JP2005340346A - Pad for surface mounted component on printed board - Google Patents

Pad for surface mounted component on printed board Download PDF

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JP2005340346A
JP2005340346A JP2004154598A JP2004154598A JP2005340346A JP 2005340346 A JP2005340346 A JP 2005340346A JP 2004154598 A JP2004154598 A JP 2004154598A JP 2004154598 A JP2004154598 A JP 2004154598A JP 2005340346 A JP2005340346 A JP 2005340346A
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pad
electrode
lead
surface mount
mount component
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Masahiko Shoji
雅彦 庄司
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Keihin Corp
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Keihin Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L24/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L24/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
    • H01L2224/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
    • H01L2224/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
    • H01L2224/37001—Core members of the connector
    • H01L2224/3701—Shape
    • H01L2224/37011—Shape comprising apertures or cavities
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/4005—Shape
    • H01L2224/4009—Loop shape
    • H01L2224/40095—Kinked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/401—Disposition
    • H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/40225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/83801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/84—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector
    • H01L2224/848—Bonding techniques
    • H01L2224/84801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

<P>PROBLEM TO BE SOLVED: To provide a pad for a surface mounted component on a printed board wherein it is possible to determine the quality of soldering with good accuracy by visual observation from an upper portion and the check of a fillet shape by image photographing even when a lead-free cream solder is used, and a positional displacement of a surface mounted component is prevented. <P>SOLUTION: The pad (12) with the lead-free cream solder printed thereon comprises an electrode placement part (12a) which is formed into the same shape or substantially the same shape as an electrode of the surface mounted component that is a connection object and on which the foregoing electrode is to be placed; and a pullout (12b) which is formed in succession with the foregoing electrode placement part (12a), and is protruded from an external shape of the surface mounted component as viewed in a top surface. The neighborhood (12b2) of the electrode placement part (12a) in the foregoing pullout (12b) is contracted in its diameter compared with a remaining portion (12b1). <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

この発明はプリント基板の表面実装部品用パッドに関し、より詳しくは、無鉛クリーム半田を使用したプリント基板の表面実装部品用パッドの形状に関する。   The present invention relates to a surface mount component pad for a printed circuit board, and more particularly to the shape of a surface mount component pad for a printed circuit board using lead-free cream solder.

表面実装部品の底部においてその上面視における外形よりも小さく形成された電極を、プリント基板上において前記電極と同形あるいは略同形に形成されたパッドに半田付けした場合、半田フィレットは表面実装部品の下方に形成される。そのため、半田付けの良否判定、具体的には、半田フィレットが所望の形状に形成されているか否かの判定を上方からの目視や画像撮影では行い難いという不具合があった。   When an electrode formed smaller than the outer shape of the surface mount component at the bottom of the surface mount component is soldered to a pad formed in the same shape or substantially the same shape as the electrode on the printed circuit board, the solder fillet is below the surface mount component. Formed. For this reason, there is a problem that it is difficult to determine whether soldering is good or not, specifically, whether the solder fillet is formed in a desired shape by visual observation or image photographing from above.

一方、半田フィレットを上方から確認できる位置に形成させるために、パッドを表面実装部品の上面視における外形よりも十分に大きく形成することも考えられる。しかしながら、そのように構成すると、パッドに印刷したクリーム半田をリフローさせた際に、表面実装部品が位置ずれを起こすおそれがあった。   On the other hand, in order to form the solder fillet at a position where the solder fillet can be confirmed from above, it is conceivable to form the pad sufficiently larger than the outer shape of the surface-mounted component in a top view. However, with such a configuration, there is a possibility that the surface-mounted component may be displaced when the cream solder printed on the pad is reflowed.

そこで、本出願人が先に提案した特許文献１に記載されるプリント基板の表面実装部品用パッドにあっては、電極と略同大に形成されたパッドに引き出し部を設け、かかる引き出し部を表面実装部品の上面視における外形から突出させるように構成することで、表面実装部品の位置ずれを防止すると共に、引き出し部に形成された半田フィレットの形状を上方から確認して半田付けの良否判定を行えるようにしている。
特許第３３４２８５５号公報 Therefore, in the surface mount component pad of the printed circuit board described in Patent Document 1 previously proposed by the present applicant, a lead portion is provided on the pad formed approximately the same size as the electrode, and the lead portion is provided with the lead portion. By configuring the surface mount component so that it protrudes from the top view, the position of the surface mount component can be prevented, and the shape of the solder fillet formed on the drawer can be checked from above to determine whether soldering is good or bad. Can be done.
Japanese Patent No. 3342855

ところで、近年、環境への配慮から半田の鉛フリー化が進んでいる。鉛を含まないクリーム半田（以下「無鉛クリーム半田」という）は、従来の共晶半田に比して溶融温度が高いため、リフロー温度およびリフロー時間が共に増大する。このため、電極の温度がパッドの温度よりも高くなり、溶融した半田が電極へ吸い寄せられる現象が増長される。特に、電極が大きい実装部品では、溶融した半田の吸い寄せ量が多いことから、半田フィレットが過小となる場合があった。   By the way, in recent years, lead-free solder has been promoted for environmental considerations. Since cream solder not containing lead (hereinafter referred to as “lead-free cream solder”) has a higher melting temperature than conventional eutectic solder, both reflow temperature and reflow time increase. For this reason, the temperature of the electrode becomes higher than the temperature of the pad, and the phenomenon that the molten solder is attracted to the electrode is increased. In particular, in a mounting component having a large electrode, there is a case where the solder fillet is excessively small because the amount of sucked molten solder is large.

