JP2005309236A - Connector device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To increase reliability and stability by suppressing a temperature rise of a connector body. <P>SOLUTION: A casing 1 houses an optical multiplexer demultiplexer 8 and is provided with a fixed pin terminal 20 which projects outward from a bottom part 2 at a position corresponding to the optical multiplexer demultiplexer 8. Further, a recess 21 whose surface side is open is provided at the bottom part 2 of the casing 1 at a position opposite the optical multiplexer demultiplexer 8, and an intermediate part 20B of the fixed pin terminal 20 is exposed to the bottom surface side of the recess 21. A beveled part 23 is provided at the opening end side of the recess 21, and a heat radiation sheet 24 which has heat conductivity is put in the recess 21 and clamped and held between the recess 21 and optical multiplexer demultiplexer 8. Consequently, the heat radiation sheet 24 comes into contact with the optical multiplexer demultiplexer 8 and fixed pin terminal 20, so when the optical multiplexer demultiplexer 8 generates heat, the heat can be radiated to the outside through the heat radiation sheet 24 etc. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a connector device such as an optical module connected to an optical fiber, for example.

  In general, as a connector device, an optical connector connection type optical module in which an optical multiplexer / demultiplexer including a light emitting element and a light receiving element is accommodated in a casing is known (for example, see Patent Document 1). Such an optical module transmits an optical signal using a light emitting element while being connected to a counterpart optical connector, converts the optical signal received from the optical connector into an electrical signal, and outputs the electrical signal to the outside.

JP-A-7-104149

  By the way, in the above-described optical module according to the prior art, a light emitting element, a light receiving element, an amplifier, and the like are accommodated inside the optical multiplexer / demultiplexer. For this reason, when the optical module is driven, these circuits generate heat and the temperature in the optical multiplexer / demultiplexer rises, so that there is a problem that the wavelength of the laser diode (LD) constituting the light emitting element is shifted. In the prior art, the system on the receiving side is configured in consideration of such a wavelength shift, but in order to simplify and stabilize the entire system, the temperature shift of the light emitting element is suppressed to suppress the wavelength shift. It was necessary to suppress.

  The present invention has been made in view of the above-described problems of the prior art, and an object of the present invention is to provide a connector device that can suppress an increase in temperature of an optical multiplexer / demultiplexer and can improve reliability and stability. is there.

  In order to solve the above-described problem, the invention according to claim 1 of the present application provides a connector device including a casing and an optical multiplexer / demultiplexer that is attached to the casing and transmits / receives a signal to / from a counterpart. Is provided with a fixed pin terminal made of a heat conductive material protruding outward, and the casing has an opening having a smaller area than the optical multiplexer / demultiplexer at a position facing the optical multiplexer / demultiplexer. A concave portion where the terminal is exposed is provided, and a heat transfer member in contact with the optical multiplexer / demultiplexer and the fixed pin terminal is provided in the concave portion.

  In the invention of claim 2, the concave portion is provided with a chamfered portion for chamfering located around the opening end.

  According to a third aspect of the present invention, the heat transfer member is made of a material that has a thickness dimension larger than the depth dimension of the concave portion and is deformable when sandwiched between the optical multiplexer / demultiplexer and the concave portion. It is set as the structure formed using.

  According to a fourth aspect of the present invention, the heat transfer member has a protrusion that is located on the peripheral side and protrudes in the thickness direction.

  According to the first aspect of the present invention, the casing is provided with a concave portion in which the fixed pin terminal is exposed at a position facing the optical multiplexer / demultiplexer, and the concave portion is in contact with the optical multiplexer / demultiplexer and the fixed pin terminal. Since the heat member is provided, the heat generated from the optical multiplexer / demultiplexer can be radiated to the outside through the heat transfer member and the fixed pin terminal. For this reason, the temperature increase of the optical multiplexer / demultiplexer can be suppressed, the optical multiplexer / demultiplexer can be operated stably, and the reliability and stability can be improved. Further, since the recess has an opening having an area smaller than that of the optical multiplexer / demultiplexer, the optical multiplexer / demultiplexer can be brought into contact with a portion of the casing located around the opening of the recess. For this reason, for example, even when the heat transfer member is formed using a deformable material, the thickness dimension of the heat transfer member can be set by the depth dimension of the recess, and the optical multiplexer / demultiplexer, the fixed pin terminal, The distance can be kept constant. As a result, the heat transfer characteristics of the heat transfer member and the like can be made substantially constant, and temperature variations of the optical multiplexer / demultiplexer can be suppressed and stabilized.

