JP2005333021A - Chip-type variable electronic part and resistor thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a chip-type variable electronic part that is provided with an insulating substrate 2 with a through hole 5, an adjusting rotor 3 that is arranged on the upper surface of the insulating substrate and is formed like a cup by using a metal plate, an intermediate terminal electrode plate 4 made of metal plate that is in contact with the lower surface of the insulating substrate, and a hollow shaft 9 provided integrally on the intermediate electrode plate in a manner to be engaged in the through hole, and wherein a bottom plate in the adjusting rotor is covered freely rotatably at the upper end of the hollow shaft so that the bottom plate may be in contact with the surface of the insulating substrate and the upper end of the hollow shaft is caulked wider outwardly; and to make a total height L small without reducing the allowable depth W of a driver tool into the rotor and degrading the strength of the insulating substrate. <P>SOLUTION: The thickness of the bottom plate 17 among the adjusting roller 3 is made smaller than those of the other parts in the rotor. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a chip-type variable electronic component and a variable resistor in which a rotor for adjusting, for example, a resistance value or a capacitor capacity is rotatably mounted.

  As is well known, a chip-type variable resistor, which is representative of the variable electronic component, is a chip-type resistor film formed on the upper surface of an insulating substrate having a through hole at the center. Are formed in an arc shape centered on the through hole, and external terminal electrodes for both ends of the arc resistance film are provided on the insulating substrate, and a hollow that fits in the through hole is formed on the lower surface of the insulating substrate. While a middle plate electrode plate made of a metal plate having an integral shaft is disposed, the upper surface of the insulating substrate is formed in a bowl shape with a metal plate, and a slider is brought into contact with the resistance film. The adjusting rotor is provided so that the bottom of the rotor is fitted to the upper end of the hollow shaft in a state in which the bottom of the rotor is in close contact with the upper surface of the insulating substrate. It is attached to the insulating substrate so that it can rotate freely. Inside the motor, and configured to receive a driver tool to rotate the rotor.

  In addition, in the conventional chip-type variable resistor, when this is soldered and mounted on a printed circuit board or the like, soldering flux or the like enters the rotor through the hollow shaft. In order to prevent this, the hollow shaft is configured to be closed by sticking a film to the lower surface of the middle terminal electrode plate.

  By the way, the adjustment rotor receives a driver tool that rotates the rotor in the interior thereof, and in order to ensure the engagement of the driver tool with the rotor, the rotor into the rotor Since the depth of acceptance of the driver tool must be increased, and the height dimension of the rotor configured in a bowl shape must be increased, the total height of the chip-type variable resistor is increased.

  Further, in the case of sticking a film to the lower surface of the middle terminal electrode plate, the film is in a state of protruding from the lower surface of the middle terminal electrode plate, and the chip type variable type by the thickness of the film. The total height of the resistor is increased.

  In view of this, Patent Document 1 describes that the entire height of the upper surface of the insulating substrate is lowered by partially denting the bottom portion of the adjusting rotor. .

Further, in Patent Document 2, a concave portion is provided in a through hole portion of the lower surface of the insulating substrate, and the hollow shaft portion of the middle terminal electrode plate is fitted into the concave portion, whereby the film is formed. It is described that the film is configured not to protrude and the thickness of the film is not added to the total height.
JP-A-9-260116 Japanese Utility Model Publication No. 2-102703

  In order to reduce the overall height, as described in Patent Document 1, partially denting the upper surface of the insulating substrate increases the depth of the recess by an amount that reduces the overall height. Therefore, the cost required for manufacturing the insulating substrate is increased not only by partially denting the upper surface, but also the strength of the insulating substrate is reduced, and during the manufacturing and mounting on the printed circuit board. There was a problem of frequent cracking inside.

  In addition, as described in the above-mentioned Patent Document 1, in order to attach a film to the lower surface of the middle terminal electrode plate on the lower surface of the insulating substrate, it is similarly provided with a recessed portion. In addition, the cost required for manufacturing the insulating substrate increases not only by providing a recess on the lower surface thereof, but also the strength of the insulating substrate decreases, and it may crack during its manufacture and mounting on the printed circuit board. There was a problem of frequent occurrence.

  In particular, the above-described problem becomes more prominent when the concave portion is provided on the lower surface in addition to the concave portion of the upper surface of the insulating substrate.

  An object of the present invention is to provide a variable electronic component that solves these problems.