そのため、上記した特許文献１に記載される表面実装部品用パッドに無鉛クリーム半田を使用した場合も、引き出し部に印刷された無鉛クリーム半田の多くが電極に吸い寄せられ、半田付けの良否に関わらず半田フィレットが過小となり、半田付けの良否判定が精度良く行えないという不具合があった。   Therefore, even when the lead-free cream solder is used for the surface mount component pad described in Patent Document 1 described above, most of the lead-free cream solder printed on the lead portion is sucked to the electrode, regardless of whether the soldering is good or bad. There was a problem that the solder fillet was too small and the quality of soldering could not be determined accurately.

従ってこの発明の目的は上記した課題を解決し、無鉛クリーム半田を使用した場合であっても、上方からの目視や画像撮影によるフィレット形状の確認によって半田付けの良否を精度良く判定できるようにすると共に、表面実装部品の位置ずれを防止するようにしたプリント基板の表面実装部品用パッドを提供することにある。   Therefore, the object of the present invention is to solve the above-mentioned problems, and even when lead-free cream solder is used, it is possible to accurately determine whether soldering is good or not by checking the fillet shape by visual observation or image photographing from above. A further object is to provide a surface mount component pad for a printed circuit board which prevents the displacement of the surface mount component.

上記の課題を解決するために、請求項１にあっては、表面実装部品の底部において前記表面実装部品の上面視における外形よりも小さく形成された電極を、パッド上に印刷された無鉛クリーム半田を溶融させてプリント基板に接続するプリント基板の表面実装部品用パッドにおいて、前記パッドを、前記電極と同形あるいは略同形に形成された、前記電極が載置されるべき電極載置部と、前記電極載置部に連続して形成されて前記表面実装部品の上面視における外形から突出させられた引き出し部とから構成すると共に、前記引き出し部において前記電極載置部の近傍を、残余の部位に比して縮径させるように構成した。   In order to solve the above-mentioned problem, in claim 1, a lead-free cream solder in which an electrode formed on the bottom of a surface-mounted component smaller than the outer shape in a top view of the surface-mounted component is printed on a pad In the surface mount component pad of the printed circuit board that is melted and connected to the printed circuit board, the pad is formed in the same shape or substantially the same shape as the electrode, and the electrode mounting portion on which the electrode is to be mounted, And a lead portion formed continuously from the electrode placement portion and projecting from the outer shape of the surface mount component in a top view, and the vicinity of the electrode placement portion in the lead portion is a remaining portion. In comparison, the diameter was reduced.

また、請求項２にあっては、前記引出し部を少なくとも２個形成すると共に、前記パッドから離間した位置に第２のパッドを形成し、前記２個の引出し部を、前記電極載置部と前記第２のパッドの中心位置を結ぶ線に対して対称となる位置に設けるように構成した。   According to a second aspect of the present invention, at least two lead portions are formed, a second pad is formed at a position spaced from the pad, and the two lead portions are connected to the electrode mounting portion. It was configured to be provided at a position that is symmetrical with respect to a line connecting the center positions of the second pads.

また、請求項３にあっては、前記引出し部を、前記プリント基板上の前記表面実装部品を除く電子部品に干渉しない位置に設けるように構成した。   According to a third aspect of the present invention, the drawer portion is provided at a position where it does not interfere with electronic components other than the surface mount component on the printed board.

請求項１に係るプリント基板の表面実装部品用パッドにあっては、無鉛クリーム半田が印刷されたパッドを、接続対象たる表面実装部品の電極と同形あるいは略同形に形成された、前記電極が載置されるべき電極載置部と、前記電極載置部に連続して形成されて前記表面実装部品の上面視における外形から突出させられた引き出し部とから構成すると共に、前記引き出し部において前記電極載置部の近傍を、残余の部位に比して縮径させるように構成したので、無鉛クリーム半田を使用した場合であっても、上方からの目視や画像撮影によるフィレット形状の確認によって半田付けの良否を精度良く判定できると共に、表面実装部品の位置ずれを防止することができる。   In the surface mount component pad of the printed circuit board according to claim 1, the electrode on which the lead-free cream solder is printed is formed in the same shape or substantially the same shape as the electrode of the surface mount component to be connected. The electrode mounting portion to be placed and a lead portion that is formed continuously from the electrode placement portion and protrudes from the outer shape of the surface mount component in a top view. Since the vicinity of the mounting part is configured to be reduced in diameter compared to the remaining part, even when lead-free cream solder is used, soldering is performed by visual inspection from above or by confirming the fillet shape by taking an image. As a result, it is possible to accurately determine whether or not the surface mounting component is misaligned, and to prevent displacement of the surface-mounted component.

