JP2005294426A - Electrochemical device and electronic device using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electrochemical device that can sufficiently prevent a bad influence on a thin film laminated part in an electronic device, and to provide an electronic device using the same. <P>SOLUTION: An electric double-layer capacitor 100 is provided with a conductive package 2 having a lead terminal 2b, a conductive package 4 that is arranged opposite to the conductive package 2 and has a lead terminal 4b, a part 6 to be pinched that is pinched by the conductive packages 2 and 4, and an outermost layer 18 covering the conductive packages 2 and 4. The part 6 to be pinched is provided with electrodes 20 and 22 and an electrolyte that is formed therebetween, and the lead terminals 2b and 4b are partly and respectively exposed, and then the outermost layer 18 is made of a high-resistance material having a specific resistance of ≥1.0×10<SP>4</SP>Ω/cm and ≤1.0×10<SP>12</SP>Ω/cm. Even if a worker charged with static electricity fits the electric double-layer capacitor 100 to the electronic device having a thin-film laminated part, a flow of current from the worker to the thin-film laminated part can be sufficiently prevented. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an electrochemical element and an electronic device using the same.

  In an electronic device such as a hard disk device, in general, even when the power supply from the main power supply is cut off due to the stop of the device, the magnetic head is retracted to a lamp located away from the disk, or data on the disk is recorded. It is necessary to retreat (retract) to a shipping zone or CSS (Contact Start Stop) area where no operation is performed.

For this reason, in an electronic device such as a hard disk device, an auxiliary power source is usually built in, and as such an auxiliary power source, for example, an electric power source provided with an electric double layer capacitor is conventionally known (see, for example, Patent Document 1). . Here, in the electric double layer capacitor, a conductive member such as nickel is generally used as an outer case.
JP 2001-202144 A

  However, the electric double layer capacitor described above has the following problems.

  That is, when the electric double layer capacitor is installed in the hard disk device in the course of manufacturing the hard disk device incorporating the electric double layer capacitor, if the operator is charged with static electricity, the static electricity is There is a risk of being transmitted to the magnetic head through the multilayer capacitor. Here, the reading unit of the magnetic head includes a GMR (Giant Magneto-Resistance) element, and this GMR element is a thin film laminated part formed by laminating extremely thin films. For this reason, when static electricity is rapidly transmitted to the reading unit, the reading function may be adversely affected. In the worst case, the reading unit may be destroyed. The above problem is not limited to a hard disk device, and may occur during the manufacture of an electronic device having a thin film stacking unit, such as a PC card or an IC card.

  This invention is made | formed in view of the said situation, and it aims at providing the electrochemical element which can fully prevent the bad influence to the thin film laminated part in an electronic device, and an electronic apparatus using the same.

  As a result of intensive studies to solve the above problems, the present inventors have found that the above problems can be solved by the following invention, and have completed the present invention.

That is, the present invention provides a first conductive exterior body having a first lead terminal portion, and a second conductive exterior body disposed opposite to the first conductive exterior body and having a second lead terminal portion. A sandwiched portion sandwiched between the first conductive exterior body and the second conductive exterior body, and an outermost layer covering the first conductive exterior body and the second conductive exterior body And the sandwiched portion includes a pair of electrodes and an electrolyte provided between the pair of electrodes, and at least a part of the first lead terminal portion and the second lead terminal. At least part of the portion is exposed, and the outermost layer is made of a high resistance material having a specific resistance of 1.0 × 10 ⁴ Ωcm or more and 1.0 × 10 ¹² Ωcm or less. It is a chemical element.

  According to this electrochemical element, the following advantages can be obtained in the manufacturing process of the electronic device having the electrochemical element and the thin film laminated portion. That is, after the thin film stacking unit is installed, even if an electrostatically charged worker attaches the electrochemical element to the electronic device, the worker passes through the first conductive exterior body and the second conductive exterior body. Thus, it is possible to sufficiently prevent a current from flowing rapidly to the thin film laminated portion.

  In the electrochemical device, the sandwiched portion may further include a separator between the pair of electrodes.

The outermost layer includes an electrochemical element including the first conductive exterior body, the second conductive exterior body, and the sandwiched portion, at least a part of the first lead terminal portion, and the It is dipped in a paint containing a high resistance material having a specific resistance of 1.0 × 10 ⁴ Ωcm or more and 1.0 × 10 ¹² Ωcm or less and dried so that at least a part of the second lead terminal portion is exposed. It is preferable that it is obtained by this.

According to this electrochemical element, since the outermost layer is formed by immersing the electrochemical element body in the paint and drying, each of the first conductive exterior body and the second conductive exterior body is 1 It is sufficiently covered with a high resistance material having a specific resistance of 0.0 × 10 ⁴ Ωcm or more and 1.0 × 10 ¹² Ωcm or less. That is, it is possible to sufficiently prevent the first conductive exterior body and the second conductive exterior body from being exposed. For this reason, even when an electrostatically charged worker attaches the electrochemical element to an electronic device having a thin film stacking section, it is possible to more sufficiently prevent a rapid flow of current from the worker to the thin film stacking section. It becomes. In addition, since the outermost layer is formed by immersing the electrochemical element in the paint and drying, there is a gap between the first conductive outer body and the second conductive outer body and the outermost layer covering them. Formation is sufficiently prevented, and charge due to the gap is sufficiently prevented. For this reason, the rapid flow of the electric current to the thin film laminated part by the charged electric charge is fully prevented.

