JP2006100090A - Method and device for manufacturing organic el device, organic el device and electronic apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To display a high quality image in an organic EL device, and to manufacture an organic EL device with uniform display property. <P>SOLUTION: This manufacturing method for the organic EL device provided with first and second electrodes and at least one functional layer sandwiched between the first and second electrodes for every pixel on a substrate comprises a process forming the first electrode for every pixel on the substrate, a process holding the substrate in a processing chamber wherein steam of a solvent in which a material of the functional layer is soluble is set at a prescribed pressure after forming the first electrode, and a process forming the functional layer as a film on the first electrode after holding the substrate in the processing chamber. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a manufacturing method and manufacturing apparatus for an organic EL (Electro-Luminescence) device, an organic EL device manufactured by the manufacturing method, and a technical field of various electronic devices including the organic EL device.

  An organic EL device manufactured by a manufacturing method of this type of organic EL device includes functional layers such as a light emitting layer and an electron injection layer that are sandwiched between first and second electrodes on a substrate for each pixel. ing. As disclosed in Patent Document 1, for example, when a light emitting layer is formed as a functional layer, a light emitting material is liquefied and applied onto an anode which is a pixel electrode.

  Patent Document 2 or 3 discloses an apparatus for cleaning a workpiece such as a liquid crystal panel or a semiconductor wafer with isopropyl alcohol (IPA) vapor.

JP 2003-249375 A JP-A-11-351747 Japanese Patent Laid-Open No. 5-166792

  However, the wettability with respect to the light emitting material on the surface of the pixel electrode becomes non-uniform in each pixel or each substrate in the substrate surface due to variations in the processing status of each manufacturing process during film formation. Problems arise. For example, plasma treatment may be performed in order to control the wettability with respect to the light emitting material on the part of the bank layer that defines the formation region of the functional layer or the surface of the pixel electrode that is in contact with the functional layer. If this processing state varies among pixels or each pixel or substrate within the substrate surface, the wettability becomes non-uniform as described above. As a result, uneven application of the luminescent material occurs in each pixel or each pixel or substrate in the substrate surface, the thickness of the luminescent layer becomes nonuniform, and the flatness deteriorates.

  In addition, even when the coating unevenness as described above does not occur, when the liquefied light emitting material is dried after being applied, the light emitting layer is formed in each pixel or each substrate in the pixel due to a difference in drying speed or the like. There is a risk that the flatness of the surface of the film becomes non-uniform. The above-mentioned difference in the drying speed of the luminescent material is caused by the influence of the pixel arrangement in the substrate surface, the temperature distribution in the substrate surface, the gas flow on the substrate surface, and the like. According to the manufacturing method, it is difficult.

  As described above, the uniformity and flatness of the film thickness in the light emitting layer can occur in the electron injection layer as well. Thus, when the film thickness of the functional layer becomes non-uniform or the flatness on the surface of the functional layer cannot be ensured, display defects such as luminance unevenness occur in the display image in the organic EL device, resulting in a high quality image. There is a risk that the display cannot be performed. There is also a problem that uniform display characteristics cannot be obtained for organic EL devices manufactured by the same manufacturing process.

  The present invention has been made in view of the above problems, for example, and a method for manufacturing an organic EL device capable of displaying a high-quality image in the organic EL device and manufacturing an organic EL device with uniform display characteristics. It is another object of the present invention to provide a manufacturing apparatus, an organic EL device manufactured by the manufacturing method, and an electronic apparatus including the organic EL device.

  In order to solve the above problems, the first method for manufacturing an organic EL device of the present invention is sandwiched between the first and second electrodes and the first and second electrodes for each pixel on the substrate. A method of manufacturing an organic EL device comprising at least one functional layer, the step of forming the first electrode for each pixel on the substrate, and after forming the first electrode, A step of holding the substrate in a processing chamber in which a vapor of a solvent in which a material is soluble is set to a predetermined pressure, and after holding the substrate in the processing chamber, forming the functional layer on the first electrode A process.

  The organic EL device manufactured by the first organic EL device manufacturing method of the present invention is provided with an organic EL element having at least one functional layer sandwiched between the first and second electrodes for each pixel. Yes. In the organic EL element, a light emitting layer, a hole injection layer, a hole transport layer, an electron injection layer, or an electron transport layer is formed as a functional layer. In addition to the light emitting layer, by forming the hole injection layer, hole transport layer, electron injection layer, or electron transport layer in this way, the organic EL element can emit light efficiently, and each pixel can display images with high brightness. Can be performed.

  In the first manufacturing method of the present invention, first, an anode or a cathode of an organic EL element is formed as a first electrode for each pixel. Here, various wirings for driving the first electrode for each pixel and driving elements such as a thin film transistor (hereinafter referred to as “TFT” as appropriate) may be formed on the substrate in advance. Alternatively, various wirings and driving elements are formed on a substrate different from the substrate on which the organic EL element is formed, and the other substrate is electrically connected to and bonded to the substrate on which the organic EL element is formed. It may be.

  Subsequently, after the substrate on which the first electrode is formed for each pixel is held in a processing chamber to be described later, a functional layer material is applied onto the first electrode by, for example, an inkjet method, and the applied material is dried. At this time, a liquid mixture obtained by dissolving a material of a functional layer, for example, a material of a hole injection layer, a hole transport layer, or a light emitting layer, in a solvent in which the material is soluble is obtained by an ink jet method. Apply on electrode. Thereby, a functional layer is formed on the first electrode. Note that in the case of forming a plurality of functional layers, it is preferable to perform a process of holding the substrate in the processing chamber in advance when forming each functional layer.

  Here, in the step of holding the substrate in the processing chamber, a solvent in which the material of the light emitting layer, the hole injection layer, the hole transport layer, or the electron injection layer or the electron transport layer is formed in advance as a functional layer is soluble. Is vaporized, and the vapor thus obtained is supplied to a predetermined pressure, for example, a saturated vapor pressure, in a sealed processing chamber. Thus, the substrate is held in a state where the vapor is supplied into the processing chamber. In this case, the solvent may be a polar solvent or a nonpolar solvent as long as the functional layer material is soluble.

  In the processing chamber, the entire surface of the substrate comes into contact with the vapor of the solvent, and any part of the surface of the substrate comes into contact with the vapor at a predetermined pressure. Then, on the substrate, in each pixel, the solvent liquefies and adheres to the surface of the first electrode or the functional layer already formed. Therefore, wettability can be improved in the pixel and uniform wettability can be ensured. In addition, in each pixel on the substrate, it is possible to improve wettability and ensure uniform wettability.

