JP2005346909A - Head gimbal assembly with flying height adjuster, disk drive unit and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a head gimbal assembly (HGA) capable of both of the flying height adjustment of a slider and fine course adjustment for positioning the slider, and its manufacturing method. <P>SOLUTION: The HGA 3 includes the slider 203', a suspension 213' to load the slider 203', and at least one thin film or ceramic piezoelectric element for the flying height adjustment arranged between the slider 203' and the suspension 213'. The HGA 3 is further provided with a pinched type micro-actuator or a metal frame type micro-actuator for adjusting the horizontal position of the slider. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a disk drive unit and a manufacturing method thereof, and more particularly to a head gimbal assembly and a manufacturing method thereof.

  A disk drive is an information storage device used as a magnetic medium for storing data. Referring to FIGS. 1a and 1b, a typical disk drive in the prior art includes a drive arm 104 that moves a magnetic disk 101 and a head gimbal assembly (HGA, not numbered) having a slider 203 mounted thereon. The disk 101 is mounted on a spindle motor 102 that rotates the disk 101 and is equipped with a voice coil motor (VCM) 107 for controlling the operation of the drive arm 104, so that data can be read from the disk 101 or the disk 101. The operation of the slider 203 that moves from track to track across the surface of the disk 101 is controlled.

  However, due to the inherent tolerance (dynamic play) associated with the movement of the slider 203 by the VCM, the slider 203 cannot achieve a path adjustment for precise alignment.

  In order to solve the above problem, a piezoelectric (PZT) microactuator is used here to correct the movement of the slider 203. That is, the PZT microactuator modifies the operation of the slider 203 in order to correct the tolerance between the VCM 107 and the drive arm 104 on a very small scale. This allows for a small track width and increases the “number of tracks per inch” (TPI) of the disk drive unit by 50% (also increases surface storage density).

  Referring to FIG. 1d, the PZT microactuator 205 comprises a ceramic U-shaped frame 297 with a ceramic beam having two PZTs (not shown) on each side. Referring to FIGS. 1 c and 1 d, the PZT microactuator 205 is physically coupled to the suspension 213, and includes three pieces for coupling the microactuator 205 to the suspension print pattern 210 on one side of the ceramic beam 207. There is a connection ball (gold ball bonding, or solder ball bonding, GBB or SBB). In addition, there are four metal balls 208 (GBB or SBB) to electrically couple the slider 203 with the suspension 213. FIG. 2 shows a detailed process of inserting the slider 203 into the microactuator 205. The slider 203 is bonded to two ceramic beams 207 at two points 206 at an epoxy point 212 so that the movement of the slider 203 is independent of the drive arm 104.

  When power is supplied through the suspension print pattern 210, the PZT microactuator 205 expands or contracts, and deforms the U-shaped frame 297 to move the slider 203 onto the disk 101. In this way, fine course adjustment can be performed.

  However, the PZT microactuator 205 can only be used for path adjustment for alignment of the head gimbal assembly (HGA) 277, and cannot be used for flying height adjustment (FH adjustment) of the head gimbal assembly (HGA) 277. As is well known, flying height is a very important parameter for disk drives. That is, if the flying height is too high, reading of data from the disk 101 of the slider 203 or writing of data to the disk 101 is affected. Conversely, if the flying height is too low, the slider 203 scratches the disk 101, thereby damaging the slider 203 and / or the disk 101. In today's disk drive industry, as the capacity of disk drives rapidly increases, the disk drive track pitch and track width become increasingly narrower, so the flying height of the slider 203 becomes lower and the flying height in HGA becomes finer. Adjustments are becoming increasingly important. Therefore, there is a need to provide a head gimbal assembly and disk drive capable of both fine height adjustment and adjustment of flying height, and a method for manufacturing the same, thereby reading data from the disk 101 or disk The slider 203 can successfully write the data to 101.

  A main feature of the present invention is to provide a head gimbal assembly, a disk drive, and a method of manufacturing the head gimbal assembly that can adjust the flying height.