  In the said electrochemical element, it is preferable that the outermost layer is a sheet form and coat | covers each of the said 1st electroconductive exterior body and the said 2nd electroconductive exterior body via the adhesive bond layer. . In this case, since the outermost layer is in close contact with each of the first conductive outer package and the second conductive outer package by the adhesive layer, the outermost layer, the first conductive outer package, and the second conductive A gap is sufficiently prevented from being formed between the outer package and the charge due to the gap is sufficiently prevented. For this reason, the rapid flow of the electric current to the thin film laminated part by the charged electric charge is fully prevented.

In the electrochemical device, the high resistance material having a specific resistance of 1.0 × 10 ⁴ Ωcm or more and 1.0 × 10 ¹² Ωcm or less is, for example, an inorganic oxide such as alumina, magnesia, silica, titania, zirconia, It includes one selected from the group consisting of inorganic carbides such as silicon carbide and titanium carbide, and inorganic nitrides such as tantalum nitride, niobium nitride, and vanadium nitride.

The specific resistance of the high resistance material is more preferably 1.0 × 10 ⁴ Ωcm or more and 1.0 × 10 ¹⁰ Ωcm or less. The specific resistance of the high resistance material is more preferably 1.0 × 10 ⁴ Ωcm or more and 1.0 × 10 ⁶ Ωcm or less. As such a high resistance material, for example, magnesia, silica, titania, zirconia, silicon carbide, titanium carbide, tantalum nitride, niobium nitride, vanadium nitride, or the like can be used. When the specific resistance of the high resistance material is 1.0 × 10 ⁴ Ωcm or less, the movement of electric charges from the surface of the electrochemical element is abruptly generated and the surrounding electronic components tend to be destroyed. Further, when the specific resistance of the high resistance material is 1.0 × 10 ¹⁰ Ωcm or more, the charge tends to be more easily accumulated on the surface of the electrochemical element.

Polyimides and polyamides are widely used as exterior component materials for electronic components because of their high moisture blocking ability. However, since polyimide and polyamide generally have a high specific resistance of 10 ¹⁷ Ωcm to 10 ²² Ωcm, they tend to be charged up easily. In this case, a general-purpose polyimide or polyamide sheet can be used by adhering to the surfaces of the first and second conductive exterior bodies with a conductive adhesive. In this case, an adhesive having a specific resistance of 1.0 × 10 ⁴ Ωcm or more and 1.0 × 10 ¹⁰ Ωcm or less can be selected and used. That is, in this invention, the outermost layer includes an adhesive having a specific resistance of 1.0 × 10 ⁴ Ωcm or more and 1.0 × 10 ¹⁰ Ωcm or less, and a layer made of polyimide and polyamide or one of these. It is configured. For example, it is preferable to use an adhesive in which fillers such as graphite, aluminum, and tin are dispersed. Thereby, an electroconductive exterior body can be obtained, maintaining the water blocking ability of polyimide and polyamide.

  Further, those obtained by subjecting polyimide and polyamide to antistatic treatment can be suitably used as the outermost layer used in the present invention. As the antistatic treatment, a method of graphitizing a part of the surface by irradiation with energy such as an electron beam can be used. Alternatively, a structure in which a sulfonic acid group or a sulfinic acid group is introduced into the polymer skeleton may be used. Thereby, polyimide and polyamide have an antistatic structure. Also by these methods, it is possible to obtain a conductive exterior body while maintaining the water blocking ability of polyimide and polyamide. Such antistatic treated polyimide and polyamide may be processed into a sheet and bonded. In particular, polyimides and polyamides into which sulfonic acid groups or sulfinic acid groups are introduced may be dispersed in an appropriate solvent and applied. As the dispersion solvent, it is preferable to use a polar solvent such as water, alcohol or dimethylformamide.

  In the electrochemical device, the high-resistance material includes at least one selected from the group consisting of alumina, magnesia, silica, titania, silicon carbide, titanium carbide, tantalum nitride, niobium nitride, vanadium nitride, and zirconia, The outer layer is preferably a thin film.

  In this case, there is an advantage that the needs for light weight and space saving can be met as compared with the case where the outermost layer is not a thin film.

  In the present invention, the term “thin film” refers to a film that is difficult to stand independently in a room temperature and atmospheric pressure environment (that cannot maintain its shape without the assistance of a substrate). The thin film of the present invention preferably has a film thickness range of 2 μm to 100 μm. The film thickness of the high resistance material is more preferably 2 μm to 70 μm. In addition, the thickness of the high resistance material is more preferably 2 μm to 50 μm. When the film thickness is less than 2 μm, the actual resistance value becomes high as a whole or a part of the film, so that charge tends to be easily generated. Further, when the film thickness exceeds 100 μm, the internal stress (total stress) accumulated in the thin film becomes large, and therefore the thin film tends to be broken or peeled off. The internal stress (total stress) increases as the film thickness increases, but in the case of the present invention, if the film thickness is 100 μm or less, it is in a range where there is no practical problem.

  In addition, the present invention includes the above-described electrochemical element, and an electronic device main body having an accommodating part for accommodating the electrochemical element and a thin film stacking part, and the accommodating part includes a first lead constituting the electrochemical element. A connection terminal to be in contact with the terminal portion and the second lead terminal portion is provided, and the accommodating portion is provided on the surface side of the electronic device main body, so that the electrochemical element can be attached to and detached from the accommodating portion. The electronic device is housed.

