JP2005308790A - Wavelength multiplex optical transmission module and its alignment method - Google Patents

Wavelength multiplex optical transmission module and its alignment method Download PDF

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JP2005308790A
JP2005308790A JP2004121665A JP2004121665A JP2005308790A JP 2005308790 A JP2005308790 A JP 2005308790A JP 2004121665 A JP2004121665 A JP 2004121665A JP 2004121665 A JP2004121665 A JP 2004121665A JP 2005308790 A JP2005308790 A JP 2005308790A
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circuit board
light emitting
optical axis
transmission module
optical transmission
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JP4265470B2 (en
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Ryuta Takahashi
龍太 高橋
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Hitachi Cable Ltd
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Hitachi Cable Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To readily manufacture wavelength multiplex optical transmission module that has attained reduction in size. <P>SOLUTION: In the wavelength multiplex optical transmission module 1 comprises a circuit board 2, a waveguide element having a plurality of cores parallel thereto, and a light-transmitting element 5 attached to the circuit board 2 or a light-receiving element there are arranged the light-transmitting element 5 on the circuit board 2 so that an optical axis intersects the circuit board 2 or the light-receiving element, and a mirror member 8 for aligning the optical axis and an optical axis of the waveguide element is provided on the optical axis of the light-transmitting element 5 or the light-receiving element. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、波長の異なる複数のレーザ光を合波して送信し、或いは合波して送信された波長多重レーザ光を分波して受信する波長多重光伝送モジュール及びその調芯方法に関するものである。   The present invention relates to a wavelength division multiplexing optical transmission module that multiplexes and transmits a plurality of laser beams having different wavelengths, or demultiplexes and receives a wavelength division multiplexed laser beam transmitted after multiplexing and a method for aligning the same. It is.

より多くの情報を送受信するために、波長の異なる複数のレーザ光を合波して送受信する技術がある。この技術は、図５に示すように、波長の異なる複数のレーザ光を合波して送信する波長多重光送信モジュール５１と、波長多重光送信モジュール５１に光ファイバ５２を介して接続され送信されたレーザ光を波長ごとに分波して受信する波長多重光受信モジュール５３とで光信号を送受信するようになっている。   In order to transmit / receive more information, there is a technique for transmitting and receiving a plurality of laser beams having different wavelengths. In this technique, as shown in FIG. 5, a wavelength division multiplexing optical transmission module 51 that multiplexes and transmits a plurality of laser beams having different wavelengths and is connected to the wavelength division multiplexing optical transmission module 51 via an optical fiber 52 and transmitted. The optical signal is transmitted / received to / from the wavelength-multiplexed light receiving module 53 that receives the divided laser light for each wavelength.

波長多重光送信モジュール５１は、図５及び図６に示すように、波長の異なるレーザ光を出射する４つの発光素子５４と、これら発光素子５４が接続される回路基板５５と、それぞれの発光素子５４から出射されたレーザ光を合波する光合波器５６とを備えて構成されている。光合波器５６には、複数の導波路５７が形成されており、発光素子５４側で４つに分かれている導波路５７が一つに結合するようになっている。   As shown in FIGS. 5 and 6, the wavelength multiplexing optical transmission module 51 includes four light emitting elements 54 that emit laser beams having different wavelengths, a circuit board 55 to which the light emitting elements 54 are connected, and the respective light emitting elements. And an optical multiplexer 56 that multiplexes the laser beams emitted from 54. A plurality of waveguides 57 are formed in the optical multiplexer 56, and the waveguides 57 divided into four on the light emitting element 54 side are combined into one.

上述の回路基板５５と導波路５７とは互いに平行に配置されており、発光素子５４もその光軸が導波路５７の光軸と平行になるようにそれぞれ配置されている。   The circuit board 55 and the waveguide 57 described above are arranged in parallel to each other, and the light emitting element 54 is also arranged so that the optical axis thereof is parallel to the optical axis of the waveguide 57.

