JP2005302598A - Enameled wire and insulating coating used for it - Google Patents

Enameled wire and insulating coating used for it Download PDF

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JP2005302598A
JP2005302598A JP2004118958A JP2004118958A JP2005302598A JP 2005302598 A JP2005302598 A JP 2005302598A JP 2004118958 A JP2004118958 A JP 2004118958A JP 2004118958 A JP2004118958 A JP 2004118958A JP 2005302598 A JP2005302598 A JP 2005302598A
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enameled wire
insulating
conductor
insulating film
resin
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JP4041471B2 (en
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Kazunori Suzuki
和則 鈴木
Kenji Asano
健次 浅野
Shigeharu Masubuchi
重春 増渕
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Hitachi Cable Ltd
Hitachi Magnet Wire Ltd
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Hitachi Magnet Wire Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide an inexpensive enameled wire with high reliability of an insulating coating in the vicinity of a welding part in welding; and to provide an insulating coating used for it. <P>SOLUTION: This enameled wire 10 has an insulating coating composed of at least two insulating layers around a conductor 11. The enameled wire is so formed that the innermost insulating layer 13 immediately above the conductor 11 is formed of a polyimide coating; the outermost insulating layer 14 is formed of a polyamide-imide coating; and adhesion strength between the conductor 11 and the insulting layer 13 is set above 40 g/mm. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、モータやトランスなどの電気機器に用いるエナメル線及びそれに用いる絶縁塗料に関するものである。   The present invention relates to an enameled wire used for an electric device such as a motor or a transformer and an insulating paint used therefor.

一般的に、エナメル線は、導体の周りに絶縁塗料からなる絶縁皮膜を設けてなる。このエナメル線を使用して電気機器、例えばモータやトランスなどを作製する場合、一般的にはモータのコア(磁芯)のスロットに連続的にエナメル線をコイル状に巻回して形成したり、或いはエナメル線をコイル状に巻いたものをコアのスロットに嵌合、挿入したりする方法が主流であった。   Generally, an enameled wire is provided with an insulating film made of an insulating paint around a conductor. When using this enameled wire to make an electrical device such as a motor or a transformer, it is generally formed by winding the enameled wire continuously in a coil shape around the motor core (magnetic core) slot, Alternatively, a method in which an enameled wire wound in a coil shape is fitted and inserted into a slot of the core has been the mainstream.

一方、断面積の大きな(太サイズの)エナメル線や、平角導体を有するエナメル線の場合、エナメル線を連続的に巻いて巻き数の多い長尺のコイルを形成するのではなく、巻き数の少ない短尺の小径コイルを複数形成し、これら小径コイルのエナメル線端末を溶接して繋ぎ合わせ、長尺のコイルを形成する方法が提案されている。このように形成したコイルは、小型で、かつ、高密度の磁束が要求される電気機器のコイル、例えば自動車の発電機などのコイルに使用されている。   On the other hand, in the case of enameled wire with a large cross-sectional area (thick size) or enameled wire with a flat rectangular conductor, the enameled wire is not continuously wound to form a long coil with a large number of turns. A method has been proposed in which a plurality of small short-diameter coils are formed, and the enameled wire ends of these small-diameter coils are welded together to form a long coil. The coil formed in this way is used for a coil of an electric device that is small and requires a high-density magnetic flux, for example, a coil of an automobile generator or the like.

自動車の発電機などのコイルには、導体の周りにポリエステルイミドの絶縁皮膜を形成し、そのポリエステルイミド絶縁皮膜の周りにポリアミドイミドの絶縁皮膜を設けたダブルコート線や、導体の周りにポリアミドイミドの絶縁皮膜を設けたシングルコート線が主に使用されている。また、一部では、導体の周りにポリイミドの絶縁皮膜を形成し、そのポリイミド絶縁皮膜の周りにポリアミドイミドの絶縁皮膜を設け、耐熱性と機械強度を向上させたダブルコート線なども使用されている(例えば、特許文献1参照)。   For coils such as automobile generators, double-coated wires with a polyesterimide insulation film formed around the conductor and a polyamideimide insulation film around the polyesterimide insulation film, or polyamideimide around the conductor Single-coated wires with an insulating film are mainly used. In some cases, double-coated wires with a polyimide insulation film formed around the conductor and a polyamide-imide insulation film around the polyimide insulation film to improve heat resistance and mechanical strength are also used. (For example, refer to Patent Document 1).

特開平5−130759号公報Japanese Patent Laid-Open No. 5-130759

ところで、自動車の発電機などのコイルでは、前述した短尺の各小径コイルのエナメル線端末を溶接する場合、TIG溶接やヒュージングといった電気的な溶接方法を用いることが主流である。   By the way, in a coil of an automobile generator or the like, when welding the enameled wire terminal of each of the short coils described above, it is a mainstream to use an electric welding method such as TIG welding or fusing.

TIG溶接やヒュージングを行う際、各コイルの溶接部は、銅を溶解させるために、銅の融点である1084℃以上に加熱される。この熱は溶接部近傍の絶縁皮膜にも伝わるため、絶縁皮膜も急激に加熱されることとなる。   When performing TIG welding or fusing, the welded portion of each coil is heated to 1084 ° C. or higher, which is the melting point of copper, in order to dissolve copper. Since this heat is also transmitted to the insulating film in the vicinity of the welded portion, the insulating film is also rapidly heated.

この時、前述した従来のポリエステルイミドとポリアミドイミドの絶縁皮膜とからなるダブルコート線や、ポリアミドイミド皮膜からなるシングルコート線では、溶接に伴う高温により、絶縁皮膜が熱分解してガスが生じたり、絶縁皮膜に吸湿されていた水分や絶縁皮膜の焼き付け後においても皮膜中に残留(残存)していた溶剤成分が急激に気化したりする。その結果、これらの熱分解ガスや気化ガスにより、絶縁皮膜が導体表面から押し上げられ、導体から剥離して浮き上がってしまったり(以下、皮膜浮きと表す)、ブリスタと呼ぶような発泡が生じたりする(以下、ブリスタ発生と表す)ため、電気機器の信頼性が低下するという問題があった。   At this time, in the conventional double-coated wire made of the polyesterimide and polyamideimide insulating film and the single-coated wire made of the polyamideimide film, the insulating film is thermally decomposed and gas is generated due to the high temperature caused by welding. The moisture absorbed in the insulating film and the solvent component remaining (residual) in the film after the baking of the insulating film are rapidly vaporized. As a result, the insulating film is pushed up from the surface of the conductor by these pyrolysis gas and vaporized gas, and is peeled off from the conductor and floats (hereinafter referred to as film floating), or foaming called a blister occurs. Therefore, there is a problem that the reliability of the electrical equipment is lowered.

