JP2006066558A - Element substrate with uncoated part - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an element substrate which prevents a coating agent from outflow into a circuit substrate side while preventing the coating agent from outflow into an unapplied part. <P>SOLUTION: In a substrate 101, a notch 114 used as a first outflow prevention means is formed so as to prevent a sealing resin 105 from flowing into a circuit substrate 102 side. Further, in the substrate 101, a recess 115 used as a second outflow prevention means is formed in electrodes 107, 108 provided in the substrate 101 so as to prevent a sealing resin from flowing into an element 103 (uncoated part). In the recess 115, connecting electrodes 107, 108 for connecting to wires 104. Consequently, the outflow of the sealing resin 105 is prevented from flowing into the circuit substrate 102 side, and from flowing into the element 103 (uncoated part). <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an element substrate having a portion to be coated with a flowable coating agent and a non-coated portion that causes a problem when the coating agent touches.

  Various structures have been developed for preventing the coating agent to be applied only to a part of the substrate from flowing out to the other part. 10A and 10B show the structure of an element substrate having an outflow prevention structure according to the prior art. FIG. 10A is a plan view and FIG. 10B is a cross-sectional view. An element substrate 15a is composed of the circuit board 1, the substrate 8, the element 14, the wire 12, the sealing resin 13, and the like. Elements 14 such as a detection unit and an actuator unit are formed or mounted on the substrate 8. The detection unit is, for example, a gas sensor that does not function unless it is open to the atmosphere. Further, the actuator has a movement like a piezoelectric element, for example. All of these elements do not perform their original functions when covered with resin. A circuit 9 for transmitting an electrical signal to the element 14 is formed on the substrate 8, and an end of the circuit 9 is connected to a pair of connection electrodes 10 and 11 disposed on the substrate 8.

  A pair of connection electrodes 6, 7 are provided on the circuit board 1, and the connection electrodes 6, 7 are connected to terminals 4, 5 via circuits 2, 3 formed on the circuit board 1. Connected to the device. The connection electrodes 10 and 11 of the substrate 8 and the connection electrodes 6 and 7 provided on the circuit board 1 are connected by wires 12 respectively. These connection electrodes and wires 12 are protected by applying and covering the sealing resin 13.

  In order to prevent the sealing resin 13 from flowing out into the element 14 which is an uncoated portion to which the sealing resin 13 should not be applied, a protruding portion 16 a is formed on the substrate 8. (For example, see Patent Document 1)

The outline 13a after curing of the sealing resin 13 as the coating agent is described in a streamlined manner in FIG. 1, but this is the shape expected by the designer, and the viscosity of the sealing resin 13, It varies depending on the temperature / humidity at the time of application and the amount of application. Therefore, there is a possibility that the sealing resin 13 flows over the protruding portion 16a formed on the substrate 8 or from both ends of the protruding portion 16a and flows out to the element 14 on the substrate 8 which is an uncoated portion. I cannot say that there is no. Further, the protruding portion 16a is intended to prevent the sealing resin 13 from flowing out to the element 14 side, but since there is no means for preventing the outflow on the circuit board 1 side, the sealing resin 13 flows out, There is also a possibility of reaching the terminals 4 and 5. Furthermore, part of the wire 12 that should be protected may be exposed by flowing and spreading toward the circuit board 1 side.
JP-A-10-189627

  An element substrate having a coated portion to be coated with a flowable coating agent and a non-coated portion that causes problems when the coating agent touches, and prevents the coating agent from flowing out to the non-coated portion. Provided is an element substrate that prevents outflow to a circuit board side.

  At least a circuit board, a substrate having an uncoated portion disposed on the circuit substrate, a connection electrode disposed on the substrate, and a connection electrode disposed on the circuit substrate are connected. A wire, a connection electrode disposed on the substrate, a sealing resin covering the connection electrode disposed on the circuit substrate, and the substrate having the non-coated portion on the substrate. A first outflow prevention means for preventing the sealing resin from flowing out at a position adjacent to the disposed connection electrode, and preventing the sealing resin from flowing out at the periphery of the connection electrode disposed on the substrate A second non-covering means configured to apply the sealing resin on the first and second outflow prevention means, the wire, the circuit board, and the connection electrode disposed on the board. An element substrate having a coating portion is provided.

