JP2005294651A - Plated circuit device and receiver - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a plated circuit device comprising a high frequency circuit in which the high frequency circuit and a functional circuit presenting a desired function are configured on an insulated substrate, so that a current to be consumed in another functional circuit does not flow to a circuit ground pattern of a ground pattern corresponding to said functional circuit and that a howling phenomenon or malfunction does not occur as a result. <P>SOLUTION: In a plated circuit device 1, a ground pattern 3 and a circuit ground pattern 17 corresponding to an oscillation/modulation circuit 8 are connected only in one spot, and an insulated area 22 is provided between the ground pattern 3 excepting for that connecting spot and the corresponding circuit ground pattern 17. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a substrate circuit device in which a plurality of electronic components are mounted on an insulating substrate, and a circuit that performs a plurality of desired functions is configured by connecting the mounted electronic components by a wiring pattern. In particular, a power supply circuit, two or more high-frequency circuits, and a functional circuit having a desired function are provided, and current consumed in each of the high-frequency circuit or the functional circuit invades another high-frequency circuit or the functional circuit. It is related with the board | substrate circuit apparatus which can avoid that an unnecessary signal component is mixed by.

The present invention further provides a power supply circuit, two or more high-frequency circuits, and a desired function by connecting a plurality of electronic components, each having a plurality of electronic components mounted on an insulating substrate, by a wiring pattern. The present invention relates to a communication device in which a functional circuit is configured, and further, a communication means is configured by each of those circuits, and in particular, a current consumed in each of the high frequency circuit or the functional circuit penetrates into another high frequency circuit or a functional circuit. Thus, the present invention relates to a communication device that can prevent unnecessary signal components from being mixed into communication means.
In addition, the communication apparatus said here means two, a transmission apparatus and a receiving apparatus.

In a circuit board device in which an electronic component is mounted on an insulating board and a circuit having a desired function is configured, the circuit often malfunctions due to external noise.
As a substrate circuit device configured to prevent malfunction of such a circuit, there is an invention described in the following document.

Japanese Patent Laid-Open No. 10-145031

  That is, in this publication, a low-impedance wiring pattern capable of absorbing noise from the outside of each circuit is arranged in each divided insulating region of the insulating substrate in which the electronic components constituting the circuit in the substrate circuit device correspond. An invention is disclosed in which external noise is absorbed by the low impedance wiring pattern and, as a result, circuit malfunction due to external noise is prevented.

  On the other hand, as a substrate circuit device including a conventional high-frequency circuit, a power supply pattern for supplying power and a circuit ground pattern of each circuit are connected by a bypass capacitor so that the power supply pattern and each circuit ground are connected. Each circuit has the same potential generated at the high frequency of the pattern, and each circuit ground pattern and ground pattern connection portion has a relatively wide wiring pattern to provide as many ground pattern connection portions as possible. The potential generated at the high frequency of the ground pattern is equal to that of the ground pattern, and each circuit is covered with the ground pattern in a plane to prevent radio waves generated by the high frequency circuit from entering the high frequency circuit or functional circuit from the space. The method was known.

  In the above publication, in a circuit board device comprising electronic components and wiring patterns so as to constitute a circuit having a desired function, a low impedance that can absorb noise in an insulating region that isolates the regions of each wiring pattern from each other. It is disclosed that a pattern electrode is disposed and external noise is absorbed by the disposed low impedance pattern electrode.

However, in a substrate circuit device provided with a high-frequency circuit and provided with a low-impedance pattern electrode using this method, when radio waves from the high-frequency circuit enter into other high-frequency circuits, functional circuits, etc. There arises a problem that radio waves associated therewith cannot be absorbed.
Therefore, in the substrate circuit device having such a configuration, the high-frequency circuit, the functional circuit, and the like receive a high-frequency radio wave generated by another high-frequency circuit from the space, resulting in a howling phenomenon and a malfunction.
Further, in the communication device in which the communication means is configured by the substrate circuit device having such a configuration, high-frequency radio waves are received from the space, and similarly, howling and malfunctions occur during use.

  On the other hand, for a substrate circuit device equipped with a conventional high-frequency circuit, a high-frequency power supply pattern and each circuit ground pattern are provided by interposing a bypass capacitor between the power supply pattern for supplying power and each circuit ground pattern. In addition, the circuit ground pattern and the ground pattern are provided by making the potentials generated at the same level and providing as many contact portions as possible between each circuit ground pattern and the ground pattern. There are known ones configured so that the potentials generated at the high frequency are equal.

In the substrate circuit device having such a configuration, it is possible to prevent radio waves emitted from other high-frequency circuits from entering the space with respect to the high-frequency circuit or the functional circuit.
In particular, in a so-called multi-layer board circuit device configured by stacking a plurality of board circuit devices in a layered manner, a power supply pattern and a signal pattern are arranged on the board circuit device arranged on the inner layer. In the case where it is provided, a shielding effect against high frequency is obtained by covering the outer layer of the substrate multilayer substrate circuit device itself with a ground pattern common to all circuits.