一方、これらポリエステルイミド樹脂やポリアミドイミド樹脂よりも耐熱性の高いポリイミド樹脂の皮膜と、ポリアミドイミド樹脂の皮膜とからなるダブルコート線では、ポリイミド樹脂が高価なため、高価なエナメル線となってしまうという問題があった。また、導体と絶縁皮膜との密着性が悪いために、皮膜浮きが発生し易いという問題があった。   On the other hand, a double-coated wire composed of a polyimide resin film and a polyamideimide resin film, which have higher heat resistance than those of the polyesterimide resin and polyamideimide resin, is expensive and therefore becomes an expensive enameled wire. There was a problem. Moreover, since the adhesion between the conductor and the insulating film is poor, there is a problem that the film is liable to float.

以上の事情を考慮して創案された本発明の目的は、端末溶接時における溶接部近傍の絶縁皮膜の信頼性が高いエナメル線及びそれに用いる絶縁塗料を提供することにある。   An object of the present invention, which was created in view of the above circumstances, is to provide an enameled wire with high reliability of an insulating film in the vicinity of a welded portion at the time of terminal welding and an insulating paint used therefor.

上記目的を達成すべく本発明に係るエナメル線は、導体の周りに少なくとも2層の絶縁層で構成される絶縁皮膜を有するエナメル線において、上記導体直上の最内絶縁層がポリイミド皮膜で、最外絶縁層がポリアミドイミド皮膜で構成され、導体と最内絶縁層との密着強度を40g/mm以上に形成したものである。   In order to achieve the above object, the enameled wire according to the present invention is an enameled wire having an insulating film composed of at least two insulating layers around a conductor, wherein the innermost insulating layer directly above the conductor is a polyimide film, The outer insulating layer is composed of a polyamideimide film, and the adhesion strength between the conductor and the innermost insulating layer is 40 g / mm or more.

ここで、最内絶縁層の300〜400℃での線膨張係数が5×10-4/℃以下であることが好ましい。また、100重量部のポリイミド樹脂に対して少なくとも0.1重量部の密着性向上剤を混合してなる混合樹脂で最内絶縁層を構成することが好ましい。さらに、最内絶縁層の層厚と絶縁皮膜全体の層厚との比が0.05以上であることが好ましい。 Here, it is preferable that the linear expansion coefficient of the innermost insulating layer at 300 to 400 ° C. is 5 × 10 −4 / ° C. or less. Moreover, it is preferable to comprise an innermost insulating layer with mixed resin formed by mixing at least 0.1 part by weight of an adhesion improver with 100 parts by weight of polyimide resin. Furthermore, it is preferable that the ratio between the thickness of the innermost insulating layer and the thickness of the entire insulating film is 0.05 or more.

一方、本発明に係るエナメル線に用いる絶縁塗料は、エナメル線の絶縁層を構成する絶縁塗料において、絶縁塗料の樹脂分として、100重量部のポリイミド樹脂に対して少なくとも0.1重量部の密着性向上剤を混合してなる混合樹脂を含むものである。   On the other hand, the insulating paint used for the enameled wire according to the present invention is an insulating paint constituting the enameled wire insulating layer, and as a resin component of the insulating paint, at least 0.1 part by weight of 100 parts by weight of polyimide resin is adhered. It contains a mixed resin formed by mixing a property improver.

また、本発明に係るエナメル線に用いる絶縁塗料は、エナメル線の絶縁層を構成する絶縁塗料において、絶縁塗料の樹脂分として、エナメル線の導体と絶縁層との密着強度を40g/mm以上とすべく、ポリイミド樹脂と密着性向上剤とを所定の割合で混合してなる混合樹脂を含むものである。   Moreover, the insulating paint used for the enameled wire according to the present invention is an insulating paint constituting the insulating layer of the enameled wire, and the adhesion strength between the conductor of the enameled wire and the insulating layer is 40 g / mm or more as a resin component of the insulating paint. Preferably, it includes a mixed resin obtained by mixing a polyimide resin and an adhesion improver at a predetermined ratio.

本発明によれば、エナメル線の端末を溶接する際、溶接部近傍の絶縁皮膜において良好な耐熱性、溶接性が得られるという優れた効果を発揮する。   According to the present invention, when an end of an enameled wire is welded, an excellent effect is obtained that good heat resistance and weldability can be obtained in an insulating film near the welded portion.

以下、本発明の好適一実施の形態を添付図面に基づいて説明する。   DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, a preferred embodiment of the invention will be described with reference to the accompanying drawings.

本発明者らが、エナメル線の端末を溶接する際、溶接部近傍における皮膜浮きや、ブリスタ発生を抑制すべく、鋭意研究した結果、以下のことを見出した。   When the present inventors welded the end of an enameled wire, as a result of earnest research to suppress film floating and blister generation in the vicinity of the weld, the following was found.

(1) 絶縁皮膜を構成する材料としては、耐熱性が高く、熱分解しづらいものを用いることが必要である。このような材料としては、ポリイミド(以下、PIと表す)、ポリアミドイミド(以下、PAIと表す)が挙げられる。特に、最も熱負荷の大きな導体直上の最内絶縁層は、最も耐熱性に優れたPI樹脂が最適である。また、最外絶縁層は、耐熱性が高く、かつ、巻線時などの加工を受けた際に傷が生じにくく、耐傷性に優れたPAI樹脂が最適である。   (1) As a material constituting the insulating film, it is necessary to use a material that has high heat resistance and is difficult to be thermally decomposed. Examples of such a material include polyimide (hereinafter referred to as PI) and polyamideimide (hereinafter referred to as PAI). In particular, for the innermost insulating layer directly on the conductor having the largest heat load, the PI resin having the highest heat resistance is optimal. For the outermost insulating layer, a PAI resin that has high heat resistance and is less likely to be damaged when subjected to processing such as winding is optimal.

(2) 絶縁皮膜を構成する材料としては、導体に対する密着強度が高いものを用いることが必要である。これは、導体と絶縁皮膜との密着強度が、導体から絶縁皮膜が剥離する力(又は浮き上がる力)よりも高いと、皮膜浮きや、ブリスタ発生を抑制できるためである。   (2) It is necessary to use a material having a high adhesion strength to the conductor as the material constituting the insulating film. This is because when the adhesion strength between the conductor and the insulating film is higher than the force (or the lifting force) at which the insulating film peels from the conductor, film floating and blister generation can be suppressed.

(3) 絶縁皮膜を構成する材料としては、高温時の熱変形が小さい材料、すなわち線膨張係数が小さい材料を用いることが必要である。これは、溶接時に絶縁皮膜が急激な熱を受けた際、熱変形が小さい方が、皮膜浮きや、ブリスタ発生を抑制できるためである。   (3) As a material constituting the insulating film, it is necessary to use a material having a small thermal deformation at a high temperature, that is, a material having a small coefficient of linear expansion. This is because when the insulating film receives rapid heat during welding, the smaller the thermal deformation, the more the film floating and blister generation can be suppressed.