  According to this electronic device, even when an electrostatically charged worker removes the electrochemical element from the housing of the electronic device main body to the outside of the electronic device main body, sufficient current flows from the worker to the thin film stacking portion. To be prevented.

  In the electronic device, the electrochemical element is preferably an electric double layer capacitor. In this case, as compared with the case where an electrochemical element other than the electric double layer capacitor is used, there are advantages that charging and discharging can be performed instantaneously and a high energy density can be obtained.

  In the electronic device, for example, the electronic device main body includes at least one magnetic disk and a magnetic head having a reading unit that reads magnetic information recorded on the magnetic disk, and the reading unit includes: It has the thin film lamination part.

  In the electronic device of the present invention, the thin film stack is a thin film stack, which is indispensable for performing the function of the electronic device, and the electronic device cannot function normally due to static electricity. It has a withstand voltage characteristic.

  According to the electrochemical element of the present invention, it is possible to sufficiently prevent an abrupt flow of current from an electrostatically charged worker to the thin film stack in the manufacturing process of the electronic device having the thin film stack. For this reason, it is possible to sufficiently prevent an adverse effect on the thin film laminated portion in the electronic device, and it is possible to sufficiently prevent a decrease in the manufacturing yield of the electronic device.

  Further, according to the electronic device of the present invention, even when an electrostatically charged worker removes the electrochemical element from the housing of the electronic device main body to the outside of the electronic device main body, the electric current from the worker to the thin film stacking portion is reduced. Sudden flow can be sufficiently prevented. For this reason, the bad influence to the thin film laminated part in an electronic device can fully be prevented.

  Hereinafter, embodiments of the present invention will be described in detail. In all the drawings, the same or equivalent components are denoted by the same reference numerals, and redundant description is omitted.

  FIG. 1 is a plan view showing a first embodiment of an electrochemical element according to the present invention, and FIG. 2 is a cross-sectional view taken along the line II-II in FIG.

  As shown in FIG. 2, the electric double layer capacitor (electrochemical element) 100 includes a first conductive exterior body 2 and a second conductive exterior body 4, and the first conductive exterior body. 2 and the 2nd electroconductive exterior body 4 are arrange | positioned facing each other.

  The first conductive exterior body 2 is composed of a flat plate-like main body 2a, a first lead terminal 2b, and a connecting portion 2c that connects the main body 2a and the first lead terminal 2b. The second conductive exterior body 4 is also composed of a flat plate-like main body portion 4a, a second lead terminal portion 4b, and a connecting portion 4c that connects the main body portion 4a and the second lead terminal portion 4b. (See FIG. 1).

  The first conductive exterior body 2 and the second conductive exterior body 4 are not particularly limited as long as they have conductivity, and as the first conductive exterior body 2 and the second conductive exterior body 4 For example, aluminum, nickel, copper or the like is used. Of these, aluminum is preferably used from the viewpoint of excellent corrosion resistance with respect to the electrolyte solution.

  The first conductive exterior body 2 and the second conductive exterior body 4 may be made of the same material or different materials.

  Between the first conductive exterior body 2 and the second conductive exterior body 4, a power storage unit (held portion) 6 having a function of storing electric charge is provided. 2a and the main body 4a.

  The power storage unit 6 includes a first power storage unit 8 and a second power storage unit 10, and the first power storage unit 8 and the second power storage unit 10 are connected in series via a current collector 12. . The first power storage unit 8 and the second power storage unit 10 include a first electrode 20 and a second electrode 22 that face each other, and a separator 24 is provided between the first electrode 20 and the second electrode 22. Yes. The separator 24 is sandwiched between the first electrode 20 and the second electrode 22. The separator 24 is impregnated with an electrolyte solution (electrolyte). As a result, the electrolytic solution is provided between the first electrode 20 and the second electrode 22.

The first electrode 20 and the second electrode 22 are composed of, for example, a mixture of an active material and fluororubber. As the active material, for example, acetylene black, graphite, graphite, activated carbon, or the like can be selected, or any of these can be mixed and used. The separator 24 is made of an insulating porous body. Examples of the insulating porous material include cellulose nonwoven fabric. The electrolyte solution includes an aqueous electrolyte solution and an organic electrolyte solution, and an organic electrolyte solution is preferable. Examples of such an organic electrolyte include a mixture of a solute made of triethylmethylammonium fluoroborate (TEMAF ₄ ) and a solvent made of propylene carbonate (PC). Solutes include Et ₄ NBF ₄ , Et ₄ NPF ₆ , Et ₄ PBF ₄ , Et ₃ MeNBF ₄ in addition to the above. Solvents include gamma butyrolactone (GBL), ethylene carbonate (EC) in addition to the above. And sulfolane (SFL).

  The peripheral edge of the first power storage unit 8 and the peripheral edge of the second power storage unit 10 are sealed with a sealing material 14. This prevents moisture from entering the electrolytic solution in the first power storage unit 8 and the second power storage unit 10 and sufficiently prevents a decrease in withstand voltage. The sealing material 14 may be any material that can prevent moisture from entering from the outside. For example, a polypropylene material is used as the sealing material 14. Thus, the electrochemical element 16 is configured.