However, the substrate multilayer type substrate circuit device having such a configuration is configured by providing as many circuit ground patterns and ground pattern connection portions as possible.
Therefore, in such a configuration, when a circuit that handles a minute current or signal and a circuit that handles a relatively large current or signal are mixed and arranged, a circuit that handles a minute current or signal has a relatively large current or signal. There is a problem that an unnecessary signal (noise) is mixed with a target signal or malfunction occurs due to noise generated based on current consumption of a circuit that handles the signal.

  In addition, each circuit ground pattern and ground pattern connections are provided as many as possible, so the power supply circuit and multiple circuits include a circuit that modulates and demodulates, signals before and after modulation and demodulation, and others. If circuits that handle signals in different frequency bands are mixed, the current consumed by the circuit that handles signals before and after the modulation / demodulation and other signals in different frequency bands modulates / demodulates. As a result, there arises a problem that an unnecessary signal (noise) is mixed with a target modulation / demodulation signal.

  On the other hand, by reducing the number of connections between each circuit ground pattern and the ground pattern so that the current consumed by a specific circuit does not flow to the circuit ground pattern of another circuit, the above-described problem is solved. It can be avoided.

However, if the number of connection portions between each circuit ground pattern and the ground pattern common to all circuits is reduced, a potential difference due to a high frequency may occur between each circuit ground pattern and the ground pattern.
In such a case, a high frequency (radio wave) emitted from the high frequency circuit enters the other high frequency circuit or functional circuit from the space, and the high frequency causes another high frequency circuit or functional circuit to cause a howling phenomenon or malfunction.
That is, in the substrate circuit device including the high frequency circuit, the problem of howling phenomenon and malfunction still remains even if the above-described configuration is adopted.

Therefore, the substrate circuit device 1a provided with the high-frequency circuit and used in the communication device can be the one shown in FIG. 10 and FIG.
That is, the circuit circuit pattern 1a, the circuit ground pattern a of each circuit, and the connection portion of the ground pattern a common to all circuits are increased as much as possible, and each circuit ground pattern a is covered with the ground pattern a in a planar shape.

  However, in such a configuration, an oscillation / modulation circuit 8a (VCO: Voltage Control Oscillator) that handles a minute signal between the power supply circuit 4a and the reception audio amplifier circuit 12a that handles a relatively large current or signal. ) Is disposed, the current consumed by the reception audio amplifier circuit 12a flows through the ground pattern a of the oscillation / modulation circuit 6a, and an audio (low frequency) signal caused by the reception audio amplifier circuit 12a. Is mixed with the oscillation signal that is supposed to be unmodulated by the oscillation / modulation circuit a5 as a modulation, and as a result, a problem of howling at the audio frequency is likely to occur.

Here, it is considered that the factor causing such a problem is that the current consumed by the reception audio amplifier circuit 12a flows through the ground pattern of the oscillation / modulation circuit 8a.
Therefore, it is only necessary to make the current consumed by the reception audio amplifier circuit 12a difficult to flow through the ground pattern of the oscillation / modulation circuit 8a by switching the arrangement position of the power supply circuit 4a and the arrangement position of the oscillation / modulation circuit 8a. Can be considered.
However, in the board circuit device 1a including the high-frequency circuit, it is not possible to easily replace the arrangement positions between the circuits under the condition that the arrangement positions of the respective circuits are required along the signal flow. There's a problem.

In addition, if the arrangement position of a specific circuit is forcibly selected, as a result, if the pattern of the high frequency signal is routed longer than necessary, the high frequency signal will be reduced. In addition, there is a problem that an additional amplification stage has to be added, and there is a problem that performance is deteriorated.
Therefore, it is difficult to change the arrangement positions of specific circuits because it leads to redesign of the circuit. In addition, switching the positions of specific circuits does not necessarily solve all problems and provide a desired board circuit device.
10 and 11 will be described later in comparison with the characteristics of the present invention.

  The inventor of the present invention has devised in view of the above-described problems, and is equipped with a high-frequency circuit. For example, the current consumed by the reception audio amplifier circuit of the functional circuit does not flow through the ground pattern of the oscillation / modulation circuit. For example, the present inventors have invented a substrate circuit device in which an oscillation / modulation circuit of a high-frequency circuit functions normally and does not cause malfunction.

That is, the present invention prevents a current consumed by a certain functional circuit from flowing to a circuit ground pattern of another functional circuit, and as a result, a substrate circuit device having a high-frequency circuit that does not cause a howling phenomenon or malfunction. Is to provide.
Further, the present invention provides a communication device that includes the substrate circuit device having such a configuration and that does not have a howling phenomenon or malfunction during operation.

