JP2005311516A - Non-reciprocal circuit element, and manufacturing method thereof - Google Patents

Non-reciprocal circuit element, and manufacturing method thereof Download PDF

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JP2005311516A
JP2005311516A JP2004123071A JP2004123071A JP2005311516A JP 2005311516 A JP2005311516 A JP 2005311516A JP 2004123071 A JP2004123071 A JP 2004123071A JP 2004123071 A JP2004123071 A JP 2004123071A JP 2005311516 A JP2005311516 A JP 2005311516A
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yoke
resin body
insulating resin
input
bottom plate
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Atsuo Takano
敦雄 高野
Akira Sakai
晃 境
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Alps Alpine Co Ltd
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Alps Electric Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a non-reciprocal circuit element which can be reduced in thickness and has good workability, and a manufacturing method thereof. <P>SOLUTION: In this non-reciprocal circuit element, a box-like member 2 for accommodating a ferrite member 7 is formed of a second yoke 3 and an insulating resin body 5. A ground terminal 3e embedded in the resin body 5 has a coupling section 3c coupled to a bottom plate 3a and a bent tongue piece 3d extending along the external wall of the side wall 5b of the resin body 5. An L-shaped input/output terminal 4 embedded in the resin body 5 has a bottom 4a in the same plane state as the bottom plate 3a, and a bent side 4b extending along the external surface of the side wall 5b of the resin body 5. Thus, the bottom piece 4a of the input/output terminal 4 is in the same surface state as the bottom plate 3a of the second yoke 3, the thickness of the bottom wall of the box-like member 2 can be reduced, and a thin element can be obtained. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は携帯電話機等の移動体通信機の送信部等に適用されるアイソレータやサーキュレータからなる非可逆回路素子、及びその製造方法に関する。   The present invention relates to an irreversible circuit element including an isolator and a circulator applied to a transmission unit of a mobile communication device such as a mobile phone, and a manufacturing method thereof.

従来の非可逆回路素子、及びその製造方法の図面を説明すると、図8は従来の非可逆回路素子に係る分解斜視図、図9は従来の非可逆回路素子に係る樹脂ケースの要部断面図、図10は従来の非可逆回路素子の製造方法の第1工程を示す説明図、図11は従来の非可逆回路素子の製造方法の第2工程を示す説明図、図12は従来の非可逆回路素子の製造方法の第3工程を示す説明図、図13は従来の非可逆回路素子の製造方法の第4工程を示す説明図である。   FIG. 8 is an exploded perspective view according to a conventional non-reciprocal circuit element, and FIG. 9 is a cross-sectional view of a main part of a resin case according to the conventional non-reciprocal circuit element. FIG. 10 is an explanatory diagram showing a first step of a conventional non-reciprocal circuit device manufacturing method, FIG. 11 is an explanatory diagram showing a second step of a conventional non-reciprocal circuit device manufacturing method, and FIG. 12 is a conventional non-reciprocal circuit device. FIG. 13 is an explanatory diagram showing a fourth step of a conventional method for manufacturing a nonreciprocal circuit device.

次に、従来の非可逆回路素子の構成を図8〜図13に基づいて説明すると、箱形の磁性板(鉄板等)からなる第1のヨーク51内には、磁石52が収納されている。   Next, the configuration of a conventional non-reciprocal circuit device will be described with reference to FIGS. 8 to 13. A magnet 52 is housed in a first yoke 51 made of a box-shaped magnetic plate (iron plate or the like). .

箱形の樹脂ケース53は、絶縁樹脂の成型によって形成され、貫通孔53aを有する底壁53bと、底部53bの周辺から上方に延びる側壁53cを有する。
磁性板(鉄板等)からなるU字状の第2のヨーク54は、底板54aと、この底板から折り曲げられた一対の側板54bを有し、この第2のヨーク54は、樹脂ケース53に埋設されて一体化され、底板54aが貫通孔53aの下部に露出すると共に、第2のヨーク54は、第1のヨーク51と結合されて、磁気閉回路が形成される。
The box-shaped resin case 53 is formed by molding an insulating resin, and includes a bottom wall 53b having a through hole 53a and a side wall 53c extending upward from the periphery of the bottom 53b.
The U-shaped second yoke 54 made of a magnetic plate (iron plate or the like) has a bottom plate 54 a and a pair of side plates 54 b bent from the bottom plate. The second yoke 54 is embedded in the resin case 53. As a result, the bottom plate 54a is exposed below the through hole 53a, and the second yoke 54 is coupled to the first yoke 51 to form a magnetic closed circuit.

第2のヨーク54と同じ材料からなる複数の略U字状のアース端子55は、第2のヨーク54から切り離された状態で、樹脂ケース53に埋設されて一体化され、底壁53b上に露出する接続部55aと、樹脂ケース53の側壁53cの外面に沿って延びる折曲舌片55bを有する。   A plurality of substantially U-shaped ground terminals 55 made of the same material as the second yoke 54 are embedded in and integrated with the resin case 53 in a state of being separated from the second yoke 54, and are formed on the bottom wall 53b. The exposed connecting portion 55 a and a bent tongue 55 b extending along the outer surface of the side wall 53 c of the resin case 53 are provided.

第2のヨーク54と同じ材料からなる複数の略U字状の入出力端子56は、第2のヨーク54から切り離されて第2のヨーク54から絶縁状態で、樹脂ケース53に埋設されて一体化され、底壁53b上に露出する接続部56aと、樹脂ケース53の側壁53cの外面に沿って延びる折曲側片56bを有する。   A plurality of substantially U-shaped input / output terminals 56 made of the same material as that of the second yoke 54 are separated from the second yoke 54 and insulated from the second yoke 54 and embedded in the resin case 53 so as to be integrated. And has a connecting portion 56a exposed on the bottom wall 53b and a bent side piece 56b extending along the outer surface of the side wall 53c of the resin case 53.

チップ型のコンデンサ57と抵抗器58は、樹脂ケース53の底壁53b上に載置されて、アース端子55の接続部55aや入出力端子56の接続部56aに接続されている。   The chip-type capacitor 57 and the resistor 58 are placed on the bottom wall 53 b of the resin case 53 and connected to the connection portion 55 a of the ground terminal 55 and the connection portion 56 a of the input / output terminal 56.

