JP2006106164A - Color filter substrate and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a color filter substrate which improves display quality of a liquid crystal display device and to provide a manufacturing method of the color filter substrate. <P>SOLUTION: A black matrix is formed on a substrate such as glass and a transparent thin film is formed on the substrate and the black matrix to cover the black matrix. Then, a color filter is formed on the transparent thin film. Cr(chromium) or a black resist is used for the black matrix. ITO or a silicon oxidized film or a silicon nitride film or a transparent photosensitive material is used for the transparent thin film. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a color filter substrate for use in a liquid crystal display device to improve display quality and a method for manufacturing the same.

The liquid crystal display device is advantageous in that it is thin and lightweight, can be driven at a low voltage, and has low power consumption. For this reason, liquid crystal display devices are used in various electronic devices such as televisions, PCs (personal computers), PDAs (portable terminals), and mobile phones. By the way, in a color filter substrate of a conventional liquid crystal display device, a black matrix having excellent light shielding properties is formed on a glass substrate. And the color filter of red (R), green (G), and blue (B) is formed on the glass substrate and the black matrix (for example, refer patent document 1).
JP-A-8-136910

  In the conventional color filter substrate described above, a black matrix 22 is formed of a metal film such as Cr (chromium) on a glass substrate 21 as shown in FIG. 1, and red (R) and green (G) are formed thereon. In addition, a blue (B) color filter 23 is formed. That is, the colored resin for the color filter is formed on different materials such as glass and metal. Therefore, the adhesion degree of the color filter 23 to the black matrix 22 and the adhesion degree to the glass substrate 21 are different. When pressure is applied to the color filter 23, the force acting on the portion where the color filter 23 and the glass substrate 21 are in contact with the portion where the color filter 23 and the black matrix 22 are in contact is different. In some cases, such as failure. Moreover, the film thickness may become non-uniform | heterogenous by the material difference by forming on a different material. As a result, the display quality of the liquid crystal display device is adversely affected, such as color unevenness.

  The present invention has been made to solve the above problems, and an object of the present invention is to provide a color filter substrate and a method for manufacturing the same that can provide good display quality.

(Method to solve the problem)
The above-described problems include a step of forming a black matrix on a substrate such as glass, a step of forming a transparent film on the substrate to cover the black matrix, and forming a color filter on the transparent film. And a process for producing a color filter substrate characterized by comprising the steps of:

  The transparent film is formed of a transparent metal, a silicon oxide film, a silicon nitride film, a transparent photosensitive agent, or the like. The black matrix is formed of chromium (Cr) or a black resist.

(Configuration for solving problems)
The above-described problems are formed on a substrate such as glass, a black matrix formed on the substrate, a transparent film formed on the substrate and the black matrix, and the transparent film. This is solved by a color filter substrate having a color filter.

(The invention's effect)
In the present invention, in the step of forming the color filter substrate, a black matrix is formed on a substrate such as glass, and then a transparent film is formed on the entire surface of the substrate, and the color filter is formed on the transparent film. Form.

  Thus, after forming the black matrix, a transparent film is formed on the entire surface of the substrate, so that a color filter can be formed on the same film, preventing the color filter from peeling off, and generating color unevenness. Can be suppressed. Thereby, display quality improves compared with the past.

  Further, since a transparent film is formed on the surface of the black matrix so as to cover the black matrix, the edge portion of the black matrix becomes gentle and the occurrence of cracks in the color filter can be suppressed. For this reason, display quality improves compared with the past.

  Furthermore, since the color filter is formed on the same film and the edge portion of the black matrix is smoothed, the adhesion between the color filter and the transparent film is improved. For this reason, the heat resistance of the color filter is higher than before, and the effect that the color filter does not easily peel even when the alignment film is baked (for example, at 180 ° C. for 1 hour) is obtained.

(Configuration of the color filter substrate of the present invention)
Embodiments of the present invention will be described with reference to the accompanying drawings.

  FIG. 2 is a sectional view showing a part of a color filter substrate (hereinafter referred to as a CF substrate) of the present invention. The CF substrate is formed on a transparent substrate 31 such as glass, a black matrix 32 formed thereon, a transparent thin film 33 formed on the surface of the transparent substrate 31 and the black matrix 32, and the transparent thin film 33. A color filter 34 is included.

  The transparent thin film 33 shown in FIG. 2 corresponds to the transparent film described in the claims, has a film thickness of about 0.1 μm, and is formed of ITO (Indium-tin oxide). ing. Since the transparent thin film 33 is formed so that the surface of the black matrix 32 is covered, the edge portion of the black matrix 32 is gentle.

  Note that the black matrix is formed of chromium (Cr), but is not limited thereto, and may be a black resist or the like. The transparent thin film may be SiO2 (silicon oxide film), SiN (silicon nitride film), or a transparent photosensitive agent.

  On the transparent thin film 33, red (R), green (G) and blue (B) color filters 34 are formed. These color filters 34 are arranged opposite to the pixel electrodes, and one of the red (R), green (G), and blue (B) color filters 34 corresponds to one pixel electrode. .

(Effects of the configuration of the CF substrate of the present invention)
In the present embodiment, a transparent thin film 33 is formed on a transparent substrate 31 such as glass on which a black matrix 32 is formed. As shown in FIG. 2, red (R), green (G), and blue (B) color filters 34 are formed on the transparent thin film 33. As described above, the color filter 34 shown in FIG. 2 is formed on the same transparent thin film 33. Therefore, there is no portion in which the adhesion degree differs greatly between the color filter 34 and the transparent thin film 33, and it is possible to prevent the occurrence of problems such as separation of the color filter 34 where the adhesion degree is weak. As a result, good display quality without color unevenness can be obtained.

