JP2006030585A - Thin film member, micro-actuator, optical device, and optical switch - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a thin film member for quickly separating the thin film member from a fixing part while enhancing rigidity of a prescribed region. <P>SOLUTION: A movable plate 12 is the thin film member composed of a thin film. A movable plate 10 is supported with the fixing part to be moved to the fixing part, and is changed over to a pushing state pushed to the fixing part and a state which is separated from the fixing part. The movable plate 10 includes a projection planar part 50 having a height relatively near to the fixing part in a region R enhancing rigidity, a recess planar part 51 substantially parallel to the projection planar part 50 and having a height far from the fixing part as compared with the projection planar part 50, and a level difference side wall part 52 for forming a level difference between the projection planar part 50 and the recess planar part 51. The large part of an outside circumference of the recess planar part 51 is surrounded with the outside projection planar part 50, and the remaining part (in the neighborhood of M1-M16) of the outside circumference of the recess planar part 51 is not surrounded with the projection planar part 50. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a thin film member used in, for example, a MEMS (Micro-Electro-Mechanical System), and a microactuator, an optical device, and an optical switch using the thin film member. The optical device and the optical switch can be used in, for example, an optical communication device or an optical transmission device.

  For example, in MEMS, a thin film member that constitutes at least a part of a movable part that is supported by a fixed part and moves relative to the fixed part, and at least a part of the thin film member is pressed against the fixed part. A thin film member that can be switched between a state and a state of being separated from the fixed portion may be used.

  For example, Patent Documents 1 and 2 below disclose an optical switch using a microactuator using such a thin film member. The microactuator includes a fixed portion and a movable portion that is supported by the fixed portion and can move with respect to the fixed portion. Patent Document 1 discloses a type of microactuator in which the movable part has a cantilever structure (for example, FIG. 26 and FIGS. 36 to 40 of Patent Document 1). A type of microactuator (for example, FIGS. 2 to 4 of Patent Document 2) is disclosed. In these microactuators, the movable part has an elastic part (for example, a leaf spring part constituting a beam part in a microactuator having a cantilever structure and a flexure part in a microactuator having a both-ends structure). And it can move with respect to the substrate according to the deformation of the elastic portion.

  In each optical switch disclosed in Patent Documents 1 and 2, the support structure of the mirror is different, but in any of the optical switches, the movable part is formed of a thin film to be a thin film member, and the mirror support in the movable part A mirror is mounted in a region to be a substrate perpendicular to the surface. In these optical switches, the mirror is driven by the microactuator to move up and down, and light travels straight when the mirror exits the incident optical path, while light is reflected by the mirror when the mirror enters the incident optical path. As a result, the outgoing optical path is switched. At the time of switching the emission optical path, the thin film member is switched between a pressing state in which a portion to be a mirror support substrate is pressed against the fixing portion and a state in which the portion is separated from the fixing portion.

In the optical switch disclosed in Patent Document 1, in order to stably support the mirror, a step is formed by providing a concavo-convex shape in a region to be a mirror support substrate in the thin film member. This increases the rigidity of the region. In the optical switch disclosed in Patent Document 2, the region to be a mirror support substrate in the thin film member is simply formed in a flat plate shape, and this region is not provided with an uneven shape, but to support the mirror stably. In the same manner as in the optical switch disclosed in Patent Document 1, it is preferable to provide a concavo-convex shape to a region to be a mirror support substrate in the thin film member.
International Publication No. 03/060592 Pamphlet JP 2003-159698 A

  However, in the thin film member used in the optical switch disclosed in Patent Document 1, the uneven shape is given as follows. That is, the concave portion that is concave on the fixed portion side is completely surrounded by the convex portion that is convex on the fixed portion side, and at least a part of the convex portion around the concave portion is in contact with the fixed portion in the pressed state. As a result, the space formed by the concave portion and the fixed portion is a closed space or a state close thereto.

  Therefore, in the pressed state, the concave portion and its vicinity perform an action similar to a suction cup, and thereby a relatively large adsorption force acts between the thin film member and the fixed portion in the pressed state. As a result, it took time to separate the thin film member from the fixed portion from the pressed state, and the thin film member could not be quickly separated from the fixed portion. In addition, as a result of the inventor's research, the reason why the suction force is relatively large is that the concave portion and the vicinity thereof perform an action similar to a suction cup.

  As described above, the thin film member used in the microactuator of the optical switch has been described as an example, but the situation described above is the same for the thin film member for other uses.

  The present invention has been made in view of such circumstances, and is a thin film member that constitutes at least a part of a movable portion that is supported by a fixed portion and moves with respect to the fixed portion, In a thin film member that can be switched between a pressed state in which a part is pressed against the fixed part and a state in which the part is separated from the fixed part, the thin film member can quickly separate the thin film member from the fixed part while increasing the rigidity of a predetermined region. The purpose is to provide. It is another object of the present invention to provide a microactuator, an optical device, and an optical switch using such a thin film member.

  In order to solve the above-described problem, the thin film member according to the first aspect of the present invention is a thin film member that constitutes at least a part of a movable part that is supported by a fixed part and moves relative to the fixed part. In the thin film member that is switched between a pressed state in which at least a part of the member is pressed against the fixed portion and a state in which the member is pulled away from the fixed portion, (i) having a concavo-convex shape on the fixed portion side in a predetermined region, In the predetermined region, a convex portion that is convex toward the fixed portion, and a concave portion that is concave toward the fixed portion, and (ii) a part of the convex portion and the fixed portion in the pressed state Regardless of whether or not there is a gap between them, the space formed by the concave portion and the fixed portion in the pressed state is configured to communicate with the outside from other than the gap.

  The thin film member according to a second aspect of the present invention is the thin film member according to the first aspect, wherein an opening for communicating the space with the outside is formed in a part of the side wall of the recess.

  The thin film member according to a third aspect of the present invention is the thin film member according to the first or second aspect, wherein an opening for communicating the space to the outside is formed in a part of the bottom portion of the recess.

  A thin film member according to a fourth aspect of the present invention is a thin film member that constitutes at least a part of a movable part that is supported by a fixed part and moves relative to the fixed part, wherein at least a part of the thin film member is the above-mentioned In the thin film member that is switched between a pressed state pressed against the fixed portion and a state separated from the fixed portion, (i) a convex flat portion that is a flat portion having a height relatively close to the fixed portion, the convex A concave planar portion that is a planar portion that is substantially parallel to the planar portion and has a height farther from the fixed portion than the convex planar portion, and the convex planar portion and the concave planar portion. (Ii) the pressing state regardless of whether or not a gap is formed between a part of the convex portion and the fixing portion in the pressing state. In the concave planar shape And in which a space formed between the fixed portion is configured to communicate with the outside from other than the gap.

  The thin film member according to a fifth aspect of the present invention is the thin film member according to the fourth aspect, wherein (i) at least a part of the outer periphery of the concave planar portion is substantially the same as viewed from the height direction. The convex planar part and the concave planar part are arranged so as not to be surrounded by the convex planar part, and (ii) a space formed between the concave planar part and the fixing part in the pressing state However, it communicates with the outside from between the at least part of the outer periphery of the concave planar portion and the fixing portion.

  The thin film member according to a sixth aspect of the present invention is the thin film member according to the fifth aspect, wherein (i) the entire outer periphery of the concave planar portion is the convex plane in a plan view as viewed substantially from the height direction. The convex planar portion and the concave planar portion are arranged such that the entire outer periphery of the convex planar portion is surrounded by the concave planar portion and is not surrounded by the convex portion, and (ii) A space formed between the concave planar portion and the fixed portion in the pressed state communicates with the outside from between the entire outer periphery of the concave planar portion and the fixed portion.

