JP2005350639A - Heat-conductive electrical insulating member, semiconductor package and method for producing the heat-conductive electrical insulating member - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a heat-conductive electrical insulating material usable for a substrate of an electronic part, a radiator or the like, having excellent heat conductivity. <P>SOLUTION: The material is the heat-conductive electrical insulating material 1 comprising a substrate 2 and an organic-inorganic hybrid layer 3 integrally formed on the surface of the substrate 2. The organic-inorganic hybrid layer 3 comprises an organic-inorganic hybrid formulation obtained by mixing a sol obtained by reacting a metal alkoxide with an organopolysiloxane having functional groups reactive with the metal alkoxide at one terminal or both terminals, with a heat-conductive filler. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

The present invention relates to a heat conductive electrically insulating member used as a heat radiating member of a heat-generating electronic component and a method for manufacturing the member.
Furthermore, the present invention relates to a semiconductor package in which a semiconductor chip is mounted on the thermally conductive electrical insulating member and sealed with an epoxy resin.

With the improvement in performance of electric and electronic devices, the power consumption of these heat generating electronic components is increasing. For this reason, the amount of heat generated from the heat-generating electronic components is also increasing, and efficiently removing heat from the heat-generating electronic components has become an important issue in heat countermeasures for electrical and electronic devices.
Therefore, as a method of cooling the heat-generating electronic component, generally, a heat sink such as a metal plate or a radiator (heat sink) is press-contacted to the surface of the heat-generating electronic component via a heat conductive sheet or grease. In order to increase the heat dissipation area, it has been carried out. The heat conductive sheet is required to have particularly high electrical insulation and heat conductivity.

  As a material for the heat conductive sheet, a composition in which a heat conductive filler is blended with a composition having a silicone rubber as a base polymer has been used from the viewpoint of electrical insulation, heat resistance, flexibility, and the like ( For example, see Patent Document 1).

JP 2001-294840 A

When using a composition having a silicone rubber as a base polymer as the material of the heat conductive sheet, it is necessary to add a heat conductive filler to the silicone rubber composition to impart heat conductivity. The rubber composition has a high viscosity, and there is a problem that a large amount of a heat conductive filler cannot be added even if high heat conductivity is to be imparted.
Moreover, when a heat conductive filler is highly blended with this silicone rubber composition, there exists a problem that the heat resistance of the heat conductive sheet which consists of this silicone rubber composition will worsen.
Furthermore, when bonding the heat conductive sheet to another member such as a metal plate, the silicone rubber composition is pre-blended with an adhesive aid and baked or formed between the heat conductive sheet and the other member. It was necessary to interpose an adhesive layer.

As a means for solving the above problems, the present invention provides a sol solution obtained by reaction of a metal alkoxide with an organopolysiloxane having a functional group capable of reacting with the metal alkoxide at one or both ends. Provided is a thermally conductive electrical insulating member 1 in which an organic / inorganic hybrid compound mixed with a filler is formed on the surface of a substrate 2 as an organic / inorganic hybrid layer 3.
The thermally conductive filler is preferably fine particles of metal oxide and / or metal nitride and / or metal carbide.
The thermally conductive filler is a mixture of two or more kinds of the same or different kinds of fillers having different particle diameters, and the difference in the particle diameters is desirably three times or more.
Furthermore, it is desirable that 50 to 3000 parts by mass of the thermally conductive filler is mixed with 100 parts by mass of the sol solution.
The metal of the metal alkoxide is one or two selected from boron, aluminum, silicon, titanium, vanadium, manganese, iron, cobalt, zinc, germanium, yttrium, zirconium, niobium, lanthanum, cerium, cadmium, tantalum, and tungsten. The above metal is desirable.
The present invention is also obtained as a means for solving the above-mentioned problems by reacting a metal alkoxide on the surface of a substrate with an organopolysiloxane having a functional group capable of reacting with the metal alkoxide at one or both ends. A method for producing a thermally conductive electrically insulating member, in which an organic / inorganic hybrid layer made of an organic / inorganic hybrid compound in which a thermally conductive filler is mixed with a sol solution is integrally formed and the organic / inorganic hybrid layer is heated and gelled. provide.
The thermally conductive filler is preferably fine particles of metal oxide and / or metal nitride and / or metal carbide.
The heat conductive filler is a mixture of two or more kinds of the same or different kinds of fillers having different particle diameters, and the difference in the particle diameters is desirably three times or more.
The thermally conductive filler is desirably mixed in an amount of 50 to 3000 parts by mass with respect to 100 parts by mass of the sol solution.
The metal of the metal alkoxide is one or two selected from boron, aluminum, silicon, titanium, vanadium, manganese, iron, cobalt, zinc, germanium, yttrium, zirconium, niobium, lanthanum, cerium, cadmium, tantalum, and tungsten. The above metal is desirable.
Moreover, this invention provides the heat conductive electrical insulation member which formed the epoxy resin layer on the organic-inorganic hybrid layer currently formed in the base-material surface of the said heat conductive electrical insulation member.
Still further, the present invention provides a semiconductor chip bonded on the organic / inorganic hybrid layer formed on the surface of the base material of the heat conductive electrical insulating member, and an epoxy on the organic / inorganic hybrid layer including the semiconductor chip. A semiconductor package in which a resin layer is formed and the semiconductor chip is sealed is provided.