  In the case where the plurality of substrates are sequentially held in the processing chamber with the first electrode formed for each pixel, each substrate is kept at a predetermined temperature for a predetermined time and a solvent vapor at a predetermined pressure. It is preferable to adjust and hold. In this way, the wettability can be made uniform in each pixel or in each pixel in each substrate.

  Accordingly, the functional layer material can be uniformly applied in the pixels in each substrate, and the functional layer material can be uniformly applied in each pixel, and the occurrence of uneven application can be prevented. As a result, in each substrate, a functional layer having a flat surface and a uniform film thickness can be obtained in the pixel and in each pixel.

  Therefore, according to the first manufacturing method of the present invention as described above, the yield can be improved. In addition, in the organic EL device manufactured by the first manufacturing method of the present invention, it is possible to obtain a uniform light emission state within the pixel or in each pixel, thereby preventing display defects such as luminance unevenness from occurring. be able to. As a result, each organic EL device can perform high-quality image display and obtain uniform display characteristics.

  In order to solve the above-described problem, the second organic EL device manufacturing method of the present invention is sandwiched between the first and second electrodes and the first and second electrodes for each pixel on the substrate. A method of manufacturing an organic EL device comprising at least one functional layer, the step of forming the first electrode for each pixel on the substrate, and after forming the first electrode, Before forming the functional layer, the step of holding the substrate in a processing chamber in which a vapor of a solvent in which the functional layer material is soluble is set to a predetermined pressure; and the functional layer is formed on the first electrode. Forming a film, and holding the substrate in the processing chamber after forming the functional layer.

  In the second method for manufacturing an organic EL device of the present invention, as in the first method of manufacturing of the present invention described above, after forming the first electrode and before forming the functional layer, the processing chamber The substrate is held, and the substrate is brought into contact with the vapor of the solvent in which the material of the functional layer to be formed is soluble. Therefore, the functional layer material can be uniformly applied in each pixel or in each pixel in each substrate, and application unevenness can be prevented.

  Further, after the functional layer is formed, the substrate is held again in the processing chamber. At this time, a vapor of a solvent in which the deposited material of the functional layer is soluble is supplied to the processing chamber so as to have a predetermined pressure in the processing chamber. As a result, when the substrate and the vapor of the solvent come into contact again, the solvent liquefies and adheres to the surface of the functional layer in each pixel. In the vicinity of the surface of the functional layer, the material of the functional layer is redissolved in the solvent. Therefore, when the functional layer material is formed, when the functional layer material is applied and then dried, even if the drying speed becomes uneven in each pixel in the pixel or on the substrate, the functional layer material is reused as described above. By dissolving, the step generated on the surface of the functional layer can be relaxed and the surface of the functional layer can be flattened. Therefore, the flatness of the functional layer can be improved in each pixel on the substrate.

  In addition, compared to the case where the solvent is directly spray coated on the substrate, for example, the entire substrate surface can be brought into contact with the vapor of the solvent uniformly. It is possible to obtain flatness and uniform flatness at each pixel on the substrate.

  Similarly to the first manufacturing method of the present invention, when a plurality of substrates are sequentially held in the processing chamber, each substrate is adjusted to a predetermined temperature for a predetermined time and a solvent vapor to a predetermined pressure. It is preferable to hold it. This makes it possible to ensure uniform flatness within the pixel or in each pixel in each substrate.

  Therefore, in each substrate, a functional layer having a flat surface and a uniform film thickness can be formed within the pixel or in each pixel. Therefore, according to the second manufacturing method of the present invention, it is possible to receive the same benefits as the first manufacturing method of the present invention. However, according to the second manufacturing method of the present invention, compared with the above-described first manufacturing method of the present invention or the third manufacturing method of the present invention described later, each substrate is more reliable in each pixel. In addition, the flatness of the surface of the functional layer can be improved. Further, in each substrate, the flatness of the surface of the functional layer and the thickness of the functional layer in the pixel are made uniform, and the flatness of the surface of the functional layer and the thickness of the functional layer are made uniform in each pixel. It becomes possible.

  In one aspect of the method for manufacturing the first or second organic EL device of the present invention, the step of holding the substrate after the step of forming the first electrode and before forming the functional layer. Before the step, a step of performing plasma treatment on the substrate as a pre-ink application treatment is further provided, and the step of forming the functional layer forms the functional layer by ink application.

  According to this aspect, plasma processing is performed as pre-ink application processing in each pixel. Here, the “ink application pretreatment” is a process for improving wettability or forming a region showing at least one of lyophilicity and liquid repellency with respect to ink application as a subsequent process. Means processing. The “ink” as used herein corresponds to a liquid mixture obtained by dissolving the material of the functional layer as described above in a solvent in which the material is soluble.

  Therefore, in this aspect, the wettability of the surface of the first electrode can be improved by the plasma treatment. Further, in the plasma processing, even if the processing situation differs in the pixels on the same substrate or in each pixel, or in each substrate, the substrate is held in the processing chamber and then in the pixel or each pixel. Uniform wettability can be ensured in the pixel or each substrate.

  In order to solve the above-described problem, the third organic EL device manufacturing method of the present invention is sandwiched between the first and second electrodes and the first and second electrodes for each pixel on the substrate. A method of manufacturing an organic EL device comprising at least one functional layer, wherein the functional layer is formed on the first electrode, and the functional layer is formed after the functional layer is formed. And a step of holding the substrate in a processing chamber having a predetermined pressure of a solvent vapor.

  According to the third method for manufacturing an organic EL device of the present invention, the substrate is held in the processing chamber in a state where at least one functional layer is formed on the first electrode for each pixel. At this time, in the processing chamber, the material of the functional layer is re-dissolved in the solvent in the vicinity of the surface of the functional layer, as in the second manufacturing method of the present invention described above. Here, when a plurality of functional layers are formed, the functional layer material formed on the uppermost layer among the functional layers formed on the substrate is soluble while the substrate is held in the processing chamber. A solvent vapor is supplied into the processing chamber at a predetermined pressure.

  Therefore, the flatness of the functional layer can be improved in each pixel in each substrate. Further, in each substrate, uniform flatness can be ensured in the pixels, and uniform flatness can be ensured in each pixel. Therefore, according to the third manufacturing method of the present invention, it is possible to receive the same benefits as the first or second manufacturing method of the present invention.

  In another aspect of the method for manufacturing an organic EL device according to any one of the first to third aspects of the present invention, in the step of holding the substrate, the predetermined pressure is 80% or more of a saturated vapor pressure of the solvent. Adjust to be a value.

  According to this aspect, when the substrate and the vapor come into contact with each other in the processing chamber, the solvent can be liquefied and attached to the surface of the first electrode or the functional layer in each pixel.

