JP2006064365A - Temperature regulator - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To locally regulate the temperature of only an objective chemical reaction part of a micro chemical chip and to set chemical reaction parts other than the objective one at an atmospheric temperature. <P>SOLUTION: This temperature regulator includes a first heat conductor, a first temperature measurement means, a first thermoelectric element, a first temperature control means, a second heat conductor, a second temperature measurement means, a second thermoelectric element, a second temperature control means and a heat exchange means. The circumference of the first heat conductor is surrounded by the second heat conductor through a minute space; the temperature of the first heat conductor is regulated to a targeted temperature; and the temperature of the second heat conductor is regulated to an atmospheric temperature. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a temperature control device that performs temperature control of a local region of a temperature control target member using a thermoelectric element.

  A thermoelectric element is a device that can directly convert thermal energy into electrical energy and a device that can directly convert electrical energy into thermal energy. The thermoelectric element is composed of a plurality of thermocouples. A thermocouple is a p-type thermoelectric semiconductor and an n-type thermoelectric semiconductor having a columnar shape having substantially the same length, and paired at both ends thereof.

  In a general thermoelectric element, a plurality of thermocouples are arranged in a plane so that the p-type thermoelectric semiconductor and the n-type thermoelectric semiconductor are alternately and regularly arranged. The plurality of thermocouples arranged in such a manner are electrically connected in series. A thermoelectric element generates a voltage due to the Seebeck effect when a temperature difference is given between both ends thereof. When a direct current is passed through the thermoelectric element, heat absorption occurs at one end of the thermoelectric element and heat dissipation (heat generation) occurs at the other end due to the Peltier effect.

  Thus, the thermoelectric element has a reversible effect and is applied as a conversion element between heat energy and electric energy. In particular, the temperature of one end face of the thermoelectric element can be accurately controlled by controlling the amount and direction (polarity) of the current flowing through the thermoelectric element. Therefore, the thermoelectric element can be used as a temperature control device.

  On the other hand, examples of the target member that requires local temperature adjustment in such a thermoelectric element include a microchemical chip. The microchemical chip includes a DNA chip called a DNA chip, a chip for protein analysis, and a micro TAS that performs various chemical processes usually performed in a laboratory on a chip of several cm square size. There are chips called a Total Analysis System, a lab-on-a-chip, or a microreactor. In this specification, anything that causes some kind of chemical process on or inside the chip is called a microchemical chip. A portion where a chemical process occurs on the chip or inside the chip is called a chemical reaction portion.

  The chemical changes that occur in the chemical reaction section include various chemical processes such as mixing, reaction, extraction, separation or concentration. For each chemical process, for example, in order to increase the reaction rate, stabilize or activate the reaction system, or increase the reaction efficiency, it is necessary to set the temperature to an optimum state.

  For this purpose, it is necessary to have a configuration capable of locally adjusting the temperature of the chemical reaction part in the microchemical chip. Conventionally, a microchemical chip having a configuration for performing local temperature adjustment has been proposed (see, for example, Patent Document 1).

FIG. 14 is a diagram schematically showing a configuration of a temperature control device for a microchemical chip disclosed in Patent Document 1. As shown in FIG. 14, a heat conductor 101, a thermoelectric element 103, and a heat exchange member 105 are sequentially provided below the chemical reaction portion 305 of the microchemical chip 301, and each of them is connected so as to be able to conduct heat. ing. According to this configuration, the chemical reaction unit 305 is heated, cooled, or temperature-controlled by the thermoelectric element 103, thereby increasing the reaction rate in the chemical reaction unit 305, stopping the reaction, The reaction can be optimally controlled.

JP 2003-43052 A

However, in the prior art disclosed in Patent Document 1, the region 1104 to which the heat conductor 101 is connected so as to be able to conduct heat is temperature-adjusted by the thermoelectric element 103 to be different from the surrounding ambient temperature. Although the temperature can be adjusted, at the same time, the temperature (heat) of the region 1104 conducts the member of the microchemical chip 301 and the temperature of the surrounding region 1402 also has a temperature distribution different from the ambient ambient temperature.
Therefore, the chemical reaction unit 305 can obtain a predetermined optimum temperature different from the ambient atmosphere temperature, but at the same time, the chemical reaction units 304 and 306 also have a temperature different from the ambient atmosphere temperature (the temperature of the chemical reaction unit 305 and the ambient temperature). Intermediate temperature).
This is because when only the chemical reaction unit 305 is desired to be adjusted to a predetermined optimum temperature different from the ambient temperature, the chemical reaction units 304 and 306 also have a temperature different from the ambient temperature. The problem is that adjustment is not possible.

(Object of invention)
The present invention eliminates the above-mentioned problems caused by the prior art, and locally adjusts the temperature of only the target chemical reaction part of the microchemical chip to a temperature different from the ambient temperature by heating or cooling, so It is an object of the present invention to provide a temperature control device in which the reaction section can be set to an ambient temperature.

  In order to solve the above-described problems and achieve the object, the temperature control device is arranged in the vicinity of the first thermal conductor made of a material having a high thermal conductivity, the first thermal conductor, and the first thermal conductor. Measured by a first temperature measuring means for measuring the temperature of the conductor, a first thermoelectric element having one surface connected to the first thermal conductor so as to be capable of conducting heat, and a first temperature measuring means. 1st temperature control means which controls the electric current sent through the 1st thermoelectric element based on temperature, 2nd heat conductor comprised with a material with large heat conductivity, and it arranges near the 2nd heat conductor Second temperature measuring means for measuring the temperature of the second heat conductor, at least one second thermoelectric element having one surface connected to the second heat conductor so as to conduct heat, And a second temperature for controlling the current flowing through the second thermoelectric element based on the temperature measured by the second temperature measuring means. Control means, heat exchange means joined and fixed to the other surface of the first thermoelectric element and the second thermoelectric element so as to be able to conduct heat, and a small gap around the first heat conductor It is characterized by being surrounded by the second thermal conductor via

  Moreover, it is preferable that a temperature control apparatus has multiple 1st heat conductors and 1st thermoelectric elements, respectively.

  In the temperature adjusting device, it is preferable that the first and second temperature measuring means are provided inside the first and second heat conductors, respectively.

  The temperature adjusting device preferably has an atmospheric temperature measuring means for measuring the atmospheric temperature, and the temperature of the second heat conductor is preferably adjusted to be the same as the atmospheric temperature measured by the atmospheric temperature measuring means. .