  The first outflow prevention means provided at a position adjacent to the connection electrode disposed on the substrate having the non-coated portion is an element substrate having a non-coated portion which is a notch provided in the substrate.

  The first outflow prevention means provided at a position adjacent to the connection electrode disposed on the substrate having the non-coated portion is an element substrate having a non-coated portion which is a through hole provided in the substrate.

  An element substrate having a non-coated portion located inside a first outflow prevention means provided at a position adjacent to the connection electrode disposed on the circuit board, the connection electrode disposed on the circuit board; To do.

  The second outflow prevention means provided in the peripheral portion of the connection electrode disposed on the substrate having the non-coated portion is a concave portion, and the non-coated portion in which the connection electrode with the wire is provided in the concave portion An element substrate having

  An element having a non-coated portion, which is a concave frame provided so that the second outflow prevention means provided in the peripheral portion of the connection electrode disposed on the substrate having the non-coated portion surrounds the connection electrode. A substrate is used.

  The second outflow prevention means provided in the peripheral portion of the connection electrode disposed on the substrate having the non-coated portion has a non-coated portion which is a convex frame provided so as to surround the connecting electrode. An element substrate is used.

  The first outflow prevention means and the second outflow prevention means are element substrates having an uncoated portion formed by etching.

  The second outflow prevention means provided on the periphery of the connection electrode disposed on the substrate having the non-coated portion is an element substrate having a non-coated portion formed by patterning the thin film.

  A first outflow prevention means for preventing the sealing resin from flowing out at a position adjacent to the connection electrode disposed on the substrate having the non-coated portion; and a peripheral portion of the connection electrode disposed on the substrate. Since the second outflow prevention means for preventing the sealing resin from flowing out is provided, the first outflow prevention means prevents the sealing resin from flowing out to the circuit board side, and the second outflow prevention means prevents the sealing resin from flowing out. It is possible to reliably prevent the sealing resin from flowing out to the application portion. Therefore, the problem caused by the flow of the sealing resin is solved and the yield is improved.

  At least a circuit board, a substrate having an uncoated portion disposed on the circuit substrate, a connection electrode disposed on the substrate, and a connection electrode disposed on the circuit substrate are connected. A wire, a connection electrode disposed on the substrate, a sealing resin covering the connection electrode disposed on the circuit substrate, and the substrate having the non-coated portion on the substrate. A first outflow prevention means for preventing the sealing resin from flowing out at a position adjacent to the disposed connection electrode, and preventing the sealing resin from flowing out at the periphery of the connection electrode disposed on the substrate A second outflow prevention means is provided, and the first and second outflow prevention means, the wire, the circuit board, and a non-coated part in which the sealing resin is applied on the connection electrode disposed on the substrate. It has an element substrate.

  1A and 1B show an embodiment of an element substrate according to the present invention, wherein FIG. 1A is a top view, FIG. 1B is a cross-sectional view taken along the line A-A in FIG. 1A, and FIG. 105 is omitted). Reference numeral 100 denotes an element substrate, which includes a circuit board 102, a substrate 101 on which an element portion 103 is formed, a wire 104, a sealing resin 105, and the like. An element unit 103 such as a detection unit / actuator unit is formed on the substrate 101. The detection unit is, for example, a gas sensor, and is a part that does not function unless it is opened to the atmosphere. The actuator has a movement like a piezoelectric element, for example. All of these elements do not perform their original functions when covered with resin. A pattern 106 for transmitting an electric signal to the element portion 103 is formed on the substrate 101, and an end portion of the pattern 106 is connected to connection electrodes 107 and 108 provided on the substrate 101.

  The connection electrodes 109 and 110 disposed on the circuit board 102 are connected to the terminal 113 via the patterns 111 and 112 formed on the circuit board 102 and connected to other devices. The connection electrodes 107 and 108 of the substrate 101 and the connection electrodes 109 and 110 provided on the circuit substrate 102 are connected by wires 104, respectively. These connection electrodes and wires 104 are protected by applying and covering a sealing resin 105.