  Another feature of the present invention is to provide a head gimbal assembly, a disk drive, and a method for manufacturing the head gimbal assembly that are capable of both fine height adjustment for adjusting the flying height and alignment.

  In order to achieve the above characteristics, the head gimbal assembly includes a slider, a suspension on which the slider is mounted, and a flying height adjusting device for adjusting the flying height of the slider. In the present invention, the flying height adjusting device includes at least one piezoelectric element thin film or ceramic piezoelectric element. The flying height adjusting device is disposed between the slider and the suspension. In one embodiment of the present invention, the head gimbal assembly further includes a microactuator for adjusting a horizontal position of the slider. The microactuator includes a pinch type microactuator or a metal frame type microactuator. In the present invention, the microactuator includes at least one piezoelectric element thin film or ceramic piezoelectric element.

  In one embodiment of the present invention, the microactuator further includes a support base for supporting the piezoelectric element. The flying height adjusting device is located between the suspension and the support base. In another embodiment, the flying height adjusting device is located between the support base and the slider. The support base includes a bottom plate, a top plate, and a guiding beam that is physically coupled to the bottom plate and the top plate. As an embodiment of the present invention, the support base may be a frame composed of two side beams and a bottom beam coupled to the two side beams.

  In one embodiment, the flying height adjusting device includes a plurality of adhesive pads formed thereon. Corresponding to the adhesive pads on the flying height adjusting device, the suspension includes a plurality of adhesive pads. The flying height adjusting device is electrically connected to the suspension by electrically connecting the bonding pad of the flying height adjusting device and the adhesive pad of the suspension. In one embodiment, an adhesive pad of the flying height adjusting device is electrically connected to an adhesive pad of the suspension by wire bonding.

  A method for manufacturing a head gimbal assembly includes the steps of forming a slider, a flying height adjusting device and a suspension, disposing the flying height adjusting device between the slider and the suspension, and the flying height adjusting device as described above. A slider and a step of coupling to the suspension. In the present invention, the flying height adjusting device is made of a piezoelectric thin film or a ceramic piezoelectric element. The method further comprises forming a microactuator that adjusts the horizontal position of the slider. Forming the microactuator includes forming at least one piezoelectric element, forming a support base, and bonding at least one piezoelectric element to the support base. In one embodiment, forming the support base includes forming a bottom plate, a top plate, and a guide beam that is physically coupled to the bottom plate and the top plate. In another embodiment, the step of forming the support base includes forming two side beams and a bottom beam combined with the two side beams. In the present invention, the step of forming the flying height adjusting device includes the step of forming a plurality of adhesive pads thereon. The step of forming the suspension includes the step of forming a plurality of adhesive pads on the suspension corresponding to the adhesive pads on the flying height adjusting device. The step of connecting the flying height adjusting device and the suspension includes electrically connecting the bonding pad of the flying height adjusting device and the bonding pad of the suspension. In one embodiment, the step of electrically connecting the bonding pad of the flying height adjusting device and the bonding pad of the suspension is performed by wire bonding.

  The disk drive unit includes an HGA, a drive arm coupled to the HGA, a disk, and a spindle motor for rotating the disk. The HGA includes a slider, a flying height adjusting device for adjusting the flying height of the slider, and a suspension. In the present invention, the flying height adjusting device includes at least one piezoelectric element thin film or ceramic piezoelectric element. The flying height adjusting device is located between the slider and the suspension. The head gimbal assembly further includes a microactuator that adjusts the horizontal position of the slider.

  Compared with the prior art, the HGA according to the present invention uses a flying height adjusting device for adjusting the flying height, so that fine adjustment of the flying height can be achieved. In addition, the present invention can also use the flying height adjusting device for adjusting the flying height by using the micro actuator for adjusting the head path, so that the flying height can be finely adjusted by the disk drive of the present invention. Both fine track adjustments for alignment can be achieved, and thus the TPI of the disk drive unit is greatly improved.