  According to the second aspect of the present invention, the recess is provided with a chamfered portion for chamfering located around the opening end. Here, for example, when the heat transfer member is sandwiched between the optical multiplexer / demultiplexer and the recess, the heat transfer member is deformed and overflows from the recess, and the thickness dimension of the heat transfer member is partially increased. May be. At this time, even if a part of the heat transfer member moves to the opening end side of the recess, the heat transfer member moved to the opening end side can be accommodated by the chamfered portion. For this reason, since the heat transfer member can be prevented from overflowing from the recess, the thickness dimension of the heat transfer member can be made constant over the entire surface, and temperature variation of the optical multiplexer / demultiplexer can be suppressed. it can. Moreover, since the area (opening area) on the opening end side of the recess is increased by the chamfered portion, the contact area between the heat transfer member and the optical multiplexer / demultiplexer can be increased as compared with the case where the chamfered portion is not provided. Thereby, since the heat radiation using the heat transfer member can be promoted, the effect of suppressing the temperature rise of the optical multiplexer / demultiplexer can be enhanced.

  According to the invention of claim 3, since the heat transfer material is formed using a deformable material and the thickness dimension of the heat transfer member is set larger than the depth dimension of the recess, the optical multiplexer / demultiplexer and the recess When the heat transfer member is sandwiched between the heat transfer member, the heat transfer member can be reliably brought into contact with the optical multiplexer / demultiplexer and the fixed pin terminal exposed in the recess, and the heat transfer member and the fixed pin terminal are used. The heat of the optical multiplexer / demultiplexer can be released to the outside. Further, when the heat transfer member is sandwiched between the optical multiplexer / demultiplexer and the recess, the heat transfer member is deformed according to the shape of the recess, and the inside of the recess can be filled with the heat transfer member without a gap. For this reason, heat dissipation can be promoted using the heat transfer member, and the thickness dimension of the heat transfer member can be made substantially uniform over the entire surface by setting the depth dimension of the recesses to be substantially constant over the entire surface. And temperature variations of the optical multiplexer / demultiplexer can be suppressed.

  According to invention of Claim 4, since it was set as the structure which has a projection part in the peripheral side of a heat-transfer member, when a heat-transfer member is accommodated in a recessed part, a projection part protrudes from the inside of a recessed part. In this state, when the concave portion is closed by the optical multiplexer / demultiplexer, the protrusion is deformed and rides on the chamfered portion of the concave portion, so that the contact area between the heat transfer member and the optical multiplexer / demultiplexer is increased by the amount of the bumper. It is possible to increase the heat radiation effect by the heat transfer member.

  Hereinafter, an optical module connected to an SC type optical connector as an example of a connector device according to an embodiment of the present invention will be described in detail with reference to FIGS. 1 to 4.

  In the figure, reference numeral 1 denotes a casing which is formed using, for example, a resin material and accommodates an optical multiplexer / demultiplexer 8 which will be described later. The casing 1 includes a bottom portion 2 having a substantially rectangular plate shape extending in the front and rear directions, and the bottom portion. 2 and a peripheral wall portion 3 standing from the left and right end portions and the rear end portion and surrounding the bottom portion 2, and a front end portion of the bottom portion 2 standing left and right (width direction) with a gap. The two pillar parts 4 provided and a hook part 5 provided on each pillar part 4 and projecting toward the outside of the casing 1 are roughly constituted. A plurality of insertion holes 2A through which pin terminals 9B described later are inserted are formed on the rear side of the bottom portion 2, and positioning protrusions 2B for positioning the optical multiplexer / demultiplexer 8 are provided on the front side of the bottom portion. ing.

  A gap 6 is formed between the two pillars 4 to form a substantially semicircular notch. Thereby, the ferrule holder 8B of the optical multiplexer / demultiplexer 8 which will be described later can be easily inserted into the gap 6 from the upper side (the tip side of the column portion 4), and the assembling property of the optical multiplexer / demultiplexer 8 is improved. ing.

