JP2006001042A - Manufacturing method of mold for optical part and mold for optical part - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To easily form a predetermined mold pattern to the surface of a member for a mold with high precision without requiring much processing time. <P>SOLUTION: The manufacturing method of the mold 10 for the optical part includes a process for forming a photosensitive material layer 13 on the surface of the member 11 for the mold, a process for exposing the photosensitive material layer 13 to the shape of the predetermined mold pattern 14, a process for developing the exposed photosensitive material layer 13 to form the predetermined mold pattern 14, a process for forming a metal peel layer 15 on the surface of the developed photosensitive material layer 13, a process for forming an external metal layer 16 (external rigid layer) on the surface of the metal peel layer 15, a process for melting the metal peel layer 15 and the photosensitive material layer 13 having the external metal layer 16 formed to the surface thereof, a process for forming a fixing layer 19 in the space formed by melting the photosensitive material layer 13 to fix a member 11A for the mold and a process for peeling the external metal layer 16 from the fixed member 11A for the mold. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an optical component mold used for molding an optical component such as a lens sheet having a lens array.

2. Description of the Related Art As an optical component used for a rear projection television transmission screen, a CCD, a liquid crystal display panel, and the like, a microlens sheet having a lens array in which a plurality of microlenses having a substantially hemispherical shape are arranged in a lattice shape is known. Yes. The lens array in such a microlens sheet is molded by an optical component mold in which a molding pattern corresponding to the outer shape of the microlens group is formed on the surface of the mold member.
Conventionally, a molding pattern of a mold for optical parts is formed by a method of engraving the surface of a mold member by sublimating with the heat of laser light or a method of combining a plurality of parts corresponding to each part of the molding pattern. It was.

However, all of the conventional optical component mold manufacturing methods are for manufacturing a planar mold, and when a cylinder-shaped mold is manufactured, a sufficient processing accuracy of a spherical shape can be obtained. There is a problem that the processing cannot be easily performed due to the absence of the processing, and there is a problem that a great amount of processing time is required, resulting in an increase in manufacturing cost.
On the other hand, in Patent Document 1, a resist layer is formed on the surface of a die member that has been subjected to copper plating, and a predetermined processing pattern is formed by irradiating the resist layer with laser light. A method is disclosed in which a predetermined molding pattern is formed on the surface of a mold member by corroding a copper plating layer exposed using a processing pattern as a mask with an acid.
JP 2001-30273 A

However, in the method for manufacturing a mold for optical components disclosed in Patent Document 1, after forming a fine processing pattern (especially a processing pattern of 100 μm or less) with high accuracy on a resist layer, copper plating is performed using this processing pattern as a mask. Since the layer is corroded with acid, the molding pattern for molding the lens array is formed in a non-uniform shape due to variations in acid concentration on the surface of the mold member, temperature, and the state of the copper plating layer. There is a problem of being done.
The present invention has been made in view of the above problems, and can be used to easily form a predetermined molding pattern with high accuracy on the surface of a mold member without requiring a great amount of processing time. It aims at providing the manufacturing method of a metal mold | die, and the metal mold | die for optical components.

In order to solve the above-described problems and achieve such an object, the method for manufacturing a mold for optical components according to the present invention is such that a predetermined molding pattern to be transferred to a substrate to be transferred is formed on the surface of the mold member. A method for producing a mold for optical components formed, the step of forming a photosensitive material layer on the surface of a mold member, and the step of exposing the photosensitive material layer to a shape of a predetermined molding pattern. Developing the exposed photosensitive material layer to form the predetermined molding pattern; forming a metal release layer on the surface of the developed photosensitive material layer; and forming a surface on the surface of the metal release layer. A step of forming an external rigid body layer, a step of melting the photosensitive material layer on which the metal peeling layer and the external rigid body layer are formed, and a space formed by melting the photosensitive material layer A process of forming a fixing layer and fixing a mold member It is characterized in that the fixed said mold member and a, and a step of removing the outer rigid layer.
The optical component mold according to the present invention is characterized by being manufactured by the optical component mold manufacturing method of the present invention.