以上、(1)〜(3)を踏まえ、本発明者らが、更に検討を続けた結果、最外層となる絶縁皮膜には、巻線時などの加工を受けた際に傷が生じにくく、耐傷性に優れたPAIを用い、最内層となる絶縁皮膜には、導体に対する密着強度を高く調整したPIを用いることで、皮膜浮きや、ブリスタ発生を抑制することが可能になるということを見出した。   As described above, based on (1) to (3), as a result of further investigations by the present inventors, the insulating film as the outermost layer is less likely to be damaged when subjected to processing such as winding, We have found that PAI with excellent scratch resistance and the innermost insulating film, PI, which has a high adhesion strength to the conductor, can be used to suppress film floating and blistering. It was.

本発明の好適一実施の形態に係るエナメル線の横断面図を図1に示す。   A cross-sectional view of an enameled wire according to a preferred embodiment of the present invention is shown in FIG.

図1に示すように、本実施の形態に係るエナメル線10は、導体11の周りに少なくとも2層(図1中では2層)の絶縁層13,14で構成される絶縁皮膜を有するものである。より具体的には、絶縁皮膜は、導体11の直上に設けられ、導体11に対する密着強度を40g/mm以上、好ましくは70g/mm以上、より好ましくは85g/mm以上に調整したPI樹脂の皮膜で構成される内層(最内絶縁層)13と、PAI樹脂の皮膜で構成される外層(最外絶縁層)14とで構成される。内層13及び外層14は一体に(又はほぼ一体に)形成される。また、内層13と外層14との密着性(一体性)を更に向上すべく、内層13と外層14との間に密着性向上層(図示せず)を設けてもよい。   As shown in FIG. 1, the enameled wire 10 according to the present embodiment has an insulating film composed of at least two insulating layers 13 and 14 around a conductor 11 (two layers in FIG. 1). is there. More specifically, the insulating film is provided immediately above the conductor 11, and the PI resin film whose adhesion strength to the conductor 11 is adjusted to 40 g / mm or more, preferably 70 g / mm or more, more preferably 85 g / mm or more. And an outer layer (outermost insulating layer) 14 formed of a PAI resin film. The inner layer 13 and the outer layer 14 are formed integrally (or substantially integrally). In order to further improve the adhesion (integration) between the inner layer 13 and the outer layer 14, an adhesion improving layer (not shown) may be provided between the inner layer 13 and the outer layer 14.

本実施の形態に係るエナメル線10においては、導体11と絶縁皮膜(内層13)との密着強度がより強い(高い)方が好ましい。これは、導体11と内層13との密着強度がより高い方が、ブリスタ発生を抑制する効果が大きくなるからである。しかし、導体11の周りに、PI樹脂単体からなる絶縁皮膜を形成した場合、40g/mm以上の密着強度を確保することは困難である。そこで、導体11と内層13との密着強度を40g/mm以上に向上させるべく、導体11直上の内層13を構成するPI樹脂の絶縁塗料中に、密着性向上剤と呼ばれる添加剤が添加、混合される。導体11と内層13との密着強度を40g/mm以上としたのは、密着強度が40g/mm未満だと、絶縁皮膜の皮膜浮きや、ブリスタ発生を抑制する効果が小さくなるためである。   In the enameled wire 10 according to the present embodiment, it is preferable that the adhesion strength between the conductor 11 and the insulating film (inner layer 13) is stronger (higher). This is because the higher the adhesion strength between the conductor 11 and the inner layer 13, the greater the effect of suppressing the generation of blisters. However, when an insulating film made of a single PI resin is formed around the conductor 11, it is difficult to ensure an adhesion strength of 40 g / mm or more. Therefore, in order to improve the adhesion strength between the conductor 11 and the inner layer 13 to 40 g / mm or more, an additive called an adhesion improver is added and mixed in the insulating coating of PI resin constituting the inner layer 13 immediately above the conductor 11. Is done. The reason why the adhesion strength between the conductor 11 and the inner layer 13 is 40 g / mm or more is that when the adhesion strength is less than 40 g / mm, the effect of suppressing the floating of the insulating film and the generation of blisters is reduced.

密着性向上剤としては、導体11と内層13との密着強度を向上させる作用を奏するものであれば特に限定するものではなく、例えば、
ブチル化メラミン樹脂等のメラミン樹脂類、
トリアルキルアミン等のアミン類、
メルカプトベンズイミダゾールなどのメルカプタン類、
ポリカルボジイミド樹脂類、
などが挙げられる。また、2種類以上の密着性向上剤を併用して添加するようにしてもよい。
The adhesion improver is not particularly limited as long as it has an effect of improving the adhesion strength between the conductor 11 and the inner layer 13, for example,
Melamine resins such as butylated melamine resin,
Amines such as trialkylamine,
Mercaptans such as mercaptobenzimidazole,
Polycarbodiimide resins,
Etc. Two or more types of adhesion improvers may be added in combination.

絶縁塗料のPI樹脂分に対する密着性向上剤の添加割合は、密着性向上効果が十分に得られ、かつ、絶縁塗料の安定性、内層13の線膨張係数、エナメル線10の可とう性などの特性に悪影響を及ぼさない範囲であれば、特に規定するものではない。例えば、密着性向上剤としてブチル化メラミン樹脂を用いる場合、PI樹脂分100重量部に対して、少なくとも0.1重量部、好ましくは0.3重量部以上、より好ましくは0.6重量部以上添加すればよい。   The ratio of addition of the adhesion improver to the PI resin content of the insulating paint is sufficient to obtain the effect of improving adhesion, and the stability of the insulating paint, the linear expansion coefficient of the inner layer 13, the flexibility of the enameled wire 10, etc. There is no particular limitation as long as it does not adversely affect the characteristics. For example, when a butylated melamine resin is used as an adhesion improver, it may be added at least 0.1 parts by weight, preferably 0.3 parts by weight or more, more preferably 0.6 parts by weight or more with respect to 100 parts by weight of the PI resin.

また、内層13の300℃〜400℃における線膨張係数は5×10-4/℃以下、好ましくは2.5×10-4/℃以下とされる。300℃〜400℃における線膨張係数を5×10-4/℃以下としたのは、線膨張係数が5×10-4/℃より大きいと、絶縁皮膜の皮膜浮きや、ブリスタ発生を抑制する効果が小さくなるためである。 The linear expansion coefficient of the inner layer 13 at 300 ° C. to 400 ° C. is 5 × 10 −4 / ° C. or less, preferably 2.5 × 10 −4 / ° C. or less. The reason why the linear expansion coefficient at 300 to 400 ° C is set to 5 × 10 -4 / ° C or less is that when the linear expansion coefficient is greater than 5 × 10 -4 / ° C, the insulation film floats and blisters are suppressed. This is because the effect is reduced.