  The surface of the electrochemical element 16 is covered with an outermost layer 18, and a first opening 26 is formed in the outermost layer 18, thereby exposing a part of the first lead terminal portion 2 b. As shown in FIG. 1, the outermost layer 18 has a second opening 28, thereby exposing a part of the second lead terminal portion 4b. The first lead terminal portion 2b and the second lead terminal portion 4b are exposed in this way because the first lead terminal portion 2b and the second lead terminal portion 4b and the electronic device body in which the electric double layer capacitor 100 is to be installed. This is to enable contact with the connection terminal on the part side.

Here, the outermost layer 18 has the electrochemical element body 16 of 1.0 × 10 ⁴ Ωcm or more so that a part of the first lead terminal part 2b and a part of the second lead terminal part 4b are exposed. It is obtained by dipping in a paint containing a high resistance material having a specific resistance of 1.0 × 10 ¹² Ωcm or less and drying. In addition to the high-resistance material, the paint includes a solvent for dissolving or dispersing the high-resistance material. Examples of the solvent include terpineol, acetone, alcohol, dimethylformamide, and water.

Therefore, the outermost layer 18 is made of a high resistance material having a specific resistance of 1.0 × 10 ⁴ Ωcm or more and 1.0 × 10 ¹² Ωcm or less.

According to the electric double layer capacitor 100, the outermost layer 18 is formed by immersing the electrochemical element body 16 in the paint and drying it, so that the first conductive outer casing 2 and the second conductive outer casing 4 Each is sufficiently covered with a high resistance material having a specific resistance of 1.0 × 10 ⁴ Ωcm or more and 1.0 × 10 ¹² Ωcm or less. That is, the exposure of the first conductive exterior body 2 and the second conductive exterior body 4 is sufficiently prevented.

  For this reason, according to the electric double layer capacitor 100, for example, a magnetic head including a read unit having a GMR element and a connection in contact with the first lead terminal portion 2b and the second lead terminal portion 4b of the electric double layer capacitor 100. The following advantages can be obtained in the manufacturing process of a hard disk device having terminals.

  In other words, even when an electrostatically charged worker makes the electric double layer capacitor 100 contact the connection terminal after the magnetic head and the connection terminal are installed, the first conductive exterior body 2 and the second conductive exterior are provided. By covering the body 4 with the outermost layer 18, the rapid flow of static electricity from the operator to the first conductive exterior body 2 and the second conductive exterior body 4 is sufficiently prevented. For this reason, it is possible to sufficiently prevent the reading portion from being destroyed by the rapid flow of current from the operator to the reading portion.

  In addition, since the outermost layer 18 is formed by immersing the electrochemical element 16 in the paint and drying, there is a gap between the first conductive exterior body 2 and the second conductive exterior body 4 and the outermost layer 18. Formation is sufficiently prevented, and charge due to the gap is sufficiently prevented. For this reason, an abrupt flow of current to the reading unit due to the charged electric charge is sufficiently prevented.

  As described above, according to the electric double layer capacitor 100, it is possible to sufficiently prevent adverse effects such as destruction of the reading unit in the hard disk device, and sufficiently prevent a decrease in manufacturing yield of the hard disk device.

The high resistance material is not particularly limited as long as it has a specific resistance of 1 × 10 ⁴ Ωcm or more and 1 × 10 ¹² Ωcm or less. Examples of the high resistance material include alumina, magnesia, silica, and titania. , Silicon carbide, titanium carbide, tantalum nitride, niobium nitride, vanadium nitride, zirconia, or those containing one or more thereof. Moreover, a polyimide, polyamide, or both of these may be included.

In addition, the specific resistance of the high resistance material is preferably 1 × 10 ⁵ Ωcm or more because the electrostatic charge of the outside (for example, the worker's body) is gently moved so as not to destroy the electronic component. . Further, the specific resistance of the high resistance material is preferably 1 × 10 ¹⁰ Ωcm or less because it prevents charging.

  Next, a second embodiment of the electrochemical device of the present invention will be described.

  FIG. 3 is a cross-sectional view showing a second embodiment of the electrochemical device according to the present invention. As shown in FIG. 3, in the electric double layer capacitor 200, the sheet-like outermost layers 18 a and 18 b cover the first conductive exterior body 2 and the second conductive exterior body 4 via the adhesive layer 201. This is different from the electric double layer capacitor 100 of the first embodiment. That is, in the electric double layer capacitor 200 of the present embodiment, the sheet-like outermost layers 18a and 18b are formed in accordance with the size and shape of the surfaces of the first conductive outer package 2 and the second conductive outer package 4. It differs from the electric double layer capacitor 100 of the first embodiment in that it is affixed to the surfaces of the first conductive exterior body 2 and the second conductive exterior body 4 via the adhesive layer 201.

  Since the sheet-like outermost layer 18 is thus attached to the first conductive exterior body 2 and the second conductive exterior body 4 via the adhesive layer 201, the outermost layer 18 is formed by the adhesive layer 201. Are in close contact with each of the first conductive exterior body 2 and the second conductive exterior body 4. For this reason, the formation of a gap is sufficiently prevented between the outermost layer 18 and the first conductive exterior body 2 and the second conductive exterior body 4, and the charge due to the clearance is sufficiently prevented. . For this reason, an abrupt flow of current to the reading unit due to the charged electric charge is sufficiently prevented. As a result, adverse effects such as destruction of the reading unit in the hard disk device can be sufficiently prevented, and a decrease in the manufacturing yield of the hard disk device can be sufficiently prevented.

Next, a first embodiment of an electronic device according to the present invention will be described.

