JP2006066979A - Passive component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a passive component that can be downsized and low-profiled while ensuring the electric characteristic. <P>SOLUTION: In the passive component wherein a filter unit 30 including first and second resonance electrodes 38a, 38b, an unbalance-balance state conversion unit 32, and a connection unit 34 for electrically connecting the filter unit 30 to the unbalance-balance state conversion unit 32 are formed in a dielectric board 12 on which earth electrodes 26a, 26b are formed, an inner layer earth electrode 44 aimed at forming a static capacitance between the first and second resonance electrodes 38a, 38b and an open end and at isolation between the filter unit 30 and the unbalance-balance state conversion unit 32 is formed in the dielectric board 12, and the unbalance-balance state conversion unit 32 is formed beneath the inner layer earth electrode 44. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a passive component including a laminated dielectric filter that constitutes a resonance circuit in a microwave band of several hundred MHz to several GHz, and relates to a passive component that can be reduced in size and height.

  In recent years, integrated circuits (ICs) have been highly integrated, and miniaturization of ICs has been progressing rapidly. Along with this, miniaturization of passive components such as a filter used around the IC is progressing. In order to reduce the size of the passive component, a laminated dielectric passive component using a dielectric substrate is effective.

  As shown in FIG. 19, a conventional passive component 400 includes two quarter-wave resonators in a dielectric substrate 402 in which a plurality of dielectric layers (dielectric layers S1 to S11) are stacked and baked and integrated. A filter unit 408 having first and second input side resonance electrodes 404a and 404b and first and second output side resonance electrodes 406a and 406b, and first to third strip lines 410, 412 and 414. And a connection unit 418 for connecting the filter unit 408 and the conversion unit 416 (refer to Patent Document 1). . In this conventional example, the filter unit 408 constituting the resonance circuit and the conversion unit 416 constituting the balun are integrally configured in the dielectric substrate 402 via the connection part 418 and the inner layer ground electrode 420.

  The connection portion 418 includes a capacitor electrode 422 formed on the main surface of the fifth dielectric layer S5 and a connection electrode 424 formed on the main surface of the sixth dielectric layer S6. The capacitive electrode 422 is opposed to the substantially central portion of the second output-side resonance electrode 406b with the fourth dielectric layer S4 interposed therebetween, and forms a capacitance between the second output-side resonance electrode 406b. The connection electrode 424 is formed to extend from a position corresponding to the capacitor electrode 422 to a position corresponding to one end of the first strip line 410 in the conversion unit 416. In addition to the capacitor electrode 422 and the connection electrode 424, the connection portion 418 includes a via hole 426 that electrically connects one end of the connection electrode 424 and the capacitor electrode 422, the other end of the connection electrode 424, and the first strip line 410. A via hole 428 that electrically connects one end of each.

JP 2003-87008 A

  In the conventional passive component 400 described above, the plurality of dielectric layers S1 to S11 constituting the dielectric substrate 402 are formed as, for example, tape-shaped dielectric thin films, whereby the electrical characteristics (insertion loss, While ensuring the Q value, etc., it is trying to make it smaller and thinner.

  However, in the conventional passive component 400, a wide inner layer ground electrode 420 is formed between the filter unit 408 and the conversion unit 416 for the purpose of isolation between the filter unit 408 and the conversion unit 416. Therefore, if the conventional passive component 400 is to be further reduced in size and height, the distance (resonance electrodes 404b and 406b) between the portion on the short-circuit end side of the resonance electrodes 404b and 406b and the inner layer ground electrode 420 (GND: ground). The distance in the direction orthogonal to the electrode surface of the electrode) becomes extremely short, so that there is a concern that the conductor loss and the insertion loss increase and eventually the Q value decreases.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a passive component having a filter part and a conversion part, which can realize further miniaturization and height reduction while ensuring electrical characteristics.

  The passive component according to the present invention includes a purpose of forming a capacitance between the filter unit and the non-equilibrium-balance conversion unit between the open end of the resonant electrode, the filter unit, and the non-balance-balance conversion unit. An inner layer ground electrode is formed for the purpose of ensuring isolation between them, and a non-equilibrium-balance conversion section is formed immediately below the inner layer ground electrode.

  In addition, the passive component according to the present invention includes a first inner-layer ground electrode for the purpose of forming a capacitance with the open end of the resonance electrode between the filter unit and the non-equilibrium-balance conversion unit, and the filter unit. And a non-equilibrium-to-equilibrium conversion unit are formed, and a second inner layer ground electrode is formed for the purpose of isolation, and the non-equilibrium is disposed directly below the first inner layer ground electrode with the second inner layer ground electrode interposed therebetween. -An equilibrium converter is formed.

  This eliminates the need to form a wide inner-layer ground electrode between the filter unit and the unbalanced-balanced conversion unit for the purpose of isolation between the filter unit and the unbalanced-balanced conversion unit. It may be of a size that can form a capacitance with the open end of the electrode. That is, there is no inner layer ground electrode for the purpose of isolation between the filter unit and the non-equilibrium-balance conversion unit immediately below the portion on the short-circuit end side of the resonance electrode.

