JP2005283215A - Thin film evaluation device and evaluation method in electronic device - Google Patents

Thin film evaluation device and evaluation method in electronic device Download PDF

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JP2005283215A
JP2005283215A JP2004094716A JP2004094716A JP2005283215A JP 2005283215 A JP2005283215 A JP 2005283215A JP 2004094716 A JP2004094716 A JP 2004094716A JP 2004094716 A JP2004094716 A JP 2004094716A JP 2005283215 A JP2005283215 A JP 2005283215A
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thin film
cutting blade
electronic device
adhesion
peeling
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JP4122310B2 (en
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Tadahiro Omi
忠弘 大見
Yumi Osako
ゆみ 大迫
Teruhiko Suzuki
輝彦 鈴木
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Zeon Corp
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21J—FORGING; HAMMERING; PRESSING METAL; RIVETING; FORGE FURNACES
    • B21J5/00—Methods for forging, hammering, or pressing; Special equipment or accessories therefor
    • B21J5/06—Methods for forging, hammering, or pressing; Special equipment or accessories therefor for performing particular operations
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a procedure for measuring and evaluating adhesiveness of a thin film having the film thickness of 10 μm or less, especially a photosensitive resin film, which is used in an electronic device. <P>SOLUTION: When cutting and exfoliating the thin film by a cutting blade, in order to reduce strengthening of a horizontal force generated after exfoliation, water drops are dropped onto the contact surface between the cutting blade and the thin film, to thereby reduce a frictional force on the contact surface. Hereby, the horizontal force can be measured and evaluated stably and accurately. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、半導体装置、液晶表示装置、有機エレクトロルミネッセンス装置等の電子装置における薄膜の密着性を測定、評価する薄膜評価装置及び評価方法に関する。   The present invention relates to a thin film evaluation apparatus and an evaluation method for measuring and evaluating thin film adhesion in electronic devices such as semiconductor devices, liquid crystal display devices, and organic electroluminescence devices.

一般に、この種の電子装置に用いられるＭＯＳトランジスタ、ＴＦＴ等の素子は、高密度に集積化される傾向にあり、この傾向は今後益々強まるものと考えられる。高集積化と共に、これらの電子装置には、無機材料だけでなく、これまで、使用されていなかった有機材料の薄膜が使用されることも多くなっている。   In general, elements such as MOS transistors and TFTs used in this type of electronic device tend to be integrated at a high density, and this tendency is expected to increase in the future. Along with the high integration, not only inorganic materials but also thin films of organic materials that have not been used so far have been used in these electronic devices.

このように、多種多様な薄膜を複数層形成した場合、薄膜間の密着性が悪くなると、素子不良が多くなって歩留まりの低下を避けることができない。また、電子装置の製造には、ホトリソグラフィー技術によって感光性樹脂をパターニングすることも行なわれているが、感光性樹脂に剥離等が生じると、配線の断線やＴＦＴの動作不良が起こってしまう。したがって、新たな材料を用いて薄膜を形成する場合、下地となる薄膜との間の密着性を考慮して材料を選択する必要がある。しかしながら、実際には、各種の薄膜を試行的に下地となる薄膜上に形成して、不良品の発生を検査し、検査結果から密着性を間接的に評価するか、或いは、テープを薄膜に貼付した後、このテープを剥離して密着性を測定する手法が一般的に使用されているのが実情である。   As described above, when a plurality of thin films are formed in a plurality of layers, if the adhesion between the thin films deteriorates, the number of device defects increases and a decrease in yield cannot be avoided. Also, in the manufacture of electronic devices, a photosensitive resin is patterned by a photolithography technique. However, if the photosensitive resin is peeled off, wiring disconnection or TFT malfunction may occur. Therefore, when a thin film is formed using a new material, it is necessary to select the material in consideration of adhesion between the thin film serving as a base. However, in practice, various thin films are trially formed on the underlying thin film, the occurrence of defective products is inspected, and the adhesion is indirectly evaluated from the inspection results, or the tape is made into a thin film. The actual situation is that after sticking, this tape is peeled to measure the adhesion.

