JP2006076007A - Splicing method of heat-resistant films - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a splicing method of heat-resistant films capable of certainly and strongly splicing the splicing parts of the heat-resistant films without damaging the heat resistance of the heat-resistant films. <P>SOLUTION: A heat-resistant film, which is composed of a base material film and a pressure-sensitive layer, is pasted on the splicing parts of the heat-resistant films. Even if the heat-resistant films are spliced after foreign matter formed at the time of formation of the heat-resistant films is cut and removed, a spliced heat-resistant film having sufficient heat resistance is obtained. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a method for seaming heat resistant films that can reliably join seam portions of heat resistant films without impairing the heat resistance of the heat resistant films.

  The heat-resistant film is widely used for various applications, and in particular, it is widely used for semiconductors and mounted circuit board applications. Typical examples of such a heat resistant film include a polyimide film and a liquid crystal polymer film. A typical polymer material for the polyimide film is polyimide composed of pyromellitic dianhydride and 4,4′-diaminodiphenyl ether. Since this polyimide has a structure with a good balance between mechanical and thermal properties, it is widely used industrially as a general-purpose product.

  When a polyimide film is produced, a step of imidizing a polyamic acid as a precursor is usually performed. In this case, heating at a high temperature is required to sufficiently imidize the polyamic acid. However, when heated at a high temperature, a part of the oligomer region that is not sufficiently high in molecular weight evaporates from the film, but when part of the evaporated oligomer is reattached to the surface of the film, it differs from the surroundings. It shows color and appearance and is present in the film as foreign matter. Such foreign matter may not be a problem in particular, but when a polyimide film is used for a semiconductor or a mounting circuit board, if such foreign matter is present in the wiring portion, it may cause disconnection or short circuit. For this reason, it is preferable that foreign substances do not exist as much as possible.

  Since it is difficult to completely eliminate the problem of foreign matters existing on this polyimide film, in order to solve the above problems, after forming a polyimide film, the foreign matters are detected by inspection, A method is used in which the film in the existing portion is cut off and removed, and then joined again.

  However, after separating and removing the film where the foreign matter exists by such a method, the method of pasting the seam part using an adhesive as conventionally performed (see, for example, Patent Documents 1 and 2) When the film is taken, the thermoplastic polyimide has a softening point, and if it exceeds the softening point, the adhesive strength becomes weak. Therefore, peeling occurs between the layers of the adhesive, and when the film is conveyed at high temperature, the seam portion is cut. There was a problem that.

Further, there is known a method of joining after activating the surface of the seam portion of the film by plasma treatment (see, for example, Patent Document 3). However, sufficient adhesion strength cannot be expressed only by such plasma treatment. Also, there was a problem that the seam portion was cut during the conveyance of the film.
Japanese Patent Laid-Open No. 10-157896 Japanese Patent Laid-Open No. 11-343054 JP 2000-178363 A

  Therefore, an object of the present invention is to solve the problems in the method for joining heat resistant films, and to provide a heat resistant film capable of reliably and firmly joining the seam portions of the heat resistant film without impairing the heat resistance of the heat resistant film. It is to provide a seaming method.

  In order to achieve the above object, according to the present invention, in the method for joining heat-resistant films, a heat-resistant tape comprising a base film and an adhesive layer is attached to a joint portion of the heat-resistant film. A method for seaming films is provided.

In addition, in the seaming method of the heat-resistant film of the present invention,
The material of the heat-resistant film is a polyimide film;
The base film of the heat-resistant tape is a polyimide film;
Affixing the heat-resistant tape on both sides of the joint portion of the heat-resistant film;
The heat-resistant film has a thickness of 5 to 225 μm;
The total thickness of the heat-resistant tape is 10 to 150 μm;
The thickness of the base film of the heat-resistant tape is 5 to 125 μm, and the thickness of the adhesive layer is 5 to 100 μm.
The heat-resistant film is a polyimide film, and the diamine component of the polyimide is at least one selected mainly from diaminodiphenyl ether, phenylenediamine and diaminodiphenylpropane.
The heat-resistant film is a polyimide film, and the acid component of the polyimide is mainly at least one selected from pyromellitic acid, biphenyltetracarboxylic acid and benzophenonetetracarboxylic acid,
It is preferable that the heat resistance of the adhesive layer of the heat-resistant tape is 200 ° C. or higher, and that the heat-resistant film and the base film of the heat-resistant tape are the same material.

