JP2006058434A - Photosensitive resin composition and cured object of the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To profitably provide a photosensitive resin composition excellent in photosensitivity, heat resistance, etc., and to economically provide a cured object of the same. <P>SOLUTION: The photosensitive resin composition contains a resin (A) soluble in an alkaline aqueous solution, a crosslinking agent (B), a photopolymerization initiator (C) and a curing agent (D), wherein the curing agent (D) is an epoxy resin varnish obtained by adding an organic solvent to a glyoxal-phenol condensate after glycidyl-etherification with an epihalohydrin. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a photosensitive resin composition using an epoxy resin varnish excellent in light transmittance as a curing agent component, and a cured product thereof using a compound having an epoxy carboxylate skeleton as a resin component. More specifically, it is useful as a solder resist for printed wiring boards, interlayer insulation materials for multilayer printed wiring boards, solder resists for flexible printed wiring boards, plating resists, photosensitive optical waveguides, etc., developability, heat resistance, thermal stability The present invention relates to a photosensitive resin composition that gives a cured product excellent in electrical insulation, adhesion, chemical resistance, and the like, and a cured product thereof.

A photosensitive resin composition using an epoxy carboxylate compound having photosensitivity is environmentally friendly, and its cured product is excellent in thermal and mechanical properties, and in an excellent balance of properties such as adhesion to a substrate. For this reason, it has been used in the fields of paints, coatings, adhesives and the like. Recently, it has been widely used in fields such as electrical / electronic component manufacturing applications and printed circuit board (wiring board) manufacturing applications, and its application range is expanding. However, along with the expansion of this application field, economics are being demanded together with the addition of functions such as higher heat resistance and adhesion.

With the aim of reducing the size and weight of mobile communication devices and improving the communication speed, printed circuit boards are required to have high precision and high density, and as a result, the demand for solder resists used in the manufacture of boards has become higher. It is required to have characteristics such as substrate adhesion, high insulation, and drug resistance while maintaining heat resistance and thermal stability higher than conventional ones. For example, Patent Document 1 discloses a novolac type epoxy resin and an unsaturated base. A solder mask composition composed of a photosensitive resin obtained by adding an acid anhydride to a reaction product of an acid, a photopolymerization initiator, a crosslinking agent, and an epoxy resin is disclosed in Patent Document 2 as light containing a urethane-modified vinyl ester resin. A polymerizable resin composition is described in Patent Literature 3 and Patent Literature 4 as tetraphenylethane derivative epoxidized products.

JP-A 61-243869 JP-A-9-52925 Japanese Patent Laid-Open No. 9-3162 JP 2004-10877 A

However, in the cured product of the solder mask composition described in Patent Document 1, sufficient heat resistance, adhesion, and chemical resistance cannot be obtained, and in the cured product of the photopolymerizable resin composition described in Patent Document 2, Sufficient heat resistance and adhesion are not obtained. Patent Document 3 and Patent Document 4 do not have a description as a photosensitive resin composition.
In addition, a commercially available solder resist ink uses a crystalline epoxy resin as a curing agent for stability during storage, but has a drawback of low solubility, and as a crystal due to crystallization or the like. In the case of taking out, it is not economical because there is a loss of yield when removing the non-crystalline component.
The object of the present invention is excellent in developability that can correspond to high functions of today's printed wiring boards, and a cured film obtained by heat curing in a post-curing (post-cure) process has sufficient heat resistance, The object is to economically provide a photosensitive resin composition suitable for a solder resist ink having excellent insulating properties, adhesion, chemical resistance, and the like, and a cured product thereof.

As a result of diligent research, the present inventors have found that the above problems can be solved by using an epoxy resin varnish as a curing agent and a compound having an epoxy carboxylate skeleton as an aqueous alkali-soluble resin. It came to be completed. That is, the present invention
(1) A photosensitive resin composition containing an aqueous alkali solution-soluble resin (A), a crosslinking agent (B), a photopolymerization initiator (C), and a curing agent (D), wherein the curing agent (D) is glyoxal A photosensitive resin composition characterized by being an epoxy resin varnish obtained by adding an organic solvent after glycidyl etherification of a condensate of phenols with epihalohydrin,
(2) A condensate of glyoxal and phenol is represented by the following formula (1)

The photosensitive resin composition according to (1), which contains 70% by weight or more of the compound represented by:
(3) The photosensitive resin composition according to (1) or (2), wherein the resin concentration in the organic solvent of the epoxy resin varnish is 40 to 90% by weight,
(4) The alkaline aqueous solution-soluble resin (A) reacts an epoxy compound (a) having two or more epoxy groups in the molecule with a monocarboxylic acid compound (b) having an ethylenically unsaturated group in the molecule. The photosensitive resin composition according to any one of (1) to (3), which is a reaction product of an epoxycarboxylate compound obtained in the above and a polybasic acid anhydride (c),
(5) A cured product of the photosensitive resin composition according to any one of (1) to (4),
(6) A substrate having a layer of the cured product according to (5),
(7) An article having the substrate according to (6),
About.

The photosensitive resin composition of the present invention has an economical manufacturing process, is excellent in tackiness, has excellent photosensitivity in the formation of a coating film obtained by curing by exposure to active energy rays such as ultraviolet rays, and is rare. Patterns can be formed by development with an aqueous alkaline solution, and the cured film obtained by thermosetting in the post-cure process is sufficiently satisfactory in heat resistance, chemical resistance (acid resistance, solvent resistance), etc. In particular, it is suitable as a photosensitive resin composition for printed wiring boards and a photosensitive resin composition for forming an optical waveguide.

The present invention will be described in detail below.
The photosensitive resin composition of the present invention comprises an alkaline aqueous solution-soluble resin (A), a crosslinking agent (B), a photopolymerization initiator (C), and a condensate of glyoxal and phenols after the glycidyl etherification with epihalohydrin. It contains a curing agent (D) which is an epoxy resin varnish obtained by adding.