  The substrate 101 is provided with a notch 114 serving as a first outflow prevention means in order to prevent the sealing resin 105 from flowing out toward the circuit substrate 102. The notch 114 is formed by a processing step (for example, dry etching processing or wet etching processing) for forming the substrate 101. By providing the cutout portion 114 of the substrate 101, most of the sealing resin 105 is accommodated in the cutout portion 114, thereby preventing the outflow and spreading to the circuit board 102 side.

  Further, in the substrate 101, a recess 115 serving as a second outflow prevention means is provided in the connection electrodes 107 and 108 disposed on the substrate 101 in order to prevent the sealing resin from flowing out to the element portion 103 (uncoated portion). The connection electrodes 107 and 108 for the wire 104 are formed in the recess 115.

  Similarly to the formation of the notch 114, the recess 115 is simultaneously formed by a processing step for forming the substrate 101 (for example, dry etching processing or wet etching processing). Therefore, the outflow prevention means such as the recess 115 and the notch 114 can be easily formed without adding a special process. By providing the cutout portion 114, the sealing resin 105 is prevented from flowing out to the circuit board 102 side, and by providing the concave portion 115, the element portion 103 (uncoated portion) of the sealing resin 105 is provided. Can be prevented.

  2A and 2B show an embodiment of the element substrate according to the present invention, which is another embodiment of the first embodiment. FIG. 2A is a top view, FIG. 2B is a cross-sectional view taken along line A-A in FIG. FIG. Since the basic configuration is the same as that of the first embodiment, detailed description thereof is omitted. In this embodiment, the connection electrodes 109 and 110 arranged on the circuit board 102 are arranged inside the notch 114 formed on the board 101. With this configuration, the application range of the sealing resin 105 is accommodated in the notch 114, so that the sealing resin 105 can be reliably prevented from flowing out to the circuit board 102 side. The outflow of the sealing resin 105 to the element portion 103 (non-coated portion) can be prevented by the formation of the recess 115 as in the first embodiment.

  3A and 3B show an embodiment of an element substrate according to the present invention, in which FIG. 3A is a top view, FIG. 3B is a cross-sectional view taken along the line A-A in FIG. 105 is omitted). Reference numeral 100 denotes an element substrate, which includes a circuit board 102, a substrate 101 on which an element portion 103 is formed, a wire 104, a sealing resin 105, and the like. An element unit 103 such as a detection unit / actuator unit is formed on the substrate 101. A pattern 106 for transmitting an electric signal to the element portion 103 is formed on the substrate 101, and an end portion of the pattern 106 is connected to connection electrodes 107 and 108 provided on the substrate 101.

  The connection electrodes 109 and 110 disposed on the circuit board 102 are connected to the terminal 113 via the patterns 111 and 112 formed on the circuit board 102 and connected to other devices. The connection electrodes 107 and 108 of the substrate 101 and the connection electrodes 109 and 110 provided on the circuit substrate 102 are connected by wires 104, respectively. These connection electrodes and wires 104 are protected by applying and covering a sealing resin 105.

  In the substrate 101, in order to prevent the sealing resin 105 from flowing out toward the circuit substrate 102, a through hole 116 as a first outflow prevention means is formed. The substrate 101 is mounted such that the connection electrodes 109 and 110 on the circuit substrate 102 are located in the through holes 116. The through hole 116 is formed by a processing step (for example, dry etching processing or wet etching processing) for forming the substrate 101, and the sealing resin 105 is moved to the circuit substrate 102 side through the through hole 116 of the substrate 101. Prevents the outflow. By providing the through hole 116, the hole wall becomes a dam, and the outflow of the sealing resin 105 can be completely prevented.

  Further, in the substrate 101, a recess serving as a second outflow prevention means is provided in the connection electrodes 107 and 108 disposed on the substrate 101 in order to prevent the sealing resin from flowing out to the element portion 103 (non-coated portion). 115, and connection electrodes 107 and 108 with the wire 104 are formed in the recess 115.

  Similarly to the formation of the through hole 116, the recess 115 is simultaneously formed by a processing step for forming the substrate 101 (for example, dry etching processing or wet etching processing). Therefore, the outflow prevention means such as the recess 115 and the through hole 116 can be easily formed without adding a special process. By providing the through hole 116, the sealing resin 105 is prevented from flowing out to the circuit board 102 side, and by providing the recess 115, the element portion 103 (uncoated portion) of the sealing resin 105 is provided. Can be prevented from flowing out.