平板状のフェライト部材59には、第1,第2,第3の中心導体60,61,62が巻回されて取り付けられ、このフェライト部材59は、第1,第2,第3の中心導体60,61,62と共に貫通孔53a内に挿入され、第1,第2,第3の中心導体60,61,62のアース部(図示せず)が第2のヨーク54の底板54aに接触し、また、第1,第2,第3の中心導体60,61,62のポート部60a、61a、62aがコンデンサ57や抵抗器58に接続される。   First, second, and third center conductors 60, 61, and 62 are wound and attached to the flat ferrite member 59, and the ferrite member 59 includes the first, second, and third center conductors. The ground portions (not shown) of the first, second, and third central conductors 60, 61, and 62 are in contact with the bottom plate 54a of the second yoke 54. Further, the port portions 60 a, 61 a, 62 a of the first, second, and third center conductors 60, 61, 62 are connected to the capacitor 57 and the resistor 58.

そして、磁石52,フェライト部材59,及び第1,第2,第3の中心導体60,61,62が第1のヨーク51と樹脂ケース53との間で挟持されると、従来の非可逆回路素子が形成される。   When the magnet 52, the ferrite member 59, and the first, second, and third center conductors 60, 61, and 62 are sandwiched between the first yoke 51 and the resin case 53, a conventional nonreciprocal circuit is obtained. An element is formed.

次に、従来の非可逆回路素子の製造方法を図10〜図13に基づいて説明すると、先ず、図10に示すように、フープ材65を打ち抜き加工して、中央部に位置する孔66内には、連結部68によって繋がった第2のヨーク54を形成すると共に、孔66の外周部には、複数のアース端子55となる帯状片69と、複数の入出力端子56となる帯状片70を形成する。   Next, a conventional non-reciprocal circuit device manufacturing method will be described with reference to FIGS. 10 to 13. First, as shown in FIG. 10, the hoop material 65 is punched into the hole 66 located in the center portion. The second yoke 54 connected by the connecting portion 68 is formed, and the strips 69 serving as the ground terminals 55 and the strips 70 serving as the plurality of input / output terminals 56 are formed on the outer periphery of the hole 66. Form.

次に、図11に示すように、折り曲げ加工によって、底板54aから折り曲げられた側板54bを形成した後、図12に示すように、折り曲げ加工によって、帯状片69,70が略U字状に折り曲げられて、帯状片69,70の先端部が底板54aの近傍に位置するようにする。   Next, as shown in FIG. 11, the side plate 54b bent from the bottom plate 54a is formed by bending, and then the strips 69 and 70 are bent into a substantially U shape by bending as shown in FIG. Thus, the front ends of the strips 69 and 70 are positioned in the vicinity of the bottom plate 54a.

次に、図13に示すように、成形加工によって樹脂ケース53を形成した後、切断線S1の位置で連結部58と帯状片69,70を切断し、しかる後、帯状片69,70を側壁54cに沿って折り曲げると、図9に示すような樹脂ケース53が製造され、従来の非可逆回路素子の製造が完了する。(例えば、特許文献1参照)   Next, as shown in FIG. 13, after forming the resin case 53 by molding, the connecting portion 58 and the strips 69 and 70 are cut at the position of the cutting line S1, and then the strips 69 and 70 are connected to the side walls. When bent along the line 54c, the resin case 53 as shown in FIG. 9 is manufactured, and the manufacture of the conventional non-reciprocal circuit device is completed. (For example, see Patent Document 1)

しかし、従来の非可逆回路素子は、アース端子55と入出力端子56が略U字状をなし、接続部55a、56aが樹脂ケース53の底壁53b上に位置し、且つ、第2のヨーク54の底板54aから上方に離れた位置となっているため、樹脂ケース53の底壁53bの厚みが大きくなって、薄型化が図れない。
また、アース端子55は、第2のヨーク54から切り離されているため、第2のヨーク54の接地性が悪くなるばかりか、アース端子55の加工性が悪くなる。
However, in the conventional non-reciprocal circuit element, the ground terminal 55 and the input / output terminal 56 are substantially U-shaped, the connection portions 55a and 56a are located on the bottom wall 53b of the resin case 53, and the second yoke 54, the bottom wall 53b of the resin case 53 is increased in thickness and cannot be reduced in thickness.
Further, since the ground terminal 55 is separated from the second yoke 54, not only the grounding property of the second yoke 54 is deteriorated but also the workability of the ground terminal 55 is deteriorated.

また、従来の非可逆回路素子の製造方法にあっては、アース端子55が第2のヨーク54から切り離されて製造されるため、アース端子55の加工性が悪くなるばかりか、アース端子55と入出力端子56の接続部55a、56aが樹脂ケース53の底壁53b上に位置し、且つ、第2のヨーク54の底板54aから上方に離れた位置となっているため、樹脂ケース53の底壁53bの厚みが大きくなって、薄型化が図れない。   Further, in the conventional method of manufacturing a non-reciprocal circuit element, since the ground terminal 55 is manufactured separately from the second yoke 54, not only the workability of the ground terminal 55 is deteriorated, but also the ground terminal 55 Since the connecting portions 55a and 56a of the input / output terminal 56 are located on the bottom wall 53b of the resin case 53 and are located away from the bottom plate 54a of the second yoke 54, the bottom of the resin case 53 Since the thickness of the wall 53b is increased, the thickness cannot be reduced.

特開2001−24406号公報JP 2001-24406 A

従来の非可逆回路素子は、アース端子55と入出力端子56が略U字状をなし、接続部55a、56aが樹脂ケース53の底壁53b上に位置し、且つ、第2のヨーク54の底板54aから上方に離れた位置となっているため、樹脂ケース53の底壁53bの厚みが大きくなって、薄型化が図れないという問題がある。
また、アース端子55は、第2のヨーク54から切り離されているため、第2のヨーク54の接地性が悪くなるばかりか、アース端子55の加工性が悪くなるという問題がある。
In the conventional non-reciprocal circuit element, the ground terminal 55 and the input / output terminal 56 are substantially U-shaped, the connecting portions 55 a and 56 a are located on the bottom wall 53 b of the resin case 53, and the second yoke 54 Since the position is away from the bottom plate 54a, there is a problem that the thickness of the bottom wall 53b of the resin case 53 is increased and the thickness cannot be reduced.
Further, since the ground terminal 55 is separated from the second yoke 54, there is a problem that not only the grounding property of the second yoke 54 is deteriorated but also the workability of the ground terminal 55 is deteriorated.

また、従来の非可逆回路素子の製造方法にあっては、アース端子55が第2のヨーク54から切り離されて製造されるため、アース端子55の加工性が悪くなるばかりか、アース端子55と入出力端子56の接続部55a、56aが樹脂ケース53の底壁53b上に位置し、且つ、第2のヨーク54の底板54aから上方に離れた位置となっているため、樹脂ケース53の底壁53bの厚みが大きくなって、薄型化が図れないという問題がある。   Further, in the conventional method of manufacturing a non-reciprocal circuit element, since the ground terminal 55 is manufactured separately from the second yoke 54, not only the workability of the ground terminal 55 is deteriorated, but also the ground terminal 55 Since the connecting portions 55a and 56a of the input / output terminal 56 are located on the bottom wall 53b of the resin case 53 and are located away from the bottom plate 54a of the second yoke 54, the bottom of the resin case 53 There is a problem that the thickness of the wall 53b becomes large and the thickness cannot be reduced.