In order to achieve this technical problem, claim 1 of the present invention provides:
“An insulating substrate having a through hole, an adjustment rotor disposed on the upper surface side of the insulating substrate and configured in a bowl shape with a metal plate, a middle terminal electrode plate made of a metal plate in close contact with the lower surface of the insulating substrate, A hollow shaft integrally provided on the middle terminal electrode plate so as to fit in the through-hole, and the bottom plate of the adjusting rotor is in close contact with the upper end of the hollow shaft, and the bottom plate is in close contact with the surface of the insulating substrate. In a chip-type variable electronic component that is rotatably fitted so that the upper end of the hollow shaft is caulked outward,
The plate thickness of the bottom plate of the adjusting rotor is made thinner than the plate thickness of other portions of the rotor. "
It is characterized by that.

Further, claim 2 of the present invention provides
“An insulating substrate having a through hole, an adjustment rotor disposed on the upper surface side of the insulating substrate and configured in a bowl shape with a metal plate, a middle terminal electrode plate made of a metal plate in close contact with the lower surface of the insulating substrate, The middle terminal electrode plate is provided with a hollow shaft integrally provided so as to fit into the through hole, and the bottom plate of the adjusting rotor is disposed at the tip of the hollow shaft so that the bottom plate is in close contact with the surface of the insulating substrate. The upper end of the hollow shaft is caulked outwardly, and a film for closing the hollow shaft is attached to the hollow shaft portion of the lower surface of the middle terminal electrode plate. In chip-type variable electronic components,
The plate | board thickness in the part which sticks the said film among the said middle terminal electrode plates is made thinner than the plate | board thickness in another part among the said middle terminal electrode plates. "
It is characterized by that.

Furthermore, claim 3 of the present invention provides
“An insulating substrate having a through hole, an adjustment rotor disposed on the surface side of the insulating substrate and configured in a bowl shape with a metal plate, a middle terminal electrode plate made of a metal plate in close contact with the lower surface of the insulating substrate, The middle terminal electrode plate is provided with a hollow shaft that is integrally provided so as to fit into the through hole, and the bottom plate of the adjusting rotor is attached to the upper end of the hollow shaft so that the bottom plate is in close contact with the surface of the insulating substrate. The upper end of the hollow shaft is caulked outwardly, and a film for closing the hollow shaft is attached to the hollow shaft portion of the lower surface of the middle terminal electrode plate. In chip-type variable electronic components,
The plate thickness of the bottom plate of the adjusting rotor is made thinner than the plate thickness of the other portion of the rotor, and the plate thickness of the hollow shaft portion of the middle terminal electrode plate is The thickness of the middle terminal electrode plate is made thinner than that of other portions. "
It is characterized by that.

In addition, claim 4 of the present invention provides
“In any one of claims 1 to 3, the stopper mechanism for restricting the rotation angle of the adjusting rotor is configured not to protrude from the upper surface of the rotor.”
It is characterized by that.

Claim 5 of the present invention provides
“The chip-type variable electronic component according to any one of claims 1 to 3, wherein the chip-type variable electronic component includes an arc-shaped resistance film centered on the through-hole in the insulating substrate, and external terminal electrodes to both ends of the resistance film. And a slider that slidably contacts the resistance film on the adjustment rotor. "
It is characterized by that.

Claim 6 of the present invention provides
“In the description of claim 5, the stopper mechanism for restricting the rotation angle of the adjusting rotor is configured not to protrude from the upper surface of the rotor.”
It is characterized by that.

  As described in claim 1, by making the plate thickness of the bottom plate of the adjusting rotor smaller than the plate thickness of the other portion of the rotor, the height dimension of the rotor is set to the rotor. Since the depth of the bottom plate in the plate can be reduced without reducing the depth of acceptance of the driver tool into the rotor, the overall height dimension of the chip-type variable electronic component can be reduced. In order to reduce the height, it is possible to omit the partial recess of the upper surface of the insulating substrate as in Patent Document 1, or even when the upper surface of the insulating substrate is partially recessed, The depth can be made shallower by the thickness of the bottom plate of the rotor.

  Moreover, as described in claim 2, by making the plate thickness in the portion of the middle terminal electrode plate to which the film is stuck smaller than the plate thickness in the other portion of the middle terminal electrode plate. The overall height dimension of the chip-type variable electronic component is a plate in a portion of the middle terminal electrode plate where the film is adhered without providing a recess for fitting the middle terminal electrode plate on the lower surface of the insulating substrate. Even when the thickness can be reduced by the reduced thickness, or when a recess is provided on the lower surface of the insulating substrate to which the middle terminal electrode plate is fitted, the depth of the recess is set to the depth of the middle terminal electrode plate. Of these, the plate thickness at the portion where the film is attached can be made shallower by the amount made thinner.