The heat conductive electrical insulation member of the present invention is particularly excellent in heat conductivity, electrical insulation, and heat resistance.
In addition, in a heat conductive electrical insulating member in which an epoxy resin layer is formed on an organic / inorganic hybrid layer, the organic / inorganic hybrid layer and the epoxy resin layer are firmly bonded and do not peel off due to vibration or the like. .

  The heat conductive electrically insulating member 1 of the present invention is obtained by integrally forming an organic / inorganic hybrid layer on the surface of a substrate 2. The organic / inorganic hybrid layer is an organic / inorganic hybrid layer in which a thermally conductive filler is mixed with a sol obtained by reaction of a metal alkoxide with an organopolysiloxane having a functional group capable of reacting with the metal alkoxide at one or both ends. It consists of an inorganic hybrid formulation.

〔Base material〕
The base material used in the present invention is, for example, carbon steel for mechanical structures, alloy steel, nickel chrome steel, nickel chrome molybdenum steel, chrome steel, aluminum chrome molybdenum steel, austenitic stainless steel, ferritic stainless steel, martensitic stainless steel. , Copper and copper alloys, gold silver and their alloys, metal materials such as metals surface-treated with dissimilar metals, simple oxide alumina, magnesia, beryllia, zirconia, silicate silica, holsterite, It is made of ceramic materials such as steatite, zircon, double oxide aluminum titanate, sialon, boron nitride, titanium nitride, carbide, boride and silicide. Moreover, resin with favorable heat conductivity, such as a polyimide resin, can be used as a base material of this invention.
The shape of the base material 2 used in the present invention is, for example, a plate-like base material 2 as shown in FIG. The shape of the base material used in the present invention may be the shape of the base material 2A as shown in FIG.

[Metal alkoxide]
Metal types of metal alkoxide used in the present invention include boron, aluminum, silicon, titanium, vanadium, manganese, iron, cobalt, zinc, germanium, yttrium, zirconium, niobium, lanthanum, cerium, cadmium, tantalum, tungsten Among them, particularly desirable metals are titanium and zirconium.
The type of alkoxide is not particularly limited. For example, methoxide, ethoxide, n-propoxide, iso-propoxide, n-butoxide, iso-butoxide, sec-butoxide, tert-butoxide, methoxyethoxide, ethoxyethoxy And the like.
The alkoxide is selected by appropriately considering the reactivity with the organopolysiloxane to be used, but it is generally desirable to use propoxide.
The metal is desirably chemically modified with a chemical modifier such as acetoacetate such as methyl acetoacetate, ethyl acetoacetate, and isopropyl acetoacetate.

[Organopolysiloxane]
As the polyorganosiloxane used in the present invention, it is desirable to use an organopolysiloxane having a functional group capable of reacting with a metal alkoxide at one or both ends, such as one-end or both-end silanol polydimethylsiloxane.