  A thin film member according to a seventh aspect of the present invention is the thin film member according to the fifth aspect, wherein (i) a large portion of the outer periphery of the concave planar portion is substantially convex in plan view as viewed substantially from the height direction. (Ii) the convex planar portion and the concave planar portion are arranged so that the remaining portion around the outside of the concave planar portion is not surrounded by the convex planar portion while being surrounded by the planar portion; A space formed between the concave planar portion and the fixing portion in the pressed state communicates with the outside through an opening between the remaining portion around the outer side of the concave planar portion and the fixing portion. Is.

  The thin film member according to an eighth aspect of the present invention is the thin film member according to the seventh aspect, wherein the openings are present at two or more locations, and the openings are in the predetermined direction on both sides of the predetermined direction of the continuous region of the concave planar portion. It is not located in the two places opposite to.

  The thin film member according to the ninth aspect of the present invention is the thin film member according to the seventh or eighth aspect, wherein the concave planar portion has substantially the same height in each portion.

  The thin film member according to a tenth aspect of the present invention is the thin film member according to the seventh or eighth aspect, wherein (i) the concave planar portion has a first portion and a second portion having different heights, (Ii) a second step side wall portion that forms a step between the first portion and the second portion; and (iii) the remaining portion around the outside of the concave flat portion is the convex flat shape. The second step side wall portion is arranged so as to compensate for the strength reduction that is caused by being not surrounded by the portion.

  The thin film member according to an eleventh aspect of the present invention is the thin film member according to any one of the fourth to tenth aspects, wherein an opening that communicates the space with the outside is formed in a part of the concave planar portion. .

  A microactuator according to a twelfth aspect of the present invention includes a movable portion supported by a fixed portion and movable with respect to the fixed portion, and at least a part of the movable portion is pressed against the fixed portion; The microactuator can be switched to a state of being pulled away from the fixed part, wherein the at least part of the movable part is formed of a thin film member according to any one of the first to eleventh aspects.

  An optical device according to a thirteenth aspect of the present invention includes the microactuator according to the twelfth aspect and an optical element provided in the movable portion.

  An optical switch according to a fourteenth aspect of the present invention includes the microactuator according to the twelfth aspect and a mirror provided on the movable part.

  According to the present invention, a thin film member that constitutes at least a part of a movable part that is supported by a fixed part and moves relative to the fixed part, wherein at least a part of the thin film member is pressed against the fixed part In the thin film member that can be switched between the state and the state of being separated from the fixed part, it is possible to provide a thin film member that can quickly separate the thin film member from the fixed part while increasing the rigidity of a predetermined region. In addition, according to the present invention, a microactuator, an optical device, and an optical switch using such a thin film member can be provided.

  Hereinafter, a thin film member according to the present invention, and a microactuator, an optical device, and an optical switch using the same will be described with reference to the drawings.

  [First Embodiment]

  FIG. 1 schematically shows an example of an optical system (in this embodiment, an optical switch system) including an optical switch array 1 having a plurality of optical switches as optical devices according to the first embodiment of the present invention. It is a schematic block diagram. For convenience of explanation, as shown in FIG. 1, an X axis, a Y axis, and a Z axis that are orthogonal to each other are defined (the same applies to the drawings described later). In FIG. 1, an X ′ axis and a Y ′ axis indicate axes obtained by rotating the X axis and the Y axis by 45 ° around the Z axis, respectively. The surface of the substrate 11 of the optical switch array 1 is parallel to the XY plane. The direction of the arrow in the Z-axis direction is called the + Z direction or + Z side, and the opposite direction is called the -Z direction or -Z side, and the same applies to the X-axis direction and the Y-axis direction. The + side in the Z-axis direction may be referred to as the upper side, and the − side in the Z-axis direction may be referred to as the lower side.

  As shown in FIG. 1, this optical switch system includes an optical switch array 1, m optical input optical fibers 2, m optical output optical fibers 3, and n optical output optical fibers 4. In response to the optical path switching state command signal, the optical path switching state indicated by the optical path switching state command signal is realized in response to the magnet 5 as a magnetic field generating unit that generates a magnetic field as will be described later with respect to the optical switch array 1. And an external control circuit 6 serving as a control unit for supplying a control signal to the optical switch array 1. In the example shown in FIG. 1, m = 3 and n = 3, but m and n may each be an arbitrary number.

  In the present embodiment, the magnet 5 is a permanent magnet disposed on the lower side of the optical switch array 1 and applies a substantially uniform magnetic field toward the + side along the X-axis direction with respect to the optical switch array 1. It has occurred. However, instead of the magnet 5, for example, a permanent magnet having another shape, an electromagnet, or the like may be used as the magnetic field generation unit.

  As shown in FIG. 1, the optical switch array 1 includes a substrate 11 and m × n mirrors 31 arranged on the substrate 11. The m light input optical fibers 2 are arranged in a plane parallel to the XY plane so as to guide incident light in the Y′-axis direction from one side in the Y′-axis direction with respect to the substrate 11. The m optical output optical fibers 3 are arranged on the other side of the substrate 11 so as to face the m optical input optical fibers 2 and are not reflected by any mirror 31 of the optical switch array 1. Are arranged in a plane parallel to the XY plane so that light traveling in the Y′-axis direction is incident on the XY plane. The n light output optical fibers 4 are arranged in a plane parallel to the XY plane so that light reflected by any mirror 31 of the optical switch array 1 and traveling in the −X′-axis direction is incident. ing. The m × n mirrors 31 can be moved in and out by a microactuator described later with respect to the intersection of the outgoing optical path of the m optical input optical fibers 2 and the incident optical path of the optical output optical fiber 4. It is arranged on the substrate 11 in a two-dimensional matrix so that it can move in the Z-axis direction. In this example, the orientation of the mirror 31 is set so that the normal line thereof is parallel to the Y axis that forms 45 ° with the Y axis ′ in a plane parallel to the XY plane. However, the angle can be changed as appropriate. When the angle of the mirror 31 is changed, the direction of the optical fiber 4 for light output may be set according to the angle. The optical path switching principle of this optical switch system is the same as the optical path switching principle of the conventional two-dimensional optical switch.

  FIG. 2 is a schematic plan view schematically showing the optical switch array 1 in FIG. The optical switch array 1 includes a substrate 11 (not shown in FIG. 2), m × n movable plates 12 arranged two-dimensionally on the substrate 11, and mirrors 31 mounted on each movable plate 12. And. In FIG. 1 and FIG. 2 and the drawings to be described later, nine optical switches are arranged in 3 rows and 3 columns for the sake of simplicity, but the number of optical switches is not limited at all. Portions other than the mirror 31 in the optical switch array 1 constitute a microactuator array. In the present invention, the optical switch may be used alone without being arrayed.

  Next, the structure of one optical switch as a unit element of the optical switch array 1 in FIG. 1 will be described with reference to FIGS.

  FIG. 3 is a schematic plan view schematically showing one optical switch (that is, one microactuator and one mirror 31 driven thereby) as a unit element of the optical switch array 1 in FIG. In order to facilitate understanding, in FIG. 3, the Al film 22 is indicated by hatching. 4 and 5 are schematic cross-sectional views of the cross section taken along the line A-A ′ in FIG. 3 as viewed from the + Y side in the −Y direction. 4 shows a state in which the mirror 31 is held on the upper side and advances into the optical path K, and FIG. 5 shows a state in which the mirror 31 is held on the lower side and has exited from the optical path.