  4 is a perspective view schematically showing a hard disk device as an electronic device according to the present embodiment, and FIG. 5 is an enlarged plan view showing the thin film stacking portion of FIG. FIG. 4 shows a state where the electric double layer capacitor 100 is removed from the hard disk device.

  As shown in FIG. 4, the hard disk device 300 includes a thin rectangular parallelepiped main body (electronic device main body) 301, and a cable connection connector 302 is provided on the main body 301. An insertion hole (accommodating portion) 303 for accommodating the electric double layer capacitor 100 is formed on a surface 301 a opposite to the connector 302 on the surface side of the main body portion 301. The electric double layer capacitor 100 is detachably accommodated in the insertion hole 303. For this reason, the electric double layer capacitors 100 and 200 can be freely taken out of the main body 301 and can be freely mounted from the outer side of the main body 301. Further, when the electric double layer capacitor 100 is inserted into the insertion hole 303 from the first lead terminal portion 2 b and the second lead terminal portion 4 b side, the first lead terminal portion 2 b and the second lead terminal portion 4 b are inside the main body portion 301. The two connection terminals 304 and 305 are in contact with each other.

  Inside the main body 301, a magnetic disk 306 is rotatably provided by a rotation shaft 307, and a rotation driving force is applied to the rotation shaft 307 by a rotation motor (not shown). Yes.

  A rotation shaft 308 is provided inside the main body 301, and the rotation shaft 308 can be rotated by a rotation motor (not shown). A magnetic head assembly 309 is fixed to the rotary shaft 308. The magnetic head assembly 309 includes an arm unit 310 fixed to the rotation shaft 308 and a magnetic head 312 provided at the tip of the arm unit 310. The magnetic head 312 includes a reading unit 314 and a writing unit 316. Have. Here, the reading unit 314 includes a GMR element, and the GMR element is formed by sequentially stacking a pinned layer 315 that is an antiferromagnetic layer, a pinned layer 318 that is a pinned magnetic layer, a nonmagnetic layer 320, and a free layer 322. The laminated body 324 formed is included.

  The pinned layer 315 is made of an antiferromagnetic material such as PtMn or NiO, and the thickness of the pinned layer 315 is usually 3 nm to 50 nm. The pinned layer 318 is made of a ferromagnetic material such as Fe, Co, Ni, NiFe, CoFe, CoZrNb, or FeCoNi, and the thickness of the pinned layer 318 is usually 0.5 nm to 5 nm. The nonmagnetic layer 320 is made of a nonmagnetic material such as Cu, Ru, Rh, Ir, Au, or Ag, and the thickness of the nonmagnetic layer 320 is usually 1 nm to 4 nm. The free layer 322 is made of a ferromagnetic material such as Fe, Co, Ni, NiFe, CoFe, CoZrNb, or FeCoNi, and the thickness of the free layer 322 is usually 0.5 nm to 10 nm. As described above, the stacked body 324 is formed by stacking extremely thin films to form a thin film stack portion.

In the hard disk device 300, the electric double layer capacitor 100 is detachably accommodated in the accommodation hole 303 of the main body 301. The electric double layer capacitor 100 is 1.0 × 10 ⁴ Ωcm or more and 1.0 × 10 6. ^The outermost layer 18 includes a high resistance material having a specific resistance of ¹² Ωcm or less. In particular, in the electric double layer capacitor 100, the outermost layer 18 is formed by immersing the electrochemical element 16 in the paint and drying it. Therefore, each of the first conductive exterior body 2 and the second conductive exterior body 4 is sufficiently a high resistance material having a specific resistance of 1.0 × 10 ⁴ Ωcm or more and 1.0 × 10 ¹² Ωcm or less. Will be covered. That is, the exposure of the first conductive exterior body 2 and the second conductive exterior body 4 is sufficiently prevented.

  Therefore, even when a worker who is charged with static electricity removes the electric double layer capacitor 100 from the accommodation hole 303 of the main body 301, the worker can connect the first conductive exterior body 2 and the second conductive exterior body 4 to each other. Sudden flow of static electricity is sufficiently prevented. Therefore, an abrupt flow of current from the worker to the reading unit 314 is sufficiently prevented, and as a result, damage to the reading unit 314 due to the static electricity of the worker is sufficiently prevented.

  In particular, since the outermost layer 18 is formed by immersing the electrochemical element 16 in the coating material and drying it, there is a gap between the first conductive exterior body 2 and the second conductive exterior body 4 and the outermost layer 18. Formation is sufficiently prevented, and charge due to the gap is sufficiently prevented. For this reason, the rapid flow of the current to the reading unit 314 due to the charged electric charge is sufficiently prevented.

  Therefore, according to the hard disk device 300, even when the electric double layer capacitor 100 is removed, the adverse effect on the reading unit 314 can be sufficiently prevented, and damage to the hard disk device 300 is sufficiently prevented.

  Next, a second embodiment of the electronic device according to the present invention will be described.

  FIG. 6 is a perspective view showing a second embodiment of the electronic device of the present invention, and shows a state in which the electric double layer capacitor 100 is removed from the hard disk device.

  As shown in FIG. 6, in the hard disk device 400 of this embodiment, first, a fitting portion 403 as a housing portion is formed on the surface 401 a side facing the magnetic disk 306 in the surface of the main body portion 401. This is different from the hard disk device 300. The fitting portion 403 has a shape into which the electric double layer capacitor 100 is fitted, and the first lead terminal portion 2b and the second lead terminal portion where the electric double layer capacitor 100 is exposed are formed on the bottom portion 403a of the fitting portion 403. Also different from the hard disk device 300 in that connection terminals 404 and 405 that are in contact with 4b are provided.