As the organopolysiloxane, those having a weight average molecular weight in the range of 400 to 70000 are generally used. From the viewpoint of reactivity with the metal alkoxide, an organopolysiloxane having a weight average molecular weight in the range of 5,000 to 40,000 is preferable.
An organic / inorganic hybrid layer using an organopolysiloxane having a weight average molecular weight within the above range hardly deteriorates even when continuously used under high temperature conditions, and functions such as thermal conductivity and insulation are stable.
When the weight average molecular weight of the organopolysiloxane is less than 5000, the resulting organic / inorganic hybrid layer lacks heat resistance and durability.
It is desirable to use an organopolysiloxane having a weight average molecular weight of 15000 or higher under a high temperature condition of 150 ° C. or higher. When the weight average molecular weight of the organopolysiloxane exceeds 70,000, the viscosity of the sol solution becomes too high and it becomes difficult to blend the filler.
When the weight average molecular weight of the organopolysiloxane is less than 15,000, the resulting organic / inorganic hybrid material has poor heat resistance.

  The functional group capable of reacting with the metal or semi-metal alkoxide at one or both ends of the organopolysiloxane is, for example, the following functional groups (Chemical Formula 1 to Chemical Formula 13). In the chemical formula, R and R ′ represent methylene, alkylene, and alkyl.

但し、X=−OCH3、−OC₂H₅等のアルコキシル基、
−Cl、Br等のハロゲン原子

However, X = -OCH3, alkoxyl groups such as -OC ₂ H _5,
-Halogen atoms such as Cl and Br

Moreover, you may use a dialkyl dialkoxysilane with the said organopolysiloxane as needed.
Examples of the dialkyl dialkoxysilane include dimethyldimethoxysilane, dimethyldiethoxysilane, dimethyldipropoxysilane, dimethyldibutoxysilane, diethyldimethoxysilane, diethyldiethoxysilane, diethyldipropoxysilane, diethyldibutoxysilane, and dipropyl. Examples include dimethoxysilane, dipropyldiethoxysilane, dipropyldipropoxysilane, dipropyldibutoxysilane, diphenyldimethoxysilane, diphenyldiethoxysilane, diphenyldipropoxysilane, diphenyldibutoxysilane, and the like.

(Thermal conductive filler)
The thermally conductive filler used in the present invention is desirably fine particles of metal oxide and / or metal nitride and / or metal carbide. For example, aluminum oxide, magnesium oxide, zinc oxide, nickel oxide, titanium oxide, silicon oxide, vanadium oxide, copper oxide, iron oxide, silver oxide, or other metal oxide, or aluminum nitride, boron nitride, silicon carbide, silicon nitride, etc. Metal nitride or metal carbide.
The particle shape of the thermally conductive filler may be either spherical or flaky, but the average particle size is usually preferably in the range of 0.1 μm to 300 μm.
A heat conductive filler is added to the sol liquid obtained by mixing a metal alkoxide solution and an organopolysiloxane solution. In order to improve dispersibility in the sol liquid and physical properties, the heat conductive filler may be subjected to a surface treatment. As the surface treatment method, for example, there is a treatment method using a silane coupling agent. Examples of the silane coupling agent include N-hexyltriethoxysilane, N-hexyltrimethoxysilane, N-octyltriethoxysilane, N-decyltrimethoxysilane, phenyltrimethoxysilane, phenyltriethoxysilane, and diphenyldimethoxy. Examples include silane, diphenyldiethoxysilane, and commercially available silane coupling agents.
The heat conductive filler may be added to the organopolysiloxane solution. A sol solution may be prepared by adding a metal alkoxide solution to the organopolysiloxane after addition of the thermally conductive filler.
The heat conductive filler used in the present invention is preferably used as a mixture of two or more kinds of the same or different heat conductive fillers having different particle diameters. The difference in particle diameter of the thermally conductive filler is preferably 3 times or more.

[Manufacture of organic / inorganic hybrid compounds]
In order to produce an organic / inorganic hybrid compound, first, a metal alkoxide solution containing a hydrolyzate of a desired metal alkoxide is mixed with the organopolysiloxane solution, and one or both ends of the organopolysiloxane are mixed. An organic / inorganic hybrid sol solution is prepared by conducting a condensation reaction involving hydrolysis of a functional group capable of reacting with a metal alkoxide and the metal alkoxide.