The curing agent (D) contained in the photosensitive resin composition of the present invention is a glycidyl ether prepared by dissolving a condensate of glyoxal and phenols in epihalohydrin and adding an alkali metal compound such as sodium hydroxide or potassium hydroxide. This is an epoxy resin varnish obtained by washing with water, removing excess epihalohydrin and the like from the oil layer under heating and reduced pressure, and then adding an organic solvent. Examples of the epihalohydrin include epichlorohydrin, epibromohydrin, epiiodohydrin and the like, and epichlorohydrin is preferable.
Epoxy resin varnish (curing agent (D)) reacts by being heated with the carboxyl groups remaining in the resin coating after photocuring, and further has strong chemical resistance (acid resistance, solvent resistance, etc.). Contributes to providing a coating.

A condensate of glyoxal, which is a raw material of the epoxy resin varnish (curing agent (D)), and phenols can be obtained by condensing in a known manner under acidic conditions using glyoxal and the following phenols. Specific phenols include phenol, o-cresol, m-cresol, p-cresol, ethylphenol, n-propylphenol, isopropylphenol, t-butylphenol, octylphenol, nonylphenol, phenylphenol, cyclohexylphenol, xylenol, methyl. Examples include substituted phenols such as propylphenol, methylbutylphenol, allylphenol, and aminophenol, and halogen-substituted phenols such as brominated phenol. These phenol compounds may be used alone or in admixture of two or more. Good. In the present invention, the condensate of glyoxal and phenol is represented by the following formula (1)

It is preferable to use a condensate of glyoxal and a phenol containing 70% by weight or more of the component represented by Commercially available products such as TEP-DF (Asahi Organic Materials Industries Co., Ltd .; 1,1,2,2-tetrakis (4-hydroxyphenyl) ethane) can be used as the condensate of glioxal and phenols.

Glycidyl etherification of the condensate of glioxal and phenol can be performed by the following method. That is, the mixture of glyoxal and phenols and excess epihalohydrin is heated at a temperature of 20 to 120 ° C., and alkali metal hydroxides such as sodium hydroxide and potassium hydroxide are added all at once or in portions. Or it is made to react at the temperature of 20-120 degreeC for 0.5 to 10 hours, adding. In the reaction, an aqueous solution of the alkali metal hydroxide may be used. In this case, the aqueous solution is continuously added to the reaction mixture, and water and epihalohydrin are continuously distilled under reduced pressure or normal pressure. Further, after separation of water and epihalohydrin, water may be removed, and epihalohydrin may be continuously returned to the reaction mixture.

Further, a quaternary ammonium salt such as tetramethylammonium chloride, tetramethylammonium bromide, trimethylbenzylammonium chloride or the like is used as a catalyst in a dissolved mixture of glyoxal / phenols condensate and epihalohydrin. For 10 hours, add a solid or aqueous solution of an alkali metal hydroxide such as sodium hydroxide or potassium hydroxide to the halohydrin etherified product of the phenol resin, and again at a temperature between 20 and 120 ° C. Glycidyl etherification can also be carried out by reacting for 10 hours and dehydrohalogenating (ring closure). In this case, the amount of the quaternary ammonium salt used is in the range of 0.001 to 0.2 mol, preferably 0.05 to 0.1 mol, with respect to 1 equivalent of the hydroxyl group of the condensate of glyoxal and phenol. .

The amount of epihalohydrin that can be used in these reactions is about 0.8 to 20 mol, preferably about 1.0 to 10 mol, per 1 equivalent of hydroxyl group of the condensate of glyoxal and phenols. The amount of the alkali metal hydroxide used is about 0.8 to 1.5 mol, preferably about 0.9 to 1.1 mol, based on 1 equivalent of the hydroxyl group of the condensate of glyoxal and phenol. In order to make the reaction proceed smoothly, it is preferable to carry out the reaction by adding a solvent such as an alcohol such as methanol or ethanol, or an aprotic polar solvent such as dimethylsulfone or dimethylsulfoxide.

When using alcohol, the usage-amount is preferable 2 to 40 weight% with respect to the usage-amount of epihalohydrin, and 4 to 30 weight% is especially preferable. Moreover, when adding an aprotic polar solvent, the usage-amount is preferable 5-150 weight% with respect to the usage-amount of epihalohydrin, and 10-140 weight% is especially preferable.

After washing the reaction solution of the glycidyl etherification reaction of the condensate of glioxal and phenols, excess epihalohydrin, solvent, etc. are removed from the oil layer under heating and reduced pressure. Thereafter, an organic solvent is added to the obtained glycidyl etherified product, and the mixture is heated and stirred at 70 ° C. to 150 ° C., and after confirming that it has become a slurry, it is contained in the photosensitive resin composition of the present invention. The curing agent (D) which is an epoxy resin varnish is obtained. By adding a required amount of an organic solvent to a glycidyl etherified product of a condensate of glioxal and phenols, a component that is hardly soluble in the organic solvent is precipitated, so that the epoxy resin varnish (curing agent (D)) becomes a slurry. In addition, since the process such as crystallization is not performed, the yield loss is small and it is very economical.