  In order to make the present invention more understandable, some specific embodiments will be described with reference to the accompanying drawings.

  Referring to FIG. 3, the head gimbal assembly (HGA) 3 of the present invention includes a slider 203 ′, a microactuator unit 30, and a suspension 213 ′ for mounting the slider 203 ′ and the microactuator unit 30.

  Still referring to FIG. 3, the suspension 213 ′ includes a load beam 326, a flexure 325, a hinge 324, and a base plate 321. The load beam 326 has three openings 408 formed as stacked reference holes and a plurality of dimples 329 (see FIG. 7). Two holes 322 and 323 are provided in the hinge 324 and the base plate 321 respectively. The hole 322 is used to swag the HGA 3 together with the drive arm, and the hole 323 is used to reduce the weight of the suspension 213 '. The flexure 325 is provided with a plurality of connection pads 318 for connection to the control system at one end, and a plurality of electrical multi-print patterns 309 and 311 at the other end. 4 and 7, the flexure 325 also supports the microactuator unit 30 and also has a suspension tongue 328 that is used to load the central portion of the slider 203 ′ through the dimples 329 of the load beam 326 at all times. It also has. The suspension tongue 328 has adhesive pads 801, 802, 803, and 805 formed thereon.

  Referring to FIG. 8, the microactuator unit 30 includes a microactuator (not numbered) and a flying height adjusting device (not numbered). In this embodiment, the microactuator is a metal frame type microactuator, and includes a metal support base 302 and a piezoelectric (PZT) unit including two side PZT elements 303. The flying height adjusting device is a bottom PZT element having two adhesive pads. In the present invention, the support base 302 is preferably made of stainless steel. The support base 302 includes a bottom plate 401, a top plate 402, and a guide beam 404 that physically couples the bottom plate 401 and the top plate 402. As an embodiment of the present invention, the bottom plate 401 forms two side beams 401a and 401b on both sides thereof, and the top plate 402 also forms two side beams 402a and 402b on both sides thereof. ing. In addition, each of the top plate 402 and the bottom plate 401 has two gaps 409 provided on the side where the guide beam 404 is coupled. The moving distance of the PZT unit can be extended by the gap 409, and thus the slider 203 'can be moved greatly. As an embodiment of the present invention, the bottom PZT element 304 is T-shaped and includes a PZT base 308 and a PZT arm 309. Two adhesive pads 305 are provided on the PZT base 308. Each of the side surface PZT elements 303 is provided with electric bonding pads 702 and 703 on both sides thereof. The side PZT element 303 and the bottom PZT element 304 are preferably made of a thin film PZT material having a single layer or a multilayer structure. In addition, the side PZT element 303 and the bottom PZT element 304 can be made of a ceramic PZT material.

  10a, 10c, 10e, and 10f show a first operation method for the two side surface PZT elements 303 for performing a course adjustment function for alignment. In the present embodiment, the two side surface PZT elements 303 have the same polarization direction, and are commonly grounded at one end 404 as shown in FIG. 10a, and as shown in FIG. 10c at the other ends 401a and 401b. Two voltages of opposite phase waveforms 405 and 406 are applied. Referring to FIGS. 10e and 10f, when a voltage is applied, one of the two side PZT elements 303 expands and the other contracts in the same half cycle. When the voltage enters the next half cycle, the two side PZT elements 303 change phase, one contracts and the other expands. As a result, the slider 203 'is moved in parallel with the disk surface to adjust the head path.

  FIGS. 10b and 10d show another method of operating the side PZT element 303 for performing a course adjustment function for alignment. In the present embodiment, the two side surface PZT elements 303 have two polarization directions in opposite directions, and are commonly grounded at one end 404 and have the same waveform 407 at the other ends 401a and 401b, as shown in FIG. 10b. Two voltages are applied (see FIG. 10d). When a voltage is applied, one of the two side PZT elements 303 expands and the other contracts in the same half cycle, and when the voltage enters the next half cycle, one of the two side PZT elements 303 contracts. And the other stretches. Thereby, the slider 203 'periodically moves from the right side to the left side and returns from the left side to the right side.

