JP2006073936A - Process for producing microstructure and substrate for multichip, substrate for plasma display panel and microconnector - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To produce inexpensive microstructure having high dimensional precision in large quantities. <P>SOLUTION: The process for producing a microstructure having a metal conductor on the electrode formed on the insulating substrate of a circuit board comprises a step for securing an insulating resin die having a through hole formed in accordance with the profile of the metal conductor onto the circuit board through a conductive adhesive layer containing metal powder, a step for forming the metal conductor in the resin die by electrocasting on the conductive adhesive layer, a step for removing the resin die, and a step for removing the conductive adhesive layer directly under the removed resin die. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a method of manufacturing a microstructure having a metal conductor on an electrode in a circuit board formed by forming an electrode on an insulating substrate. The present invention also relates to a multichip substrate, a plasma display panel substrate and a microconnector manufactured by such a method.

  With the development of electronics, information communication devices such as mobile phones and personal computers are becoming more multifunctional, higher performance, and smaller. Accordingly, high definition and narrow pitch are required for the fine structures used in these devices.

  As a method of manufacturing a fine structure, a method using X-ray lithography is known, and in particular, LIGA combined with electroforming using X-rays (hereinafter referred to as “SR”) by synchrotron radiation having strong directivity. The method is useful. The LIGA method enables deep lithography, and can manufacture a large number of metal structures having a thickness of several hundreds of micrometers with high accuracy (see Non-Patent Document 1).

  In the LIGA method, first, as shown in FIG. 4A, a resin layer 42 is formed on a conductive substrate 41, a mask 43 is disposed on the resin layer 42, and exposure is performed with an SR 44 through the mask 43. When developed, a resin mold as shown in FIG. 4B is obtained. Next, electroforming is performed, and a metal material layer 45 is deposited on a resin mold as shown in FIG. Electroforming refers to forming a layer made of a metal material on a conductive substrate using a metal ion solution. After electroforming, when a predetermined thickness is obtained by polishing or grinding, a fine structure as shown in FIG. 4D is obtained. Thereafter, the resin mold is removed, a mold is produced (FIG. 4 (e)), and injection molding, RIM (Reactive Injection Mold), hot embossing, etc. are performed to obtain a resin molded body (FIG. 4 ( f)).

  As a method for manufacturing a fine structure, a method via hot embossing is known (see Non-Patent Document 2). In this manufacturing method, as shown in FIG. 5, first, a sacrificial layer 54 is formed on a circuit board on which an electrode 53 is formed on an insulating substrate 51, and then a resin layer 52 such as polymethyl methacrylate (PMMA) is formed. (FIG. 5A). Next, while aligning, the mold 56 is hot embossed to form a resin mold 52a (FIG. 5B). Subsequently, after removing the resin layer on the electrode 53 and the sacrificial layer 54 by reactive ion etching (RIE) (FIG. 5C), a layer 55 made of a metal material is formed on the resin mold by electroforming (FIG. 5C). FIG. 5 (d)). Next, when the resin mold 52b and the sacrificial layer 54 are removed, a circuit board having a metal material layer 55 such as a conductor circuit on the electrode 53 is obtained as shown in FIG.

Another method for manufacturing a microstructure is shown in FIG. 6 (see Patent Document 1). First, as shown in FIG. 6A, a conductive adhesive layer 63 is formed on a conductive substrate 61. Next, after fixing the insulating resin mold 62 on the conductive adhesive layer 63 (FIG. 6B), a layer 65 made of a metal material is formed on the resin mold 62 on the conductive adhesive layer 63. It forms by electroforming (FIG.6 (c)). Subsequently, after polishing or grinding as necessary (FIG. 6D), the resin mold 62a is removed to obtain a microstructure having a layer 65a made of a metal material as shown in FIG. 6E. It is done.
JP 2003-147570 A A Rogner, et al., “The LIGA technique-what are the new opportunities” Journal of Micromechanics and Microengineering Structures, Devices and Systems (volume 2) number 3 September 1992 p 133-140 A. Both, et al., Proc.IEEE MEMS '95, 186 (1995)

  The LIGA method is an excellent manufacturing method capable of easily forming a fine and high-precision thick film structure and sufficiently responding to the demand for narrow pitch, but a method using expensive X-ray lithography. In addition, since the irradiation takes time, the manufacturing cost is high.