  Furthermore, as described in claim 3, the thickness of the bottom plate of the adjusting rotor is made thinner than the thickness of the other portion of the rotor, and the middle terminal electrode plate By making the plate thickness in the hollow shaft portion thinner than the plate thickness in the other portion of the middle terminal electrode plate, the height dimension in this rotor is reduced to the plate thickness of the bottom plate in the rotor. In order to reduce the total height dimension of the chip-type variable electronic component, the above-mentioned patent can be lowered under the condition that the receiving depth of the driver tool into the rotor is not reduced. As described in Document 1, it can be omitted to partially dent the upper surface of the insulating substrate, or even when the upper surface of the insulating substrate is partially recessed, the depth of the dent is given to the rotor. The bottom plate can be made as thin as the thickness of the bottom plate can be reduced, and the overall height of the chip-type variable electronic component can be reduced without providing a recess for fitting the middle terminal electrode plate on the lower surface of the insulating substrate. When the thickness of the middle terminal electrode plate in the portion where the film is pasted can be reduced by the reduced thickness, or when the concave portion in which the middle terminal electrode plate is fitted is provided on the lower surface of the insulating substrate. In this case, the depth of the recess can be made shallower by reducing the plate thickness at the portion of the middle terminal electrode plate where the film is adhered.

  In short, according to the present invention, the upper surface of the insulating substrate is partially formed in a state in which the depth of acceptance of the driver tool into the rotor is increased and the overall height of the chip-type variable electronic component is reduced. The indentation and / or the provision of a recess in the lower surface of the insulating substrate can be omitted, or the depth when the upper surface of the insulating substrate is recessed and / or the recess in the lower surface of the insulating substrate is provided. Since the depth of the time can be reduced, the cost required for manufacturing the insulating substrate can be greatly reduced as compared with the conventional case, and the insulating substrate is surely cracked during its manufacture and mounting on the printed circuit board. Can be reduced.

  In particular, according to the fourth aspect of the present invention, when a stopper mechanism for restricting the rotation angle of the adjusting rotor is provided, it is possible to avoid an increase in the overall height due to the stopper mechanism.

  Moreover, according to the structure described in Claim 5 and 6, there exists an advantage which can comprise a chip-type variable resistor in what has the above-mentioned effect.

  Hereinafter, drawings (FIGS. 1 to 5) in a case where an embodiment of the present invention is applied to a chip-type variable resistor will be described.

  In these drawings, reference numeral 1 denotes a chip-type variable resistor. The chip-type variable resistor 1 includes an insulating substrate 2 configured in a chip shape with a heat-resistant insulating material such as ceramic, and an upper surface of the insulating substrate 2. And the middle terminal electrode plate 4 disposed on the lower surface of the insulating substrate 2.

  The insulating substrate 2 has a through hole 5 penetrating from the upper surface to the lower surface at a substantially center thereof, and a resistance film 6 is formed on the upper surface so as to extend in an arc shape with the through hole 5 as a center. On one side surface 2 a of the insulating substrate 2, external terminal electrodes 7 and 8 for both ends of the resistance film 5 are provided.

  The middle terminal electrode plate 4 is suitably made of a metal plate having a thickness of S0, is in close contact with the lower surface of the insulating substrate 2, and is inserted into the through hole 5 in the through hole 5 portion. A hollow shaft 9 is integrally provided, and a stopper piece 10 formed by bending upward is integrally provided on the other side surface 2 b of the insulating substrate 2.

  On the other hand, the rotor 3 is integrally formed with a first plate 11 formed in a bowl shape having a flange on the outer periphery with a metal plate having an appropriate thickness T0, and the first plate 11 via a folded connection portion 12. The second plate 13 is connected to a planar plate-like second plate 13, and the second plate 13 has a cross-shaped driver engagement hole 14 formed in the second plate 13, and is formed on the upper surface of the first plate 10 from the folded connection portion 12. On the other hand, the outer peripheral flange of the first plate 10 is provided with a slit hole 15 extending in a substantially semicircular arc shape at a portion opposite to the folded connection portion 12. The portion outside the slit hole 15 is configured as a slider 16 that elastically contacts the resistance film 5.

  The rotor 3 is fitted on the upper surface side of the insulating substrate 2, and a mounting hole 18 formed in the bottom plate 17 of the first plate 10 of the rotor 3 is fitted on the upper end of the hollow shaft 9. After the lower surface of 17 is in close contact with the upper surface of the insulating substrate 2 and the slider 16 is supplied so as to elastically contact the resistance film 5, the upper end of the hollow shaft 9 is spread outward. By caulking in this way, the hollow shaft 9 is mounted so as to freely rotate about the hollow shaft 9 as a central axis.