In addition, the temperature control device includes a third thermal conductor made of a material having a high thermal conductivity and a third temperature that is disposed in the vicinity of the third thermal conductor and measures the temperature of the third thermal conductor. The third thermoelectric element is connected to the third thermoelectric element based on the temperature measured by the measuring means, the third thermoelectric element having one surface connected to the third heat conductor so as to conduct heat, and the temperature measured by the third temperature measuring means. Third temperature control means for controlling the current to flow, a fourth thermal conductor made of a material having a high thermal conductivity, and a temperature of the fourth thermal conductor, arranged in the vicinity of the fourth thermal conductor. Measured by a fourth temperature measuring means, at least one fourth thermoelectric element whose one surface is connected to the fourth heat conductor so as to conduct heat, and a fourth temperature measuring means. A fourth temperature control means for controlling a current flowing through the fourth thermoelectric element based on the measured temperature, and a third thermoelectric element And a second heat exchanging means that is joined and fixed to the other surface of the fourth thermoelectric element so as to be capable of conducting heat, and the periphery of the third heat conductor is fourth through a minute gap. The first heat conductor and the third heat conductor face each other, and the second heat conductor and the fourth heat conductor face each other. It is preferable to adjust the temperature of the first heat conductor and the third heat conductor to the same temperature, and to adjust the temperature of the second heat conductor and the fourth heat conductor to the same temperature. .

  Moreover, it is preferable that a temperature control apparatus has multiple 1st thermal conductors, 1st thermoelectric elements, 3rd thermal conductors, and 3rd thermoelectric elements, respectively.

  The temperature control device has an atmospheric temperature measuring means for measuring the atmospheric temperature, and the temperature of both the second thermal conductor and the fourth thermal conductor is the same as the atmospheric temperature measured by the atmospheric temperature measuring means. It is preferable to adjust so that.

  In the temperature control device, it is preferable that the first to fourth temperature measuring means are provided inside the first to fourth heat conductors, respectively.

  According to the temperature control device of the present invention, the temperature of the target chemical reaction section is adjusted to a temperature different from the ambient temperature by the first thermoconductor and the first thermoelectric element that controls the temperature of the first heat conductor. At the same time, the temperature of the peripheral region of the target chemical reaction part can be adjusted to the ambient temperature by the second thermoelectric element that adjusts the temperature of the second heat conductor and the second heat conductor. As a result, the temperature of only the target chemical reaction part of the microchemical chip is locally adjusted to a temperature different from the ambient temperature by heating and cooling, and the chemical reaction part other than the target can be brought to the ambient temperature. Have. In particular, it is suitable for adjusting the temperature of only a minute region such as about 1 mm square.

  Moreover, according to the temperature control apparatus concerning this invention, the 3rd heat conductor and the 4th heat conductor which were provided so that it might respectively oppose the 1st heat conductor and the 2nd heat conductor were provided. The third thermoelectric element and the fourth thermoelectric element respectively cause the third thermal conductor to be at the same temperature as the first thermal conductor, and the fourth thermal conductor is the second thermal conductor. By adjusting the temperature to the same temperature, the microchemical chip is sandwiched between the first thermal conductor, the second thermal conductor, the third thermal conductor, and the fourth thermal conductor. Can be adjusted. Therefore, the temperature of the chemical reaction part of the microchemical chip is adjusted to the same temperature from the top and bottom, and the temperature gradient in the thickness direction of the microchemical chip is minimized, so that the target chemical reaction part can be adjusted to a more uniform temperature. Has an effect. It is particularly suitable when the microchemical chip is thick or when the temperature of a minute region smaller than 1 mm is adjusted.

Furthermore, according to the temperature control device of the present invention, the plurality of first thermal conductors and the plurality of first thermoelectric elements, or the plurality of first thermal conductors, the plurality of first thermoelectric elements, and the plurality of first thermoelectric elements. 3 thermal conductors and a plurality of third thermoelectric elements can adjust the temperature of the plurality of chemical reaction portions to a temperature different from the ambient temperature, so that only the plurality of chemical reaction portions of the microchemical chip are individually provided. It has the effect that the temperature can be adjusted to the temperature.
Therefore, it is possible to freely adjust the temperature of only the region where the temperature of the microchemical chip needs to be adjusted, and integration of the microchemical chip capable of arbitrarily adjusting the temperature can be realized.

  Exemplary embodiments of a temperature control device according to the present invention will be explained below in detail with reference to the accompanying drawings. In the following description of each embodiment, the same components as those in the other embodiments are denoted by the same reference numerals and description thereof is omitted.

[First Embodiment]
FIGS. 1A and 1B are a plan view and a cross-sectional view (b) schematically showing the configuration of the temperature control apparatus according to the first embodiment of the present invention. FIG. 2 is a perspective view schematically showing the configuration of the temperature adjusting device according to the first embodiment of the present invention.

  As shown in FIG. 1, the temperature control device 106 according to the first embodiment includes a first thermal conductor 101, a second thermal conductor 102, a first thermoelectric element 103, a second thermoelectric element 104, As shown in FIG. 2, the first heat conductor 101 and the second heat conductor 102 are provided with a first temperature measuring means 203 and a second temperature measuring means 204, respectively.

  Although not shown, the first temperature control means 806 for controlling the current flowing through the first thermoelectric element 103 based on the temperature measured by the first temperature measurement means 203, and the second temperature measurement means And a second temperature control unit 906 for controlling a current flowing through the second thermoelectric element 104 based on the temperature measured by the unit 204.

  The first thermal conductor 101 and the second thermal conductor 102 have a large thermal conductivity such as a material such as copper, aluminum, and aluminum nitride, or a heat pipe or a material having anisotropy in thermal conductivity. Consists of materials that are very easy to conduct heat. A material having a high thermal conductivity refers to a material having a thermal conductivity of about 100 to 400 W / mK, for example.

  One surface of the first heat conductor 101 and the second heat conductor 102 is connected to the microchemical chip 301 shown in FIGS.

  According to FIGS. 1 and 2, the other surface of the first thermal conductor 101 is joined to one surface of the first thermoelectric element 103 through a solder, a thermal conductive adhesive, or the like so as to be able to conduct heat. Is fixed. In addition, the other surface of the second thermal conductor 102 is also soldered, thermally conductive adhesive, or the like on one surface of an appropriate number of second thermoelectric elements 104 according to the area of the second thermal conductor 102. It is joined and fixed through heat conduction. Furthermore, the heat exchanging means 105 is joined and fixed to the other surface of the first thermoelectric element 103 and the second thermoelectric element 104 so as to be capable of conducting heat via solder, a heat conductive adhesive, or the like.