  Furthermore, the hook portion 5 is engaged with a flat plate-like arm portion 5A extending from each column portion 4 toward the front side, and an optical connector (not shown) provided at the tip of the plate-like arm portion 5A. And the engaging claw portion 5B. The two hook portions 5 are provided so as to face each other, and are prevented from coming off while the counterpart optical connector is sandwiched between the two engaging claws 5B, and the optical connector is connected to the optical module.

  The peripheral wall 3 of the casing 1 is provided with engagement protrusions 7 that are located on the rear side of the column 4 and protrude left and right. The engagement protrusion 7 is inserted into an engagement hole 19 of the cover member 16 to be described later and engaged therewith to fix the cover member 16 to the casing 1.

  8 is an optical multiplexer / demultiplexer located on the front side of the casing 1 and attached to the bottom 2. The optical multiplexer / demultiplexer 8 has a laser diode (LD) in a box-shaped casing made of a heat-conductive metal material or the like. Functions as a connection end when an element accommodating portion 8A accommodating an element such as a photodiode (PD) or the like (both not shown) is projected from the element accommodating portion 8A toward the front side and connected to a counterpart optical connector And a ferrule holder 8B. The ferrule holder 8B is inserted into the gap 6 and the element accommodating portion 8A is positioned by the protrusion 2B of the bottom 2. Further, the element housing portion 8A is in contact with a heat radiating sheet 24 described later provided in the casing 1.

  Reference numeral 9 denotes a circuit board connected to the optical multiplexer / demultiplexer 8. The circuit board 9 has a plurality of circuit components 9A and a plurality of pin terminals 9B for inputting / outputting signals to / from the outside. It is lined up. The circuit board 9 is connected to the optical multiplexer / demultiplexer 8 using, for example, a lead wire 9C, and is accommodated in the casing 1 with the pin terminal 9B inserted into the insertion hole 2A of the bottom portion 2. Thereby, the front end side of the pin terminal 9B protrudes from the bottom part 2, and can be connected to an external electrode or the like.

  Reference numeral 10 denotes an adapter case which is attached to the front end side of the casing 1 and accommodates the hook portion 5 therein. The adapter case 10 is formed in a substantially square cylindrical shape using, for example, a resin material. The adapter case 10 is provided on the front side and is connected to the two column portions 4 provided on the rear side of the guide tube portion 11 into which the counterpart optical connector is inserted. The connecting part 12 attached to the casing 1 is generally configured.

  Moreover, the connection part 12 is provided with the two fitting parts 13 which are provided in the width direction both ends and are each fitted to the pillar part 4 of the casing 1. And the fitting part 13 comprises the substantially square box shape, and becomes a structure which pinches | interposes the two pillar parts 4 from the width direction both ends (left and right both sides). Further, a top plate-side protrusion 14 protrudes from the upper end side of the connecting portion 12, and a side plate-side protrusion 15 that protrudes outward in the left and right directions protrudes from the fitting portion 13.

  Reference numeral 16 denotes a metal cover member that covers the optical multiplexer / demultiplexer 8 and the circuit board 9, and the cover member 16 includes a top plate portion 16 </ b> A that sandwiches the optical multiplexer / demultiplexer 8 from above with the bottom 2 of the casing 1. The side plate 16B is formed by bending the left and right sides of the top plate 16A toward the bottom 2 of the casing 1, and has a U-shaped cross section along the front and rear directions of the casing 1. It extends.

  Further, a first engagement hole 17 is formed in the top plate portion 16 </ b> A at a position facing the top plate side protrusion 14 of the connecting portion 12. On the other hand, the side plate portion 16B is provided with a second engagement hole 18 at a position facing the side plate projection 15 of the connecting portion 12 and at a position facing the engagement projection 7 of the casing 1. An engagement hole 19 is provided.

  The cover member 16 is mounted from above so as to cover the optical multiplexer / demultiplexer 8 and the like with the optical multiplexer / demultiplexer 8, the circuit board 9, and the adapter case 10 attached to the casing 1. At this time, the top plate side projection 14, the side plate side projection 15 of the adapter case 10, and the engagement projection 7 of the casing 1 are inserted into the engagement holes 17 to 19 of the cover member 16, respectively. Is connected and fixed to the adapter case 10 and the casing 1 in a retaining state.