  Specifically, the metal alkoxide or, if desired, a metal alkoxide modified with the chemical modifier is dropped into the organopolysiloxane solution.

  The solvent used in the organopolysiloxane solution is selected in consideration of the solubility of the organopolysiloxane and metal alkoxide, but in general, alcohols such as methanol and ethanol, acetone, toluene, xylene, tetrahydrofuran and the like are used. I can do it.

  When the metal alkoxide added to the organopolysiloxane solution is chemically modified by a chemical modifier, the amount of the chemical modifier is 2 mol or less, preferably 0.5 mol or more and 1 mol or less, relative to 1 mol of the metal alkoxide. Used in.

The amount of the metal alkoxide added to the organopolysiloxane is usually in the range of 1: 0.1 to 1:30 in molar ratio.
The organopolysiloxane is preferably about 80% by volume with respect to the metal alkoxide.
When there are more metal components than the above ratio, the metal components form agglomerates, and swells and pores are formed in the resulting organic / inorganic hybrid layer, and when there are many organopolysiloxanes, the synergistic effect of the inorganic and organic components Does not appear and approaches the characteristics of the organic component.

The above-mentioned organic / inorganic hybrid sol liquid is mixed with the thermally conductive filler to obtain an organic / inorganic hybrid blend.
The amount of the thermally conductive filler added is usually preferably 100 to 3000 parts by mass, more preferably 100 to 2500 parts by mass with respect to 100 parts by mass of the organic / inorganic hybrid sol liquid. Since the organic / inorganic hybrid sol liquid of the present invention is excellent in filler dispersibility, the heat conductive filler can be easily dispersed uniformly.

  In addition to the thermally conductive filler, the organic / inorganic hybrid sol liquid may contain a filler such as an antioxidant, an ultraviolet absorber, an antiseptic, an adhesion-imparting agent, and a viscosity modifier, if desired. . The organic / inorganic hybrid sol solution obtained as described above does not become cloudy and becomes a sol solution having a long pot life.

[Formation of organic / inorganic hybrid layer]
The organic / inorganic hybrid blend is integrally formed as an organic / inorganic hybrid layer on the surface of the substrate.
The organic / inorganic hybrid layer integrally formed on the surface of the substrate is further gelled by heating.
The organic / inorganic hybrid layer may be formed partially or entirely on the substrate surface. Here, when the substrate is plate-shaped, an organic / inorganic hybrid layer may be formed on one or both surfaces of the substrate. Further, the organic / inorganic hybrid layer may be formed entirely or partially on the surface of the plate-like substrate.

Examples of the method for integrally forming the sol solution layer on the substrate surface (integral molding method) include an insert transfer molding method, a screen printing method, a doctor blade method, and a dip coating method.
Before forming the organic / inorganic hybrid layer on the substrate surface, the substrate surface may be degreased and washed in advance.
Further, if desired, the adhesion between the organic / inorganic hybrid layer and the substrate may be improved by treating the surface of the substrate with a primer.
In order to form the organic / inorganic hybrid layer integrally on the surface of the base material without gaps and with good adhesion, the insert transfer molding method and the screen printing method are particularly desirable.