波長多重光受信モジュール５３は、図５に示すように、波長多重光送信モジュール５１からのレーザ光を分波する光分波器５８と、この光分波器５８で分波されたレーザ光をそれぞれ受光する４つの受光素子５９と、これら受光素子５９が接続される回路基板（図示せず）とを備えて構成されている。光分波器５８にも、レーザ光を分波するための導波路（図示せず）が複数形成されている。   As shown in FIG. 5, the wavelength division multiplexing receiver module 53 includes an optical demultiplexer 58 that demultiplexes the laser beam from the wavelength division multiplexing transmitter module 51, and the laser beam demultiplexed by the optical demultiplexer 58. Each light receiving element 59 is configured to include four light receiving elements 59 and a circuit board (not shown) to which the light receiving elements 59 are connected. The optical demultiplexer 58 is also formed with a plurality of waveguides (not shown) for demultiplexing the laser light.

上述の図示しない回路基板と導波路とは互いに平行に配置されており、受光素子５９もその光軸が導波路の芯と平行になるようにそれぞれ配置されている。   The circuit board (not shown) and the waveguide are arranged in parallel to each other, and the light receiving element 59 is also arranged so that its optical axis is parallel to the core of the waveguide.

ところで、上述の発光素子５４（受光素子５９）は、内部のＬＤチップ（ＰＤチップ）がケーシングに対して位置ズレしている場合があるので、個別に光軸を、導波路５７（図示しない導波路）の端部の芯と合わせる必要がある。   By the way, in the above-described light emitting element 54 (light receiving element 59), the internal LD chip (PD chip) may be misaligned with respect to the casing. It is necessary to match with the core at the end of the (waveguide).

そこで、従来は、図６に示すように、各発光素子５４（受光素子５９）の本体を把持する調芯チャック６１を用いて、各発光素子５４（受光素子５９）自身を挟み込んで支持しながら移動させて一つずつ調芯するようになっていた。   Therefore, conventionally, as shown in FIG. 6, each light emitting element 54 (light receiving element 59) itself is sandwiched and supported by using an alignment chuck 61 that holds the main body of each light emitting element 54 (light receiving element 59). They were moved and aligned one by one.

特開平７−１８１３５０号公報JP-A-7-181350

しかしながら、上述の調芯方法では、各発光素子５４（受光素子５９）を調芯チャック６１で把持して調芯するため、隣接する発光素子５４（受光素子５９）間の距離をそれぞれ確保しなければならず、波長多重光伝送モジュールの幅が大きくなってしまう原因となっていた。   However, in the above-described alignment method, each light emitting element 54 (light receiving element 59) is gripped and aligned by the alignment chuck 61, so that a distance between adjacent light emitting elements 54 (light receiving elements 59) must be ensured. In other words, the width of the wavelength division multiplexing optical transmission module is increased.

また、発光素子５４（受光素子５９）が、その光軸が回路基板５５（図示しない回路基板）と平行になるように設けられているので、発光素子５４（受光素子５９）から延びるリード６２を９０°屈曲させて、回路基板５５（図示しない回路基板）に接続するリードフォーミングを行う必要があり、多くの作業手間と時間を要するといった問題もあった。   Further, since the light emitting element 54 (light receiving element 59) is provided so that its optical axis is parallel to the circuit board 55 (circuit board not shown), the lead 62 extending from the light emitting element 54 (light receiving element 59) is provided. It is necessary to perform lead forming which is bent by 90 ° and connected to the circuit board 55 (a circuit board (not shown)), and there is a problem that much work and time are required.

そこで本発明は、上記問題を解決すべく案出されたものであり、その目的は、モジュールの小型化が達成できると共に、容易に製造できる波長多重光伝送モジュール及びその調芯方法を提供することにある。   Therefore, the present invention has been devised to solve the above problems, and an object of the present invention is to provide a wavelength division multiplexing optical transmission module that can be miniaturized and can be easily manufactured, and an alignment method thereof. It is in.