  Further, when the method via hot embossing is used, after the resin mold 52a is formed (FIG. 5B), the resin layer on the electrode 53 and the sacrificial layer 54 is removed by reactive ion etching (RIE). (FIG. 5 (c)) Since the side wall of the resin mold 52a is simultaneously etched by RIE, when the dimensional accuracy of the resin mold 52a is reduced and the pitch is narrowed, adjacent holes are connected.

  On the other hand, a fine structure can be formed by the method disclosed in Patent Document 1, but the obtained fine structure includes a layer 65a made of a metal material, a conductive substrate 61, as shown in FIG. Since the conductive adhesive layer 63 is provided between them, it cannot be used as a connector terminal.

  An object of the present invention is to provide a method capable of mass-producing inexpensive microstructures. Another object of the present invention is to provide a method for manufacturing a fine structure which has high dimensional accuracy and can cope with a narrow pitch and can be used for a multichip substrate, a plasma display panel substrate, a connector terminal, or the like.

The manufacturing method of the present invention is a manufacturing method of a microstructure including a circuit board formed by forming an electrode on an insulating substrate and having a metal conductor on the electrode,
Fixing an insulating resin mold in which a through hole is formed in accordance with the shape of the metal conductor on a circuit board via a conductive adhesive layer containing metal powder;
Forming a metal conductor on a resin mold by electroforming on the conductive adhesive layer;
Removing the resin mold;
And a step of removing the conductive adhesive layer directly under the removed resin mold. The conductive adhesive preferably has an aspect in which the chemical composition is changed by X-rays, electron beams, ultraviolet rays or visible rays.

According to another aspect, the manufacturing method of the present invention is a manufacturing method of a microstructure including a circuit board formed by forming an electrode on an insulating substrate and having a metal conductor on the electrode,
Fixing an insulating resin mold in which a through hole is formed in accordance with the shape of the metal conductor on a circuit board via an anisotropic conductive adhesive layer;
And a step of forming a metal conductor by electroforming on a resin mold on the conductive adhesive layer.

According to another aspect, the manufacturing method of the present invention is a manufacturing method of a microstructure including a circuit board formed by forming an electrode on an insulating substrate and having a metal conductor on the electrode,
A step of fixing an insulating resin mold in which a through-hole is formed in accordance with the shape of a metal conductor on a circuit board through an insulating adhesive layer whose chemical composition is changed by X-rays, electron beams, ultraviolet rays or visible rays. When,
Exposing the insulating adhesive layer through a resin-type through hole with X-rays, electron beams, ultraviolet rays or visible rays;
Removing the insulating adhesive layer whose chemical composition has been changed by exposure and exposing the electrode surface of the circuit board; and
And a step of forming a metal conductor on a resin mold by electroforming on an electrode of a circuit board.

  The multichip substrate, plasma display panel substrate, or microconnector of the present invention is manufactured by such a method.

  According to the present invention, it is possible to manufacture a large number of fine structures with high dimensional accuracy and at low cost.

  The method for producing a microstructure of the present invention includes a step of fixing an insulating resin mold in which a through hole is formed in accordance with the shape of a metal conductor on a circuit board via a conductive adhesive layer containing metal powder. And forming a metal conductor on the resin mold by electroforming on the conductive adhesive layer, removing the resin mold, and removing the conductive adhesive layer immediately below the removed resin mold. It is characterized by that. According to the present invention, it is possible to manufacture a large number of microstructures at a low cost compared to a method using expensive X-ray lithography such as SR. In addition, since the resin mold does not include a step of etching the resin mold for a long time by RIE or the like, the resin mold and the fine structure formed by this resin mold have good dimensional accuracy and stability, and can also reduce the pitch. Can respond.

  By such a method, as shown in FIG. 1 (f), it is possible to obtain a microstructure having a circuit substrate formed by forming the electrode 3 on the insulating substrate 1 and having the metal conductor 5 on the electrode 3. In the obtained fine structure, the metal conductor 5 on the electrode 3 can be used as a conductor circuit, and since each line is electrically insulated, it can be used as a multichip substrate, a plasma display panel substrate, or a microconnector. Useful.