さらに、内層13の層厚と絶縁皮膜全体(内層13+外層14)の層厚との比は、特に規定するものではないが、0.05以上、好ましくは0.10以上、より好ましくは0.15以上とされる。この場合、内層13の層厚と絶縁皮膜全体の層厚との比が0.05より小さくなると、例えば、内層13の層厚が2μmより薄くなると、皮膜浮きや、ブリスタ発生を抑制する効果が小さくなるためである。   Further, the ratio between the layer thickness of the inner layer 13 and the layer thickness of the entire insulating film (inner layer 13 + outer layer 14) is not particularly specified, but is 0.05 or more, preferably 0.10 or more, more preferably 0.15 or more. In this case, if the ratio of the layer thickness of the inner layer 13 to the layer thickness of the whole insulating film is smaller than 0.05, for example, if the layer thickness of the inner layer 13 is smaller than 2 μm, the effect of suppressing film floating and blistering is reduced. Because.

本実施の形態で言う内層13を構成するPI樹脂と密着性向上剤との混合樹脂は、導体11と絶縁皮膜(内層13)との密着強度が40g/mm以上の絶縁フィルムを作製可能なものである。また、混合樹脂は、300℃〜400℃における線膨張係数が5×10-4/℃以下の絶縁フィルムを作製可能であることがより好ましい。さらに、混合樹脂は、層厚が約2μmの極薄の絶縁フィルムを作製可能であるものがより好ましい。この混合樹脂の絶縁塗料を導体11に塗布、焼き付けしてなる絶縁皮膜が内層13である。 The mixed resin of the PI resin constituting the inner layer 13 and the adhesion improver referred to in this embodiment can produce an insulating film having an adhesion strength between the conductor 11 and the insulating film (inner layer 13) of 40 g / mm or more. It is. The mixed resin is more preferably capable of producing an insulating film having a linear expansion coefficient of 5 × 10 −4 / ° C. or less at 300 ° C. to 400 ° C. Further, it is more preferable that the mixed resin is capable of producing an extremely thin insulating film having a layer thickness of about 2 μm. The inner layer 13 is an insulating film formed by applying and baking this insulating resin paint on the conductor 11.

本実施の形態で言うPI樹脂の絶縁塗料は、通常塗料の状態ではポリアミド酸溶液になっており、本溶液を導体に塗布した後、ダイスで絞って塗布厚を均一にし、その後、焼付炉にて焼成することによりポリアミド酸が閉環してPI樹脂絶縁皮膜となる。PI樹脂絶縁塗料としては、芳香族テトラカルボン酸二無水物と芳香族ジアミンとを極性溶媒中で反応させて得られた塗料が最も一般的であり、PIの化学構造については特に規定するものではない。   Insulating paint of PI resin referred to in this embodiment is usually a polyamic acid solution in the state of paint, and after this solution is applied to a conductor, it is squeezed with a die to make the coating thickness uniform, and then applied to a baking furnace. By firing, the polyamic acid is closed and a PI resin insulating film is formed. As the PI resin insulating paint, a paint obtained by reacting an aromatic tetracarboxylic dianhydride and an aromatic diamine in a polar solvent is most common, and the chemical structure of PI is not particularly specified. Absent.

芳香族テトラカルボン酸二無水物として代表的なものは、
ピロメリット酸二無水物、
ベンゾフェノンテトラカルボン酸二無水物等がある。
A typical aromatic tetracarboxylic dianhydride is:
Pyromellitic dianhydride,
Examples include benzophenone tetracarboxylic dianhydride.

芳香族ジアミンとして代表的なものは、
4,4'−ジアミノジフェニルメタン、
4,4'−ジアミノジフェニルエーテル等がある。
Typical aromatic diamines are:
4,4′-diaminodiphenylmethane,
4,4'-diaminodiphenyl ether and the like.

市販のPI樹脂絶縁塗料としては、デュポン社製のPyre ML、東レ社製のトレニース#3000等が挙げられる。   Examples of commercially available PI resin insulating paints include Pyre ML manufactured by DuPont and Trenys # 3000 manufactured by Toray.

一方、本実施の形態で言うPAI樹脂の絶縁塗料としては、トリメリット酸無水物と4,4'−ジフェニルメタンジイソシアネートとを極性溶媒中で加熱反応させて得られた塗料が最も一般的であり、PAIの化学構造については特に規定するものではない。   On the other hand, as the PAI resin insulating paint referred to in the present embodiment, a paint obtained by heating and reacting trimellitic anhydride and 4,4′-diphenylmethane diisocyanate in a polar solvent is most common. The chemical structure of PAI is not particularly specified.

市販のPAI樹脂絶縁塗料としては、日立化成工業社製のHI-404やHI-406等が挙げられる。   Examples of commercially available PAI resin insulation paints include HI-404 and HI-406 manufactured by Hitachi Chemical.

導体11の構成材としては、エナメル線導体として慣用的に用いられているものであれば全て適用可能であり、特に限定するものではないが、Cu又はCu合金が好ましい。また、導体11の断面形状についても、特に限定するものではなく、円形導体、平角導体などのようにいずれであってもよい。さらに、導体11の断面積(サイズ)についても、特に限定するものではなく、エナメル線導体として慣用的に用いられているものであれば全て適用可能である。   As a constituent material of the conductor 11, any material that is conventionally used as an enameled wire conductor can be applied, and although not particularly limited, Cu or a Cu alloy is preferable. Further, the cross-sectional shape of the conductor 11 is not particularly limited, and may be any one such as a circular conductor or a flat conductor. Furthermore, the cross-sectional area (size) of the conductor 11 is not particularly limited, and any conductor that is conventionally used as an enameled wire conductor can be applied.

次に、本実施の形態の作用を説明する。   Next, the operation of the present embodiment will be described.

本実施の形態に係るエナメル線10は、絶縁皮膜として、PI樹脂で構成され、導体11に対する密着強度を40g/mm以上に調整した内層13と、PAI皮膜で構成される外層14とを有している。また、内層13の300℃〜400℃における線膨張係数は5×10-4/℃以下に調整されている。これによって、絶縁皮膜は、導体11に対する密着強度が高く、耐熱性が高く、熱分解しづらいものとなり、かつ、高温時の熱変形が小さくなる。その結果、エナメル線10の端末を溶接して繋ぎ合わせる際、溶接に伴う高温により絶縁皮膜が熱分解してガスが生じたり、絶縁皮膜に吸湿されていた水分や絶縁皮膜の焼き付け後においても皮膜中に残留(残存)していた溶剤成分が急激に気化したりしても、溶接部近傍の絶縁皮膜における皮膜浮きや、ブリスタ発生を抑制することができる。 The enameled wire 10 according to the present embodiment includes an inner layer 13 made of PI resin and having an adhesion strength with respect to the conductor 11 adjusted to 40 g / mm or more as an insulating film, and an outer layer 14 made of a PAI film. ing. The linear expansion coefficient of the inner layer 13 at 300 ° C. to 400 ° C. is adjusted to 5 × 10 −4 / ° C. or less. As a result, the insulating film has a high adhesion strength to the conductor 11, has high heat resistance, is difficult to be thermally decomposed, and reduces thermal deformation at high temperatures. As a result, when the ends of the enameled wire 10 are welded together, the insulating film is thermally decomposed due to the high temperature associated with the welding to generate gas, or even after moisture or moisture absorbed in the insulating film is baked. Even if the solvent component that remains (residual) vaporizes abruptly, it is possible to suppress film floating and blister generation in the insulating film near the weld.