  4A and 4B show an embodiment of an element substrate according to the present invention, in which FIG. 4A is a top view, FIG. 4B is a cross-sectional view taken along line A-A in FIG. 4A, and FIG. 105 is omitted). Since the main configuration is the same as that of the above-described embodiment, detailed description is omitted, and only different portions will be described.

  The substrate 101 is provided with a notch 114 serving as a first outflow prevention means in order to prevent the sealing resin 105 from flowing out toward the circuit substrate 102. The notch 114 is formed by a processing step (for example, dry etching processing or wet etching processing) for forming the substrate 101. As a result, most of the sealing resin 105 is accommodated in the notch 114, thereby preventing outflow and spreading to the circuit board 102 side.

  Further, the substrate 101 serves as a second outflow prevention means around the connection electrodes 107 and 108 disposed on the substrate 101 in order to prevent the sealing resin from flowing out to the element portion 103 (uncoated portion). A concave frame 117 is formed, and connection electrodes 107 and 108 to the wire 104 are formed inside the concave frame 117.

  The concave frame 117 is also formed at the same time by a processing step (for example, dry etching processing or wet etching processing) for forming the substrate 101, similarly to the formation of the notch 114. Therefore, outflow prevention means such as the concave frame 117 and the notch 114 can be easily formed without adding a special process. By providing the cutout portion 114, the sealing resin 105 is prevented from flowing out to the circuit board 102 side, and by providing the concave frame 117, the element portion 103 (uncoated portion) of the sealing resin 105 is provided. ) Can be prevented.

  FIG. 5 shows an embodiment of the element substrate according to the present invention, which is another embodiment of the fourth embodiment. FIG. 5A is a top view, FIG. 5B is a cross-sectional view taken along the line A-A in FIG. FIG. Since the basic configuration is the same as that of the fourth embodiment, detailed description thereof is omitted. In this embodiment, the connection electrodes 109 and 110 arranged on the circuit board 102 are arranged inside the notch 114 formed on the board 101. With this configuration, the application range of the sealing resin 105 is accommodated in the notch 114, so that the sealing resin 105 can be reliably prevented from flowing out to the circuit board 102 side. The outflow of the sealing resin 105 to the element portion 103 (non-coated portion) can be prevented by the formation of the concave frame 117 as in the fourth embodiment.

  6A and 6B show an embodiment of the element substrate according to the present invention, in which FIG. 6A is a top view, FIG. 6B is a cross-sectional view taken along the line A-A in FIG. 105 is omitted). Since the main configuration is the same as that of the above-described embodiment, detailed description is omitted, and only different portions will be described.

  In the substrate 101, in order to prevent the sealing resin 105 from flowing out toward the circuit substrate 102, a through hole 116 as a first outflow prevention means is formed. The substrate 101 is mounted such that the connection electrodes 109 and 110 on the circuit substrate 102 are located in the through holes 116. The through-hole 116 is formed by a processing step (for example, dry etching processing or wet etching processing) for forming the substrate 101, thereby preventing the sealing resin 105 from flowing out to the circuit substrate 102 side. ing. By providing the through hole 116, the hole wall becomes a dam, and the outflow of the sealing resin 105 can be completely prevented.

  Further, the substrate 101 serves as a second outflow prevention means around the connection electrodes 107 and 108 disposed on the substrate 101 in order to prevent the sealing resin from flowing out to the element portion 103 (uncoated portion). A concave frame 117 is formed, and connection electrodes 107 and 108 to the wire 104 are formed inside the concave frame 117.

  Similarly to the formation of the through hole 116, the concave frame 117 is simultaneously formed by a processing step (for example, dry etching processing or wet etching processing) for forming the substrate 101. Therefore, outflow prevention means such as the concave frame portion 117 and the through hole 116 can be easily formed without adding a special process. By providing the through hole 116, the sealing resin 105 is prevented from flowing out toward the circuit board 102, and by providing the concave frame 117, the element portion 103 (uncoated portion) of the sealing resin 105. Can be prevented.

  7A and 7B show an embodiment of an element substrate according to the present invention, in which FIG. 7A is a top view, FIG. 7B is a cross-sectional view taken along line AA of FIG. 105 is omitted). Since the main configuration is the same as that of the above-described embodiment, detailed description is omitted, and only different portions will be described.

