermocompression bonding using it. <P>SOLUTION: The iron A for thermocompression bonding used for thermocompression-bonding a cover tape (the material to be thermocompression-bonded) 5 on a specified material, has a constitution equipped with an iron main body 11 having a thermocompression bonding face 11a to be thermocompression-bonded on the material to be thermocompression-bonded and a structure in which a heater 13 for heating the thermocompression bonding face to a specified temperature, and a cover member 12 formed by using a material with a heat conductivity lower than that of a constitutional material of the iron main body, and arranged so as to cover a main part of the iron main body 11 except the thermocompression bonding face. A thermocouple 14 is arranged between the heater 13 buried in the iron main body 11 and the thermocompression bonding face 11a of the iron main body. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The invention of the present application, for example, stores electronic components in a storage recess disposed in a tape-shaped main body, thermocompression-bonds a cover tape to the tape-shaped main body, and covers the storage recess to produce a taping electronic component series. The present invention relates to a thermocompression iron suitable for use in thermocompression bonding of a cover tape to a tape-shaped main body, a thermocompression iron with a holding member, and a thermocompression bonding apparatus using the same.

  When mounting a surface-mounted electronic component, it is often mounted using an automated mounting machine. And when supplying the mounting device of an electronic component, the taping electronic component series hold | maintained at the accommodation recessed part for accommodating the electronic component formed in the tape-shaped main body is used widely.

  Then, as the tape-shaped electronic component series, the electronic component is stored in the storage recess formed in the tape-shaped main body, and the electronic component stored in the storage recess is thermocompression bonded to the tape-shaped main body. There is a series of taping electronic components that ensure that the is held.

  And in the manufacturing process of the taping electronic component series as described above, a tape thermocompression bonding apparatus having a configuration as shown in FIG. 5 is used as a tape thermocompression bonding apparatus for thermocompression bonding the cover tape to the tape-shaped main body. (See Patent Document 1).

This tape thermocompression bonding apparatus is mounted on a tape-shaped main body support member 54 for supporting a tape-shaped main body 53 in which storage recesses 52 for storing electronic components 51 are arranged at a predetermined pitch. A pressure heating means 56 for pressing the cover tape 55 against the tape-shaped main body 53 and thermocompression bonding, positioning pins 57 for positioning the tape-shaped main body 53, etc. A heater 60 and a thermocouple 61 are disposed on the side. The tape-shaped main body support member 54 is provided with positioning pin holes 59 for avoiding interference with the positioning pins 57 for positioning the tape-shaped main body 53.
Further, a protrusion 56a is formed on the lower surface side of the press heating means 56, and the lower end surface of the protrusion 56a is a thermocompression bonding surface.

  In this tape thermocompression bonding apparatus, the pressure heating means 56 heated to a predetermined temperature is lowered so that the thermocompression bonding surface comes into contact with the cover tape 55 placed on the tape-shaped main body 53, and at a predetermined pressure. By pressing, the cover tape 55 is reliably thermocompression bonded to the tape-shaped main body 53. When the thermocompression bonding is completed, the tape-shaped main body 53 is intermittently conveyed until the next storage recess 52 of the tape-shaped main body 53 reaches a position corresponding to the heating and pressing means 56, and the above-described thermocompression bonding process is repeated. As a result, a series of taping electronic components in which the plurality of electronic components 51 are stored in the storage recesses 52 of the tape-shaped main body 53 is manufactured.

  However, in the conventional tape thermocompression bonding apparatus, there is a problem that not only the heat radiation from the heating and pressing means 56 is large and the energy efficiency is low, but also the heat transfer efficiency to the thermocompression bonding surface is poor.

  In addition, in order to improve the productivity of the taping electronic component series, it is required to shorten the cycle of the thermocompression bonding process. However, if it is attempted to shorten the cycle of the thermocompression bonding process, By the next thermocompression bonding step, it is necessary to raise the temperature of the thermocompression bonding surface at the lower end surface of the press heating means 56 to a required temperature in a short time.