  According to the hard disk device 400, similarly to the hard disk device 300, even when the electric double layer capacitor 100 is removed, the adverse effect on the reading unit 314 can be sufficiently prevented, and damage to the hard disk device 400 is sufficiently prevented.

  The present invention is not limited to the above embodiment. For example, in the above embodiment, the electric double layer capacitors 100 and 200 are used as the electrochemical elements, but a secondary battery such as a primary battery or a lithium ion battery is used instead of the electric double layer capacitors 100 and 200. It does not matter. In this case, the sandwiched portion is not the power storage unit 6 but a power generation unit having a power generation function. However, when the electrochemical element is an electric double layer capacitor, charging and discharging can be performed instantaneously and high energy can be obtained as compared with the case where an electrochemical element other than the electric double layer capacitor is used. There is an advantage.

  In the above embodiment, a hard disk device is used as the electronic device. However, the electronic device of the present invention is not limited to the hard disk device, and may be a PC card, an IC card, or the like. Here, the thin film laminated portion in a PC card, an IC card or the like is an integrated circuit constituted by an insulating film in MOS, an FET gate insulating film, or the like. Even in this case, when the electrochemical element is removed, it is possible to sufficiently prevent the adverse effect on the thin film stacking portion and sufficiently prevent the function of the electronic device from being impaired.

  Furthermore, in the embodiment according to the electrochemical device of the present invention, the outermost layer 18 is formed by dipping in a paint and drying, or by forming a sheet and pasting it through an adhesive layer. Is a thin film containing alumina or zirconia, the outermost layer 18 can be manufactured by vapor phase synthesis. Even in this case, the exposure of the first conductive exterior body 2 and the second conductive exterior body 4 can be sufficiently prevented in the same manner as in the case where the electrochemical element body is dip-coated in the paint. It is possible to sufficiently prevent a current from abruptly flowing from a teddy worker through the first conductive exterior body 2 and the second conductive exterior body 4 to the reading unit of the magnetic head.

  Here, in the vapor phase synthesis, a support and an aluminum or zirconium target are arranged in a container, the degree of vacuum in the container is, for example, 10 to 20 Pa, and argon gas and oxygen gas are respectively 20 sccm and 15 scc in a vacuum container. It may be performed by applying an electric field having an RF frequency of 13.56 Hz between the support and the target while being introduced into the substrate.

  The thin film may contain magnesia, silica, titania, silicon carbide, titanium carbide, tantalum nitride, niobium nitride, and vanadium nitride instead of alumina or zirconia. The same effect as the case where it is contained is acquired.

  Furthermore, in the electric double layer capacitors 100 and 200 of the above embodiment, the first lead terminal portion 2b and the second lead terminal portion 4b are provided outside the main body portions 2a and 4a, respectively. Like the multilayer capacitor 150, the first lead terminal portion 2b and the second lead terminal portion 4b may be provided inside the main body portions 2a and 4a, respectively. In this case, the electric double layer capacitor 150 can be reduced in size. In FIG. 7, the exposed portions are the first lead terminal portion 2b and the second lead terminal portion 4b. In this embodiment, the connecting portions 2c and 4c are unnecessary.

  EXAMPLES Hereinafter, although this invention is demonstrated more concretely based on an Example and a comparative example, this invention is not limited to a following example.

(Example 1)
The electric double layer capacitor of Example 1 having the same configuration as that of the electric double layer capacitor 100 shown in FIG.

(Preparation of electric double layer capacitor body)
First, a current collector having an electrode was produced as follows. That is, as the current collector, an aluminum foil (thickness: 50 μm) cut into a rectangular shape (10 × 10 mm) was adopted, and electrodes were formed on these current collectors. Specifically, activated activated carbon (specific surface area 2000 m ² / g, BP-20 manufactured by Kuraray Chemical), fluororubber (manufactured by DuPont, Viton-GF), and acetylene black (conducting aid) ( Denka Black, manufactured by Denki Kagaku Kogyo Co., Ltd.) was mixed and kneaded with a predetermined amount of methyl isobutyl ketone so as to be 80% by weight, 10% by weight, and 10% by weight, respectively. It apply | coated to the center part (8x8 mm) of the surface (both surfaces), and it dried and set it as the electrode. The thickness of the electrode after drying was 50 μm.

  Next, two conductive exterior bodies were prepared. The two conductive armor bodies shift the lead terminal portions (2b, 4b) and the connecting portions (2c, 4c) of FIG. 2 from the central axis to one side with respect to the central axis of the current collector. Shape. At this time, the shape of the portion excluding the lead terminal portion and the connecting portion was the same as that of the current collector.

  Next, the same paste as the paste used for producing the electrode in the current collector is applied to the portion of the conductive outer body corresponding to the current collector (8 × 8 mm) for the two conductive outer bodies. It was applied and dried to form an electrode. The thickness of the electrode after drying was 50 μm. The position of the electrode formation surface is such that when two conductive exterior bodies are stacked so that the electrode formation surfaces face each other, the lead terminal portion and the connecting portion (for example, 2b and 2c) of one conductive exterior body are The position that does not overlap the other lead terminal portion and the connecting portion (for example, 4b and 4c) was selected. Specifically, the configuration is as shown in FIG.