  As shown in FIGS. 3 to 5, the optical switch as a unit element of the optical switch array 1 includes a movable plate 12 that is provided on the substrate 11 and that forms a microactuator together with the substrate 11, and a movable plate 12. And a mirror 31 as an optical element which is a mounted driven body. In the present embodiment, a silicon substrate is used as the substrate 11. However, the present invention is not limited to this, and an insulating substrate such as a glass substrate may be used as the substrate 11 as appropriate.

  Here, the movable plate 12 will be described with reference to FIGS. 6 to 11 in addition to FIGS. 3 to 5. FIG. 6 is a schematic plan view showing the outer shape and unevenness of the movable plate 12 in FIG. FIG. 7 is a schematic sectional view taken along line C-C ′ in FIG. 6. FIG. 8 is a schematic cross-sectional view along the line D-D ′ in FIG. 6. FIG. 9 is a schematic sectional view taken along line E-E ′ in FIG. 6. FIG. 10 is a schematic enlarged perspective view schematically showing the vicinity of M1 in FIG. FIG. 11 is a schematic cross-sectional view schematically showing a cross section taken along line F-F ′ in FIG. 10 together with resists 100 and 101 as later-described sacrificial layers that are formed during the manufacturing process and finally removed. In addition, FIG. 11 has shown the same process as FIG.13 (b) mentioned later. For convenience of drawing, in FIGS. 10 and 11, the movable plate 12 is shown as if it is formed of a single layer film.

  The movable plate 12 is formed of a thin film and is a thin film member. As shown in FIGS. 3 to 5 and FIGS. 7 to 9, the lower silicon nitride film over the entire planar shape of the movable plate 12 ( SiN film) 21 and an Al film 22 partially formed on the SiN film 21. That is, the movable plate 12 has both a part made of a single layer film made of the SiN film 21 in order from the bottom and a part made of a two layer film in which the SiN film 21 and the Al film 22 are laminated in order from the bottom. . An SiN film covering the entire planar shape of the movable plate 12 may be further laminated on the SiN film 21 and the Al film 22. The pattern shape of the Al film 22 is as shown in FIG. 3, which will be described later. The movable plate 12 faces upward with respect to the substrate 11 (+ Z direction) as shown in FIG. 4 due to the internal stress generated by the difference in thermal expansion coefficient between the SiN film 21 and the Al film 22 and the internal stress generated at the time of film formation. ) With a predetermined film thickness and film formation conditions.

  As shown in FIGS. 3 and 6, the movable plate 12 includes a rectangular mirror mounting plate 12b as a mounting portion for mounting the mirror 31 (that is, a support base for the mirror 31), and a mirror mounting plate 12b. And two belt-like support plates 12c connected to the ends. In the present embodiment, these two support plates 12c are two beam portions mechanically connected in parallel to each other. The support plate 12c has a leg 12a and a leg 12d at each end. The leg portions 12a and 12d are both fixed to the substrate 11, and the movable plate 12 is lifted on the mirror mounting plate 12b side as shown in FIG. 4 with the leg portions 12a and 12d as fixed ends. . Thus, in the present embodiment, the movable plate 12 is a movable portion having a cantilever structure with the leg portions 12a and 12d as fixed ends. In the present embodiment, the substrate 11, the insulating films 18 and 19 and the fixed electrode 35, which will be described later, constitute a fixed portion.

  As shown in FIG. 6, the movable plate 12 has a concavo-convex shape, which will be described in detail later, in a region R composed of the mirror mounting plate 12 b and the support plate 12 c on the mirror mounting plate 12 b side portion. Since the unevenness causes a step, the rigidity of the region R of the movable plate 12 increases, and the region R is suppressed from being curved by internal stress and can maintain flatness. For this reason, even if the movable plate 12 is in a state where the mirror 31 is lifted to the upper position by bending due to internal stress as shown in FIG. The shape of the mirror 31 can be kept stable and constant.

  As described above, in the movable plate 12, the curvature of the region R is suppressed, but the region close to the leg portion 12d of the support plate 12c is not provided with an uneven shape. As a result, the movable plate 12 is raised on the mirror mounting plate 12b side as shown in FIG. 4 with the legs 12a and 12d as fixed ends due to the curvature of the region near the leg 12d of the support plate 12c. Moreover, the area | region near the leg part 12d of the support plate 12c becomes a leaf | plate spring part as an elastic part by the uneven | corrugated shape not being provided.

  Here, the shape of the Al film 22 of the movable plate 12 will be described with reference to FIG. In the present embodiment, in order to drive the movable plate 12 using both Lorentz force and electrostatic force as driving forces, the Al film 22 is patterned into a shape as shown in FIG.

  The pattern 22 a of the Al film 22 extends from one of the two leg portions 12 d along the outer peripheral edge of the movable plate 12 and reaches the tip of the movable plate 12, and then the opposite edge of the movable plate 12. Is the pattern that reaches the other leg 12d. The pattern 22a is used as a wiring for supplying a current for generating the Lorentz force when the movable plate 12 is driven by the Lorentz force. 4 and 5, the pattern 22a is connected to the wiring 40 through the through hole of the insulating film 19 such as a silicon oxide film on the substrate 11 and the contact hole of the SiN film 21 at the leg portion 12d on the + Y side. At the same time, it is connected to a wiring (not shown) formed between the insulating films 18 and 19 in the leg portion 12d on the -Y side, and a current as a drive signal for Lorentz force is transmitted from the wiring 40 via the leg portion 12d. Supplied. A current path (current path for Lorentz force) in which a straight line portion extending in the Y-axis direction along the one side 12e of the tip of the movable plate 12 in the pattern 22a is arranged in a magnetic field and generates a Lorentz force as a driving force by energization. ). The other part of the pattern 22a is the wiring of the Lorentz force current path. The Lorentz force current path is placed in the magnetic field in the X-axis direction by the magnet 5 shown in FIG. Accordingly, when a current is supplied to the pattern 22a, a Lorentz force in the + Z direction or the -Z direction is generated in the current path for Lorentz force depending on the direction of the current.

  The pattern 22b of the Al film 22 extends from each of the two leg portions 12a to the fixed end side (−X side) of the mirror mounting plate 12b along the inner edge of the movable plate 12, and the mirror mounting plate 12b. Are connected to a rectangular pattern 22d arranged on the fixed end side. The pattern 22d is a movable electrode for generating an electrostatic force as a driving force. Hereinafter, the pattern 22d may be referred to as the movable electrode 22d. The pattern 22 d is also a pattern in the Al film 22. The pattern 22b is a wiring pattern of the movable electrode 22d. The pattern 22b is connected to the wiring (not shown) through the through hole of the insulating film 19 and the contact hole of the SiN film 21 in both the leg portions 12a, and is connected to the fixed electrode 35 made of an Al film or the like. (Voltage for electrostatic force, drive signal for electrostatic force) is applied. The fixed electrode 35 is formed between the insulating films 18 and 19 on the substrate 11 and is disposed at a position facing the movable electrode 22d. The fixed electrode 35 is insulated from the substrate 11. When a voltage is applied between the movable electrode 22d and the fixed electrode 35, an electrostatic force as a driving force is generated between them, and the movable plate 12 is attracted to the substrate 11 by this electrostatic force.

  In the present embodiment, the mirror 31 is held on the upper side (the side opposite to the substrate 11) by controlling the electrostatic force voltage between the movable electrode 22d and the fixed electrode 35 and the current flowing through the Lorentz force current path. The state (FIG. 4) and the state where the mirror 31 is held on the lower side (substrate 11 side) (FIG. 5) can be obtained. In the present embodiment, as described later, such control is performed by the external circuit 6. 4 and 5, K indicates a cross section of the optical path of the incident light with respect to the advance position of the mirror 31.