  The production method of the present invention is shown in FIG. First, a conductive adhesive layer 7 is formed on a circuit board in which an electrode 3 is formed on an insulating substrate 1 as shown in FIG. 1A (FIG. 1B). The resin mold 2 is fixed on the circuit board through the layer 7 (FIG. 1C). Unlike the embodiment shown in FIG. 1, it is also possible to form a conductive adhesive layer on a resin mold and fix the resin mold on the circuit board through the conductive adhesive layer. The same applies to other embodiments of the production method of the present invention.

  The insulating resin mold 2 has a hole penetrating in the thickness direction formed in accordance with the shape of the metal conductor 5 to be formed in a later electroforming process. Further, the microstructure manufactured by the method of the present invention has the metal conductor 5 on the electrode 3. Therefore, in consideration of such points, the hole portion of the resin mold 2 is formed. For the resin mold 2, polymethyl methacrylate (PMMA), polyacetal, polycarbonate, epoxy resin or the like is used. The thickness of the resin mold 2 can be arbitrarily set according to the thickness of the metal conductor 5 to be formed, and can be set to 40 μm to 500 μm, for example.

  The conductive adhesive layer 7 contains metal powder as a conductive component, and the average particle size of the metal powder is preferably 1 μm or less. By making the average particle size of the metal powder to be 1 μm or less, sufficiently fine metal powder is uniformly dispersed when the conductive adhesive layer is viewed microscopically based on the size of the microstructure. The conductive adhesive layer having high smoothness can be obtained, and the metal conductor formed on the conductive adhesive layer can be physically, electrically and mechanically uniformized. From this viewpoint, the average particle size of the metal powder is more preferably 400 nm or less.

  Examples of the metal include one metal selected from the group consisting of Ni, Fe, Co, Ag, Au, Pt, Cu, In, Ir, Re, Rh, and Pd, or an alloy of two or more metals. . In addition, the difference between the metal lattice constant of the metal powder and the lattice constant of the metal conductor is 5% or less in terms of smoothing the crystal growth and obtaining a metal conductor having a good crystal structure during the next electroforming. Is preferable, and 3% or less is more preferable.

  The aspect which contains 5 mass%-95 mass% of metal powder in a conductive adhesive layer is preferable. When the content ratio of the metal powder is less than 5% by mass, the conductivity tends to be insufficient. Moreover, when there is more content rate of metal powder than 95 mass%, adhesiveness will fall and the intensity | strength which fixes a resin mold | type will become inadequate.

  For example, the resin mold 2 is formed by a method shown in FIG. 4 that combines X-ray lithography and electroforming, and has a recess by injection molding, reactive molding or emboss molding using the mold. After the resin mold is formed, it can be formed by a method of penetrating the concave portion by polishing or grinding.

  After the resin mold 2 is fixed on the circuit board via the conductive adhesive layer 7, the metal conductor 5 is formed on the resin mold 2 by electroforming on the conductive adhesive layer 7 (FIG. 1 (d)). . As the metal material, at least one selected from the group consisting of Ni, Fe, Co, Ag, Au, Pt, Cu, In, Ir, Re, Rh, and Pd is used as in the above metal powder. Can do. An alloy such as nickel-manganese can also be suitably used.

  After electroforming, if necessary, the surface irregularities are removed by polishing or grinding to obtain a predetermined thickness. Next, the resin mold 2 is removed by wet etching or plasma ashing (FIG. 1 (e)), and the conductive adhesive layer 7a immediately below the removed resin mold 2 is removed, as shown in FIG. 1 (f). A fine microstructure can be obtained.

  The conductive adhesive is preferably one whose chemical composition is changed by X-rays, electron beams, ultraviolet rays or visible rays. The removal of the conductive adhesive layer 7a (FIG. 1E) can be performed by wet etching or the like, but the metal conductor 5 and the electrode 3 are easily damaged by such etching. On the other hand, when a material whose chemical composition is changed by X-rays, electron beams, ultraviolet rays or visible rays is used as the conductive adhesive, X-rays, electron beams, ultraviolet rays or visible rays are removed when removing the conductive adhesive layer 7a. By preliminarily irradiating the conductive adhesive layer 7a with light rays, the conductive adhesive layer can be easily removed and the conditions for the removal can be made mild. Can be suppressed. In addition, the conductive adhesive layer can be reliably removed, and the insulation performance between the lines can be enhanced.

