JP2005307338A - Substrate fixing device in deposit-up type sputtering vapor deposition apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a simple substrate fixing tool capable of performing offset film deposition without polluting a substrate in the deposit-up type sputtering vapor deposition. <P>SOLUTION: In the deposit-up type sputtering vapor deposition apparatus, a fixing tool comprising a substrate fixing part to prevent a substrate from being dropped even when the substrate is mounted upside down, and a magnet part to fix the substrate to any point of a substrate stage is used. In the deposit-up type sputtering vapor deposition, the substrate is not polluted, and the offset film deposition is also performed. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a deposition-up type sputter deposition in which a film forming material source and a rotating stage on which a substrate to be deposited is held are provided in the lower part of a sealed container, and the substrate surface to be processed is placed on the lower side. The present invention relates to a mechanism for fixing a substrate at an arbitrary position.

  Recently, as a means for forming a thin film industrially, a sputter deposition apparatus is most used. As a sputtering apparatus, a bipolar glow discharge type was considered in the early stages of development, but after that, improvements were made, high-frequency sputtering, and further, a magnet was provided on the back side (non-sputtering side) of the target. A magnetic field is formed in the vicinity of the sputtering surface by the lines of magnetic force, the collision frequency between the rare gas such as argon gas introduced into the vacuum chamber and the electrons is increased, and ionization of the atmospheric gas is dramatically increased to form a plasma with a high ion density. Thus, magnetron sputter deposition for sputtering a target is conceivable and is currently most frequently used.

  As the sputter deposition apparatus, a rotary stage on which a substrate to be deposited is held at the lower part of a sealed container and a deposition material source are provided on the upper side. A so-called deposition down type was first developed to deposit film materials.

  However, in the above-described deposition down type film forming apparatus, the components of the film adhering to the inner wall of the chamber of the film forming apparatus often peel off and contaminate the substrate surface.

  Thus, a film forming material source is located below, and a film forming target substrate is disposed above the processing target surface, that is, a deposition up type sputtering deposition apparatus (see, for example, Patent Document 1 below) ) Was created. In this deposition-up type, the substrate is disposed with the surface to be processed facing down, so that the film components adhering to the inner wall of the chamber of the film forming apparatus do not peel off and contaminate the substrate surface. It is superior to deposition down type sputter deposition equipment.

  The deposition-up type deposition apparatus has a structure in which the flow of the deposition material is inverted upside down from the deposition-down type deposition apparatus.

However, in the case of the deposition type, there is a problem of how to fix the substrate to the substrate stage. That is, in the deposit-up type, it is necessary to fix the substrate surface horizontally with the substrate surface facing the ground side, and therefore, some fixing means for preventing the fall is necessary.

  For this reason, conventionally, as shown in FIG. 4, a method of adhering a double-sided adhesive tape to the back surface of the substrate and bonding the substrate to the lower surface of the revolution stage 1 or a method of fixing with a screw or the like has been adopted.

However, electromagnetic attraction has a disadvantage that leads to an increase in the size of the apparatus. In the method of mounting on the notch, the position where the substrate is placed on the stage is fixed, so that the position where the substrate is placed is changed (offset). Therefore, the composition cannot be changed or the film thickness distribution cannot be improved. In addition, in the tape fixing method, offset is possible, but the adhesive residue of the tape remains on the back surface, the subsequent cleaning process is complicated, and the adhesive residue remaining on the stage contaminates the inside of the chamber, It leads to deterioration of film quality, which is not preferable. Further, it is necessary to press the substrate surface for fixing the tape, and there is a disadvantage that the substrate surface that should be cleaned is soiled.
JP 2000-239833 A

  The present invention provides a simple substrate fixing device capable of forming an offset film without contaminating the substrate in the deposition-up type sputter deposition.

  In a deposition-type sputter deposition system, a fixture that consists of a substrate fixing part that prevents the substrate from falling and a magnet part that can fix the substrate anywhere on the substrate stage even when the substrate is mounted face down is used. It is what.

  The present invention makes it possible to provide a simple substrate fixing device capable of forming an offset film without contaminating the substrate in the deposition-up type sputter deposition. As a result, the substrate cleaning process can be simplified, contamination can be prevented, contamination in the chamber can be prevented, and the film composition and film thickness distribution can be improved.