  The organic solvent to be added to the epoxy resin varnish (curing agent (D)) may be one that is usually used for solder resist ink or the like. Specifically, ketones such as methyl ethyl ketone and cyclohexanone; toluene, xylene, tetra Aromatic hydrocarbons such as methylbenzene; ethylene glycol monoethyl ether, ethylene glycol monomethyl ether, ethylene glycol monobutyl ether, diethylene glycol monoethyl ether, diethylene glycol monomethyl ether, diethylene glycol monobutyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, Glycol ethers such as dipropylene glycol diethyl ether and triethylene glycol monoethyl ether; Acetates such as butyl acetate, ethylene glycol monoethyl ether acetate, ethylene glycol monobutyl ether acetate, diethylene glycol monoethyl ether acetate, diethylene glycol monobutyl ether acetate, propylene glycol monomethyl ether acetate, dipropylene glycol monomethyl ether acetate; ethanol, propanol, Examples include alcohols such as ethylene glycol and propylene glycol; aliphatic hydrocarbons such as octane and decane; petroleum solvents such as petroleum ether, petroleum naphtha, hydrogenated petroleum naphtha, and solvent naphtha. These organic solvents can be used alone or as a mixture of two or more.

The resin concentration in the organic solvent of the epoxy resin varnish (curing agent (D)) is preferably 40 to 90% by weight. When the concentration falls outside this range in the low concentration direction, problems such as the precipitation of difficultly soluble components become severe or all components of the epoxy resin dissolve, and when the concentration is outside the range, the glycidyl etherified product remains in a resinous state. This causes problems such as insufficient slurry formation and difficulty in handling.

  As a content rate of the hardening | curing agent (D) used for the photosensitive resin composition of this invention, 200% or less of the equivalent calculated from the solid content acid value and usage-amount of alkali aqueous solution resin (A) of this invention is used. An amount is preferred. If this amount exceeds 200%, the developability of the photosensitive resin composition of the present invention may be remarkably lowered, which is not preferable.

The epoxy resin varnish (curing agent (D)) may be mixed in advance with the resin composition, but it can also be used after being mixed before application to the printed wiring board.

  As the aqueous alkaline solution-soluble resin (A), for example, an epoxy compound (a) having two or more epoxy groups in the molecule and a monocarboxylic acid compound (b) having an ethylenically unsaturated group in the molecule are reacted. The reaction product of the epoxycarboxylate compound obtained by this and a polybasic acid anhydride (c) etc. are mentioned.

As the epoxy compound (a) having two or more epoxy groups in the molecule, an epoxy compound having an epoxy equivalent of 100 to 900 g / equivalent is particularly preferable. When the epoxy equivalent is less than 100 / equivalent, the molecular weight of the resulting aqueous alkali-soluble resin (A) is small and film formation may be difficult, or flexibility may not be obtained sufficiently, and the epoxy equivalent is 900 / equivalent. When exceeding, the introduction rate of the monocarboxylic acid compound (b) having an ethylenically unsaturated group is lowered, and the photosensitivity may be lowered.

  As the epoxy compound (a) having two or more epoxy groups in the molecule, glycidyl etherified product of bisphenol A (for example, Epicoat 828, Epicoat 1001 (both manufactured by Japan Epoxy Resins Co., Ltd.), UVR-6410 (Union) Carbide), DER-331 (Dow Chemical), YD-8125 (Toto Kasei)), glycidyl etherified product of bisphenol F (for example, UVR-6490 (Union Carbide) ), YDF-8170 (manufactured by Toto Kasei Co., Ltd.), etc.), glycidyl etherified product of phenol novolac (for example, Epicron N-770 (manufactured by Dainippon Ink and Chemicals)), DE N438 (Dow Chemical) ), Epicoat 154 (manufactured by Japan Epoxy Resin Co., Ltd.), RE-306 Nippon Kayaku Co., Ltd.))), glycidyl etherified product of cresol novolak (for example, Epicron N-695 (manufactured by Dainippon Ink and Chemicals), EOCN-102S, EOCN-103S, EOCN-104S (all Nippon Kayaku Co., Ltd.), UVR-6650 (Union Carbide), ESCN-195 (Sumitomo Chemical Co., Ltd.), etc.), bisphenol S, fluorene bisphenol, terpene diphenol, 4, 4'-biphenol, 2,2'-biphenol, 3,3 ', 5,5'-tetramethyl- [1,1'-biphenyl] -4,4'-diol, hydroquinone, resorcin, naphthalenediol, tris- (4-hydroxyphenyl) methane, 1,1,2,2-tetrakis (4-hydroxyphenyl) ethane, phenols Phenol, alkyl-substituted phenol, naphthol, alkyl-substituted naphthol, dihydroxybenzene, dihydroxynaphthalene, various bisphenols, etc.) and formaldehyde, acetaldehyde, glyoxal, benzaldehyde, p-hydroxybenzaldehyde, o-hydroxybenzaldehyde, p-hydroxyacetophenone, o-hydroxyacetophenone , Dicyclopentadiene, furfural, 4,4′-bis (chloromethyl) -1,1′-biphenyl, 4,4′-bis (methoxymethyl) -1,1′-biphenyl, 1,4-bis (chloro Methyl) benzene, 1,4-bis (hydroxymethyl) benzene, 1,4-bis (methoxymethyl) benzene, etc., compounds having a carbonyl group in the molecule, or hydroxymethyl in the molecule , Alkoxymethyl groups, halogenomethyl groups, or polycondensates with olefins and their modified products, halogenated bisphenols such as tetrabromobisphenol A, glycidyl ethers derived from alcohols, heterocyclic Epoxy resins (for example, TEPIC-L, TEPIC-H, TEPIC-S (all manufactured by Nissan Chemical Industries, Ltd.)), alicyclic epoxy resins (for example, EHPE-3150 (manufactured by Daicel Chemical Industries, Ltd.), etc.) And solid or liquid epoxy resins such as glycidyl ester epoxy resins, but are not limited thereto. These may be used alone or in combination of two or more. The epoxy compound can be obtained by, for example, glycidyl etherification using epihalohydrin.