  Then, the plate thickness T1 of the bottom plate 17 in the first plate 10 of the rotor 3 is made thinner than the original plate thickness T0 in the metal plate constituting the rotor 3, and this thin plate thickness T1 is obtained. The bottom plate 17 is in close contact with the upper surface of the insulating substrate 2 and is rotatably mounted on the hollow shaft 9.

  Further, the plate thickness S1 in the portion of the hollow shaft 9 provided integrally therewith in the middle terminal electrode plate 4 is set to be larger than the original plate thickness S0 in the metal plate constituting the middle terminal electrode plate 4. The film 19 is made thin, and a film 19 made of heat-resistant synthetic resin is attached to the lower surface in this portion so as to block the inside of the hollow shaft 8 with the film 19.

  In addition, when thinning the bottom plate 17 in the first plate 10 of the rotor 3 from the original plate thickness T0 to the plate thickness T1, it is by coining that the bottom plate 17 is sandwiched between two molds, Alternatively, means such as grinding or cutting the lower surface of the bottom plate 17 can be employed.

  In addition, when the portion of the hollow shaft 9 of the middle terminal electrode plate 4 is reduced from the original plate thickness S0 to the plate thickness S1, the portion is similarly sandwiched between two molds. It is possible to adopt means such as coining, or grinding or cutting the lower surface of the portion.

  As described above, by making the plate thickness T1 of the bottom plate 17 of the adjusting rotor 3 thinner than the plate thickness T0 of other portions of the rotor, the height dimension H1 of the rotor 3 is The receiving depth W of the driver tool into the rotor 3 by the amount that the thickness of the bottom plate 17 in the rotor is reduced to T1 rather than the height dimension H0 of the bottom body 17 as it is. Therefore, in order to reduce the overall height L of the chip-type variable electronic component 1, the upper surface of the insulating substrate is partially formed as in Patent Document 1 described above. Can be omitted, or even when the top surface of the insulating substrate is partially recessed, the depth of the recess can be reduced by the thickness of the bottom plate of the rotor. so That.

  Further, as described above, the portion of the middle terminal electrode plate 4 to which the film 19 is adhered, that is, the plate thickness S1 at the portion of the hollow shaft 9 is set to the other portion of the middle terminal electrode plate 4. By making the thickness less than the plate thickness S0, the overall height dimension L of the chip-type variable electronic component 1 can be reduced without providing a recess portion into which the middle terminal electrode plate 4 is fitted on the lower surface of the insulating substrate 2. A concave portion in which the middle terminal electrode plate 4 fits on the lower surface of the insulating substrate 2 can be reduced by a reduction in the plate thickness S1 in the portion of the middle terminal electrode plate 4 where the film 19 is adhered. In this case, the depth of the recessed portion can be made shallower by reducing the plate thickness S1 in the portion of the middle terminal electrode plate 4 where the film 19 is adhered.

  When the adjusting rotor 3 rotates, the folded connection portion 12 of the rotor 3 comes into contact with the stopper piece 10 protruding upward from the upper surface of the insulating substrate 2 as shown in FIG. The rotation angle is restricted within the range of θ.

  In this case, the folded connection portion 12 and the stopper piece 10 with which the folded connection portion 12 contacts constitute a stopper mechanism for restricting the rotation of the adjusting rotor 3 to an angle θ. Since the folded connection portion 12 and the stopper piece 10 are configured not to protrude from the upper surface of the rotor 3, the total height L does not increase due to the stopper mechanism.

  In the embodiment shown in FIGS. 1 to 5, the stopper piece 10 is configured such that its upper end is bent downward and contacts the upper surface of the insulating substrate 2.

  With this configuration, the insulating substrate 2 is sandwiched from the upper and lower surfaces by the stopper piece 10, so that the strength of the stopper piece 10 can be improved and the middle terminal electrode plate 4 can be attached to the insulating substrate 2. Strength can be improved.

  The stopper piece is not limited to the above-described configuration, and as shown in FIGS. 6 and 7, the stopper piece is formed into a stopper piece 10 ′ having a U-shaped cross-section upward and bent upward. It goes without saying that it is also good.

  Needless to say, the present invention is not limited to the above-described chip-type variable resistor but can be similarly applied to a variable electronic component such as a variable capacitor.

  In the above-described illustrated embodiment, the turn-up connecting portion 12 in the rotor 3 increases the width dimension M, while straddling the hole 12a over both the first plate 11 and the second plate 13. In the state where the folding connection portion 12 can be easily bent, the twisted connection portion 12 is twisted in the lateral direction between the first plate 11 and the second plate 13. It is configured to maintain a strong strength against deformation.