However, as in the conventional tape thermocompression bonding apparatus, when the heat radiation from the heating and pressing unit 56 is large and the heat transfer efficiency to the thermocompression bonding surface is low, the temperature of the thermocompression bonding surface at the lower end surface of the pressing and heating unit 56 is quickly increased. Even when the temperature of the heat source cannot be raised and the temperature of the heat source is sufficiently high, there is a problem that heat is not sufficiently transferred to the cover tape 55 and a thermocompression bonding failure is caused.
JP-A-10-203506

  This invention solves the said subject, suppresses the heat release from the iron main body which has the thermocompression-bonding surface thermocompression-bonded to a to-be-heat-bonded material, and can heat up a thermocompression-bonding surface rapidly. An object of the present invention is to provide a thermocompression-bonding iron, a thermocompression-bonding iron with a holding member, and a thermocompression bonding apparatus using the same, which can shorten the repetition cycle of the thermocompression-bonding process.

In order to solve the above problems, the thermocompression-bonding iron of the present invention (Claim 1)
A thermocompression iron used for thermocompression bonding of a thermocompression bonding material to a predetermined material,
An iron body having a structure in which a thermocompression-bonding surface that is thermocompression-bonded to a heat-bonded material and having a heater embedded therein for heating the thermocompression-bonding surface to a predetermined temperature;
A cover member formed using a material having a lower thermal conductivity than the constituent material of the iron body, and disposed so as to cover the main part of the iron body except for the thermocompression bonding surface. It is a feature.

  The iron for thermocompression bonding according to claim 2 is characterized in that a thermocouple is disposed between the heater embedded in the iron body and the thermocompression surface of the iron body.

  The iron for thermocompression bonding according to claim 3 is characterized in that the thermal conductivity of the material constituting the iron body is larger than the thermal conductivity of the material constituting the surface of the heater.

  According to a fourth aspect of the present invention, the main part of the iron body is made of aluminum or copper, and the main part of the cover member is made of iron or stainless steel.

  Further, the thermocompression-bonding iron according to claim 5 is characterized in that a thermocompression-bonding surface that is thermocompression-bonded to the thermocompression-bonding material is provided at the tip of the protrusion formed on the iron body.

  The iron for thermocompression bonding according to claim 6 is characterized in that the cover member includes an auxiliary heater and an auxiliary thermocouple.

The thermocompression-bonding iron with a holding member of the present invention (Claim 7)
(a) the iron for thermocompression bonding according to any one of claims 1 to 6;
(b) a holding member for holding the thermocompression-bonding iron;
It is characterized by comprising.

  Further, in the thermocompression-bonding iron with a holding member according to claim 8, a heat insulating member having a thermal conductivity smaller than that of the cover member is interposed between the thermocompression-bonding iron and the thermo-compression iron. It is characterized by that.

The thermocompression bonding apparatus of the present invention (claim 9)
(a) a thermocompression-bonding iron with a holding member according to claim 7 or 8,
(b) driving means for driving a holding member that holds the thermocompression-bonding iron so that the thermocompression-bonding surface of the iron body is pressed against the thermocompression-bonding material.

The thermocompression-bonding iron of the present invention (Claim 1) has a thermocompression-bonding surface that is thermocompression-bonded to a heat-bonded material. It is formed using an iron body having a structure in which a heater for heating the thermocompression bonding surface to a predetermined temperature is embedded, and a material having a lower thermal conductivity than the constituent material of the iron body, and excluding the thermocompression bonding surface. And a cover member disposed so as to cover the main part of the iron main body, and therefore, it is possible to suppress heat radiation from the iron main body having a thermocompression bonding surface that is thermocompression bonded to the heat-bonded material. For example, after thermocompression bonding, the temperature of the thermocompression bonding surface can be quickly raised to prepare for the next thermocompression bonding step.
That is, according to the thermocompression-bonding iron of the present invention, it is possible to suppress excessive heat radiation from other than the thermocompression surface side, improve energy efficiency, and shorten the repetition cycle of the thermocompression bonding process.

  In addition, since the thermocouple is disposed between the heater embedded in the iron body and the thermocompression bonding surface of the iron body as in the thermocompression iron of claim 2, the thermocouple uses the thermocouple. By detecting the temperature, it becomes possible to improve the temperature controllability of the thermocompression bonding surface by the heater.

  Further, as in the thermocompression-bonding iron according to claim 3, by making the thermal conductivity of the material constituting the iron body larger than the thermal conductivity of the material constituting the surface of the heater, the iron by heating of the heater is used. It becomes possible to improve the temperature followability of the thermocompression bonding surface of the main body, and the present invention can be made more effective.