  The present invention relates to a substrate circuit device in which a circuit ground pattern corresponding to a ground pattern is connected only at one place, and an insulating region is provided between the ground pattern excluding the connection place and the corresponding circuit ground pattern. In addition, the communication device is configured to include such a substrate circuit device.

  One of the detailed configurations is an insulating substrate, a wiring pattern attached to the substrate for making a desired electrical connection and a ground pattern through which a reference potential current flows, and the wiring disposed on the substrate. A power supply circuit configured to supply power, at least two or more high-frequency circuits, and a functional circuit having a desired function, and the substrate corresponding to the power supply circuit, the high-frequency circuit, and the functional circuit. A circuit ground pattern disposed in each of the regions, and a current consumed by the high-frequency circuit or the functional circuit enters into a region of a circuit ground pattern corresponding to another high-frequency circuit or the functional circuit. In order to prevent this, the circuit ground pattern corresponding to the ground pattern is connected only at one place, and Insulating region between the circuit ground pattern response is a substrate circuit device in which is provided.

  In the substrate circuit device having such a configuration, even if the current consumed by the high-frequency circuit or the functional circuit attempts to enter the area of the corresponding circuit ground pattern, the circuit ground pattern corresponding to the ground pattern is connected only at one place. In addition, since an insulating region is provided between the ground pattern and the corresponding circuit ground pattern, the current consumed by the high-frequency circuit or the functional circuit does not flow into the ground pattern and enter the circuit ground pattern region. .

  The second detailed structure is an insulating substrate, a wiring pattern attached to the substrate for making a desired electrical connection and a ground pattern through which a reference potential current flows, and wiring arranged on the substrate. A power supply circuit that supplies power, a high-frequency circuit receiving circuit, a detection / demodulation circuit, an oscillation / modulation circuit, a PLL circuit, a reference oscillation circuit, and a reception audio amplifier that performs a desired function, which is configured with a pattern and a ground pattern A circuit, a CPU, and a circuit ground pattern, an antenna, an audio output unit, and an operation input unit, which are arranged in the area of the substrate corresponding to each circuit, and the high-frequency circuit or a desired function is provided. The current consumed by the playing circuit invades the area of the circuit ground pattern corresponding to another high-frequency circuit or a circuit that performs the desired function. The Guyo, circuit ground pattern corresponding to the ground pattern are connected only at one place, and a receiving apparatus configured insulating region is provided between the circuit ground pattern corresponding to the ground pattern.

  Three of the detailed configurations are: an insulating substrate, a wiring pattern attached to the substrate for making a desired electrical connection and a ground pattern through which a reference potential current flows, and the wiring disposed on the substrate. A power supply circuit configured to supply power, a transmission circuit that is a high-frequency circuit, an oscillation / modulation circuit, a PLL circuit, a reference oscillation circuit, a transmission audio amplifier circuit that performs a desired function, and a CPU, which are configured together with a pattern and a ground pattern; A circuit ground pattern, an antenna, a voice input unit, and an operation input unit, which are respectively disposed in the area of the substrate corresponding to each circuit, are provided and consumed by the high frequency circuit or a circuit having a desired function. To prevent the current from entering the area of the circuit ground pattern corresponding to the other high-frequency circuit or the circuit performing its desired function. Circuit ground pattern corresponding to the de pattern is connected only at one place, and a transmitting unit configured insulating region is provided between the circuit ground pattern corresponding to the ground pattern.

  In the receiving device and the transmitting device having such a configuration, in the circuit board device having the configuration requirements, the current consumed by the high frequency circuit or the circuit having a desired function does not flow into the ground pattern and enter the circuit ground pattern region. Therefore, there is no howling phenomenon caused by an electric signal and no noise is mixed in a desired signal.

The present invention is used for circuit forming means such as a substrate circuit device including a high-frequency circuit, and a power supply circuit for supplying power to the substrate circuit device or the like and a plurality of high-frequency circuits and functional circuits are mixedly arranged. When this occurs, the current consumed by the high-frequency circuit or functional circuit is prevented from entering the ground pattern area directly belonging to another high-frequency circuit or functional circuit, and unnecessary signal components are generated in the high-frequency circuit or functional circuit. It is a substrate circuit device that does not mix.
Further, the second and third inventions comprise the substrate circuit device having such a configuration, so that current consumed in the high-frequency circuit or a circuit having a desired function flows in the ground pattern, and the circuit ground pattern region. Therefore, it is a communication device in which noise is not mixed in a howling phenomenon by an electric signal or a desired signal.