  Therefore, in the passive component according to the present invention, even if a further miniaturization / low profile design is performed, the portion on the short-circuit end side of the resonance electrode and the inner layer ground electrode do not come close to each other. It is possible to suppress the increase in the conductor loss and the insertion loss and the decrease in the Q value due to the increase in the frequency.

  As described above, the passive component according to the present invention can realize a reduction in size and a height while securing desired electrical characteristics (insertion loss, Q value, etc.).

  In the above-described invention, the unbalanced-balanced conversion unit has one unbalanced transmission line and two balanced transmission lines, and one end of the unbalanced transmission line is connected via the connection unit. One end of each of the two balanced transmission lines electrically connected to the filter unit may be connected to a balanced input / output terminal, and each other end may be connected to a common electrode. In this case, only the dielectric may exist between the short-circuit end side portion of the resonance electrode and the common electrode. The common electrode may be a DC terminal to which a DC voltage is supplied.

  The connecting portion is opposed to the resonant electrode with a dielectric interposed therebetween, and forms a capacitance between the resonant electrode and a position corresponding to the capacitive electrode in the non-equilibrium-balance converting unit. A connection electrode formed to extend to a position corresponding to one end of the unbalanced transmission line, a via hole that electrically connects the capacitor electrode and the connection electrode, and one end of the unbalanced transmission line and the connection You may make it have a via hole which electrically connects with an electrode.

  Alternatively, the connecting portion is opposed to the resonant electrode with a dielectric interposed therebetween, and forms a capacitance between the resonant electrode and the unbalanced transmission line located immediately below the capacitive electrode. You may make it have a via hole which electrically connects one end.

  Depending on the configuration of these connecting portions, the non-equilibrium-balance conversion portion is formed immediately below the inner layer ground electrode, or the second inner layer ground electrode is sandwiched between the first inner layer ground electrode and the first inner layer ground electrode. It is possible to form the non-equilibrium-balance conversion section. Note that one or more terminals electrically connected to a plurality of electrodes formed in the dielectric substrate may be led out only to the lower surface or the side surface of the dielectric substrate. This facilitates mounting of passive components on the circuit board.

  As described above, according to the passive component according to the present invention, the passive component having the filter unit and the conversion unit can achieve further miniaturization and low height while ensuring electrical characteristics.

  Hereinafter, several embodiments of the passive component according to the present invention will be described with reference to FIGS.

  First, as shown in FIG. 1, the passive component 10A according to the first embodiment is a dielectric substrate in which a plurality of dielectric layers (dielectric layers S1 to S8: see FIG. 2) are stacked and integrated by firing. Twelve. Of the six outer peripheral surfaces of the dielectric substrate 12 (the first to fourth side surfaces 14a to 14d, the upper surface 14e, and the bottom surface 14f constituting the dielectric substrate 12), the first side surface 14a has an unbalanced input / output terminal. 16, a first balanced input / output terminal 18 a, and one NC terminal (terminal not connected to an electrode in the dielectric substrate 12) 20 are formed.

  A second balanced input / output terminal 18b and two NC terminals (terminals not connected to the electrodes in the dielectric substrate) 22 and 24 are formed on the second side face 14b opposite to the first side face 14a. ing.

  Ground electrodes 26a to 26d are respectively formed on the top surface 14e, the bottom surface 14f, the third side surface 14c, and the fourth side surface 14d of the dielectric substrate 12, and in particular, the ground electrodes 26a and 26b formed on the top surface 14e and the bottom surface 14f. In this case, a region for insulation from each terminal (a portion where no electrode is formed) is secured.

  In the dielectric substrate 12, as shown in FIG. 2, a filter unit 30, a non-equilibrium-balance conversion unit (hereinafter referred to as a conversion unit 32 for convenience) formed near the third side surface 14c, A connection part 34 for electrically connecting the filter part 30 and the conversion part 32 is formed.

  The dielectric substrate 12 is configured by stacking first to eighth dielectric layers S1 to S8 in order from the top. These first to eighth dielectric layers S1 to S8 are composed of one or more layers.

  The filter unit 30 and the conversion unit 32 are respectively formed on the dielectric substrate 12 in regions separated vertically in the stacking direction of the first to eighth dielectric layers S1 to S8. For example, the filter unit 30 is formed in the upper part of the stacking directions of the first to eighth dielectric layers S1 to S8, and the conversion unit 32 is formed in the lower part of the stacking direction. A connecting portion 34 is formed on the top.

  The filter unit 30 includes two quarter-wave resonators (first and second resonators 36a and 36b). The first resonator 36a is composed of a first resonance electrode 38a formed on the main surface of the third dielectric layer S3, and the second resonator 36b is also formed of the third dielectric layer S3. The second resonance electrode 38b is formed on the main surface. The short-circuit ends of the first and second resonance electrodes 38a and 38b are connected to a ground electrode 26d (see FIG. 3) formed on the fourth side surface 14d.