  Next, a separator was prepared. The separator was formed by cutting a paper having a thickness of 50 μm (manufactured by Nippon Kogyo Paper Industries, TF4050) into a size (8 × 8 mm) corresponding to the surface of the electrode.

  Subsequently, two sealing materials made of a single-layer acid-modified polyethylene sheet (thickness 150 μm) were prepared. The sealing material was created by punching the central portion of the acid-modified polyethylene sheet so as to have a frame shape with an outer dimension of 10 × 10 mm and an inner dimension of 8.1 × 8.1 mm.

  Next, after placing a frame-shaped sealing material on the peripheral edge of the surface of the conductive exterior body where the electrode is formed so as to surround the electrode, the sealing material is heated and melted from the conductive exterior body side. The sealing material and one of the current collectors were heat-sealed at 170 ° C. Subsequently, an appropriate amount of electrolyte solution was dropped on the electrode, a separator was laminated on the electrode, and an appropriate amount of electrolyte solution was further dropped on the separator. As the electrolyte solution, a solution obtained by dissolving triethylmethylammonium tetrafluoride salt in a propylene carbonate solution at a concentration of 1.8 mol / L was used. The same treatment was performed on the other conductive exterior body.

  Subsequently, an appropriate amount of electrolyte solution was also dropped onto the electrode of the current collector. Then, the two outermost conductive bodies were overlapped so as to sandwich the current collector. At this time, the electrode of the current collector was in contact with the separator on the conductive exterior body, and the periphery of all the electrodes was surrounded by a frame-shaped sealing material. This was heated at 170 ° C. to melt the sealing material. The electric double layer capacitor body was obtained by the above procedure.

(Coating with high resistance exterior)
The lead terminal portion of the electric double layer capacitor body produced by the above procedure was coated with about Φ2 mm with a resist.

  Next, the electric double layer capacitor body was immersed in a ceramic coating material mixed with zirconia-alumina powder (trade name: Araldite E, manufactured by Toagosei Co., Ltd.). During the dipping process, the electric double layer capacitor element was held by the resist coating portion of the lead terminal portion. The electric double layer capacitor body, which had been immersed in the ceramic coating material, was heated in an oven to 155 ° C. and subjected to effect treatment for a specified time to form an outermost layer having a thickness of 20 μm. The electric double layer capacitor of Example 1 was obtained through the above steps.

Separately, a dummy outermost layer was formed on a fused silica substrate by the same method, and the specific resistance of the outermost layer was measured by removing the influence of the conductive exterior body with a two-terminal probe. As a result of the 50-point measurement, the specific resistance was 2.6 to 7.2 × 10 ⁵ Ωcm.

(Example 2)
In Example 2, a commercially available antistatic polyimide tape (manufactured by Sumitomo 3M, trade name: polyimide tape No. 5419) was applied to the entire surface of the electric double layer capacitor body, and the lead terminal portion was cut out and exposed. In the same manner as in Example 1, an electric double layer capacitor was produced. When the specific resistance of the antistatic polyimide tape affixed on the fused quartz substrate was measured in the same manner as in Example 1, the specific resistance was 6.3 to 7.7 × 10 ¹⁰ Ωcm.

(Example 3)
In Example 3, the electric double layer capacitor body was immersed in a monomer solution obtained by adding 20 parts by weight of commercially available acetylene black (trade name: Denka Black, manufactured by Denki Kagaku Kogyo Co., Ltd.) in a propylene monomer dispersion solution. An electric double layer capacitor of Example 2 was produced in the same manner as in Example 1 except that a polymerization reaction was performed to form a polymer film having a thickness of 20 μm as the outermost layer. When the specific resistance of the film polymerized on the fused quartz substrate was measured in the same manner as in Example 1, the specific resistance was 4.3 to 8.0 × 10 ⁷ Ωcm.

(Comparative Example 1)
In Comparative Example 1, a commercially available polyimide tape (trade name: polyimide tape No. 5413, manufactured by Sumitomo 3M) that is not subjected to antistatic treatment is applied to the entire surface of the electric double layer capacitor body, and the lead terminal portion is exposed by cutting out. An electric double layer capacitor of Comparative Example 1 was produced in the same manner as Example 1 except that. When the specific resistance of the polyimide tape affixed on the fused quartz substrate was measured in the same manner as in Example 1, the specific resistance was 1.7 to 9.1 × 10 ¹³ Ωcm.

(Comparative Example 2)
In Comparative Example 2, the electric double layer capacitor of Comparative Example 2 was prepared in the same manner as in Example 1 except that a sputtering apparatus was used and a tungsten thin film having a thickness of 10 μm was formed on the surface of the electric double layer capacitor body other than the lead terminal portion. Was made. When the specific resistance of the tungsten thin film formed on the fused quartz substrate was measured in the same manner as in Example 1, the specific resistance was 1.7 to 9.1 × 10 ² Ωcm.

(Evaluation of electrostatic breakdown rate)
100 pieces of dummy thin film magnetic heads for evaluation in which only the reading portion was formed were prepared. All of these dummy thin film magnetic heads were placed on a suspension, and only the reading portion was electrically connected to the outside. The electric double layer capacitors of Examples 1 to 3 and Comparative Examples 1 and 2 were each brought into contact with 10 pieces of suspension portions. The working room temperature was 24 ° C. and the humidity was 38%. During the work, a magnetic head with a suspension was placed on a static elimination mat, a static elimination shower was applied, and the operator was wearing a static elimination tool such as a wristband. The electric double layer capacitor was not charged.