よって、本実施の形態に係るエナメル線10を用いて巻き数の少ない短尺の小径コイルを複数形成し、これら小径コイルのエナメル線端末を溶接して繋ぎ合わせてなる長尺のコイルで構成される電気機器においては、高い信頼性が得られる。   Therefore, a plurality of short small-diameter coils having a small number of turns are formed by using the enameled wire 10 according to the present embodiment, and the enameled wire terminals of these small-diameter coils are welded and joined together to form a long coil. In electrical equipment, high reliability can be obtained.

以上、本発明は、上述した実施の形態に限定されるものではなく、他にも種々のものが想定されることは言うまでもない。   As described above, the present invention is not limited to the above-described embodiment, and it goes without saying that various other things are assumed.

次に、本発明について、実施例に基づいて説明するが、本発明はこの実施例に限定されるものではない。   Next, although this invention is demonstrated based on an Example, this invention is not limited to this Example.

(実施例1)
ポリイミドa(トレニース#3000,東レ社製;以下、PIaと表す)塗料の樹脂分100重量部に対して密着性向上剤A(ブチル化メラミン樹脂)を1重量部添加し、絶縁塗料を得た。
(Example 1)
1 part by weight of adhesion improver A (butylated melamine resin) was added to 100 parts by weight of the resin content of polyimide a (Trenice # 3000, manufactured by Toray Industries, Inc .; hereinafter referred to as PIa) to obtain an insulating paint. .

この絶縁塗料を、導体寸法が1.5×2.5mm、R部面取り半径が0.6mmの平角形状の銅導体上に塗布した後、熱風循環式堅型焼付炉により焼き付けを行い、皮膜厚さが10μmの内層絶縁皮膜を設けた。この内層絶縁皮膜の周りに、ポリアミドイミド(HI-404,日立化成工業社製;以下、PAIと表す)塗料単体を塗布した後、焼き付けを行い、皮膜厚さが30μmの外層絶縁皮膜を設けた。これによって、絶縁皮膜全体の厚さが40μmの2層耐熱エナメル線を作製した。   After applying this insulating paint on a rectangular copper conductor with a conductor size of 1.5 x 2.5 mm and a chamfer radius of R part of 0.6 mm, it is baked in a hot air circulation type solid baking furnace, and the film thickness is 10 μm. An inner layer insulating film was provided. A polyamideimide (HI-404, manufactured by Hitachi Chemical Co., Ltd .; hereinafter referred to as PAI) coating was applied around the inner insulating film and then baked to provide an outer insulating film with a film thickness of 30 μm. . Thereby, a two-layer heat-resistant enameled wire having a total thickness of 40 μm was produced.

(実施例2)
PIa塗料の代わりにポリイミドb(Pyre ML,デュポン社製;以下、PIbと表す)塗料を用いる以外は、実施例1と同様にして、2層耐熱エナメル線を作製した。
(Example 2)
A two-layer heat-resistant enamel wire was produced in the same manner as in Example 1 except that polyimide b (Pyre ML, manufactured by DuPont; hereinafter referred to as PIb) paint was used instead of the PIa paint.

(実施例3)
酸成分としてピロメリット酸二無水物、ジアミン成分として4,4'−ジアミノジフェニルメタン及び4,4'−ジアミノジフェニルエーテルを、モル比で2対1対1となるように溶媒(2-メチルピロリドン)中に溶解した。この溶液を攪拌し、反応させることによりポリイミドc(以下、PIcと表す)塗料を作製した。
Example 3
Pyromellitic dianhydride as the acid component and 4,4'-diaminodiphenylmethane and 4,4'-diaminodiphenyl ether as the diamine component in a solvent (2-methylpyrrolidone) in a molar ratio of 2 to 1 to 1 Dissolved in. This solution was stirred and reacted to prepare a polyimide c (hereinafter referred to as PIc) paint.

PIa塗料の代わりにPIc塗料を用いる以外は、実施例1と同様にして、2層耐熱エナメル線を作製した。   A two-layer heat-resistant enameled wire was produced in the same manner as in Example 1 except that PIc paint was used instead of PIa paint.

(実施例4)
内層絶縁皮膜の厚さが5μm、外層絶縁皮膜の厚さが35μmである以外は、実施例1と同様にして、2層耐熱エナメル線を作製した。
Example 4
A two-layer heat-resistant enameled wire was produced in the same manner as in Example 1 except that the thickness of the inner insulating film was 5 μm and the thickness of the outer insulating film was 35 μm.

(実施例5)
内層絶縁皮膜の厚さが2μm、外層絶縁皮膜の厚さが38μmである以外は、実施例1と同様にして、2層耐熱エナメル線を作製した。
(Example 5)
A two-layer heat-resistant enameled wire was produced in the same manner as in Example 1 except that the thickness of the inner insulating film was 2 μm and the thickness of the outer insulating film was 38 μm.

(実施例6)
PIa塗料の樹脂分100重量部に対する密着性向上剤Aの配合割合を0.5重量部とする以外は、実施例1と同様にして、2層耐熱エナメル線を作製した。
Example 6
A two-layer heat-resistant enameled wire was produced in the same manner as in Example 1 except that the blending ratio of the adhesion improver A to 100 parts by weight of the PIa paint was 0.5 parts by weight.

(実施例7)
PIa塗料の樹脂分100重量部に対する密着性向上剤Aの配合割合を0.2重量部とする以外は、実施例1と同様にして、2層耐熱エナメル線を作製した。
(Example 7)
A two-layer heat-resistant enameled wire was prepared in the same manner as in Example 1 except that the blending ratio of the adhesion improver A with respect to 100 parts by weight of the resin of the PIa paint was 0.2 parts by weight.

(実施例8)
密着性向上剤Aの代わりに密着性向上剤B(メルカプトベンズイミダゾール)を用いる以外は、実施例1と同様にして、2層耐熱エナメル線を作製した。
(Example 8)
A two-layer heat-resistant enamel wire was produced in the same manner as in Example 1 except that the adhesion improver B (mercaptobenzimidazole) was used instead of the adhesion improver A.