Here, an insert transfer molding method will be described as an example of a method for integrally forming the organic / inorganic hybrid layer on the substrate surface in the present invention.
A schematic view of a mold used in the molding method is shown in FIG. The mold 5 includes an upper mold 6, a lower mold 7, and a piston mold 8. In the upper part of the upper mold, there is a cylinder part 9 for storing a sol-like organic / inorganic hybrid compound containing a heat conductive filler. The upper mold 6 and the lower mold 7 have an upper mold recess 10 and a lower mold recess 11 for fitting and fixing the base material 2 respectively. A cavity 12 is provided above the upper mold recess 10, and the cavity 12 and the cylinder portion 9 are connected by a plurality of liners 13 and 13. The piston mold 8 located above the upper mold 6 has a convex portion 14 that fits into the shape of the cylinder portion 9 of the upper mold 6.
The process of forming the organic / inorganic hybrid layer 3 on the substrate 2 will be described. First, the base material 2 is fitted into the lower mold recess 11 of the lower mold 7. At this time, the base material 2 is not completely fitted into the lower mold recess 11, but is fitted to a position half the thickness of the base material 2, for example. Next, the upper mold 6 and the lower mold 7 are overlapped while the lower mold 7 fitted with the base material 2 is fitted into the upper mold concave portion 10.
Next, the organic / inorganic hybrid blend is filled into the upper cylinder portion 9, and the tip portion of the convex portion 14 of the piston mold 8 is fitted into the cylinder portion 9 filled with the blend.
The mold 5 in this state is put into a vacuum press, pressurized from above the piston mold 8 while reducing the pressure, and the piston mold 8 is lowered. When the piston mold 8 is lowered, the sol solution in the cylinder section 9 is pressed by the convex section 14 of the piston mold 8 and is pressed into the cavity 12 through the liners 13 and 13 to form an organic / inorganic hybrid layer on the substrate 2. To do. When the mold is opened after the organic / inorganic hybrid layer is formed, the substrate 2 on which the organic / inorganic hybrid layer is formed is obtained.
Since the formed organic / inorganic hybrid layer is integrally formed on the substrate 2, the adhesion between the substrate 2 and the organic / inorganic hybrid layer is excellent. Therefore, a fine gap is not generated between the substrate 2 and the organic / inorganic hybrid layer.

  When forming layers of the organic / inorganic hybrid sol solution on both surfaces of the substrate 2, as shown in FIG. 4, a substrate 2A having holes 4 and 4 provided at predetermined locations is used, and the lower mold is used. What is necessary is just to use the metal mold | die 5A which has the lower mold | type 7A which further opened the cavity 15 under the lower mold | type recessed part 11A of 7A. In this case, the sol-like organic / inorganic hybrid compound filled in the cylinder portion 9 is pressed against the convex portion 14 of the piston mold 8 as the piston mold 8 is lowered, and the upper mold 6 is passed through the liners 13 and 13. Press fit into the cavity 9. The organic / inorganic mixture press-fitted into the cavity 9 is further press-fitted into the cavity 15 of the lower mold 7A through the holes 4 and 4 of the substrate 2A.

The base material on which the organic / inorganic hybrid layer is formed is subsequently subjected to a firing step, and the organic / inorganic hybrid layer is gelled.
In this way, a heat conductive electrically insulating member in which the organic / inorganic hybrid layer is integrally formed on the surface of the substrate is obtained.

[Thermal conductive electrical insulation]
The heat conductive electrical insulating member of the present invention comprises a base material and an organic / inorganic hybrid layer formed on the surface of the base material, and the base material and the organic / inorganic hybrid layer are integrally formed. It is manufactured.
The thickness of the organic / inorganic hybrid layer is preferably 0.05 mm to 5 mm.
The organic / inorganic hybrid layer preferably has a hardness (JIS K6253 constant load type M method) of 35 to 90.

An example of the thermally conductive electrical insulating member of the present invention is, for example, a thermally conductive electrical insulating member 1 in which an organic / inorganic hybrid layer 3 is formed on the upper surface of a plate-like substrate 2 as shown in FIG. . This heat conductive electrically insulating member 1 can be used for, for example, an IGBT (Insulated Gate Bipolar Transistor) module.
As another example, there is a thermally conductive electrically insulating member 1A in which an organic / inorganic hybrid layer 3 is formed on both surfaces of a plate-like substrate 2A as shown in FIG.
As another example, there is a thermally conductive electrically insulating member 1B in which an organic / inorganic hybrid layer 3 is formed on the bottom surface of a substrate 2B as shown in FIG.
This heat conductive electrically insulating member 1B can be used, for example, as a radiator of an electronic component.

As yet another example, there is a thermally conductive electrical insulating member in which an epoxy resin layer is formed on the organic / inorganic hybrid layer formed on the surface of the base material of the thermally conductive electrical insulating member 1.
The epoxy resin layer is formed by mixing an epoxy resin and a curing agent, adding a solvent if desired, and applying the mixture to the surface of the organic / inorganic hybrid layer. It can also be formed by preparing a semi-cured sheet by mixing an epoxy resin and a curing agent, pressing the sheet onto the organic / inorganic hybrid layer, and completely curing the sheet. A glass fiber sheet may be impregnated with a mixture of an epoxy resin and a curing agent, and semi-cured to form a prepreg, and the prepreg may be pressure-bonded onto the organic / inorganic hybrid layer.