  The main surface of the second dielectric layer S2 has an inner layer ground electrode 40 facing the open ends of the first and second resonance electrodes 38a and 38b, the first resonator 36a, and the second resonance. A coupling adjusting electrode 42 for adjusting the degree of coupling between the devices 36b is formed. On the main surface of the fourth dielectric layer S4, an inner layer ground electrode 44 facing each open end of the first and second resonance electrodes 38a and 38b is formed.

  On the other hand, the conversion unit 32 includes a first stripline (unbalanced transmission line) 46 formed on the main surface of the sixth dielectric layer S6 and a first surface formed on the main surface of the seventh dielectric layer S7. 2 and a third strip line (a pair of balanced transmission lines) 48 and 50.

  The first strip line 46 has one end 52 and the other end 54 adjacent to each other, is formed in a substantially spiral shape or a meandering shape from the one end 52 toward the other end 54, and has a substantially bilaterally symmetric shape.

  The second stripline 48 has a shape formed in a spiral shape or a meandering shape from one end 56 toward the first balanced input / output terminal 18a, and the third stripline 50 is formed from the one end 58 to the second It has a shape formed in a spiral shape or a meandering shape toward the balanced input / output terminal 18b. These second and third strip lines 48 and 50 are arranged symmetrically.

  One end 56 of the second stripline 48 and one end 58 of the third stripline 50 are both connected to the ground electrode 26b on the bottom surface via via holes 60 and 62 penetrating the seventh and eighth dielectric layers S7 and S8. Electrically connected.

  On the other hand, the connection portion 34 includes a capacitor electrode 64 formed on the main surface of the fourth dielectric layer S5 and a connection electrode 66 formed on the main surface of the fifth dielectric layer S6. The capacitance electrode 64 is opposed to the substantially central portion of the second resonance electrode 38b with the third dielectric layer S3 interposed therebetween, and forms a capacitance between the second resonance electrode 38b. The connection electrode 66 is formed to extend from a position corresponding to the capacitor electrode 64 to a position corresponding to one end 52 of the first strip line 46 in the conversion unit 32.

  In addition to the capacitor electrode 64 and the connection electrode 66, the connection part 34 includes a via hole 68 that electrically connects one end of the connection electrode 66 and the capacitor electrode 64, the other end of the connection electrode 66, and one end of the first strip line 46. And a via hole 70 for electrically connecting to 52.

  For this reason, the inner layer ground electrode 44 formed between the filter unit 30 and the conversion unit 32 forms a capacitance between the open ends of the first and second resonance electrodes 38a and 38b. It functions as an inner layer ground electrode formed for the purpose and for the purpose of ensuring isolation between the filter unit 30 and the conversion unit 32.

  Here, the passive component 300 according to the comparative example and the passive component 10A according to the first embodiment described above will be compared and described.

  In the passive component 300 according to the comparative example, as illustrated in FIG. 4, the conversion unit 32 is formed immediately below the center portion of the resonance electrode 38 b. Therefore, the purpose is to isolate the filter unit 30 and the conversion unit 32 separately from the inner layer ground electrode 44 for forming capacitance between the open ends of the first and second resonance electrodes 38a and 38b. The inner layer ground electrode 102 is formed, and further, the inner layer ground electrode 102 is formed widely.

  Therefore, in the passive component 300 according to the comparative example, when further downsizing / reducing the height is performed, the first and second resonance electrodes 38a and 38b and the inner layer ground electrode 102 (GND: ground) (Distance in the direction orthogonal to the electrode surfaces of the resonance electrodes 38a and 38b) dg1 becomes extremely short, so that there is a concern that the conductor loss and the insertion loss increase, and the Q value eventually decreases.

  However, in the passive component 10A according to the first embodiment, the dielectric substrate 12 has a capacitance formed with the open ends of the first and second resonance electrodes 38a and 38b, and the filter unit 30 and the conversion unit. The conversion portion 32 is formed immediately below the inner layer ground electrode 44 for the purpose of isolation from the inner layer 32.

  Therefore, it is not necessary to form a wide inner layer ground electrode between the filter unit 30 and the conversion unit 32 for the purpose of isolation between the filter unit 30 and the conversion unit 32, and the inner layer ground electrode 44 has the first and second layers. Any size may be used as long as capacitance is formed between the open ends of the resonance electrodes 38a and 38b. That is, the inner layer ground electrode for the purpose of isolation between the filter unit 30 and the conversion unit 32 does not exist immediately below the portion on the short-circuit end side of the first and second resonance electrodes 38a and 38b. As a result, the distance between the short-circuit end side portions of the first and second resonance electrodes 38a and 38b and the GND (distance in the direction orthogonal to the electrode surfaces of the resonance electrodes 38a and 38b) dg2 is determined by the resonance electrodes 38a and 38b. The distance between the short-circuit end side portion and the ground electrode 26b on the bottom surface is larger than the distance dg1 in the passive component 300 according to the comparative example (dg2> dg1).