Hereinafter, the best mode of the present invention will be described with reference to the drawings. However, the present invention is not limited by this form.
In recent years, a substrate circuit device including a high-frequency circuit has become more sophisticated in mounting technology, and a substrate circuit device having a double-sided substrate, a substrate circuit device having a so-called multilayer substrate structure having three or more mounting surfaces, and each circuit. 2. Description of the Related Art A substrate circuit device or the like that is configured to straddle both the front and back surfaces of a substrate is known. There is also known a substrate circuit device in which the shape of each circuit configured on an insulating substrate is not constant and is diversified depending on the purpose, and each electrode pattern is complicatedly connected through holes.
In order to facilitate understanding, the present invention corresponds to the substrate circuit device shown in FIG. 10 in the item “Problem to be Solved by the Invention” so as to facilitate understanding, and 1 shows a substrate circuit device in which each circuit is collected only on one side and each circuit is made into a rectangular shape.
In the substrate circuit device, the power line and signal line patterns, through holes, various components, etc. are not shown, and a power supply circuit, a plurality of functional circuits, and a ground pattern are shown.

  As shown in FIG. 1, the substrate circuit device 1 includes an insulating substrate 2, a wiring pattern (not shown), a ground pattern 3, a power supply circuit 4, a receiving circuit 5 that is a high-frequency circuit, Corresponding to the demodulation circuit 6, the antenna switch circuit 7, the oscillation / modulation circuit 8, the transmission circuit 9, the PLL circuit 10, the reference oscillation circuit 11, the reception voice amplification circuit 12 which is a functional circuit, and each of these circuits Circuit ground patterns 13, 14, 15, 16, 17, 18, 19, 20, and 21 are provided.

A ground pattern 3, a power supply circuit 4, a receiving circuit 5 as a high frequency circuit, a detection / demodulation circuit 6, an antenna switch circuit 7, an oscillation / modulation circuit 8, a transmission circuit 9, a PLL circuit 10, a reference oscillation circuit 11, and a functional circuit. A certain received audio amplifier circuit 12 is arranged on the substrate 2 in a substantially matrix form at almost equal intervals.
The insulating substrate 2 is made of a substantially rectangular sheet-like hard material or a foldable flexible material, and holds and holds the electronic components constituting each circuit, and the wiring pattern, the ground pattern 3 and the circuit. Ground patterns 13, 14, 15, 16, 17, 18, 19, 20, and 21 are provided.

The wiring pattern is used to configure the above-described circuit by electronic connection between the electronic components mounted and fixed on the insulating substrate 2 and to supply a driving current to each circuit.
The ground pattern 3 is for supplying a reference potential current, and the circuit ground patterns 13, 14, 15, 16, 17, 18, 19, 20, and 21 are respectively arranged in the region of the substrate 2 corresponding to each circuit. This is a ground pattern that directly belongs to each installed circuit.
As a method of attaching the wiring pattern, the ground pattern 3 and the circuit ground patterns 13, 14, 15, 16, 17, 18, 19, 20, and 21 to the insulating substrate 2, one is a so-called circuit printing method. Is mentioned.

The power supply circuit 4 supplies predetermined power to each circuit of the apparatus main body.
The receiving circuit 5 is one of high-frequency circuits, and receives a signal, removes an unnecessary signal from the received signal, amplifies the received signal, and further converts it to a lower frequency.
The detection / demodulation circuit 6 is one of high-frequency circuits, and further amplifies the signal sent from the reception circuit 5 and converts it to a lower low frequency to remove unnecessary signals and detect the detection means. Is used to demodulate the audio signal.

The antenna switch circuit 7 is one of high-frequency circuits, and functions as a switch that sends a reception signal received by an antenna (not shown) to the reception circuit 5 at the time of reception and sends a signal from the transmission circuit 9 to the antenna at the time of transmission. Is to do.
The oscillation / modulation circuit 8 is one of high-frequency circuits, and oscillates a local frequency for reception, oscillates a transmission frequency, and superimposes transmission sound on the signal as modulation.

The transmission circuit 9 is one of high-frequency circuits, and amplifies the transmission signal transmitted from the oscillation / modulation circuit 8 to a predetermined power and removes unnecessary signals.
The PLL circuit 10 is one of high-frequency circuits, and processes the signal output from the oscillation / modulation circuit 8 into a desired frequency based on the reference frequency output from the reference oscillation circuit 11.

The reference oscillation circuit 11 is one of high-frequency circuits, and generates a signal having a stable reference frequency even when the environmental temperature changes, and outputs the signal to the PLL circuit 10.
The reception voice amplification circuit 12 which is a functional circuit amplifies the power of the voice signal output from the detection / demodulation circuit 6 to a predetermined power.

  In the substrate circuit device 1, the current consumed by the PLL circuit 10 that is a high-frequency circuit or the reception audio amplifier circuit 12 that is a functional circuit corresponds to a circuit ground corresponding to the reception circuit 5 or the oscillation / modulation circuit 8 that is another high-frequency circuit. The circuit ground pattern 17 is connected to the ground pattern 3 only at one point so as to prevent entry into the area of the pattern 14 or the circuit ground pattern 17, and the other parts are insulated from the ground pattern 3. A region 22 is provided.