  According to the present invention, as described below, since the seam portion of the heat-resistant film can be securely and firmly joined without impairing the heat resistance of the heat-resistant film, foreign matters generated during film formation of the heat-resistant film are removed. Thus, it is possible to provide a heat-resistant film having sufficient heat resistance even when seamed.

  Below, the joining method of the heat-resistant film of this invention is demonstrated in detail, referring drawings.

  1 to 4 are cross-sectional views showing a seam portion of a heat-resistant film joined by the method of the present invention.

  A feature of the present invention is that the joint portion of the heat-resistant film is joined by a heat-resistant tape.

  In the first embodiment shown in FIG. 1, the heat-resistant tape 2 is attached to both surfaces of the joint portion 3 where the heat-resistant film 1 is abutted.

  In the second embodiment shown in FIG. 2, the heat-resistant tape 2 is attached to only one surface of the joint portion 3 where the heat-resistant film 1 is abutted, and the seam is bonded.

  As in the second embodiment, the heat-resistant tape 2 may be attached only to one side of the joint portion 3. However, when the strength of the joint portion is sufficiently taken into consideration, the joint portion is used as in the first embodiment. 3 is preferably pasted on both sides.

  Further, in order to clarify the existence of the joint portion 3, before and after the joint portion 3 (third embodiment shown in FIG. 3), or at the end of the joint portion (fourth embodiment shown in FIG. 4). It is preferable to apply a marking such as a mark tape 4.

  Examples of the heat-resistant film used in the present invention include a polyimide film, a liquid crystal polymer film, a polyamide film, a polyphenylene sulfide film, and a polyamideimide film. Among these, a polyimide film is particularly preferable. Specific examples of the acid dianhydride component and the diamine component of the polyimide film include the following.

(1) acid dianhydride pyromellitic dianhydride, 3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride, 2,3 ′, 3,4′-biphenyltetracarboxylic dianhydride, 3,3 ′, 4,4′-benzophenonetetracarboxylic dianhydride, 2,3,6,7-naphthalenedicarboxylic dianhydride, 2,2-bis (3,4-dicarboxyphenyl) ether, pyridine -2,3,5,6-tetracarboxylic dianhydride, 1,2,4,5-naphthalene tetracarboxylic dianhydride, 1,4,5,8-naphthalene tetracarboxylic dianhydride, 1, 4,5,8-decahydronaphthalene tetracarboxylic dianhydride, 4,8-dimethyl-1,2,5,6-hexahydronaphthalene tetracarboxylic dianhydride, 2,6-dichloro-1,4 5,8-Naphthalenetetracarboxylic acid Dianhydride, 2,7-dichloro-1,4,5,8-naphthalenetetracarboxylic dianhydride, 2,3,6,7-tetrachloro-1,4,5,8-naphthalenetetracarboxylic acid Anhydride, 1,8,9,10-phenanthrenetetracarboxylic dianhydride, 2,2-bis (2,3-dicarboxyphenyl) propane dianhydride, 1,1-bis (3,4-dicarboxy) Phenyl) ethane dianhydride, 1,1-bis (2,3-dicarboxyphenyl) ethane dianhydride, bis (2,3-dicarboxyphenyl) methane dianhydride, bis (3,4-dicarboxyphenyl) ) Methane dianhydride, bis (3,4-dicarboxyphenyl) sulfone dianhydride, benzene-1,2,3,4-tetracarboxylic dianhydride, 3,4,3 ′, 4′-benzophenone tetra Carboxylic acid dianhydride Such as.

