JP2006100755A5 - - Google Patents

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JP2006100755A5
JP2006100755A5 JP2004305544A JP2004305544A JP2006100755A5 JP 2006100755 A5 JP2006100755 A5 JP 2006100755A5 JP 2004305544 A JP2004305544 A JP 2004305544A JP 2004305544 A JP2004305544 A JP 2004305544A JP 2006100755 A5 JP2006100755 A5 JP 2006100755A5
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Prior art keywords
heating element
processing apparatus
substrate processing
electric heater
substrate
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JP2004305544A
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JP4885438B2 (en
JP2006100755A (en
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Claims (19)

基板を収納し処理する処理室と、発熱体を有し該発熱体により前記処理室内を加熱する加熱装置とを具備する基板処理装置であって、
前記発熱体は蛇行状に構成され、この発熱体を複数有し、各発熱体の上側端を支持体に固定し、前記各発熱体の下側端を上下方向に移動自在な状態とし、発熱体の上側端と他の発熱体の下側端とを近接させて配置し、前記各発熱体の中間部を絶縁体から離隔させてある基板処理装置。
A substrate processing apparatus comprising a processing chamber for storing and processing a substrate, and a heating device having a heating element and heating the processing chamber by the heating element,
The heating element is configured in a meandering manner, and has a plurality of heating elements, the upper end of each heating element is fixed to a support, and the lower end of each heating element is made movable in the vertical direction to generate heat. A substrate processing apparatus, wherein an upper end of a body and a lower end of another heating element are arranged close to each other, and an intermediate portion of each heating element is separated from an insulator.
蛇行状の発熱体を複数有し、各発熱体の上側端を支持体に固定し、前記各発熱体の下側端を上下方向に移動自在な状態とし、発熱体の上側端と他の発熱体の下側端とを近接させて配置し、前記各発熱体の中間部を絶縁体から離隔させてある基板処理装置用電気ヒーター。 There are a plurality of serpentine heating elements, the upper end of each heating element is fixed to the support, the lower end of each heating element is movable in the vertical direction, the upper end of the heating element and other heating elements An electric heater for a substrate processing apparatus, which is disposed close to a lower end of the body, and an intermediate portion of each heating element is separated from an insulator. 前記発熱体の前記上側端よりも前記下側端を前記絶縁体から離隔させてある請求項2記載の基板処理装置用電気ヒーター。 3. The electric heater for a substrate processing apparatus according to claim 2, wherein the lower end is separated from the insulator with respect to the upper end of the heating element. 前記発熱体の上側端に折曲部を形成してこの折曲部を支持体に掛止してある請求項2又は3記載の基板処理装置用電気ヒーター。 The electric heater for a substrate processing apparatus according to claim 2 or 3, wherein a bent portion is formed at an upper end of the heating element, and the bent portion is hooked on a support. 前記折曲部が略直角に折り曲げられ、前記支持体の掛止部もこの折曲部を受け入れる略直角に形成されている請求項4に記載の基板処理装置用電気ヒーター。 The electric heater for a substrate processing apparatus according to claim 4, wherein the bent portion is bent at a substantially right angle, and a hooking portion of the support is formed at a substantially right angle to receive the bent portion. 前記掛止部は折曲部が掛止される下壁部と下壁部に略平行で折曲部の上側への抜けを防止する上壁部と折曲部の水平方向への脱落を防止するための上壁部から垂下する横壁部とを備え、下壁部は上壁部及び横壁部とは分割可能である請求項5に記載の基板処理装置用電気ヒーター。 The hook portion is substantially parallel to the lower wall portion and the lower wall portion where the bent portion is hooked, and prevents the upper wall portion and the bent portion from falling off in the horizontal direction. 6. The electric heater for a substrate processing apparatus according to claim 5, further comprising: a horizontal wall portion that hangs down from an upper wall portion for performing the operation, wherein the lower wall portion is separable from the upper wall portion and the horizontal wall portion. 前記発熱体の上解放スリットにおける前記折曲部にこの上解放スリット間での発熱体の短絡を防ぐ第一絶縁片を介在させてある請求項4〜6のいずれかに記載の基板処理装置用電気ヒーター。 7. The substrate processing apparatus according to claim 4, wherein a first insulating piece for preventing a short circuit of the heating element between the upper release slits is interposed in the bent portion of the upper release slit of the heating element. Electric heater. 前記発熱体の上側端を固定するための前記支持体が、前記発熱体の下解放スリットを貫通する請求項2〜7のいずれかに記載の基板処理装置用電気ヒーター。 The electric heater for a substrate processing apparatus according to claim 2, wherein the support for fixing the upper end of the heating element passes through a lower release slit of the heating element. 前記支持体が前記発熱体と前記絶縁体との間に介在する絶縁片を貫通する請求項8に記載の基板処理装置用電気ヒーター。 The electric heater for a substrate processing apparatus according to claim 8, wherein the support passes through an insulating piece interposed between the heating element and the insulator. 