That is, as shown in FIG. 2, the circuit ground pattern of the oscillation / modulation circuit 8 has a substantially rectangular shape, and the circuit ground pattern 17 has an edge 23 on one side at a position facing the antenna switch circuit 7. Only connected to the ground pattern 3.
On the other hand, the edge 24 on one side of the oscillation / modulation circuit 8 facing the receiving circuit 5, the edge 25 of the oscillation / modulation circuit 8 facing the PLL circuit 10, and the received sound of the oscillation / modulation circuit 8. The edge 26 on one side at the position facing the amplifier circuit 12, that is, the U-shaped portion on the outer periphery of the oscillation / modulation circuit 8 is in an insulated state from the ground pattern 3.

The state of insulation of the oscillation / modulation circuit 8 is that various electrode patterns on the insulating substrate 2 are formed by laminating a conductive material on the substrate 2, and a circuit ground is formed when the various electrode patterns are formed. It is obtained by processing a part to be an insulating configuration with a pattern in advance so that the conductive layer is removed as a pattern.
The insulating region 22 is a strip having a width of about 0.1 to 1.0 mm.

Here, in the substrate circuit device 1, the oscillation / modulation circuit 8 and the reception audio amplification circuit 12 are expressed as blocks, and the connection between the oscillation / modulation circuit 8 and the reception audio amplification circuit 12 is expressed as an electric circuit in FIG. It will be shown.
On the other hand, what corresponds to FIG. 11 of the prior art is shown in FIG.
Since the power supply pattern is not shown in FIG. 1, the bypass capacitor interposed between the positive electrode side and the negative electrode side of each circuit is also omitted, but the oscillation / modulation circuit 8 in FIG. In the reception audio amplifier circuit 12, since the positive electrode side and the negative electrode side corresponding to the power supply pattern are illustrated, a bypass capacitor is illustrated correspondingly.
FIG. 3 also shows a bypass capacitor.

In the substrate circuit device 1 of the present invention shown in FIG. 2, the oscillation / modulation circuit 8 is connected to the ground pattern 3 at only one circuit ground pattern 17.
On the other hand, in the substrate circuit device 1a according to the prior art, the circuit / ground pattern 17a of the oscillation / modulation circuit 8a is connected to the ground pattern 3a at a plurality of portions in FIG.
Here, since the board circuit device 1 and the board circuit device 1a are configured as described above in terms of electrical connection, the oscillation / modulation circuit 10a of the board circuit device 1a is connected to the circuit ground pattern 17a connected to the ground pattern 3a. Since there is an exit, a part of the current consumed by the reception audio amplifier circuit 12a may flow into the circuit ground pattern 17a of the oscillation / modulation circuit 8a, but the oscillation / modulation circuit 8 of the substrate circuit device 1 is connected to the ground. Since only the entrance to the circuit ground pattern 17 common to the pattern 3 is present, the current consumed by the reception audio amplifier circuit 12 does not flow into the circuit ground pattern 17 of the oscillation / modulation circuit 8.

The substrate circuit device 1 is configured as described above. Here, the function of the substrate circuit device 1 will be described.
When a predetermined power source is connected to the circuit board device 1, a predetermined current is supplied from the power supply circuit 4 to the circuit via the wiring pattern.
Here, the substrate circuit device 1 is in an operating state, and each circuit receives the supply of a predetermined current and performs the above-described functions.

  Here, in the oscillation / modulation circuit 8, the reception voice amplification circuit 12 that is a functional circuit and a speaker (not shown) that is a load of the reception voice amplification circuit 12 consume current, and part of the current is oscillation and modulation circuit. The oscillation / modulation circuit 8 tries to enter through the circuit ground pattern 17 of 8. However, since the portion of the circuit ground pattern 17 facing the reception audio amplifier circuit 12, that is, the edge 25 is insulated as an insulating portion, part of the current consumption of the reception audio amplifier circuit 12 and the speaker is the circuit ground pattern. It does not flow to the oscillation / modulation circuit 8 via 17.

Therefore, since the circuit ground pattern 17 of the oscillation / modulation circuit 8 has such a configuration, the current consumed by the reception audio amplifier circuit 12 and the speaker does not enter the circuit ground pattern 17 of the oscillation / modulation circuit 8. 3 will flow to the power supply circuit 4 via 3.
Therefore, in the oscillation / modulation circuit 8, in the conventional configuration, an unnecessary audio (low frequency) signal is mixed as a modulation with respect to the oscillation signal generated by the oscillation / modulation circuit 8 due to the current from the reception audio amplification circuit 12. However, an unnecessary audio signal is not generated and mixed with the oscillation signal, and a desired unmodulated oscillation signal can be obtained.
Moreover, the board circuit device 1 does not cause the problem of howling at the audio frequency as a result. As a result, the problem of howling at the audio frequency does not occur.