According to the present invention, a predetermined molding pattern is formed on the surface of a mold member (for example, a cylinder shape or a planar shape) with a photosensitive material layer (for example, a resist layer) with high accuracy. After sequentially transferring through an external rigid body layer (for example, an external metal layer formed by electroforming or plating using a metal peeling layer as a conductive layer), the external rigid body layer is finally peeled off. Further, when the outer rigid layer is peeled off, the outer rigid layer can be peeled easily and reliably due to the presence of the metal peeling layer. Therefore, in the present invention, a fine molding pattern including a spherical shape (particularly, a molding pattern of 100 μm or less) is easily formed with high accuracy on the surface of the mold member without requiring a great amount of processing time. be able to.
In particular, in the present invention, even when a seamless cylinder-shaped mold member is used, a mold for an optical component in which a predetermined molding pattern is formed with high accuracy on the surface of the mold member is provided. You can definitely get it.

Further, in the present invention, an inner rigid layer (for example, an electroforming process or a plating process using the metal release layer as a conductive layer) on the back surface of the metal release layer exposed in the space formed by melting the photosensitive material layer. Forming a fixing layer in a space formed between the inner rigid body layer and the mold member. You may make it carry out. At this time, the step of forming the inner rigid layer is performed after the mold member is pulled out using the space formed by melting the photosensitive material, and the step of fixing the mold member is performed. Alternatively, it may be performed after the mold member is inserted again.
Further, in the present invention, the step of forming the photosensitive material layer is performed after forming a base layer on the surface of the mold member, and the step of melting the photosensitive material layer includes the step of forming the base layer. It may be melted.
In addition, in this invention, you may make it provide the process of surface-treating with respect to the metal mold | die for optical components in which the said external rigid body layer is peeled.

Embodiments of the present invention will be described below with reference to the accompanying drawings.
As shown in FIGS. 1 and 2, the optical component mold 10 according to the present embodiment is, for example, a mold member 11 having a hollow cylinder shape (may be a mold member having a planar shape). A predetermined molding pattern 14 to be transferred to an optical component as a substrate to be transferred is formed on the surface (outer peripheral surface).

As an example of the optical component molded by the optical component mold 10, it is known as an optical component used for a rear projection television transmission screen, a CCD, a liquid crystal display panel, and the like. A microlens sheet having a lens array in which a plurality of microlenses are arranged in a lattice shape can be given.
In this case, as shown in FIGS. 1 and 2, the molding pattern 14 is formed by arranging a plurality of fine concave portions having a substantially hemispherical shape corresponding to the outer shape of the microlens group of the lens array. Thus, the lens array is inverted.

  In addition, as an example of the optical component molded by the optical component mold 10, not only the micro lens sheet, but also a lenticular lens sheet, a cross wrench lens sheet, a Fresnel lens sheet, a light diffusion sheet, a prism sheet, a polarization, for example A plate, a phase difference plate, a liquid crystal optical film, etc. can be mentioned.

Hereinafter, the manufacturing method of the optical component mold 10 according to the present embodiment will be described. First, as shown in FIG. 3A, for example, a mold member 11 having a hollow cylinder shape, specifically, a length. 2 m, diameter 100 mm to 300 mm, thickness 10 mm, mold member 11 having a hollow cylinder shape with a surface difference of 2 to 3 μm / m on the surface (outer peripheral surface) (for a mold having a planar shape) It may be a member).

Next, as shown in FIG. 3B, by applying a resin material such as acrylic or polyester to the surface of the mold member 11, a predetermined thickness (for example, 0.1 mm to 2.0 mm) of the underlayer 12 is formed.
Then, as shown in FIG. 3C, for example, a positive photosensitive material such as a positive resist having sensitivity to light of a specific wavelength is applied to the surface of the base layer 12 (the surface of the mold member 11). By applying by a dip coating method, a photosensitive material layer 13 having a predetermined thickness (for example, 50 μm to 80 μm) is formed on the surface of the mold member 11.

  Next, as shown in FIG. 3D, after the photosensitive material layer 13 formed on the surface of the mold member 11 is exposed to the shape of a predetermined molding pattern 14 by the laser scanning device M, As shown in FIG. 3E, the photosensitive material layer 13 exposed to the shape of the predetermined molding pattern 14 is developed with an organic solvent, so that the photosensitive material in the portion where the chemical bond is cut is dissolved. A predetermined molding pattern 14 is formed on the photosensitive material layer 13.