Examples of the monocarboxylic acid compound (b) having an ethylenically unsaturated group in the molecule that can be used for the production of the alkaline aqueous solution-soluble resin (A) that is a constituent of the photosensitive resin composition of the present invention include acrylic acids and the like. Examples include crotonic acid, α-cyanocinnamic acid, cinnamic acid, or a reaction product of a saturated or unsaturated dibasic acid and an unsaturated group-containing monoglycidyl compound.

Examples of acrylic acids include (meth) acrylic acid, β-styrylacrylic acid, β-furfurylacrylic acid, reaction products of (meth) acrylic acid and ε-caprolactone, saturated or unsaturated dibasic acid anhydrides And a (meth) acrylate derivative having one hydroxyl group in one molecule and an equimolar reaction product of a half ester, a saturated or unsaturated dibasic acid and a monoglycidyl (meth) acrylate derivative. A certain half ester etc. are mentioned.

The monocarboxylic acid compound (b) having an ethylenically unsaturated group includes (meth) acrylic acid, (meth) acrylic acid and ε-caprolactone in terms of sensitivity to active energy rays when a photosensitive resin composition is used. The reaction product or cinnamic acid is preferred.

The polybasic acid anhydride (c) that can be used for the production of the aqueous alkaline solution-soluble resin (A) that is a constituent of the photosensitive resin composition of the present invention has one or more acid anhydride structures in the molecule. Any succinic anhydride, acetic anhydride, phthalic anhydride, pyromellitic anhydride, maleic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, ethylene glycol-bis (anhydrotrimethylene) can be used. Tate), glycerin-bis (anhydrotrimellitate) monoacetate, 1,2,3,4, -butanetetracarboxylic dianhydride, 3,3 ′, 4,4′-diphenylsulfonetetracarboxylic dianhydride 3,3 ′, 4,4′-benzophenonetetracarboxylic dianhydride, 3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride, 3,3 ′, 4 , 4′-diphenyl ether tetracarboxylic dianhydride, 2,2-bis (3,4-anhydrodicarboxyphenyl) propane, 2,2-bis (3,4-anhydrodicarboxyphenyl) hexafluoropropane, 5- (2,5-dioxotetrahydro-3-furanyl) -3-methylcyclohexene-1,2-dicarboxylic anhydride, 3a, 4,5,9b-tetrahydro-5- (tetrahydro-2,5-dioxo Preference is given to polybasic acid anhydrides selected from among -3-furanyl) -naphtho [1,2-c] furan-1,3-dione.

  The content of the alkaline aqueous solution-soluble resin (A) contained in the photosensitive resin composition of the present invention is usually 15 to 70% by weight when the solid content of the photosensitive resin composition is 100% by weight, Preferably, it is 20 to 60% by weight.

Examples of the crosslinking agent (B) contained in the photosensitive resin composition of the present invention include (meth) acrylates that may have a substituent. Examples of the crosslinking agent that can be used include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 1,4-butanediol mono (meth) acrylate, carbitol (meth) acrylate, acryloylmorpholine, Hydroxyl group-containing (meth) acrylates (for example, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 1,4-butanediol mono (meth) acrylate, etc.) and acid anhydrides of polycarboxylic acid compounds ( For example, succinic anhydride, maleic anhydride, phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, etc.) half-ester, polyethylene glycol di (meth) acrylate, tripropylene glycol di (meth) acrylate, G Di (meth) acrylates of ε-caprolactone adducts of methylolpropane tri (meth) acrylate, trimethylolpropane polyethoxytri (meth) acrylate, glycerin polypropoxytri (meth) acrylate, neobiglycol hydroxybivalate (e.g., Nippon Kayaku Co., Ltd., KAYARAD HX-220, HX-620, etc.), pentaerythritol tetra (meth) acrylate, poly (meth) acrylate of a reaction product of dipentaerythritol and ε-caprolactone, dipentaerythritol poly (meta) ) Acrylate, mono- or polyglycidyl compounds (eg butyl glycidyl ether, phenyl glycidyl ether, polyethylene glycol diglycidyl ether, polypropylene glycol diglycidyl ether) And 1,6-hexanediol diglycidyl ether, hexahydrophthalic acid diglycidyl ester, glycerin polyglycidyl ether, glycerin polyethoxyglycidyl ether, trimethylolpropane polyglycidyl ether, trimethylolpropane polyethoxypolyglycidyl ether) An epoxy (meth) acrylate which is a reaction product of (meth) acrylic acid can be used. The content ratio is usually 2 to 40% by weight, preferably 5 to 30% by weight, when the solid content of the photosensitive resin composition is 100% by weight.

  It does not specifically limit as a photoinitiator (C) contained in the photosensitive resin composition of this invention, The photoinitiator contained in a normal photosensitive resin composition can be used. Specific examples of the photopolymerization initiator (C) include benzoins such as benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin propyl ether, and benzoin isobutyl ether; acetophenone, 2,2-diethoxy-2-phenylacetophenone, 1, 1-dichloroacetophenone, 2-hydroxy-2-methyl-phenylpropan-1-one, diethoxyacetophenone, 1-hydroxycyclohexyl phenyl ketone, 2-methyl-1- [4- (methylthio) phenyl] -2-morpholinopropane Acetophenones such as -1-one; anthraquinones such as 2-ethylanthraquinone, 2-tert-butylanthraquinone, 2-chloroanthraquinone, 2-amylanthraquinone; 2,4-diethylthioxanthone, 2- Thioxanthones such as sopropylthioxanthone and 2-chlorothioxanthone; ketals such as acetophenone dimethyl ketal and benzyl dimethyl ketal; benzophenone, 4-benzoyl-4′-methyldiphenyl sulfide, 4,4′-bismethylaminobenzophenone, etc. And phosphine oxides such as 2,4,6-trimethylbenzoyldiphenylphosphine oxide and bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide. The addition ratio of these is usually 1 to 30% by weight, preferably 2 to 25% by weight, when the solid content of the photosensitive resin composition is 100% by weight.

