JP2005307123A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2005307123A5 JP2005307123A5 JP2004129786A JP2004129786A JP2005307123A5 JP 2005307123 A5 JP2005307123 A5 JP 2005307123A5 JP 2004129786 A JP2004129786 A JP 2004129786A JP 2004129786 A JP2004129786 A JP 2004129786A JP 2005307123 A5 JP2005307123 A5 JP 2005307123A5
- Authority
- JP
- Japan
- Prior art keywords
- compound
- meth
- group
- acrylate
- curable composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Description
本発明は、二塩基酸無水物基を有する化合物（ａ１）に、水酸基含有（メタ）アクリレート（ａ２）を付加して得られるカルボキシル基含有化合物（Ａ）であって２個以上の（メタ）アクリロイル基を有する化合物、およびエポキシ基含有化合物（Ｂ）を含み、実質的に溶剤を含まない硬化性組成物、それを硬化してなる硬化物品、およびその硬化性組成物を硬化してなる硬化被膜を有する物品にある。 The present invention is a carboxyl group-containing compound (A) obtained by adding a hydroxyl group-containing (meth) acrylate (a2) to a compound (a1) having a dibasic acid anhydride group, and having two or more (meth) A curable composition containing an acryloyl group- containing compound and an epoxy group-containing compound (B) and substantially free of a solvent, a cured article obtained by curing the same, and a cured product obtained by curing the curable composition In an article with a coating.
本発明に用いる化合物（Ａ）は、化合物（ａ１）に化合物（ａ２）を付加して得られる、分子内にカルボキシル基と２個以上の（メタ）アクリロイル基とを有する化合物であり、本発明の組成物に熱硬化性と活性エネルギー線硬化性とを付与する成分である。
しかも、化合物（Ａ）は低粘度であるため、有機溶剤を用いることなく、塗工時の作業
環境や塗工作業性を良好とし、かつ本発明の組成物を低粘度とするための成分である。
The compound (A) used in the present invention is a compound having a carboxyl group and two or more (meth) acryloyl groups in the molecule, obtained by adding the compound (a2) to the compound (a1). It is a component which provides thermosetting property and active energy ray curability to the composition.
Moreover, since the compound (A) has a low viscosity, it is a component for improving the working environment and coating workability during coating without using an organic solvent, and for reducing the viscosity of the composition of the present invention. is there.
この化合物（Ａ）は、光硬化性が良好であることから、分子内に２個以上の（メタ）アクリロイル基を有する（メタ）アクリレートである。
また、エポキシ基との熱硬化性が良好であることから、化合物（Ａ）は分子内に２個以上のカルボキシル基を有する（メタ）アクリレートであることが好ましい。
The compound (A), et al. Can photohardenable is good, Ru (meth) acrylate der having two or more (meth) acryloyl groups in the molecular.
Moreover, since the thermosetting property with an epoxy group is favorable, it is preferable that a compound (A) is a (meth) acrylate which has a 2 or more carboxyl group in a molecule | numerator.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004129786A JP2005307123A (en) | 2004-04-26 | 2004-04-26 | Curable composition, cured article and article |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004129786A JP2005307123A (en) | 2004-04-26 | 2004-04-26 | Curable composition, cured article and article |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2005307123A JP2005307123A (en) | 2005-11-04 |
| JP2005307123A5 true JP2005307123A5 (en) | 2007-06-14 |
Family
ID=35436249
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004129786A Pending JP2005307123A (en) | 2004-04-26 | 2004-04-26 | Curable composition, cured article and article |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2005307123A (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4947905B2 (en) * | 2005-02-04 | 2012-06-06 | 株式会社日本触媒 | Resin composition for optical semiconductor encapsulation |
| US7723404B2 (en) * | 2006-04-06 | 2010-05-25 | Ppg Industries Ohio, Inc. | Abrasion resistant coating compositions and coated articles |
| JP5248071B2 (en) * | 2006-09-26 | 2013-07-31 | 株式会社日本触媒 | Resin composition for optical semiconductor encapsulation |
| JP5700903B2 (en) * | 2007-07-31 | 2015-04-15 | 日揮触媒化成株式会社 | Base material with hard coat film and coating liquid for forming hard coat film |
| WO2010007859A1 (en) * | 2008-07-18 | 2010-01-21 | Dic株式会社 | Epoxy resin composition, cured product thereof, method for producing cured product, optical semiconductor sealing material, and optical semiconductor device |
| JP5397265B2 (en) * | 2010-02-25 | 2014-01-22 | Ｄｉｃ株式会社 | Epoxy resin composition, cured product thereof, optical semiconductor sealing resin composition, optical semiconductor device, fiber reinforced composite material, and fiber reinforced resin molded product |
| JP2011190310A (en) * | 2010-03-12 | 2011-09-29 | Dic Corp | Method for producing acryl (meth)acrylate resin composition |
| JP6412813B2 (en) * | 2015-02-25 | 2018-10-24 | 富士フイルム株式会社 | Polarizing plate protective film, polarizing plate, image display device, and manufacturing method of polarizing plate protective film |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61101526A (en) * | 1984-10-23 | 1986-05-20 | Toyobo Co Ltd | Curable resin composition |
| JPH04251744A (en) * | 1991-01-29 | 1992-09-08 | Dainippon Ink & Chem Inc | Manufacture of laminated board and epoxy resin composition |
-
2004
- 2004-04-26 JP JP2004129786A patent/JP2005307123A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2005087822A1 (en) | Liquid composition containing no solvent | |
| CN104974594B (en) | The ink composite of a kind of water-soluble solvent, its application and printed circuit board (PCB) | |
| WO2009019979A1 (en) | Photocurable composition | |
| JP2010513699A5 (en) | ||
| JP2016505668A5 (en) | ||
| CA2637455A1 (en) | Curing agents for epoxy-functional compounds | |
| ATE382668T1 (en) | RADIATION CURED COMPOSITIONS | |
| JP2011013486A5 (en) | ||
| JP2009084398A5 (en) | ||
| ATE491761T1 (en) | HIGH SOLID CONTENT UV CURABLE COATING COMPOSITIONS | |
| JP2005307123A5 (en) | ||
| BRPI0917176A2 (en) | silane / urea compound as heat activatable hardener for epoxy resin compositions | |
| JP2007016191A5 (en) | ||
| JP2007171812A5 (en) | ||
| JP2007510772A5 (en) | ||
| JP2008007555A5 (en) | ||
| JPH0735433B2 (en) | Epoxy amine composition using unsaturated imides | |
| JP2012520277A5 (en) | ||
| JP5495087B2 (en) | Active energy ray curable composition, active energy ray curable coating and active energy ray curable printing ink using the same | |
| TW200801802A (en) | Curable composition and cured product thereof | |
| JP6117547B2 (en) | Thermosetting composition, cured film and color filter | |
| CN104403515A (en) | Preparation method for attapulgite-loaded photosensitizer and UV-curable paint | |
| JP2003522229A5 (en) | ||
| JP4095380B2 (en) | Method for producing (meth) acrylate compound and method for producing resin composition | |
| JP2008133439A5 (en) |