Here, heat conduction is possible because the thermal resistance between the surfaces fixed by connection or bonding is extremely small in connection with heat conductive grease or heat conductive sheet, or bonding with solder or heat conductive adhesive. Means that. Specifically, it is desirable that the thermal resistivity is 1 × 10 ⁻⁴ m ² ° C./W or less.

  Thermally conductive grease is made of, for example, thermally conductive grease with improved thermal conductivity by mixing fine particles (fillers) of metals such as copper and aluminum or ceramics such as aluminum nitride, alumina and boron nitride with silicon grease. It is configured. The heat conductive sheet is made of, for example, a heat conductive sheet made of silicon resin or siloxane resin having elasticity in the thickness direction mixed with the fine particles (filler). Further, as the heat conductive adhesive, for example, an epoxy resin adhesive or a silicon resin adhesive mixed with the fine particles is used.

  Here, as the most characteristic structure of the present invention, the first thermal conductor 101 is surrounded by the second thermal conductor 102 through a minute gap. That is, the second heat conductor 102 is formed to have a shape that surrounds the entire periphery of the first heat conductor 101.

  At this time, each surface of the first thermal conductor 101 and the second thermal conductor 102 connected to the microchemical chip 301 has a shape in which both surfaces are simultaneously connected to the surface to which the microchemical chip 301 is connected. . As an example, assuming that the microchemical chip 301 has a plate shape having one plane, the surfaces of the first thermal conductor and the second thermal conductor connected to the microchemical chip 301 are on the same plane. The configuration. The effect of this structure will be described later with reference to FIG.

  Next, an example of the first thermal conductor 101, the second thermal conductor 102, the first temperature measuring means 203, and the second temperature measuring means 204 will be described. As shown in FIG. 2, in the present embodiment, the first temperature measuring means 203 is provided integrally with the first thermal conductor 101. Similarly, the second temperature measuring means 204 is provided integrally with the second heat conductor 102. In order to integrate each heat conductor and each temperature measuring means, each heat conductor has holes 201 and 202, and each temperature measuring means is inserted into each hole.

  The lead wires 205 and 206 of each temperature measuring means are drawn out from the hole portions 201 and 202 to the outside. The holes 201 and 202 are closed by filling with a heat conductive adhesive or the like, whereby the first temperature measuring means 203 and the second temperature measuring means 204 are replaced with the first heat conductor. 101 and the second thermal conductor 102 are respectively fixed. As described above, since each temperature measuring means is built in each heat conductor, each temperature measuring means is placed in the vicinity of each corresponding chemical reaction part of the microchemical chip 301 described later with reference to FIGS. Since they are connected, the temperature of each thermal conductor, that is, each chemical reaction part can be measured with high accuracy. Here, as each temperature measuring means, for example, a temperature sensor such as a thermistor, a platinum resistance temperature detector (Pt100Ω), or a thermocouple is used.

  In addition, each of these thermal conductors is provided between each thermoelectric element and the microchemical chip 301 and is excellent in thermal conductivity. Therefore, each thermal conductor of the microchemical chip 301 is connected. It has a function of reducing the temperature distribution variation of the portions, that is, the chemical reaction portions, and making the temperature of the chemical reaction portions uniform. Therefore, each temperature measuring means can measure the uniform temperature of each chemical reaction part.

  Each temperature measuring means may be made independent from each heat conductor without integrating each temperature measuring means with each heat conductor. In this case, each temperature measuring means may be installed on the surface in the vicinity of each chemical reaction part of the microchemical chip 301, for example, the upper surface of the microchemical chip 301, or may be configured to be built in the microchemical chip 301.

  That is, any configuration may be used as long as each temperature measuring unit can measure the temperature of each chemical reaction unit. Therefore, for example, a radiation thermometer that can measure the temperature in a non-contact manner may be installed as each temperature measuring means. In this case, the temperature of each chemical reaction part can be measured at a position away from the microchemical chip 301.

  A signal based on the temperature measured by each temperature measuring means is not shown in FIGS. 1 and 2, but is sent to each temperature control means (see FIGS. 8 and 9). Each temperature control means controls the current flowing through each thermoelectric element by PID control or the like based on the signal sent from each temperature measurement means so that the temperature measured by each temperature measurement means becomes a target value. . The configuration of each temperature control means will be described later with reference to FIGS.

  Next, an example of the microchemical chip 301 will be described. FIG. 3 is a perspective view showing an example of a microchemical chip 301 whose temperature is adjusted by the temperature adjusting device according to the present invention. Here, a conceptual example in which various analyzes and synthesis are performed by a chemical process inside the microchemical chip 301 is shown.

  The microchemical chip 301 is made of, for example, a material such as glass, resin, silicon, ceramics, semiconductor, or metal, and includes an inlet 302 for introducing a chemical into the microchemical chip, a conveyance path 303 for conveying the chemical, and various chemicals. Chemical reaction units 304, 305, 306, and 307 that perform the process, a recovery port 308 that recovers the reacted chemical solution, and the like are included.

  The introduction port 302, the conveyance path 303, the chemical reaction units 304, 305, 306, 307, and the recovery port 308 are formed inside or above the microchemical chip 301 by a fine processing method such as machining, chemical etching, or lithography. It is included.

  A chemical solution or the like is introduced into the microchemical chip 301 from the outside through the introduction port 302. In each chemical reaction section, various chemical processes such as storage, transportation, mixing, reaction, extraction, separation, concentration, and recovery are performed. In various chemical processes, for example, there are optimum temperature conditions for stable storage, rapid mixing, activation, increasing reaction rate, increasing reaction efficiency, stopping reaction and stabilizing. .

  For example, each of the chemicals A, B, C, D, E, and F introduced from the introduction port 302 is carried by the respective conveyance paths 303, and the chemicals A and B are transferred to the chemical reaction unit 304, and the chemicals C to the chemical reaction unit 305. And D are mixed and reacted in the chemical reaction unit 306 with the chemicals E and F, respectively. Then, the chemical solution reacted in the chemical reaction units 304, 305, and 306 is further mixed and reacted in the chemical reaction unit 307 and recovered at the recovery port 308.

  At this time, when the optimum temperature of the chemical reaction unit 305 is 37 ° C. and the temperature of the other chemical reaction units 304, 306, and 307 and the temperature of each conveyance path 303 are not desired to be heated, for example, in the enzyme reaction process In some cases, the enzyme is allowed to react at 37 ° C., which is the body temperature, in order to reproduce the reaction in the body.