  These photopolymerization initiators (C) can be used alone or as a mixture of two or more thereof, and further, tertiary amines such as triethanolamine and methyldiethanolamine, N, N-dimethylaminobenzoic acid ethyl ester, N, N -It can also be used in combination with a curing accelerator such as a benzoic acid derivative such as dimethylaminobenzoic acid isoamyl ester. The addition amount of these curing accelerators is preferably 100% by weight or less with respect to the photopolymerization initiator (C).

  The alkaline aqueous solution-soluble resin (A), which is a constituent component of the photosensitive resin composition of the present invention, has an epoxy compound (a) having two or more epoxy groups in the molecule and an ethylenically unsaturated group in the molecule. Reaction of an epoxycarboxylate compound having an alcoholic hydroxyl group obtained by reaction with a monocarboxylic acid compound (b) having (hereinafter referred to as first reaction) and a polybasic acid anhydride (c) (hereinafter referred to as second reaction) ) Can be obtained.

The first reaction is a solventless or solvent having no alcoholic hydroxyl group, specifically, for example, ketones such as acetone, ethylmethylketone, cyclohexanone, aromatic carbonization such as benzene, toluene, xylene, tetramethylbenzene, etc. Hydrogens, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, dipropylene glycol dimethyl ether, dipropylene glycol diethyl ether, triethylene glycol dimethyl ether, triethylene glycol diethyl ether and other glycol ethers, ethyl acetate, butyl acetate, methyl cellosolve acetate, ethyl Cellosolve acetate, butyl cellosolve acetate, carbitol acetate, diethylene glycol monoethyl ether acetate, propylene glycol Esters such as dimonomethyl ether acetate, dialkyl glutarate (eg, dimethyl glutarate), dialkyl succinate (eg, dimethyl succinate), dialkyl adipate (eg, dimethyl adipate), cyclic such as γ-butyrolactone It can be carried out in petroleum solvents such as esters, petroleum ether, petroleum naphtha, hydrogenated petroleum naphtha and solvent naphtha, and also in the above-mentioned crosslinking agent (B) alone or in a mixed organic solvent.

  The raw material charge ratio in this reaction is preferably 80 to 120 equivalent% of the monocarboxylic acid compound (b) having an ethylenically unsaturated group in the molecule with respect to 1 equivalent of the epoxy compound (a). When deviating from this range, gelation is caused during the second reaction, or the thermal stability of the finally obtained aqueous alkali-soluble resin (A) tends to be low.

  In the reaction, it is preferable to use a catalyst for promoting the reaction, and the amount of the catalyst used is 0.1 to 10% by weight based on the reaction product. The reaction temperature at that time is 60 to 150 ° C., and the reaction time is preferably about 5 to 60 hours. Specific examples of catalysts that can be used include triethylamine, benzyldimethylamine, triethylammonium chloride, benzyltrimethylammonium bromide, benzyltrimethylammonium iodide, triphenylphosphine, triphenylstibine, methyltriphenylstibine, chromium octoate, octane. Examples include zirconium acid.

  Moreover, it is preferable to use hydroquinone monomethyl ether, 2-methylhydroquinone, hydroquinone, diphenylpicrylhydrazine, diphenylamine, 3,5-di-tert-butyl-4hydroxytoluene, etc. as a thermal polymerization inhibitor. The amount of the thermal polymerization inhibitor used is usually 0.1 to 10% by weight based on the reaction product.

  The first reaction is carried out with appropriate sampling, and the end point is when the acid value is 1 mg · KOH / g or less, preferably 0.5 mg · KOH / g or less.

  The second reaction is an esterification reaction in which the polybasic acid anhydride (c) is added to the reaction solution and reacted after completion of the first reaction. The reaction can be carried out without a catalyst, but when a basic catalyst is used to promote the reaction, the amount used is preferably 10% by weight or less based on the reaction product. The reaction temperature is 40 to 120 ° C., and the reaction time is about 5 to 60 hours. In this case, a solvent or a thermal polymerization inhibitor as described above may be used.

  In the charged amount of each component, as the polybasic acid anhydride (c), it is preferable to add a calculated amount so that the solid content acid value of the aqueous alkali-soluble resin (A) is 50 to 150 mg · KOH / g. . When the solid content acid value is less than 50 mg · KOH / g, the solubility in an alkaline aqueous solution becomes insufficient, and remains as a residue when patterning is performed. In the worst case, patterning cannot be performed. On the other hand, when the solid content acid value exceeds 150 mg · KOH / g, the solubility in an alkaline aqueous solution becomes too high, and the photocured pattern may be peeled off.

  The alkaline aqueous solution-soluble resin (A) thus obtained can be isolated by removing the solvent by any of the methods depending on the solvent.

  The alkaline aqueous solution-soluble resin (A), which is a constituent of the photosensitive resin composition of the present invention, is soluble in an alkaline aqueous solution, but is also soluble in the solvent used in the above reaction. For example, it is possible to develop with various solvents.

  The photosensitive resin composition of the present invention is characterized in that it contains the alkaline aqueous solution-soluble resin (A), the crosslinking agent (B), the photopolymerization initiator (C), and the curing agent (D). In the photosensitive resin composition of the present invention, the alkaline aqueous solution-soluble resin (A), the crosslinking agent (B), the photopolymerization initiator (C), and the curing agent (D) are mixed in an arbitrary order, and 3 if necessary. It can be obtained by kneading with a roll mill or the like.