  In another aspect of the method for manufacturing an organic EL device according to any one of the first to third aspects of the present invention, in the step of forming the functional layer, a light emitting layer is formed as the functional layer.

  According to this aspect, in each substrate, a light emitting layer having a flat surface and a uniform film thickness can be obtained in the pixel or in each pixel.

  In another aspect of the method for manufacturing an organic EL device according to any one of the first to third aspects of the present invention, in the step of forming the functional layer, a hole injection layer or a hole transport layer is formed as the functional layer. .

  According to this aspect, a hole injection layer or a hole transport layer having a flat surface and a uniform film thickness can be obtained in each pixel or in each pixel in each substrate.

  In another aspect of the method for manufacturing an organic EL device according to any one of the first to third aspects of the present invention, in the step of forming the functional layer, an electron injection layer or an electron transport layer is formed as the functional layer.

  According to this aspect, in each substrate, an electron injection layer or an electron transport layer having a flat surface and a uniform film thickness can be obtained in each pixel or in each pixel.

  In order to solve the above problems, the organic EL device of the present invention is manufactured by the method for manufacturing the organic EL device of the present invention (including various aspects thereof).

  Since the organic EL device of the present invention is manufactured by the above-described method for manufacturing the organic EL device of the present invention (including various aspects thereof), each organic EL device performs high-quality image display and is uniform. Display characteristics can be obtained.

  In order to solve the above problems, an electronic apparatus according to the present invention includes the above-described organic EL device according to the present invention.

  Since the electronic device of the present invention includes the above-described organic EL device of the present invention, a television, a mobile phone, an electronic notebook, a word processor, which can perform high-quality image display and obtain uniform display characteristics, Various electronic devices such as viewfinder type or monitor direct view type video tape recorders, workstations, videophones, POS terminals, touch panels, etc., printers using organic EL devices as exposure heads, image forming devices such as copiers and facsimiles Equipment can be realized.

  In order to solve the above-described problem, the first organic EL device manufacturing apparatus of the present invention has at least a first electrode and a second electrode, and is sandwiched between the first and second electrodes on a substrate for each pixel. An apparatus for manufacturing an organic EL device comprising a single layer of functional layers, the means for forming the first electrode for each pixel on the substrate, and the material of the functional layer after forming the first electrode Means for holding the substrate in a processing chamber having a predetermined pressure of vapor of a soluble solvent, and means for forming the functional layer on the first electrode after holding the substrate in the processing chamber With.

  According to the first organic EL device manufacturing apparatus of the present invention, the yield in the manufacturing process of the organic EL device can be improved in the same manner as the above-described first manufacturing method of the present invention. In addition, in the organic EL device manufactured by the first manufacturing apparatus of the present invention, it is possible to perform high-quality image display and obtain uniform display characteristics.

  In order to solve the above-mentioned problem, the second organic EL device manufacturing apparatus of the present invention is sandwiched between the first and second electrodes and the first and second electrodes for each pixel on the substrate. An apparatus for manufacturing an organic EL device comprising at least one functional layer, wherein the first electrode is formed on the substrate for each pixel, and the first electrode is formed. Before forming the functional layer, the functional layer is formed on the first electrode and means for holding the substrate in a processing chamber having a predetermined pressure of vapor of a solvent in which the functional layer material is soluble. The means for holding the substrate holds the substrate again in the processing chamber after the functional layer is formed.

  According to the second organic EL device manufacturing apparatus of the present invention, it is possible to receive the same benefits as the first manufacturing apparatus of the present invention. However, according to the second manufacturing apparatus of the present invention, each pixel in each substrate is more reliable than the first manufacturing apparatus of the present invention described above or the third manufacturing apparatus of the present invention described later. In addition, the flatness of the surface of the functional layer can be improved. Further, in each substrate, the flatness of the surface of the functional layer and the thickness of the functional layer in the pixel are made uniform, and the flatness of the surface of the functional layer and the thickness of the functional layer are made uniform in each pixel. It becomes possible.

  In order to solve the above problems, the third organic EL device manufacturing apparatus of the present invention is sandwiched between the first and second electrodes and the first and second electrodes for each pixel on the substrate. An apparatus for manufacturing an organic EL device comprising at least one functional layer, the means for depositing the functional layer on the first electrode, and a material for the functional layer after the functional layer is deposited. Means for holding the substrate in a processing chamber having a predetermined pressure of a solvent vapor dissolved therein.

  According to the third organic EL device manufacturing apparatus of the present invention, it is possible to receive the same benefits as the first or second manufacturing apparatus of the present invention.

  Such an operation and other advantages of the present invention will become apparent from the embodiments described below.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

<1: First Embodiment>
1st Embodiment which concerns on the organic EL apparatus of this invention is described with reference to FIGS.

<1-1: Overall configuration of organic EL device>
First, the overall configuration of the organic EL device will be described with reference to FIG. FIG. 1 is a block diagram showing the overall configuration of the organic EL device. Here, an active matrix driving type organic EL device with a built-in driving circuit is taken as an example.

  The image display area 110 in the organic EL device is provided with data lines 114 and scanning lines 112 wired vertically and horizontally, and the pixel units 70 corresponding to the intersections thereof are arranged in a matrix. Further, the image display area 110 is provided with power supply lines 117 corresponding to the pixel portions 70 arranged for the respective data lines 114.

  Further, a scanning line driving circuit 130 and a data line driving circuit 150 are provided in a peripheral area located around the image display area 110. The scanning line driving circuit 130 sequentially supplies scanning signals to the plurality of scanning lines 112. Further, the data line driving circuit 150 supplies an image signal to the data line 114 wired in the image display area 110. The operations of the two types of scanning line driving circuits 130 and the operation of the data line driving circuit 150 are synchronized with each other by a synchronization signal 160 supplied from an external circuit. The power supply line 117 is supplied with pixel driving power from an external circuit.

  Here, if attention is paid to one pixel portion 70 in FIG. 1, the pixel portion 70 is provided with an organic EL element 72 and, for example, a switching transistor 76 and a driving transistor 74 configured using TFTs, In addition, a holding capacitor 78 is provided.

  The scanning line 112 is electrically connected to the gate electrode of the switching transistor 76, the data line 114 is electrically connected to the source electrode of the switching transistor 76, and the drive is connected to the drain electrode of the switching transistor 76. The gate electrode of the transistor 74 is electrically connected. The power supply line 117 is electrically connected to the source electrode of the driving transistor 74, and the anode of the organic EL element 72 is electrically connected to the drain electrode of the driving transistor 74.

  In addition to the configuration of the pixel circuit illustrated in FIG. 1, various types of pixel circuits such as a current programming type pixel circuit, a voltage programming type pixel circuit, a voltage comparison type pixel circuit, a subframe type pixel circuit, and the like. Can be adopted.