  Here, the atmospheric temperature is a temperature around the microchemical chip when an experiment using the microchemical chip is performed. That is, when it is performed in the laboratory, it is the temperature of the air in the laboratory, and in the case of a constant temperature room or a sealed constant temperature region, it is the temperature of the air or gas therein.

  In such a case, when the ambient temperature (room temperature) is 25 ° C., adjusting the temperature of only the region of the chemical reaction portion 305 to 37 ° C. affects the temperature adjustment of the chemical reaction portion 305 to 37 ° C., which is different from the ambient temperature 25 ° C. The heat is conducted to the chemical reaction parts 304, 306, 307 and the conveyance path 303 in the peripheral area of the chemical reaction part 305, and gradually has a temperature distribution from 37 ° C. to 25 ° C. from the area close to the chemical reaction part 305. End up. That is, the temperatures of the chemical reaction units 304, 306, and 307 and the conveyance path 303 that are desired to be 25 ° C. cannot be set to 25 ° C.

  Therefore, when only the chemical reaction unit 305 is desired to be 37 ° C., the temperature of the chemical reaction unit 305 is adjusted to 37 ° C., and at the same time, the chemical reaction units 304, 306, 307 in the peripheral region adjacent to the chemical reaction unit 305 are transported. It is necessary to adjust the temperature of 303 to 25 ° C.

  By performing such two temperature adjustments, only the chemical reaction part 305 can be set to a temperature different from the ambient temperature.

FIG. 4 is a perspective view showing a correspondence relationship between each chemical reaction unit of the microchemical chip 301 shown in FIG. 3 and the temperature control device 106. The first thermal conductor 101 is disposed immediately below the chemical reaction unit 305 that adjusts the temperature to a temperature different from the atmospheric temperature, and the chemical reaction units 304, 306, and 307 that adjust the temperature to the atmospheric temperature, the conveyance path 303, and the like The second thermal conductor 102 is arranged immediately below the microchemical chip 301 and the thermal conductors are connected so as to be capable of conducting heat.

  Although not shown, each temperature measuring means is also integrated with each heat conductor, and the temperature of the chemical reaction unit 305 and the chemical reaction units 304, 306, and 307, which are peripheral regions of the chemical reaction unit 305, are conveyed. The temperature of the path 303 can be measured.

  FIG. 5 is a cross-sectional view in which the microchemical chip 301 is connected to the temperature control device 106 described in FIGS. The first heat conductor 101 is connected immediately below the chemical reaction unit 305, and the second heat conductor 102 is connected directly below the chemical reaction units 304 and 306. At this time, although not shown in the drawing, the second thermal conductor 102 is also connected directly below the chemical reaction unit 307 and the conveyance path 303.

  Here, by adjusting the temperature of the first thermal conductor 101 to a temperature different from the ambient temperature, the temperature of the neighboring region 501 to which the first thermal conductor 101 is connected so as to be thermally conductive can also be increased. The temperature is adjusted to about the same temperature. At this time, by simultaneously adjusting the temperature of the second thermal conductor 102 to the ambient temperature, the second thermal conductor 102 is connected to the peripheral region 502 so as to be able to conduct heat. The heat transmitted to the region 502 is canceled immediately below the peripheral region 502, and the temperature of the peripheral region 502 is adjusted to the ambient temperature. Further, since the outer side of the peripheral region 502 (the side far from the neighboring region 501) is in a gas having an ambient temperature, the ambient temperature is also maintained here.

  Here, the surface of the neighboring region 501 that is not temperature-controlled touches the ambient air at the ambient temperature to conduct heat, so that a slight temperature gradient occurs in the neighboring region 501, but the microchemical chip 301 is usually a thin plate. Therefore, the temperature gradient is almost within the allowable range and is very unlikely to cause a problem.

  As described above, the first thermoelectric element 103 for adjusting the temperature of the first thermal conductor 101 and the first thermal conductor 101, and the temperature of the second thermal conductor 102 and the second thermal conductor 102 are adjusted. By using the second thermoelectric element 104, it is possible to adjust the temperature of only the chemical reaction unit 305 to a temperature different from the ambient temperature.

  Next, an example of the first thermoelectric element 103 and the second thermoelectric element 104 will be described. Since the first thermoelectric element 103 and the second thermoelectric element constituting the temperature control device 106 according to the present invention have the same structure, an example of the first thermoelectric element 103 will be described. FIG. 6 is a cross-sectional view showing an example of the first thermoelectric element 103. In the thermoelectric element 103 shown in FIG. 6, p-type thermoelectric semiconductors 601 and n-type thermoelectric semiconductors 602 are arranged alternately and regularly. Then, both ends of each thermoelectric semiconductor 601 and 602 are connected to the adjacent thermoelectric semiconductors 602 and 601 via wiring electrodes 603. That is, a plurality of p-type thermoelectric semiconductors 601 and n-type thermoelectric semiconductors 602 are alternately electrically connected in series.

  The thermoelectric semiconductors 601 and 602 located at both ends of the serial connection body of the thermoelectric semiconductors 601 and 602 are connected to the extraction electrode 604, respectively. A lead wire 607 is connected to each extraction electrode 604. The serially connected body of thermoelectric semiconductors 601 and 602 having such a configuration is sandwiched between a pair of heat conductive plates 605 and 606, and the wiring electrode 603 and the extraction electrode 604 are joined to the heat conductive plates 605 and 606. .

  Of these heat conducting plates 605 and 606, one end is a hot junction and the other end is a cold junction. By changing the direction of the current flowing through the serial connection body of the thermoelectric semiconductors 601 and 602, either of the heat conducting plates 605 and 606 can be a hot junction or a cold junction.

  When a current is passed through the first thermoelectric element 103 so that one of the heat conduction plates 605 becomes a cold junction, and the object in contact with the heat conduction plate 605 is cooled, the heat absorbed by the cold junction and the first Joule heat generated by the current flowing through one thermoelectric element 103 is transmitted to the other heat conduction plate 606 side which becomes a hot junction. Therefore, on the side of the heat conduction plate 606 serving as a hot junction, heat is accumulated in the first thermoelectric element 103 and the temperature of the first thermoelectric element 103 is increased unless the transmitted heat is configured to be dissipated. End up. As a result, the temperature on the cold junction side increases.

  In addition, when a reverse current is passed through the first thermoelectric element 103 so that one heat conduction plate 605 side is used as a hot junction and an object in contact with the heat conduction plate 605 is heated, the other heat conduction is performed. The plate 606 side is a cold junction. For this reason, the temperature of the first thermoelectric element 103 is lowered unless the temperature is maintained by making the structure that gives the necessary heat to the first thermoelectric element 103 on the side of the heat conduction plate 606 serving as a cold junction. As a result, the temperature on the heat conduction plate 605 side to be heated is lowered.