(2) Diamine 4,4′-diaminodiphenyl ether, 3,4′-diaminodiphenyl ether, 3,3′-diaminodiphenyl ether, metaphenylenediamine, paraphenylenediamine, 4,4′-diaminodiphenylpropane, 3,4′- Diaminodiphenylpropane, 3,3′-diaminodiphenylpropane, 4,4′-diaminodiphenylmethane, 3,4′-diaminodiphenylmethane, 3,3′-diaminodiphenylmethane, benzidine, 4,4′-diaminodiphenyl sulfide, 3, 4'-diaminodiphenyl sulfide, 3,3'-diaminodiphenyl sulfide, 4,4'-diaminodiphenyl sulfone, 3,4'-diaminodiphenyl sulfone, 3,3'-diaminodiphenyl sulfone, 2,6-diaminopyridine, Screw (4 -Aminophenyl) diethylsilane, 3,3'-dichlorobenzidine, bis- (4-aminophenyl) ethylphosphinoxide, bis- (4-aminophenyl) phenylphosphinoxide, bis- (4-amino) Phenyl) -N-phenylamine, bis- (4-aminophenyl) -N-methylamine, 1,5-diaminonaphthalene, 3,3′-dimethyl-4,4′-diaminobiphenyl, 3,4′-dimethyl -3 ′, 4-diaminobiphenyl 3,3′-dimethoxybenzidine, 2,4-bis (p-β-amino-t-butylphenyl) ether, bis (p-β-amino-t-butylphenyl) ether P-bis (2-methyl-4-aminopentyl) benzene, p-bis- (1,1-dimethyl-5-aminopentyl) benzene, m-xylylenediamine P-xylylenediamine, 1,3-diaminoadamantane, 3,3′-diamino-1,1′-diaminoadamantane, 3,3′-diaminomethyl1,1′-diadamantane, bis (p-aminocyclohexyl) ) Methane, hexamethylenediamine, heptamethylenediamine, octamethylenediamine, nonamethylenediamine, decamethylenediamine, 3-methylheptamethylenediamine, 4,4'-dimethylheptamethylenediamine, 2,11-diaminododecane, 1,2 -Bis (3-aminopropoxy) ethane, 2,2-dimethylpropylenediamine, 3-methoxyhexaethylenediamine, 2,5-dimethylhexamethylenediamine, 2,5-dimethylheptamethylenediamine, 5-methylnonamethylenediamine, 1 , 4-Diaminocyclohex 1,12-diaminooctadecane, 2,5-diamino-1,3,4-oxadiazole, 2,2-bis (4-aminophenyl) hexafluoropropane, N- (3-aminophenyl) -4 -Aminobenzamide, 4-aminophenyl-3-aminobenzoate and the like.

  Examples of the solvent used when synthesizing these polyamic acid and polyimide include N, N-dimethylformamide, N, N-dimethylacetamide, N-methyl-2-pyrrolidone, N-methylformamide, and dimethyl sulfoxide. However, it is not limited to these. Moreover, when synthesizing a polyimide, various catalysts represented by tertiary amines, various dehydrating agents represented by organic carboxylic acid anhydrides, and the like may be used as appropriate.

  Although it does not specifically limit about the thickness of the heat-resistant film used by this invention, Preferably it is 5-225 micrometers, More preferably, it is 5-175 micrometers. If it is too thick, the strength of the joint will be insufficient. On the other hand, if it is too thin, wrinkles and the like are likely to enter the joint portion.

  In order to splice such heat-resistant films, heat-resistant tape is used. The heat-resistant tape used in the present invention comprises a base film and an adhesive layer.

  It is important that the base film of the heat-resistant tape has heat resistance equivalent to that of the heat-resistant film. Therefore, it is preferable to use a film having the same or very similar composition as the heat resistant film as the substrate. For example, when joining a polyimide film as a heat-resistant film, it is preferable that the base film is also a polyimide film. By making the heat-resistant film and the base film of heat-resistant tape the same or very similar composition, not only heat resistance but also expansion and contraction due to heat and humidity (thermal expansion coefficient and humidity expansion coefficient) will be similar. In addition, it is possible to prevent wrinkles, distortion, warpage, and the like from occurring at the seamed portion.

  As the pressure-sensitive adhesive layer of the heat-resistant tape, known heat-resistant pressure-sensitive adhesives and adhesives are used, preferably epoxy-based heat-resistant adhesives, epoxy-based heat-resistant adhesives, polyimide-based heat-resistant adhesives, polyimide-based heat-resistant adhesives. Agents, silicone heat resistant adhesives, silicone heat resistant adhesives, acrylic heat resistant adhesives, acrylic heat resistant adhesives, and the like. Among these, epoxy adhesives, epoxy adhesives, silicone adhesives, silicone adhesives, polyimide adhesives, and polyimide adhesives are particularly preferable. Specific components include, but are not limited to, thermosetting polyfunctional epoxy compounds, thermoplastic silicones, thermosetting silicones, thermoplastic polyimides, thermosetting polyimides, and the like. It is optional to add various flame retardants, curing accelerators, curing catalysts, and other additives as the adhesive component. It is important that the adhesive layer has a heat resistance of 200 ° C. or higher as a whole. When the heat resistance of the adhesive layer is 200 ° C. or lower, the heat resistance of a precious heat-resistant film or a heat-resistant tape equipment film is impaired, which is not preferable.