前記発熱体の下端側は下固定体をスリットに貫通させ、スリット長手方向に移動自在で且つスリット垂直方向の移動を規制する状態で絶縁体に保持してある請求項2〜9のいずれかに記載の基板処理装置用電気ヒーター。 The lower end side of the heating element is held by an insulator in such a manner that the lower fixed body penetrates the slit, is movable in the longitudinal direction of the slit, and restricts movement in the vertical direction of the slit. The electric heater for substrate processing apparatuses as described. 下側の発熱体の上端を支持する支持体に上側の発熱体の下端を水平方向視で重ねてある請求項2〜10のいずれかに記載の基板処理装置用電気ヒーター。 The electric heater for a substrate processing apparatus according to any one of claims 2 to 10, wherein the lower end of the upper heating element is overlapped with a support supporting the upper end of the lower heating element in a horizontal direction. 発熱体の上端と下端との間に放熱側に対するオフセット距離を設けながら、発熱体の一部を垂下させるように発熱体の上部側に湾曲部を形成してある請求項2〜11のいずれかに記載の基板処理装置用電気ヒーター。 The curved part is formed in the upper part side of a heat generating body so that a part of heat generating body may hang down, providing the offset distance with respect to the heat radiating side between the upper end and lower end of a heat generating body. An electric heater for a substrate processing apparatus as described in 1. 発熱体の上下方向中間部を絶縁体とは反対側に突出するよう湾曲させてある請求項2〜11のいずれかに記載の基板処理装置用電気ヒーター。 The electric heater for a substrate processing apparatus according to any one of claims 2 to 11, wherein an intermediate portion in the vertical direction of the heating element is curved so as to protrude to the side opposite to the insulator. 請求項2〜13のいずれかに記載の基板処理装置用電気ヒーターを備えた基板処理装置。 The substrate processing apparatus provided with the electric heater for substrate processing apparatuses in any one of Claims 2-13. 蛇行状の発熱体を複数有し、各発熱体の上側端を支持体に固定し、前記各発熱体の下側端を上下方向に移動自在な状態とし、発熱体の上側端と他の発熱体の下側端とを近接させて配置すると共に、前記各発熱体の中間部を絶縁体から離隔させる基板処理装置用電気ヒーターにおける発熱体の保持構造。 There are a plurality of serpentine heating elements, the upper end of each heating element is fixed to the support, the lower end of each heating element is movable in the vertical direction, the upper end of the heating element and other heating elements A structure for holding a heating element in an electric heater for a substrate processing apparatus, which is arranged close to a lower end of the body and separates an intermediate portion of each heating element from an insulator. 請求項1に記載の基板処理装置を用いた半導体装置の製造方法であって、
前記処理室に前記基板を装入する工程と、
前記発熱体により前記処理室内の基板を熱処理する工程と、
熱処理された前記基板を引出す工程とを有する
半導体装置の製造方法。
A method of manufacturing a semiconductor device using the substrate processing apparatus according to claim 1,
Loading the substrate into the processing chamber;
Heat treating the substrate in the processing chamber with the heating element;
A method of manufacturing a semiconductor device, comprising a step of extracting the heat-treated substrate.
基板を収納し処理する処理室と、発熱体を有し該発熱体により前記処理室内を加熱する加熱装置とを具備し、前記発熱体は一端のみを保持部によって保持され、少なくとも一部が前記基板に向かって凸となる様に形成されている基板処理装置。 A processing chamber that houses and processes the substrate; and a heating device that has a heating element and heats the processing chamber by the heating element, wherein the heating element is held only at one end by a holding portion, at least a part of which is A substrate processing apparatus formed so as to be convex toward the substrate. 基板を収納し処理する処理室と、発熱体を有し該発熱体により前記処理室内を加熱する加熱装置とを具備し、前記発熱体は一端のみを保持部によって保持され、前記発熱体の上側端よりもこの発熱体の下側端を絶縁体から離隔させた基板処理装置。 A processing chamber for storing and processing a substrate; and a heating device that includes a heating element and heats the processing chamber by the heating element. The heating element is held by a holding portion at one end, and the upper side of the heating element. A substrate processing apparatus in which the lower end of the heating element is separated from the insulator rather than the end. 蛇行状の発熱体と複数の保持部とを有し、該発熱体の上側端を第一の保持部によって保持し、前記発熱体の下側端を第二の保持部に当接若しくは近接させて上下方向に移動自在な状態とし、前記発熱体の中間部を絶縁体から離隔させる基板処理装置用電気ヒーターにおける発熱体の保持構造。 A serpentine heating element and a plurality of holding parts, the upper end of the heating element is held by the first holding part, and the lower end of the heating element is brought into contact with or close to the second holding part; A structure for holding the heating element in the electric heater for the substrate processing apparatus, wherein the intermediate part of the heating element is separated from the insulator.
JP2004305544A 2003-10-21 2004-10-20 SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING APPARATUS ELECTRIC HEATER, SUBSTRATE PROCESSING APPARATUS PROVIDED WITH THE SAME, HOLDER STRUCTURE HOLDING STRUCTURE AND SUBSTRATE PROCESSING APPARATUS Active JP4885438B2 (en)