  The organic / inorganic hybrid layer and the epoxy resin layer of the heat conductive electrical insulating member are excellent in affinity, and the organic / inorganic hybrid layer and the epoxy resin layer are firmly bonded. Therefore, the organic / inorganic hybrid layer and the epoxy resin layer do not peel off due to vibration or the like.

  A semiconductor chip is mounted on the organic / inorganic hybrid layer formed on the surface of the base material of the heat conductive electrical insulating member 1, and an epoxy resin layer is formed on the organic / inorganic hybrid layer including the semiconductor chip. A semiconductor package is obtained by forming and sealing the semiconductor chip.

  The epoxy resin used in the present invention has an average of two or more epoxy groups in one molecule, and the kind thereof is not particularly limited. Specific examples thereof include phenolic glycidyl ether type epoxy resins such as bisphenol-A, bisphenol-F, tetrabromobisphenol-A, tetraphenylolethane, phenol novolac, cresol novolac, polypropylene glycol, hydrogenated bisphenol-A. Alcohol-based glycidyl ether type epoxy resins such as glycidyl ester type epoxy resins made from hexahydrophthalic anhydride or dimer acid, glycidyl amine type epoxy resins such as hydantoin, isocyanuric acid, diaminodiphenylmethane, aminophenol and oxybenzoic acid Examples thereof include mixed epoxy resins, alicyclic epoxy resins, and brominated epoxy resins as raw materials. These may be used alone or in combination of two or more.

  Examples of the curing agent used in the present invention include known curing agents for epoxy resins such as amine-based curing agents, acid anhydride-based curing agents, and dihydrazide-based curing agents.

  In addition, a well-known hardening accelerator, a plasticizer, a coloring agent, and a filler may be added to the said epoxy resin.

  Examples of the solvent added to the epoxy resin include ethers such as tetrahydrofuran (THF) and N-methylpyrrolidone (NMP), amides such as dimethylformamide (DMF) and dimethylacetamide (DMA), acetone and 2 -Reactive diluents such as glycidyl methacrylate usually used in ketones such as butanone (MEK), alcohols such as methanol, ethanol, 2-propanol and butanol, or organic solvents such as methyl ethyl cellolb and epoxy resins A known solvent is used.

  Examples for more specifically explaining the present invention will be described below.

[Example 1]
Liquid A was prepared by heat-treating 0.35 mol of silanol dimethylpolysiloxane at both ends (weight average molecular weight: 38000, YF3057, manufactured by GE Toshiba Silicones).
On the other hand, 1 mol of zirconium propoxide and 0.5 mol of ethyl acetoacetate were reacted in a nitrogen atmosphere to prepare zirconium propoxide chemically modified with ethyl acetoacetate (Liquid B).
B liquid was dripped and mixed with the said A liquid, and the sol liquid (C liquid) was prepared.
Prepare 100 parts by mass of sol liquid (C liquid), add 750 parts by mass, 1000 parts by mass, 1500 parts by mass, and 2000 parts by mass of alumina to each sol, and knead them with a kneader. Thus, four kinds of compounded liquids (a sol liquid of an organic / inorganic hybrid compound) containing alumina were obtained.
In addition, the said alumina is uniform in the mass ratio of 1: 4 for the aluminum oxide of average particle diameter 3.0micrometer (AL-30, Showa Denko Co., Ltd.) and 40.0 micrometers (AS-10, Showa Denko Co., Ltd.). Dispersed and mixed.
Next, an organic / inorganic hybrid layer is formed on one side of each of the above four kinds of blended liquids by a transfer transfer molding method on one side of a substrate (aluminum plate, thickness: 0.20 mm), and then the organic / inorganic hybrid layer is formed. The formed substrate was fired in a heating furnace. The firing conditions were 100 ° C. × 2 hours, 120 ° C. × 2 hours, 150 ° C. × 2 hours, 180 ° C. × 2 hours, 200 ° C. × 2 hours, 250 ° C. × 2 hours, 300 ° C. × 2 hours. It was.
After firing, the thickness of the organic / inorganic hybrid layer formed on each substrate was 0.3 mm. As described above, four types of thermally conductive electrical insulating members were produced.