  Reference numeral 20 denotes a fixed pin terminal provided on the bottom 2 of the casing 1 at a position facing the element accommodating portion 8A of the optical multiplexer / demultiplexer 8, and the fixed pin terminal 20 is substantially U-shaped using a heat conductive metal material. It is formed in a shape. As a result, the fixed pin terminal 20 is located at both ends thereof and protrudes from the bottom 2 toward the outside of the casing 1 and is exposed between the ends 20A and exposed in a recess 21 described later. It is comprised by the intermediate part 20B resin-molded (embedded) in the casing 1 in the state. The fixed pin terminal 20 is such that the end portion 20A is bonded and fixed to, for example, an external mounting substrate (not shown) using a bonding means such as soldering to position and fix the casing 1 and the like.

  21 is a recess provided in the bottom 2 of the casing 1, and the recess 21 is recessed on the surface side of the bottom 2 as, for example, a substantially rectangular recess, and its depth dimension D (for example, D = about 0.2 mm). Is set to a substantially constant value over the entire surface. The concave portion 21 is disposed at a position facing the element accommodating portion 8A of the optical multiplexer / demultiplexer 8 and has an opening having an area smaller than the bottom surface of the element accommodating portion 8A. As a result, the recess 21 is closed by the element accommodating portion 8A over substantially the entire surface, and the peripheral edge of the opening end of the recess 21 in the bottom 2 of the casing 1 is in contact with the bottom surface of the element accommodating portion 8A. A stopper portion 22 for preventing 8A from entering the recess 21 is formed.

  Further, an intermediate portion 20 </ b> B of the fixed pin terminal 20 is exposed inside the recess 21 at the bottom surface side. On the other hand, a chamfered portion 23 that is chamfered such as a C surface or an R surface is formed around the opening end of the concave portion 21 and is positioned on the corner side (edge side) of the stopper portion 22. As a result, the opening area of the recess 21 is expanded by an amount corresponding to the chamfered portion 23 as compared with the case where the chamfered portion 23 is omitted.

  Reference numeral 24 denotes a heat radiating sheet as a heat transfer member housed in the recess 21. The heat radiating sheet 24 has heat conductivity and can be deformed when sandwiched between the optical multiplexer / demultiplexer 8 and the recess 21 ( For example, a silicon material or the like is used as a flexible material, and is formed into a substantially sheet shape (cloth shape). As shown in FIG. 4, it is larger than the depth dimension D of the recess 21 over the entire surface before mounting. It has a value thickness dimension T (eg, T = 0.3 mm) (T> D).

  Further, the heat dissipation sheet 24 is formed with a frame-like protrusion 24A (protrusion) protruding toward the surface side in the thickness direction on the peripheral side located in the vicinity of the opening end of the recess 21, and the frame-like protrusion A recessed portion 24B that is recessed from the frame-shaped protrusion 24A is formed on the center side surrounded by the portion 24A. When the heat radiation sheet 24 is sandwiched between the concave portion 21 and the optical multiplexer / demultiplexer 8, the frame-shaped protrusion 24A is deformed toward the outer peripheral side of the concave portion 21, and the chamfered portion 23 and the optical multiplexer / demultiplexer 8 are deformed. It is configured to enter between. Further, the heat radiation sheet 24 is sandwiched between the concave portion 21 and the optical multiplexer / demultiplexer 8, so that the surface side of the heat radiating sheet 24 is substantially in contact with the bottom surface of the optical multiplexer / demultiplexer 8 (element accommodating portion 8 </ b> A). The back surface is in contact with the intermediate portion 20B of the fixed pin terminal 20 exposed in the recess 21.

  The optical module according to the present embodiment has the above-described configuration, and the operation thereof will be described next.