  Therefore, in the first embodiment, even if a further miniaturization / low profile design is performed, the portion on the short-circuited end side of the resonance electrodes 38a and 38b and the inner layer ground electrode are not close to each other. Thus, it is possible to suppress the increase in the conductor loss and the insertion loss and the decrease in the Q value due to the low profile.

  As described above, in the first embodiment, it is possible to realize a reduction in size and height while ensuring desired electrical characteristics (insertion loss, Q value, etc.).

  In the first embodiment, since the capacitor part 64, the connection electrode 66, and the via holes 68 and 70 are provided as the connection part 34, the conversion part 32 is formed immediately below the inner layer ground electrode 44. The above-described effects can be obtained with certainty.

  Next, a passive component 10B according to a second embodiment will be described with reference to FIGS.

  As shown in FIGS. 5 and 6, the passive component 10B according to the second embodiment has substantially the same configuration as the passive component 10A according to the first embodiment described above. A first inner-layer ground electrode 72 for the purpose of forming a capacitance between the open ends of the resonance electrodes 38a and 38b between the conversion parts 32, and a first purpose for the isolation between the filter part 30 and the conversion part 32. 2 in that the inner ground electrode 74 is formed and the connection electrode 66 does not exist in the connection portion 34.

  That is, the first inner layer ground electrode 72 is formed at a position facing the open ends of the first and second resonance electrodes 38a and 38b on the main surface of the fourth dielectric layer S4. The inner layer ground electrode 74 is formed at a position facing the first inner layer ground electrode 72 on the main surface of the fifth dielectric layer S5.

  The connecting portion 34 includes a capacitive electrode 64 formed at a position facing the second resonant electrode 38b on the main surface of the fourth dielectric layer S4, and the first electrode in the capacitive electrode 64 and the conversion portion 32. And a via hole 76 electrically connecting one end 52 of the strip line 46.

  Specifically, a notch 78 is formed in a portion of the first inner layer ground electrode 72 facing the second resonance electrode 38 b, and a part of the capacitor electrode 64 is formed in the notch 78. ing. Note that the position of the depth end of the notch 78 is located closer to the short-circuit end than the position corresponding to the open end of the second resonance electrode 38b. Therefore, even if the notch 78 is formed in the first inner layer ground electrode 72, a capacitance for improving characteristics is formed between the open end of the second resonance electrode 38b. Further, the second inner layer ground electrode 74 is formed with a region (a region where no electrode is formed) for ensuring electrical insulation with the via hole 76.

  Even in the passive component 10B according to the second embodiment, similarly to the passive component 10A according to the first embodiment described above, the resonance electrodes 38a and 38b can be formed even if a further downsizing / reducing design is performed. Therefore, the increase in the conductor loss and the insertion loss and the decrease in the Q value due to the downsizing and the low profile can be suppressed.

  In particular, as the connecting portion 34, a capacitive electrode 64 that faces the second resonant electrode 38b with the third dielectric layer S3 interposed therebetween and forms a capacitance with the second resonant electrode 38b, and Unlike the case of the passive component 10A according to the first embodiment, the via hole 76 that electrically connects the one end 52 of the first strip line 46 located immediately below the capacitor electrode 64 is provided. The connection electrode 66 can be omitted, and the overall thickness increases even if the first inner layer ground electrode 72 and the second inner layer ground electrode 74 are stacked with the dielectric layer interposed therebetween. This is advantageous in reducing the height as in the first embodiment.

  Of course, the configuration of the connecting portion 34 in the passive component 10B according to the second embodiment may be adopted in the passive component 10A according to the first embodiment, or the passive component according to the first embodiment. You may make it employ | adopt the structure of the connection part 34 in 10 A of components in the passive component 10B which concerns on 2nd Embodiment.

  Next, two examples of the passive component 10B according to the second embodiment will be described with reference to FIGS.

  First, as shown in FIG. 7, the passive component 200 </ b> A according to the first embodiment includes a dielectric substrate 12 in which a plurality of dielectric layers (S <b> 1 to S <b> 12: see FIG. 8) are stacked and baked and integrated. Of the outer peripheral surface of the dielectric substrate 12, only the bottom surface 14f has six terminals (unbalanced input / output terminal 16, first balanced input / output terminal 18a, second balanced input / output terminal 18b, DC input terminal 80, ground). The terminals 82 and 84) are exposed, and only the dielectric is formed on the four side surfaces 14a to 14d and the upper surface 14e.

  In the dielectric substrate 12, as shown in FIG. 8, the filter unit 30 having three resonators (first to third resonance electrodes 38a to 38c) and a third portion formed closer to the third side surface 14c. A conversion unit 32 having first to third strip lines 46, 48, and 50 and a connection unit 34 for connecting the filter unit 30 and the conversion unit 32 are formed.