  As shown in FIG. 4, when the electrostatic force as the driving force and the Lorentz force as the driving force are not applied, + Z is caused by the stress (spring force) of the film in the region near the leg portion 12d of the support plate 12c. It returns to the state curved in the direction, and the mirror 31 is held on the upper side. As a result, the mirror 31 advances into the optical path K and reflects the light incident on the optical path K. When switching from this state to a state in which light incident on the optical path K is allowed to pass through without being reflected by the mirror 31 (FIG. 5), for example, first, the Lorentz force as a driving force is applied, and the support plate The mirror 31 is moved downward against the stress (spring force) of the film in the region near the leg 12d of 12c, and after the mirror 31 is held on the substrate 11, the electrostatic force as a driving force is applied. It is only necessary to maintain the holding and stop the application of the Lorentz force. In this way, the region R of the movable plate 12 is switched between a pressed state (FIG. 5) pressed against the fixed part and a state separated from the fixed part (FIG. 4).

  As can be seen from the above description, in the present embodiment, the movable electrode 22d and the fixed electrode 35 that generate an electrostatic force as a driving force, and the Lorentz force current path that generates a Lorentz force as a driving force are: In response to the signal, the movable plate 12 is provided with a driving force for moving and maintaining the position of the mirror 31 against the spring force of the elastic portion of the movable plate 12 (the region of the support plate 12c where the convex portion 24 is not provided). A driving force applying means that can be applied is configured.

  However, in the present invention, the driving force applying means may be configured by only one of the movable electrode 22d, the fixed electrode 35, and the Lorentz force current path, for example. In the case where the driving force applying means is composed of only the movable electrode 22d and the fixed electrode 35, for example, the pattern 22a may be removed or disconnected in the middle. In the case where the driving force applying means is constituted only by the Lorentz force current path, for example, the pattern 22b may be removed, the wire may be disconnected in the middle, or the movable electrode 22d may be removed. In the present invention, other various driving forces may be used.

  In the present embodiment, the mirror 31 is made of Au, Ni, or other metal like the mirror disclosed in Patent Document 2, and stands upright on the upper surface of the mirror mounting plate 12b of the movable plate 12, It is simply fixed. For example, as disclosed in Patent Document 2, the mirror 31 is formed by forming a recess corresponding to the mirror 31 with a resist, and then growing Au, Ni, and other metals to be the mirror 31 by electrolytic plating. Then, it can be formed by removing the resist. The support structure for supporting the mirror 31 by the mirror mounting plate 12b serving as the support base is not limited to this, and for example, the support structure disclosed in Patent Document 1 may be adopted. In this case, the support structure and the mirror 31 can be manufactured by a manufacturing method similar to the manufacturing method disclosed in Patent Document 1.

  Here, the uneven shape imparted to the region R of the movable plate 12 will be described in detail. As shown in FIGS. 4 to 11 (particularly FIG. 6), the region R of the movable part 12 has a convex plane which is a planar part having a height relatively close to the fixed part (and therefore the substrate 11). A convex portion 50, a concave planar portion 51 that is substantially parallel to the convex planar portion 50 and has a height farther from the fixed portion than the convex planar portion 50, and the convex planar portion 50, A step side wall portion 52 that forms a step with respect to the concave planar portion 51 is formed. The convex planar part 50, the concave planar part 51, and the step side wall part 52 are formed by the constituent films constituting the movable plate 12. In a plan view viewed substantially from the height direction, a stepped side wall portion 52 exists at the boundary between the convex planar portion 50 and the concave planar portion 51, while the convex plane coincides with the outer edge of the movable plate 12. The stepped side wall 52 does not exist in a place that does not become the boundary, such as an edge of the concave portion 50 or the concave flat portion 51. The concave flat part 51 and the step side wall part 52 connected to the concave flat part 51 constitute a concave part that is concave on the lower side (fixed part side). In the present embodiment, the concave planar portion 51 has substantially the same height at each portion. On the other hand, the convex flat portion 50 constitutes a convex portion that is convex downward (fixed portion side).

  In the present embodiment, on the upper surface of the fixed portion (that is, the upper surface of the insulating film 19), there are a place where the fixed electrode 35 or the wiring pattern exists between the insulating films 18 and 19, and a place where the fixed electrode 35 or the wiring pattern does not exist. There is a minute step depending on the thickness. Therefore, as shown in FIG. 5, in a state where the movable plate 12 is pressed against the fixed part, in the place where the fixed electrode 35 or the wiring pattern exists, the concave flat part 51 contacts the fixed part, while the fixed part 35 is fixed. Where the electrode 35 or the wiring pattern does not exist, a minute gap S is generated between the concave planar portion 51 and the fixed portion.

  In this embodiment, as shown in FIGS. 3 and 6, the concave planar portion 51 is a convex planar portion on the inner side that is rectangular in a plan view corresponding to the portion on which the mirror 31 of the movable plate 12 is mounted. 50 completely surrounded. Most of the outer periphery of the concave planar part 51 is surrounded by the outer convex planar part 50, and the remaining part of the outer periphery of the concave planar part 51 (in this embodiment, M1 to M16 in FIG. 6). (Near part) is not surrounded by the convex flat part 50. Therefore, there is no step side wall portion 52 connected to a portion near M1 to M16 in FIG. 6 around the outside of the concave planar portion 51 (see FIGS. 8 to 11), and a portion where this step side wall portion 52 does not exist. However, when the movable plate 12 is pressed against the fixed portion as shown in FIG. 5, the space between the concave planar portion 51 and the fixed portion is an opening L that communicates with the outside from the gap S. The opening L corresponds to an opening formed in a part of a side wall of a concave portion (a concave portion which is concave on the lower side) formed by the concave planar portion 51 and the stepped side wall portion 52 connected thereto. The structure near M2 to M16 in FIG. 6 is the same as the structure near M1 in FIG. 6 shown in FIG.

  The optical switch array 1 according to the present embodiment can be manufactured by using a semiconductor manufacturing technique such as film formation and patterning, etching, and sacrificial layer formation / removal. A specific example will be briefly described with reference to FIGS. 12 and 13 are schematic cross-sectional views schematically showing each manufacturing process in the method for manufacturing the optical switch array 1 according to the present embodiment, and correspond to FIGS. 4 and 5.

  First, the insulating film 18 is formed on the substrate 11. Next, an Al film is formed on the insulating film 18, and this Al film is patterned into the shape of the fixed electrode 35, the wiring 40, and other wirings by a photolithography etching method or the like. Next, an insulating film 19 is formed thereon, and openings 19a for the leg portions 12a and 12d are formed in the insulating film 19 (FIG. 12A).

  Next, a resist 100 as a sacrificial layer is formed on the substrate in this state, and openings 100a for the leg portions 12a and 12d are formed in the resist 100 (FIG. 12B).

  Thereafter, a resist 101 is formed in an island shape on the resist 100 as a sacrificial layer for forming the concave planar portion 51 and the like (FIG. 13A). Thereafter, an SiN film is formed, and this SiN film is patterned into the shape of the SiN film 21 of the movable portion 11 by a photolithography etching method or the like, and contact holes in the leg portions 12a and 12d are formed in the SiN film.

  Next, an Al film is formed on the substrate in this state, and this Al film is patterned into the shapes of the patterns 22a, 22b, and 22d by a photolithography etching method or the like (FIG. 13B). As described above, FIG. 11 shows the same process as FIG.

  Thereafter, for example, as in the manufacturing method disclosed in Patent Document 1, a resist for forming a mirror is applied on the substrate in this state, and a recess corresponding to the mirror 31 is formed in the resist. Au, Ni and other metals to be the mirror 31 are grown by plating. Finally, the resists 100 and 101 and the mirror forming resist are removed by an ashing method or the like. Thus, the optical switch array 1 according to the present embodiment is completed.