具体的には、電極が載置されるべき電極載置部を、その電極と同形あるいは略同形に形成することで、リフロー時に表面実装部品に位置ずれが生じるのを防止することができる。さらに、電極載置部に連続する引き出し部を形成し、かかる引き出し部を表面実装部品の上面視における外形から突出させると共に、引き出し部において電極載置部の近傍を残余の部位に比して縮径させることで、前記縮径された部位がリフローした無鉛クリーム半田の流動抵抗となることから、引き出し部に印刷された無鉛クリーム半田が電極に吸い寄せられるのを抑制することができる。これにより、上方から視覚で確認できる位置に半田付けの良否判定を行うのに十分な大きさの半田フィレットを形成させることができ、よって上方からの目視や画像撮影によるフィレット形状の確認によって半田付けの良否を精度良く判定することができる。   Specifically, by forming the electrode mounting portion on which the electrode is to be mounted in the same shape or substantially the same shape as the electrode, it is possible to prevent the positional mounting component from being displaced during reflow. In addition, a lead-out portion that is continuous with the electrode mounting portion is formed so that the lead-out portion protrudes from the outer shape of the surface mount component when viewed from above, and the vicinity of the electrode mounting portion in the lead-out portion is reduced compared to the remaining portion. By reducing the diameter, the reduced-diameter portion becomes the flow resistance of the reflowed lead-free cream solder, so that the lead-free cream solder printed on the lead-out portion can be prevented from being attracted to the electrode. This makes it possible to form a solder fillet that is large enough to determine whether soldering is good or not at a position that can be visually confirmed from above. Can be determined with high accuracy.

また、請求項２に係るプリント基板の表面実装部品用パッドにあっては、引出し部を少なくとも２個形成すると共に、電極載置部と引き出し部とで構成されるパッドから離間した位置に第２のパッドを形成し、前記２個の引出し部を電極載置部と第２のパッドの中心位置を結ぶ線に対して対称となる位置に設けるように構成したので、上記した効果に加え、リフローした無鉛クリーム半田の表面張力に起因する表面実装部品の位置ずれを抑制することができ、よって表面実装部品の位置ずれをより効果的に防止することができる。   In the surface mount component pad of the printed circuit board according to claim 2, at least two lead portions are formed, and the second portion is spaced from the pad constituted by the electrode placement portion and the lead portion. In addition to the effects described above, the two lead portions are provided at positions symmetrical with respect to the line connecting the electrode mounting portion and the center position of the second pad. It is possible to suppress the displacement of the surface-mounted component due to the surface tension of the lead-free cream solder, and thus more effectively prevent the displacement of the surface-mounted component.

また、請求項３に係るプリント基板の表面実装部品用パッドにあっては、引出し部を、プリント基板上の他の電子部品に干渉しない位置に設けるように構成したので、上記した効果に加え、プリント基板の実装面積の低下を抑制することができる。   Further, in the surface mounting component pad of the printed circuit board according to claim 3, since the drawer portion is configured to be provided at a position that does not interfere with other electronic components on the printed circuit board, in addition to the effects described above, A reduction in the mounting area of the printed circuit board can be suppressed.

以下、添付図面に即してこの発明に係るプリント基板の表面実装部品用パッドを実施するための最良の形態について説明する。   The best mode for carrying out a surface mount component pad of a printed circuit board according to the present invention will be described below with reference to the accompanying drawings.

図１は、この発明の第１実施例に係るプリント基板の表面実装部品用パッドを示す平面図である。また、図２は、図１に示す表面実装部品用パッドを紙面下方から見た側面図であり、図３は、図１に示す表面実装部品用パッドを紙面左方から見た側面図である。   FIG. 1 is a plan view showing a surface mount component pad of a printed circuit board according to a first embodiment of the present invention. 2 is a side view of the surface mount component pad shown in FIG. 1 as viewed from the lower side of the drawing, and FIG. 3 is a side view of the surface mount component pad shown in FIG. .

図１から図３において符号１０は、第１実施例に係るプリント基板の表面実装部品用パッドを示す。表面実装部品用パッド１０は、プリント基板ＣＢ上に形成された第１のパッド１２と、プリント基板ＣＢ上において第１のパッド１２から離間した位置に形成された第２のパッド１４とからなり、それらはプリント基板ＣＢ上に形成された図示しないパターンに接続される。尚、図１から図３では図示を省略するが、第１のパッド１２と第２のパッド１４の上面には、鉛を含まない無鉛クリーム半田が印刷（塗布）される。   In FIG. 1 to FIG. 3, reference numeral 10 denotes a surface mount component pad of the printed circuit board according to the first embodiment. The surface mounting component pad 10 includes a first pad 12 formed on the printed circuit board CB and a second pad 14 formed on the printed circuit board CB at a position spaced from the first pad 12. They are connected to a pattern (not shown) formed on the printed circuit board CB. Although not shown in FIGS. 1 to 3, lead-free cream solder not containing lead is printed (applied) on the upper surfaces of the first pad 12 and the second pad 14.

第１のパッド１２は、接続対象たる表面実装部品の電極（後述）が載置されるべき電極載置部１２ａと、電極載置部１２ａに連続して形成された（別言すれば、電極載置部１２ａから外方へと引き出された）２個の引き出し部１２ｂとから構成される。   The first pad 12 is formed continuously with an electrode mounting portion 12a on which an electrode (described later) of a surface-mounted component to be connected is to be mounted, and in other words, an electrode mounting portion 12a. And two drawer portions 12b (extracted outward from the placement portion 12a).