  Further, as in the iron for thermocompression bonding according to claim 4, the main part of the iron body is made of aluminum or copper, and the main part of the cover member is made of iron or stainless steel, thereby significantly increasing the material cost. Without inviting, it is possible to obtain a thermocompression-bonding iron in which the iron body having the requirements of the present invention is formed using a material having a higher thermal conductivity than the cover member.

  Further, as in the thermocompression-bonding iron according to claim 5, the thermocompression-bonding surface is provided with a thermocompression-bonding surface that is thermocompression-bonded to the thermocompression-bonding material at the tip of the protrusion formed on the iron body. The surface can be easily thermocompression-bonded to a desired position of the material to be thermocompression-bonded, and the present invention can be more effectively realized.

  Further, like the thermocompression-bonding iron according to claim 6, by arranging an auxiliary heater and an auxiliary thermocouple on the cover member, the temperature rise at the start of use and the process of repeatedly performing the thermocompression-bonding process are performed. It becomes possible to quickly increase the temperature when the temperature is raised from a state in which the temperature of the crimping iron is lowered to a predetermined temperature at which thermocompression bonding can be performed. Furthermore, by monitoring the temperature difference of the heater (main heater) embedded in the iron body, the temperature stability inside the thermocompression iron can be improved, and the peeling force when peeling the cover tape can be improved. It becomes possible to prevent quality deterioration such as variation. It is also possible to detect breakage of the thermocompression iron and failure of the heater.

  Moreover, the iron for thermocompression bonding with a holding member of this invention (Claim 7) is (a) the thermocompression iron according to any one of claims 1 to 6, and (b) holds the thermocompression iron. Since the holding member is provided, the thermocompression iron can be reliably operated via the holding member, and an efficient thermocompression treatment can be performed.

  In the thermocompression-bonding iron with a holding member according to claim 8, a heat insulating member having a lower thermal conductivity than that of the cover member is interposed between the thermocompression-bonding iron and the thermo-compression iron. As a result, it is possible to further reliably suppress excess heat dissipation from other than the thermocompression surface side of the iron body, and to perform efficient thermocompression treatment while ensuring sufficient energy saving. .

  The thermocompression bonding apparatus of the present invention (Claim 9) includes (a) a thermocompression-bonding iron with a holding member according to claim 7 or 8, and (b) a thermocompression bonding surface of the iron body as a thermocompression bonding material. Since it is provided with a driving means for driving the holding member that holds the thermocompression-bonding iron so as to be pressed, excessive heat radiation from other than the thermocompression surface side is suppressed, energy efficiency is improved, and thermocompression bonding process It is possible to shorten the repetitive cycle, and it is possible to perform thermocompression bonding with high reliability by reliably thermocompressing the thermocompression bonding surface of the thermocompression bonding iron to the material to be thermally bonded.

  The features of the present invention will be described in more detail below with reference to examples of the present invention.

  FIG. 1 is a side sectional view showing a main part of a thermocompression bonding apparatus using a thermocompression ironing iron according to an embodiment (embodiment 1) of the present invention, and FIG. 2 is a front view.

  The thermocompression bonding apparatus according to the first embodiment holds the electronic component 6 that is an object to be packaged in the housing recess 4 by thermocompression bonding the tape-shaped main body 1 and the cover tape 5 in the process of manufacturing the taping electronic component series. In this thermocompression bonding apparatus, the thermocompression bonding iron A according to the present invention is used.

  Further, the taping electronic component series manufactured by using the thermocompression bonding apparatus of the first embodiment stores the electronic component 6 in the storage recess 4 of the tape-shaped main body 1 constituted by the carrier tape 2 and the bottom tape 3, and covers the cover. It is obtained by thermocompression bonding the tape 5 to the tape-shaped main body 1 to cover the storage recess 4 in which the electronic component 6 is stored.

  The tape-shaped main body 1 connected to the taping electronic component is composed of a carrier tape 2 in which a through hole 4a serving as a storage recess 4 is formed, and a bottom tape 3 disposed on the lower surface thereof. In the state where the electronic component 6 is housed in 4, the cover recess 5 is thermocompression bonded to the upper surface of the carrier tape 2, so that the housing recess 4 in which the electronic component 6 is housed does not drop off. So that it is covered.