  Hereinafter, embodiments of the present invention will be described in detail.

  FIG. 1 shows a well-known deposition-up type high-frequency sputter deposition apparatus, and a vacuum chamber is provided with a sputtering gas supply system for supplying a sputtering gas, for example, Ar gas, and an exhaust system for evacuating, The inside of the vacuum chamber is set to a predetermined pressure by controlling the supply amount of the sputtering gas and the exhaust speed of the vacuum exhaust. In the upper part of the vacuum chamber, a plurality of substrates 2 are horizontally installed on the lower surface of the revolution stage 1 (only one is shown in FIG. 1). A sputtering target 3 is provided in the lower part of the container so as to face the stage. A high frequency power source is connected to the cathode electrode from outside the vacuum chamber via a matching circuit.

In such a depot-up type high-frequency sputter deposition apparatus, first, when high-frequency power from a high-frequency power source is applied to the cathode electrode, Ar gas is ionized or excited in the vacuum chamber to generate Ar ⁺ ions. Next, when a DC voltage is applied to the substrate electrode from a DC power source, Ar ⁺ ions are irradiated onto the substrate 2 while arbitrarily controlling the kinetic energy, and the surface of the substrate 2 is sputtered. Therefore, the adsorbed gas on the surface of the substrate 2 is desorbed and the surface of the substrate 2 is cleaned. Thereafter, sputtering is performed with the target 3Ar ⁺ ions to form a high-quality film on the substrate 2.

  FIG. 2 shows a method for fixing the substrate. A substrate holder 10 for holding a substrate is composed of a substrate fixing member 7 and a substrate holding magnet 8. The substrate fixing member 7 is provided with a slide 9 for fixing the substrate 2, and the slide 9 is formed by a screw. It is fixed to the fixing member 7. Accordingly, the substrate 2 is placed on the substrate fixing member 7 and is fixed to the substrate fixing member 7 after the slide 9 is slid and held in a non-moving state. In order to ensure the fixation of the substrate, it is preferable to provide a plurality of, for example, 3 to 6, slides 9.

  FIG. 3 shows details of the substrate holder 10. A magnet 8 is fixed to the substrate fixing member 7 constituting the substrate holder 10, and the substrate is fixed to the opposite side of the magnet by the method shown in FIG. The substrate 2 can be fixed at an arbitrary position on the rotation (revolution) stage by moving the substrate fixing member. The size, strength, and the like of the magnet 8 can be changed as appropriate.

  SUMMARY OF THE INVENTION The present invention provides a simple substrate fixing device capable of forming an offset film without contaminating the substrate in deposit-up type sputter deposition. As a result, the substrate cleaning process can be simplified, contamination can be prevented, contamination in the chamber can be prevented, and the film composition and film thickness distribution can be improved.

Schematic diagram of deposition-up type sputter deposition equipment Explanatory drawing of the board | substrate fixing member which concerns on this invention Enlarged view of the substrate fixing part according to the present invention Illustration of conventional board fixing method with double-sided adhesive tape

Explanation of symbols

1 Revolving Stage 2 Substrate 3 Target 4 RF Power Supply 5 Matching Circuit 6 Substrate Fixing Member 7 Substrate Holding Magnet 8 Substrate Holder 9 Slide

Claims (4)

  In a deposition-type sputter deposition apparatus in which a film forming material source and a rotating stage for holding a substrate above are provided in the lower part of the hermetic container, and a surface to be processed of the substrate is disposed downward, the substrate is a substrate. A depot-up type wherein the substrate holder is held by the holder, and the substrate holder includes a substrate fixing member for preventing the substrate from dropping and a substrate holding magnet for fixing the substrate to an arbitrary position of the stage. Sputter deposition equipment.   2. The deposition-type sputter deposition apparatus according to claim 1, wherein a plurality of the substrate holders are provided on the stage.   3. The deposition up-type sputter deposition apparatus according to claim 1, wherein the substrate is fixed to the substrate fixing member by a slide. The deposition apparatus according to claim 3, wherein a plurality of the slides are provided.

Images