  The dielectric substrate 12 is configured by stacking a first dielectric layer S1 to a twelfth dielectric layer S12 in order from the top. These first to twelfth dielectric layers S1 to S12 are composed of one or a plurality of layers.

  The filter unit 30 and the conversion unit 32 are respectively formed on the dielectric substrate 12 in regions separated vertically in the stacking direction of the dielectric layers S1 to S12. For example, the filter part 30 is formed in the upper part in the stacking direction of the dielectric layers S1 to S12, the conversion part 32 is formed in the lower part in the stacking direction, and the connection part 34 is formed therebetween. Has been.

  Wide inner ground electrodes 86, 88 and 90 are formed on the main surface of the second dielectric layer S2, the main surface of the ninth dielectric layer S9 and the main surface of the eleventh dielectric layer, respectively.

  Further, a wide DC electrode 92 is formed on the main surface of the tenth dielectric layer S10, and the DC electrode 92 is electrically connected to the DC input terminal 80 through a via hole 94. In this case, the inner layer ground electrode 88 electrically separates the first to third strip lines 46, 48, 50 and the DC electrode 92 in the converter 32, and the inner layer ground electrode 90 has five terminals 16, 18a. , 18b, 80, 82, 84 and the DC electrode 92 are electrically separated.

  On one main surface of the fourth dielectric layer S4, first to third resonance electrodes 38a to 38c constituting first to third resonators of a quarter wavelength are respectively provided to the first and second resonators. It is formed in parallel to the side surfaces 14a and 14b.

  The first to third resonance electrodes 38a to 38c are located near the fourth side surface 14d, and are connected to the third and fourth side surfaces 14c and 14d via a short-circuit electrode 96. Each is electrically connected. The short-circuit electrode 96 is electrically connected to the inner layer ground electrodes 86, 88 and 90 and the ground terminals 82 and 84 through the two via holes 98 and 100.

  Thereby, among the resonance electrodes 38a to 38b, the end portion on the fourth side surface 14d side constitutes the short-circuit end portions 96a to 96c, respectively, and the end portion on the third side surface 14c side forms the open end portions 102a to 102c. Configure each.

  In addition, an inner layer ground electrode 40 is formed at a position near the third side surface 14c in the main surface of the third dielectric layer S3, and the third surface of the main surface of the fifth dielectric layer S5 is the third surface. An inner layer ground electrode 72 is formed at a position near the side surface 14c. These inner layer ground electrodes 40 and 72 are formed so as to overlap each other so as to sandwich the open ends 102a to 102c of the first to third resonance electrodes 38a to 38c. Therefore, electrostatic capacitance is formed between each open end of the first to third resonance electrodes and the inner layer ground electrode 40 and between each open end and the inner layer ground electrode 72.

  Further, an inner layer ground electrode 74 for the purpose of isolation between the filter unit 30 and the conversion unit 32 is formed at a position near the third side surface 14c in one main surface of the sixth dielectric layer S6. Yes.

  As shown in FIGS. 8 and 9, the inner layer ground electrodes 40, 72, and 74 are electrically connected to each other through two via holes 104 and 106 that are formed near the third side surface 14c.

  Further, the inner layer ground electrodes 74, 88, 90 are electrically connected through two via holes 108 and 110 formed closer to the center portion of the dielectric substrate 12 than the via holes 104 and 106, respectively. .

  Further, the inner layer ground electrode 90 is connected to the ground terminals 82 and 84 through the via holes 112 and 114, respectively.

  Further, the lead electrode 116 is formed on the main surface of the fourth dielectric layer S4 so as to be drawn from the central portion of the first resonance electrode 38a. Of the lead electrode 116, the terminal end portion 118 formed at the corner portion of the first side surface 14 a and the fourth side surface 14 d is an unbalanced input / output formed in the twelfth dielectric layer S 12 via the via hole 120. The terminal 16 is electrically connected.

  On the main surface of the third dielectric layer S3, in addition to the inner-layer ground electrode 40 described above, a second resonator (second resonance electrode 38b) and a third resonance are formed in the central portion of the main surface. A coupling adjusting electrode 122 for adjusting the degree of coupling between the electrodes (third resonance electrode 38c) is formed.

  In addition to the inner ground electrode 72 described above, the main surface of the fifth dielectric layer S5 includes the first resonator (first resonance electrode 38a) and the second resonator at the central portion of the main surface. A coupling adjusting electrode 124 for adjusting the degree of coupling between the resonators (second resonant electrode 38b) is formed.

  On the other hand, a first strip line 46 constituting the conversion unit 32 is formed at a position near the third side surface 14c in one main surface of the seventh dielectric layer S7. The first strip line 46 is developed in a spiral shape from one end 52, and is further bisected at a line symmetrical position with the one end 52 (the line segment connecting the first and second balanced input / output terminals 18a and 18b). The shape is such that it converges in a spiral toward the other end 54 disposed at a line-symmetrical position with respect to m.