(比較例1)
内層絶縁皮膜を構成する絶縁塗料中に密着性向上剤Aを全く添加しない、つまり内層絶縁皮膜の樹脂分をPIa単体で構成する以外は、実施例1と同様にして、2層耐熱エナメル線を作製した。
(Comparative Example 1)
A two-layer heat-resistant enameled wire is formed in the same manner as in Example 1 except that the adhesion improver A is not added at all to the insulating coating constituting the inner insulating film, that is, the resin component of the inner insulating film is composed of PIa alone. Produced.

(比較例2)
内層絶縁皮膜を構成する絶縁塗料として、実施例1のPAI塗料の樹脂分100重量部に対して密着性向上剤Aを1重量部添加した塗料を用いる以外は、実施例1と同様にして、2層耐熱エナメル線を作製した。
(Comparative Example 2)
As in Example 1, except that the insulating paint constituting the inner layer insulating film is a paint obtained by adding 1 part by weight of the adhesion improver A to 100 parts by weight of the resin content of the PAI paint of Example 1. A two-layer heat-resistant enameled wire was produced.

実施例1〜8及び比較例1,2の各エナメル線について、導体と絶縁皮膜(内層)との密着強度を求めた。   For each of the enameled wires of Examples 1 to 8 and Comparative Examples 1 and 2, the adhesion strength between the conductor and the insulating film (inner layer) was determined.

導体と絶縁皮膜との密着強度測定は以下の方法で行った。先ず、各エナメル線を製造した後、各エナメル線から約5cmの長さの試料片をそれぞれ切り取った。その後、各試料片の上面又は下面(幅が広い方の面のいずれか一方)の絶縁皮膜に、カッターなどを用いて、試料片の長手方向に延びる切り込みを1mm間隔で2本形成した。この切り込み間における絶縁皮膜の長手方向端部を、ピンセットなどを用いて導体から剥離させ、つかみ代を形成した。その後、各試料片を治具に固定すると共に、つかみ代をチャックで挟み、テンシロン万能試験機を用いて導体から絶縁皮膜を更に引き剥がした。この時、絶縁皮膜を1mm長さで剥がす時の剥離強度(密着強度)を測定した。   The adhesion strength between the conductor and the insulating film was measured by the following method. First, after each enamel wire was manufactured, a sample piece having a length of about 5 cm was cut from each enamel wire. Thereafter, two cuts extending in the longitudinal direction of the sample piece were formed at intervals of 1 mm on the insulating film on the upper surface or the lower surface (one of the wider surfaces) of each sample piece using a cutter or the like. The longitudinal ends of the insulating film between the cuts were peeled from the conductor using tweezers or the like to form a grip allowance. Thereafter, each sample piece was fixed to a jig, the gripping margin was sandwiched between chucks, and the insulating film was further peeled from the conductor using a Tensilon universal testing machine. At this time, the peel strength (adhesion strength) when the insulating film was peeled off with a length of 1 mm was measured.

また、実施例1〜8及び比較例1,2の各エナメル線について、内層の300〜400℃における線膨張係数を求めた。   Moreover, about each enamel wire of Examples 1-8 and Comparative Examples 1 and 2, the linear expansion coefficient in 300-400 degreeC of the inner layer was calculated | required.

具体的には、先ず、ガラス板上にそれぞれの内層を構成する絶縁塗料をキャスト(塗布)した後、恒温槽を用いて、80℃×20分、200℃×20分、300℃×10分という熱履歴で加熱して各絶縁塗料を硬化させ、厚さ30μmの絶縁フィルムを作製した。各絶縁フィルムを、幅2mm、チャック間長さ20mmとなるよう治具に取り付けた後、熱機械分析測定装置を用いて、引張荷重48mN、昇温速度10℃/分という条件で絶縁フィルムの伸びを測定し、300℃から400℃における平均線膨張係数を測定した。   Specifically, first, after coating (applying) the insulating paint constituting each inner layer on a glass plate, using a thermostatic bath, 80 ° C. × 20 minutes, 200 ° C. × 20 minutes, 300 ° C. × 10 minutes Each insulating coating was cured by heating with a heat history of 30 μm to produce an insulating film having a thickness of 30 μm. After each insulating film is mounted on a jig so that the width is 2 mm and the length between chucks is 20 mm, the insulating film is stretched using a thermomechanical analysis measuring device under the conditions of a tensile load of 48 mN and a heating rate of 10 ° C./min. Was measured, and the average linear expansion coefficient from 300 ° C. to 400 ° C. was measured.

さらに、実施例1〜8及び比較例1,2の各エナメル線について、TIG溶接後の外観評価を行った。   Furthermore, the external appearance evaluation after TIG welding was performed about each enameled wire of Examples 1-8 and Comparative Examples 1 and 2.

TIG溶接後の外観評価は以下の方法で行った。先ず、各エナメル線を製造した後、評価時の環境によるばらつきを考慮して、各エナメル線を40℃−95%RHの恒温恒湿槽内に30分間放置した。その後、恒温恒湿槽から各エナメル線を取り出して10分以内に、各エナメル線から約5cmの長さの試料片をそれぞれ切り取り、各試料片の一方の端末から4.5mmの長さに亘って絶縁皮膜を剥離した。各試料片の一方の端末の端部から2.5mmの所を、断面寸法が1.5mm×2.0mmのクロム銅製アース棒で挟み込み、また、各試料片の一方の端末の端部から1.25mmの所に、溶接トーチの先端位置を合わせ、TIG溶接機により通電を行った。通電条件は、通電電流40A、通電時間0.5秒とした。   Appearance evaluation after TIG welding was performed by the following method. First, after each enamel wire was manufactured, each enamel wire was allowed to stand in a constant temperature and humidity chamber of 40 ° C.-95% RH for 30 minutes in consideration of variations due to the environment at the time of evaluation. After that, within 10 minutes after taking out each enamel wire from the thermo-hygrostat, each sample piece of about 5 cm length is cut out from each enamel wire, and 4.5 mm long from one end of each sample piece. The insulating film was peeled off. Place 2.5 mm from the end of one end of each sample piece with a chrome-copper ground rod with a cross-sectional dimension of 1.5 mm x 2.0 mm, and place 1.25 mm from the end of one end of each sample piece. In addition, the tip position of the welding torch was aligned and energized by a TIG welder. The energization conditions were an energization current of 40 A and an energization time of 0.5 seconds.

外観の評価は、通電後の各試料片における通電部近傍の表面を目視で観察し、皮膜浮きやブリスタ発生がほとんど見られないものを良、皮膜浮きの試料片長手方向の長さが4mm未満で、発泡(ブリスタ)の径が1mm未満、かつ、その数が5個以下と少数のものをほぼ良、これ以上の皮膜浮きやブリスタ発生が見られるものを不良とした。   Appearance is evaluated by visually observing the surface in the vicinity of the current-carrying part of each sample piece after energization, and the film floating or blister generation is almost unobservable, and the length of the film floating in the longitudinal direction of the sample piece is less than 4 mm Thus, foams (blisters) with a diameter of less than 1 mm and a small number of foams of 5 or less were considered to be good, and those with more film floating or blistering were considered bad.