そこで、本発明は薄型化が図れ、加工性の良好な非可逆回路素子、及びその製造方法を提供することを目的とする。   Accordingly, an object of the present invention is to provide a non-reciprocal circuit device that can be thinned and has good processability, and a method for manufacturing the same.

上記課題を解決するための第1の解決手段として、上板を有する第1のヨークと、平板状の底板を有し、前記第1のヨークとで磁気閉回路を構成する第2のヨークと、前記上板側に配置された磁石と、前記底板側に配置された平板状のフェライト部材と、前記磁石と前記フェライト部材との間に配置され、誘電体を介して上下方向に一部が交叉するように配設された第1,第2,第3の中心導体と、絶縁樹脂体によって前記第2のヨークと一体的に形成された入出力端子、及びアース端子とを備え、前記第2のヨークと前記絶縁樹脂体によって、前記フェライト部材を収納するための箱形部材が形成され、前記絶縁樹脂体に埋設された前記アース端子は、前記底板に繋がれた連結部と、前記絶縁樹脂体の側壁の外面に沿って延びる折曲舌片を有し、前記絶縁樹脂体に埋設されたL字状の前記入出力端子は、前記底板と面一状態にある底片と、前記絶縁樹脂体の前記側壁の外面に沿って延びる折曲側片を有した構成とした。   As a first means for solving the above problems, a first yoke having an upper plate, a second yoke having a flat bottom plate and constituting a magnetic closed circuit with the first yoke, , A magnet disposed on the upper plate side, a flat ferrite member disposed on the bottom plate side, and disposed between the magnet and the ferrite member, and partly in the vertical direction via a dielectric. First, second, and third center conductors arranged to cross, an input / output terminal integrally formed with the second yoke by an insulating resin body, and a ground terminal; A box-shaped member for housing the ferrite member is formed by the yoke 2 and the insulating resin body, and the ground terminal embedded in the insulating resin body includes a connecting portion connected to the bottom plate, and the insulating member. A bent tongue extending along the outer surface of the side wall of the resin body The L-shaped input / output terminal embedded in the insulating resin body has a bottom piece that is flush with the bottom plate and a bent side piece that extends along the outer surface of the side wall of the insulating resin body. The configuration was as follows.

また、第2の解決手段として、前記箱形部材の底壁は、前記第2のヨークの前記底板、前記入出力端子の前記底片、及び前記絶縁樹脂体の底部で構成され、前記箱形部材の底壁の厚さは、前記第2のヨークの前記底板の厚みとした構成とした。
また、第3の解決手段として、前記入出力端子の前記底片の側面には、傾斜部が設けられ、この傾斜部に前記絶縁樹脂体の前記底部が充填された構成とした。
As a second solution, the bottom wall of the box-shaped member is composed of the bottom plate of the second yoke, the bottom piece of the input / output terminal, and the bottom of the insulating resin body, and the box-shaped member The thickness of the bottom wall was set to the thickness of the bottom plate of the second yoke.
As a third solving means, an inclined portion is provided on a side surface of the bottom piece of the input / output terminal, and the inclined portion is filled with the bottom portion of the insulating resin body.

また、第4の解決手段として、前記入出力端子の先端部には、前記折曲側片よりも幅の広い広幅部を設けた構成とした。
また、第5の解決手段として、前記第1,第2,第3の中心導体は、一端側に位置するポート部と、他端側に位置するアース部を有し、少なくとも前記第1,第2の中心導体の前記ポート部のそれぞれが、前記入出力端子の前記折曲側片に接続された構成とした。
Further, as a fourth solution, a configuration is provided in which a wide portion wider than the bent side piece is provided at the tip of the input / output terminal.
As a fifth solution, the first, second, and third central conductors include a port portion located on one end side and a ground portion located on the other end side, and at least the first and first center conductors. Each of the port portions of the second central conductor is connected to the bent side piece of the input / output terminal.

また、第6の解決手段として、請求項1記載の非可逆回路素子を備え、前記箱形部材は、フープ材が打ち抜き、折り曲げ加工されて、前記底板と前記側板を有する前記第2のヨークと、前記底板に繋がった前記アース端子と、前記第2のヨークから離された状態で前記入出力端子が形成された後、成形加工によって前記絶縁樹脂体が形成されて、前記第2のヨークと前記入出力端子が前記絶縁樹脂体によって一体化された製造方法とした。   Further, as a sixth solving means, the nonreciprocal circuit element according to claim 1 is provided, and the box-shaped member is formed by punching and bending a hoop material, and the second yoke having the bottom plate and the side plate. The ground terminal connected to the bottom plate, and the input / output terminal in a state of being separated from the second yoke, the insulating resin body is formed by molding, and the second yoke and The input / output terminal is integrated with the insulating resin body.

また、第7の解決手段として、前記箱形部材の底壁は、前記第2のヨークの前記底板、前記入出力端子の前記底片、及び前記絶縁樹脂体の底部で構成され、前記箱形部材の底壁の厚さは、前記第2のヨークの前記底板の厚みとした製造方法とした。
また、第8の解決手段として、前記入出力端子の前記底片の側面には、潰し加工によって傾斜部が設けられ、この傾斜部に前記絶縁樹脂体の前記底部が充填された製造方法とした。
As a seventh solution, the bottom wall of the box-shaped member is composed of the bottom plate of the second yoke, the bottom piece of the input / output terminal, and the bottom of the insulating resin body, and the box-shaped member The thickness of the bottom wall of the manufacturing method was the same as the thickness of the bottom plate of the second yoke.
As an eighth solving means, a side surface of the bottom piece of the input / output terminal is provided with an inclined portion by crushing, and the inclined portion is filled with the bottom portion of the insulating resin body.