  On one main surface of the eighth dielectric layer S8, second and third strip lines 48 and 50 constituting the conversion unit 32 are formed. The second stripline 48 is located at a position facing the first balanced input / output terminal 18a in the eighth dielectric layer S8 from the one end 56 corresponding to the one end 52 of the first stripline 46 described above. The third strip line 50 has a shape developed in a spiral shape toward the other end 54 of the first strip line 46 from the one end 58 corresponding to the other end 54 of the first dielectric layer S8. , And has a shape developed in a spiral shape toward a position facing the second balanced input / output terminal 18b.

  The second and third strip lines 48 and 50 are spirally symmetric with respect to each other (line symmetric with respect to the bisector m), and have the same physical length.

  On the other hand, the connection portion 34 includes a capacitor electrode 64 formed at a position facing the third resonance electrode 38c in the main surface of the fifth dielectric layer S5, and the first electrode in the capacitor electrode 64 and the conversion portion 32. A via hole 76 for electrically connecting the strip line 46.

  Specifically, a notch 78 is formed in a portion of the inner layer ground electrode 72 facing the third resonance electrode 38 c, and a part of the capacitor electrode 64 is formed in the notch 78. Therefore, the third resonance electrode 38c and the capacitive electrode 64 are capacitively coupled with the fourth dielectric layer S4 interposed therebetween. The position of the depth end of the notch 78 is located closer to the short-circuit end portion 96c than the position corresponding to the open end of the third resonance electrode 38c. Therefore, even if the notch 78 is formed in the inner ground electrode 72, a capacitance for improving the characteristics is formed between the open end of the third resonance electrode 38c.

  The inner layer ground electrode 74 formed on the main surface of the sixth dielectric layer S6 is formed with a region (region where no electrode is formed) for ensuring electrical insulation with the via hole 76. Yes.

  In the first strip line 46, the capacitor electrode 64 described above is electrically connected through the via hole 76 at one end 52 or a position near the one end 52 (connection position 126).

  In addition, the second strip line 48 and the first balanced input / output terminal 18a are connected via the via hole 132 at the other end 128 of the second strip line 48 or in the vicinity of the other end 128 (connection position 130). The third strip line 50 is connected to the third strip line 50 via the via hole 138 at the other end 134 of the third strip line 50 or in the vicinity of the other end 134 (connection position 136). The terminal 18b is electrically connected.

  Further, two electrically insulated regions are respectively formed in the inner layer ground electrode 88 formed on the main surface of the ninth dielectric layer S9 in the portion near the third side surface 14c. Then, one end 56 of the second strip line 48 or a position in the vicinity of the one end 56 (connection position 140) and the DC electrode 92 pass through a region near the second side surface 14b in the two insulated regions. Are electrically connected through via holes 142. Further, one end 58 of the third strip line 50 or a position in the vicinity of the one end 58 (connection position 144) and the DC electrode 92 pass through a region near the first side surface 14a in the two insulated regions. Are electrically connected through via holes 146.

  As a result, as shown in FIG. 10, the DC power source is connected to the second and third strip lines 48 and 50 via the DC input terminal 80. Further, the DC electrode 92 has a capacitance C formed between the inner layer ground electrodes 88 and 90 (GND).

  Here, one experimental example is shown in FIG. In this experimental example, the first to third resonance electrodes 38a for the passive component 200A according to the first embodiment (see FIGS. 7 to 9) and the passive component 300A according to the comparative example 1 (see FIGS. 12 and 13). ˜38c and the insertion loss α with respect to the distance d (see FIGS. 9 and 13) between the resonance electrodes 38a to 38c and the inner layer ground electrode. In this case, the thickness W (see FIGS. 9 and 13) of the passive components 200A and 300A is the same.

  The passive component 300A according to the comparative example 1 has substantially the same configuration as the passive component 200A according to the first embodiment. However, as illustrated in FIGS. 12 and 13, the passive component 300A according to the first comparative example has a central portion of the third resonance electrode 38c. The conversion unit 32 is formed immediately below. Therefore, the purpose is to isolate the filter unit 30 and the conversion unit 32 separately from the inner layer ground electrode 72 for forming capacitance between the open ends of the first and second resonance electrodes 38a and 38b. The inner layer ground electrode 102 is formed, and further, the inner layer ground electrode 102 is formed widely. In addition, about the same component as 200 A of passive components which concern on Example 1, the same referential mark is attached | subjected and demonstrated.

  In this case, the definition of the interval d shown in FIG. 11 is as follows. The distance d in the first embodiment is defined by the distance between the first to third resonance electrodes 38a to 38c and the inner layer ground electrode 88 in the passive component 200A according to the first embodiment shown in FIG. On the other hand, the distance d in Comparative Example 1 is defined by the distance between the first to third resonance electrodes 38a to 38c of the passive component 300A and the inner layer ground electrode 102 in FIG.