導体と絶縁皮膜との密着強度、内層の線膨張係数の測定結果、及びTIG溶接後の外観評価結果を表1に示す。   Table 1 shows the adhesion strength between the conductor and the insulating film, the measurement results of the linear expansion coefficient of the inner layer, and the appearance evaluation results after TIG welding.

Figure 2005302598
Figure 2005302598

表1に示すように、実施例1〜8の各エナメル線は、絶縁皮膜の内層を、PI樹脂と密着性向上剤とで構成している。   As shown in Table 1, each enameled wire of Examples 1 to 8 comprises an inner layer of an insulating film composed of a PI resin and an adhesion improver.

これによって、実施例1〜8の各エナメル線の、導体と絶縁皮膜との密着強度は45〜124g/mmとなり、いずれも規定範囲(40g/mm以上)を満足していた。また、実施例1〜8各エナメル線における内層の、300℃〜400℃での線膨張係数は5.9×10-5/℃〜1.8×10-4/℃となり、いずれも規定範囲(5×10-4/℃以下)を満足していた。特に、実施例1,4〜8の各エナメル線と比較例1のエナメル線とを比較することで、密着性向上剤の添加により、密着強度が高くなり、かつ、線膨張係数が更に小さくなることが確認できた。 Thus, the adhesion strength between the conductor and the insulating film of each enameled wire of Examples 1 to 8 was 45 to 124 g / mm, and all satisfied the specified range (40 g / mm or more). In addition, the linear expansion coefficient at 300 ° C. to 400 ° C. of the inner layer in each of the enamel wires in Examples 1 to 8 is 5.9 × 10 −5 / ° C. to 1.8 × 10 −4 / ° C., both of which are in the specified range (5 × 10 5 -4 / ° C or less). In particular, by comparing the enamel wires of Examples 1 and 4 to 8 with the enamel wire of Comparative Example 1, the adhesion strength is increased and the linear expansion coefficient is further reduced by the addition of the adhesion improver. I was able to confirm.

また、実施例1〜5,8の各エナメル線は、導体と絶縁皮膜との密着強度が70g/mm以上と非常に良好であった。さらに、実施例1,2,4〜8の各エナメル線は、300℃〜400℃での線膨張係数が9.0×10-5/℃以下と非常に良好であった。よって、実施例1,2,4,5,8の各エナメル線が、密着強度及び線膨張係数が共に非常に良好であり、より好ましい。このことから、導体と絶縁皮膜との密着強度は80g/mm以上がより好ましい。 In addition, each of the enamel wires of Examples 1 to 5 and 8 had very good adhesion strength between the conductor and the insulating film of 70 g / mm or more. Furthermore, each enamel wire of Examples 1, 2, 4 to 8 had a very good linear expansion coefficient at 300 ° C. to 400 ° C. of 9.0 × 10 −5 / ° C. or less. Therefore, the enameled wires of Examples 1, 2, 4, 5, and 8 are more preferable because both the adhesion strength and the linear expansion coefficient are very good. For this reason, the adhesion strength between the conductor and the insulating film is more preferably 80 g / mm or more.

これらの結果、実施例1〜8の各エナメル線は、その溶接部近傍における密着強度が十分に高く、耐熱性が十分で、熱分解しづらいものとなり、かつ、高温時に熱変形しにくいため、TIG溶接後の外観は良好又はほぼ良好であった。   As a result, each of the enamel wires of Examples 1 to 8 has sufficiently high adhesion strength in the vicinity of the welded portion, sufficient heat resistance, difficult to be thermally decomposed, and difficult to thermally deform at high temperatures. The appearance after TIG welding was good or almost good.

これに対して、密着性向上剤を混合させることなく、PIa単体で絶縁皮膜の内層を構成した比較例1のエナメル線は、300〜400℃における線膨張係数は9.1×10-5/℃と規定範囲を満足していたものの、密着強度が35g/mmと規定範囲未満であった。その結果、比較例1のエナメル線の絶縁皮膜は、耐熱性は十分であるものの、密着強度が不足しているため、溶接時に皮膜浮きや、ブリスタが発生してしまい、TIG溶接後の外観は不良であった。 On the other hand, the enameled wire of Comparative Example 1 in which the inner layer of the insulating film is composed of PIa alone without mixing the adhesion improver has a linear expansion coefficient of 9.1 × 10 −5 / ° C. at 300 to 400 ° C. Although the specified range was satisfied, the adhesion strength was 35 g / mm, which was less than the specified range. As a result, although the insulation film of the enameled wire of Comparative Example 1 has sufficient heat resistance, the adhesion strength is insufficient, so that the film floats and blisters are generated during welding, and the appearance after TIG welding is It was bad.

また、内層のベース樹脂をPI樹脂ではなく、PAI樹脂に密着性向上剤を添加した比較例2のエナメル線は、密着強度は58g/mmと規定範囲を満足していたものの、300〜400℃における線膨張係数が7.2×10-4/℃と規定範囲よりも大きかった。その結果、比較例2のエナメル線の絶縁皮膜は、密着強度は十分であるものの、PI樹脂よりも耐熱性の劣るPAI樹脂を用いているため、耐熱性が不足していると共に、高温時の熱変形が大きく、溶接時に皮膜浮きや、ブリスタが発生してしまい、TIG溶接後の外観は不良であった。 In addition, the enamel wire of Comparative Example 2 in which the adhesion improver was added to the PAI resin instead of the PI resin as the base resin of the inner layer had an adhesion strength of 58 g / mm, which satisfied the specified range, but was 300 to 400 ° C. The linear expansion coefficient was 7.2 × 10 −4 / ° C., which was larger than the specified range. As a result, although the enamel wire insulation film of Comparative Example 2 has sufficient adhesion strength, it uses a PAI resin that is inferior in heat resistance to the PI resin. Thermal deformation was large, and film floating and blistering occurred during welding, and the appearance after TIG welding was poor.

本発明の好適一実施の形態に係るエナメル線の横断面図である。It is a cross-sectional view of an enameled wire according to a preferred embodiment of the present invention.