  FIGS. 10 g and 10 h show two different polarization directions that can be used for the bottom PZT element 304. FIG. 10 j shows two methods of operating the bottom PZT element 304 for performing the FH adjustment function, and a single waveform 411 as shown in FIG. 10 i is applied to the bottom PZT element 304. Referring to FIG. 10j, the bottom PZT element 304 remains in its original position when no voltage is applied, and when a positive voltage is applied, the bottom PZT element 304 bends up to position 412a and a negative voltage is applied. The bottom PZT element 304 bends downward to a position 412c. In this way, the static gradient of the suspension changes, the static characteristics of the slider 203 'change, and the FH adjustment of the slider 203' can be accomplished.

  Referring to FIG. 9, the steps of forming the microactuator unit 30 include firstly providing a support base 302 and two side PZT elements 303, and then two side PZT elements on two sides of the support base 302. 303, and finally, a step of preparing the bottom PZT element 304 and bonding it to the support base 302. Thereafter, the slider 203 ′ is prepared and bonded to the support base 302 on which the two side surface PZT elements 303 and the bottom surface PZT element 304 are mounted.

  8 and 9, as one embodiment of the present invention, one of the two side PZT elements 303 is bonded to the two side beams 401a and 402a of the support base 302 and the other is the support base 302. Bonded to the two side beams 401b and 402b. The bottom PZT element 304 is bonded to the back surface of the support base 302 by adhering the PZT base 308 to the back surface of the bottom plate 401 with an adhesive or epoxy via an anisotropic conductive film (ACF). Will be located under the guide beam 404 of the support base 302, and the two adhesive pads 305 of the PZT base 308 will be exposed downward. In the present invention, one end of the slider 203 ′ is physically and electrically bonded to the upper surface plate 402 by an adhesive or epoxy via the ACF, and the other end is positioned on the guide beam 404 of the support base 302. By being physically coupled, the slider 203 ′ can be moved together with the microactuator unit 30, and the electrical connection helps prevent the slider 203 ′ from being damaged by static electricity (ESD).

  After the assembly is completed, referring to FIG. 5, the microactuator unit 30 having the slider 203 ′ is partially bonded to the suspension tongue 328 of the flexure 325 through an anisotropic conductive film (ACF). Thus, the bottom PZT element 304 is sandwiched between the suspension tongue 328 and the support base 302 (see FIG. 7). Accordingly, the two bonding pads 305 of the bottom PZT element 304 are electrically coupled to the two bonding pads and are electrically coupled to the connection pads 318 via the electrical multi-print pattern 311. At the same time, the plurality of sliding pads 701 of the slider 203 ′ and the electric bonding pads 702 and 703 of the side PZT element 303 are located on the corresponding bonding pads 801, 802 and 803. A parallel gap 313 is formed between the microactuator unit 30 and the suspension tongue 328 in order to ensure a smooth operation of the microactuator unit 30. See Figure 7 for details.

  Referring to FIG. 6, in the present invention, the sliding pad 701 is electrically coupled to the adhesive pad 801 to electrically couple the slider 203 ′ to the two electrical multi-print patterns 311 of the suspension 213 ′. Four metal balls 208 ′ (GBB or SBB) are used. At the same time, in order to electrically couple the microactuator unit 30 to the electrical multi-print pattern 311, three metal balls 209 ′ are used to electrically couple the adhesive pads 702 and 703 to the adhesive pads 802 and 803. Used. An adhesive pad 318 connects the slider 203 'and the microactuator unit 30 to a control system (not shown) through the electrical multi-print patterns 309 and 311.