上記目的を達成するために本願発明は、回路基板と、これに平行な複数のコアを有する導波路素子と、上記回路基板に取り付けられた発光素子または受光素子とを備えた波長多重光伝送モジュールにおいて、上記回路基板上に、光軸が回路基板に対して交差するように上記発光素子または受光素子を配置し、その発光素子または受光素子の光軸上に、その光軸と上記導波路素子の光軸とを調芯するためのミラー部材を設けた波長多重光伝送モジュールである。   To achieve the above object, the present invention provides a wavelength division multiplexing optical transmission module comprising a circuit board, a waveguide element having a plurality of cores parallel to the circuit board, and a light emitting element or a light receiving element attached to the circuit board. The light emitting element or the light receiving element is disposed on the circuit board so that the optical axis intersects the circuit board, and the optical axis and the waveguide element are disposed on the optical axis of the light emitting element or the light receiving element. This is a wavelength division multiplexing optical transmission module provided with a mirror member for aligning the optical axis.

そして、上記ミラー部材が、光を反射させるミラー部と、このミラー部を可動支持すべく塑性変形する可動支持部と、この可動支持部を固定する固定台とを有するものが好ましい。   The mirror member preferably has a mirror part that reflects light, a movable support part that is plastically deformed to move and support the mirror part, and a fixed base that fixes the movable support part.

また、上記ミラー部が、ガラス或いはシリコン等からなる平板状の基板にアルミ或いは金等の金属を蒸着して形成されたものが好ましい。   Further, it is preferable that the mirror part is formed by vapor-depositing a metal such as aluminum or gold on a flat substrate made of glass or silicon.

さらに、本願発明は、回路基板に平行な導波路素子の光軸と、上記回路基板に取り付けられた発光素子または受光素子の光軸とを調芯する波長多重光伝送モジュールの調芯方法において、上記回路基板上に、光軸が回路基板に対して交差するように上記発光素子または受光素子を配置し、その発光素子または受光素子の光軸上にミラー部材を設け、このミラー部材を傾斜させて上記発光素子または受光素子の光軸と上記導波路素子の光軸とを調芯するようにした波長多重光伝送モジュールの調芯方法である。   Furthermore, the present invention relates to an alignment method of a wavelength division multiplexing optical transmission module that aligns an optical axis of a waveguide element parallel to a circuit board and an optical axis of a light emitting element or a light receiving element attached to the circuit board. The light emitting element or the light receiving element is arranged on the circuit board so that the optical axis intersects the circuit board, a mirror member is provided on the optical axis of the light emitting element or the light receiving element, and the mirror member is inclined. This is an alignment method for a wavelength division multiplexing optical transmission module in which the optical axis of the light emitting element or light receiving element and the optical axis of the waveguide element are aligned.

そして、上記ミラー部材は、その幅方向両側から把持する調芯チャック或いは背面を吸着して把持する調芯チャックによって傾斜される波長多重光伝送モジュールの調芯方法が好ましい。   The mirror member is preferably an alignment method of a wavelength division multiplexing optical transmission module that is tilted by an alignment chuck that is gripped from both sides in the width direction or an alignment chuck that is suctioned and gripped on the back surface.

本発明によれば、波長多重光伝送モジュールの小型化が達成できると共に、容易に製造できるといった優れた効果を発揮する。   According to the present invention, the wavelength multiplexed optical transmission module can be reduced in size and can be manufactured easily.

図１は、本発明に係る波長多重光伝送モジュールの好適な実施の形態を示した平面図、図２は本発明に係る波長多重光伝送モジュールの好適な実施の形態を示した側面図、図３はミラー部材を示した側面図、図４はミラー部材を示した底面図である。   FIG. 1 is a plan view showing a preferred embodiment of a wavelength division multiplexing optical transmission module according to the present invention, and FIG. 2 is a side view showing a preferred embodiment of the wavelength division multiplexing optical transmission module according to the present invention. 3 is a side view showing the mirror member, and FIG. 4 is a bottom view showing the mirror member.

なお、本実施の形態では、波長多重光伝送モジュールとして、波長の異なる複数のレーザ光を合波して送信する波長多重光送信モジュールを例に挙げて説明する。   In the present embodiment, a wavelength division multiplexing optical transmission module that multiplexes and transmits a plurality of laser beams having different wavelengths will be described as an example.