  The distance d can be changed by adjusting the individual thicknesses of the first to twelfth dielectric layers S1 to S12 (see FIGS. 8 and 12) constituting the dielectric substrate 12. In addition, the filter part 30 of the above-described passive components 200A and 300A is a filter having a center frequency of 2.5 GHz.

  In FIG. 11, when the interval d is decreased, the insertion loss α increases. This is because the conductor loss increases as the distance d decreases. As the insertion loss α increases, the Q value also decreases.

  Here, Example 1 has a characteristic A of d = 0.42 mm and α = −1.4 dB, and Comparative Example 1 has a characteristic B of d = 0.18 mm and α = −1.9 dB. That is, the insertion loss α of Comparative Example 1 (Characteristic B) is larger than the insertion loss α of Example 1 (Characteristic A). From this result, in the passive component 300A according to the comparative example 1, when the thickness W and the distance d are decreased to further reduce the size and the height, the insertion loss α further increases, and the desired electrical It is expected that the characteristics cannot be secured.

  On the other hand, in Example 1 (Characteristic A), the insertion loss α is lower than in Comparative Example 1 (Characteristic B). Therefore, it is possible to reduce the distance d from 0.42 mm to 0.18 mm of the comparative example 1 (characteristic B), for example. That is, the distance d and the thickness W can be reduced by 60%.

  In Example 1 (characteristic A), as shown in FIG. 9, the distance d is the distance between the first to third resonance electrodes 38 a to 38 c and the inner layer ground electrode 88. Thereby, compared with the comparative example 1 (characteristic B), 200 A of passive components which can implement | achieve further size reduction and low profile with low insertion loss (alpha) can be obtained.

  Further, since the capacitive electrode 64 is formed so as to oppose the open end of the third resonance electrode 38c, the short-circuit ends 96a to 96c of the first to third resonance electrodes 38a to 38c and the inner layer ground electrode 88 are formed. In the meantime, there are no electrodes that degrade the electrical properties. As a result, it is possible to obtain a passive component 200A having desired electrical characteristics and having a reduced size and height.

  Next, the passive component 200B according to the second embodiment will be described with reference to FIGS.

  The passive component 200B according to the second embodiment has substantially the same configuration as the passive component 200A according to the first embodiment described above, but includes six terminals (unbalanced input / output terminals 16, first and The second balanced input / output terminals 18a and 18b, the DC input terminal 80, and the ground terminals 82 and 84) are different in that they are formed in the vertical direction of the first to fourth side surfaces 14a to 14d. In addition, about the component same as 200 A of passive components which concern on Example 1, the same referential mark is attached | subjected and demonstrated.

  Specifically, in the passive component 200B according to the second embodiment, the unbalanced input / output terminal 16 and the second balanced input / output terminal 18b are formed on the first side surface 14a, and the DC input terminal is formed on the second side surface 14b. 80 and a first balanced input / output terminal 18a are formed, and ground terminals 82 and 84 are formed on the third and fourth side surfaces 14c and 14d, respectively.

  In the passive component 200B according to the second embodiment, most circuit elements configured in the dielectric substrate 12 have first to twelfth dielectric layers as shown in FIG. 15 without a plurality of via holes. The wiring patterns formed in S1 to S12 are electrically connected directly to the six terminals (16, 18a, 18b, 80, 82 and 84) described above.

  Specifically, the inner layer ground electrodes 86, 88 and 90 are electrically connected to the ground terminals 82 and 84, and the inner layer ground electrodes 40, 72 and 74 are electrically connected to the ground terminal 82. Further, the short-circuit ends 96 a to 96 c of the first to third resonance electrodes 38 a to 38 c are electrically connected to the ground terminal 84.

  Furthermore, the lead electrode 116 is electrically connected to the unbalanced input / output terminal 16 in the fourth dielectric layer S4. The second and third strip lines 48 and 50 are electrically connected to the first and second balanced input / output terminals 18a and 18b. The DC electrode 92 is electrically connected to the DC input terminal 80.

  By the way, as shown in FIGS. 17 and 18, the passive component 300 </ b> B according to the comparative example 2 is further reduced in size and height as the passive component 300 </ b> A according to the comparative example 1 (see FIGS. 12 and 13). When trying to do so, there was a concern that the spacing d would be too close and insertion loss would increase. In addition, also about the passive component 300B which concerns on the comparative example 2, the same referential mark is attached | subjected about the component same as the passive component 200B which concerns on Example 2. FIG.

  On the other hand, in the passive component 200B according to the second embodiment, as shown in FIGS. 14 to 16, in the dielectric substrate 12 as in the passive component 200A according to the first embodiment (see FIGS. 7 to 9). 1 to 3, the first to third strip lines 46, 48 and 50 constituting the conversion unit 32 are opposed to the open ends of the first to third resonance electrodes 38 a to 38 c, so that the first to third resonance electrodes The short-circuit end portions 96a to 96c of 38a to 38c are opposed to the inner layer ground electrode 88.