  Further, various additives known per se, for example, fillers such as talc, barium sulfate, calcium carbonate, magnesium carbonate, barium titanate, aluminum hydroxide, aluminum oxide, silica, clay, and aerosil Thixotropy imparting agents; coloring agents such as phthalocyanine blue, phthalocyanine green, and titanium oxide; silicone, fluorine leveling agents and antifoaming agents, polymerization inhibitors such as hydroquinone and hydroquinone monomethyl ether, etc., for the purpose of enhancing various performances of the composition. It may be added.

The photosensitive resin composition of the present invention can also be used as a dry film resist having a structure in which the resin composition is sandwiched between a support film and a protective film.

The photosensitive resin composition (liquid or film-like) of the present invention is useful as a resist material such as an insulating material between electronic components, an optical waveguide connecting optical components, a solder resist for printed circuit boards, and a coverlay. In addition, it can also be used as a color filter, printing ink, sealant, paint, coating agent, adhesive and the like.

The cured product of the present invention is obtained by curing the photosensitive resin composition of the present invention by irradiation with energy rays such as ultraviolet rays. Curing by irradiation with active energy rays such as ultraviolet rays can be performed by a conventional method. For example, in the case of irradiating ultraviolet rays, an ultraviolet generator such as a low-pressure mercury lamp, a high-pressure mercury lamp, an ultrahigh-pressure mercury lamp, a xenon lamp, or an ultraviolet light emitting laser (such as an excimer laser) may be used.

The cured product of the photosensitive resin composition of the present invention is used for, for example, a resist film, an interlayer insulating material for a build-up method, or an optical waveguide as a substrate for electrical, electronic, or optical use such as a printed board, an optoelectronic board, or an optical board. These substrates are also included in the present invention. Further, for example, articles such as computers, home appliances, and portable devices using these base materials are also included in the present invention.
The film thickness of the cured product layer is usually about 0.5 to 160 μm, preferably about 1 to 100 μm.

The manufacturing method of the printed wiring board using the photosensitive resin composition of this invention is shown. For example, the photosensitive resin composition solution (for example, carbitol acetate solution) of the present invention is used, and a screen printing method, a spray method, a roll coating method, an electrostatic coating method, a curtain coating method, etc. are applied to a printed wiring board. The film is applied at a film thickness of 5 to 160 μm by the above method, and the coating film is usually dried at a temperature of 50 to 110 ° C., preferably 60 to 100 ° C. Thereafter, the coating film is directly or indirectly irradiated with active energy rays such as ultraviolet rays with an intensity of about 10 to 2000 mJ / cm ² through a photomask having an exposure pattern such as a negative film, and the development to be described later is performed. Using the liquid, development is performed, for example, by spraying, rocking dipping, brushing, scrubbing, or the like. Thereafter, if necessary, further irradiation with ultraviolet rays is performed, and then heat treatment is usually performed at a temperature of 100 to 200 ° C., preferably 140 to 180 ° C., thereby being excellent in gold plating resistance, heat resistance, solvent resistance, and acid resistance. A printed wiring board having a permanent protective film satisfying various properties such as adhesion and flexibility can be obtained.

Examples of the developer used for the development include inorganic alkaline aqueous solutions such as potassium hydroxide, sodium hydroxide, sodium carbonate, potassium carbonate, sodium hydrogen carbonate, potassium hydrogen carbonate, sodium phosphate, potassium phosphate, and tetramethylammonium. Organic alkaline aqueous solutions such as hydroxide, tetraethylammonium hydroxide, tetrabutylammonium hydroxide, monoethanolamine, diethanolamine, and triethanolamine can be used. Moreover, you may use the organic solvent which can melt | dissolve the said photosensitive resin composition as a developing solution as needed.

EXAMPLES Hereinafter, although an Example demonstrates this invention further in detail, this invention is not limited to these Examples. In addition, in a synthesis example, an Example, and a comparative example, a part means a weight part. The melt viscosity was measured under the following conditions.
Melting point: DSC method Seiko Instruments Inc. EXSTAR6000 made
Measurement sample 2 mg to 5 mg Temperature rising rate 10 ° C./min.
-Epoxy equivalent Measured by a method according to JIS K-7236, the unit is g / eq. It is.

Synthesis example 1
In a 3 L flask equipped with a stirrer and a reflux tube, EOCN-103S (manufactured by Nippon Kayaku Co., Ltd., epoxy equivalent: 215 g / eq.) As an epoxy compound (a) having two or more epoxy groups in the molecule. ), 860 parts of acrylic acid (molecular weight: 72.06) as a monocarboxylic acid compound (b) having an ethylenically unsaturated group in the molecule, 492 parts of carbitol acetate as a reaction solvent, heat 4.9 parts of 2,6-di-tert-butyl-p-cresol as a polymerization inhibitor and 4.9 parts of triphenylphosphine as a reaction catalyst were charged, and the acid value of the reaction liquid was set at a temperature of 98 ° C. It was made to react until it became 5 mg * KOH / g or less, and the epoxy carboxylate compound was obtained.
Next, 170 parts of diethylene glycol monoethyl ether acetate (CA) as a reaction solvent was added to this reaction liquid, and 202 parts of tetrahydrophthalic anhydride was added as a polybasic acid anhydride (c) and reacted at 95 ° C. for 4 hours. A resin solution containing 67% by weight of the soluble resin (A) was obtained (this solution is referred to as A-1). When the acid value was measured, it was 69.4 mg · KOH / g (solid content acid value: 103.6 mg · KOH / g).