  The substrate 101 is provided with a notch 114 serving as a first outflow prevention means in order to prevent the sealing resin 105 from flowing out toward the circuit substrate 102. The notch 114 is formed by a processing step for forming the substrate 101 (for example, dry etching processing or wet etching processing). As a result, most of the sealing resin 105 is accommodated in the notch 114, thereby preventing outflow to the circuit board 102 side.

  Further, the substrate 101 serves as a second outflow prevention means around the connection electrodes 107 and 108 disposed on the substrate 101 in order to prevent the sealing resin from flowing out to the element portion 103 (uncoated portion). A convex frame 118 is formed, and connection electrodes 107 and 108 to the wire 104 are formed inside the convex frame 118.

  The convex frame 118 is also formed simultaneously by a processing step (for example, dry etching processing or wet etching processing) for forming the substrate 101, similarly to the formation of the notch 114. Therefore, outflow prevention means such as the convex frame 118 and the notch 114 can be easily formed without adding a special process. In addition, the convex frame 118 can be formed by patterning a thin film by a method such as vapor deposition or sputtering. By providing the cutout portion 114, the sealing resin 105 is prevented from flowing out to the circuit board 102 side, and by providing the convex frame 118, the element portion 103 (non-coated) of the sealing resin 105 is provided. Can be prevented from flowing out to (part).

  FIG. 8 shows an embodiment of the element substrate according to the present invention, which is another embodiment of the embodiment 7. FIG. 8A is a top view, FIG. 8B is a cross-sectional view taken along the line A-A in FIG. FIG. Since the basic configuration is the same as that of the seventh embodiment, detailed description is omitted. In this embodiment, the connection electrodes 109 and 110 arranged on the circuit board 102 are arranged inside the notch 114 formed on the board 101. With this configuration, the application range of the sealing resin 105 is accommodated in the notch 114, so that the sealing resin 105 can be reliably prevented from flowing out to the circuit board 102 side. The outflow of the sealing resin 105 to the element portion 103 (non-coated portion) can be prevented by the convex frame 118 formed as in the seventh embodiment.

  9A and 9B show an embodiment of the element substrate according to the present invention, wherein FIG. 9A is a top view, FIG. 9B is a cross-sectional view taken along line AA of FIG. 9A, and FIG. 105 is omitted). Since the main configuration is the same as that of the above-described embodiment, detailed description is omitted, and only different portions will be described.

  In the substrate 101, in order to prevent the sealing resin 105 from flowing out toward the circuit substrate 102, a through hole 116 as a first outflow prevention means is formed. The substrate 101 is mounted such that the connection electrodes 109 and 110 on the circuit substrate 102 are located in the through holes 116. The through-hole 116 is formed by a processing step (for example, dry etching processing or wet etching processing) for forming the substrate 101, thereby preventing the sealing resin 105 from flowing out to the circuit substrate 102 side. ing. By providing the through hole 116, the hole wall becomes a dam, and the outflow of the sealing resin 105 can be completely prevented.

  Further, the substrate 101 serves as a second outflow prevention means around the connection electrodes 107 and 108 disposed on the substrate 101 in order to prevent the sealing resin from flowing out to the element portion 103 (uncoated portion). A convex frame 118 is formed, and connection electrodes 107 and 108 to the wire 104 are formed inside the convex frame 118.

  Similarly to the formation of the through hole 116, the convex frame 118 is simultaneously formed by a processing step (for example, dry etching processing or wet etching processing) for forming the substrate 101. Therefore, outflow prevention means such as the convex frame portion 118 and the through hole 116 can be easily formed without adding a special process. In addition, the convex frame 118 can be formed by patterning a thin film by a method such as vapor deposition or sputtering. By providing the through hole 116, the sealing resin 105 is prevented from flowing out to the circuit board 102 side, and by providing the convex frame 118, the element portion 103 (uncoated portion) of the sealing resin 105 is provided. ) Can be prevented.