The thermal resistance value and thermal conductivity of the obtained heat conductive electrical insulation member were evaluated. The thermal resistance value was measured based on ASTM D5470, and the thermal conductivity was measured based on JIS R2616. The results are shown in Table 1.
Moreover, the dielectric breakdown voltage of each heat conductive electrical insulation member was measured. The dielectric breakdown voltage was measured based on JIS-K-6249.

  It was confirmed that any heat conductive electrical insulation member has an excellent heat dissipation effect. Moreover, it was confirmed that any heat conductive electrical insulation member showed high electrical insulation performance.

  Furthermore, the heat conductive electrical insulating member was heated under the conditions of 200 ° C. × 500 hours, and the heat resistance was evaluated. As a result of the evaluation, none of the thermally conductive electrical insulating members decomposed or deteriorated on the surface under the above temperature conditions.

  Next, after the elements of the IGBT power module are pressure-bonded onto the organic / inorganic hybrid layer formed on each base material, vacuum casting is performed with an epoxy resin for insulation sealing (Pernox ME502, manufactured by Nihon Pernox Corporation). -After filling, Samples 1, 2, 3, and 4 were produced by heat molding at 120 ° C for 2 hours.

Each adhesion state of the organic-inorganic hybrid layer formed on the base material of the sample and the epoxy resin layer for insulating sealing was measured. The adhesion state was measured according to JIS K6850.
The organic / inorganic hybrid layer and the epoxy resin layer of any sample were strongly bonded to each other, and interface fracture occurred in the sample.
Therefore, it was confirmed that the organic / inorganic hybrid layer and the epoxy resin layer of any sample were bonded with an adhesive force higher than the material strength.

[Example 2]
Dual-end silanol dimethylpolysiloxane: a material obtained by heat treatment (weight average molecular weight 38000, YF3057, GE Toshiba Silicone) 0.35 mol was A ₁ liquid.
On the other hand, under nitrogen atmosphere, by reacting a zirconium propoxide 1mol ethyl acetoacetate 0.5 mol, to prepare a chemically modified zirconium propoxide with ethyl acetoacetate (B ₁ liquid).
Dropwise B ₁ liquid to the A ₁ solution was prepared by mixing the sol solution (C ₁ solution).
Prepare 100 parts by mass of sol solution (C ₁ solution), add 750 parts by mass, 1000 parts by mass, 1500 parts by mass, and 2000 parts by mass of alumina to each sol, and knead them with a kneader. Thus, four kinds of compounded liquids (a sol liquid of an organic / inorganic hybrid compound) containing alumina were obtained.
In addition, the alumina similar to the said Example 1 was used for the said alumina.
Next, the above four kinds of blended liquids are each formed on one side of a base material (thermally conductive polyimide film, Kapton MT, manufactured by Toray DuPont Co., Ltd., thickness: 0.05 mm) by an organic and inorganic hybrid layer by an insert transfer molding method. After that, the base material on which the organic / inorganic hybrid layer was formed was fired in a heating furnace. The firing conditions were 100 ° C. × 2 hours, 120 ° C. × 2 hours, 150 ° C. × 2 hours, 180 ° C. × 2 hours, 200 ° C. × 2 hours, 250 ° C. × 2 hours, 300 ° C. × 2 hours. It was.
After firing, the thickness of the organic / inorganic hybrid layer formed on each substrate was 0.3 mm. As described above, four types of thermally conductive electrical insulating members were produced.

  The thermal resistance value and thermal conductivity of the obtained heat conductive electrical insulating member were evaluated. The evaluation method is the same as in Example 1 above. The results are shown in Table 2. Moreover, the dielectric breakdown voltage of each heat conductive electrical insulation member was also measured. The dielectric breakdown voltage was also measured in the same manner as in Example 1.