  In addition, as an aspect which covers the storage recessed part 4 by thermocompression-bonding the cover tape 5 to the tape-shaped main body 1, when sealing the inside of the storage recessed part 4 so that it may become airtight, or the inside of the storage recessed part 4 is airtight In some cases, the housing recess 4 is covered to such an extent that the electronic component 6 does not fall off. Although the present invention can be applied to any case, in the first embodiment, the latter (the housing recess 4 is not airtight and the housing recess is formed so that the electronic component 6 does not fall off). A case of covering) will be described as an example.

  In the thermocompression bonding apparatus according to the first embodiment, the iron body 11 is made of copper and has a thermocompression bonding surface 11a that is thermocompression bonded to the cover tape 5 that is a material to be thermally bonded. A thermocompression bonding according to an embodiment of the present invention, which is made of stainless steel having a low conductivity, and includes a cover member 12 arranged so as to cover the main part of the iron body 11 except for the thermocompression bonding surface 11a. Iron A is used.

  In addition, the thermocompression bonding surface 11a of the iron body 11 constituting the thermocompression bonding iron A is formed at the lower part (lower end surface) of the protruding portion 11b provided on the lower surface side, and the cover tape 5 which is a thermocompression bonding material. It is configured for easy access. In Example 1, the lower portion of the protrusion 11b is processed so that the tip is thinned, and the bottom surface on the thinned tip side is a thermocompression bonding surface 11a.

In addition, a heater 13 for heating the iron body 11 is embedded in the iron body 11 so as to reduce loss of heat energy.
Further, the surface of the heater 13 is formed of iron, which is a material having a lower thermal conductivity than that of copper, which is a material constituting the iron body 11, and the heat of the iron body 11 due to the heating of the heater 13. It is comprised so that the temperature followable | trackability of the crimping | compression-bonding surface 11a may improve.

  Further, a thermocouple 14 for detecting the temperature of the iron body 11 is embedded between the heater 13 embedded in the iron body 11 and the thermocompression bonding surface 11 a of the iron body 11. And the temperature controllability of the thermocompression bonding surface 11a by the heater 13 can be improved.

  Further, the thermocompression-bonding iron A used in the first embodiment further includes a holding member 21 that holds the thermocompression-bonding iron A. Further, between the thermocompression iron A and the holding member 21 that holds the thermocompression iron A, the thermal conductivity is higher than that of the cover member 12 in order to suppress a loss of thermal energy due to heat transfer to the holding member. A small heat insulating member 15 is disposed. In addition, although titanium is used as the heat insulating member 15, ceramics or the like can also be used.

In this thermocompression bonding apparatus, the holding member 21 that holds the thermocompression iron A is moved in the vertical direction so that the thermocompression bonding surface 11a of the iron body 11 can be pressed against the cover tape 5 that is a thermocompression bonding material. The drive means 22 which drives to is provided.
The configuration of the driving means 22 is not particularly limited, and various types such as a solenoid system and a system combining a cam and a motor can be used.

  In the thermocompression bonding apparatus configured as described above, a structure having a thermocompression bonding surface 11a to be thermocompression bonded to the cover tape 5 and a heater 13 for heating the thermocompression bonding surface 11a to a predetermined temperature is embedded. The main body 11 of the iron body 11 is formed by using the iron body 11 and the stainless steel having a lower thermal conductivity than copper, which is a constituent material of the iron body 11, except for the thermocompression surface 11a and the vicinity thereof. Since the thermocompression-bonding iron A provided with the cover member 12 disposed so as to be covered is used, heat radiation from the iron body 11 is suppressed and the cover tape 5 is thermocompression bonded to the upper surface of the carrier tape 2. Later, the temperature of the thermocompression bonding surface 11a can be quickly raised to prepare for the next thermocompression bonding process, energy saving can be achieved, and the thermocompression bonding process can be repeated. And short, it is possible to improve the productivity.

  In addition, since the thermocompression bonding surface 11a that is thermocompression bonded to the cover tape (thermocompression bonding material) 5 is provided at the tip of the protrusion 11b formed on the iron body 11, the thermocompression bonding surface 11a is covered. It is possible to easily perform thermocompression bonding to a desired position on the tape (thermocompression bonding material) 5, and the present invention can be more effectively realized.

  Moreover, since the thermocompression bonding apparatus of the first embodiment has a configuration including the driving means 22 that drives the holding member 21 that holds the thermocompression bonding iron A, the thermocompression bonding surface 11a of the thermocompression bonding iron A is performed. Can be reliably thermocompression bonded to the cover tape (heat-bonding material) 5 to perform highly reliable thermocompression bonding.