  First, a counterpart optical connector (not shown) is inserted into the adapter case 10 of the optical module, and the counterpart optical connector is sandwiched between the two hook portions 5 to prevent it from coming off. Thereby, the optical fiber in the optical connector of the other party is optically coupled to the element in the optical multiplexer / demultiplexer 8 through the optical fiber in the optical ferrule held by the ferrule holder 8B. In addition, an optical signal can be transmitted to the optical fiber, and an optical signal received from the other optical fiber can be converted into an electrical signal and output to the outside.

  At this time, since a laser diode, a photodiode, an amplifier and the like are accommodated in the optical multiplexer / demultiplexer 8, when the optical module is driven, these circuits generate heat and the temperature in the optical multiplexer / demultiplexer 8 is increased. Tend to rise.

  On the other hand, in the present embodiment, the bottom portion 2 of the casing 1 is provided with a concave portion 21 in which the fixed pin terminal 20 is exposed at a position facing the optical multiplexer / demultiplexer 8. Since the heat dissipation sheet 24 in contact with the container 8 and the fixed pin terminal 20 is provided, the heat generated from the optical multiplexer / demultiplexer 8 can be released to the outside through the heat dissipation sheet 24 and the fixed pin terminal 20. . For this reason, the temperature increase of the optical multiplexer / demultiplexer 8 can be suppressed, wavelength shift of the laser diode of the optical multiplexer / demultiplexer 8 can be prevented and operated stably, and the reliability and stability can be improved. it can. Further, since the wavelength shift of the optical multiplexer / demultiplexer 8 is suppressed, the entire communication system including the optical module can be simplified.

  Further, since the recess 21 has an opening having an area smaller than that of the optical multiplexer / demultiplexer 8, a stopper portion 22 that contacts the optical multiplexer / demultiplexer 8 is formed in a portion of the casing 1 that is located around the opening of the recess 21. can do. Therefore, by sandwiching the heat radiation sheet 24 made of a deformable material between the concave portion 21 and the optical multiplexer / demultiplexer 8, as shown in FIG. 3, the depth dimension D of the concave portion 21 and the thickness of the heat radiation sheet 24 are obtained. The length T ′ can be made to coincide. For this reason, since the thickness dimension T ′ of the heat radiation sheet 24 at the time of mounting (when assembled) can be set by the depth dimension D of the recess 21, the distance between the optical multiplexer / demultiplexer 8 and the fixed pin terminal 20 is set. The distance can be kept constant. As a result, the heat transfer characteristics of the heat radiating sheet 24 and the like can be made substantially constant, and temperature variations of the optical multiplexer / demultiplexer 8 can be suppressed and stabilized.

  On the other hand, since the heat radiating sheet 24 is formed using a deformable material, when the heat radiating sheet 24 is sandwiched between the optical multiplexer / demultiplexer 8 and the concave portion 21, the heat radiating sheet 24 is deformed and the It may overflow and overflow, and the thickness dimension of the heat radiation sheet 24 may partially increase (the optical multiplexer / demultiplexer 8 tilts). At this time, since the recess 21 is provided with the chamfered portion 23 around the opening end, even if a part of the heat radiation sheet 24 (especially around the frame-like protruding portion 24A) moves to the opening end side of the recess 21, the opening is opened. The heat radiating sheet 24 moved to the end side can be accommodated between the chamfer 23 and the optical multiplexer / demultiplexer 8. For this reason, since it is possible to prevent the heat radiation sheet 24 from overflowing from the recess 21, the thickness dimension T ′ of the heat radiation sheet 24 can be made constant over the entire surface, and temperature variations of the optical multiplexer / demultiplexer 8 can be prevented. Can be suppressed. Moreover, since the area (opening area) on the opening end side of the recess 21 is increased by the chamfered portion 23, the contact area between the heat radiation sheet 24 and the optical multiplexer / demultiplexer 8 is increased as compared with the case where the chamfered portion 23 is not provided. be able to. Thereby, since the heat radiation using the heat radiating sheet 24 can be promoted, the effect of suppressing the temperature rise of the optical multiplexer / demultiplexer 8 can be enhanced.