<1-2: Configuration of Pixel Unit>
Next, a more detailed configuration of the pixel unit 70 will be described with reference to FIGS. 2 and 3. 2 is a plan view of an arbitrary pixel portion, and FIG. 3 is a cross-sectional view taken along the line AA ′ of the pixel portion shown in FIG. In FIGS. 2 and 3, the scale is different for each layer and each member so that each layer and each member can be recognized on the drawing.

  For example, the semiconductor layer 3 of the switching transistor 76 and the driving transistor 74 is formed on the substrate 10 formed of a transparent member such as a transparent resin or a glass substrate. The semiconductor layer 3 is formed using, for example, a low temperature polysilicon technique. On the semiconductor layer 3, the gate insulating layer 2 of the switching transistor 76 and the driving transistor 74 is formed so as to be embedded in the semiconductor layer 3. Further, the gate electrode 3 a of the driving transistor 74 and the scanning line 112 are formed on the gate insulating layer 2. A part of the scanning line 112 is formed as a gate electrode of the switching transistor 76. The gate electrode 3a and the scanning line 112 are made of a metal material containing at least one of Al (aluminum), W (tungsten), Ta (tantalum), Mo (molybdenum), Ti (titanium), copper (Cu), and the like. Is formed.

  In addition, an interlayer insulating layer 41 is formed on the gate insulating layer 2 so as to bury the scanning line 112 and the gate electrode 3 a of the driving transistor 74. The interlayer insulating layer 41 and the gate insulating layer 2 are made of, for example, a silicon oxide film.

  On the interlayer insulating layer 41, for example, a data line 114 and a power supply line 117, and further a drain electrode 42 of the driving transistor 74, each made of a conductive material containing aluminum (Al) or ITO (Indium Tin Oxide), for example. Is formed. Contact holes 501 and 502 are formed in the interlayer insulating layer 41 from the surface of the interlayer insulating layer 41 through the interlayer insulating layer 41 and the gate insulating layer 2 to reach the semiconductor layer 3 of the driving transistor 74. As shown in FIG. 3, the conductive film constituting the power supply line 117 and the drain electrode 42 is continuously formed so as to reach the surface of the semiconductor layer 3 along the inner walls of the contact holes 501 and 502. .

  Here, the lower capacitor electrode of the storage capacitor 78 is formed in the same layer as the scanning line 112 using, for example, the same material, and a part of the power supply line 117 is formed as the upper capacitor electrode of the storage capacitor 78. Yes. The interlayer insulating layer 41 is formed as a dielectric film, and a part of the interlayer insulating layer 41 is sandwiched between the lower capacitor electrode and the upper capacitor electrode.

  On the interlayer insulating layer 41, for example, a silicon nitride film (SiN) is formed as the protective layer 45 by embedding the power supply line 117 and the drain electrode 42. A first bank layer 46 made of, for example, a silicon oxide film is formed on the protective layer 45, and a second bank layer 47 is further formed on the first bank layer 46. The first bank layer 46 and the second bank layer 47 define the formation region of the organic EL layer 50 in the pixel unit 70.

  The anode 34 which is the “first electrode” according to the present invention is formed on the protective layer 45 so that the surface is exposed in the formation region of the organic EL layer 50. The anode 34 is formed using ITO as a transparent conductive material so as to extend from the formation region of the organic EL layer 50 and overlap with a part of the drain electrode 42.

  Further, the organic EL layer 50 is formed on the anode 34 in the region where the organic EL layer 50 is formed. The organic EL layer 50 includes, for example, a light emitting layer 50a, a hole injection layer or a hole transport layer (hereinafter appropriately referred to as a hole injection / transport layer) 50b, and an electron injection layer or an electron transport layer (hereinafter appropriately referred to as an electron injection). / Referred to as transport layer) 50c. In the organic EL layer 50, for example, the hole injection / transport layer 50b, the light emitting layer 50a, and the electron injection / transport layer 50c are sequentially stacked on the substrate 10 in this order. The organic EL layer 50 may include only the light emitting layer 50a, or may include any one of the hole injection / transport layer 50b and the electron injection / transport layer 50c in addition to the light emitting layer 50a.

  The organic EL element 72 includes an anode 34 and a cathode 49, and an organic EL layer 50 sandwiched between the anode 34 and the cathode 49. In FIG. 3, the sealing substrate is not shown. The cathode 49 which is an example of the “second electrode” according to the present invention is formed using a metal material containing, for example, aluminum (Al), or calcium (Ca), lithium fluoride (LiF), strontium fluoride. It is formed as a stacked film of conductive films formed using a metal material containing at least one of (SrF2), magnesium (Mg), silver (Ag), and the like.

  When the organic EL device is driven, a scanning signal is supplied via the scanning line 112, whereby the switching transistor 76 is turned on. When the switching transistor 76 is turned on, an image signal is written to the storage capacitor 78 from the data line 114. The electrical conduction state of the driving transistor 74 is determined according to the current of the image signal written in the storage capacitor 78. Then, when a current corresponding to the image signal written in the storage capacitor 78 is supplied from the power supply line 117 to the anode 34 of the organic EL element 72 through the channel of the driving transistor 74, the current corresponding to the supplied current is supplied. Thus, the light emitting layer 50a in the organic EL layer 50 emits light. In the present embodiment, as indicated by an arrow X in FIG. 3, the organic EL device is configured as a bottom emission type in which light emitted from the organic EL element 72 is emitted as display light from the substrate 10 side. In the present embodiment, the organic EL device may be configured as a top emission type that emits light emitted from the organic EL element 72 as display light from the sealing substrate side.

<1-3: Manufacturing method of organic EL device>
Next, a manufacturing process of the organic EL device will be described with reference to FIGS. 4 to 6 in addition to FIGS. FIG. 4 is a flowchart for explaining each process related to the manufacturing process of the organic EL device in the present embodiment, and FIG. 5 is a flow of each process in the manufacturing apparatus used for manufacturing the organic EL device. It is a schematic diagram for demonstrating this. 6A and 6B schematically show a configuration example of the first processing chamber.

  First, in FIG. 4, various wirings such as scanning lines 112 and data lines 114 and driving elements such as driving transistors 74 are formed on the substrate 10 (step S101). The first electrode "is formed (step S102). Further, first and second bank layers 46 and 47 are formed on the upper layer side of the anode 34.