  The structure of the iron body 11 constituting the thermocompression-bonding iron A is not limited to the shape shown in FIG. 1, and for example, FIGS. 3 (a), (b), (c), (d ) As shown in FIG. 3 (a) to 3 (d), the same reference numerals as those in FIG. 1 denote the same or corresponding parts.

  The iron body 11 in FIG. 3 (a) has a protruding portion 11b that is thin from the base end and is formed straight, and the iron body 11 in FIG. 3 (b) has the protruding portion 11b thin toward the tip. However, the processing mode is different from the iron body 11 of FIG. 1 described above, and the outer surface of the protrusion 11b is cut obliquely. Further, the iron body 11 in FIG. 3C has a round shape (substantially U-shaped) in the cross-sectional shape, and the iron body 11 in FIG. The cross-sectional shape has a shape with a sharp upper part (substantially pentagonal shape). In addition, about the shape of the iron main body 11 which comprises the iron A for thermocompression bonding, it is also possible to set it as another shape.

FIG. 4 is a view showing a thermocompression bonding apparatus according to another embodiment (Example 2) of the present invention.
In the thermocompression bonding apparatus according to the second embodiment, an auxiliary heater 23 for heating the cover member 12 and an auxiliary thermocouple 24 for monitoring the temperature of the cover member 12 are embedded in the cover member 12. The heater (main heater) 13 and the auxiliary heater 23 embedded in the iron body 11 can be controlled independently.

  Since other configurations are the same as those of the thermocompression bonding apparatus of the first embodiment, description thereof is omitted here in order to avoid duplication. In FIG. 4, the parts denoted by the same reference numerals as those in FIG. 1 indicate the same or corresponding parts.

  In the thermocompression bonding apparatus according to the second embodiment, the capacity of the auxiliary heater 23 embedded in the cover member 12 is configured to be smaller than the capacity of the heater (main heater) 13 embedded in the iron body 11. . However, in the present invention, there is no particular restriction on the relationship between the capacity of the auxiliary heater 23 embedded in the cover member 12 and the capacity of the heater (main heater) 13 embedded in the iron body 11. It is possible to make the capacity of the heater 23 larger than the capacity of the heater (main heater) 13 embedded in the iron body 11.

  When thermocompression bonding is performed using the thermocompression bonding apparatus according to the second embodiment, for example, when starting up from a state where the iron body 11 is cooled, the auxiliary heater 23 is turned on together with the main heater 13, and the iron body 11 and The cover member 12 is heated to an appropriate temperature.

  After the cover member 12 is heated to an appropriate temperature, the auxiliary heater 23 is turned off, the temperature of the cover member 12 is monitored by the auxiliary thermocouple 24, and the cover member 12 needs to be heated. By turning on the auxiliary heater 23 again, the cover member 12 is quickly heated to an appropriate temperature.

  It is also possible to monitor the temperature difference between the auxiliary heater 23 and the main heater 13 and control so that the thermocompression bonding apparatus cannot be operated when it is out of the proper range so as to improve the reliability.

  Further, according to the thermocompression bonding apparatus of the second embodiment, since the auxiliary heater 23 is embedded in the cover member 12, the temperature rise from the state in which the iron body 11 is cooled can be quickly performed.

  Moreover, since the main heater 13 only needs to supply heat mainly to the thermocompression bonding surface 11a side by performing the heat retention of the cover member 12 by the auxiliary heater 23, the temperature followability of the thermocompression bonding surface 11a. The temperature controllability can be further improved as compared with the case of the thermocompression bonding apparatus of the first embodiment.

  Furthermore, by monitoring the temperature difference between the auxiliary heater 23 and the main heater 13, it is possible to prevent quality degradation such as variation in peeling force when peeling the cover tape 5.

  The invention of the present application is not limited to the above-described embodiments. The structure of the iron body, the specific structure and arrangement of the cover member arranged to cover the main part of the iron body, the heater and the iron Arrangement mode of thermocouples arranged between thermocompression surfaces of main body, constituent material of iron body and cover member, specific configuration of thermocompression surface, auxiliary heater and auxiliary thermocouple arranged on cover member Various applications and modifications can be made within the scope of the invention with respect to the arrangement of the present invention, the specific configuration of the holding member for holding the thermocompression iron, the configuration of the driving means for driving the holding member, and the like. .

