JP2006022361A - Partial plating apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve the quality of a plated surface by inhibiting a plating solution from being applied on an upper plated surface of a belt-shaped hoop material which has been plated in a partial plating apparatus, by a shutter mechanism arranged in an upper sparger of the partial plating apparatus. <P>SOLUTION: This partial plating apparatus has a sliding mechanism installed in the fixed window plate 18 and movable window plate 19 of the shutter mechanism arranged in the upper sparger 1. The partial plating method includes controlling the sliding mechanism so that the plating solution is not applied (deposited) on the upper part of the belt-shaped hoop material 17 while the hoop material is not plated. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a partial plating apparatus having an opening / closing shutter for preventing leakage of a plating solution in an upper sparger of a partial plating facility for performing partial plating on a band-like hoop material.

  Conventionally, this type of partial plating equipment has a configuration as shown in FIGS. 3, 4, and 5.

  FIG. 4 is a schematic view in which partial plating is performed on the band-shaped hoop material.

  In FIG. 4, 17 is a band-shaped hoop material, and this band-shaped hoop material 17 is trimmed into a predetermined shape. Reference numeral 18 denotes a place where partial plating is performed. And as shown in FIG. 4, the installation which performs the partial plating 18 to the strip | belt-shaped hoop material 17 is called partial plating installation (or apparatus).

  FIG. 3 is a schematic view of a partial plating facility.

  In FIG. 3, 12 is a housing made of steel or the like. Reference numeral 9 is a tank for storing a plating solution, and 13 is a pipe connected to five pumps. 14 is a pipe, 24 is an upper sparger unit, and the pump 5 and the upper sparger unit 24 are connected by a pipe 14. By operating the pump 5, the plating solution is supplied to the upper sparger unit 24. A pipe 15 is connected to the pump 6. Reference numeral 16 denotes a pipe, and reference numeral 25 denotes a lower sparger unit. The pump 16 and the lower sparger unit 25 are connected by the pipe 16. By operating the pump 6, the plating solution is supplied to the lower sparger unit 25. A slider 8 is attached to the housing 12 and the upper sparger unit 24, and a cylinder 7 is attached to the housing 12 and the upper sparger unit 24. Reference numeral 17 denotes a belt-like hoop material.

  FIG. 5 is a schematic view of an upper and lower sparger of a conventional partial plating facility.

  In FIG. 5, the upper sparger unit 24 includes the upper block 3 and the upper sparger 1. The lower sparger unit 25 is composed of the lower block 4 and the lower sparger 2.

  The operation | movement is demonstrated below about the partial plating equipment comprised as mentioned above.

  The upper sparger unit 24 can be moved up and down at a predetermined position by operating the cylinder 7. Reference numeral 17 denotes a belt-like hoop material. The belt-like hoop material 17 is sandwiched between the upper sparger unit 24 by operating the lower sparger unit 25 and the cylinder 7, the plating solution is operated by the pump 5 and the pump 6, and the upper sparger is operated. The jar unit 24 and the lower sparger unit 25 are supplied, and only a necessary portion of the strip-shaped hoop material 17 is plated.

For example, Patent Document 1, Patent Document 2, and Patent Document 3 are known as prior art document information relating to the invention of this application.
Japanese Patent No. 25551531 JP-A-9-184099 JP 2000-119893 A

  However, in the conventional partial plating equipment, the plating solution stored in the upper sparger falls on the upper and lower spargers, and the upper plating solution stain or plating replacement of the strip-shaped hoop material, etc. Had quality issues.

  The present invention solves the above-mentioned conventional problems, and aims to supply a partial plating facility in which a plating solution leakage shutter is provided in the upper sparger so as to eliminate the quality problem of the strip-shaped hoop material. is there.

  In order to achieve the above object, the present invention has the following configuration.

  The invention described in claim 1 of the present invention is a partial plating facility provided with a shutter mechanism that prevents the plating solution stored in the upper sparger from being applied to the strip-shaped hoop material except for the plating time, The effect which eliminates quality problems, such as plating stain and plating substitution, is obtained.

  In the invention according to claim 2 of the present invention, particularly when the upper sparger is partially plated, the upper sparger and the lower sparger are opened so that the plating solution is applied with the shutter opened. When the plating is not performed, the shutter mechanism that can adjust the opening and closing of the shutter so that the shutter is in the closed state can suppress the plating stain, the plating replacement, and the like, thereby improving the plating quality.

  The invention according to claim 3 of the present invention is provided with an opening / closing key jig for opening / closing, particularly on the shutter attached to the upper sparger, and by using a shutter mechanism capable of opening / closing the shutter with an opening / closing slide cylinder. The effect of suppressing plating substitution and improving plating quality can be obtained.

  In the invention according to claim 4 of the present invention, in particular, an opening / closing mechanism is provided for the shutter stored in the upper sparger, and the plating mechanism, plating replacement, etc. are performed by the shutter mechanism capable of opening / closing the shutter from outside the upper sparger. The effect of suppressing and improving plating quality is obtained.