  After that, plasma treatment is performed on the surface of the substrate 10 on which the anode 34 is formed, and a region showing lyophilicity and a region showing liquid repellency are formed for each pixel unit 70 as follows. (Step S103). That is, for each pixel, in the formation region of the organic EL layer 50, the first and second bank layers 46 and 47 are continuously exposed from a part of the first bank layer 46 exposed from the second bank layer 47. A region showing lyophilicity is formed on the surface of the anode 34. In addition, a region having liquid repellency is continuously formed on the upper surface of the second bank layer 47 from the side wall of the second bank layer 47 that defines the formation region of the organic EL layer 50 by the plasma treatment. As described above, by performing the plasma treatment, it is possible to improve wettability particularly on a part of the surface of the anode 34 on which each functional layer of the organic EL layer 50 is formed. In addition, by forming a region exhibiting liquid repellency for each pixel unit 70, when the organic EL layer 50 is formed, it protrudes from the region where the organic EL layer 50 is formed and is injected into the upper surface of the second bank layer 47. It is possible to prevent the transport layer 50b and the light emitting layer 50a from being formed.

  The processes from step S101 to step S103 as described above are performed in the second processing chamber J2 shown in FIG. Thereafter, as indicated by an arrow 601 from the second processing chamber J2, the substrate 10 is transferred to the first processing chamber J1. Then, the substrate 10 is held in the first processing chamber J1 as follows (step S104).

  As shown in FIG. 6A, when the door 708 in the first processing chamber J1 is opened and closed, the substrate 10 is loaded into the first processing chamber J1, and is held in the first processing chamber J1 by the holding means 706. Retained. In the state where the substrate 10 is held in this manner, the solvent in the container 704 is bubbled and vaporized in the first processing chamber J1 by, for example, the compressor 702, and the vapor of the solvent thus obtained is set at a predetermined pressure. It is supplied to become.

  In the first processing chamber J1, it is preferable to adjust the pressure of the solvent vapor so as to be 80% or more of the saturated vapor pressure of the solvent. In addition, the pressure in the first processing chamber J1 is adjusted so that, for example, the vapor of the solvent and air or nitrogen (N2) are combined to become an atmospheric pressure.

  Furthermore, in the container 704, a solvent in which the functional layer formed in the process of step S105 described later is soluble is retained. When the hole injection / transport layer 50b is formed as a functional layer, for example, at least one polar solvent of methanol, ethanol, propanol, hexanol, butanol, etc. is held in the container 704 as water or lower alcohol. To do. Alternatively, in the case of forming the light emitting layer 50a as the functional layer, for example, at least one of xylene, trimethylbenzene, tetramethylbenzene, cyclohexylbenzene, ethylbiphenyl, isopropylbiphenyl, n (normal) -propylbiphenyl, and the like. Polar solvent is held in container 704.

  As shown in FIG. 6B, a compressor 702 and a container 704 may be installed outside the first processing chamber J1. In addition, a filter 703 is provided in the path from the compressor 702 to the container 704, or a sensor (not shown) for observing the amount of the solvent based on the level of the solvent in the container 704 is provided. It may be. Further, as shown in FIG. 6B, the gas in the first processing chamber J <b> 1 may be exhausted by being sucked by a compressor 702.

  In the first processing chamber J1, the substrate 10 is held by the holding means 706 so that the surface on the side where the anode 34 is formed comes into contact with the vapor of the solvent. The entire surface of the substrate 10 is in contact with the vapor of the solvent, and any part of the surface of the substrate 10 is in contact with the vapor having a predetermined pressure. As described above, by adjusting the pressure of the solvent vapor in the first processing chamber J1, the solvent can be liquefied and adhered to the surface of the anode 34 in each pixel portion 70 on the substrate 10.

  Therefore, it is possible to improve wettability at each pixel portion 70 on the substrate 10 and to ensure uniform wettability. Further, when attention is paid to each pixel portion 70 in the substrate 10, it is possible to improve wettability and ensure uniform wettability even within the pixel portion 70. Therefore, even if the processing conditions differ in the pixel unit 70 on the substrate 10 or in each pixel unit 70 on the substrate 10 by the plasma processing in step S103, the substrate is subsequently processed in the first processing chamber J1. By holding 10, uniform wettability can be ensured in the pixel portion 70 on the substrate 10 and in each pixel portion 70 on the substrate 10.

  The holding time of the substrate 10 in the first processing chamber J1 is, for example, about 1 to 30 minutes, and the temperature in the first processing chamber J1 is preferably 20 to 60 [° C.]. According to the study by the present inventors, the wettability can be improved in the pixel unit 70 or in each pixel unit 70 only by holding the substrate 10 in the first processing chamber J1 for about 1 minute, and the holding time is lengthened. Even in about 30 minutes, the effect reaches its peak.

  Subsequently, the substrate 10 is transferred from the first processing chamber J1 shown in FIG. 5 to the third processing chamber J3 as indicated by an arrow 602. Then, in the third processing chamber J3, the material of the hole injection / transport layer 50b is applied on the anode 34 for each pixel portion 70 by, for example, an inkjet method. Thereafter, the substrate 10 coated with the material of the hole injection / transport layer 50b is transferred from the third processing chamber J3 to the fourth processing chamber J4 as indicated by an arrow 603 in FIG. Then, in the fourth processing chamber J4, the material of the hole injection / transport layer 50b applied on the substrate 10 is dried, for example, under reduced pressure to form the hole injection / transport layer 50b (step S105).

  In the present embodiment, by performing the process of step S104, the material of the hole injection / transport layer 50b is uniformly applied in the pixel unit 70 in the third processing chamber J3, and each pixel unit 70 on the substrate 10 is applied. However, it is possible to uniformly apply the material of the hole injection / transport layer 50b, and it is possible to prevent coating unevenness. As a result, the hole injection / transport layer 50b having a flat surface and a uniform film thickness can be obtained in the pixel portion 70 and each pixel portion 70 on the substrate 10.

  Thereafter, the light emitting layer 50a and the electron injection / transport layer 50c are sequentially formed on the hole injection / transport layer 50b to form the organic EL layer 50. More specifically, after forming the hole injection / transport layer 50b, the substrate 10 is transferred again from the fourth processing chamber J4 to the first processing chamber J1, as indicated by an arrow 604 in FIG. Then, similarly to the film formation of the hole injection / transport layer 50b, the substrate 10 was transferred from the first processing chamber J1 to the third processing chamber J3, and transferred from the third processing chamber J3 to the fourth processing chamber J4. Thereafter, the procedure of transporting the substrate 10 to the first processing chamber J1 again is repeated to form the light emitting layer 50a and the electron injection / transport layer 50c, respectively. Therefore, the light emitting layer 50a and the electron injecting / transporting layer 50b having a flat surface and a uniform film thickness can be obtained in the pixel portion 70 and each pixel portion 70 on the substrate 10, respectively. In the first processing chamber J1, a vapor of a solvent in which the light emitting layer 50a is soluble when the light emitting layer 50a is formed, and a solvent in which the electron injection / transport layer 50c is soluble when the electron injecting / transporting layer 50c is formed. The steam of each is supplied.