Synthesis example 2
While performing a nitrogen gas purge on a flask equipped with a thermometer, a condenser, and a stirrer, TEP-DF (produced by Asahi Organic Materials Co., Ltd., 1,1,2,2-tetrakis ( 4-hydroxyphenyl) ethane, molecular weight: 398.45), 498 parts, epichlorohydrin (molecular weight: 92.53) as epihalohydrin, 2313 parts, and 199 parts of methanol as solvent were dissolved. The mixture was heated to 70 ° C. and 202 parts of flaky sodium hydroxide (molecular weight: 40) were added in portions over 100 minutes, followed by reaction at 70 ° C. for 60 minutes, and then at 75 ° C. for 60 minutes. After completion of the reaction, after washing once with 650 parts of water and twice with 1300 parts of water, excess epichlorohydrin and methanol were distilled off from the resulting organic layer under heating and reduced pressure. The reaction solvent CA654 parts was added to 654 parts (yield 84%) of the obtained glycidyl ether compound, stirred at 130 ° C., confirmed to be in the form of a slurry, cooled to room temperature, and epoxy resin varnish (cured) Agent (D1), an epoxy equivalent of solid content of 178 g / eq., And a resin concentration of 50% by weight).

Synthesis example 3
While performing a nitrogen gas purge on a flask equipped with a thermometer, a condenser, and a stirrer, TEP-DF (produced by Asahi Organic Materials Co., Ltd., 1,1,2,2-tetrakis ( 4-hydroxyphenyl) ethane, molecular weight: 398.45), 498 parts, epichlorohydrin (molecular weight: 92.53) as epihalohydrin, 2313 parts, and 199 parts of methanol as solvent were dissolved. The mixture was heated to 70 ° C. and 202 parts of flaky sodium hydroxide (molecular weight: 40) were added in portions over 100 minutes, followed by reaction at 70 ° C. for 60 minutes, and then at 75 ° C. for 60 minutes. After completion of the reaction, after washing once with 650 parts of water and twice with 1300 parts of water, excess epichlorohydrin and methanol were distilled off from the resulting organic layer under heating and reduced pressure. Add 271 parts of the reaction solvent CA to 633 parts (yield 81%) of the resulting glycidyl ether compound, stir at 130 ° C., confirm that the slurry is in the form of a slurry, cool to room temperature, and epoxy resin varnish (cured) Agent (D2), epoxy equivalent of solid content 178 g / eq., Resin concentration 70 wt%).

Synthesis example 4
While performing a nitrogen gas purge on a flask equipped with a thermometer, a condenser, and a stirrer, TEP-DF (produced by Asahi Organic Materials Co., Ltd., 1,1,2,2-tetrakis ( 4-hydroxyphenyl) ethane, molecular weight: 398.45), 498 parts, epichlorohydrin (molecular weight: 92.53) as epihalohydrin, 2313 parts, and 199 parts of methanol as solvent were dissolved. The mixture was heated to 70 ° C. and 202 parts of flaky sodium hydroxide (molecular weight: 40) were added in portions over 100 minutes, followed by reaction at 70 ° C. for 60 minutes, and then at 75 ° C. for 60 minutes. After completion of the reaction, after washing once with 650 parts of water and twice with 1300 parts of water, excess epichlorohydrin and methanol were distilled off from the resulting organic layer under heating and reduced pressure. The reaction solvent CA169 part was added to 677 parts (yield 87%) of the obtained glycidyl etherified product, stirred at 130 ° C., confirmed to be in a slurry state, cooled to room temperature, and epoxy resin varnish (cured) Agent (D3), epoxy equivalent of solid content 178 g / eq., Resin concentration 80 wt%).

Comparative Synthesis Example TEP-DF (manufactured by Asahi Organic Materials Co., Ltd., 1,1,2,2) was used as a condensate of glyoxal and phenols while performing nitrogen gas purging on a flask equipped with a thermometer, a condenser, and a stirrer. -300 parts of tetrakis (4-hydroxyphenyl) ethane, molecular weight: 398.45), 1110 parts of epichlorohydrin (molecular weight: 92.53) as epihalohydrin, and 240 parts of methanol as solvent were dissolved. The mixture was heated to 70 ° C., 120 parts of flaky sodium hydroxide (molecular weight: 40) was added in portions over 100 minutes, and the mixture was further reacted at 70 ° C. for 60 minutes. After completion of the reaction, after washing twice with 450 parts of water, excess epichlorohydrin and methanol were distilled off from the resulting organic layer under heating and reduced pressure, and 1500 parts of methyl isobutyl ketone was added to the residue under reflux conditions. It melt | dissolved below, it cooled gradually to 4 degreeC, and left still as it was for 24 hours. The obtained crystals were filtered and dried to obtain 294 parts of the desired curing agent (EP1) (epoxy equivalent 165 g / eq., Melting point 174 ° C., yield 63%) as colorless crystals.

Examples 1-3, Comparative Example 1
Resin solution (A-1) obtained in Synthesis Example 1 and epoxy resin varnish (curing agents (D1) to (D3)) obtained in Synthesis Examples 2 to 4 and crystals obtained in Comparative Synthesis Examples The curing agent (EP1) was mixed at a blending ratio shown in Table 1, and kneaded with a three-roll mill as necessary to obtain a photosensitive resin composition of the present invention. This was applied to a printed circuit board by a screen printing method so that the dry film thickness was 15 to 25 μm, and the coating film was dried with a hot air dryer at 80 ° C. for 30 minutes. Subsequently, ultraviolet rays were irradiated through a mask on which a circuit pattern was drawn using an ultraviolet exposure device (Oak Manufacturing Co., Ltd., model HMW-680GW). Thereafter, spray development was performed with a 1% by weight aqueous sodium carbonate solution to remove the resin in the non-irradiated part. After washing with water and drying, the printed circuit board was subjected to a heat curing reaction in a hot air dryer at 150 ° C. for 60 minutes to obtain a cured film. The coating film was tested for tackiness, developed and developed for development, and the cured product was tested for photosensitivity, solvent resistance, acid resistance and heat resistance. The results are shown in Table 2. The test method and evaluation method are as follows.

