JP2005317908A5 - - Google Patents
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- Publication number
- JP2005317908A5 JP2005317908A5 JP2004365968A JP2004365968A JP2005317908A5 JP 2005317908 A5 JP2005317908 A5 JP 2005317908A5 JP 2004365968 A JP2004365968 A JP 2004365968A JP 2004365968 A JP2004365968 A JP 2004365968A JP 2005317908 A5 JP2005317908 A5 JP 2005317908A5
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- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004365968A JP2005317908A (ja) | 2004-03-31 | 2004-12-17 | 素子内蔵基板および素子内蔵基板の製造方法 |
| US11/090,812 US20050218491A1 (en) | 2004-03-31 | 2005-03-25 | Circuit component module and method of manufacturing the same |
| CNA2005100626675A CN1678175A (zh) | 2004-03-31 | 2005-03-31 | 电路部件模块及其制造方法 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004101609 | 2004-03-31 | ||
| JP2004365968A JP2005317908A (ja) | 2004-03-31 | 2004-12-17 | 素子内蔵基板および素子内蔵基板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2005317908A JP2005317908A (ja) | 2005-11-10 |
| JP2005317908A5 true JP2005317908A5 (nl) | 2007-03-01 |
Family
ID=35444972
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004365968A Withdrawn JP2005317908A (ja) | 2004-03-31 | 2004-12-17 | 素子内蔵基板および素子内蔵基板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2005317908A (nl) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100725481B1 (ko) | 2006-02-24 | 2007-06-07 | 삼성전기주식회사 | 전자 소자 내장형 인쇄회로기판 및 그 제조 방법 |
| WO2011067945A1 (ja) * | 2009-12-04 | 2011-06-09 | パナソニック株式会社 | 回路基板、回路モジュール、及び電子機器 |
| US8890628B2 (en) * | 2012-08-31 | 2014-11-18 | Intel Corporation | Ultra slim RF package for ultrabooks and smart phones |
| JP6139653B2 (ja) * | 2013-02-12 | 2017-05-31 | 株式会社村田製作所 | 部品内蔵樹脂多層基板 |
| KR102425753B1 (ko) * | 2015-06-01 | 2022-07-28 | 삼성전기주식회사 | 인쇄회로기판, 인쇄회로기판의 제조 방법 및 이를 포함하는 반도체 패키지 |
| JP6667105B2 (ja) * | 2016-04-15 | 2020-03-18 | 株式会社オートネットワーク技術研究所 | 回路基板、回路構成体、及び回路基板の製造方法 |
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2004
- 2004-12-17 JP JP2004365968A patent/JP2005317908A/ja not_active Withdrawn