  Thereafter, a cathode 49 is formed on the organic EL layer 50, and the organic EL element 72 is sealed with, for example, a sealing substrate.

  In FIG. 5, when a plurality of substrates 10 are processed in the first to fourth processing chambers J1 to J4 in the organic EL device manufacturing apparatus, each substrate 10 is set in the first processing chamber J1 for a predetermined time. It is preferable that the solvent vapor is adjusted to a predetermined pressure and maintained at a predetermined temperature. In this way, it is possible to make the wettability uniform in the pixel unit 70 or in each pixel unit 70 in each substrate 10. Therefore, in each substrate 10, the surface of the hole injection / transport layer 50 b and the light emitting layer 50 can be flattened and the film thickness can be made uniform in the pixel portion 70 and each pixel portion 70.

  Therefore, according to the manufacturing process of the present embodiment as described above, the yield in manufacturing the organic EL device can be improved. In addition, in the organic EL device manufactured by the manufacturing process of the present embodiment, it is possible to obtain a uniform light emission state in the pixel unit 70 or in each pixel unit 70, and display defects such as luminance unevenness occur. Can be prevented. As a result, each organic EL device can perform high-quality image display and obtain uniform display characteristics.

<2: Second Embodiment>
Next, a second embodiment according to the organic EL device of the present invention will be described. The second embodiment differs from the first embodiment in a part of the manufacturing process of the organic EL device. Therefore, only differences from the first embodiment will be described with reference to FIGS.

  FIG. 7 is a diagram illustrating a flowchart for explaining each process related to the manufacturing process of the organic EL device according to the second embodiment, and FIG. 8 illustrates each process in the manufacturing apparatus used for manufacturing the organic EL device. It is a schematic diagram for demonstrating a flow typically. In addition, about the process or structure similar to 1st Embodiment, the same code | symbol is attached | subjected and shown, and the overlapping description is abbreviate | omitted.

  In the following, as in the first embodiment, the organic EL layer 50 is formed by sequentially forming the hole injection / transport layer 50b, the light emitting layer 50a, and the electron injection / transport layer 50c on the anode 34. And

  First, in FIG. 7, similarly to the first embodiment, steps S101 to S103 are performed in the second processing chamber J2 shown in FIG. Thereafter, as indicated by an arrow 611, the substrate 10 is transferred from the second processing chamber J2 to the third processing chamber J3. Then, in the third processing chamber J3, the material of the hole injection / transport layer 50b is applied on the anode 34 for each pixel portion 70. Thereafter, the substrate 10 coated with the material of the hole injection / transport layer 50b is transferred from the third processing chamber J3 to the fourth processing chamber J4 as indicated by an arrow 612 in FIG. Then, in the fourth processing chamber J4, the material for the hole injection / transport layer 50b applied on the substrate 10 is dried to form the hole injection / transport layer 50b (step S204).

  Subsequently, the substrate 10 is transferred from the fourth processing chamber J4 to the first processing chamber J1 as indicated by an arrow 613 in FIG. Then, the substrate 10 is held in the first processing chamber J1 (step S205). Here, the vapor of the solvent in which the hole injection / transport layer 50b is soluble is supplied into the first processing chamber J1 so as to have a predetermined pressure.

  In the first processing chamber J1, the substrate 10 and the vapor of the solvent come into contact with each other, so that the solvent liquefies and adheres to the surface of the hole injection / transport layer 50b in each pixel unit 70. In the vicinity of the surface of the hole injection / transport layer 50b, the material of the hole injection / transport layer 50b is redissolved in the solvent. Therefore, before the substrate 10 is transferred to the first processing chamber J1, when the material of the hole injection / transport layer 50b applied on the substrate 10 is dried in the fourth processing chamber J4, Even if the drying speed is nonuniform between the pixel portions 70 in the substrate 10, the material of the hole injection / transport layer 50b is re-dissolved on the surface of the hole injection / transport layer 50b as described above. It is possible to relax the generated step and planarize the surface of the hole injection / transport layer 50b. Therefore, the flatness of the hole injection / transport layer 50b can be improved in each pixel portion 70 on the substrate 10. If attention is paid to each pixel portion 70 in the substrate 10, the flatness of the hole injection / transport layer 50 b can be improved also in the pixel portion 70.

  Furthermore, since the surface of the substrate 10 can be uniformly contacted with the vapor of the solvent as a whole as compared with, for example, the case where the solvent is directly spray-coated on the substrate 10, the uneven application of the solvent can be prevented, It is possible to obtain uniform flatness in the pixel portion 70 on the substrate 10 and also obtain uniform flatness in each pixel portion 70 on the substrate 10. In addition, as will be described later, when processing a plurality of substrates 10 in the first to fourth processing chambers J1 to J4 in the organic EL device manufacturing apparatus, the holding time in the first processing chamber J1 is set to a predetermined value. By adjusting, it becomes possible to easily perform processing with high reproducibility on each substrate 10.

  Subsequently, the substrate 10 is transferred from the first processing chamber J1 to the fourth processing chamber J4 as indicated by an arrow 614 in FIG. In the fourth processing chamber J4, the re-dissolved material of the hole injection / transport layer 50b is dried again, for example, under reduced pressure (step S206).

  Thereafter, the light emitting layer 50a and the electron injection / transport layer 50c are sequentially formed on the hole injection / transport layer 50b to form the organic EL layer 50. More specifically, after the material of the hole injection / transport layer 50b is re-dried, the substrate 10 is again transferred from the fourth processing chamber J4 to the third processing chamber J3 as indicated by an arrow 615 in FIG. Transport. Then, as in the film formation of the hole injection / transport layer 50b, the substrate 10 is transferred from the third processing chamber J3 to the fourth processing chamber J4, then transferred to the first processing chamber J1, and again to the fourth processing chamber. The procedure of transporting the substrate 10 to J4 is repeated to form the light emitting layer 50a and the electron injection / transport layer 50c, respectively. Therefore, the flatness of each of the light emitting layer 50a and the electron injection / transport layer 50c can be improved in the pixel portion 70 on the substrate 10 or in each pixel portion 70. In the first processing chamber J1, a vapor of a solvent in which the light emitting layer 50a is soluble when the light emitting layer 50a is formed, and a solvent in which the electron injection / transport layer 50c is soluble when the electron injecting / transporting layer 50c is formed. The steam of each is supplied.