電極載置部１２ａは、図１に示すように上面視において円形を呈する。一方、引き出し部１２ｂは、上面視において長方形を呈する第１の部位１２ｂ１と、第１の部位１２ｂ１を電極載置部１２ａに接続する、上面視において長方形を呈する第２の部位１２ｂ２とからなり、第２の部位１２ｂ２の幅（引き出し部１２ｂの引き出し方向（突出方向）と直交する方向における幅）は、第１の部位１２ｂ１のそれよりも狭く形成される。即ち、引き出し部１２ｂにおいて電極載置部１２ａの近傍（第２の部位１２ｂ２）は、残余の部位（第１の部位１２ｂ１）に比して縮径される。尚、第２のパッド１４は、上面視において長方形を呈する。   As shown in FIG. 1, the electrode placement portion 12a has a circular shape when viewed from above. On the other hand, the lead portion 12b includes a first portion 12b1 that has a rectangular shape in a top view and a second portion 12b2 that has a rectangular shape in a top view and connects the first portion 12b1 to the electrode placement portion 12a. The width of the second portion 12b2 (the width in the direction orthogonal to the drawing direction (protruding direction) of the drawing portion 12b) is formed narrower than that of the first portion 12b1. That is, in the lead portion 12b, the vicinity of the electrode placement portion 12a (second portion 12b2) is reduced in diameter as compared with the remaining portion (first portion 12b1). The second pad 14 has a rectangular shape when viewed from above.

図４は、表面実装部品用パッド１０とそれに接続された（半田付けされた）表面実装部品を示す平面図である。また、図５は、図４に示す表面実装部品用パッド１０と表面実装部品を紙面下方から見た側面図であり、図６は、図４に示す表面実装部品用パッド１０と表面実装部品を紙面左方から見た側面図である。   FIG. 4 is a plan view showing the surface mount component pad 10 and the surface mount component connected thereto (soldered). 5 is a side view of the surface mount component pad 10 and the surface mount component shown in FIG. 4 as viewed from the lower side of the drawing. FIG. 6 shows the surface mount component pad 10 and the surface mount component shown in FIG. It is the side view seen from the paper left side.

図４から図６において符号２０は、表面実装部品を示す。表面実装部品２０は、具体的にはパワーツェナーダイオードであり、上面視における外形が円形を呈する本体２０ａと、本体２０ａの底部に設けられた第１の電極（アノード電極）２０ｂと、本体２０ａの上部から側方へと延設された第２の電極（カソード電極）２０ｃとを備える。   4 to 6, reference numeral 20 denotes a surface mount component. The surface-mounted component 20 is specifically a power Zener diode, and has a main body 20a whose outer shape in a top view is circular, a first electrode (anode electrode) 20b provided on the bottom of the main body 20a, and the main body 20a. A second electrode (cathode electrode) 20c extending from the top to the side.

図４に示すように、表面実装部品２０の第１の電極２０ｂは、上面視において、本体２０ａの外形よりも小さな円形に形成され、第１のパッド１２の電極載置部１２ａに載置される。図示の如く、電極載置部１２ａは第１の電極２０ｂと略同形に形成される。より具体的には、電極載置部１２ａは、第１の電極２０ｂよりも僅かに大きく、かつ表面実装部品の本体２０ａの上面視における外形よりも小さく形成される。   As shown in FIG. 4, the first electrode 20 b of the surface mount component 20 is formed in a circular shape smaller than the outer shape of the main body 20 a when viewed from above, and is placed on the electrode placement portion 12 a of the first pad 12. The As illustrated, the electrode mounting portion 12a is formed in substantially the same shape as the first electrode 20b. More specifically, the electrode mounting portion 12a is formed to be slightly larger than the first electrode 20b and smaller than the outer shape of the surface-mounted component main body 20a when viewed from above.

また、前記した引き出し部１２ｂは、表面実装部品の本体２０ａの上面視における外形よりも外方に突出させられる。具体的には、引き出し部１２ｂのうち、第１の部位１２ｂ１の全部と、第２の部位１２ｂ２の一部が本体２０ａの上面視における外形よりも外方に突出させられる。   Moreover, the above-mentioned drawer part 12b is protruded outward from the external shape in the top view of the main body 20a of the surface mount component. Specifically, all of the first part 12b1 and a part of the second part 12b2 of the lead-out part 12b are projected outward from the outer shape of the main body 20a in a top view.

一方、第２の電極２０ｃは、本体２０ａから離間した位置において、前記した第２のパッド１４に載置される。尚、図４から図６において斜線部分は無鉛クリーム半田を示し、第１のパッド１２に印刷されたものを符号２２で表すと共に、第２のパッド１４に印刷されたものを符号２４で表す。   On the other hand, the second electrode 20c is placed on the second pad 14 at a position separated from the main body 20a. 4 to 6, the hatched portion indicates lead-free cream solder, and what is printed on the first pad 12 is denoted by reference numeral 22, and what is printed on the second pad 14 is denoted by reference numeral 24.

ここで、図７を参照して表面実装部品用パッド１０の形状について詳説する。図７は、表面実装部品用パッド１０の説明図である。   Here, the shape of the surface-mounted component pad 10 will be described in detail with reference to FIG. FIG. 7 is an explanatory diagram of the surface mount component pad 10.