図１及び図２に示すように、かかる波長多重光伝送モジュール１は、回路基板２と、これに平行な複数のコア（導波路３）を有する導波路素子と、回路基板２に取り付けられた発光素子（Ｃａｎ−ＬＤ：レーザ・ダイオード）５とを備えている。   As shown in FIGS. 1 and 2, the wavelength division multiplexing optical transmission module 1 is attached to the circuit board 2, a waveguide element having a plurality of cores (waveguides 3) parallel to the circuit board 2, and the circuit board 2. And a light emitting element (Can-LD: laser diode) 5.

導波路３は、光合波器６に複数列形成されている。具体的には、導波路３は、発光素子５側から４列形成され、互いに結合されて一つにまとまるようになっている。導波路３が形成された光合波器６は、ベース７上に載置されており、ベース７の下面には回路基板２が取り付けられ、光合波器６と回路基板２とが互いに平行になるように配置されている。ベース７の回路基板２が取り付けられた部分は、薄板状に形成されている。   A plurality of waveguides 3 are formed in the optical multiplexer 6. Specifically, the waveguides 3 are formed in four rows from the light emitting element 5 side, and are coupled to each other so as to be combined into one. The optical multiplexer 6 in which the waveguide 3 is formed is placed on the base 7, the circuit board 2 is attached to the lower surface of the base 7, and the optical multiplexer 6 and the circuit board 2 are parallel to each other. Are arranged as follows. The portion of the base 7 to which the circuit board 2 is attached is formed in a thin plate shape.

回路基板２の端部上には、光軸が回路基板２に対して交差するように複数の発光素子５（波長多重光受信モジュールの場合には受光素子）が配置されている。本実施の形態では、４つの発光素子５が、ベース７の薄板部を介して回路基板２の端部に対して垂直に固定されている。隣接する発光素子５同士は、端部同士が略接触する距離で配置されており、発光素子５は、一列に整列されている。回路基板２には、発光素子５を作動させるＬＤドライバ等の電子部品（図示せず）が装着されている。   On the end of the circuit board 2, a plurality of light emitting elements 5 (light receiving elements in the case of a wavelength multiplexed light receiving module) are arranged so that the optical axis intersects the circuit board 2. In the present embodiment, the four light emitting elements 5 are fixed perpendicularly to the end of the circuit board 2 through the thin plate portion of the base 7. Adjacent light emitting elements 5 are arranged at a distance where the end portions substantially contact each other, and the light emitting elements 5 are aligned in a line. An electronic component (not shown) such as an LD driver for operating the light emitting element 5 is mounted on the circuit board 2.

発光素子５の上方で、その光軸上には、その光軸と導波路３の光軸（導波路素子の光軸）とを調芯するためのミラー部材８が設けられている。ミラー部材８は、図３及び図４に示すように、光を反射させるミラー部９と、このミラー部９を可動支持すべく塑性変形する可動支持部１０と、この可動支持部１０を固定する固定台１１とを有している。   Above the light emitting element 5, a mirror member 8 for aligning the optical axis with the optical axis of the waveguide 3 (optical axis of the waveguide element) is provided on the optical axis. As shown in FIGS. 3 and 4, the mirror member 8 fixes a mirror portion 9 that reflects light, a movable support portion 10 that is plastically deformed to support the mirror portion 9, and the movable support portion 10. And a fixed base 11.

固定台１１は、導波路３の発光素子５側端部上方に配置され、光合波器６の幅方向に延びて形成されている。固定台１１は、その両端（光合波器６の幅方向両端）が、光合波器６に固定されて、導波路３上に架け渡されている。   The fixed base 11 is disposed above the end portion of the waveguide 3 on the light emitting element 5 side, and is formed to extend in the width direction of the optical multiplexer 6. Both ends of the fixing base 11 (both ends in the width direction of the optical multiplexer 6) are fixed to the optical multiplexer 6 and spanned on the waveguide 3.