符号の説明Explanation of symbols

10 エナメル線
11 導体
13 内層(最内絶縁層)
14 外層(最外絶縁層)
10 Enamelled wire 11 Conductor 13 Inner layer (innermost insulating layer)
14 Outer layer (outermost insulating layer)

Claims (6)

導体の周りに少なくとも2層の絶縁層で構成される絶縁皮膜を有するエナメル線において、上記導体直上の最内絶縁層がポリイミド皮膜で、最外絶縁層がポリアミドイミド皮膜で構成され、導体と最内絶縁層との密着強度を40g/mm以上に形成したことを特徴とするエナメル線。   In an enameled wire having an insulating film composed of at least two insulating layers around a conductor, the innermost insulating layer directly above the conductor is a polyimide film, and the outermost insulating layer is a polyamideimide film, An enameled wire having an adhesion strength with an inner insulating layer of 40 g / mm or more. 上記最内絶縁層の300〜400℃での線膨張係数が5×10-4/℃以下である請求項1記載のエナメル線。 The enameled wire according to claim 1, wherein the innermost insulating layer has a coefficient of linear expansion at 300 to 400 ° C of 5 × 10 -4 / ° C or less. 100重量部のポリイミド樹脂に対して少なくとも0.1重量部の密着性向上剤を混合してなる混合樹脂で上記最内絶縁層を構成した請求項1又は2記載のエナメル線。   The enameled wire according to claim 1 or 2, wherein the innermost insulating layer is composed of a mixed resin obtained by mixing at least 0.1 parts by weight of an adhesion improver with 100 parts by weight of a polyimide resin. 上記最内絶縁層の層厚と上記絶縁皮膜全体の層厚との比が0.05以上である請求項1から3いずれかに記載のエナメル線。   The enameled wire according to any one of claims 1 to 3, wherein a ratio of a layer thickness of the innermost insulating layer to a layer thickness of the entire insulating film is 0.05 or more. エナメル線の絶縁層を構成する絶縁塗料において、絶縁塗料の樹脂分として、100重量部のポリイミド樹脂に対して少なくとも0.1重量部の密着性向上剤を混合してなる混合樹脂を含むことを特徴とするエナメル線に用いる絶縁塗料。   The insulating paint constituting the enameled wire insulating layer includes a mixed resin obtained by mixing at least 0.1 part by weight of an adhesion improver with 100 parts by weight of polyimide resin as a resin component of the insulating paint. Insulating paint used for characteristic enameled wire. エナメル線の絶縁層を構成する絶縁塗料において、絶縁塗料の樹脂分として、エナメル線の導体と絶縁層との密着強度を40g/mm以上とすべく、ポリイミド樹脂と密着性向上剤とを所定の割合で混合してなる混合樹脂を含むことを特徴とするエナメル線に用いる絶縁塗料。
In the insulating paint constituting the enameled wire insulating layer, a polyimide resin and an adhesion improver are used as a resin component of the insulating paint so that the adhesion strength between the enameled wire conductor and the insulating layer is 40 g / mm or more. Insulating paint used for enameled wire, characterized by containing a mixed resin mixed at a ratio.
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JP2007234432A (en) * 2006-03-01 2007-09-13 Furukawa Electric Co Ltd:The Insulated electric wire, and rotating electric machine using it
JP2008259329A (en) * 2007-04-05 2008-10-23 Mitsubishi Electric Corp Insulating structure for coil portion of rotating electrical machine
JP2008305620A (en) * 2007-06-06 2008-12-18 Hitachi Cable Ltd Insulating electric wire
US20090286083A1 (en) * 2008-05-13 2009-11-19 Hitachi Cable, Ltd. Copper wire for a magnet wire, magnet wire using same, and method for fabricating copper wire for a magnet wire
JP2010023090A (en) * 2008-07-22 2010-02-04 Hitachi Cable Ltd Manufacturing method of copper wire for magnet wire, copper wire for magnet wire, and magnet wire
JP2010201505A (en) * 2009-02-03 2010-09-16 Hitachi Cable Ltd Casting material, method for producing the same, copper wire for magnet wire using the same, magnet wire and method for producing the same
US20130068500A1 (en) * 2010-06-03 2013-03-21 Ls Cable & System Ltd. Insulated wire
JP2015028106A (en) * 2013-07-30 2015-02-12 三井化学株式会社 Polyimide precursor varnish, polyimide resin, and use thereof
CN112592653A (en) * 2020-12-02 2021-04-02 江苏四达特材科技有限公司 Preparation method of high-temperature-resistant polyimide wire enamel

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JPH0745130A (en) * 1993-07-27 1995-02-14 Sumitomo Electric Ind Ltd Insulated wire
JPH08218007A (en) * 1995-02-09 1996-08-27 Sumitomo Electric Ind Ltd Insulating coating and insulating wire using the same
JPH10334735A (en) * 1997-06-02 1998-12-18 Sumitomo Electric Ind Ltd Polyimide insulating coating material and insulated wire

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JPH05130759A (en) * 1991-10-31 1993-05-25 Toshiba Corp Insulation method of rotary electric machine winding
JPH0745130A (en) * 1993-07-27 1995-02-14 Sumitomo Electric Ind Ltd Insulated wire
JPH08218007A (en) * 1995-02-09 1996-08-27 Sumitomo Electric Ind Ltd Insulating coating and insulating wire using the same
JPH10334735A (en) * 1997-06-02 1998-12-18 Sumitomo Electric Ind Ltd Polyimide insulating coating material and insulated wire

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007234432A (en) * 2006-03-01 2007-09-13 Furukawa Electric Co Ltd:The Insulated electric wire, and rotating electric machine using it
JP2008259329A (en) * 2007-04-05 2008-10-23 Mitsubishi Electric Corp Insulating structure for coil portion of rotating electrical machine
US7768162B2 (en) 2007-04-05 2010-08-03 Mitsubishi Electric Corporation Dynamoelectric coil portion insulating construction
JP2008305620A (en) * 2007-06-06 2008-12-18 Hitachi Cable Ltd Insulating electric wire
US20090286083A1 (en) * 2008-05-13 2009-11-19 Hitachi Cable, Ltd. Copper wire for a magnet wire, magnet wire using same, and method for fabricating copper wire for a magnet wire
JP2009297785A (en) * 2008-05-13 2009-12-24 Hitachi Cable Ltd Copper wire for magnet wire, method for producing copper wire for magnet wire, and magnet wire
JP2010023090A (en) * 2008-07-22 2010-02-04 Hitachi Cable Ltd Manufacturing method of copper wire for magnet wire, copper wire for magnet wire, and magnet wire
JP2010201505A (en) * 2009-02-03 2010-09-16 Hitachi Cable Ltd Casting material, method for producing the same, copper wire for magnet wire using the same, magnet wire and method for producing the same
US20130068500A1 (en) * 2010-06-03 2013-03-21 Ls Cable & System Ltd. Insulated wire
EP2579275A4 (en) * 2010-06-03 2015-12-09 Ls Cable Ltd Insulated electric wire
JP2015028106A (en) * 2013-07-30 2015-02-12 三井化学株式会社 Polyimide precursor varnish, polyimide resin, and use thereof
CN112592653A (en) * 2020-12-02 2021-04-02 江苏四达特材科技有限公司 Preparation method of high-temperature-resistant polyimide wire enamel

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