  In another embodiment, referring to FIG. 11, the bottom PZT element 304 can also be placed between the slider 203 ′ and the support base 302 with the two adhesive pads 305 exposed upward. Subsequently, referring to FIG. 12, the adhesive pad 305 of the bottom surface PZT element 304 is electrically connected to the adhesive pad 805 of the suspension tongue 328. Referring to FIG. 13, in one embodiment of the present invention, the electrical coupling is formed as follows. That is, first, a wire 991 portion output from a bonding apparatus (not shown) is melted in the bonding pad 305 of the bottom surface PZT element 304 (a method such as gold ball bonding, solder ball bonding, or laser welding). The metal ball 901 is bonded and the bonding device is moved to the bonding pad 805 of the suspension tongue 328 to form another metal ball 902 without cutting the wire 991. In the present embodiment, no changes other than those described above are made regarding the configuration and assembly of the HGA of the present invention. Therefore, detailed description other than the above is omitted.

  Referring to FIG. 14, a microactuator unit 30 'according to another embodiment of the present invention also includes a microactuator (not numbered) and a flying height adjusting device (not numbered). In the present embodiment, the microactuator is a pinch type microactuator and includes a U-shaped frame 302 ′ and a piezoelectric (PZT) unit. The U-shaped frame 302 ′ includes two side beams 207 ′ and a bottom beam 398 that is coupled to the two side beams 207 ′. In the present invention, the PZT unit includes two PZT elements 303 ′ bonded to the two side beams 207 ′ of the U-shaped frame 302 ′. In the present embodiment, the flying height adjusting device is a bottom PZT element 304 ′ equipped with two adhesive pads 305 ′. As an embodiment of the present invention, referring to FIGS. 16 and 17, the bottom PZT element 304 ′ is fully coupled to the suspension tongue 328 via the ACF, so that the two adhesive pads 305 ′ are The suspension tongue 328 is coupled to the two adhesive pads 805. Each of the side PZT elements 303 'has three electrical bonding pads 702' and 703 'formed at both ends thereof. The bottom PZT element 304 'is preferably made of a thin film PZT having a single layer or a multilayer structure. The side PZT element 303 'and the bottom PZT element 304' can be made of ceramic PZT.

  19a, 19c, 19e, and 19f show a first operation method for the two side surface PZT elements 303 'for performing the alignment path adjusting function. In the present embodiment, the two side PZT elements 303 ′ have the same polarization direction, and are commonly grounded at one end 404 ′ and at the other ends 401′a and 401′b as shown in FIG. 19a. Two voltages of opposite phase waveforms 405 'and 406' are applied as shown in Figure 19c. Referring to FIGS. 19e and 19f, when a voltage is applied, one of the two side PZT elements 303 'expands and the other contracts in the same half cycle. When the voltage enters the next half cycle, the two side PZT elements 303 'change phase and one of the two side PZT elements 303' contracts and the other expands. As a result, the slider 203 'is moved in parallel with the disk surface to adjust the head path.

  19b and 19d show another method of operating the side PZT element 303 'for performing a course adjustment function for alignment. In the present embodiment, the two side surface PZT elements 303 ′ have two polarization directions in opposite directions, and are commonly grounded at one end 404 ′ and the other ends 401′a and 401 ′ as shown in FIG. 19b. Two voltages of 'b and the same waveform 407' (see FIG. 19d) are applied. When a voltage is applied, one of the two side PZT elements 303 'expands and the other contracts in the same half cycle, and when the voltage enters the next half cycle, one of the two side PZT elements 303' It contracts and the other stretches. Thereby, the slider 203 'periodically moves from the right side to the left side and returns from the left side to the right side.

  FIG. 19g shows two methods of operating the bottom PZT element 304 'for performing the FH adjustment function. In the present invention, two different polarization directions are selectively used by the bottom PZT element 304'. In the present invention, a voltage having a single waveform is applied to the bottom surface PZT element 304 ′. When no voltage is applied, the bottom surface PZT element 304 ′ remains in its original position, and when a positive voltage is applied, the bottom surface PZT element 304 ′. 'Bends up to position 412a' and when a negative voltage is applied, the bottom PZT element 304 'bends down to position 412c'. In this way, the slider 203 'is moved up and down, and the FH adjustment of the slider 203' can be accomplished.