本発明の非可逆回路素子は、上板を有する第1のヨークと、平板状の底板を有し、第1のヨークとで磁気閉回路を構成する第2のヨークと、上板側に配置された磁石と、底板側に配置された平板状のフェライト部材と、磁石とフェライト部材との間に配置され、誘電体を介して上下方向に一部が交叉するように配設された第1,第2,第3の中心導体と、絶縁樹脂体によって第2のヨークと一体的に形成された入出力端子、及びアース端子とを備え、第2のヨークと絶縁樹脂体によって、フェライト部材を収納するための箱形部材が形成され、絶縁樹脂体に埋設されたアース端子は、底板に繋がれた連結部と、絶縁樹脂体の側壁の外面に沿って延びる折曲舌片を有し、絶縁樹脂体に埋設されたL字状の入出力端子は、底板と面一状態にある底片と、絶縁樹脂体の側壁の外面に沿って延びる折曲側片を有した構成とした。
即ち、絶縁樹脂体に埋設されたL字状の入出力端子の底片は、第2のヨークの底板と面一状態にしたため、箱形部材の底壁の厚みを薄くできて、薄型のものが得られる。
また、アース端子は、第2のヨークの底板に繋がっているため、第2のヨークの接地が確実になるばかりか、アース端子の加工性を良好にすることができる。
The non-reciprocal circuit device of the present invention includes a first yoke having an upper plate, a second bottom plate having a flat bottom plate, and forming a magnetic closed circuit with the first yoke, and disposed on the upper plate side. The first magnet is disposed between the magnet, the flat ferrite member disposed on the bottom plate side, the magnet and the ferrite member, and partly intersects in the vertical direction via the dielectric. , Second and third center conductors, an input / output terminal integrally formed with the second yoke by an insulating resin body, and a ground terminal, and the ferrite member is formed by the second yoke and the insulating resin body. A box-shaped member for storage is formed, and the ground terminal embedded in the insulating resin body has a connecting portion connected to the bottom plate, and a bent tongue extending along the outer surface of the side wall of the insulating resin body, The L-shaped input / output terminal embedded in the insulating resin body is the bottom that is flush with the bottom plate. If, it has a structure having a bent side pieces extending along the outer surface of the side wall of the insulating resin material.
That is, since the bottom piece of the L-shaped input / output terminal embedded in the insulating resin body is flush with the bottom plate of the second yoke, the thickness of the bottom wall of the box-shaped member can be reduced. can get.
Further, since the ground terminal is connected to the bottom plate of the second yoke, not only the grounding of the second yoke is ensured but also the workability of the ground terminal can be improved.

また、箱形部材の底壁は、第2のヨークの底板、入出力端子の底片、及び絶縁樹脂体の底部で構成され、箱形部材の底壁の厚さは、第2のヨークの底板の厚みとしたため、箱形部材の底壁の厚みを著しく薄くでき、薄型のものが得られる。   The bottom wall of the box-shaped member is composed of the bottom plate of the second yoke, the bottom piece of the input / output terminal, and the bottom of the insulating resin body. The thickness of the bottom wall of the box-shaped member is the bottom plate of the second yoke. Therefore, the thickness of the bottom wall of the box-shaped member can be remarkably reduced, and a thin one can be obtained.

また、入出力端子の底片の側面には、傾斜部が設けられ、この傾斜部に絶縁樹脂体の底部が充填されたため、入出力端子の埋設が確実となって、入出力端子の取付の強硬なものが得られる。   In addition, the side of the bottom piece of the input / output terminal is provided with an inclined portion, and the inclined portion is filled with the bottom of the insulating resin body, so that the input / output terminal is securely embedded and the input / output terminal is firmly attached. Can be obtained.

また、入出力端子の先端部には、折曲側片よりも幅の広い広幅部を設けたため、入出力端子の取付のより強硬なものが得られる。   In addition, since the wide end portion wider than the bent side piece is provided at the front end portion of the input / output terminal, a harder one with the input / output terminal attached can be obtained.

また、第1,第2,第3の中心導体は、一端側に位置するポート部と、他端側に位置するアース部を有し、少なくとも第1,第2の中心導体のポート部のそれぞれが、入出力端子の折曲側片に接続されたため、ポート部の外部機器への接続の容易なものが得られる。   The first, second, and third center conductors each have a port portion located on one end side and a ground portion located on the other end side, and each of the port portions of at least the first and second center conductors. However, since it is connected to the bent side piece of the input / output terminal, it is easy to connect the port portion to an external device.

また、請求項1記載の非可逆回路素子を備え、箱形部材は、フープ材が打ち抜き、折り曲げ加工されて、底板と側板を有する第2のヨークと、底板に繋がったアース端子と、第2のヨークから離された状態で入出力端子が形成された後、成形加工によって絶縁樹脂体が形成されて、第2のヨークと入出力端子が絶縁樹脂体によって一体化されたため、アース端子は、第2のヨークの底板に繋がっているため、第2のヨークの接地が確実になるばかりか、アース端子の加工性を良好にすることができる。   The non-reciprocal circuit device according to claim 1, wherein the box-shaped member is formed by punching and bending a hoop material, a second yoke having a bottom plate and a side plate, a ground terminal connected to the bottom plate, and a second member After the input / output terminal is formed in a state separated from the yoke, the insulating resin body is formed by molding, and the second yoke and the input / output terminal are integrated by the insulating resin body. Since it is connected to the bottom plate of the second yoke, not only the grounding of the second yoke is ensured but also the workability of the ground terminal can be improved.

また、箱形部材の底壁は、第2のヨークの底板、入出力端子の底片、及び絶縁樹脂体の底部で構成され、箱形部材の底壁の厚さは、第2のヨークの底板の厚みとしたため、箱形部材の底壁の厚みを著しく薄くでき、薄型のものが得られる。   The bottom wall of the box-shaped member is composed of the bottom plate of the second yoke, the bottom piece of the input / output terminal, and the bottom of the insulating resin body. The thickness of the bottom wall of the box-shaped member is the bottom plate of the second yoke. Therefore, the thickness of the bottom wall of the box-shaped member can be remarkably reduced, and a thin one can be obtained.

また、入出力端子の底片の側面には、潰し加工によって傾斜部が設けられ、この傾斜部に絶縁樹脂体の底部が充填されたため、入出力端子の埋設が確実となって、入出力端子の取付の強硬なものが得られる。   In addition, the side surface of the bottom piece of the input / output terminal is provided with an inclined portion by crushing processing, and since this inclined portion is filled with the bottom portion of the insulating resin body, the input / output terminal is reliably embedded, A strong installation can be obtained.