図７に示すように、２個の引出し部１２ｂは、電極載置部１２ａの中心位置１２ｃと第２のパッド１４の中心位置１４ｃを結ぶ線２８に対し、対称となる位置に設けられる。より具体的には、２個の引出し部１２ｂは、プリント基板ＣＢ上の表面実装部品２０を除く他の電子部品（図示せず）に干渉しない位置において、線２８に対して対称となるように設けられる。尚、２個の引き出し部１２ｂの位置は、線２８に対して対称であれば良く、必ずしも図示のように引き出し部１２ｂと線２８のなす角度が直角である必要はない。   As shown in FIG. 7, the two lead portions 12 b are provided at positions that are symmetrical with respect to a line 28 that connects the center position 12 c of the electrode placement portion 12 a and the center position 14 c of the second pad 14. More specifically, the two lead portions 12b are symmetrical with respect to the line 28 at a position where they do not interfere with other electronic components (not shown) other than the surface mount component 20 on the printed circuit board CB. Provided. The positions of the two lead portions 12b need only be symmetrical with respect to the line 28, and the angle formed between the lead portion 12b and the line 28 does not necessarily have to be a right angle as shown.

また、引き出し部１２ｂにおいて第２の部位１２ｂ２の幅Ｗ２は、第１の部位１２ｂ１の幅Ｗ１の３分の２程度の値に設定される。尚、幅Ｗ１，Ｗ２とは、引き出し部１２ｂの引き出し方向（突出方向）と直交する方向における幅を意味する。第２の部位１２ｂ２の幅Ｗ２は、表面実装部品２０の位置ずれを考慮し、電極載置部１２ａの直径Ｄの３分の１程度またはそれ以下の値に設定される。   Further, the width W2 of the second part 12b2 in the lead-out part 12b is set to a value of about two thirds of the width W1 of the first part 12b1. The widths W1 and W2 mean widths in a direction orthogonal to the drawing direction (protruding direction) of the drawing portion 12b. The width W2 of the second portion 12b2 is set to a value of about one third or less of the diameter D of the electrode mounting portion 12a in consideration of the positional deviation of the surface mount component 20.

また、引き出し部１２ｂにおいて第２の部位１２ｂ２の長さＬ２は、第１の部位１２ｂ１の長さＬ１の３分の２程度の値に設定される。尚、長さＬ１，Ｌ２とは、引き出し部１２ｂの引き出し方向における幅を意味する。   Further, the length L2 of the second part 12b2 in the lead-out part 12b is set to a value of about two thirds of the length L1 of the first part 12b1. The lengths L1 and L2 mean the width in the pulling direction of the pulling portion 12b.

第２の部位１２ｂ２の長さＬ２は、具体的には、第２の部位１２ｂ２の一部が表面実装部品の本体２０ａ（図７で図示せず）の上面視における外形よりも外方に突出するように設定される。但し、第１の部位１２ｂ１の長さＬ１と第２の部位１２ｂ２の長さＬ２の合計値は、プリント基板ＣＢの実装面積が低下するのを考慮し、電極載置部１２ａの直径Ｄの３分の１程度またはそれ以下の値に設定するのが望ましい。   Specifically, the length L2 of the second portion 12b2 is such that a part of the second portion 12b2 protrudes outward from the outer shape of the main body 20a (not shown in FIG. 7) of the surface mount component in a top view. Set to do. However, the total value of the length L1 of the first portion 12b1 and the length L2 of the second portion 12b2 takes into consideration that the mounting area of the printed circuit board CB is reduced, and is 3 of the diameter D of the electrode placement portion 12a. It is desirable to set to a value of about 1 / min or less.

次いで、図４から図６を再度参照し、表面実装部品用パッド１０と表面実装部品２０の接続（半田付け）について説明する。   Next, the connection (soldering) of the surface mount component pad 10 and the surface mount component 20 will be described with reference to FIGS. 4 to 6 again.

表面実装部品用パッド１０上に載置された表面実装部品２０は、無鉛クリーム半田２２，２４をリフロー（溶融）させることによって表面実装部品用パッド１０に接続される。   The surface-mounted component 20 placed on the surface-mounted component pad 10 is connected to the surface-mounted component pad 10 by reflowing (melting) the lead-free cream solders 22 and 24.

このとき、引出し部１２ｂに印刷された無鉛クリーム半田２２は、図５および図６に示すように、半田フィレット３０として引出し部１２ｂの上部、特に、第２の部位１２ｂ１の上部に残留する。   At this time, as shown in FIGS. 5 and 6, the lead-free cream solder 22 printed on the lead portion 12b remains as a solder fillet 30 on the top of the lead portion 12b, particularly on the second portion 12b1.