As described above, the thermocompression-bonding iron of the present invention has a structure in which a thermocompression-bonding surface that is thermocompression-bonded to a material to be heat-bonded and a heater for heating the thermocompression-bonding surface to a predetermined temperature is embedded. A structure comprising an iron body and a cover member that is formed using a material having a lower thermal conductivity than the constituent material of the iron body, and that covers the main part of the iron body except for the thermocompression surface. Therefore, it is possible to suppress heat dissipation from the iron body, to quickly raise the temperature of the thermocompression bonding surface, to save energy, and to shorten the repetition cycle of the thermocompression bonding process, It becomes possible to quickly prepare for the next thermocompression bonding step, and productivity can be improved.
Therefore, the thermocompression-bonding iron and thermocompression bonding apparatus according to the present invention include a step of storing an electronic component in a storage recess disposed in a tape-shaped body, and thermocompression-bonding a cover tape to the tape-shaped body to cover the storage recess. In the manufacturing process of the taping electronic component series manufactured through the above, it can be widely applied when the cover tape is thermocompression bonded to the tape-shaped main body.

It is side surface sectional drawing which shows the principal part of the thermocompression bonding apparatus using the iron for thermocompression bonding concerning one Example (Example 1) of this invention. It is a front view which shows the principal part of the thermocompression bonding apparatus using the iron for thermocompression bonding concerning one Example (Example 1) of this invention. (a), (b), (c), (d) is a figure which shows the modification of the iron main body which comprises the iron for thermocompression bonding of this invention. It is side surface sectional drawing which shows the principal part of the thermocompression bonding apparatus using the thermocompression-bonding iron concerning other Example (Example 2) of this invention. It is a figure which shows the conventional thermocompression bonding apparatus (tape thermocompression bonding apparatus).

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Tape-shaped main body 2 Carrier tape 3 Bottom tape 4 Receiving recessed part 4a Through-hole 5 Cover tape (heat-bonding material)
6 Electronic parts 11 Iron body 11a Thermocompression bonding surface 11b Protrusion part 12 Cover member 13 Heater (main heater)
14 thermocouple 15 heat insulating member 21 holding member 22 driving means 23 auxiliary heater 24 auxiliary thermocouple A iron for thermocompression bonding

Claims (9)

A thermocompression iron used for thermocompression bonding of a thermocompression bonding material to a predetermined material,
An iron body having a structure in which a thermocompression-bonding surface that is thermocompression-bonded to a heat-bonded material and having a heater embedded therein for heating the thermocompression-bonding surface to a predetermined temperature;
A cover member formed using a material having a lower thermal conductivity than the constituent material of the iron body, and disposed so as to cover the main part of the iron body except for the thermocompression bonding surface. Featuring a thermocompression iron.   The thermocompression-bonding iron according to claim 1, wherein a thermocouple is disposed between the heater embedded in the iron body and the thermocompression-bonding surface of the iron body.   The thermocompression-bonding iron according to claim 1 or 2, wherein a thermal conductivity of a material constituting the iron body is larger than a thermal conductivity of a material constituting a surface of the heater.   The iron for thermocompression bonding according to any one of claims 1 to 3, wherein a main part of the iron body is made of aluminum or copper, and a main part of the cover member is made of iron or stainless steel.   The thermocompression-bonding iron according to any one of claims 1 to 4, wherein a thermocompression-bonding surface that is thermocompression-bonded to a thermocompression-bonding material is provided at a tip portion of a protrusion formed on the iron body. .   The thermocompression-bonding iron according to claim 1, wherein the cover member includes an auxiliary heater and an auxiliary thermocouple. (a) the iron for thermocompression bonding according to any one of claims 1 to 6;
(b) a holding member for holding the thermocompression-bonding iron;
A thermocompression-bonding iron with a holding member.   8. With a holding member according to claim 7, wherein a heat insulating member having a thermal conductivity smaller than that of the cover member is interposed between the thermocompression iron and the holding member for holding the thermocompression iron. Iron for thermocompression bonding. (a) a thermocompression-bonding iron with a holding member according to claim 7 or 8,
(b) A thermocompression bonding apparatus comprising: a drive unit that drives a holding member that holds the thermocompression-bonding iron so that the thermocompression-bonding surface of the iron body is pressed against the thermocompression-bonding material.

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