本発明の非可逆回路素子、及びその製造方法の図面を説明すると、図1は本発明の非可逆回路素子の要部断面図、図2は本発明の非可逆回路素子に係るアース端子の要部の拡大断面図、図3は本発明の非可逆回路素子に係る入出力端子の要部の拡大断面図、図4は本発明の非可逆回路素子に係るブロック体の平面図、図5は本発明の非可逆回路素子に係る磁石とブロック体の分解斜視図、図6は本発明の非可逆回路素子の製造方法に係る第1工程を示す説明図、図7は本発明の非可逆回路素子の製造方法に係る第2工程を示す説明図である。   The drawings of the non-reciprocal circuit device of the present invention and the manufacturing method thereof will be described. FIG. 1 is a cross-sectional view of the main part of the non-reciprocal circuit device of the present invention, and FIG. 3 is an enlarged cross-sectional view of a main part of an input / output terminal according to the non-reciprocal circuit element of the present invention, FIG. 4 is a plan view of a block body according to the non-reciprocal circuit element of the present invention, and FIG. 6 is an exploded perspective view of a magnet and a block body according to the non-reciprocal circuit device of the present invention, FIG. 6 is an explanatory view showing a first step according to the method for manufacturing the non-reciprocal circuit device of the present invention, and FIG. It is explanatory drawing which shows the 2nd process which concerns on the manufacturing method of an element.

次に、本発明の非可逆回路素子の構成を図1〜図7に基づいて説明すると、磁性板(鉄板等)からなる第1のヨーク1は、箱形、或いはU字状をなし、四角形状の上板1aと、この上板1aの辺から下方に折り曲げられた側板1bを有する。   Next, the configuration of the non-reciprocal circuit device of the present invention will be described with reference to FIGS. 1 to 7. The first yoke 1 made of a magnetic plate (iron plate or the like) has a box shape or a U shape, and is a square. An upper plate 1a having a shape and a side plate 1b bent downward from a side of the upper plate 1a are provided.

成形加工によってによって形成された箱形部材2は、磁性板(鉄板等)からなるU字状の第2のヨーク3と、この第2のヨーク3から離されて絶縁状態で形成された入出力端子4と、この入出力端子4と第2のヨーク3とを結合する絶縁樹脂体5とで構成されている。   The box-shaped member 2 formed by the molding process includes a U-shaped second yoke 3 made of a magnetic plate (iron plate or the like), and an input / output formed in an insulated state separated from the second yoke 3. The terminal 4 and the insulating resin body 5 that couples the input / output terminal 4 and the second yoke 3 are configured.

第2のヨーク3は、平板状の底板3aと、この底板3aから上方に折り曲げられた側板3bと、底板3aに連結部3cによって連結され、上方に折り曲げられた折曲舌片3dを備えたアース端子3eを有し、また、入出力端子4は、底板3aと面一状態の底片4aと、この底片4aから上に折り曲げられた折曲側片4bと、底片4aの先端部に設けられ、折曲側片4bよりも幅の広い広幅部4cと、底片4aの側面に潰し加工によって設けられ、下面側が狭幅となるような傾斜部4dを有し、第2のヨーク3と入出力端子4は、絶縁樹脂体5によって一体化されている。   The second yoke 3 includes a flat bottom plate 3a, a side plate 3b bent upward from the bottom plate 3a, and a bent tongue piece 3d connected to the bottom plate 3a by a connecting portion 3c and bent upward. The input / output terminal 4 includes a ground piece 3e, a bottom piece 4a flush with the bottom plate 3a, a bent side piece 4b bent upward from the bottom piece 4a, and a tip of the bottom piece 4a. And a wide portion 4c wider than the bent side piece 4b, and an inclined portion 4d provided on the side surface of the bottom piece 4a by crushing and having a lower width on the lower surface side. The terminal 4 is integrated by an insulating resin body 5.

また、絶縁樹脂体5は、底板3a、及び底片4aと面一状態にある底部5aと、この底部5aから上方に延びる側壁5bを有し、折曲舌片3dと折曲側片4bは、側壁5bの外側面に沿って上方に延びると共に、入出力端子4の傾斜部4dには、絶縁樹脂体5の底部5aが充填されて、下方への抜け止めが行われる。   The insulating resin body 5 has a bottom plate 3a and a bottom portion 5a that is flush with the bottom piece 4a, and a side wall 5b extending upward from the bottom portion 5a. The bent tongue piece 3d and the bent side piece 4b are While extending upward along the outer surface of the side wall 5b, the inclined portion 4d of the input / output terminal 4 is filled with the bottom portion 5a of the insulating resin body 5 to prevent downward slipping.

そして、箱形部材2の底壁は、底板3a、底片4a、及び底部5aで構成され、箱形部材2の底壁の厚みは、第2のヨーク3の底板3aの板厚の同等になっていると共に、箱形部材2の第2のヨーク3は、第1のヨーク1と結合されて、その結果、第1,第2のヨーク1,3とで磁気閉回路が形成されている。   The bottom wall of the box-shaped member 2 includes a bottom plate 3a, a bottom piece 4a, and a bottom portion 5a. The thickness of the bottom wall of the box-shaped member 2 is equal to the thickness of the bottom plate 3a of the second yoke 3. At the same time, the second yoke 3 of the box-shaped member 2 is coupled to the first yoke 1, and as a result, a magnetic closed circuit is formed by the first and second yokes 1, 3.

金属材からなるアース板6は、平板部6aと、この平板部から上方に折り曲げられた複数の折曲片6bを有し、このアース板6は、箱形部材2内に位置した状態で、平板部6aが底板3a上に載置されている。
YIG(Yttrium iron garnet)等からなる板状のフェライト部材7は、箱形部材2内に位置した状態で、アース板6の平板部6a上に載置されている。
The ground plate 6 made of a metal material has a flat plate portion 6a and a plurality of bent pieces 6b bent upward from the flat plate portion, and the ground plate 6 is located in the box-shaped member 2, The flat plate portion 6a is placed on the bottom plate 3a.
A plate-like ferrite member 7 made of YIG (Yttrium iron garnet) or the like is placed on the flat plate portion 6 a of the ground plate 6 in a state of being located in the box-shaped member 2.

平板状で基板状をなしたブロック体8は、誘電体9と、この誘電体94を介して、上下方向に一部が交叉した状態で第1,第2,第3の中心導体10,11,12とで構成され、そして、誘電体9と第1,第2,第3の中心導体10,11,12は、一つの部品となるように一体化されてブロック体9となっている。   The block body 8 that is flat and has a substrate shape has a dielectric 9 and first, second, and third central conductors 10 and 11 with the dielectric 94 partially crossed in the vertical direction. 12 and the dielectric 9 and the first, second and third central conductors 10, 11 and 12 are integrated into one block to form a block body 9.