鉛を含まない無鉛クリーム半田は、従来の共晶クリーム半田に比してリフロー時に電極に吸い寄せられ易いという特性を持つのは前述の通りである。しかしながら、この発明に係る表面実装部品用パッド１０にあっては、引き出し部１２ｂにおいて電極載置部１２ａの近傍（第２の部位１２ｂ２）を、残余の部位（第１の部位１２ｂ１）に比して縮径させるように構成したので、縮径された部位がリフローした無鉛クリーム半田２２の流動抵抗となり、引き出し部１２ｂに印刷された無鉛クリーム半田２２が第１の電極２０ｂに吸い寄せられるのが抑制される。これにより、引き出し部１２ｂの上部には、表面実装部品２０の半田付け（具体的には、第１の電極２０ｂの半田付け）の良否判定を行うのに十分な大きさの半田フィレット３０が形成される。   As described above, the lead-free cream solder that does not contain lead has a characteristic that it is easily attracted to the electrode at the time of reflow as compared with the conventional eutectic cream solder. However, in the surface mount component pad 10 according to the present invention, in the lead portion 12b, the vicinity of the electrode placement portion 12a (second portion 12b2) is compared with the remaining portion (first portion 12b1). Therefore, the reduced diameter portion becomes the flow resistance of the reflowed lead-free cream solder 22, and the lead-free cream solder 22 printed on the lead portion 12b is prevented from being sucked to the first electrode 20b. Is done. As a result, a solder fillet 30 large enough to determine whether or not the surface mounting component 20 is soldered (specifically, soldering of the first electrode 20b) is formed on the lead portion 12b. Is done.

続いて、第１の電極２０ｂの半田付けの良否判定について簡単に説明する。上記したように、表面実装部品の本体２０ａの上面視における外形から突出した引き出し部１２ｂの上部（即ち、上方から視覚によって確認できる位置）には、第１の電極２０ｂの半田付けの良否判定を行うのに十分な大きさの半田フィレット３０が形成される。   Subsequently, the quality determination of the soldering of the first electrode 20b will be briefly described. As described above, whether or not the first electrode 20b is soldered is determined on the upper portion of the lead portion 12b protruding from the outer shape of the main body 20a of the surface mount component (ie, a position that can be visually confirmed from above). A solder fillet 30 large enough to be formed is formed.

従って、第１の電極２０ｂの半田付けの良否判定は、図８に示す如く、プリント基板ＣＢの上方からＣＣＤカメラなどによって撮影して得た二値画像、あるいは目視などの適宜な検査手段４０を用い、半田フィレット３０の形状（大きさ）を確認することによって行う。尚、これは第２の電極２０ｃに関しても同様である。   Accordingly, whether the soldering of the first electrode 20b is acceptable or not is determined by using an appropriate inspection means 40 such as a binary image obtained by photographing with a CCD camera or the like from above the printed circuit board CB, or visual inspection, as shown in FIG. Used by confirming the shape (size) of the solder fillet 30. This also applies to the second electrode 20c.

このように、この発明の第１実施例に係るプリント基板の表面実装部品用パッドにあっては、接続対象たる第１の電極２０ｂが載置されるべき電極載置部１２ａを、第１の電極２０ｂと略同形に形成したので、リフロー時に表面実装部品２０に位置ずれが生じるのを防止することができる。   Thus, in the surface mount component pad of the printed circuit board according to the first embodiment of the present invention, the electrode mounting portion 12a on which the first electrode 20b to be connected is to be mounted is the first Since the electrode 20b is formed in substantially the same shape, it is possible to prevent the surface mounted component 20 from being displaced during reflow.

また、電極載置部１２ａに連続する引き出し部１２ｂを形成し、かかる引き出し部１２ｂを表面実装部品２０の本体２０ａの上面視における外形から突出させると共に、引き出し部１２ｂにおいて電極載置部１２ａの近傍（第２の部位１２ｂ２）を残余の部位（１２ｂ１）に比して縮径させるようにしたので、無鉛クリーム半田をリフローさせた際、縮径された部位（第２の部位１２ｂ２）が流動抵抗となり、引き出し部１２ｂに印刷された無鉛クリーム半田２２が第１の電極２２ｂに吸い寄せられるのを抑制することができる。これにより、上方から視覚で確認できる位置（即ち、引き出し部１２ｂ）に第１の電極２２ｂの半田付けの良否判定を行うのに十分な大きさの半田フィレット３０を形成させることができ、よって上方からの目視や画像撮影によるフィレット形状の確認によって半田付けの良否を精度良く判定することができる。   In addition, a lead portion 12b that is continuous with the electrode placement portion 12a is formed, and the lead portion 12b protrudes from the outer shape of the main body 20a of the surface mount component 20 as well as in the vicinity of the electrode placement portion 12a in the lead portion 12b. Since the diameter of the second part 12b2 is smaller than that of the remaining part (12b1), when the lead-free cream solder is reflowed, the diameter-reduced part (second part 12b2) is flow resistance. Thus, the lead-free cream solder 22 printed on the lead portion 12b can be prevented from being attracted to the first electrode 22b. This makes it possible to form a solder fillet 30 large enough to determine whether or not the first electrode 22b is soldered at a position that can be visually confirmed from above (that is, the lead portion 12b). The quality of soldering can be determined with high accuracy by checking the fillet shape by visual inspection or image capturing.