可動支持部１０は、各発光素子５毎にそれぞれ設けられている。可動支持部１０は、固定台１１に固定される保持部１２と、保持部１２の先端に設けられ保持部１２よりも幅及び厚さが小さく形成された変形部１３と、変形部１３の先端に設けられミラー部９が設けられるミラー固定部１４とで形成されている。保持部１２、変形部１３及びミラー固定部１４は鉄或いはアルミ等の同一の金属で一体的に形成されている。ここで変形部１３は、鉄やアルミ等の金属で幅及び厚さが小さく形成されているので、塑性変形可能である。   The movable support portion 10 is provided for each light emitting element 5. The movable support portion 10 includes a holding portion 12 that is fixed to the fixed base 11, a deformation portion 13 that is provided at the distal end of the holding portion 12 and has a smaller width and thickness than the holding portion 12, and the distal end of the deformation portion 13. And a mirror fixing part 14 provided with a mirror part 9. The holding part 12, the deforming part 13, and the mirror fixing part 14 are integrally formed of the same metal such as iron or aluminum. Here, since the deformed portion 13 is formed of a metal such as iron or aluminum and has a small width and thickness, it can be plastically deformed.

ミラー部９は、ミラー固定部１４の下面に、ガラス或いはシリコン等からなる平板状の基板１５を接着剤等で貼り付け、その基板１５に、アルミ或いは金等の金属を蒸着して形成されている。ミラー部９は、発光素子５の出射光束よりも若干大きければよく、例えば、１ｍｍ四方の正方形に形成されている。   The mirror portion 9 is formed by attaching a flat substrate 15 made of glass or silicon to the lower surface of the mirror fixing portion 14 with an adhesive or the like, and depositing a metal such as aluminum or gold on the substrate 15. Yes. The mirror part 9 should just be a little larger than the emitted light beam of the light emitting element 5, for example, is formed in a 1 mm square.

ミラー部９は、発光素子５の光軸に対して略４５°傾斜して配置されており、後述する調芯チャック（図１及び図２参照）１６でその傾斜角度を３次元的に調整することで、発光素子５の光軸と導波路３の光軸とを調芯する。   The mirror unit 9 is disposed with an inclination of approximately 45 ° with respect to the optical axis of the light emitting element 5, and the inclination angle thereof is three-dimensionally adjusted by an alignment chuck (see FIGS. 1 and 2) 16 described later. Thus, the optical axis of the light emitting element 5 and the optical axis of the waveguide 3 are aligned.

調芯チャック１６は、図１及び図２に示すように、ミラー部材８のミラー固定部１４をその両側から把持する一対の把持爪１７を有している。把持爪１７は、近接離反可能に設けられており、互いに近接してミラー固定部１４を掴んで把持する。   As shown in FIGS. 1 and 2, the alignment chuck 16 has a pair of gripping claws 17 for gripping the mirror fixing portion 14 of the mirror member 8 from both sides thereof. The gripping claws 17 are provided so as to be close to and away from each other. The gripping claws 17 are close to each other and grip and hold the mirror fixing portion 14.

そして、ミラー固定部１４を把持した状態で、導波路３の他端に光パワーメータを設置して、発光素子５から光を出射し、光パワーメータの検出値を見ながら、その検出値が最大になるように調芯チャック１６を３次元的に回動することで調芯して変形部１３を塑性変形させる。その後、把持爪１７を離反させて、ミラー固定部１４の把持を解除する。これで、ミラー部９が調芯された状態で固定される。   And in the state which hold | gripped the mirror fixing | fixed part 14, the optical power meter is installed in the other end of the waveguide 3, light is radiate | emitted from the light emitting element 5, and the detected value is looking at the detected value of an optical power meter. The deforming portion 13 is plastically deformed by aligning the aligning chuck 16 in a three-dimensional manner so as to be maximized. Thereafter, the gripping claws 17 are separated to release the grip of the mirror fixing portion 14. Thus, the mirror unit 9 is fixed in an aligned state.

なお、調芯チャック１６は、把持爪１７でミラー固定部１４を狭持するものに限られるものではなく、ミラー固定部１４の上側背面に吸着するエアーチャックであってもよい。   The alignment chuck 16 is not limited to the one that holds the mirror fixing portion 14 with the gripping claws 17, and may be an air chuck that adsorbs to the upper back surface of the mirror fixing portion 14.