  That is, in order to adjust the temperature by cooling or heating one end portion of the first thermoelectric element 103, the other end portion of the first thermoelectric element 103 can sufficiently exchange heat. Something like a heat sink is essential. Therefore, in the present embodiment, the heat exchanging means 105 is joined to the first thermoelectric element 103 by a heat conductive adhesive or the like so as to be able to conduct heat (see FIG. 1). The heat exchange means 105 will be described later with reference to FIG.

  Here, although not particularly limited, the material of the heat conductive plates 605 and 606 is a ceramic having good heat conductivity such as aluminum nitride and alumina. The material of the p-type thermoelectric semiconductor 601 is an alloy made of, for example, BiTeSb, and the material of the n-type thermoelectric semiconductor 602 is made of an alloy made of BiTeSe. However, as a thermoelectric material, it is not restricted to these, For example, various materials, such as another BiTe type | system | group, can be used according to a use.

  Under the condition that the heat exchanging means 105 can appropriately exchange excess or deficient heat, the first thermoelectric element 103 is controlled by reversing or adjusting the current flowing through the first thermoelectric element 103. Can maintain one surface at a constant temperature within a range of minus several tens of degrees Celsius to plus several hundreds of degrees Celsius. It is also possible to change the temperature at a certain speed. And when maintaining the temperature of one surface (surface near each chemical reaction part) of the 1st thermoelectric element 103 at a fixed temperature as mentioned above, it can adjust with the precision of about plus or minus 0.1 degreeC. Therefore, the temperature of each chemical reaction part can be adjusted with sufficiently high accuracy.

  In addition to the configuration shown in FIG. 6, the first thermoelectric element 103 is filled with a resin or the like between the p-type thermoelectric semiconductor 601 and the n-type thermoelectric semiconductor 602, and one or both of the heat conductive plates 605 and 606 are filled. It is good also as a structure which omitted. When the heat conductive plates 605 and 606 are omitted, for example, an insulating layer may be provided between the wiring electrode 603 and the first heat conductor 101 or between the wiring electrode 603 and the heat exchange means 105. . Further, by stacking a plurality of thermoelectric elements one above the other and using them together as one first thermoelectric element 103, the adjustable temperature range is further widened, and the temperature adjustment accuracy is further improved.

  Note that the structure of the second thermoelectric element 104 is similar to that of the first thermoelectric element 103, and thus the description of the second thermoelectric element 104 is omitted.

The size of each thermoelectric element used in the present embodiment is about several mm square, for example, about 1 to 3 mm square. In manufacturing such a small thermoelectric element, the manufacturing method described in Japanese Patent No. 3225049 by the present applicant can be applied. That is, by applying the manufacturing method described in Japanese Patent No. 3225049, a thermoelectric element having a size of about 1 to 3 mm square can be obtained. Therefore, a minute chemical reaction portion of about 1 to 3 mm square of the microchemical chip 301 is obtained. Can be locally heated or cooled, whereby the temperature of the minute chemical reaction part can be locally controlled.

  Note that the first thermoelectric element 103 and the heat conduction plate 605 (or the heat conduction plate 606) of the second thermoelectric element 104 formed in a shape surrounding the periphery of the first thermoelectric element 103 (a shape having a hole in the center). ) May also serve as each heat conductor. In this case, each temperature measuring means may be integrated with the heat conducting plate 605 (or heat conducting plate 606) also serving as each heat conductor, or each temperature measuring means may be integrated with the heat conducting plate 605 (or heat conducting plate 606). ).

  Next, an example of the heat exchange means 105 will be described. Fig.7 (a) is sectional drawing which shows the 1st example of the heat exchange means which comprises the temperature control apparatus 106 concerning this invention. As shown in FIG. 7A, the first example of the heat exchange means 105 is a heat sink having fins 701. In this case, the heat exchange means 105 exchanges heat with the surrounding air via the fins 701. In addition to the fins 701, a fan for forcibly exchanging heat may be attached. This first example is suitable when the temperature control range is not so wide because the structure is simple and compact.

  FIG.7 (b) is sectional drawing which shows the 2nd example of the heat exchange means which comprises the temperature control apparatus 106 concerning this invention. As shown in FIG. 7B, the second example of the heat exchanging means 105 includes a liquid bottle 702 connected to a thermostatic device 704 via a pipe 703, and uses the liquid flowing through the liquid bottle 702. It is configured to perform heat exchange. This second example is effective when the temperature adjustment range is wide and it is necessary to cool to minus tens of degrees Celsius.

  Next, an example of the first temperature control unit 806 will be described. FIG. 8 is a block diagram for explaining a control system of the first temperature control means constituting the temperature adjusting device 106 according to the present invention. As shown in FIG. 8, the first temperature control means 806 includes a temperature conversion circuit 801, a current control circuit 802, a power supply circuit 803 having an external outlet 804, and a console 805.

  In FIG. 8, the first temperature measuring means 203 is connected to the temperature conversion circuit 801 via the lead wire 205. The temperature conversion circuit 801 converts an electrical signal output from the first temperature measurement unit 203 into temperature information based on the temperature measured by the first temperature measurement unit 203. The current control circuit 802 is connected to the temperature conversion circuit 801. The current control circuit 802 performs feedback control of the temperature measured by the first temperature measuring unit 203, for example, temperature adjustment so that the measured temperature of the first temperature measuring unit 203 becomes a preset temperature. The direction of the current flowing through the first thermoelectric element 103 and the amount of current are controlled by commonly used PID control or the like. By performing such control, the measured temperature of the first temperature measuring means 203 can be kept within a temperature range of about plus or minus 0.1 ° C. with respect to the set temperature.

  The power supply circuit 803 transforms the commercial power supply voltage supplied from the outside via the external outlet 804 into a desired DC voltage and supplies the voltage to the current control circuit 802. The console 805 is connected to the current control circuit 802, and includes a display unit for displaying a real-time temperature, that is, a measured temperature and a set temperature of the first temperature measuring unit 203, a switch for changing settings, and the like.

Next, an example of the second temperature control unit 906 will be described. FIG. 9 is a block diagram for explaining a control system of the second temperature control means constituting the temperature adjusting device 106 according to the present invention. As shown in FIG. 9, the second temperature control unit 906 includes a temperature conversion circuit 901, a current control circuit 902, a power supply circuit 903 having an external outlet 904, and a console 905.