Priority Applications (1)

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JP2004305544A JP4885438B2 (en) 2003-10-21 2004-10-20 SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING APPARATUS ELECTRIC HEATER, SUBSTRATE PROCESSING APPARATUS PROVIDED WITH THE SAME, HOLDER STRUCTURE HOLDING STRUCTURE AND SUBSTRATE PROCESSING APPARATUS

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JP2003361292 2003-10-21
JP2003361292 2003-10-21
JP2004256651 2004-09-03
JP2004256651 2004-09-03
JP2004305544A JP4885438B2 (en) 2003-10-21 2004-10-20 SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING APPARATUS ELECTRIC HEATER, SUBSTRATE PROCESSING APPARATUS PROVIDED WITH THE SAME, HOLDER STRUCTURE HOLDING STRUCTURE AND SUBSTRATE PROCESSING APPARATUS

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JP2006100755A JP2006100755A (en) 2006-04-13
JP2006100755A5 true JP2006100755A5 (en) 2007-11-29
JP4885438B2 JP4885438B2 (en) 2012-02-29

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JP4646592B2 (en) * 2003-10-21 2011-03-09 貞徳舎株式会社 Electric heater and furnace equipped with the same
JP5139734B2 (en) * 2007-06-25 2013-02-06 株式会社日立国際電気 Substrate processing apparatus and heating apparatus used therefor
US8395096B2 (en) 2009-02-05 2013-03-12 Sandvik Thermal Process, Inc. Precision strip heating element
KR101096602B1 (en) * 2009-07-21 2011-12-20 가부시키가이샤 히다치 고쿠사이 덴키 Heating device, substrate processing apparatus, and method of manufacturing semiconductor device
JP5544121B2 (en) 2009-07-21 2014-07-09 株式会社日立国際電気 Heating apparatus, substrate processing apparatus, and semiconductor device manufacturing method
US9064912B2 (en) 2009-07-21 2015-06-23 Hitachi Kokusai Electric, Inc. Heating device, substrate processing apparatus, and method of manufacturing semiconductor device
JP5525248B2 (en) * 2009-12-03 2014-06-18 貞徳舎株式会社 Electric heater, electric heater manufacturing method, and heating apparatus
JP6630146B2 (en) * 2015-02-25 2020-01-15 株式会社Kokusai Electric Substrate processing apparatus, semiconductor device manufacturing method, and heating unit
CN109616434A (en) 2015-02-25 2019-04-12 株式会社国际电气 Substrate processing device and method, the manufacturing method of semiconductor devices and heating part
JP6887659B2 (en) * 2015-09-15 2021-06-16 貞徳舎株式会社 Hot air generator

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US4403329A (en) * 1981-07-06 1983-09-06 General Signal Corporation Support system for electrical resistance element
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