上記構成の波長多重光伝送モジュール及びその調芯方法によれば、発光素子５を回路基板２に対して垂直に取り付けているので、発光素子５の後方に延びるリード（図示せず）を曲げる必要がなく、リードフォーミングを行わなくてよいので、発光素子５の取付作業の手間及び時間を短縮することができ、波長多重光伝送モジュールの製造が容易にできるようになる。   According to the wavelength division multiplexing optical transmission module and the alignment method thereof configured as described above, since the light emitting element 5 is attached perpendicularly to the circuit board 2, a lead (not shown) extending behind the light emitting element 5 needs to be bent. Therefore, since it is not necessary to perform lead forming, the labor and time for attaching the light emitting element 5 can be shortened, and the wavelength division multiplexing optical transmission module can be easily manufactured.

さらに、発光素子５が、ベース７の薄板部を介して、広い面積で回路基板２に接触するので、放熱性を高めることができる。   Furthermore, since the light emitting element 5 contacts the circuit board 2 in a wide area via the thin plate portion of the base 7, heat dissipation can be improved.

また、発光素子５の上方に、発光素子５よりも個々の幅が小さいミラー部材８を設けて、調芯チャック１６で、ミラー部材８の傾斜角度を調整するようにしたので、従来のように、発光素子５４間に調芯チャックの挿入スペースを設ける必要がない。よって、隣接する発光素子５間の間隔を発光素子５同士が略接触するまで小さくできる。従って、発光素子５を最小の幅で配列でき、波長多重光伝送モジュールの小型化が達成できる。   Further, since the mirror member 8 having an individual width smaller than that of the light emitting element 5 is provided above the light emitting element 5 and the tilt angle of the mirror member 8 is adjusted by the alignment chuck 16, It is not necessary to provide a space for inserting the alignment chuck between the light emitting elements 54. Therefore, the interval between the adjacent light emitting elements 5 can be reduced until the light emitting elements 5 are substantially in contact with each other. Therefore, the light emitting elements 5 can be arranged with a minimum width, and the wavelength division multiplexing optical transmission module can be reduced in size.

なお、上記実施の形態では、ミラー部９は塑性変形する変形部１３によって支持されているが、これに限られるものではない。例えば、自在継手等を介してミラー部９を支持する等、３次元的に移動して固定される構成であればよい。   In the above-described embodiment, the mirror portion 9 is supported by the deformable portion 13 that is plastically deformed, but is not limited thereto. For example, it may be configured to move and fix three-dimensionally, such as supporting the mirror portion 9 via a universal joint or the like.

なお、上記実施の形態では、発光素子５を備えた波長多重光送信モジュールを例に挙げて説明したが、受光素子を備えた波長多重光受信モジュールにも適用できるのは勿論である。   In the above embodiment, the wavelength multiplexing optical transmission module including the light emitting element 5 has been described as an example. However, it is needless to say that the present invention can also be applied to a wavelength multiplexing optical receiving module including a light receiving element.

本発明に係る波長多重光伝送モジュールの好適な実施の形態を示した平面図である。1 is a plan view showing a preferred embodiment of a wavelength division multiplexing optical transmission module according to the present invention. 本発明に係る波長多重光伝送モジュールの好適な実施の形態を示した側面図である。1 is a side view showing a preferred embodiment of a wavelength division multiplexing optical transmission module according to the present invention. ミラー部材を示した側面図である。It is the side view which showed the mirror member. ミラー部材を示した底面図である。It is the bottom view which showed the mirror member. 波長多重光送信モジュールと波長多重光受信モジュールの概略説明図である。It is a schematic explanatory drawing of a wavelength division multiplexing optical transmission module and a wavelength division multiplexing optical reception module. 従来の波長多重光送信モジュールの平面図である。It is a top view of the conventional wavelength division multiplexing optical transmission module.