  In FIG. 9, the second temperature measuring means 204 is connected to the temperature conversion circuit 901 through a lead wire 206. The temperature conversion circuit 901 converts the electrical signal output from the second temperature measurement unit 204 into temperature information based on the temperature measured by the second temperature measurement unit 204. Similarly, the ambient temperature measuring means 907 for measuring the ambient temperature is connected to the temperature conversion circuit 901 via the lead wire 908. The temperature conversion circuit 901 simultaneously converts the electrical signal output from the ambient temperature measuring unit 907 into temperature information based on the measured ambient temperature of the ambient temperature measuring unit 907. The current control circuit 902 is connected to the temperature conversion circuit 901. The current control circuit 902 performs feedback control, for example, so that the measurement temperature of the second temperature measurement unit 204 becomes a preset ambient temperature or the same as the ambient temperature measured by the ambient temperature measurement unit 907. The direction and the amount of current flowing through the second thermoelectric element 104 connected by the connection wiring 909 are controlled by PID control or the like that is generally used when adjusting the temperature. By performing such control, the measured temperature of the second temperature measuring means 204 can be kept within a temperature range of about plus or minus 0.1 ° C. with respect to the ambient temperature.

  The power supply circuit 903 transforms the commercial power supply voltage supplied from the outside via the external outlet 904 into a desired DC voltage and supplies the voltage to the current control circuit 902. The console 905 is connected to the current control circuit 902, and changes the display and the setting for displaying the real-time temperature, that is, the measured temperature of the second temperature measuring unit 204 and the ambient temperature of the ambient temperature measuring unit 907. It has a switch etc.

  The second temperature control means 906 shown in FIG. 9 can adjust the temperature of the second heat conductor 102 to the predicted ambient temperature by predicting and setting the ambient temperature in advance. It is also possible to adjust the temperature of the second thermal conductor 102 to the same temperature as the measured ambient temperature. In addition, by setting the temperature different from the ambient temperature, the temperature of the second thermal conductor 102 can be adjusted to a temperature different from the ambient temperature.

  As described above, according to the first embodiment, the first thermal conductor 101 and the first thermoelectric element 103 that regulates the temperature of the first thermal conductor cause the chemical reaction unit 305 to be the ambient temperature. The chemical reaction portions 304, 306, and 307 in the peripheral region of the chemical reaction portion 305 are controlled by the second thermoelectric element 104 that adjusts the temperature to different temperatures and simultaneously adjusts the temperature of the second heat conductor 102 and the second heat conductor. In addition, the temperature of the conveyance path 303 can be adjusted to the atmospheric temperature, and as a result, only the chemical reaction unit 305 can be adjusted to a temperature different from the atmospheric temperature.

  In fact, the inventors of the present invention made a 1 mm × 1 mm first thermal conductor 101 having a size of 1 mm × 1 mm and a 3.2 mm × 1.2 mm hole in each thermoelectric element having a size of 1 mm × 1 mm. A sample of the temperature control device 106 in which the second thermal conductor 102 having a size of 3.2 mm is joined, and the gap between the first thermal conductor 101 and the second thermal conductor 102 is 0.1 mm. Created a device.

  Then, a several cm square microchemical chip 301 is connected to the sample device so as to be able to conduct heat, the temperature of the first heat conductor 101 is 37 ° C., and the temperature of the second heat conductor 102 is 25 ° C. of the ambient temperature. When set and controlled, both were able to adjust to the set temperature. From this experimental result, it was confirmed that it was possible to adjust the temperature of only a very narrow region of 1 mm × 1 mm in the microchemical chip 301.

[Second Embodiment]
FIG. 10 is a plan view schematically showing the configuration of the temperature control device according to the second embodiment of the present invention.

  As shown in FIG. 10, the temperature control apparatus of the second embodiment includes a plurality of first thermal conductors 101 and first thermoelectric elements 103, and includes a plurality of first thermal conductors 101 a and 101 b. The second thermal conductor 102 is provided in a shape that surrounds all of the two planar surfaces, and an appropriate number of second thermoelectric elements 104 is provided according to the area of the second thermal conductor 102, and a plurality of first thermoelectric elements A structure in which the plurality of thermal conductors 101a and 101b are independently adjusted to a temperature different from the ambient temperature by 103a and 103b, and the second thermal conductor 102 is adjusted to the ambient temperature by the second thermoelectric element 104. And

With this structure, when the microchemical chip 301 has a plurality of chemical reaction parts that adjust the temperature to a temperature different from the atmospheric temperature, only the plurality of chemical reaction parts are adjusted to individual temperatures, and the other parts are the atmosphere. Has the effect of maintaining the temperature.
[Third Embodiment]
FIG. 11: is sectional drawing which shows typically the structure of the temperature control apparatus concerning the 3rd Embodiment of this invention.

  As shown in FIG. 11, the temperature control device of the third embodiment includes a first thermal conductor 101, a second thermal conductor 102, a first thermoelectric element 103, a second thermoelectric element 104, and a first thermoelectric element 104. A third heat conductor 1101 having substantially the same shape as the first heat conductor, and a fourth heat conductor 1102 having substantially the same shape as the second heat conductor, A third thermoelectric element 1103, a fourth thermoelectric element 1104, and a second heat exchange means 1105 are provided on the upper side, arranged so that the first heat conductor and the third heat conductor face each other, and The second heat conductor and the fourth heat conductor are arranged to face each other, and the first heat conductor 101, the second heat conductor 102, the third heat conductor 1101, and the fourth heat conductor are arranged. One surface of each of the bodies 1102 is connected to both surfaces of the microchemical chip 301 so as to conduct heat. In addition, one surface of each thermoelectric element is joined to the other surface of each heat conductor so as to conduct heat, and heat exchange with the other surfaces of the first thermoelectric element 103 and the second thermoelectric element 104 is performed. The means 105 is joined so as to be able to conduct heat, and the other surfaces of the third thermoelectric element 1103 and the fourth thermoelectric element 1104 and the heat exchange means 1105 are joined so as to be able to conduct heat.

  Although not shown, each thermal conductor is provided with a temperature measuring means, and each temperature control means for controlling the current flowing through each thermoelectric element based on the temperature measured by each temperature measuring means. I have.

  In other words, the temperature control device of the third embodiment has two devices that are substantially the same as the temperature control device 106 described in the first embodiment, and the two devices are used to form both sides of the microchemical chip 301. It is arranged so as to be sandwiched from above and below or from left and right.

  Then, the first thermal conductor 101 and the third thermal conductor 1101 are adjusted to a temperature different from the ambient temperature, and the second thermal conductor 101 and the fourth thermal conductor 1102 are changed to the ambient temperature. Adjust the temperature to the same temperature.