Next, the FM radio transmission / reception device 100 having the substrate circuit device 1 will be described. That is, the FM radio transmission / reception device 100 is a communication device having both functions of a reception device and a transmission device, and includes the substrate circuit device 1 in the same state as described above.
As shown in FIG. 4, the FM radio transceiver 100 includes a power supply circuit 4, a reception circuit 5, a detection / demodulation circuit 6, an antenna switch circuit 7, an oscillation / modulation circuit 8, a transmission circuit 9, A PLL circuit 10, a reference oscillation circuit 11, a reception voice amplification circuit 12, a CPU 27 which is a central processing means incorporating a storage means (not shown), an operation input means 28 provided with a display means, and a voice output A speaker 29 as means, a transmission sound amplifier circuit 30 and a microphone 31 as sound input means are provided, and each circuit is connected as shown in the figure.

The FM radio transmission / reception device 100 is a simplex type radio device that uses a transmission function and a reception function alternately.
The operation input means 28 is a circuit that sends a transmission / reception switching signal generated by a user's manual operation to the CPU 27.
The speaker 29 is a load of the reception audio amplifier circuit 12 and mainly performs an audio output function during reception.
The microphone 31 functions only at the time of transmission, senses the sound (vibration sound) around the microphone 31 and converts it into an electric signal, and the electric signal is sent to the transmission sound amplifier circuit 30.

When the transmission audio amplifier circuit 30 receives the audio signal sent from the microphone 31, it amplifies it with a predetermined gain and then sends it to the oscillation / modulation circuit 8.
That is, the transmission audio amplifier circuit 30 and the microphone 31 are configured to function only at the time of transmission, and are in a function stop state at the time of reception.
Accordingly, the transmission audio amplifier circuit 30 and the microphone 31 are in a function stop state in the above-described reception state and do not affect the oscillation / modulation circuit 8.

Here, in the reception state of the FM radio transmission / reception device 100, an experiment was performed on the generation of noise and the like from the device itself.
First, the FM radio transmission / reception device 100, the reference FM radio transmission / reception device having the same configuration as the FM radio transmission / reception device 100 with the substrate circuit device 1a as a reference to the above-described substrate circuit device 1, and the standard signal generation A device was prepared.
Next, as shown in FIG. 5, a standard signal generator is connected to the front stage of the FM radio transceiver apparatus 100 and a 4Ω speaker is connected to the rear stage. Similarly, the standard signal generator apparatus is connected to the rear stage of the reference FM radio transceiver apparatus. 4Ω speakers were connected to each.
Here, the above-mentioned standard signal generator was set to a state where the frequency was 468.575 MHz, the output was 60 dBμV, and no modulation was applied, and an experiment on howling sound generation was performed.

Specifically, the volume level (not shown) for adjusting the output of the received audio amplifier circuit 12 is set to the minimum value in a state where the standard signal generator is connected to the FM radio transceiver 100 and the speaker with a load of 4Ω is connected to the FM. The generation of howling noise was measured by gradually increasing the value from 0%, which is 0, to 100%, which is the maximum value.
FM radio transmission / reception apparatus 100 did not show howling noise even when the volume was manipulated until the maximum volume reached 100%, as well as when the output was 0% to 100%. .
The detailed observation results are as shown in FIG.
That is, in FIG. 6, the horizontal axis indicates the time when the scale is 1 mS, and the vertical axis indicates the output voltage of the received voice where the scale is 2 V. In the experiment related to the FM radio transceiver 100, the output voltage Was in a state very close to 0 W, and a state in which almost no output voltage of the received voice was generated was observed.
From this, it was recognized that the FM radio transmitting / receiving apparatus 100 is in a normal operation because it is in a reception state of a reception signal that is not modulated.

On the other hand, for the reference FM radio transmission / reception apparatus, similarly, the reference volume (not shown) for adjusting the output of the corresponding reference reception audio amplifier circuit is slightly changed from 0% where the output is the minimum value to 100% where the output is the maximum value. The howling noise was measured by gradually increasing the speed.
The detailed observation results are as shown in FIG.
In the control FM radio transmission / reception apparatus, generation of howling sound was recognized when the output of the control volume was approximately 40%. At this time, the frequency of the howling sound was approximately 318 Hz, and the output was 4 W.
FIG. 7 shows the relationship of the standard audio output of the communication device with respect to the position of the audio volume of the communication device which is the FM wireless transmission / reception device 100 and the control FM wireless transmission / reception device.
The value of 4 W of the output of the communication device can be received as a sufficiently loud output that is annoying for communication.

On the other hand, when the control FM radio transmitter / receiver was tested with a dummy resistor having a resistance value of 4Ω instead of a speaker having a resistance value of 4Ω as a load, similarly, the output of the volume level was about 40% and the howling phenomenon occurred. Occurrence was observed.
Therefore, it can be determined that the howling occurring in the control FM radio transceiver apparatus is electrical howling (howling by an electric signal) and not acoustic howling.
The observation results were as shown in FIG. 13 on the same scale as in FIG. That is, the control FM radio transmission / reception device indicates that the output voltage of the received voice is 11.4 V (power is about 4 W).
Since this is the reception state of the received signal that has not been modulated, it was recognized that this was an abnormal operation (howling phenomenon).