  The adhesion state of the base material (thermal conductive polyimide film) of the four types of thermally conductive and electrically insulating members and the organic / inorganic hybrid layer was measured. As a result, any thermally conductive electrically insulating member caused interface breakdown. Therefore, it was confirmed that the base material and the organic / inorganic hybrid layer were bonded by an adhesive force exceeding the strength of each material.

The heat conductive electrically insulating member of the present invention can be used for electronic parts such as power modules such as IGBT modules.

Perspective view of substrate Perspective view of another substrate Schematic diagram of the mold used in the insert transfer molding method Schematic of other molds used in the insert transfer molding method Perspective view of thermally conductive electrical insulation member Side view of other thermally conductive electrical insulation members Side view of other thermally conductive electrical insulation members

Explanation of symbols

1, 1A, 1B Thermally conductive electrical insulating member 2, 2A, 2B Base material 3 Organic / inorganic hybrid layer 4 Hole 5, 5A Mold 6 Upper mold 7, 7A Lower mold 8 Piston mold 9 Cylinder section 10 Upper mold recess 11 Lower mold recess 12 Cavity 13 Liner 14 Projection 15 Cavity

Claims (12)

  An organic-inorganic hybrid compound in which a thermally conductive filler is mixed with a sol obtained by reaction of a metal alkoxide with an organopolysiloxane having a functional group capable of reacting with the metal alkoxide at one or both ends A thermally conductive electrical insulating member formed as an organic / inorganic hybrid layer on the surface of a material.   The thermally conductive electrically insulating member according to claim 1, wherein the thermally conductive filler is fine particles of metal oxide and / or metal nitride and / or metal carbide.   The thermally conductive electricity according to claim 1 or 2, wherein the thermally conductive filler is a mixture of two or more kinds of the same or different fillers having different particle diameters, and the difference in the particle diameters is three times or more. Insulating member.   The thermally conductive electrically insulating member according to claim 1, wherein 50 to 3000 parts by mass of the thermally conductive filler is mixed with 100 parts by mass of the sol liquid.   The metal of the metal alkoxide is one or two selected from boron, aluminum, silicon, titanium, vanadium, manganese, iron, cobalt, zinc, germanium, yttrium, zirconium, niobium, lanthanum, cerium, cadmium, tantalum, and tungsten. The thermally conductive electrical insulating member according to claim 1, which is the metal described above.   Organic / inorganic mixed with heat conductive filler in sol solution obtained by reaction of metal alkoxide with organopolysiloxane having functional group capable of reacting with metal alkoxide at one or both ends on the surface of the substrate A method for producing a thermally conductive electrically insulating member, wherein an organic / inorganic hybrid layer made of a hybrid compound is integrally formed, and the organic / inorganic hybrid layer is heated and gelled.   The method for producing a thermally conductive electrically insulating member according to claim 6, wherein the thermally conductive filler is fine particles of metal oxide and / or metal nitride and / or metal carbide.   The thermally conductive electricity according to claim 6 or 7, wherein the thermally conductive filler is a mixture of two or more kinds of the same or different fillers having different particle diameters, and the difference in the particle diameters is three times or more. Insulating member manufacturing method.   The method for producing a thermally conductive electrically insulating member according to claim 6, wherein 50 to 3000 parts by mass of the thermally conductive filler is mixed with 100 parts by mass of the sol solution.   The metal of the metal alkoxide is one or two selected from boron, aluminum, silicon, titanium, vanadium, manganese, iron, cobalt, zinc, germanium, yttrium, zirconium, niobium, lanthanum, cerium, cadmium, tantalum, and tungsten. The manufacturing method of the heat conductive electrical insulation member of Claim 6 which is the above metal. An epoxy resin layer is formed on the organic / inorganic hybrid layer formed on the surface of the base material of the thermally conductive electrical insulating member according to claim 1. A semiconductor chip is bonded onto the organic / inorganic hybrid layer formed on the surface of the base material of the thermally conductive electrical insulating member according to claim 1, and an epoxy is formed on the organic / inorganic hybrid layer including the semiconductor chip. A semiconductor package, wherein a resin layer is formed and the semiconductor chip is sealed.

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