また、引出し部１２ｂを２個形成すると共に、電極載置部１２ａと引き出し部１２ｂとで構成される第１のパッド１２から離間した位置に第２のパッド１４を形成し、２個の引出し部１２ｂを電極載置部１２ａと第２のパッド１４の中心位置を結ぶ線２８に対して対称となる位置に設けるようにしたので、リフローした無鉛クリーム半田の表面張力に起因する表面実装部品の位置ずれを抑制することができ、よって表面実装部品の位置ずれをより効果的に防止することができる。   Further, two lead portions 12b are formed, and a second pad 14 is formed at a position separated from the first pad 12 constituted by the electrode placement portion 12a and the lead portion 12b, and the two lead portions are formed. 12b is provided at a position that is symmetrical with respect to the line 28 that connects the electrode mounting portion 12a and the center position of the second pad 14, so that the position of the surface mount component caused by the surface tension of the reflowed lead-free cream solder The shift can be suppressed, and therefore the position shift of the surface mount component can be more effectively prevented.

また、引出し部１２ｂを、プリント基板ＣＢ上の他の電子部品に干渉しない位置に設けるようにしたので、プリント基板の実装面積の低下を抑制することができる。   Moreover, since the drawer part 12b is provided at a position where it does not interfere with other electronic components on the printed circuit board CB, it is possible to suppress a reduction in the mounting area of the printed circuit board.

尚、上記において、電極載置部１２ａを第１の電極２０ｂと略同形としたが、同形としても良い。但し、位置ずれ防止の観点から、電極載置部１２ａは、第１の電極２０ｂよりも僅かに大きく形成することが望ましい。   In the above description, the electrode mounting portion 12a has substantially the same shape as the first electrode 20b, but may have the same shape. However, it is desirable to form the electrode mounting portion 12a slightly larger than the first electrode 20b from the viewpoint of preventing misalignment.

また、表面実装部品２０をパワーツェナーダイオードとしたが、他の電子部品であっても良い。また、引き出し部１２ｂを２個形成するようにしたが、１個であっても良いし、３個以上形成しても良い。   Further, although the surface mount component 20 is a power Zener diode, it may be another electronic component. In addition, two lead portions 12b are formed, but one lead portion or three or more lead portions may be formed.

以上の如く、この発明の第１実施例にあっては、表面実装部品（２０）の底部において前記表面実装部品（具体的にはその本体２０ａ）の上面視における外形よりも小さく形成された電極（第１の電極２２ｂ）を、パッド（第１のパッド１２）上に印刷された無鉛クリーム半田（２２）を溶融させてプリント基板（ＣＢ）に接続するプリント基板の表面実装部品用パッド（１０）において、前記パッドを、前記電極と同形あるいは略同形に形成された、前記電極が載置されるべき電極載置部（１２ａ）と、前記電極載置部に連続して形成されて前記表面実装部品の上面視における外形から突出させられた引き出し部（１２ｂ）とから構成すると共に、前記引き出し部において前記電極載置部の近傍（第２の部位１２ｂ２）を、残余の部位（第１の部位１２ｂ１）に比して縮径させるように構成した。   As described above, in the first embodiment of the present invention, the electrode formed on the bottom portion of the surface mount component (20) smaller than the outer shape of the surface mount component (specifically, the main body 20a) when viewed from above. A surface mount component pad (10) for connecting the first electrode 22b to the printed circuit board (CB) by melting the lead-free cream solder (22) printed on the pad (first pad 12). ), The pad is formed in the same shape or substantially the same shape as the electrode, the electrode mounting portion (12a) on which the electrode is to be mounted, and the surface formed by being continuously formed on the electrode mounting portion The lead-out part (12b) protruded from the outer shape of the mounted component in a top view, and the vicinity of the electrode mounting part (second part 12b2) in the lead-out part is the remaining part (first part). It was constructed than the site 12b1) of such decrease the diameter.

これにより、無鉛クリーム半田を使用した場合であっても、上方からの目視や画像撮影によるフィレット形状の確認によって半田付けの良否を精度良く判定できると共に、表面実装部品の位置ずれを防止することができる。   As a result, even when lead-free cream solder is used, it is possible to accurately determine whether soldering is good or not by checking the fillet shape by visual observation or image capturing from above, and to prevent displacement of surface-mounted components. it can.

また、前記引出し部（１２ｂ）を少なくとも２個形成すると共に、前記パッド（１２）から離間した位置に第２のパッド（１４）を形成し、前記２個の引出し部を、前記電極載置部（１２ａ）と前記第２のパッドの中心位置を結ぶ線（２８）に対して対称となる位置に設けるように構成した。   In addition, at least two lead portions (12b) are formed, a second pad (14) is formed at a position spaced from the pad (12), and the two lead portions are connected to the electrode placement portion. It is configured to be provided at a position that is symmetrical with respect to a line (28) connecting (12a) and the center position of the second pad.

これにより、リフローした無鉛クリーム半田の表面張力に起因する表面実装部品の位置ずれを抑制することができ、よって表面実装部品の位置ずれをより効果的に防止することができる。   Thereby, the position shift of the surface mount component resulting from the surface tension of the reflowed lead-free cream solder can be suppressed, and thus the position shift of the surface mount component can be more effectively prevented.

また、前記引出し部（１２ｂ）を、前記プリント基板（ＣＢ）上の前記表面実装部品（２０）を除く電子部品に干渉しない位置に設けるように構成した。   Moreover, it was comprised so that the said drawer | drawing-out part (12b) might be provided in the position which does not interfere with electronic components except the said surface mount components (20) on the said printed circuit board (CB).

これにより、プリント基板の実装面積の低下を抑制することができる。   Thereby, the fall of the mounting area of a printed circuit board can be suppressed.