Next, a reception signal obtained by modulating a reference FM radio transceiver with a voice of 318 Hz, which is a howling frequency, at a standard modulation level of ± 1.5 kHz is added to the radio, and the audio volume value and audio output of the radio are set. The relationship was examined by taking data.
The data of the relationship was as shown in FIG.
That is, in FIG. 7, when the value of the audio volume is 40%, the output is 4 W, and it is confirmed that it matches the output of the howling sound.

Indeed, in the control FM radio transmission / reception apparatus configured with the conventional board circuit device 1a, a howling phenomenon occurs when attempting to output an audio output of 4 W or more.
However, the FM radio transceiver 100 configured to include the substrate circuit device 1 of the present invention is originally in a state capable of outputting the maximum output of 5.5 W when the standard modulation signal is received. Nevertheless, since the received signal is not modulated, the audio output remains 0 W, and the possibility of the howling phenomenon is not recognized.

Furthermore, in order to determine the cause of the FM radio transceiver apparatus 100 of the present invention not causing the howling phenomenon, the 1ST. An experiment was conducted to investigate the function of local signals.
That is, as shown in FIG. 8, the FM radio transceiver 100 is connected to the standard signal generator in the front stage and the speaker having a resistance value of 8Ω is connected to the rear stage, and the 1ST. The local signal was taken out and observed with a spectrum analyzer.
In this experiment, the standard signal generator is set to a frequency of 468.575 MHz, an output of 60 dBμV, a modulation frequency of 1 kHz, and a modulation level of ± 2.5 kHz. The FM radio transmitting / receiving apparatus 100 receives the setting signal with a reception frequency of 468.575 MHz.

When the FM radio transceiver 100 has a speaker with a resistance of 8Ω as a load and the output of the audio volume is maximized (100%), 1ST. A local signal was observed.
The observation results are as shown in FIG.
That is, 1ST. It can be seen that there is very little modulation sound mixed with the local signal. When the C / N ratio at the 12.5 kHz off point was examined, the value was 73 dB.

On the other hand, as with the FM radio transceiver 100, experiments and observations were performed on the control FM radio transceiver configured with the conventional substrate circuit device 1a.
The observation result is as shown in FIG.
In other words, 1ST. It was recognized that a lot of modulated sounds were mixed in the local signal, and that there were clearly many compared to the case of the FM radio transceiver 100.
Further, since the channel separation is 12.5 kHz in the reference FM radio transceiver, when the C / N ratio at the point where the 12.5 kHz is off is examined, the value is 68 dB, which is compared with the case of the FM radio transceiver 100. It was found to be inferior by 5 dB. This value was not good but could be taken as bad.

Subsequently, in the same manner as described above for the FM radio transceiver apparatus 100, the value of the audio volume is set to the minimum (0%), and the 1ST. A local signal was observed.
That is, for the FM radio transmitting / receiving apparatus 100, the 1ST. When the local signal was observed, the result shown in FIG. 10 was obtained.
In FIG. 10, when the C / N ratio at the 12.5 kHz off point was examined, the value was 73 dB. This value is equivalent to the result shown in FIG. This means that the local signal is hardly influenced by the amount of audio amplification in the reception audio amplifier circuit.

Therefore, it was found that the FM radio transceiver 100 configured with the substrate circuit device 1 of the present invention has little influence on the local signal regardless of the value of the audio volume.
Therefore, in the reference FM radio transmission / reception apparatus configured with the conventional substrate circuit device, such as the adjacent channel selectivity and intermodulation characteristics, which are the performance of the radio, the performance of 5 dB is deteriorated depending on the value of the audio volume. However, in the FM radio transceiver 100 configured with the substrate circuit device 1 of the present invention, the adjacent channel selectivity and intermodulation characteristics are not deteriorated regardless of the value of the audio volume, and always the best. It can be received that it is possible to secure the received voice.