  The partial plating facility of the present invention can solve plating stains and plating substitutions which are quality issues (plating quality) on the upper plating surface where the strip-shaped hoop material is partially plated by the shutter mechanism in the upper sparger. The effect of preventing plating splattering from the partial plating equipment is achieved.

(Embodiment 1)
Hereinafter, the invention described in the first to fourth aspects of the present invention will be described using the first embodiment.

  FIG. 1 is a diagram showing an example of a shutter opening / closing mechanism in a sparger of a partial plating facility and a schematic diagram in Embodiment 1 of the present invention, and is a detailed view of a shutter mechanism in an upper sparger unit.

  In FIG. 1, 17 is a belt-like hoop material. 3 is an upper block and 1 is an upper sparger. The shutter mechanism stored in the upper sparger 1 is installed so that the movable window plate 19 slides on the fixed window plate 18, and is transmitted to the movable shaft by the drive transmitted from the movable cylinder 21 to the movable key 20. 19 can be slid.

  The upper block 3 and the upper sparger 1 are partitioned by an upper partition plate 28 and are separate chambers.

  The lower block 4 and the lower sparger 2 are also partitioned by the lower partition plate 29 and are separate chambers.

  When actually performing partial plating, the band-shaped hoop material 17 is brought into close contact with the lower sparger 2 and the upper sparger 1 is lowered, and then the band-shaped hoop material 17 is moved to the upper sparger 1 and the lower sparger 2. The plating solution is applied so that the plating solution does not leak, and partial plating is performed.

  The plating solution passes through the upper block 3 by the drive of the pump 5 in the partitioned chamber of the upper sparger 1, and the upper sparger 1 is filled with the plating solution and the positions of the fixed window 26 and the movable window 27. When they become the same, partial plating can be performed (FIG. 2 (a)).

  In addition, when the upper sparger 1 rises and leaves the band-shaped hoop material 17 when the plating is finished, the movable window plate 19 is slid by driving the movable cylinder 21 and is movable with the fixed window 26. The windows 27 do not coincide with each other, and the plating solution can not be applied to the strip-shaped hoop material 17 (FIG. 2B).

  In the configuration as described above, when partial plating is performed, the state in which the plating solution is applied or not applied can be controlled by driving the movable cylinder 21 outside the upper sparger.

  Thus, the effect which can improve plating finish quality is acquired by not applying a plating solution except when carrying out partial plating to the strip | belt-shaped hoop material 17. FIG. Moreover, the effect which can shorten the adjustment time (partial operation failure by plating solution scattering) of partial plating equipment is acquired.

  The partial plating apparatus of the present invention can control whether the plating solution in the upper sparger is applied or not applied, so that the plating solution adheres (or is applied) to the upper side of the partial plating performed on the strip-shaped hoop material. As a partial plating facility that performs various partial plating, it has the effect of reducing the quality problem of stains and replacement on the upper side of partial plating, and reducing the adjustment work time of partial plating equipment. Useful.

Schematic of the sparger mechanism of the partial plating apparatus of the present invention (A), (b) State diagram of shutter mechanism in sparger Schematic diagram of partial plating equipment (A), (b) Schematic of partial plating on strip-shaped hoop material Schematic diagram of sparger mechanism of conventional partial plating equipment

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Upper sparger 2 Lower sparger 3 Upper block 4 Lower block 5 Upper pump 6 Lower pump 7 Cylinder 8 Slider 9 Tank 10 Receiving 11 Piping 12 Housing 13 Piping 14 Piping 15 Piping 16 Piping 17 Band-shaped hoop material 18 Fixation Window plate 19 Movable window plate 20 Movable key 21 Movable cylinder 23 Sparger outer cylinder box 24 Upper sparger unit 25 Lower sparger unit 26 Fixed window 27 Movable window 28 Upper partition plate 29 Lower partition plate

Claims (4)

In a partial plating machine that sandwiches the strip-shaped hoop material between the upper sparger and the lower sparger and performs plating only on the parts that require plating, the plating solution stored in the upper sparger is not applied to the strip-shaped hoop material. Partial plating equipment with a shutter mechanism. When the upper sparger is partially plated, the shutter opens and closes so that the upper and lower spargers open and when the belt-shaped hoop material is not sandwiched, the shutter is closed. The partial plating apparatus according to claim 1, further comprising a shutter mechanism that can be controlled. 2. The partial plating apparatus according to claim 1, wherein the shutter attached to the upper sparger has a shutter mechanism provided with an open / close key and capable of sliding the shutter open / close with an air cylinder. The shutter stored in the upper sparger is provided with an opening / closing mechanism on the outside of the upper sparger with the opening / closing key jig as an axis, and a shutter mechanism capable of opening and closing the shutter from the outside of the upper sparger. 1. The partial plating apparatus according to 1.

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