  Referring to FIG. 16, the step of forming the microactuator unit 30 ′ includes firstly preparing a U-shaped frame 302 ′ having two side PZT elements 303 ′ and, as shown in FIG. Adhering to the suspension tongue 328. Finally, a slider 203 ′ is prepared and coupled to the side beam 207 ′ at two points 907 as shown in FIG. 15, and a U-shaped frame 302 ′ having the slider 203 ′ is interposed between the bottom PZT element 304 ′. Is mounted on the suspension tongue 328.

  In the present invention, referring to FIGS. 14 and 16, a U-shaped frame 302 ′ having a slider 203 ′ is obtained by partially coupling the bottom beam 398 of the U-shaped frame 302 ′ and the suspension tongue 328. Mounted on the suspension tongue 328. Accordingly, the adhesive pads 702 ′ and 703 ′ and the sliding pad 701 of the two side PZT elements 303 ′ are located at the corresponding adhesive pads 802, 803 and 801 on the suspension tongue 328. Subsequently, referring to FIG. 18, in order to electrically couple the slider 203 ′ to the two electrical multi-print patterns 309 of the suspension 213 ′, the sliding pad 701 is electrically coupled to the adhesive pad 801. Four metal balls 310 (GBB or SBB) are used. At the same time, three metal balls are used to electrically bond the bonding pads 702 ′ and 703 ′ to the bonding pads 802 and 803 in order to electrically bond the microactuator unit 30 ′ to the electrical multi-print pattern 311. 320 is used, and thus an HGA having a microactuator unit 30 ′ as shown in FIG. 20 is formed. Through the electrical multi-print patterns 309 and 311, the adhesive pad 318 connects the slider 203 ′ and the microactuator unit 30 ′ to a control system (not shown).

  When an operating voltage is applied to the microactuator unit 30 ', the two side surface PZT elements 303' move the slider 203 'parallel to the disk surface to adjust the head path. At the same time, the bottom PZT element 304 'moves the slider 203' perpendicularly to the disk surface to perform FH adjustment.

  In the present invention, the disk drive of the present invention is made by assembling a VCM having a base plate, a disk, a spindle motor, and the HGA of the present invention. Since the structure and / or assembly process of the HGA and hard disk using the microactuator unit of the present invention are well known to those having ordinary knowledge in the technical field, such structure and assembly are omitted here. To do.

  In the present invention, the microactuator unit can be replaced by a single PZT element (such as the bottom PZT element 304 or 304 ') used in the flying height adjustment device. The structure and manufacturing method of the HGA and disk drive unit having a single PZT element can be easily realized by those having ordinary knowledge in the technical field according to the above description of the HGA 3 and disk drive unit. I will omit it.

  It will be apparent that the present invention may be embodied in other forms without departing from the spirit thereof. Therefore, all of the examples and the embodiments are for explanation and do not limit the invention. Further, the present invention is not limited to the detailed description described herein.