  Similarly to the first embodiment, when processing a plurality of substrates 10 in the first to fourth processing chambers J1 to J4 in the organic EL device manufacturing apparatus, each substrate 10 is set at a predetermined temperature for a predetermined time. In addition, the vapor of the solvent is preferably adjusted to a predetermined pressure and maintained. In this way, it is possible to ensure uniform flatness in the pixel unit 70 or in each pixel unit 70 in each substrate 10.

  Therefore, in 2nd Embodiment, it becomes possible to enjoy the same profit as 1st Embodiment.

<3: Third embodiment>
Next, a third embodiment according to the organic EL device of the present invention will be described. The third embodiment is different from the first or second embodiment in a part of the manufacturing process of the organic EL device. Therefore, only differences from the first or second embodiment will be described with reference to FIGS.

  FIG. 9 is a diagram illustrating a flowchart for explaining each process related to the manufacturing process of the organic EL device according to the third embodiment, and FIG. 10 illustrates each process in the manufacturing apparatus used for manufacturing the organic EL device. It is a schematic diagram for demonstrating a flow typically. In addition, about the process or structure similar to 1st or 2nd embodiment, the same code | symbol is attached | subjected and shown, and the overlapping description is abbreviate | omitted.

  In the following, similarly to the first or second embodiment, the organic EL layer 50 is formed by sequentially forming the hole injection / transport layer 50b, the light emitting layer 50a, and the electron injection / transport layer 50c on the anode 34. Shall be formed.

  First, in FIG. 9, similarly to the first or second embodiment, steps S101 to S103 are performed in the second processing chamber J2 shown in FIG. Thereafter, as indicated by an arrow 621, the substrate 10 is transferred from the second processing chamber J2 to the first processing chamber J1. Then, the substrate 10 is held in the first processing chamber J1 (step S304).

  Here, the vapor of the solvent in which the hole injection / transport layer 50b is soluble is supplied into the first processing chamber J1 so as to have a predetermined pressure. In the first processing chamber J1, the substrate 10 and the solvent vapor come into contact with each other, so that the solvent liquefies and adheres to the surface of the anode 34 in each pixel portion 70. Therefore, it is possible to improve wettability at each pixel portion 70 on the substrate 10 and to ensure uniform wettability. Further, when attention is paid to each pixel portion 70 in the substrate 10, it is possible to improve wettability and ensure uniform wettability even within the pixel portion 70. .

  Subsequently, the substrate 10 is transferred from the first processing chamber J1 shown in FIG. 10 to the third processing chamber J3 as indicated by an arrow 622. Then, in the third processing chamber J3, the material of the hole injection / transport layer 50b is applied on the anode 34 for each pixel portion 70. Thereafter, the substrate 10 coated with the material of the hole injection / transport layer 50b is transferred from the third processing chamber J3 to the fourth processing chamber J4 as indicated by an arrow 623 in FIG. Then, in the fourth processing chamber J4, the material for the hole injection / transport layer 50b applied on the substrate 10 is dried to form the hole injection / transport layer 50b (step S305).

  By the processing in the first processing chamber J1, in the third processing chamber J3, the material of the hole injection / transport layer 50b is uniformly applied in each pixel portion 70 on the substrate 10, and also uniformly in the pixel portion 70. It becomes possible to apply the material of the hole injection / transport layer 50b, and it is possible to prevent uneven application.

  Subsequently, the substrate 10 is transferred from the fourth processing chamber J4 to the first processing chamber J1, as indicated by an arrow 624 in FIG. Then, the substrate 10 is held in the first processing chamber J1 (step S306). Also in this case, the solvent vapor in which the hole injection / transport layer 50b is soluble is supplied into the first processing chamber J1 so as to have a predetermined pressure.

  In the first processing chamber J1, the material of the hole injection / transport layer 50b is redissolved in the solvent liquefied and attached to the surface of the hole injection / transport layer 50b in each pixel portion 70. Therefore, the flatness of the hole injection / transport layer 50 b can be improved in each pixel portion 70 on the substrate 10. If attention is paid to each pixel portion 70 in the substrate 10, the flatness of the hole injection / transport layer 50 b can be improved also in the pixel portion 70.

  Subsequently, the substrate 10 is transferred from the first processing chamber J1 to the fourth processing chamber J4 as indicated by an arrow 625 in FIG. Then, the re-dissolved material of the hole injection / transport layer 50b is re-dried in the fourth processing chamber J4 (step S307).

  Thereafter, the light emitting layer 50a and the electron injection / transport layer 50c are sequentially formed on the hole injection / transport layer 50b to form the organic EL layer 50. More specifically, after the material of the hole injection / transport layer 50b is re-dried, the substrate 10 is again transferred from the fourth processing chamber J4 to the first processing chamber J1 as indicated by an arrow 624 in FIG. Transport. As in the film formation of the hole injection / transport layer 50b, the substrate 10 is transferred from the first processing chamber J1 to the third processing chamber J3, then transferred to the fourth processing chamber J4, and again in the first processing chamber. After transporting the substrate 10 to J1, the procedure of re-drying in the fourth processing chamber J4 is repeated to form the light emitting layer 50a and the electron injection / transport layer 50c, respectively. In the first processing chamber J1, a vapor of a solvent in which the light emitting layer 50a is soluble when the light emitting layer 50a is formed, and a solvent in which the electron injection / transport layer 50c is soluble when the electron injecting / transporting layer 50c is formed. The steam of each is supplied.

  Similarly to the first or second embodiment, when a plurality of substrates 10 are processed in the first to fourth processing chambers J1 to J4 in the organic EL device manufacturing apparatus, each substrate 10 is set for a predetermined time. It is preferable that the solvent vapor is adjusted to a predetermined pressure and maintained at a predetermined temperature. In this way, in each substrate 10, the shape of each of the hole injection / transport layer 50 b and the light emitting layer 50 can be made uniform in the pixel unit 70 or in each pixel unit 70. Therefore, according to the third embodiment, it is possible to receive the same benefits as those in the first or second embodiment.

In the third embodiment, the flatness of the surface of the functional layer such as the light emitting layer 50a is more reliably improved in each pixel unit 70 on the substrate 10 as compared with the first or second embodiment. The flatness of the surface of the functional layer and the film thickness of the functional layer can be made uniform.
Further, if attention is paid to each pixel portion 70 in the substrate 10, the flatness of the surface of the functional layer such as the light emitting layer 50a is more reliably improved and the surface of the functional layer is flattened in the pixel portion 70 as well. It becomes possible to make the film thickness of a property and a functional layer uniform.

<4: Electronic equipment>
Next, a case where the above-described organic EL device is applied to various electronic devices will be described.