例えば、このブロック体8は、誘電体9の下面、誘電体9の積層内、及び誘電体9の上面に第1,第2,第3の中心導体10,11,12が蒸着法やスパッタ等の薄膜技術、或いは印刷や塗布等の厚膜技術によって形成されたり、或いは、低温焼成セラミック(LTCC)や樹脂等からなる絶縁基板(図示せず)の上面に、誘電体9と第1,第2,第3の中心導体10,11,12とが蒸着法やスパッタ等の薄膜技術、或いは印刷や塗布等の厚膜技術によって形成されて構成されている。   For example, the block body 8 includes the first, second, and third central conductors 10, 11, 12 on the lower surface of the dielectric material 9, in the stack of the dielectric materials 9, and on the upper surface of the dielectric material 9. The dielectric 9 and the first and first layers are formed on the upper surface of an insulating substrate (not shown) made of a thin film technology or thick film technology such as printing or coating, or made of low temperature fired ceramic (LTCC) or resin. The second and third central conductors 10, 11, and 12 are formed by a thin film technique such as vapor deposition or sputtering, or a thick film technique such as printing or coating.

そして、第1,第2,第3の中心導体10,11,12は、一端側に位置するポート部10a、11a、12aと、他端側に位置するアース部10b、11b、12bと、ポート部10a、11a、12aのそれぞれに接続され、誘電体9の側面から下面に設けられた引出部13を有する。   The first, second, and third center conductors 10, 11, and 12 include port portions 10a, 11a, and 12a located on one end side, ground portions 10b, 11b, and 12b located on the other end side, and a port. Each of the parts 10 a, 11 a, and 12 a is connected to each other and has a lead-out part 13 provided on the lower surface from the side surface of the dielectric 9.

また、第3の中心導体12は、誘電体9(ブロック体8)の上面に露出すると共に、誘電体9は、第1,第2,第3の中心導体10,11,12のアース部10b、11b、12b側に貫通孔(スルーホール)9aが設けられており、このような構成を有するブロック体8は、フェライト部材7上に載置された状態で、ここでは図示しないが、アース部10b、11b、12b側がアース板6に接続されて、接地されている。   The third central conductor 12 is exposed on the upper surface of the dielectric 9 (block body 8), and the dielectric 9 is connected to the ground portion 10b of the first, second, and third central conductors 10, 11, and 12. 11b and 12b are provided with through holes (through holes) 9a, and the block body 8 having such a configuration is placed on the ferrite member 7 and is not shown here. The 10b, 11b, and 12b sides are connected to the ground plate 6 and are grounded.

複数のチップ型のコンデンサCは、誘電基板14と、この誘電基板14の上下面に設けられた第1,第2の電極15a、15bを有し、このコンデンサCは、アース板6の折曲片6bとフェライト部材7との間に配置され、第1の電極15aが引出部13に接続されると共に、第2の電極15bが折曲片6bに接続されて接地されている。   The plurality of chip type capacitors C includes a dielectric substrate 14 and first and second electrodes 15 a and 15 b provided on the upper and lower surfaces of the dielectric substrate 14. It arrange | positions between the piece 6b and the ferrite member 7, the 1st electrode 15a is connected to the extraction | drawer part 13, and the 2nd electrode 15b is connected to the bending piece 6b, and is earth | grounded.

なお、ここでは図示しないが、第3の中心導体12のポート部12a側には、サーキュレータではコンデンサCが、また、アイソレータではコンデンサCと抵抗器(図示せず)が接続され、コンデンサCや抵抗器の一方の電極が接地されるようになっており、そして、少なくとも第1,第2の中心導体10,11のポート部10a、11aが入出力端子4の折曲側片4bに半田19付によって接続されている。   Although not shown here, on the port portion 12a side of the third central conductor 12, a capacitor C is connected to the circulator, and a capacitor C and a resistor (not shown) are connected to the isolator. One electrode of the device is grounded, and at least the port portions 10a and 11a of the first and second center conductors 10 and 11 are attached to the bent side piece 4b of the input / output terminal 4 with solder 19 Connected by.

ブロック体8(誘電体9)の上面には、絶縁樹脂からなる半田レジスト等のレジスト層16が第3の中心導体12を避けた状態で形成されている。
このレジスト層16は、第3の中心導体12より厚さが厚く、且つ、第3の中心導体12を間にして、互いに対向して形成された第1,第2のレジスト体16a、16bと、この第1,第2のレジスト体16a、16bのそれぞれに設けられた凹状部からなる溜部16c、16dを有する。
On the upper surface of the block 8 (dielectric 9), a resist layer 16 such as a solder resist made of an insulating resin is formed in a state where the third central conductor 12 is avoided.
The resist layer 16 is thicker than the third central conductor 12, and the first and second resist bodies 16a and 16b formed opposite to each other with the third central conductor 12 therebetween. The first and second resist bodies 16a and 16b have reservoirs 16c and 16d made of concave portions.

磁石17は、下面がレジスト層16(第1,第2のレジスト体16a、16b)の上面に載置された状態で、接着剤18によって、ブロック体8,及び第3の中心導体12に接着されている。   The magnet 17 is bonded to the block body 8 and the third central conductor 12 by an adhesive 18 with the lower surface placed on the upper surface of the resist layer 16 (first and second resist bodies 16a and 16b). Has been.

そして、磁石17の取付方法は、図5に示すように、第3の中心導体12上を含む溜部16c、16dの中央部に接着剤18が塗布され、この状態で、ブロック体8と磁石17が治具によって位置決めされた状態で、治具によって磁石17がブロック体8上に押し付けられて、磁石17が接着されるようになっている。
この時、接着剤18は、磁石17によって押し広げられるが、凹状部の溜部16c、16dの周縁部が接着剤18の流出防止の機能をなして、磁石17の下面外への接着剤18の流出が防止されている。
As shown in FIG. 5, the magnet 17 is attached by applying an adhesive 18 to the central portions of the reservoirs 16c and 16d including the third central conductor 12, and in this state, the block body 8 and the magnet In a state where 17 is positioned by the jig, the magnet 17 is pressed onto the block body 8 by the jig, and the magnet 17 is bonded.
At this time, the adhesive 18 is pushed and spread by the magnet 17, but the peripheral portions of the recessed portions 16 c and 16 d serve to prevent the adhesive 18 from flowing out, and the adhesive 18 to the outside of the lower surface of the magnet 17 is used. Is prevented from leaking.

そして、本発明の非可逆回路素子は、底板3a上に位置するアース板6,このアース板6上に位置するフェライト部材7,このフェライト部材7上に位置するブロック体8,及びこのブロック体8上に位置する磁石17が第1のヨーク1の上板1aと第2のヨーク3の底板3aとの間で挟持されて構成されて、本発明の非可逆回路素子であるアイソレータやサーキュレータが形成されている。   The nonreciprocal circuit device of the present invention includes a ground plate 6 positioned on the bottom plate 3a, a ferrite member 7 positioned on the ground plate 6, a block body 8 positioned on the ferrite member 7, and the block body 8 The upper magnet 17 is sandwiched between the upper plate 1a of the first yoke 1 and the bottom plate 3a of the second yoke 3 to form an isolator or circulator which is a nonreciprocal circuit device of the present invention. Has been.