It is one Embodiment of the element substrate by this invention, (a) is a top view, (b) is AA sectional drawing of (a), (c) is a perspective view. (Example 1) It is one Embodiment of the element substrate by this invention, (a) is a top view, (b) is AA sectional drawing of (a), (c) is a perspective view. (Example 2) It is one Embodiment of the element substrate by this invention, (a) is a top view, (b) is AA sectional drawing of (a), (c) is a perspective view. Example 3 It is one Embodiment of the element substrate by this invention, (a) is a top view, (b) is AA sectional drawing of (a), (c) is a perspective view. Example 4 It is one Embodiment of the element substrate by this invention, (a) is a top view, (b) is AA sectional drawing of (a), (c) is a perspective view. (Example 5) It is one Embodiment of the element substrate by this invention, (a) is a top view, (b) is AA sectional drawing of (a), (c) is a perspective view. (Example 6) It is one Embodiment of the element substrate by this invention, (a) is a top view, (b) is AA sectional drawing of (a), (c) is a perspective view. (Example 7) It is one Embodiment of the element substrate by this invention, (a) is a top view, (b) is AA sectional drawing of (a), (c) is a perspective view. (Example 8) It is one Embodiment of the element substrate by this invention, (a) is a top view, (b) is AA sectional drawing of (a), (c) is a perspective view. Example 9 It is a figure which shows the structure of the element substrate which has the outflow prevention structure by a prior art, (A) is a top view, (B) is sectional drawing.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Circuit board 2 Circuit 3 Circuit 4 Terminal 5 Terminal 6 Connection electrode 7 Connection electrode 8 Board | substrate 9 Circuit 10 Connection electrode 11 Connection electrode 12 Wire 13 Sealing resin 13a Outline line 14 Element 15a Element board 16a Protrusion part 100 Element board 101 Substrate 102 Circuit board 103 Element portion 104 Wire 105 Sealing resin 106 Pattern 107 Connection electrode 108 Connection electrode 109 Connection electrode 110 Connection electrode 111 Pattern 112 Pattern 113 Terminal 114 Notch 115 Recess 116 Through hole 117 Concave frame 118 Convex frame

Claims (9)

  At least a circuit board, a substrate having an uncoated portion disposed on the circuit substrate, a connection electrode disposed on the substrate, and a connection electrode disposed on the circuit substrate are connected. A wire, a connection electrode disposed on the substrate, a sealing resin covering the connection electrode disposed on the circuit substrate, and the substrate having the non-coated portion on the substrate. A first outflow prevention means for preventing the sealing resin from flowing out at a position adjacent to the disposed connection electrode, and preventing the sealing resin from flowing out at the periphery of the connection electrode disposed on the substrate An element having an uncoated portion, wherein the sealing resin is coated on the wire, the circuit board, and a connection electrode disposed on the board. substrate.   The first outflow prevention means provided at a position adjacent to a connection electrode provided on the substrate having the non-coated portion is a notch provided in the substrate. An element substrate having an uncoated portion.   2. The non-coated portion according to claim 1, wherein the first outflow prevention means provided at a position adjacent to the connection electrode provided on the substrate having the non-coated portion is a through hole provided in the substrate. An element substrate having a portion to be coated.   The connection electrode disposed on the circuit board is located inside first outflow prevention means provided at a position adjacent to the connection electrode disposed on the substrate. 2. An element substrate having an uncoated portion according to 2 or 3.   The second outflow prevention means provided in the periphery of the connection electrode disposed on the substrate having the non-coated portion is a recess, and the connection electrode with the wire is provided in the recess. An element substrate having an uncoated portion according to claim 1, 2, 3, or 4.   The second outflow prevention means provided in a peripheral portion of a connection electrode provided on the substrate having the non-coated portion is a concave frame provided so as to surround the connection electrode. An element substrate having an uncoated portion according to 1, 2, 3, or 4.   The second outflow prevention means provided in a peripheral portion of a connection electrode provided on the substrate having the non-coated portion is a convex frame provided so as to surround the connection electrode. Item 5. An element substrate having an uncoated portion according to Item 1, 2, 3, or 4.   8. An element substrate having an uncoated portion according to claim 2, wherein the first outflow prevention means and the second outflow prevention means are formed by etching. .   The second outflow prevention means provided in the peripheral part of the connection electrode disposed on the substrate having the non-coated part is formed by patterning a thin film. An element substrate having an uncoated portion.

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