  When such an adhesive contains polymethyl methacrylate or the like, the molecular chain of the adhesive is cut by X-rays or an electron beam to lower the molecular weight, the chemical composition is changed, and the adhesive is easily removed. In general, X-rays cut the molecular chains more strongly than electron beams, and therefore, when the molecular weight of the resin layer to be removed is large, or when the resin layer is thick, an embodiment in which X-rays are irradiated is preferable. . On the other hand, electron beam irradiation is preferable in that the cost is lower than X-ray irradiation. When irradiating an electron beam, in order to effectively reduce the molecular weight, an embodiment in which the absorbed dose is 10 kGy or more is preferable. On the other hand, in order to shorten irradiation time and improve mass productivity, the aspect which makes absorbed dose 500kGy or less is preferable.

  When an adhesive whose chemical composition is changed by ultraviolet light or visible light is used as an adhesive, the functional group is changed by ultraviolet light or visible light, or a chemical change such as decomposition is easily caused and easily removed. For this reason, the removal conditions can be mild, and damage to the metal conductor 5 and the electrode 3 can be reduced. On the other hand, ultraviolet rays (wavelengths of 10 nm to 400 nm) or visible rays are more versatile than X-rays or electron beams, and have low energy. By using such low energy as a light source for exposure, metal is obtained. Damage to conductors can be suppressed.

  Among ultraviolet rays, those having a wavelength of 300 nm or less are preferable in that the exposure efficiency can be easily increased. Ultraviolet rays having a wavelength of 300 nm or less can be obtained by, for example, an XeF lamp or a normal mercury lamp in which a bandpass filter that blocks light having a wavelength longer than 300 nm is inserted.

  Specifically, the adhesive is preferably a phenolic resin or a novolak resin, and among these, those mainly composed of a quinonediazide compound that becomes soluble in an alkaline aqueous solution after exposure are preferable. The thickness of the photosensitive adhesive layer is preferably 1 μm to 70 μm. When it is thinner than 1 μm, it is difficult to obtain sufficient adhesive strength, and when it is thicker than 70 μm, it is difficult to obtain a vertical cross section.

  In another manufacturing method of the microstructure of the present invention, an insulating resin mold in which a through hole is formed in accordance with the shape of a metal conductor is fixed on a circuit board via an anisotropic conductive adhesive layer. And a step of forming a metal conductor in a resin mold by electroforming on the conductive adhesive layer. According to the present invention, as described above, a fine structure can be manufactured in large quantities at low cost. In addition, since the resin mold does not include a step of etching the resin mold for a long time by RIE or the like, the resin mold and the fine structure formed by this resin mold have good dimensional accuracy and stability, and can also reduce the pitch. Can respond.

  By such a method, a microstructure having a circuit board formed by forming an electrode 23 on an insulating substrate 21 as shown in FIG. 2D and having a metal conductor 25 on the electrode 23 can be obtained. In the obtained fine structure, the metal conductor 25 on the electrode 23 can be used as a conductor circuit, and since each line is electrically insulated, it can be used as a multichip substrate, a plasma display panel substrate, or a microconnector. Useful.

  The production method of the present invention is shown in FIG. An anisotropic conductive adhesive layer 27 is formed on a circuit board (FIG. 2A) formed by forming electrodes 23 on the insulating substrate 21 (FIG. 2B), and the conductive adhesive layer is formed. The resin mold 22 is fixed on the circuit board via 27 (FIG. 2C). Next, a metal conductor 25 is formed in a resin mold on the conductive adhesive layer by electroforming (FIG. 2D). The resin mold 22 can be removed as required (FIG. 2 (e)). The anisotropic conductive adhesive layer 27 directly under the resin mold 22 can also be removed, and the insulation between the lines can be similarly improved. The manufacturing process and materials used are the same as those of the invention illustrated in FIG. 1, but in the present invention, an anisotropic conductive adhesive layer is used as the conductive adhesive layer.