<4-1: Mobile computer>
First, an example in which this organic EL device is applied to a mobile personal computer will be described. FIG. 11 is a perspective view showing the configuration of the personal computer. In the figure, a computer 1200 includes a main body 1204 including a keyboard 1202 and a display unit 1206 configured using an organic EL device.

<4-2: Mobile phone>
Further, an example in which this organic EL device is applied to a mobile phone will be described. FIG. 12 is a perspective view showing the configuration of this mobile phone. In the figure, a mobile phone 1300 includes an organic EL device together with a plurality of operation buttons 1302.

  In addition, organic EL devices include notebook personal computers, PDAs, televisions, viewfinders, monitor direct-view video tape recorders, car navigation devices, pagers, electronic notebooks, calculators, word processors, workstations, POS terminals, The present invention can be applied to devices such as a touch panel, an image forming apparatus such as a printer, a copy, and a facsimile using an organic EL device as an exposure head.

  The present invention is not limited to the above-described embodiments, and can be appropriately changed without departing from the gist or the spirit of the invention that can be read from the claims and the entire specification, and an organic EL device with such a change. The manufacturing method and manufacturing apparatus, the organic EL device manufactured by the manufacturing method, and various electronic devices including such an organic EL device are also included in the technical scope of the present invention.

It is a block diagram which shows the whole structure of an organic electroluminescent apparatus. It is a top view of arbitrary pixel parts. FIG. 3 is an AA ′ cross-sectional view of the pixel portion shown in FIG. 2. It is a figure which shows the flowchart for demonstrating each process which concerns on the manufacturing process of an organic electroluminescent apparatus. It is a schematic diagram for demonstrating typically the flow of each process in the manufacturing apparatus of an organic EL apparatus. FIG. 6A and FIG. 6B are diagrams schematically illustrating a configuration example of the first processing chamber. It is a figure which shows the flowchart for demonstrating each process which concerns on the manufacturing process of the organic electroluminescent apparatus in 2nd Embodiment. It is a schematic diagram for demonstrating typically the flow of each process in the manufacturing apparatus of the organic EL device in 2nd Embodiment. It is a figure which shows the flowchart for demonstrating each process which concerns on the manufacturing process of the organic electroluminescent apparatus in 3rd Embodiment. It is a schematic diagram for demonstrating typically the flow of each process in the manufacturing apparatus of the organic EL apparatus in 3rd Embodiment. It is a perspective view which shows the structure of the personal computer which is an example of the electronic device to which the organic EL apparatus is applied. It is a perspective view which shows the structure of the mobile telephone which is an example of the electronic device to which an organic EL apparatus is applied.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Board | substrate, 34 ... Anode, 49 ... Cathode, 50 ... Organic EL layer, 70 ... Pixel part, J1 ... 1st processing chamber, J2 ... 2nd processing chamber, J3 ... 3rd processing chamber, J4 ... 4th processing chamber

Claims (13)

A method of manufacturing an organic EL device comprising a first and second electrodes and at least one functional layer sandwiched between the first and second electrodes on a substrate for each pixel,
Forming the first electrode for each pixel on the substrate;
After forming the first electrode, holding the substrate in a processing chamber having a predetermined pressure of vapor of a solvent in which the material of the functional layer is soluble;
And a step of forming the functional layer on the first electrode after the substrate is held in the processing chamber. A method of manufacturing an organic EL device comprising a first and second electrodes and at least one functional layer sandwiched between the first and second electrodes on a substrate for each pixel,
Forming the first electrode for each pixel on the substrate;
A step of holding the substrate in a processing chamber having a predetermined pressure of vapor of a solvent in which the material of the functional layer is soluble after forming the first electrode and before forming the functional layer. When,
Depositing the functional layer on the first electrode;
And a step of holding the substrate in the processing chamber after forming the functional layer. After the step of forming the first electrode, before the functional layer is formed and before the step of holding the substrate, a step of performing a plasma treatment on the substrate as an ink application pretreatment In addition,
3. The method of manufacturing an organic EL device according to claim 1, wherein the step of forming the functional layer forms the functional layer by ink application. A method of manufacturing an organic EL device comprising, on a substrate, for each pixel, a first and second electrode, and at least one functional layer sandwiched between the first and second electrodes,
Depositing the functional layer on the first electrode;
A step of holding the substrate in a processing chamber in which a vapor of a solvent in which the material of the functional layer is soluble is set to a predetermined pressure after forming the functional layer. Method. 5. The method according to claim 1, wherein in the step of holding the substrate, the predetermined pressure is adjusted to a value of 80% or more of a saturated vapor pressure of the solvent. The manufacturing method of the organic electroluminescent apparatus of description. The method for manufacturing an organic EL device according to claim 1, wherein in the step of forming the functional layer, a light emitting layer is formed as the functional layer. The organic EL device manufacturing method according to claim 1, wherein in the step of forming the functional layer, a hole injection layer or a hole transport layer is formed as the functional layer. Method. The method for manufacturing an organic EL device according to claim 1, wherein in the step of forming the functional layer, an electron injection layer or an electron transport layer is formed as the functional layer.   An organic EL device manufactured by the method for manufacturing an organic EL device according to claim 1.   An electronic apparatus comprising the organic EL device according to claim 9. An apparatus for manufacturing an organic EL device comprising, on a substrate, for each pixel, first and second electrodes and at least one functional layer sandwiched between the first and second electrodes,
Means for forming the first electrode for each pixel on the substrate;
Means for holding the substrate in a processing chamber having a predetermined pressure of vapor of a solvent in which the material of the functional layer is soluble after forming the first electrode;
An apparatus for manufacturing an organic EL device, comprising: means for forming the functional layer on the first electrode after holding the substrate in the processing chamber. A device for manufacturing an organic EL device comprising, on a substrate, a first electrode and a second electrode for each pixel, and at least one functional layer sandwiched between the first and second electrodes,
Means for forming the first electrode for each pixel on the substrate;
Means for holding the substrate in a processing chamber having a predetermined pressure of vapor of a solvent in which the material of the functional layer is soluble after forming the first electrode and before forming the functional layer. When,
Means for depositing the functional layer on the first electrode,
The method for manufacturing an organic EL device is characterized in that the means for holding the substrate holds the substrate again in the processing chamber after forming the functional layer. A device for manufacturing an organic EL device comprising, on a substrate, a first electrode and a second electrode for each pixel, and at least one functional layer sandwiched between the first and second electrodes,
Means for depositing the functional layer on the first electrode;
And a means for holding the substrate in a processing chamber in which a vapor of a solvent in which the material of the functional layer is soluble is set to a predetermined pressure after forming the functional layer. apparatus.

Images