  In addition, in the above-described illustrated embodiment, when the hole 12a is formed in the folded connection portion 12 and the cross-shaped driver engaging hole 14 is formed in the second plate 13, the hole is formed. By shifting the cross-shaped driver engagement hole 14 with respect to 12a so that the extraction hole 12a is positioned between the cross grooves in the driver engagement hole 14, the extraction hole 12a is formed in the second plate 13. And a cross-shaped driver engagement hole 14 are configured to avoid a decrease in strength of the second plate 13.

It is a top view of the variable resistor by embodiment of this invention. FIG. 2 is a sectional view taken along line II-II in FIG. 1. FIG. 3 is an exploded view of FIG. 2. It is an expanded view of a rotor. It is a top view when a rotor is rotated. It is a top view which shows another embodiment. FIG. 7 is a sectional view taken along line VII-VII in FIG. 6.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Chip-type variable resistor 2 Insulating board 3 Adjustment rotor 4 Middle terminal electrode plate 5 Through-hole 6 Resistance film 7, 8 Outer terminal electrode 9 Hollow shaft 10 Stopper piece 11 1st plate 12 Folding connection part 13 2nd plate 14 Driver Engagement hole 16 Slider 17 Bottom plate 18 Mounting hole 19 Film

Claims (6)

An insulating substrate having a through hole, an adjustment rotor disposed on the upper surface side of the insulating substrate and configured in a bowl shape with a metal plate, a middle terminal electrode plate made of a metal plate in close contact with the lower surface of the insulating substrate, A hollow shaft integrally provided on the middle terminal electrode plate so as to fit in the through-hole, and a bottom plate of the adjusting rotor is disposed on an upper end of the hollow shaft so that the bottom plate is in close contact with the surface of the insulating substrate. In a chip-type variable electronic component that is rotatably fitted on the upper end of the hollow shaft and is caulked outwardly,
A chip-type variable electronic component characterized in that a plate thickness of a bottom plate of the adjusting rotor is made thinner than plate thicknesses of other portions of the rotor. An insulating substrate having a through hole, an adjustment rotor disposed on the upper surface side of the insulating substrate and configured in a bowl shape with a metal plate, a middle terminal electrode plate made of a metal plate in close contact with the lower surface of the insulating substrate, A hollow shaft integrally provided on the middle terminal electrode plate so as to fit into the through-hole, and the bottom plate of the adjustment rotor is disposed at the tip of the hollow shaft so that the bottom plate is in close contact with the surface of the insulating substrate. A chip formed by being rotatably fitted and caulking the upper end of the hollow shaft outward, while a film covering the hollow shaft is attached to the hollow shaft portion of the lower surface of the middle terminal electrode plate. In variable type electronic parts,
A chip-type variable electronic component, wherein a thickness of a portion of the middle terminal electrode plate to which the film is adhered is made thinner than a thickness of the middle terminal electrode plate at the other portion. An insulating substrate having a through-hole, an adjustment rotor disposed on the surface side of the insulating substrate and configured in a bowl shape with a metal plate, a middle terminal electrode plate made of a metal plate in close contact with the lower surface of the insulating substrate, A hollow shaft integrally provided on the middle terminal electrode plate so as to fit into the through-hole, and a bottom plate of the adjusting rotor is disposed at an upper end of the hollow shaft so that the bottom plate is in close contact with the surface of the insulating substrate. A chip formed by being rotatably fitted and caulking the upper end of the hollow shaft outward, while a film covering the hollow shaft is attached to the hollow shaft portion of the lower surface of the middle terminal electrode plate. In variable type electronic parts,
The plate thickness of the bottom plate of the adjusting rotor is made thinner than the plate thickness of the other portion of the rotor, and the plate thickness of the hollow shaft portion of the middle terminal electrode plate is A chip-type variable electronic component characterized in that it is thinner than the thickness of the other portion of the middle terminal electrode plate.   The tip type variable type according to any one of claims 1 to 3, wherein a stopper mechanism for regulating a rotation angle of the adjusting rotor is configured not to protrude from an upper surface of the rotor. Electronic components.   The chip-type variable electronic component according to any one of claims 1 to 3, wherein the chip-type variable electronic component includes an arc-shaped resistance film centered on the through-hole in the insulating substrate, and external terminal electrodes for both ends of the resistance film. And a slider that slidably contacts the resistance film on the adjustment rotor.   6. The chip type variable resistor according to claim 5, wherein a stopper mechanism for restricting a rotation angle of the adjusting rotor is configured not to protrude from an upper surface of the rotor.

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