(Tackiness) Absorbent cotton was rubbed onto the dried coating film applied to the substrate to evaluate the tackiness of the coating film.
○ ··········································································································.

(Developability) Development was carried out by the above method, and the following evaluation criteria were used.
○ ··· Visually no residue Δ · · · Visually somewhat residual × · · · Visually much residue

(Photosensitivity) Step tablet 21 (manufactured by Kodak Co., Ltd.) is brought into close contact with the dried coating film and irradiated with ultraviolet rays with an integrated light amount of 500 mJ / cm ² . Next, the film was developed with a 1% by weight aqueous sodium carbonate solution for 60 seconds at a spray pressure of 2.0 kg / cm ² , and the number of stages of the coating film remaining undeveloped was confirmed and evaluated according to the following criteria.
○ ・ ・ ・ ・ 7 steps or more △ ・ ・ ・ 4 to 6 steps × ・ ・ ・ 3 steps or less

(Solvent resistance) The test piece is immersed in isopropyl alcohol at room temperature for 30 minutes. After confirming that there was no abnormality in the external appearance, a peeling test with cello tape (registered trademark) was conducted, and evaluation was performed according to the following criteria.
○ ··· There is no abnormality in the appearance of the coating film, and there is no blistering or peeling. △ ··· There is no peeling in the coating film, and there is a slight swelling.

(Acid resistance) The test piece is immersed in a 10% hydrochloric acid aqueous solution at room temperature for 30 minutes. After confirming that there was no abnormality in the external appearance, a peeling test with cello tape (registered trademark) was conducted, and evaluation was performed according to the following criteria.
○ ··· There is no abnormality in the appearance of the coating film, and there is no blistering or peeling.

(Heat resistance) A rosin-based plax was applied to a test piece and immersed in a solder bath at 260 ° C. for 5 seconds. This was defined as 1 cycle and repeated 3 cycles. After being allowed to cool to room temperature, a peeling test with Cellotape (registered trademark) was conducted, and the following criteria were evaluated.
○ · · · There is no abnormality in the appearance of the coating film, and there is no swelling or peeling. △ · · · The coating film has a slight swelling or peeling × · · · · The coating film has swelling or peeling.

Table 1
Note Example 1 Example 2 Example 3 Comparative Example 1
Resin solution A-1 51.80 51.80 51.80 51.80
Cross-linking agent (B)
DPHA * 1 3.38 3.38 3.38 3.38
Photopolymerization initiator (C)
Irgacure 907 * 2 4.50 4.50 4.50 4.50
DETX-S * 3 0.45 0.45 0.45 0.45
Curing agent Curing agent (D1) 35.24
Curing agent (D2) 25.17
Curing agent (D3) 22.03
Curing agent (EP1) 17.62
Thermosetting catalyst Melamine 1.00 1.00 1.00 1.00
Filler Barium sulfate 15.15 15.15 15.15 15.15
Phthalocyanine blue 0.45 0.45 0.45 0.45
Additive BYK-354 * 4 0.39 0.39 0.39 0.39
KS-66 * 5 0.39 0.39 0.39 0.39
Solvent CA 4.87

note)
* 1 Nippon Kayaku Co., Ltd .: Dipentaerythritol polyacrylate * 2 Vantico Corporation: 2-methyl-1- [4- (methylthio) phenyl] -2-morpholinopropan-1-one * 3 Nippon Kayaku ( Co., Ltd .: 2,4-diethylthioxanthone * 4 Bick Chemie Co., Ltd .: Leveling agent * 5 Shin-Etsu Chemical Co., Ltd .: Antifoaming agent

Table 2
Example 1 Example 2 Example 3 Comparative Example 1
Evaluation item tackiness ○ ○ ○ ○
Developability ○ ○ ○ ○
Photosensitivity ○ ○ ○ ○
Solvent resistance ○ ○ ○ ○
Acid resistance ○ ○ ○ ○
Heat resistance ○ ○ ○ ○

As is apparent from the above results, the photosensitive resin composition of the present invention is obtained by curing an epoxy resin varnish, which is a mixture of a glycidyl etherified product of a condensate of glyoxal and phenol represented by the formula (1), and an organic solvent. As a curing agent, the loss of curing agent yield is less than when glycidyl etherified product (low yield) of crystalline glyoxal and phenol condensates is used as a curing agent, and the process is simple. In addition to the advantages that can be achieved, all of the evaluation items showed almost the same good results. Therefore, it is clear that the photosensitive resin composition of the present invention is a photosensitive resin composition for printed circuit boards that is highly sensitive and excellent in heat resistance and is more economical.

Claims (7)

In the photosensitive resin composition containing an alkaline aqueous solution-soluble resin (A), a crosslinking agent (B), a photopolymerization initiator (C), and a curing agent (D), the curing agent (D) is composed of glyoxal and phenols. A photosensitive resin composition, which is an epoxy resin varnish obtained by adding an organic solvent after glycidyl etherification of a condensate with epihalohydrin. The condensate of glyoxal and phenol is represented by the following formula (1)

The photosensitive resin composition of Claim 1 containing 70 weight% or more of compounds represented by these. The photosensitive resin composition of Claim 1 or Claim 2 whose resin concentration in the organic solvent of an epoxy resin varnish is 40 to 90 weight%. An aqueous alkaline solution-soluble resin (A) is obtained by reacting an epoxy compound (a) having two or more epoxy groups in the molecule with a monocarboxylic acid compound (b) having an ethylenically unsaturated group in the molecule. The photosensitive resin composition according to any one of claims 1 to 3, which is a reaction product of an epoxycarboxylate compound and a polybasic acid anhydride (c). Hardened | cured material of the photosensitive resin composition as described in any one of Claims 1 thru | or 4. The base material which has the layer of the hardened | cured material of Claim 5. An article comprising the substrate according to claim 6.