  Therefore, also in the passive component 200B according to the second embodiment, since the interval d is the interval between the first to third resonance electrodes 38a to 38c and the inner layer ground electrode 88, an increase in insertion loss and a decrease in Q value are achieved. Can be suppressed. Thereby, it is possible to realize the passive component 200B that can be further reduced in size and height while ensuring the electrical characteristics.

  Note that the passive component according to the present invention is not limited to the above-described embodiment, and various configurations can be adopted without departing from the gist of the present invention.

It is a perspective view which shows the passive component which concerns on 1st Embodiment. It is a disassembled perspective view which shows the passive component which concerns on 1st Embodiment. It is sectional drawing which shows the passive component which concerns on 1st Embodiment. It is sectional drawing which shows the passive component which concerns on a comparative example. It is a disassembled perspective view which shows the passive component which concerns on 2nd Embodiment. It is sectional drawing which shows the passive component which concerns on 2nd Embodiment. 1 is a perspective view showing a passive component according to Example 1. FIG. 1 is an exploded perspective view showing a passive component according to Embodiment 1. FIG. 1 is a cross-sectional view illustrating a passive component according to Example 1. It is a circuit diagram which shows the connection relation of DC input terminal and a conversion part. It is a characteristic view which shows the change of the insertion loss (alpha) when the space | interval d is changed. 6 is an exploded perspective view showing a passive component according to Comparative Example 1. FIG. 6 is a cross-sectional view showing a passive component according to Comparative Example 1. FIG. 6 is a perspective view of a passive component according to Embodiment 2. FIG. 6 is an exploded perspective view showing a passive component according to Embodiment 2. FIG. 6 is a cross-sectional view showing a passive component according to Embodiment 2. FIG. 10 is an exploded perspective view showing a passive component according to Comparative Example 2. FIG. 10 is a cross-sectional view showing a passive component according to Comparative Example 2. FIG. It is a disassembled perspective view which shows the conventional passive component.

Explanation of symbols

10A, 10B, 200A, 200B ... passive component 12 ... dielectric substrate 16 ... unbalanced input / output terminals 18a and 18b ... first and second balanced input / output terminals 30 ... filter unit 32 ... conversion unit 34 ... connection unit 38a- 38b: First to third resonance electrodes 44, 72, 74 ... Inner layer ground electrode 64 ... Capacitance electrode 66 ... Connection electrode 68, 70, 76 ... Via hole

Claims (7)

A filter unit having one or more resonance electrodes in a dielectric substrate on which a ground electrode is formed, a non-equilibrium-balance conversion unit, and a connection unit for electrically connecting the filter unit and the non-equilibrium-balance conversion unit In passive components formed with
An inner layer ground electrode is formed in the dielectric substrate for the purpose of forming a capacitance with the open end of the resonance electrode and isolating the filter unit and the non-equilibrium-balance conversion unit,
The passive component, wherein the non-equilibrium-equilibrium converter is formed immediately below the inner layer ground electrode. A filter unit having one or more resonance electrodes, a non-equilibrium-balance conversion unit, and a connection unit for electrically connecting the filter unit and the non-equilibrium-balance conversion unit in a dielectric substrate on which a ground electrode is formed In passive components formed with
For the purpose of isolating the first inner layer ground electrode for the purpose of forming a capacitance with the open end of the resonant electrode in the dielectric substrate, the filter unit and the non-equilibrium-balance conversion unit A second inner layer ground electrode is formed,
The passive component, wherein the non-equilibrium-balance conversion section is formed immediately below the first inner layer ground electrode with the second inner layer ground electrode interposed therebetween. The passive component according to claim 1 or 2,
The unbalanced-balanced conversion unit has one unbalanced transmission line and a pair of balanced transmission lines,
One end of the unbalanced transmission line is electrically connected to the filter part via the connection part,
Each of the pair of balanced transmission lines has one end connected to a corresponding balanced input / output terminal and the other end connected to a common electrode. The passive component according to claim 3,
A passive component, wherein only a dielectric exists between a portion on a short-circuit end side of the resonance electrode and the common electrode. The passive component according to claim 3,
The passive component, wherein the common electrode is a DC terminal to which a DC voltage is supplied. The passive component according to claim 3,
The connecting portion is
A capacitive electrode facing the resonant electrode across a dielectric and forming a capacitance with the resonant electrode;
A connection electrode formed extending from a position corresponding to the capacitive electrode to a position corresponding to one end of the unbalanced transmission line in the unbalanced-balanced conversion unit;
A via hole for electrically connecting the capacitor electrode and the connection electrode;
A passive component having a via hole for electrically connecting one end of the unbalanced transmission line and the connection electrode. The passive component according to claim 3,
The connecting portion is
A capacitive electrode facing the resonant electrode across a dielectric and forming a capacitance with the resonant electrode;
A passive component comprising a via hole that electrically connects one end of the non-equilibrium transmission line located immediately below the capacitor electrode.

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