  An anisotropic conductive adhesive layer is a layer having the three functions of adhesion, conduction and insulation at the same time, showing conductivity in the thickness direction of the layer and showing insulation in the surface direction of the layer. It has electrical anisotropy. An anisotropic conductive adhesive is composed of conductive particles and a binder, and the conductive particles are nickel nuclei, silver nuclei or gold-plated styrene nuclei, etc., and the binder is a synthetic material such as chloroprene. Rubber, epoxy resin or polyester is used. When the thermocompression bonding is performed for a certain time, the binder spreads, and at least one conductive particle is sandwiched between the electrodes to be connected, thereby showing conductivity in the thickness direction. The conductive particle is moderately contained in the binder. In this case, the insulating layer is insulative in the surface direction of the layer.

  In the present invention, as shown in FIG. 2 (d), an anisotropic conductive adhesive layer 27 is provided, and there is conductivity between the metal conductor 25 and the electrode 23, and the adjacent metal conductor 25. The insulation between the adjacent electrodes 23 is maintained. Therefore, unlike the manufacturing method illustrated in FIG. 1, the process of removing the resin mold and removing the removed conductive adhesive layer immediately below the resin mold becomes unnecessary.

  In another manufacturing method of the microstructure of the present invention, an insulating resin mold in which a through hole is formed in accordance with the shape of a metal conductor is used as an insulating material whose chemical composition is changed by X-rays, electron beams, ultraviolet rays, or visible rays. A step of fixing on a circuit board through an adhesive layer, a step of exposing the insulating adhesive layer through a resin-type through-hole with X-rays, electron beams, ultraviolet rays or visible light, and a chemical composition by exposure. Removing the insulating adhesive layer changed in thickness and exposing the electrode surface of the circuit board; and forming a metal conductor on the resin mold by electroforming on the electrode of the circuit board. .

  In the present invention, after removing the adhesive layer on the electrode surface of the circuit board and exposing the electrode surface of the circuit board, a metal conductor is formed on the electrode of the circuit board by electroforming. Therefore, since the surface on which the metal conductor is formed by electroforming is metal, a very dense metal conductor can be formed, and the bonding force between the electrode of the circuit board and the metal conductor is strong. In addition, as in the manufacturing method described above, it is possible to manufacture a large number of microstructures at low cost, and since the process of etching the resin mold for a long time by RIE or the like is not included, dimensional accuracy stability is good. It is possible to cope with narrow pitch.

  By such a method, a fine structure having a circuit board in which an electrode 33 is formed on an insulating substrate 31 as shown in FIG. 3F and having a metal conductor 35 on the electrode 33 can be obtained. In the obtained fine structure, the metal conductor 35 on the electrode 33 can be used as a conductor circuit, and each line is electrically insulated, so that it can be used as a multichip substrate, a plasma display panel substrate, or a microconnector. Useful.

  The production method of the present invention is shown in FIG. An insulating adhesive layer 37 is formed on a circuit board (FIG. 3A) formed by forming electrodes 33 on the insulating substrate 31 (FIG. 3B), and the insulating adhesive layer 37 is interposed therebetween. The resin mold 32 is fixed on the circuit board (FIG. 3C). The resin mold 32 is an insulating resin mold in which a through hole is formed in accordance with the shape of the metal conductor 35, and is the same as the resin mold used in the above-described manufacturing method.

  The chemical composition of the insulating adhesive layer 37 is changed by X-rays, electron beams, ultraviolet rays, or visible rays. A material whose chemical composition is changed by X-rays, electron beams, ultraviolet rays or visible rays is used for the insulating adhesive layer 37, and when the insulating adhesive layer 37a on the electrode 33 is removed, X-rays, electron beams, ultraviolet rays or By previously irradiating the insulating adhesive layer 37a with visible light, it is possible to facilitate the removal of the insulating adhesive layer 37a and make the conditions for the removal mild. Damage can be effectively suppressed. In the present invention, an insulating adhesive layer whose chemical composition is changed by X-rays, electron beams, ultraviolet rays or visible rays is used. Therefore, the same adhesive can be used except that the conductive adhesive layer whose chemical composition is changed by the X-ray, electron beam, ultraviolet ray or visible ray and the metal powder are not contained.