  Here, the comparative example compared with this Embodiment is demonstrated with reference to FIG. FIG. 14 is a schematic plan view showing the outer shape and unevenness of the movable plate of one optical switch of the optical switch array according to the comparative example, and corresponds to FIG. 14, elements that are the same as or correspond to those in FIG. 6 are given the same reference numerals, and redundant descriptions thereof are omitted.

  This comparative example is different from the present embodiment in the present embodiment, as described above, in the plan view, the portions around M1 to M16 in FIG. 6 around the outer side of the concave planar portion 51 are convex. In this comparative example, the entire outer periphery of the concave planar portion 51 is only surrounded by the outer convex planar portion 50, whereas it is not surrounded by the planar portion 50. Therefore, in the comparative example, the space between the concave planar portion 51 and the fixed portion formed in the pressed state of the movable plate 12 to the fixed portion as shown in FIG. 5 does not communicate with the outside except the gap S. This comparative example corresponds to the above-described prior art.

  With reference to FIG. 15, the effect of the present embodiment will be described in comparison with the comparative example. FIG. 15 is a model diagram for comparing the comparative example with the present embodiment. 15 (a) and 15 (c) show that in the comparative example, the movable plate 12 is about to be pulled away from the fixed portion by the force F from the state where the movable plate 12 is pressed against the fixed portion (indicated by reference numeral 200 in FIG. 15). The state is shown as a model. FIGS. 15B and 15D show similar states modeled in the present embodiment. FIGS. 15A and 15B show a case where a gap S is generated between a part of the convex flat portion 50 and the fixed portion 200 in the pressed state, and FIGS. The case where the clearance gap S is not produced by the surface of the fixing | fixed part 200 being planarized is shown.

  When the gap S is generated in the pressed state, an external fluid (this embodiment has been described as being used in the atmosphere as the movable plate 12 is separated from the fixed portion. May enter the space between the concave planar portion 51 and the fixed portion 200 through the gap S. In the case of the comparative example, the space between the concave planar portion 51 and the fixed portion formed in the pressed state is not communicated to the outside except the gap S. Therefore, as shown in FIG. It can enter only from S and it is difficult for fluid to enter the space. Therefore, a relatively large adsorption force acts between the movable plate 12 and the fixed portion 200 by an action similar to that of the suction cup. Therefore, it takes time to separate the movable plate 12 from the fixed portion 200 from the pressed state, and the movable plate 12 cannot be quickly separated from the fixed portion 200. On the other hand, according to the present embodiment, as shown in FIG. 15B, the space between the concave planar portion 51 and the fixed portion formed in the pressed state communicates with the outside also through the opening L. Since the fluid enters the space not only from the gap S but also from the opening L, the fluid easily enters the space. Therefore, the adsorption force between the movable plate 12 and the fixed portion 200 is reduced, and the movable plate 12 can be quickly separated from the fixed portion 200.

  When the gap S is not generated in the pressed state, in the comparative example, as shown in FIG. 15C, the fluid is extremely difficult to enter the space. On the other hand, in this embodiment, since it enters the space from the opening L, it is easy for the fluid to easily enter the space. Therefore, according to the present embodiment, the adsorption force between the movable plate 12 and the fixed portion 200 is reduced, and the movable plate 12 can be quickly separated from the fixed portion 200.

  As described above, according to the present embodiment, the movable plate 12 can be quickly separated from the fixed portion 200 by the opening L even if the gap S is not generated in the pressed state.

  [Second Embodiment]

  FIG. 16 is a schematic plan view showing the outer shape and unevenness of the movable plate 12 of one optical switch of the optical switch array having a plurality of optical switches according to the second embodiment of the present invention, corresponding to FIG. is doing. In FIG. 16, elements that are the same as or correspond to those in FIG. 6 are given the same reference numerals, and redundant descriptions thereof are omitted.

  The present embodiment differs from the first embodiment in that the structure similar to the structure near M1 shown in FIG. 10 is the same as M4, M5, M6, and M9 in FIG. , M10, and M11, but instead, structures similar to those in the vicinity of M1 shown in FIG. 10 are shifted from those positions in FIG. 16, respectively M4 ′, M5 ′, and M6. It is only the point provided in the position of ', M9', M10 ', M11'.

  Therefore, the same advantages as those of the first embodiment can be basically obtained by this embodiment.

  However, in the present embodiment, since the X coordinate positions of M5 ′ and M6 ′ in FIG. 16 are the same, the structure in the vicinity of M1 shown in FIG. Are located at two locations M5 ′ and M6 ′ opposite to each other in the Y-axis direction on both sides in the Y-axis direction. Therefore, a bending moment that extends in the Y-axis direction orthogonal to the direction from the fixed end to the free end of the cantilever structure of the movable plate 12 and uses the lines passing through the positions M5 ′ and M6 ′ as bending lines is Despite being easily applied to the movable plate 21, the rigidity against this bending moment is relatively reduced. This is because the stepped side wall 52 extending in the X-axis direction, which attempts to resist such a bending moment, is interrupted near the positions M5 'and M6' by the opening L.

  Similarly, in the present embodiment, the opening L is located at two locations M9 ′ and M10 ′ facing in the Y-axis direction on both sides in the Y-axis direction of the continuous region of the concave planar portion 51. Rigidity against a bending moment such that a line passing through the positions M9 ′ and M10 ′ is a folding line is relatively reduced. The openings L are positioned at two locations M4 ′ and M11 ′ facing in the Y-axis direction on both sides in the Y-axis direction of the continuous region of the concave planar portion 51, so that the positions M4 ′ and M11 ′ are Rigidity against a bending moment such that a passing line is a folding line is relatively reduced.

  On the other hand, in the first embodiment, the X coordinate positions of M5 and M6 in FIG. 6 are different from each other, the X coordinate positions of M9 and M10 are different from each other, and the X coordinate positions of M4 and M11 are different from each other. Are different from each other. Therefore, in the first embodiment, two locations facing in the Y-axis direction on both sides in the Y-axis direction of the continuous region of the concave planar portion 51 have structures near M1 shown in FIG. There is no opening L). Therefore, the first embodiment is preferable because the rigidity can be increased as compared with the present embodiment.

  For example, the X-coordinate positions of M3 and M12 in FIG. 6 are the same, and the two locations M3 and M12 are opposed to the Y-axis direction on both sides of the concave planar portion 51 in the Y-axis direction. Since the inner convex planar portion 50 is interposed between the two portions M3 and M12, the two portions M3 and M12 are not opposed to each other in the Y-axis direction on both sides in the Y-axis direction of the continuous region of the concave planar portion 51. . The stepped side wall 52 extending in the X-axis direction is interposed between the two because the inner convex flat portion 50 is interposed between the two, and the stepped side wall 52 allows the position M4 ′, The rigidity with respect to the bending moment which makes the line which passes M11 'a bending line is improved.

  [Third Embodiment]

  FIG. 17 is a schematic plan view showing the outer shape and unevenness of the movable plate 12 of one optical switch of the optical switch array having a plurality of optical switches according to the third embodiment of the present invention, and corresponds to FIG. is doing. In FIG. 17, elements that are the same as or correspond to those in FIG. 6 are given the same reference numerals, and redundant descriptions thereof are omitted.

  The difference between this embodiment and the first embodiment is that, in the first embodiment, there is an inner convex flat portion 50 surrounded by the concave flat portion 51. In the present embodiment, the concave planar portion 51 extends to the region of the planar portion 50 on the inner side, and only the point where the inner planar portion 50 does not exist.