Next, as shown in FIG. 4F, a metal peeling layer 15 made of, for example, Ag is formed on the surface of the photosensitive material layer 13 including the molding pattern 14 formed by developing the photosensitive material layer 13. It is formed with a predetermined thickness (for example, 0.1 μm to 5 μm).
The metal release layer 15 may be formed of Ag by a spray method or a sputtering method, may be formed of Ag by a silver mirror reaction method, or may be formed by a metal vapor deposition method, EB (Electron It may be formed of another metal by a beam) vapor deposition method or a plating method. Further, the metal peeling layer 15 may be formed by using these methods in combination instead of individually.

Next, as shown in FIG. 4G, an external metal layer 16 made of, for example, Cu is formed on the surface of the metal release layer 15 by an electroforming process or a plating process using the metal release layer 15 as a conductive layer, for example. The layer is formed with a predetermined thickness (for example, about 2 mm).
As a result, the molding pattern 14 formed on the photosensitive material layer 13 is transferred to the external metal layer 16, and the molding pattern 14 </ b> A in a state where the molding pattern 14 is inverted is formed on the external metal layer 16. .

  Next, as shown in FIG. 4 (h), a photosensitive material layer 13 having a metal release layer 15 and an external metal layer 16 formed on the surface, and an underlayer 12 having the photosensitive material layer 13 formed on the surface. Are melted with an organic solvent such as MBK (methyl butyl ketone) while applying heat to the mold member 11, so that the metal peeling layer 15 and the outer metal layer 16 are spaced from the surface of the mold member 11. A space 17 is formed.

Next, as shown in FIG. 4 (i), the mold member 11 is removed from the outer metal layer 16 by utilizing a space 17 formed by melting the photosensitive material layer 13 and the underlayer 12. Pull out.
Then, as shown in FIG. 4 (j), for example, Cr, Ni, etc. on the back surface of the metal release layer 15 exposed in the space 17 by electroforming or plating using the metal release layer 15 as a conductive layer. An internal metal layer 18 made of Cu or the like is formed as an internal rigid body layer with a predetermined thickness (for example, about 2 mm).

As a result, the molding pattern 14A formed on the outer metal layer 16 is transferred to the inner metal layer 18, and the inner metal layer 18 has the molding pattern 14 in a state where the molding pattern 14A is inverted, that is, photosensitive. A molding pattern 14 formed on the material layer 13 is formed.
Here, the internal metal layer 18 may be composed of, for example, one layer obtained by electroforming a metal thickly, or may be composed of, for example, a plurality of layers obtained by electroforming a metal a plurality of times. Furthermore, you may make it grind | polish the internal peripheral surface (the back surface of the internal metal layer 18 exposed in the said space 17) of the internal metal layer 18 as needed.

Next, as shown in FIG. 5 (k), in the outer metal layer 16 after the mold member 11 has been pulled out, a mold member 11A ( The mold member 11 that has been pulled out in advance may be inserted again, and the center of the mold member 11A and the center of the outer metal layer 16 are aligned.
Then, as shown in FIG. 5 (l), in the space 17 formed by melting the photosensitive material 13 (in the space 17 formed between the internal metal layer 18 and the surface of the mold member 11A). ) Is filled with a fixing material such as a heat-resistant resin or metal, and the fixing material is cured to form the fixing layer 19, thereby fixing the mold member 11 </ b> A in the external metal layer 16.

Next, as shown in FIG. 5 (m), the outer metal layer 16 is scratched from the outer peripheral side using, for example, a blade B, as shown in FIG. 5 (n). The outer metal layer 16 is peeled from the mold member 11A fixed in the inside 16, specifically, the inner part having the mold member 11A, the fixed layer 19 and the predetermined molding pattern 14 with the metal peeling layer 15 as a boundary. The outer metal layer 16 is peeled from the metal layer 18.
By passing through the above processes, the optical component mold 10 according to the present embodiment as shown in FIG. 5 (o) can be manufactured. If necessary, surface treatment is performed on the optical component mold 10 from which the external metal layer 16 has been peeled off, for example, on the surface of the optical component mold 10 from which the external metal layer 16 has been peeled off. By applying an electrolytic plating process to form a hard coating made of Cr or the like with a predetermined thickness (for example, 0.1 μm to 0.5 μm), the surface shape and surface stability of the mold 10 for optical parts, that is, molding The surface shape and surface stability of the pattern 14 may be reinforced.