符号の説明Explanation of symbols

１ 波長多重光送信モジュール
２ 回路基板
３ 導波路
５ 発光素子
８ ミラー部材
９ ミラー部
１０ 可動支持部
１１ 固定台
１５ 基板
１６ 調芯チャック
DESCRIPTION OF SYMBOLS 1 Wavelength division multiplexing optical transmission module 2 Circuit board 3 Waveguide 5 Light emitting element 8 Mirror member 9 Mirror part 10 Movable support part 11 Fixed base 15 Board | substrate 16 Alignment chuck | zipper

Claims (5)

回路基板と、これに平行な複数のコアを有する導波路素子と、上記回路基板に取り付けられた発光素子または受光素子とを備えた波長多重光伝送モジュールにおいて、上記回路基板上に、光軸が回路基板に対して交差するように上記発光素子または受光素子を配置し、その発光素子または受光素子の光軸上に、その光軸と上記導波路素子の光軸とを調芯するためのミラー部材を設けたことを特徴とする波長多重光伝送モジュール。   In a wavelength division multiplexing optical transmission module comprising a circuit board, a waveguide element having a plurality of cores parallel to the circuit board, and a light emitting element or a light receiving element attached to the circuit board, an optical axis is disposed on the circuit board. A mirror for arranging the light emitting element or the light receiving element so as to cross the circuit board and aligning the optical axis of the light emitting element or the light receiving element with the optical axis of the waveguide element. A wavelength division multiplexing optical transmission module comprising a member. 上記ミラー部材が、光を反射させるミラー部と、このミラー部を可動支持すべく塑性変形する可動支持部と、この可動支持部を固定する固定台とを有する請求項１記載の波長多重光伝送モジュール。   2. The wavelength division multiplexing optical transmission according to claim 1, wherein the mirror member includes a mirror portion for reflecting light, a movable support portion that is plastically deformed to support the mirror portion, and a fixed base that fixes the movable support portion. module. 上記ミラー部が、ガラス或いはシリコン等からなる平板状の基板にアルミ或いは金等の金属を蒸着して形成された請求項２記載の波長多重光伝送モジュール。   3. The wavelength division multiplexing optical transmission module according to claim 2, wherein the mirror portion is formed by vapor-depositing a metal such as aluminum or gold on a flat substrate made of glass or silicon. 回路基板に平行な導波路素子の光軸と、上記回路基板に取り付けられた発光素子または受光素子の光軸とを調芯する波長多重光伝送モジュールの調芯方法において、上記回路基板上に、光軸が回路基板に対して交差するように上記発光素子または受光素子を配置し、その発光素子または受光素子の光軸上にミラー部材を設け、このミラー部材を傾斜させて上記発光素子または受光素子の光軸と上記導波路素子の光軸とを調芯するようにしたことを特徴とする波長多重光伝送モジュールの調芯方法。   In the alignment method of the wavelength division multiplexing optical transmission module for aligning the optical axis of the waveguide element parallel to the circuit board and the optical axis of the light emitting element or the light receiving element attached to the circuit board, on the circuit board, The light emitting element or the light receiving element is arranged so that the optical axis intersects the circuit board, a mirror member is provided on the optical axis of the light emitting element or the light receiving element, and the light emitting element or the light receiving element is tilted. An alignment method for a wavelength division multiplexing optical transmission module, wherein the optical axis of the element and the optical axis of the waveguide element are aligned. 上記ミラー部材は、その幅方向両側から把持する調芯チャック或いは背面を吸着して把持する調芯チャックによって傾斜される請求項４記載の波長多重光伝送モジュールの調芯方法。
5. The method of aligning a wavelength division multiplexing optical transmission module according to claim 4, wherein the mirror member is tilted by an alignment chuck that grips from both sides in the width direction or an alignment chuck that adsorbs and grips the back surface.
JP2004121665A 2004-04-16 2004-04-16 Wavelength multiplexing optical transmission module and its alignment method Expired - Fee Related JP4265470B2 (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015040883A (en) * 2013-08-20 2015-03-02 三菱電機株式会社 Method for manufacturing optical transmitter
CN109882826A (en) * 2018-11-29 2019-06-14 广东艾诗凯奇智能科技有限公司 Fog generating device
US10725338B2 (en) 2016-02-15 2020-07-28 Funai Electric Co., Ltd. Display device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015040883A (en) * 2013-08-20 2015-03-02 三菱電機株式会社 Method for manufacturing optical transmitter
US10725338B2 (en) 2016-02-15 2020-07-28 Funai Electric Co., Ltd. Display device
CN109882826A (en) * 2018-11-29 2019-06-14 广东艾诗凯奇智能科技有限公司 Fog generating device

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