  Furthermore, while forming the heat radiating sheet 24 using a deformable material, as shown in FIG. 4, the thickness dimension T of the heat radiating sheet 24 is set to be larger than the depth dimension D of the recess 21 before being attached. From (T> D), when the heat dissipation sheet 24 is sandwiched between the optical multiplexer / demultiplexer 8 and the recess 21, the heat dissipation sheet 24 is securely attached to the optical multiplexer / demultiplexer 8 and the fixed pin terminal 20 exposed in the recess 21. The heat of the optical multiplexer / demultiplexer 8 can be released to the outside using the heat dissipation sheet 24 and the fixed pin terminal 20. Further, when the heat dissipation sheet 24 is sandwiched between the optical multiplexer / demultiplexer 8 and the recess 21, the heat dissipation sheet 24 is deformed according to the shape of the recess 21, and the recess 21 can be filled with the heat dissipation sheet 24 without a gap. it can. Therefore, heat radiation can be promoted by using the heat radiating sheet 24 and the thickness dimension T ′ of the heat radiating sheet 24 at the time of mounting can be set by setting the depth dimension D of the recess 21 almost constant over the entire surface. It can be made substantially uniform over the entire surface, and temperature variations of the optical multiplexer / demultiplexer 8 can be suppressed.

  Further, since the frame-like protrusion 24A protruding in the thickness direction is formed on the peripheral side of the heat dissipation sheet 24, when the heat dissipation sheet 24 is accommodated in the recess 21, the frame-like protrusion 24A of the heat dissipation sheet 24 is in the recess 21. Protrude from. In this state, when the concave portion 21 is closed by the optical multiplexer / demultiplexer 8, the frame-shaped protrusion 24 </ b> A of the heat radiating sheet 24 is deformed and rides on the chamfered portion 23 of the concave portion 21. And the optical multiplexer / demultiplexer 8 can be increased in contact area, and the heat dissipation effect of the heat dissipation sheet 24 can be increased.

  In the above-described embodiment, the chamfered portion 23 is provided at the opening end of the recess 21 over the entire circumference. However, the present invention is not limited to this, and a chamfered portion may be partially provided in the opening end of the recess. That is, for example, a chamfered portion may be provided on the front and rear sides of the casing 1 in the recess 21 and the chamfered portions may be omitted on both sides in the width direction (left and right sides).

  Further, the optical module connected to the SC type optical connector as an example of the connector device according to the present invention has been described as an example. However, any optical multiplexer / demultiplexer having exothermic properties may be accommodated in the casing. You may apply to the other optical connector, optical module, etc. which are connected to.

It is a perspective view which shows the optical module by embodiment of this invention. It is a disassembled perspective view which shows the optical module in FIG. FIG. 3 is an enlarged cross-sectional view of a casing, an optical multiplexer / demultiplexer, a heat radiating sheet, and the like as seen from the direction of arrows III-III in FIG. FIG. 4 is an enlarged exploded cross-sectional view seen from the same position as in FIG. 3 in a state where a casing, an optical multiplexer / demultiplexer, a heat radiation sheet, and the like are disassembled.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Casing 2 Bottom part 4 Pillar part 5 Hook part 6 Gap part 7 Engagement protrusion 8 Optical multiplexer / demultiplexer 10 Adapter case 20 Fixing pin terminal 21 Recess 22 Stopper part 23 Chamfer 24 Radiation sheet 24A Frame-like protrusion (protrusion part)
24B depression

Claims (4)

In a connector device comprising a casing and an optical multiplexer / demultiplexer that is attached to the casing and transmits / receives a signal to / from the other party,
The casing is provided with a fixed pin terminal made of a heat conductive material protruding outward, and the casing has an opening having an area smaller than that of the optical multiplexer / demultiplexer at a position facing the optical multiplexer / demultiplexer. A connector device characterized in that a recessed portion in which the fixed pin terminal is exposed is provided, and a heat transfer member in contact with the optical multiplexer / demultiplexer and the fixed pin terminal is provided in the recessed portion.   The connector device according to claim 1, wherein the concave portion is provided with a chamfered portion that is located around the opening end and chamfers.   The heat transfer member has a thickness dimension larger than the depth dimension of the concave portion, and is formed using a material that can be deformed when sandwiched between the optical multiplexer / demultiplexer and the concave portion. Item 3. The connector device according to Item 2.   The connector device according to claim 3, wherein the heat transfer member includes a protrusion that is located on a peripheral side and protrudes in a thickness direction.

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