Here, by adjusting the temperature of the first thermal conductor 101 and the third thermal conductor 1101 to the same temperature that is different from the ambient temperature, the first thermal conductor 101 and the third thermal conductor 1101 are both surfaces. The temperature of the neighboring region 501 connected so as to be able to conduct heat is adjusted to the same temperature from both sides simultaneously. At the same time, by adjusting the temperature of the second heat conductor 102 and the fourth heat conductor 1102 to the ambient temperature, the second heat conductor 102 and the fourth heat conductor 110 are adjusted.
The temperature of the peripheral region 502 where the two are connected to allow heat conduction on both sides is adjusted to the ambient temperature from both sides simultaneously.

  In the first embodiment, since one surface of the vicinity region 501 is exposed to the ambient temperature, heat is conducted to the surrounding air, and a slight temperature gradient (temperature unevenness) occurs in the vicinity region 501. When the thickness of the microchemical chip 301 is thin, the temperature gradient is within an allowable range, but when the thickness is several times thick, it may not be ignored. In the case of a chemical process that requires strict temperature control that does not allow even a slight temperature gradient, the temperature gradient may affect even if the microchemical chip 301 is thin.

  In the temperature control apparatus according to the third embodiment, the temperature in both the vicinity region 501 and the periphery region 502 is adjusted to the same temperature from both surfaces of the microchemical chip 301, and heat is not conducted from one surface to ambient air at ambient temperature. Therefore, even when the thickness of the microchemical chip 301 is large, there is an effect that the temperature gradient (temperature unevenness) in the neighboring region 501 can be minimized and the temperature can be precisely adjusted to a uniform temperature.

  This effect is particularly effective when the thickness of the microchemical chip is large relative to the area of both sides of the neighboring region 501 to be temperature controlled, that is, when the neighboring region 501 to be temperature controlled is very small relative to the thickness of the microchemical chip. There is a big effect.

Although not shown, the temperature adjustment of the second embodiment is similarly performed when the microchemical chip 301 has a plurality of chemical reaction units that adjust the temperature to a temperature different from the ambient temperature as in the second embodiment. By providing the apparatus above and below, the temperature of only the plurality of chemical reaction portions can be strictly adjusted to a uniform temperature, and the other portions can be maintained at the ambient temperature.
(Example)

  FIG. 12 is a diagram of an example showing the result of numerical calculation of the temperature distribution of the microchemical chip 301 according to the third embodiment by the finite element method.

  The finite element method was performed by finite element analysis software (ANSYS). In the finite element method, a simulation model shape is created on a computer, and material conditions such as thermal conductivity and a temperature boundary condition surface that gives a fixed temperature condition are set. As a result of calculation, a surface of the same temperature (computer In the screen display, the line) is output as an isothermal surface, and the temperature distribution in the model can be simulated.

  In FIG. 12, the thickness of the microchemical chip 301 is set to about five times the normal, the thermal conductivity of glass is given as the material of the microchemical chip 301, and the temperature boundary condition surfaces 1201, 1202, 1203, 1204, 1205, 1206 was set, the temperature boundary condition surfaces 1201 and 1204 were set to 37 ° C., the temperature boundary condition surfaces 1202, 1203, 1205 and 1206 were set to 25 ° C. (atmosphere temperature), and the temperature distribution was calculated.

As a result, the isothermal surfaces 1207, 1208, 1209, and 1210 were 34.6 ° C, 32.2 ° C, 29.8 ° C, and 27.4 ° C, respectively. Although the isothermal surface given by the actual calculation result is several times finer, it is omitted because it cannot be shown on the drawing. In this result, the temperature gradient in the region 1211 surrounded by the isothermal surface 1207 and the temperature boundary condition surfaces 1201 and 1204 corresponding to the neighboring region 501 to be temperature-adjusted is 0.1 in the calculation result obtained by further detailed simulation. It was less than ℃. That is, the temperature in the vicinity region 501 can be adjusted to a uniform temperature of less than 0.1 ° C.
(Comparative example)

  FIG. 13 shows, as a comparative example, the thickness of the microchemical chip 301 is set to the same thickness as the model of FIG. 12, and the temperature boundary condition surfaces 1201, 1202, and 1203 are 37 ° C., 25 ° C. (atmosphere temperature), and 25 ° C., respectively. (Atmosphere temperature), and one side (upper side) is the result of calculation under the condition that heat is conducted by ambient air (atmosphere temperature).

  Compared to FIG. 12, FIG. 13 clearly shows that the temperature gradient in the region 1211 corresponding to the neighboring region 501 where the temperature is adjusted is large. As a detailed calculation result, a temperature gradient of about 5.0 ° C. is generated. That is, it can be seen that in a microchemical chip having a thickness five times that of a normal one, if one side is exposed to air, a temperature gradient of 5 ° C. may occur in the vicinity region 501.

  As is apparent from the examples and comparative examples, in the third embodiment, the microchemical chip 301 having a thickness several times larger than usual and the neighboring region 501 for temperature adjustment are provided in the microchemical chip. It was found that there is an effect of suppressing the value of the temperature gradient to several tenths or less when the thickness is very small with respect to the thickness of the film.

  In the description of the third embodiment, by adjusting the first thermal conductor 101 and the third thermal conductor 1101 to the same temperature, the neighboring region 501 (chemical reaction portion) can be made to have a uniform temperature. Conversely, when it is necessary to generate a temperature gradient in the thickness direction of the microchemical chip 301 in the vicinity region, the temperature of the first heat conductor 101 and the third heat conductor 1101 is adjusted to different temperatures. Can be achieved.

  As described above, as is apparent from the description of the embodiment of the present invention, the temperature control device of the present invention has a structure in which the second heat conductor surrounds the first heat conductor and the first heat conductor. The temperature of the conductor is adjusted to a temperature different from the ambient temperature by the first thermoelectric element, and the target temperature is adjusted by the first thermal conductor to the ambient temperature by the second thermoelectric element. Only the chemical reaction part can be adjusted to a temperature different from the ambient temperature. Therefore, it is possible to freely adjust the temperature of only the region where the temperature of the microchemical chip needs to be adjusted, and integration of the microchemical chip capable of arbitrarily adjusting the temperature can be realized.

  As described above, the temperature control device according to the present invention is useful for a DNA chip, a protein analysis chip, a micro TAS, a lab-on-chip, a microreactor, and the like, and in particular, a target chemical reaction unit of the microchemical chip. It is particularly suitable for a temperature control device for a microchemical chip that is used when various chemical processes are performed by locally adjusting the temperature only to a temperature different from the ambient temperature.