It is a configuration explanatory view for explaining the circuit configuration of the substrate circuit device according to the embodiment of the present invention. It is a principal part enlarged view of the board | substrate circuit apparatus shown in FIG. It is an electric circuit diagram of the principal part of the board | substrate circuit apparatus shown in FIG. It is a block diagram explaining the structure of the FM radio | wireless transmitter / receiver of the communication apparatus which is an embodiment of this invention. It is a block diagram explaining the conditions for calculating | requiring the characteristic of the FM radio | wireless transmitter / receiver shown in FIG. It is a graph which shows the relationship of the received audio | voice amplification voltage with respect to the elapsed time on the conditions shown in FIG. 5 of FM radio | wireless transmitter / receiver. It is a graph which shows the relationship of the output of the audio | voice with respect to the position of the audio volume in the conditions shown in FIG. 5 of the FM radio | wireless transmitter / receiver which is a communication apparatus, and the comparison FM radio | wireless transmitter / receiver. It is a block diagram explaining the conditions at the time of performing the reproduction experiment of the howling phenomenon by the audio | voice of FM radio | wireless transmitter / receiver shown in FIG. It is an observation figure which shows the relationship between the frequency of a speaker audio | voice, and an output when the howling phenomenon by the audio | voice under the conditions shown in FIG. 8 generate | occur | produces the FM radio | wireless transmitter / receiver shown in FIG. When the sound volume is maximum with a radio using the technology of the present invention, the 1st. It is an observation figure of a local signal. It is an observation figure of the speaker output which shows that the howling phenomenon by voice has not occurred. FIG. 2 is a view corresponding to FIG. 1 for explaining the configuration of a conventional substrate circuit device. FIG. 12 is a view corresponding to FIG. 3 for explaining an electric circuit of a main part of the conventional substrate circuit device shown in FIG. 11. FIG. 13 is a view corresponding to FIG. 6 illustrating characteristics of the FM wireless transmission / reception device of the communication device including the conventional substrate circuit device shown in FIG. 11. FIG. 9 is a diagram showing the relationship between the frequency of the speaker sound and the output when the howling phenomenon due to sound occurs in the FM radio transceiver apparatus of the communication apparatus having the conventional substrate circuit apparatus shown in FIG. 11 under the conditions shown in FIG. It is an equivalent figure.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1, 1a: Board | substrate circuit apparatus 2, 2a: Insulating board | substrate 3, 3a: Ground pattern 4, 4a: Power supply circuit 5, 5a: Reception circuit (high frequency circuit)
6, 6a: Detection / demodulation circuit (high frequency circuit)
7, 7a: Antenna switch circuit (high frequency circuit)
8, 8a: Oscillation / modulation circuit 9, 9a: Transmission circuit (high frequency circuit)
10, 10a: PLL circuit (high frequency circuit)
11, 11a: Reference oscillation circuit (high frequency circuit)
12, 12a: Received sound amplifier circuit (functional circuit)
17, 17a: Circuit ground pattern 22: Insulation region 100: FM radio transmission / reception device as a communication device

Claims (3)

An insulating substrate, a wiring pattern attached to the substrate for making a desired electrical connection and a ground pattern through which a reference potential current flows, and a wiring pattern and a ground pattern arranged on the substrate A power supply circuit for supplying power, at least two or more high-frequency circuits, and a functional circuit having a desired function, and each of the power supply circuit, the high-frequency circuit, and the functional circuit provided in the region of the substrate. A circuit ground pattern, and
The circuit ground pattern corresponding to the ground pattern is at one place so as to prevent the current consumed in the high frequency circuit or the functional circuit from entering the area of the circuit ground pattern corresponding to the other high frequency circuit or the functional circuit. Board circuit device in which an insulating region is provided between a ground pattern and a corresponding circuit ground pattern. An insulating substrate;
A wiring pattern attached to the substrate for making a desired electrical connection and a ground pattern through which a reference potential current flows;
A power supply circuit for supplying power, a high-frequency circuit receiving circuit, a detection / demodulation circuit, an oscillation / modulation circuit, a PLL circuit, a reference oscillation circuit, and the like, which are arranged on the substrate and configured with the wiring pattern and the ground pattern. A reception audio amplifier circuit that performs a desired function, a CPU, and
A circuit ground pattern disposed in each area of the substrate corresponding to each circuit;
An antenna,
Audio output means;
Operation input means is provided,
Corresponding to the ground pattern so as to prevent the current consumed by the high frequency circuit or the circuit having the desired function from entering the area of the circuit ground pattern corresponding to the other high frequency circuit or the circuit having the desired function The receiving device is configured such that the circuit ground pattern is connected only at one place, and an insulating region is provided between the ground pattern and the corresponding circuit ground pattern. An insulating substrate;
A wiring pattern attached to the substrate for making a desired electrical connection and a ground pattern through which a reference potential current flows;
A power supply circuit for supplying power, a high-frequency circuit, a transmission circuit, an oscillation / modulation circuit, a PLL circuit, a reference oscillation circuit, and a desired function, which are arranged on the substrate and configured with the wiring pattern and the ground pattern. A transmission audio amplifier circuit, a CPU,
A circuit ground pattern disposed in each area of the substrate corresponding to each circuit;
An antenna,
Voice input means;
Operation input means is provided,
Corresponding to the ground pattern so as to prevent the current consumed by the high frequency circuit or the circuit having the desired function from entering the area of the circuit ground pattern corresponding to the other high frequency circuit or the circuit having the desired function The transmission device is configured such that the circuit ground pattern is connected only at one place, and an insulating region is provided between the ground pattern and the corresponding circuit ground pattern.

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