  The total thickness of the heat-resistant tape is preferably 10 to 150 μm. If it is thicker than this, it is not preferable because the influence of the thickness difference in the seam portion appears. Moreover, since the intensity | strength of a joint part will become inadequate when too thin, it is unpreferable. More specifically, the thickness of the base film of the heat-resistant tape is preferably 5 to 125 μm, and the thickness of the adhesive layer portion is preferably 5 to 100 μm. By using a heat-resistant tape having such a thickness, it is possible to form a good seam portion. When the thickness of the adhesive layer portion is too thick, wrinkles may be generated due to expansion and contraction (thermal expansion coefficient and humidity expansion coefficient) due to heat and humidity of the heat-resistant film, the adhesive, and the heat-resistant tape. If the thickness of the adhesive layer portion is too thin, the strength of the joint portion will be insufficient. Therefore, the thickness of the adhesive layer portion is preferably 5 to 100 μm. More preferably, it is 5-50 micrometers.

  Next, although the general procedure of the joining method of the heat-resistant film of this invention is demonstrated, this invention is not limited to this procedure.

  First, after forming a heat-resistant film, foreign matters are detected by inspection. Next, the film in the part where the foreign matter exists is cut off and removed. In removing the foreign matter portion, it is preferable to remove the cut portion in parallel with the width direction of the film in order to improve the shape of the joint portion.

  After removing the foreign matter portion, the films before and after cutting are butted together to form a joint portion, and a heat-resistant tape is applied to the center portion. Alternatively, a method may be adopted in which a heat-resistant tape is first attached to one surface of the joint portion of the heat-resistant film, and then the heat-resistant film is attached to the other surface. The heat-resistant tape may be affixed only to one side of the seam portion, but it is preferable that the heat-resistant tape is affixed to both sides of the seam portion in consideration of the strength of the seam portion.

  In addition, the heat-resistant tape may be attached to only a part of the joint part, but preferably it is preferably attached to the whole joint part from the viewpoint of strength.

  At this time, in order to clarify the position where the seam portion exists, it is optional to attach a marking tape or the like before or after the seam portion or at the end of the seam portion. As a material of the marking tape when the marking tape is applied, it is preferably a heat-resistant tape, and it is also preferable to use a tape having a different color in order to distinguish it from the heat-resistant tape at the joint.

  Hereinafter, specific examples will be described.

[Example 1]
A polyimide film “Apical” NPI (125 μm thick) manufactured by Kaneka Chemical Industry Co., Ltd. was used as the heat resistant film. As heat-resistant tape, use T-100 made by Unon Giken Co., Ltd. (base film is polyimide film “Kapton” V (25 μm thickness) manufactured by Toray DuPont Co., Ltd., adhesive is acrylic-silicone type 25 μm thickness) It was.

  First, the foreign material of the heat-resistant film was detected by inspection, and the film where the foreign material was present was cut off and removed. When removing the foreign matter part, in order to make the shape of the joint part good, it was removed by making a cut substantially parallel to the width direction of the film. After removing the foreign matter portion, a heat-resistant tape was attached to the central portion of the joint portion formed by abutting the films before and after cutting. At this time, as shown in FIG. 1, the heat-resistant tape was affixed on both surfaces of the joint portion.

  A heat-resistant film having heat-resistant tape attached to both surfaces of the joint portion was conveyed into an oven at 500 ° C. At this time, the maximum temperature of the heat-resistant film in the oven was set to 450 ° C., and the time in the oven was set to be 2 minutes.

  As a result, the seam portion did not come off during the conveyance, and the conveyance could be performed satisfactorily. Further, when the joint portion was observed after being conveyed in the oven, no deterioration or the like was observed in the joint portion.

[Example 2]
A polyimide film “Upilex” S (75 μm thick) manufactured by Ube Industries, Ltd. was used as the heat resistant film. As the heat-resistant tape, K-100 manufactured by Teraoka Seisakusho Co., Ltd. (the base film is a polyimide film “Kapton” V (25 μm thickness) manufactured by Toray DuPont Co., Ltd., and the adhesive is a silicone-based adhesive having a thickness of 25 μm) was used.