In the present embodiment described above, a predetermined molding pattern 14 is formed with high accuracy on the surface of the cylinder-shaped mold member 11 using, for example, the photosensitive material layer 13 which is a positive resist layer. After the molding pattern 14 is sequentially transferred through the external metal layer 16 and the like, the external metal layer 16 is finally peeled off. Further, when the outer metal layer 16 is peeled off, the outer metal layer 16 can be easily and reliably peeled off due to the presence of the metal peeling layer 15 that is also used as a conductive layer during electroforming or plating. It can be done.
For this reason, in particular, the processing of the molding pattern 14 on the surface of the cylinder-shaped mold member 11A does not require much processing time, and a fine molding pattern including a spherical shape (particularly a molding pattern of 100 μm or less). Can be easily formed with high accuracy on the surface of the mold member 11A.
Instead of the external metal layer 16 (external rigid body layer), for example, an external rigid body layer made of a resin such as epoxy can be used. In this case, the optical component mold 10 according to the present embodiment can be manufactured by melting the outer rigid layer made of resin with, for example, an acetone-based organic solvent while applying heat (referred to in the claims). “The step of peeling the outer rigid layer” includes the step of melting the outer rigid layer made of resin).

In the present embodiment, the photosensitive material layer 13 having the metal release layer 15 and the outer metal layer 16 formed on the surface is melted, and the back surface of the metal release layer 15 exposed in the space 17 generated at that time is exposed. By forming the inner metal layer 18, a predetermined molding pattern 14 is formed on the inner metal layer 18.
Therefore, it is possible to replace the photosensitive material layer 13 having a relatively low strength with the internal metal layer 18 having a sufficient strength, and a sufficient strength against the molding pattern 14 formed on the surface of the mold member 11A. Can be applied to extend the life.
Instead of the internal metal layer 18 (internal rigid body layer), for example, an internal rigid layer made of a thermoplastic resin having a predetermined strength (preferably a thermoplastic resin with little curing shrinkage) can be used.

Here, since the internal metal layer 18 is formed after the mold member 11 is pulled out from the external metal layer 16, the internal metal layer 18 can be easily formed by electroforming or plating. Can do.
Moreover, since the space 17 generated by melting not only the photosensitive material layer 13 but also the base layer 12 is used for pulling out the mold member 11, only the amount of the base layer 12 exists. The space 17 can be enlarged, and the mold member 11 can be easily pulled out.

In this embodiment, the inner metal layer 18 is formed after the mold member 11 is pulled out from the outer metal layer 16, but the present invention is not limited to this, and the mold member is not limited thereto. 11 does not have to be extracted.
For example, as shown in FIG. 6A, the photosensitive material layer 13 and the base layer 12 are melted, and as shown in FIG. 6B, the metal peeling layer 15 exposed in the space 17 is left in that state. An inner metal layer 18 is formed on the back surface of the substrate. Thereafter, as shown in FIG. 6C, a fixing layer 19 is formed in the space 17 to fix the mold member 11, and the outer metal layer 16 is damaged as shown in FIG. , The optical component mold 10 according to the present embodiment can be manufactured. In this case, since the mold member 11 is not pulled out, the base layer 12 may not be formed.

In the present embodiment, the internal metal layer 18 is formed on the back surface of the metal release layer 15 exposed in the space 17, but the present invention is not limited to this, and the internal metal layer 18 is not formed. It doesn't matter.
For example, as shown in FIG. 7A, the photosensitive material layer 13 and the base layer 12 are melted, and as shown in FIG. 7B, the state is maintained in the space 17 (the metal peeling layer 15 and the gold layer). The fixing layer 19 is formed in the space 17 formed between the surface of the mold member 11 and the mold member 11 is fixed, and the molding pattern 14A formed on the external metal layer 16 is fixed to the fixing layer 19. Then, the molding pattern 14 is formed on the fixed layer 19. Thereafter, as shown in FIG. 7C, by scratching the outer metal layer 16, the optical component mold 10 according to the present embodiment can be manufactured. In this case, since the mold member 11 is not pulled out, the base layer 12 may not be formed.