It is a perspective view of the conventional disk drive. It is the elements on larger scale of FIG. It is a perspective view of HGA by a prior art. It is the elements on larger scale of FIG. 1c. Fig. 2 shows a detailed process of inserting the slider into the HGA microactuator in Fig. Ic. 1 is a perspective view of an HGA according to a first embodiment of the present invention. FIG. 4 is a partially exploded perspective view of the HGA in FIG. 3 before the slider and the microactuator unit are bonded to the suspension by metal balls. FIG. 4 is a partially enlarged perspective view of the assembled HGA in FIG. 3 before the slider and the microactuator unit are bonded to the suspension by metal balls. FIG. 4 is a partially enlarged perspective view of the assembled HGA in FIG. 3 after the slider and the microactuator unit are bonded to the suspension by metal balls. FIG. 4 is a cross-sectional view of the HGA of FIG. 3 in the microactuator unit. 4 shows a microactuator in the HGA of FIG. 3 according to a first embodiment of the present invention. FIG. 9 shows a process of assembling the microactuator in FIG. 8 and attaching a slider thereon. FIG. 9 shows an electrical connection relationship of piezoelectric elements on two sides of the microactuator in FIG. 8 having the same polarization direction according to an embodiment of the present invention. FIG. 9 shows an electrical connection relationship of piezoelectric elements on two sides of the microactuator in FIG. 8 having different polarization directions according to another embodiment of the present invention. Fig. 10a shows two voltage waveforms applied to each of the two side PZT elements of Fig. 10a. FIG. 10a shows the voltage waveform applied to each of the two side PZT elements of FIG. 10a. Fig. 10b shows two different modes of operation of the PZT element on the two sides of Fig. 10a moving the slider in a direction parallel to the disk surface. Fig. 10b shows two different modes of operation of the PZT element on the two sides of Fig. 10a moving the slider in a direction parallel to the disk surface. Fig. 9 shows two different polarization directions of the bottom PZT element of the microactuator unit of Fig. 8 according to two embodiments of the invention. Fig. 9 shows two different polarization directions of the bottom PZT element of the microactuator unit of Fig. 8 according to two embodiments of the invention. Fig. 10 shows voltage waveforms applied to the bottom PZT element of Fig. 10g or Fig. 10h. FIG. 10 shows two operating methods of the bottom PZT element of FIG. 10g or FIG. 10h for moving the slider in a direction perpendicular to the disk surface. 9 shows another assembling method of the microactuator unit of FIG. FIG. 12 is a partial perspective view of an HGA having the assembled microactuator unit of FIG. 11. 12 shows an electrical connection relationship between the microactuator unit of FIG. 11 and the suspension. It is a disassembled perspective view of the microactuator unit by the 2nd Embodiment of this invention. It is a perspective view which shows the slider with which the U-shaped flame | frame of the micro actuator unit of FIG. 14 was mounted | worn. FIG. 15 is a partially exploded perspective view of the HGA of the present invention having the microactuator unit of FIG. 14. FIG. 17 is a partial perspective view showing a bottom PZT element of the microactuator unit of FIG. 14 mounted on the suspension of the HGA of FIG. FIG. 17 is a partial perspective view of the assembled HGA of FIG. 16 after the slider and the microactuator unit of FIG. 14 are bonded to the suspension by metal balls. FIG. 15 shows the electrical connection relationship of the PZT elements on the two sides of the microactuator in FIG. 14 with the same polarization direction according to an embodiment of the present invention. FIG. 15 shows the electrical connection relationship of the PZT elements on the two sides of the microactuator in FIG. 14 with different polarization directions according to another embodiment of the present invention. Fig. 19a shows two voltage waveforms applied to each of the two side PZT elements of Fig. 19a. FIG. 19a shows the voltage waveform applied to each of the two side PZT elements of FIG. 19a. Figure 19a shows two different ways of operating the PZT element on the two sides of Figure 19a moving the slider in a direction parallel to the disk surface. Figure 19a shows two different ways of operating the PZT element on the two sides of Figure 19a moving the slider in a direction parallel to the disk surface. 15 shows two operating methods of the bottom PZT element of FIG. 14 for moving the slider in a direction perpendicular to the disk surface. FIG. 19 is a single perspective view of the HGA of FIG. 18 according to a second embodiment of the present invention.

Explanation of symbols

3 Head Gimbal Assembly 30 Microactuator Unit 203 ′ Slider 213 ′ Suspension 302 Support Base 303 Side PZT Element 304 Bottom PZT Element 305 Adhesive Pad 401 Bottom Plate 402 Top Plate 401a, 401b Side Beam 402a, 402b Side Beam 702, 703 Adhesive Pad

Claims (28)