  First, the foreign material of the heat-resistant film was detected by inspection, and the film where the foreign material was present was cut off and removed. When removing the foreign matter part, in order to make the shape of the joint part good, it was removed by making a cut substantially parallel to the width direction of the film. After removing the foreign matter portion, a heat-resistant tape was attached to the central portion of the joint portion formed by abutting the films before and after cutting. At this time, as shown in FIG. 2, the heat-resistant tape was attached only to one side of the joint portion.

  A heat-resistant film with a heat-resistant tape attached to only one side of the joint was conveyed in an oven at 450 ° C. At this time, the maximum temperature of the heat-resistant film in the oven was set to 400 ° C., and the time in the oven was set to be 2 minutes.

  As a result, the seam portion did not come off during the conveyance, and the conveyance could be performed satisfactorily. Further, when the joint portion was observed after being conveyed in the oven, no deterioration or the like was observed in the joint portion.

[Example 3]
A polyimide film “Kapton” V (25 μm thick) manufactured by Toray DuPont Co., Ltd. was used as the heat resistant film. As heat-resistant tape, use T-100 made by Unon Giken Co., Ltd. (base film is polyimide film “Kapton” V (25 μm thickness) manufactured by Toray DuPont Co., Ltd., adhesive is acrylic-silicone type 25 μm thickness) It was.

  First, the foreign material of the heat-resistant film was detected by inspection, and the film where the foreign material was present was cut off and removed. When removing the foreign matter part, in order to make the shape of the joint part good, it was removed by making a cut substantially parallel to the width direction of the film. After removing the foreign matter portion, a heat-resistant tape was attached to the central portion of the joint portion formed by abutting the films before and after cutting. At this time, as shown in FIG. 3, heat-resistant tape is applied to both sides of the joint portion, and K-100 made by Teraoka Seisakusho Co., Ltd. (base film is Toray DuPont Co., Ltd.) is located next to the heat-resistant tape as a mark tape. The adhesive polyimide film “Kapton” V (25 μm thickness) and the adhesive was a silicone-based 25 μm thickness) were attached.

  A heat resistant tape was affixed to both surfaces of the joint portion, and a heat resistant film having a marker tape affixed was conveyed into an oven at 550 ° C. At this time, the maximum temperature of the heat-resistant film in the oven was set to 500 ° C., and the time in the oven was set to 2 minutes.

  As a result, the seam portion did not come off during the conveyance, and the conveyance could be performed satisfactorily. Further, when the seam portion was observed after being conveyed in the oven, the position of the seam portion could be quickly confirmed with a mark tape, and no deterioration was observed in the seam portion.

[Example 4]
A polyimide film “Kapton” EN (12.5 μm thickness) manufactured by Toray DuPont Co., Ltd. was used as the heat resistant film. As a heat-resistant tape, the base film is a polyimide film “Kapton” EN (12.5 μm thickness) manufactured by Toray DuPont Co., Ltd., coated with a thermoplastic polyimide adhesive (polyimide silicone adhesive (7.5 μm thickness)) What was done was used.

  First, the foreign material of the heat-resistant film was detected by inspection, and the film where the foreign material was present was cut off and removed. When removing the foreign matter part, in order to make the shape of the joint part good, it was removed by making a cut substantially parallel to the width direction of the film. After removing the foreign matter portion, a heat-resistant tape was attached to the central portion of the joint portion formed by abutting the films before and after cutting. At this time, as shown in FIG. 4, heat-resistant tape is applied to both sides of the joint portion, and K-100 (manufactured by Teraoka Seisakusho Co., Ltd.) is used as a mark tape on the upper surface of the end of the heat-resistant tape. ) Adhesive polyimide film “Kapton” V (25 μm thickness), adhesive was silicone and 25 μm thickness).

  A heat resistant tape was affixed to both surfaces of the joint portion, and a heat resistant film having a marker tape affixed was conveyed into an oven at 550 ° C. At this time, the maximum temperature of the heat-resistant film in the oven was set to 500 ° C., and the time in the oven was set to 2 minutes.

  As a result, the seam portion did not come off during the conveyance, and the conveyance could be performed satisfactorily. Further, when the seam portion was observed after being conveyed in the oven, the position of the seam portion could be quickly confirmed with a mark tape, and no deterioration was observed in the seam portion.

[Comparative Example 1]
A polyimide film “Apical” NPI (125 μm thickness) manufactured by Kaneka Chemical Industry Co., Ltd. was used as the heat resistant film. As a tape to be affixed to the seam portion, a polyester film “Lumirror” (25 μm thickness) manufactured by Toray Industries, Inc. was applied with an acrylic adhesive (25 μm thickness).