It is a perspective view which shows the metal mold | die for optical components by embodiment of this invention. It is the sectional view on the AA line in FIG. It is explanatory drawing which shows the manufacturing method of the metal mold | die for optical components by embodiment of this invention in order of a process. It is explanatory drawing which shows the manufacturing method of the metal mold | die for optical components by embodiment of this invention in order of a process. It is explanatory drawing which shows the manufacturing method of the metal mold | die for optical components by embodiment of this invention in order of a process. It is explanatory drawing which shows the manufacturing method of the metal mold | die for optical components by other embodiment of this invention in process order. It is explanatory drawing which shows the manufacturing method of the metal mold | die for optical components by further another embodiment of this invention in order of a process.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Mold for optical components 11, 11A Mold member 12 Underlayer 13 Photosensitive material layer 14 Molding pattern 15 Metal peeling layer 16 External metal layer (external rigid body layer)
17 Space 18 Internal metal layer (Internal rigid body layer)
19 Fixed layer

Claims (11)

A method for producing a mold for optical components, wherein a predetermined molding pattern to be transferred to a substrate to be transferred is formed on the surface of a mold member,
Forming a photosensitive material layer on the surface of the mold member;
Exposing the photosensitive material layer to the shape of a predetermined molding pattern;
Developing the exposed photosensitive material layer to form the predetermined molding pattern; and
Forming a metal release layer on the surface of the developed photosensitive material layer;
Forming an external rigid body layer on the surface of the metal release layer;
Melting the photosensitive material layer having the metal release layer and the external rigid body layer formed on a surface thereof;
Forming a fixing layer in a space formed by melting the photosensitive material layer and fixing the mold member;
Peeling the outer rigid body layer from the fixed mold member;
The manufacturing method of the metal mold | die for optical components characterized by the above-mentioned. A method for producing a mold for optical components according to claim 1,
A method of manufacturing a mold for optical components, wherein the step of forming the outer rigid layer is performed by electroforming or plating using the metal release layer as a conductive layer. A method for producing a mold for optical components according to claim 1 or 2,
Forming an internal rigid body layer on the back surface of the metal release layer exposed in the space formed by melting the photosensitive material layer,
The step of fixing the mold member is performed by forming a fixed layer in a space formed between the inner rigid body layer and the mold member. Method. It is a manufacturing method of the metallic mold for optical components according to claim 3,
A method of manufacturing a mold for optical components, wherein the step of forming the internal rigid layer is performed by electroforming or plating using the metal release layer as a conductive layer. A method for producing a mold for optical components according to claim 3 or claim 4,
The step of forming the internal rigid layer is performed after pulling out the mold member using a space formed by melting the photosensitive material,
A method for manufacturing a mold for optical components, wherein the step of fixing the mold member is performed after the mold member is reinserted. It is a manufacturing method of the metallic mold for optical components in any one of Claims 1-5,
The step of forming the photosensitive material layer is performed after forming a base layer on the surface of the mold member,
A method for producing a mold for optical components, wherein the underlayer is also melted in the step of melting the photosensitive material layer. It is a manufacturing method of the metallic mold for optical components in any one of Claims 1-6,
A method for producing a mold for optical components, comprising a step of performing a surface treatment on a mold for optical components formed by peeling off the external rigid body layer. It is a manufacturing method of the metallic mold for optical components in any one of Claims 1-7,
The method for producing a mold for optical parts, wherein the photosensitive material layer is a resist layer. It is a manufacturing method of the metallic mold for optical components in any one of Claims 1-8,
The method for manufacturing a mold for optical components, wherein the mold member is cylindrical. It is a manufacturing method of the metallic mold for optical components in any one of Claims 1-8,
The method for producing a mold for optical components, wherein the mold member has a planar shape. An optical component mold manufactured by the method for manufacturing an optical component mold according to any one of claims 1 to 10.

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