この発明の第１実施例に係るプリント基板の表面実装部品用パッドを示す平面図である。It is a top view which shows the pad for surface mounting components of the printed circuit board concerning 1st Example of this invention. 図１に示す表面実装部品用パッドを紙面下方から見た側面図である。It is the side view which looked at the pad for surface mount components shown in FIG. 1 from the paper surface lower side. 図１に示す表面実装部品用パッドを紙面左方から見た側面図である。It is the side view which looked at the pad for surface mount components shown in FIG. 1 from the paper surface left side. 図１に示す表面実装部品用パッドとそれに接続された表面実装部品を示す平面図である。It is a top view which shows the pad for surface mounting components shown in FIG. 1, and the surface mounting component connected to it. 図４に示す表面実装部品用パッドと表面実装部品を紙面下方から見た側面図である。FIG. 5 is a side view of the surface mount component pad and the surface mount component shown in FIG. 図４に示す表面実装部品用パッドと表面実装部品を紙面左方から見た側面図である。It is the side view which looked at the pad for surface mount components and surface mount component shown in FIG. 4 from the paper surface left side. 図１に示す表面実装部品用パッドの説明図である。It is explanatory drawing of the surface mount component pad shown in FIG. 図１に示す表面実装部品用パッドの半田付け良否判定の手法を説明する、図６と同様な側面図である。FIG. 7 is a side view similar to FIG. 6 for explaining a method of determining whether soldering of the surface mount component pad shown in FIG.

符号の説明Explanation of symbols

１０ 表面実装部品用パッド
１２ 第１のパッド
１４ 第２のパッド
１２ａ 電極載置部
１２ｂ 引き出し部
１２ｂ１ 第１の部位（残余の部位）
１２ｂ２ 第２の部位（電極載置部の近傍）
２０ 表面実装部品
２０ｂ 第１の電極
２８ 電極載置部と第２のパッドの中心位置を結ぶ線
３０ 半田フィレット
ＣＢ プリント基板 DESCRIPTION OF SYMBOLS 10 Surface mount component pad 12 1st pad 14 2nd pad 12a Electrode mounting part 12b Lead part 12b1 1st site | part (remaining site | part)
12b2 2nd site | part (near electrode mounting part)
20 surface mount component 20b first electrode 28 line connecting electrode mounting portion and center position of second pad 30 solder fillet CB printed circuit board

Claims (3)

表面実装部品の底部において前記表面実装部品の上面視における外形よりも小さく形成された電極を、パッド上に印刷された無鉛クリーム半田を溶融させてプリント基板に接続するプリント基板の表面実装部品用パッドにおいて、前記パッドを、前記電極と同形あるいは略同形に形成された、前記電極が載置されるべき電極載置部と、前記電極載置部に連続して形成されて前記表面実装部品の上面視における外形から突出させられた引き出し部とから構成すると共に、前記引き出し部において前記電極載置部の近傍を、残余の部位に比して縮径させたことを特徴とするプリント基板の表面実装部品用パッド。   A pad for a surface mount component of a printed circuit board in which an electrode formed smaller than the outer shape of the surface mount component at the bottom of the surface mount component is connected to the printed circuit board by melting lead-free cream solder printed on the pad The pad is formed in the same shape or substantially the same shape as the electrode, the electrode mounting portion on which the electrode is to be mounted, and the upper surface of the surface mount component formed continuously from the electrode mounting portion A surface mounting of a printed circuit board comprising: a lead portion protruding from an outer shape as viewed; and a diameter of the lead portion in the vicinity of the electrode mounting portion being reduced compared to the remaining portion. Pad for parts. 前記引出し部を少なくとも２個形成すると共に、前記パッドから離間した位置に第２のパッドを形成し、前記２個の引出し部を、前記電極載置部と前記第２のパッドの中心位置を結ぶ線に対して対称となる位置に設けたことを特徴とする請求項１記載のプリント基板の表面実装部品用パッド。   At least two lead portions are formed, a second pad is formed at a position spaced from the pad, and the two lead portions are connected to the center positions of the electrode mounting portion and the second pad. 2. The surface mount component pad of a printed circuit board according to claim 1, wherein the pad is provided at a position symmetrical to the line. 前記引出し部を、前記プリント基板上の前記表面実装部品を除く電子部品に干渉しない位置に設けたことを特徴とする請求項１または２記載のプリント基板の表面実装部品用パッド。
3. The surface mount component pad of a printed circuit board according to claim 1, wherein the lead-out portion is provided at a position on the printed circuit board that does not interfere with electronic components other than the surface mount component.
JP2004154598A 2004-05-25 2004-05-25 Pad for surface mounted component on printed board Pending JP2005340346A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009187992A (en) * 2008-02-04 2009-08-20 Shindengen Electric Mfg Co Ltd Surface mounting structure of semiconductor device
WO2015159567A1 (en) * 2014-04-14 2015-10-22 日本メクトロン株式会社 Printed circuit board and production method for printed circuit

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009187992A (en) * 2008-02-04 2009-08-20 Shindengen Electric Mfg Co Ltd Surface mounting structure of semiconductor device
WO2015159567A1 (en) * 2014-04-14 2015-10-22 日本メクトロン株式会社 Printed circuit board and production method for printed circuit

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