  A transparent thin film 33 is also formed on the surface of the black matrix 32, and the edge portion of the black matrix 32 is smooth. Thereby, the occurrence of cracks in the color filter 34 due to the edges of the black matrix 32 can be suppressed. This is because when the pressure is applied to the color filter 34, since the edge portion of the black matrix 32 is gentle, the stress of the black matrix 32 and the stress of the transparent substrate 31 do not change abruptly at the edge portion. It is thought that the occurrence of cracks inside 34 can be suppressed.

  Furthermore, in this embodiment, the color filter 34 is formed on one film of the same material, and the edge portion of the black matrix 32 is gentle, so that the color filter 34 and the transparent thin film 33 are in close contact with each other. The degree is getting better. For this reason, the heat resistance of the color filter 34 is increased, and the effect that the separation of the color filter 34 hardly occurs even when the alignment film is baked (for example, at 180 ° C. for 1 hour) is obtained.

(Manufacturing method of CF substrate of the present invention)
Hereinafter, a method for manufacturing the CF substrate of this embodiment will be described.

  3 and 4 are views showing the method of manufacturing the CF substrate of this embodiment in the order of steps.

  First, the black matrix 32 shown in FIG. 3A is formed as follows. A Cr film is formed on one surface of the transparent substrate 31, and a positive photoresist is applied thereon. Then, after selectively exposing the photoresist using a predetermined mask, development processing is performed to leave a Cr film only in a predetermined region. Thereby, a black matrix 32 made of a Cr film is formed.

  Next, the transparent thin film 33 shown in FIG. 3B is formed. The transparent thin film 33 is formed on the surface of the transparent substrate 31 and the black matrix 32 made of different materials so that the surface state is the same. Therefore, after the black matrix 32 is formed, an ITO film is formed on the entire surface of the transparent substrate 31 to a thickness of about 0.1 μm by sputtering. Thereby, a transparent thin film having the same surface state is formed, and preparations for forming a color filter are completed.

  Next, a red color filter 34R shown in FIG. 3C is formed as follows. A photosensitive pigment dispersion type red resist is applied to the entire upper surface of the transparent substrate 31 by spin coating, and exposure and development are performed to form a red color filter 34R having a thickness of about 1.5 μm in the red pixel portion. To do.

  Next, the green color filter 34G shown in FIG. 4A is formed as follows. A photosensitive pigment dispersion type green resist is applied to the entire upper surface of the transparent substrate 31 by a spin coating method, and is exposed and developed to form a green color filter 34G having a thickness of about 1.5 μm in the green pixel portion. To do.

  Next, the blue color filter 34B shown in FIG. 4B is formed as follows. A photosensitive pigment dispersion type blue resist is applied to the entire upper surface of the transparent substrate 31 by spin coating, and is exposed and developed to form a blue color filter 34B having a thickness of about 1.5 μm in the blue pixel portion. To do.

  Next, as shown in FIG. 4C, a common electrode 45 is formed by depositing ITO to a thickness of about 0.15 μm on the entire upper surface of the transparent substrate 31 by sputtering. The surface of the color filter 34 is covered with the common electrode 45.

  Thereafter, an alignment film made of polyimide is formed on the entire upper surface of the transparent substrate 31, and the surface of the common electrode is covered with the alignment film, thereby completing the CF substrate.

  As described above, ITO is used as the material of the transparent thin film 33 covering the glass substrate 31 and the black matrix 32, but the present invention is not limited to this. For example, a transparent photosensitive agent such as a silicon oxide film, a silicon nitride film, or a transparent photoresist may be used as the material for the transparent thin film 33. The transparent thin film 33 formed of these silicon oxide film, silicon nitride film or transparent photosensitive agent is preferably thin because it is necessary to increase the transmittance, and is preferably 0.1 μm or less. Further, when the transparent thin film 33 is formed of a silicon oxide film, it is formed by a CVD method or a sputtering method, and when it is formed of a transparent photosensitive agent, it is formed by a spin coat method.

  Further, as described above, the case where the black matrix 32 is made of a Cr film has been described. However, the black matrix 32 may be formed of a black resin.

It is the schematic of the conventional color filter board | substrate. It is the schematic of the color filter substrate of this invention. It is sectional drawing (the 1) which shows the manufacturing method of a color filter board | substrate. It is sectional drawing (the 2) which shows the manufacturing method of a color filter board | substrate.

Explanation of symbols

21, 31 transparent substrate,
22, 32 Black matrix,
23, 34 color filter,
33 Transparent thin film,
45 Common electrode.

Claims (6)

Forming a black matrix on the substrate;
Forming a transparent film on the substrate to cover the black matrix;
And a step of forming a color filter on the transparent film.   2. The method of manufacturing a color filter substrate according to claim 1, wherein the transparent film is a transparent metal, a silicon oxide film, a silicon nitride film, or a transparent photosensitive agent.   The method for manufacturing a color filter substrate according to claim 1, wherein the black matrix is formed of chromium (Cr) or a black resist. A substrate,
A black matrix formed on the substrate;
A transparent film formed on the substrate and the black matrix;
And a color filter formed on the transparent film.   The color filter substrate according to claim 4, wherein the transparent film is a transparent metal, a silicon oxide film, a silicon nitride film, or a transparent photosensitive agent.   The color filter substrate according to claim 4, wherein the black matrix is formed of chromium (Cr) or a black resist.

Images