  Also according to this embodiment, the same advantages as those of the first embodiment can be obtained. However, the first embodiment is preferable because the rigidity can be increased as compared with the present embodiment.

  In the present embodiment, the X coordinate positions of the positions M1, M2, and M3 are the same as the X coordinate positions of the positions M14, M13, and M12. However, in order to increase the rigidity, the positions M1, M2, and M3 It is preferable to make the X coordinate position of the X coordinate position different from the X coordinate position of the positions M14, M13, and M12.

  [Fourth Embodiment]

  FIG. 18 is a schematic plan view showing the outer shape and unevenness of the movable plate 12 of one optical switch of the optical switch array having a plurality of optical switches according to the fourth embodiment of the present invention, and corresponds to FIG. is doing. FIG. 19 is a schematic enlarged perspective view schematically showing the vicinity of M1 in FIG. FIG. 20 is a schematic cross-sectional view schematically showing a cross section taken along line G-G ′ in FIG. 19 together with resists 100, 101, and 102 as sacrificial layers that are formed during the manufacturing process and finally removed. 19 and 20 correspond to FIGS. 10 and 11, respectively. 18 to 20, elements that are the same as or correspond to those in FIGS. 6, 10, and 11 are assigned the same reference numerals, and redundant descriptions thereof are omitted.

  This embodiment is different from the first embodiment in the points described below. In the first embodiment, the concave planar portion 51 has substantially the same height in each portion, whereas in the present embodiment, the concave planar portion 51 corresponds to the concave planar portion 51. A first portion (referred to as a first concave planar portion 51a) having a height equal to that of the concave planar portion 51 and a second portion having a height higher than that of the first concave planar portion 51a. (Referred to as the second concave planar portion 51b).

  Accordingly, the step side wall portion corresponding to the step side wall portion 52 in the first embodiment forms a step between the first concave planar portion 51a and the convex planar portion 50. The formation part 52a and the 2nd level | step difference side wall part 52b which forms the level | step difference between the 2nd concave planar part 51b and the convex planar part 50 are provided. In the present embodiment, a third step side wall portion 52c that forms a step between the first concave planar portion 51a and the second concave planar portion 51b is added.

  In the present embodiment, the structure in the vicinity of M1 in FIG. 18 is configured by combining the convex planar portion 50, the concave planar portions 51a and 51b, and the step side wall portions 52a, 52b and 52c as shown in FIG. Has been. The structure near M2 to M16 in FIG. 18 is the same as the structure near M1 in FIG. 18 shown in FIG.

  In manufacturing, in order to form concave planar portions 51a and 51b having different heights, resists 100 and 101 as sacrificial layers are formed and patterned in the same manner as in the first embodiment, and then shown in FIG. As described above, the resist 102 as a sacrificial layer is formed and patterned on the resist 101 before forming the constituent film of the movable plate 12. The patterning shape of the resist 102 and the patterning shape of the resist 101 are determined so as to realize the structure shown in FIGS.

  Also according to this embodiment, since the opening L is formed in the vicinity of M1 to M16, the same advantages as those of the first embodiment can be obtained.

  Further, according to the present embodiment, the third step side wall portion 52c is disposed in the vicinity of the opening L as shown in FIG. 19, so that the concave planar portion (the entire concave planar portions 51a and 51b). The third step side wall portion 52c compensates for a decrease in strength that is likely to occur when the opening L is formed without being surrounded by the convex planar portion 50 in the vicinity of the outer periphery of M1 to M16. Therefore, according to the present embodiment, the rigidity of the region R of the movable plate 12 can be further increased as compared with the first embodiment.

  [Fifth Embodiment]

  FIG. 21 is a schematic plan view showing the outer shape and unevenness of the movable plate 12 of one optical switch of the optical switch array having a plurality of optical switches according to the fifth embodiment of the present invention, corresponding to FIG. is doing. FIG. 22 is a schematic enlarged perspective view schematically showing the vicinity of M1 in FIG. FIG. 23 is a schematic cross-sectional view schematically showing a cross section taken along line H-H ′ in FIG. 22 together with resists 100, 101, and 102 as sacrificial layers that are formed during the manufacturing process and finally removed. 22 and 23 correspond to FIGS. 19 and 20, respectively. 21 to 23, the same or corresponding elements as those in FIGS. 18 to 20 are denoted by the same reference numerals, and redundant description thereof is omitted.

  In the present embodiment, the structure in the vicinity of M1 in FIG. 21 is configured by combining the convex flat portion 50, the concave flat portions 51a and 51b, and the step side wall portions 52a, 52b, and 52c as shown in FIG. Has been. The combination is similar to the case of the fourth embodiment. The structure in the vicinity of M2 to M16 in FIG. 21 is the same as the structure in the vicinity of M1 in FIG. 21 shown in FIGS.

  In manufacturing, in order to form concave planar portions 51a and 51b having different heights, resists 100 and 101 as sacrificial layers are formed and patterned in the same manner as in the first embodiment, and then shown in FIG. As described above, the resist 102 as a sacrificial layer is formed and patterned on the resist 101 before forming the constituent film of the movable plate 12. The patterning shape of the resist 102 and the patterning shape of the resist 101 are determined so as to realize the structure shown in FIGS.

  Also according to the present embodiment, since the openings L are formed in the vicinity of M1 to M16, the same advantages as those of the first embodiment can be obtained as in the fourth embodiment.

  Further, according to the present embodiment, since the third step side wall portion 52c is disposed in the vicinity of the opening L as shown in FIG. 22, as in the fourth embodiment, the concave planar portion The strength reduction that is caused by the opening L being formed without the portions near M1 to M16 around the outer periphery of the (the entire concave planar portions 51a and 51b) being surrounded by the convex planar portion 50 is the third It is supplemented by the step side wall 52c. Therefore, according to the present embodiment, as in the fourth embodiment, the rigidity of the region R of the movable plate 12 can be further increased as compared with the first embodiment.

  [Sixth Embodiment]

  FIG. 24 is a schematic plan view showing the outer shape and unevenness of the movable plate 12 of one optical switch of the optical switch array having a plurality of optical switches according to the sixth embodiment of the present invention, and corresponds to FIG. is doing. FIG. 25 is a schematic enlarged perspective view schematically showing the vicinity of M1 in FIG. FIG. 26 is a schematic cross-sectional view schematically showing a cross section taken along line J-J ′ in FIG. 25 together with resists 100, 101, and 102 as sacrificial layers that are formed during the manufacturing process and finally removed. 25 and 26 correspond to FIGS. 19 and 20, respectively. 24 to 26, the same or corresponding elements as those in FIGS. 18 to 20 are denoted by the same reference numerals, and redundant description thereof is omitted.

  In the present embodiment, the structure in the vicinity of M1 in FIG. 24 is configured by combining the convex flat portion 50, the concave flat portions 51a and 51b, and the step side walls 52a, 52b, and 52c as shown in FIG. Has been. In the fourth embodiment, the first concave planar portion 51a is configured to occupy most of the first and second concave planar portions 51a and 51b. In the embodiment, the second concave planar portion 51b is configured to occupy most. The structure in the vicinity of M2 to M16 in FIG. 24 is the same as the structure in the vicinity of M1 in FIG. 24 shown in FIGS.

  In manufacturing, in order to form concave planar portions 51a and 51b having different heights, resists 100 and 101 as sacrificial layers are formed and patterned in the same manner as in the first embodiment, and then shown in FIG. As described above, the resist 102 as a sacrificial layer is formed and patterned on the resist 101 before forming the constituent film of the movable plate 12. The patterning shape of the resist 102 and the patterning shape of the resist 101 are determined so as to realize the structure shown in FIGS.