  Next, as shown in FIG. 3D, the insulating adhesive layer 37a is exposed through the through holes of the resin mold 32 with X-rays, electron beams, ultraviolet rays, or visible rays, and the chemical composition is changed by the exposure. The insulating adhesive layer thus removed is removed, and the surface of the electrode 33 on the circuit board is exposed as shown in FIG. Subsequently, when the metal conductor 35 is formed on the resin mold 32 on the electrode 33 of the circuit board by electroforming, a fine structure as shown in FIG. 3F is obtained. The resin mold 32 can also be removed as required (FIG. 3G).

Example 1
First, as shown in FIG. 1A, a conductive adhesive layer 7 was formed on a circuit board formed by forming a 1 μm thick Cu electrode 3 on a glass insulating substrate 1 (FIG. 1). (B)). The conductive adhesive layer 7 was formed by applying a paste in which Ni powder (15 parts) having an average particle diameter of 200 nm was blended with a binder (85 parts). As the binder, a copolymer of methyl methacrylate and methacrylic acid whose chemical composition is changed by electron beam irradiation is used. The conductive adhesive layer 7 has a thickness after drying on the insulating substrate 1. It formed so that it might become 15 micrometers.

  Next, the resin mold 2 made of polyacetal having a thickness of 100 μm was fixed on the circuit board through the conductive adhesive layer 7 (FIG. 1C). The insulating resin mold 2 has a hole that penetrates in the thickness direction in accordance with the shape of the metal conductor 5 to be formed in a later electroforming process, and this through hole is located on the electrode 3 of the circuit board. Formed to be. The resin mold 2 is formed by a method shown in FIG. 4 combining X-ray lithography and electroforming, and after injection molding with the mold to form a resin mold having a recess, the recess is penetrated by polishing. Manufactured.

  After fixing the resin mold 2 on the circuit board, the metal conductor 5 was formed on the resin mold 2 by electroforming on the conductive adhesive layer 7 (FIG. 1D). The metal material was Ni like the metal powder described above. After electroforming, the surface irregularities were removed by polishing, the thickness was adjusted to 80 μm, and the resin mold 2 was removed by oxygen plasma ashing (FIG. 1E). Next, after irradiating with an electron beam, it is dissolved using ethyl lactate, and when the conductive adhesive layer 7a on the insulating substrate 1 is removed, an electrode is formed on the insulating substrate 1 as shown in FIG. 3 was obtained, and a fine structure having a metal conductor 5 on the electrode 3 was obtained. In the obtained fine structure, the metal conductor 5 on the electrode 3 can be used as a conductor circuit, and since the lines are electrically insulated, the substrate for multichip, the substrate for plasma display panel, or the microconnector It was useful as such.

Example 2
The resin mold is placed on the circuit board through the conductive adhesive layer in the same manner as in Example 1 except that an anisotropic conductive adhesive is used instead of the conductive adhesive layer containing the metal powder. The metal conductor was fixed to the resin mold on the conductive adhesive layer by electroforming. As the anisotropic conductive adhesive, an ACF containing chain Ni prepared by Sumitomo Electric Industries, Ltd., an acrylic resin as a binder, and Ni particles having an average particle diameter of 400 nm are oriented. Using. The resin mold was fixed on the circuit board by temporary bonding with ACF and thermocompression bonding at 140 ° C. and 3.91 MPa for 20 seconds.

  After the electroforming, when the resin mold 22 in FIG. 2D is removed by oxygen plasma ashing, a circuit board formed by forming the electrode 23 on the insulating substrate 21 as shown in FIG. A fine structure having the metal conductor 25 thereon could be obtained. In the obtained fine structure, the metal conductor 25 on the electrode 23 can be used as a conductor circuit, and each line is electrically insulated. Therefore, a multichip substrate, a plasma display panel substrate, or a microconnector It was useful as such.