このような構成を有する本発明の非可逆回路素子は、電子機器の回路基板(図示せず)上に箱形部材2の底壁が載置され、アース端子3eと入出力端子4が回路基板に設けられた配線パターン(図示せず)に半田付けされて、面実装されるようになっている。   In the nonreciprocal circuit device of the present invention having such a configuration, the bottom wall of the box-shaped member 2 is placed on a circuit board (not shown) of an electronic device, and the ground terminal 3e and the input / output terminal 4 are circuit boards. It is soldered to a wiring pattern (not shown) provided on the surface and surface-mounted.

次に、本発明の非可逆回路素子の製造方法を図6,図7に基づいて説明すると、先ず、図6に示すように、フープ材20を打ち抜き加工して、中央部に位置する第2のヨーク3,複数のアース端子3e、第2のヨーク3の両側に位置し、入出力端子4となる帯状片21、及びフープ材20と第2のヨーク3とを繋ぐ連結部22を形成する。   Next, the manufacturing method of the non-reciprocal circuit device according to the present invention will be described with reference to FIGS. 6 and 7. First, as shown in FIG. 6, the hoop material 20 is punched and the second located at the center portion. The yoke 3, the plurality of ground terminals 3 e, the band-like pieces 21 that are located on both sides of the second yoke 3 and serve as the input / output terminals 4, and the connecting portion 22 that connects the hoop material 20 and the second yoke 3 are formed. .

次に、図7に示すように、切断と折り曲げ加工によって、底板3aから折り曲げられた側板3bとアース端子3eを形成すると共に、帯状片21が略U字状に折り曲げられて、帯状片21の先端部が底板3aの近傍に位置するように形成する。   Next, as shown in FIG. 7, the side plate 3 b and the ground terminal 3 e that are bent from the bottom plate 3 a are formed by cutting and bending, and the band-shaped piece 21 is bent into a substantially U-shape. It forms so that a front-end | tip part may be located in the vicinity of the baseplate 3a.

次に、ここでは図示しないが、成形加工によって絶縁樹脂体5が形成されて箱形部材2を形成した後、箱形部材2の外側に沿って、入出力端子4と連結部21を切断して、フープ材20から箱形部材2を切り離すと本発明の非可逆回路素子の製造が完了する。   Next, although not shown here, after the insulating resin body 5 is formed by molding to form the box-shaped member 2, the input / output terminals 4 and the connecting portions 21 are cut along the outside of the box-shaped member 2. Then, when the box-shaped member 2 is separated from the hoop material 20, the production of the nonreciprocal circuit device of the present invention is completed.

本発明の非可逆回路素子の要部断面図。The principal part sectional drawing of the nonreciprocal circuit device of this invention. 本発明の非可逆回路素子に係るアース端子の要部の拡大断面図。The expanded sectional view of the principal part of the ground terminal which concerns on the nonreciprocal circuit device of this invention. 本発明の非可逆回路素子に係る入出力端子の要部の拡大断面図。The expanded sectional view of the principal part of the input-output terminal which concerns on the nonreciprocal circuit device of this invention. 本発明の非可逆回路素子に係るブロック体の平面図。The top view of the block body which concerns on the nonreciprocal circuit device of this invention. 本発明の非可逆回路素子に係る磁石とブロック体の分解斜視図。The disassembled perspective view of the magnet and block body which concern on the nonreciprocal circuit element of this invention. 本発明の非可逆回路素子の製造方法に係る第1工程を示す説明図。Explanatory drawing which shows the 1st process which concerns on the manufacturing method of the nonreciprocal circuit element of this invention. 本発明の非可逆回路素子の製造方法に係る第2工程を示す説明図。Explanatory drawing which shows the 2nd process which concerns on the manufacturing method of the nonreciprocal circuit element of this invention. 従来の非可逆回路素子に係る分解斜視図。The disassembled perspective view which concerns on the conventional nonreciprocal circuit element. 従来の非可逆回路素子に係る樹脂ケースの要部断面図。Sectional drawing of the principal part of the resin case which concerns on the conventional nonreciprocal circuit element. 従来の非可逆回路素子の製造方法の第1工程を示す説明図。Explanatory drawing which shows the 1st process of the manufacturing method of the conventional nonreciprocal circuit element. 従来の非可逆回路素子の製造方法の第2工程を示す説明図。Explanatory drawing which shows the 2nd process of the manufacturing method of the conventional nonreciprocal circuit element. 従来の非可逆回路素子の製造方法の第3工程を示す説明図。Explanatory drawing which shows the 3rd process of the manufacturing method of the conventional nonreciprocal circuit element. 従来の非可逆回路素子の製造方法の第4工程を示す説明図。Explanatory drawing which shows the 4th process of the manufacturing method of the conventional nonreciprocal circuit element.

符号の説明Explanation of symbols

1:第1のヨーク
1a:上板
1b:側板
2:箱形部材
3:第2のヨーク
3a:底板
3b:側板
3c:連結部
3d:折曲舌片
3e:アース端子
4:入出力端子
4a:底片
4b:折曲側片
4c:広幅部
4d:傾斜部
5:絶縁樹脂体
5a:底部
5b:側壁
6:アース板
6a:平板部
6b:折曲片
7:フェライト部材
8:ブロック体
9:誘電体
9a:貫通孔
10:第1の中心導体
10a:ポート部
10b:アース部
11:第2の中心導体
11a:ポート部
11b:アース部
12:第3の中心導体
12a:ポート部
12b:アース部
13:引出部
C:コンデンサ
14:誘電基板
15a:第1の電極
15b:第2の電極
16:レジスト層
16a:第1のレジスト体
16b:第2のレジスト体
16c、16d:溜部
17:磁石
18:接着剤
19:半田
20:フープ材
21:帯状片
22:連結部
1: 1st yoke 1a: Upper plate 1b: Side plate 2: Box-shaped member 3: 2nd yoke 3a: Bottom plate 3b: Side plate 3c: Connection part 3d: Bending tongue piece 3e: Grounding terminal 4: Input / output terminal 4a : Bottom piece 4b: Bending side piece 4c: Wide portion 4d: Inclined portion 5: Insulating resin body 5a: Bottom portion 5b: Side wall 6: Ground plate 6a: Flat plate portion 6b: Bending piece 7: Ferrite member 8: Block body 9: Dielectric 9a: Through hole 10: First central conductor 10a: Port portion 10b: Ground portion 11: Second central conductor 11a: Port portion 11b: Ground portion 12: Third central conductor 12a: Port portion 12b: Ground Part 13: Leading part C: Capacitor 14: Dielectric substrate 15a: First electrode 15b: Second electrode 16: Resist layer 16a: First resist body 16b: Second resist body 16c, 16d: Reservoir 17: magnet 18: Adhesive 19: Solder 20: Hoop material 21: Strip piece 22: Connection part