It is the top view and sectional view which show typically the composition of the temperature control device concerning a 1st embodiment of the present invention. It is a perspective view which shows typically the structure of the temperature control apparatus concerning the 1st Embodiment of this invention. It is a perspective view which shows an example of the microchemical chip | tip temperature-controlled by the temperature control apparatus concerning this invention. It is a perspective view which shows the correspondence of each chemical reaction part of the microchemical chip shown in FIG. 3, and a temperature control apparatus. It is sectional drawing which connected the microchemical chip to the temperature control apparatus concerning the 1st Embodiment of this invention. It is sectional drawing which shows an example of the thermoelectric element which comprises the temperature control apparatus concerning this invention. It is sectional drawing which shows an example of the heat exchange means which comprises the temperature control apparatus concerning this invention. It is a block diagram for demonstrating the control system of the 1st temperature control means which comprises the temperature control apparatus concerning this invention. It is a block diagram for demonstrating the control system of the 2nd temperature control means which comprises the temperature control apparatus concerning this invention. It is a top view which shows typically the structure of the temperature control apparatus concerning the 2nd Embodiment of this invention. It is sectional drawing which connected the microchemical chip to the temperature control apparatus concerning the 3rd Embodiment of this invention. It is a figure showing the simulation result in the Example concerning the 3rd Embodiment of this invention. It is a figure showing the simulation result in the comparative example concerning the 3rd Embodiment of this invention. It is sectional drawing which connected the microchemical chip to the conventional temperature control apparatus.

Explanation of symbols

101, 101a, 101b First heat conductor 102 Second heat conductor 103, 103a, 103b First thermoelectric element 104 Second thermoelectric element 105 Heat exchange means 106 Temperature control device 201, 202 Hole 203 First Temperature measuring means 204 Second temperature measuring means 205, 206 Lead wire 301 Microchemical chip
302 Inlet 303 Transport path 304, 305, 306, 307 Chemical reaction part 308 Recovery port 501 Neighborhood area 502 Peripheral area 601 P-type thermoelectric semiconductor 602 N-type thermoelectric semiconductor 603 Wiring electrode 604 Lead electrode 605, 606 Thermal conduction plate 607 Lead wire 701 Fin 702 Liquid bottle 703 Piping 704 Temperature control device 801, 901 Temperature conversion circuit 802, 902 Current control circuit 803, 903 Power supply circuit 804, 904 External outlet 805, 905 Console 806, 906 Temperature control means 907 Atmospheric temperature measurement means 908 Lead wire 909 Connection wiring 1101 3rd thermal conductor 1102 4th thermal conductor 1103 3rd thermoelectric element 1104 4th thermoelectric element 1105 2nd heat exchange means 1201, 1202, 1203, 1204, 1205, 206 thermal boundary condition plane 1207,1208,1209,1210 isothermal surface 1211 region 1401 region

Claims (8)

A first thermal conductor made of a material having a high thermal conductivity;
First temperature measuring means disposed in the vicinity of the first thermal conductor and measuring the temperature of the first thermal conductor;
A first thermoelectric element having one surface connected to the first heat conductor so as to conduct heat;
First temperature control means for controlling a current flowing through the first thermoelectric element based on the temperature measured by the first temperature measurement means;
A second thermal conductor made of a material having a high thermal conductivity;
A second temperature measuring means disposed in the vicinity of the second heat conductor and measuring the temperature of the second heat conductor;
At least one second thermoelectric element having one surface connected to the second heat conductor so as to conduct heat; and
Second temperature control means for controlling a current flowing through the second thermoelectric element based on the temperature measured by the second temperature measurement means;
Heat exchange means joined and fixed to the other surface of the first thermoelectric element and the second thermoelectric element so as to conduct heat;
A temperature control device in which the periphery of the first thermal conductor is surrounded by the second thermal conductor via a minute gap.   The temperature control device according to claim 1, wherein there are a plurality of the first thermal conductors and the first thermoelectric elements.   The first temperature measuring means is provided inside the first heat conductor, or the second temperature measuring means is provided inside the second heat conductor. The temperature control device according to claim 1 or 2.   2. An atmosphere temperature measuring means for measuring the atmosphere temperature is provided, and the temperature of the second heat conductor is adjusted to be the same as the atmosphere temperature measured by the atmosphere temperature measuring means. The temperature control apparatus as described in any one of Claim 3. A third thermal conductor made of a material having a high thermal conductivity;
A third temperature measuring means disposed in the vicinity of the third heat conductor and measuring the temperature of the third heat conductor;
A third thermoelectric element having one surface connected to the third heat conductor so as to conduct heat;
Third temperature control means for controlling a current flowing through the third thermoelectric element based on the temperature measured by the third temperature measurement means;
A fourth thermal conductor made of a material having a high thermal conductivity;
A fourth temperature measuring means disposed in the vicinity of the fourth heat conductor and measuring the temperature of the fourth heat conductor;
At least one fourth thermoelectric element having one surface connected to the fourth heat conductor so as to conduct heat;
Fourth temperature control means for controlling a current flowing through the fourth thermoelectric element based on the temperature measured by the fourth temperature measurement means;
A second heat exchanging means fixed to the other surface of the third thermoelectric element and the fourth thermoelectric element so as to be thermally conductive and fixed;
The periphery of the third thermal conductor is surrounded by the fourth thermal conductor through a minute gap, and the first thermal conductor and the third thermal conductor face each other, The second thermal conductor and the fourth thermal conductor are arranged to face each other, and the first thermal conductor and the third thermal conductor are adjusted to the same temperature, The temperature control device according to claim 1, wherein the temperature of the second heat conductor and the fourth heat conductor are adjusted to the same temperature.   The temperature according to claim 5, wherein there are a plurality of the first thermal conductor, the first thermoelectric element, the third thermal conductor, and the third thermoelectric element. Adjusting device.   An ambient temperature measuring unit for measuring the ambient temperature is provided, and the temperature of both the second thermal conductor and the fourth thermal conductor is adjusted to be the same as the ambient temperature measured by the ambient temperature measuring unit. The temperature control device according to claim 5 or 6, wherein Whether the first temperature measuring means is provided inside the first thermal conductor, whether the second temperature measuring means is provided inside the second thermal conductor, or the third temperature measuring means. 6. The temperature measuring means is provided inside the third heat conductor, or the fourth temperature measuring means is provided inside the fourth heat conductor. The temperature control device according to any one of claims 7 to 9.

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