  Also according to the present embodiment, since the openings L are formed in the vicinity of M1 to M16, the same advantages as those of the first embodiment can be obtained as in the fourth embodiment.

  Further, according to the present embodiment, since the third step side wall portion 52c is disposed in the vicinity of the opening L as shown in FIG. 22, as in the fourth embodiment, the concave planar portion The strength reduction that is caused by the opening L being formed without the portions near M1 to M16 around the outer periphery of the (the entire concave planar portions 51a and 51b) being surrounded by the convex planar portion 50 is the third It is supplemented by the step side wall 52c. Therefore, according to the present embodiment, as in the fourth embodiment, the rigidity of the region R of the movable plate 12 can be further increased as compared with the first embodiment.

  Furthermore, according to the present embodiment, the disconnection occurrence probability of the pattern 22a (see FIG. 3) of the Al film 22, that is, the disconnection occurrence probability of the wiring layer can be reduced as compared with the fourth embodiment. . In the fourth embodiment, when following the direction in which the pattern 22a (see FIG. 3) of the Al film 22 extends, the step by the third step side wall portion 52c between the concave planar portions 51a and 51b is overcome. As a result, the disconnection probability of the wiring layer is relatively high. On the other hand, according to the present embodiment, even when tracing in the extending direction of the pattern 22a (see FIG. 3) of the Al film 22, it is only necessary to follow the flat concave flat portion 51b and overcome the step. Therefore, the probability of occurrence of disconnection in the wiring layer can be reduced.

  [Seventh Embodiment]

  FIG. 27 is a schematic plan view showing the outer shape and unevenness of the movable plate 12 of one optical switch of the optical switch array having a plurality of optical switches according to the seventh embodiment of the present invention, corresponding to FIG. is doing. FIG. 28 is a schematic enlarged perspective view schematically showing the vicinity of M1 in FIG. FIG. 29 is a schematic cross-sectional view schematically showing a cross section taken along line N-N ′ in FIG. 28 together with resists 100, 101, and 102 as sacrificial layers that are formed during the manufacturing process and finally removed. 28 and 29 correspond to FIGS. 25 and 26, respectively. 27 to 29, the same or corresponding elements as those in FIGS. 24 to 26 are denoted by the same reference numerals, and redundant description thereof is omitted.

  In the present embodiment, the structure in the vicinity of M1 in FIG. 27 is configured by combining the convex flat portion 50, the concave flat portions 51a and 51b, and the step side walls 52a, 52b, and 52c as shown in FIG. Has been. The combination is similar to that of the sixth embodiment, and the second concave planar portion 51b occupies most of the first and second concave planar portions 51a and 51b. It is configured.

  In manufacturing, in order to form the concave planar portions 51a and 51b having different heights, resists 100 and 101 as sacrificial layers are formed and patterned in the same manner as in the first embodiment, and then shown in FIG. As described above, the resist 102 as a sacrificial layer is formed and patterned on the resist 101 before forming the constituent film of the movable plate 12. The patterning shape of the resist 102 and the patterning shape of the resist 101 are determined so as to realize the structure shown in FIGS.

  Also in this embodiment, the same advantages as those in the sixth embodiment can be obtained.

  [Eighth Embodiment]

  FIG. 30 is a schematic plan view showing the outer shape and unevenness of the movable plate 12 of one optical switch of the optical switch array having a plurality of optical switches according to the eighth embodiment of the present invention. 14 is supported. 30, elements that are the same as or correspond to those in FIGS. 6 and 14 are given the same reference numerals, and redundant descriptions thereof are omitted.

  This embodiment is different from the first embodiment only in the points described below. That is, in the first embodiment, the portion around M1 to M16 in FIG. 6 around the outside of the concave planar portion 51 is not surrounded by the convex planar portion 50 in plan view. In the present embodiment, as in the comparative example, the entire outer periphery of the concave planar portion 51 is surrounded by the outer convex planar portion 50. In the present embodiment, an opening 60 is formed in the concave planar portion 51 instead. The opening 60 is an opening that communicates the space between the concave planar portion 51 and the fixed portion to the outside from the space S except when the movable plate 12 is pressed against the fixed portion as shown in FIG. The opening 60 corresponds to an opening formed in a part of the bottom portion of the concave portion (the concave portion which is concave on the lower side) formed by the concave planar portion 51 and the stepped side wall portion 52 connected thereto.

  Also in this embodiment, the same advantages as those in the first embodiment can be obtained.

  In the first to seventh embodiments as well, an opening corresponding to the opening 60 may be provided. In this case, the movable plate 12 can be separated from the fixed portion more quickly.

  [Ninth Embodiment]

  FIG. 31 is a schematic plan view showing the outer shape and unevenness of the movable plate 12 of one optical switch of the optical switch array having a plurality of optical switches according to the ninth embodiment of the present invention. 14 is supported. 32 is a cross-sectional view taken along line P-P ′ in FIG. 31 and corresponds to FIG. 7. 31 and 32, elements that are the same as or correspond to those in FIGS. 6, 14, and 7 are given the same reference numerals, and redundant descriptions thereof are omitted.

  The present embodiment differs from the comparative example shown in FIG. 14 in that, in this embodiment, the convex planar portion 50 extends to the region of the concave planar portion 51 in FIG. The only difference is that the area of the planar portion 50 is changed to the concave planar portion 51. Therefore, in the present embodiment, as shown in FIG. 31, the entire outer periphery of the concave planar portion 51 is not surrounded by the convex planar portion 50 and is located around the outer periphery of the convex planar portion 50 in a plan view. The whole is surrounded by the concave planar portion 51.

  Therefore, in the present embodiment, the space formed between the concave planar portion 51 and the fixed portion in a state where the movable plate 12 is pressed against the fixed portion as shown in FIG. It communicates to the outside from between the entire surroundings and the fixed part.

  For this reason, according to the present embodiment, the space formed between the concave planar portion 51 and the fixed portion in the pressed state of the movable plate 12 to the fixed portion as shown in FIG. 5 is shown in FIG. It does not become a space close to a closed space like the comparative example. Therefore, the action similar to the suction cup in the concave planar portion 51 cannot occur, and thereby, the adsorption force between the movable plate 12 and the fixed portion is reduced, and the movable plate 12 can be quickly separated from the fixed portion. it can.

  Although the embodiments of the present invention have been described above, the present invention is not limited to these embodiments.

  For example, the positions M1 to M16 in FIGS. 6 and 17 and the positions M1 to M3, M4 ′ to M6 ′, M7, M8, M9 ′ to M11 ′, and M12 to M16 in FIG. It is not necessary to adopt this structure, and any structure of the structure shown in FIG. 10, the structure shown in FIG. 19, and the structure shown in FIG. 22 may be adopted for each position.

  In addition, each of the above-described embodiments is an example in which the present invention is applied to a microactuator having a movable part having a cantilever structure, but the present invention is not limited to this, for example, The present invention can also be applied to a microactuator of a type in which the movable part as disclosed in Patent Document 2 has a double-sided structure.

  Furthermore, although each embodiment mentioned above was an example which applied the microactuator by this invention to the optical switch, the microactuator by this invention can be used for another optical apparatus and other various uses.

  Furthermore, although each embodiment mentioned above was an example which applied the thin film member by this invention to the microactuator, the thin film member by this invention can be used for other various uses.