  A seam portion was formed in the same manner as in Example 1, and was transported in an oven at 500 ° C. as in Example 1. At this time, the maximum reached temperature of the film in the oven was set to 450 ° C., and the time in the oven was set to be 2 minutes.

  As a result, the joint part was detached during the conveyance, and the conveyance was not successful. Further, when the seam portion was observed after being transported in the oven, the tape at the seam portion was not heat resistant, and thus was significantly deteriorated by heat. Furthermore, wrinkles were generated in the heat-resistant film at the joint due to the deterioration of the tape at the joint.

[Comparative Example 2]
A polyimide film “Upilex” S (75 μm thick) manufactured by Ube Industries, Ltd. was used as the heat resistant film. As a tape to be affixed to the seam portion, a polypropylene film “Trephan” (25 μm thickness) manufactured by Toray Industries, Inc. and an acrylic adhesive (25 μm thickness) was applied.

  A seam portion was formed in the same manner as in Example 2 and conveyed in an oven at 450 ° C. as in Example 2. At this time, the maximum temperature reached by the film in the oven was set to 400 ° C., and the time in the oven was set to be 2 minutes.

  As a result, the joint part was detached during the conveyance, and the conveyance was not successful. Further, when the seam portion was observed after being transported in the oven, the tape at the seam portion was not heat resistant, and thus was significantly deteriorated by heat. Furthermore, wrinkles were generated in the heat-resistant film at the joint due to the deterioration of the tape at the joint.

  According to the present invention, the seam portion of the heat-resistant film can be reliably and firmly joined without impairing the heat resistance of the heat-resistant film. A heat-resistant film having sufficient heat resistance can be provided.

  Therefore, the heat-resistant film spliced by the method of the present invention can be widely used for semiconductor and mounted circuit board applications. Further, since the seam portion has heat resistance, it can be processed in a film form even in a high temperature process.

It is sectional drawing (1st Example) which shows the joint part of the heat resistant film joined by the method of this invention. It is sectional drawing (2nd Example) which shows the seam part of the heat resistant film joined by the method of this invention. It is sectional drawing (3rd Example) which shows the joint part of the heat resistant film joined by the method of this invention. It is sectional drawing (4th Example) which shows the seam part of the heat resistant film joined by the method of this invention.

Explanation of symbols

1 Heat-resistant film 2 Heat-resistant tape 3 Seam part 4 Marking tape

Claims (11)

A method for seaming heat-resistant films, characterized in that a heat-resistant tape comprising a base film and an adhesive layer is attached to a seam portion of the heat-resistant film. 2. The method for joining heat resistant films according to claim 1, wherein the heat resistant film is made of a polyimide film. 3. The heat-resistant film splicing method according to claim 1, wherein the base film of the heat-resistant tape is a polyimide film. The method for joining heat resistant films according to any one of claims 1 to 3, wherein the heat resistant tape is attached to both surfaces of a joint portion of the heat resistant film. The thickness of the said heat resistant film is 5-225 micrometers, The joining method of the heat resistant film of any one of Claims 1-4 characterized by the above-mentioned. The total thickness of the said heat resistant tape is 10-150 micrometers, The joining method of the heat resistant film of any one of Claims 1-5 characterized by the above-mentioned. The thickness of the base film of the said heat resistant tape is 5-125 micrometers, and the thickness of an adhesion layer is 5-100 micrometers, The joining method of the heat resistant film of any one of Claims 1-5 characterized by the above-mentioned. . The heat-resistant film is a polyimide film, and the diamine component of the polyimide is at least one selected mainly from diaminodiphenyl ether, phenylenediamine, and diaminodiphenylpropane. Of heat-resistant film. The heat-resistant film is a polyimide film, and the acid component of the polyimide is at least one selected from pyromellitic acid, biphenyltetracarboxylic acid and benzophenonetetracarboxylic acid. 2. A method for joining heat-resistant films according to item 1. The heat resistance of the pressure-sensitive adhesive layer of the heat-resistant tape is 200 ° C or higher, The method for seaming heat-resistant films according to any one of claims 1 to 9. The heat-resistant film joining method according to any one of claims 1 to 10, wherein the heat-resistant film and the base film of the heat-resistant tape are made of the same material.

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