A slider,
A suspension for mounting the slider;
A flying height adjusting device for adjusting the flying height of the slider;
A head gimbal assembly comprising:   2. The head gimbal assembly according to claim 1, wherein the flying height adjusting device comprises at least one piezoelectric element thin film or ceramic piezoelectric element.   The head gimbal assembly according to claim 1, wherein the flying height adjusting device is disposed between the slider and the suspension.   The head gimbal assembly according to claim 1, further comprising a microactuator for adjusting a horizontal position of the slider.   The head gimbal assembly according to claim 4, wherein the microactuator is a pinch type microactuator or a metal frame type microactuator.   5. The head gimbal assembly according to claim 4, wherein the microactuator comprises at least one piezoelectric element thin film or ceramic piezoelectric element.   The head gimbal assembly according to claim 6, wherein the microactuator further includes a support base for supporting the piezoelectric element.   The head gimbal assembly according to claim 7, wherein the flying height adjusting device is located between the suspension and the support base.   The head gimbal assembly according to claim 7, wherein the flying height adjusting device is located between the support base and the slider.   8. The head gimbal assembly according to claim 7, wherein the support base includes a bottom plate, a top plate, and a guide beam that is physically coupled to the bottom plate and the top plate.   The head gimbal assembly according to claim 7, wherein the support base is a frame including two side beams and a bottom beam coupled to the two side beams.   The head gimbal assembly according to claim 1, wherein the flying height adjusting device includes a plurality of adhesive pads formed thereon.   The suspension includes a plurality of adhesive pads corresponding to the adhesive pads on the flying height adjusting device, and the flying height adjusting device includes the adhesive pads of the flying height adjusting device and the adhesive pads of the suspension. The head gimbal assembly according to claim 12, wherein the head gimbal assembly is electrically connected to the suspension by electrical coupling.   14. The head gimbal assembly according to claim 13, wherein the adhesive pad of the flying height adjusting device is electrically connected to the adhesive pad of the suspension by wire bonding. Forming a slider, a flying height adjustment device and a suspension;
Disposing the flying height adjusting device between the slider and the suspension;
Coupling the flying height adjustment device to the slider and the suspension;
A method for manufacturing a head gimbal assembly, comprising:   The manufacturing method according to claim 15, wherein the flying height adjusting device is made of a piezoelectric element thin film or a ceramic piezoelectric element.   The method according to claim 15, further comprising forming a microactuator for adjusting a horizontal position of the slider. Forming the microactuator comprises:
Forming at least one piezoelectric element;
Forming a support base;
Bonding at least one piezoelectric element to the support base;
The manufacturing method of Claim 17 characterized by the above-mentioned.   The step of forming the support base includes the steps of forming a bottom plate, forming a top plate, and forming a guide beam physically coupled to the bottom plate and the top plate. The manufacturing method according to claim 18, characterized in that:   19. The fabrication of claim 18, wherein forming the support base comprises forming two side beams and forming a bottom beam coupled to the two side beams. Method.   The manufacturing method according to claim 15, wherein the step of forming the flying height adjusting device includes a step of forming a plurality of adhesive pads thereon.   The manufacturing method according to claim 21, wherein the step of forming the suspension includes a step of forming a plurality of adhesive pads on the suspension corresponding to the adhesive pads on the flying height adjusting device. .   23. The step of coupling the flying height adjusting device and the suspension includes the step of electrically coupling the adhesive pad of the flying height adjusting device and the adhesive pad of the suspension. The manufacturing method as described in.   The manufacturing method according to claim 21, wherein the step of electrically coupling the bonding pad of the flying height adjusting device and the bonding pad of the suspension is performed by wire bonding. A slider,
A flying height adjusting device for adjusting the flying height of the slider;
Suspension,
A head gimbal assembly comprising:
A drive arm coupled to the head gimbal assembly;
A disc,
A spindle motor for rotating the disk;
A disk drive unit comprising:   26. The disk drive unit according to claim 25, wherein the flying height adjusting device includes at least one piezoelectric element thin film or ceramic piezoelectric element.   26. The disk drive unit according to claim 25, wherein the flying height adjusting device is disposed between the slider and the suspension. 26. The disk drive unit according to claim 25, wherein the head gimbal assembly further comprises a microactuator for adjusting a horizontal position of the slider.

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