1 is a schematic configuration diagram schematically illustrating an example of an optical system including an optical switch array having a plurality of optical switches according to a first embodiment of the present invention. FIG. 2 is a schematic plan view schematically showing the optical switch array in FIG. 1. FIG. 2 is a schematic plan view schematically showing one optical switch of the optical switch array in FIG. 1. FIG. 4 is a schematic cross-sectional view taken along the line A-A ′ in FIG. 3 as viewed from the + Y side in the −Y axis direction, showing a state in which the mirror is held on the upper side. FIG. 4 is a schematic cross-sectional view taken along the line A-A ′ in FIG. 3 as viewed from the + Y side in the −Y axis direction, showing a state in which the mirror is held on the lower side. It is a schematic plan view which shows the external shape and uneven | corrugated condition of the movable plate in FIG. FIG. 7 is a schematic sectional view taken along line C-C ′ in FIG. 6. FIG. 7 is a schematic sectional view taken along line D-D ′ in FIG. 6. FIG. 7 is a schematic sectional view taken along line E-E ′ in FIG. 6. It is a general | schematic expansion perspective view which shows typically M1 vicinity in FIG. It is a schematic sectional drawing which shows typically the F-F 'line cross section in FIG. 10 with a sacrificial layer. It is a schematic sectional drawing which shows each process of the manufacturing method of the optical switch array shown in FIG. 3 typically, respectively. FIG. 13 is a schematic cross-sectional view schematically showing each step subsequent to FIG. 12. It is a schematic plan view which shows the external shape and uneven | corrugated state of the movable plate of one optical switch of the optical switch array by a comparative example. It is a model figure for comparing a comparative example with this Embodiment. It is a schematic plan view which shows the external shape of the movable plate of the optical switch by the 2nd Embodiment of this invention, and the condition of an unevenness | corrugation. It is a schematic plan view which shows the external shape and uneven | corrugated state of the movable plate of the optical switch by the 3rd Embodiment of this invention. It is a schematic plan view which shows the external shape and uneven | corrugated condition of the movable plate of the optical switch by the 4th Embodiment of this invention. It is a general | schematic expansion perspective view which shows typically M1 vicinity in FIG. FIG. 20 is a schematic cross-sectional view schematically showing a cross section taken along line G-G ′ in FIG. It is a schematic plan view which shows the external shape and uneven | corrugated state of the movable plate of the optical switch by the 5th Embodiment of this invention. It is a general | schematic expansion perspective view which shows typically M1 vicinity in FIG. It is a schematic sectional drawing which shows typically the H-H 'line cross section in FIG. 22 with a sacrificial layer. It is a schematic plan view which shows the external shape and uneven | corrugated state of the movable plate of the optical switch by the 6th Embodiment of this invention. FIG. 25 is a schematic enlarged perspective view schematically showing the vicinity of M <b> 1 in FIG. 24. It is a schematic sectional drawing which shows typically the J-J 'line cross section in FIG. 25 with a sacrificial layer. It is a schematic plan view which shows the external shape and uneven | corrugated condition of the movable plate of the optical switch by the 7th Embodiment of this invention. It is a general | schematic expansion perspective view which shows typically M1 vicinity in FIG. It is a schematic sectional drawing which shows typically the N-N 'line cross section in FIG. 28 with a sacrificial layer. It is a schematic plan view which shows the external shape and uneven | corrugated condition of the movable plate of the optical switch by the 8th Embodiment of this invention. It is a schematic plan view which shows the external shape and uneven | corrugated condition of the movable plate of the optical switch by the 9th Embodiment of this invention. FIG. 32 is a cross-sectional view taken along line P-P ′ in FIG. 31.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Optical switch array 11 Board | substrate 12 Movable plate 50 Convex planar part 51, 51a, 51b Concave planar part 52, 52a, 52b, 52c Step side wall part

Claims (14)

A thin film member that is supported by a fixed part and constitutes at least a part of a movable part that moves relative to the fixed part, wherein at least a part of the thin film member is pressed against the fixed part and the fixed part In the thin film member that is switched to the state of being separated,
By having a concavo-convex shape on the fixed portion side in a predetermined region, the convex portion is convex on the fixed portion side in the predetermined region, and a concave portion on the fixed portion side,
Regardless of whether or not a gap is generated between a part of the convex portion and the fixed portion in the pressed state, the space formed by the concave portion and the fixed portion in the pressed state communicates with the outside from the gap. A thin film member configured as described above.   The thin film member according to claim 1, wherein an opening for communicating the space with the outside is formed in a part of the side wall of the recess.   The thin film member according to claim 1, wherein an opening that communicates the space with the outside is formed in a part of a bottom portion of the concave portion. A thin film member that is supported by a fixed part and constitutes at least a part of a movable part that moves relative to the fixed part, wherein at least a part of the thin film member is pressed against the fixed part and the fixed part In the thin film member that is switched to the state of being separated,
A convex planar part that is a planar part having a height relatively close to the fixed part, a plane that is substantially parallel to the convex planar part and farther from the fixed part than the convex planar part A concave planar portion that is a shape portion, and a stepped side wall portion that forms a step between the convex planar portion and the concave planar portion in a predetermined region,
Regardless of whether or not a gap is generated between a part of the convex portion and the fixed portion in the pressed state, a space formed between the concave planar portion and the fixed portion in the pressed state. A thin film member configured to communicate with the outside from other than the gap. The convex planar portion and the concave planar portion so that at least a part of the outer periphery of the concave planar portion is not surrounded by the convex planar portion in a plan view substantially viewed from the height direction. Is placed,
A space formed between the concave planar portion and the fixing portion in the pressing state is communicated to the outside from between the at least part of the outer periphery of the concave planar portion and the fixing portion. The thin film member according to claim 4, wherein In a plan view substantially viewed from the height direction, the entire outer periphery of the concave planar portion is not surrounded by the convex planar portion and the entire or most of the outer periphery of the convex planar portion is the The convex planar part and the concave planar part are arranged so as to be surrounded by the concave planar part,
A space formed between the concave planar portion and the fixed portion in the pressed state communicates between the entire outer periphery of the concave planar portion and the fixed portion. The thin film member according to claim 4 or 5. In plan view as viewed substantially from the height direction, most of the outer periphery of the concave planar part is surrounded by the convex planar part and the remaining part of the outer periphery of the concave planar part is the convex. The convex planar part and the concave planar part are arranged so as not to be surrounded by the planar part,
A space formed between the concave planar portion and the fixing portion in the pressed state communicates with the outside through an opening between the remaining portion around the outer side of the concave planar portion and the fixing portion. 6. The thin film member according to claim 4 or 5, wherein: The openings are present at two or more locations;
The thin film member according to claim 7, wherein the opening is not located at two locations facing each other in the predetermined direction on both sides of the continuous region of the concave planar portion in the predetermined direction.   The thin film member according to claim 7 or 8, wherein the concave planar portion has substantially the same height in each portion. The concave planar portion has a first portion and a second portion having different heights,
A second step side wall forming a step between the first portion and the second portion;
The second step side wall portion is disposed so as to compensate for the strength reduction that is caused by the remaining portion around the outside of the concave planar portion not being surrounded by the convex planar portion. The thin film member according to claim 7 or 8.   The thin film member according to claim 4, wherein an opening that communicates the space with the outside is formed in a part of the concave planar portion. A movable portion supported by a fixed portion and movable relative to the fixed portion, wherein at least a part of the movable portion is switched between a pressed state in which the movable portion is pressed against the fixed portion and a state in which the movable portion is separated from the fixed portion. An actuator,
A microactuator, wherein the at least part of the movable part is formed of the thin film member according to any one of claims 1 to 11.   An optical apparatus comprising the microactuator according to claim 12 and an optical element provided in the movable part.   13. An optical switch comprising: the microactuator according to claim 12; and a mirror provided on the movable part.

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