Example 3
An insulating adhesive layer 37 was formed on the same circuit board substrate as in Example 1 as shown in FIG. 3A (FIG. 3B). The insulating adhesive layer 37 uses a copolymer of methyl methacrylate and methacrylic acid whose chemical composition is changed by electron beam irradiation, and the insulating adhesive layer 37 has a thickness after drying on the glass epoxy substrate. The thickness was 15 μm. Next, the resin mold 2 made of polyacetal similar to the resin mold used in Example 1 was fixed on the circuit board through the insulating adhesive layer 7 (FIG. 3C).

  Subsequently, after irradiating an electron beam and exposing the insulating adhesive layer 37a through the through hole of the resin mold 32 (FIG. 3D), the insulating adhesive layer 37a is dissolved by using ethyl lactate to insulate the electrode 33. When the adhesive layer 37a was removed, the surface of the electrode 33 was exposed as shown in FIG. Next, a metal conductor 35 was formed on the resin mold 32 on the electrode 33 by electroforming (FIG. 3F). The metal material was Ni.

  After electroforming, the surface irregularities are removed by polishing, the thickness is adjusted to 80 μm, and the resin mold 32 is removed by oxygen plasma ashing to form an electrode 33 on the insulating substrate 31 as shown in FIG. As a result, a fine structure having a metal conductor 35 on the electrode 33 was obtained. In the obtained fine structure, the metal conductor 35 on the electrode 33 can be used as a conductor circuit, and each line is electrically insulated. Therefore, the substrate for multichip, the substrate for plasma display panel, or the microconnector It was useful as such.

  It should be understood that the embodiments and examples disclosed herein are illustrative and non-restrictive in every respect. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

  A fine structure that has high dimensional accuracy and can cope with a narrow pitch can be provided.

It is process drawing which shows the manufacturing method of the microstructure in Example 1 of this invention. It is process drawing which shows the manufacturing method of the microstructure in Example 2 of this invention. It is process drawing which shows the manufacturing method of the microstructure in Example 3 of this invention. It is process drawing which shows the manufacturing method of the fine metal mold | die and resin mold by the conventional LIGA method. It is process drawing which shows the manufacturing method of the fine structure by the method of passing through the conventional hot embossing. It is process drawing which shows the manufacturing method of the microstructure by the conventional electroforming.

Explanation of symbols

  1, 21, 31 Insulating substrate, 2, 22, 32 Resin mold, 3, 23, 33 Electrode, 5, 25, 35 Metal conductor, 7, 27, 37 Adhesive layer.

Claims (7)

A method for producing a microstructure having a circuit board formed by forming an electrode on an insulating substrate and having a metal conductor on the electrode,
Fixing an insulating resin mold in which a through hole is formed in accordance with the shape of the metal conductor on a circuit board through a conductive adhesive layer containing metal powder;
Forming a metal conductor on the resin mold by electroforming on the conductive adhesive layer;
Removing the resin mold;
And a step of removing the conductive adhesive layer directly under the removed resin mold.   2. The method for producing a microstructure according to claim 1, wherein a chemical composition of the conductive adhesive is changed by X-rays, electron beams, ultraviolet rays, or visible rays. A method for producing a microstructure having a circuit board formed by forming an electrode on an insulating substrate and having a metal conductor on the electrode,
Fixing an insulating resin mold in which a through-hole is formed in accordance with the shape of the metal conductor on a circuit board via an anisotropic conductive adhesive layer;
And a step of forming a metal conductor on the resin mold by electroforming on the conductive adhesive layer. A method for producing a microstructure having a circuit board formed by forming an electrode on an insulating substrate and having a metal conductor on the electrode,
An insulating resin mold in which a through-hole is formed in accordance with the shape of the metal conductor is fixed on a circuit board via an insulating adhesive layer whose chemical composition is changed by X-rays, electron beams, ultraviolet rays or visible rays. Process,
Exposing the insulating adhesive layer through a resin-type through hole with X-rays, electron beams, ultraviolet rays or visible rays;
Removing the insulating adhesive layer whose chemical composition has been changed by exposure and exposing the electrode surface of the circuit board; and
And a step of forming a metal conductor on the resin mold by electroforming on an electrode of a circuit board.   A multichip substrate manufactured by the method according to claim 1.   The substrate for plasma display panels manufactured by the method in any one of Claims 1-4.   The microconnector manufactured by the method in any one of Claims 1-4.

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