Claims (8)

上板を有する第1のヨークと、平板状の底板を有し、前記第1のヨークとで磁気閉回路を構成する第2のヨークと、前記上板側に配置された磁石と、前記底板側に配置された平板状のフェライト部材と、前記磁石と前記フェライト部材との間に配置され、誘電体を介して上下方向に一部が交叉するように配設された第1,第2,第3の中心導体と、絶縁樹脂体によって前記第2のヨークと一体的に形成された入出力端子、及びアース端子とを備え、前記第2のヨークと前記絶縁樹脂体によって、前記フェライト部材を収納するための箱形部材が形成され、前記絶縁樹脂体に埋設された前記アース端子は、前記底板に繋がれた連結部と、前記絶縁樹脂体の側壁の外面に沿って延びる折曲舌片を有し、前記絶縁樹脂体に埋設されたL字状の前記入出力端子は、前記底板と面一状態にある底片と、前記絶縁樹脂体の前記側壁の外面に沿って延びる折曲側片を有したことを特徴とする非可逆回路素子。 A first yoke having an upper plate, a second yoke having a flat bottom plate and constituting a magnetic closed circuit with the first yoke, a magnet disposed on the upper plate side, and the bottom plate A flat ferrite member disposed on the side, and the first, second, and second members disposed between the magnet and the ferrite member and partially intersecting in the vertical direction via a dielectric. A third central conductor, an input / output terminal integrally formed with the second yoke by an insulating resin body, and a ground terminal; and the ferrite member is formed by the second yoke and the insulating resin body. A box-shaped member for housing is formed, and the ground terminal embedded in the insulating resin body includes a connecting portion connected to the bottom plate, and a bent tongue piece extending along an outer surface of the side wall of the insulating resin body L-shaped insertion embedded in the insulating resin body Power terminal, non-reciprocal circuit element characterized by having a bottom piece which is in the bottom plate and flush with the bent side pieces extending along the outer surface of the side wall of the insulating resin material. 前記箱形部材の底壁は、前記第2のヨークの前記底板、前記入出力端子の前記底片、及び前記絶縁樹脂体の底部で構成され、前記箱形部材の底壁の厚さは、前記第2のヨークの前記底板の厚みとしたことを特徴とする請求項1記載の非可逆回路素子。 The bottom wall of the box-shaped member is composed of the bottom plate of the second yoke, the bottom piece of the input / output terminal, and the bottom of the insulating resin body, and the thickness of the bottom wall of the box-shaped member is The nonreciprocal circuit device according to claim 1, wherein the thickness of the bottom plate of the second yoke is set. 前記入出力端子の前記底片の側面には、傾斜部が設けられ、この傾斜部に前記絶縁樹脂体の前記底部が充填されたことを特徴とする請求項2記載の非可逆回路素子。 3. The nonreciprocal circuit device according to claim 2, wherein an inclined portion is provided on a side surface of the bottom piece of the input / output terminal, and the inclined portion is filled with the bottom portion of the insulating resin body. 前記入出力端子の先端部には、前記折曲側片よりも幅の広い広幅部を設けたことを特徴とする請求項4記載の非可逆回路素子。 5. The nonreciprocal circuit device according to claim 4, wherein a wide portion wider than the bent side piece is provided at a tip portion of the input / output terminal. 前記第1,第2,第3の中心導体は、一端側に位置するポート部と、他端側に位置するアース部を有し、少なくとも前記第1,第2の中心導体の前記ポート部のそれぞれが、前記入出力端子の前記折曲側片に接続されたことを特徴とする請求項2から4の何れかに記載の非可逆回路素子。 The first, second and third center conductors have a port portion located on one end side and a ground portion located on the other end side, and at least the port portions of the first and second center conductors. 5. The nonreciprocal circuit device according to claim 2, wherein each of the nonreciprocal circuit devices is connected to the bent side piece of the input / output terminal. 請求項1記載の非可逆回路素子を備え、前記箱形部材は、フープ材が打ち抜き、折り曲げ加工されて、前記底板と前記側板を有する前記第2のヨークと、前記底板に繋がった前記アース端子と、前記第2のヨークから離された状態で前記入出力端子が形成された後、成形加工によって前記絶縁樹脂体が形成されて、前記第2のヨークと前記入出力端子が前記絶縁樹脂体によって一体化されたことを特徴とする非可逆回路素子の製造方法。 2. The nonreciprocal circuit element according to claim 1, wherein the box-shaped member is formed by punching and bending a hoop material, the second yoke having the bottom plate and the side plate, and the ground terminal connected to the bottom plate. And after the input / output terminal is formed in a state of being separated from the second yoke, the insulating resin body is formed by molding, and the second yoke and the input / output terminal are connected to the insulating resin body. A method for producing a non-reciprocal circuit device, wherein the non-reciprocal circuit device is integrated. 前記箱形部材の底壁は、前記第2のヨークの前記底板、前記入出力端子の前記底片、及び前記絶縁樹脂体の底部で構成され、前記箱形部材の底壁の厚さは、前記第2のヨークの前記底板の厚みとしたことを特徴とする請求項6記載の非可逆回路素子の製造方法。 The bottom wall of the box-shaped member is composed of the bottom plate of the second yoke, the bottom piece of the input / output terminal, and the bottom of the insulating resin body, and the thickness of the bottom wall of the box-shaped member is The method of manufacturing a nonreciprocal circuit device according to claim 6, wherein the thickness of the bottom plate of the second yoke is set. 前記入出力端子の前記底片の側面には、潰し加工によって傾斜部が設けられ、この傾斜部に前記絶縁樹脂体の前記底部が充填されたことを特徴とする請求項7記載の非可逆回路素子の製造方法。
8. The nonreciprocal circuit device according to claim 7, wherein a side surface of the bottom piece of the input / output terminal is provided with an inclined portion by crushing, and the inclined portion is filled with the bottom portion of the insulating resin body. Manufacturing method.
JP2004123071A 2004-04-19 2004-04-19 Non-reciprocal circuit element, and manufacturing method thereof Withdrawn JP2005311516A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006157092A (en) * 2004-11-25 2006-06-15 Hitachi Metals Ltd Nonreciprocal circuit element

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006157092A (en) * 2004-11-25 2006-06-15 Hitachi Metals Ltd Nonreciprocal circuit element
JP4605501B2 (en) * 2004-11-25 2011-01-05 日立金属株式会社 Non-reciprocal circuit element

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