Prerecorded hard disk media were prepared, and changes in magnetic head reading characteristics before and after contact with the electric double layer capacitor were evaluated. For the measurement, an evaluation apparatus centered on a dynamic tester for hard disk (manufactured by GUZIK, product names: S1701A (spin stand), RWA2585 (read / write analyzer)) was used. Table 1 shows the number (normal number) of dummy thin-film magnetic heads that could be read after contact.

  From the above results, it has been confirmed that the implementation of the present invention can prevent the adverse effects due to static electricity on the electronic component.

  As mentioned above, although this invention was demonstrated in detail by the Example and the comparative example, embodiment of this invention is not limited to this, Many applications are possible.

  For example, in the above comparative example, it was proved that the use of polyimide without antistatic treatment as an exterior body has an adverse effect on electronic parts. The same effect as that of the present invention can be obtained by using the adhesive layer as a conductive material. As such an adhesive layer, a mixture of fillers such as metal and carbon black can be used.

  Alternatively, the resistance value can be adjusted and used by oxidizing a metal thin film formed by a vacuum film forming method such as sputtering or a plating method. The oxidation method can be appropriately selected from thermal oxidation, oxidation by plasma or ions, oxidation by ozone, oxidation by light such as ultraviolet rays, oxidation by electron beam, and the like.

It is a top view which shows one Embodiment of the electrochemical element of this invention. It is sectional drawing along the II-II line of FIG. It is sectional drawing which shows other embodiment of the electrochemical element of this invention. It is a perspective view which shows one Embodiment of the electronic device of this invention. It is a top view which expands and shows the thin film laminated part of FIG. It is a perspective view which shows other embodiment of the electronic device of this invention. It is sectional drawing which shows other embodiment of the electrochemical element of this invention.

Explanation of symbols

  2b ... 1st lead terminal part, 2 ... 1st electroconductive exterior body, 4b ... 2nd lead terminal part, 4 ... 2nd electroconductive exterior body, 6 ... Power storage part (clamped part), 18, 18a, 18b ... outermost layer, 20, 22 ... electrode, 24 ... separator, 201 ... adhesive layer, 300, 400 ... hard disk device (electronic device), 301 ... main body (electronic device main body), 303 ... housing part, 304, 305... Connection terminal, 306... Magnetic disk, 312... Magnetic head, 314.

Claims (11)

A first conductive exterior body having a first lead terminal portion;
A second conductive exterior body disposed opposite to the first conductive exterior body and having a second lead terminal portion;
A sandwiched portion sandwiched between the first conductive exterior body and the second conductive exterior body;
An outermost layer covering the first conductive exterior body and the second conductive exterior body,
The sandwiched portion includes a pair of electrodes and an electrolyte provided between the pair of electrodes;
At least a portion of the first lead terminal portion and at least a portion of the second lead terminal portion are exposed;
The outermost layer is configured to include a high resistance material having a specific resistance of 1.0 × 10 ⁴ Ωcm to 1.0 × 10 ¹² Ωcm.
The electrochemical element characterized by the above-mentioned.   The electrochemical device according to claim 1, wherein the sandwiched portion further includes a separator between the pair of electrodes. The outermost layer is
An electrochemical element comprising the first conductive exterior body, the second conductive exterior body, and the sandwiched portion is formed of at least a part of the first lead terminal portion and the second lead terminal portion. Obtained by dipping in a paint containing a high resistance material having a specific resistance of 1.0 × 10 ⁴ Ωcm or more and 1.0 × 10 ¹² Ωcm or less and drying so that at least a part of the film is exposed. Is,
3. The electrochemical device according to 1 or 2, wherein   The outermost layer has a sheet shape, and covers each of the first conductive exterior body and the second conductive exterior body through an adhesive layer. 2. The electrochemical element according to 2.   The high resistance material includes at least one selected from the group consisting of alumina, magnesia, silica, titania, silicon carbide, titanium carbide, tantalum nitride, niobium nitride, vanadium nitride, and zirconia. 5. The electrochemical element according to any one of 4.   The high resistance material includes at least one selected from the group consisting of alumina, magnesia, silica, titania, silicon carbide, titanium carbide, tantalum nitride, niobium nitride, vanadium nitride, and zirconia, and the outermost layer is a thin film. The electrochemical device according to claim 1, wherein:   The electrochemical device according to any one of claims 1 to 4, wherein the high-resistance material includes at least one selected from the group consisting of polyimide and polyamide.   The electrochemical device according to claim 7, wherein the polyimide and the polyamide have an antistatic structure. The electrochemical element according to any one of claims 1 to 8,
An electronic device main body having a housing portion for accommodating the electrochemical element and a thin film stacking portion;
The accommodating portion is provided with a connection terminal that comes into contact with the first lead terminal portion and the second lead terminal portion constituting the electrochemical element,
The accommodating portion is provided on the surface side of the electronic device main body;
The electrochemical element is detachably accommodated in the accommodating portion,
An electronic device characterized by that.   The electronic device according to claim 9, wherein the electrochemical element is an electric double layer capacitor. The electronic device main body is
At least one magnetic disk;
A magnetic head having a reading unit for reading magnetic information recorded on the magnetic disk;
With
The readout unit includes the thin film stack unit.
The electronic device according to claim 9, wherein the electronic device is an electronic device.

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