一方、１０μｍより厚い自動車用の塗膜、１００μｍ程度の粉体成形塗膜の密着性を評価するために、塗膜の剥離強度及びせん断強度を測定するサイカス（ＳＡＩＣＡＳ）（Surface And Interfacial Cutting Analysis System）法と呼ばれる手法が用いられている。このサイカス法については、特開昭６１−１６９７４５（特許文献１）、特開２００３−２５４８９４（特許文献２）に開示されている。   On the other hand, SAICAS (Surface And Interfacial Cutting Analysis System) measures the peel strength and shear strength of paint films to evaluate the adhesion of paint films for automobiles thicker than 10 μm and powder-formed paint films of about 100 μm. ) Method is used. The cycas method is disclosed in Japanese Patent Application Laid-Open No. 61-169745 (Patent Document 1) and Japanese Patent Application Laid-Open No. 2003-254894 (Patent Document 2).

特開昭６１−１６９７４５号公報JP-A 61-169745 特開２００３−２５４８９４号公報JP 2003-254894 A

感光性樹脂膜、絶縁膜等の１０μｍ以下の膜厚を有する薄膜を多層、積層して製造される半導体装置等の電子装置は、真空処理装置内で、各薄膜を順次連続的に形成することによって製造され、真空処理装置のチャンバ内に薄膜の密着性を評価するステージを別に設ける等の手段は採用されていない。更に、テープを薄膜に貼付して剥離することによって密着性を測定する手法は薄膜の密着性を定性的に判断するのには利用できるが、密着性を定量的に測定することはできない。   Electronic devices such as semiconductor devices manufactured by laminating and laminating thin films having a film thickness of 10 μm or less, such as photosensitive resin films and insulating films, are formed successively in a vacuum processing apparatus. No means such as providing a stage for evaluating the adhesion of the thin film in the chamber of the vacuum processing apparatus is used. Furthermore, although the method of measuring the adhesion by attaching and peeling the tape to the thin film can be used to qualitatively determine the adhesion of the thin film, the adhesion cannot be measured quantitatively.

また、特許文献１及び２は自動車等に塗布される塗膜を評価、検査するためにサイカス法を用いることが提案されているだけで、半導体装置等の電子装置にサイカス法を適用することについては、何等、考慮されていない。   In addition, Patent Documents 1 and 2 only propose to use the cycas method for evaluating and inspecting a coating film applied to an automobile or the like, and about applying the cycas method to an electronic device such as a semiconductor device. Is not taken into account.

このことは、特許文献１及び２では、電子装置の薄膜にサイカス法を適用した場合における問題点について指摘していないことからも明白である。   This is apparent from the fact that Patent Documents 1 and 2 do not point out problems in the case where the cycas method is applied to a thin film of an electronic device.

本発明の目的は、電子装置に用いられる感光性樹脂、絶縁膜等の薄膜、特に、１０μｍ以下の膜厚の薄膜の密着性を評価する評価方法及び評価装置を提供することである。   The objective of this invention is providing the evaluation method and evaluation apparatus which evaluate the adhesiveness of thin films, such as a photosensitive resin used for an electronic device, and an insulating film, especially a thin film with a film thickness of 10 micrometers or less.

本発明の他の目的は、薄膜の密着性を評価するステージを備えた電子装置を製造するシステムを提供することである。   Another object of the present invention is to provide a system for manufacturing an electronic device having a stage for evaluating the adhesion of a thin film.

本発明の一態様によれば、電子装置に含まれている薄膜の密着性を評価する方法であって、前記薄膜に切刃を当接した後、切削方向に移動させ、前記薄膜を前記切刃により剥離する移動剥離工程を有し、前記移動剥離工程は、前記切刃の移動の際、前記切刃と前記薄膜との間に潤滑液を供給して、前記切刃と前記薄膜との間の摩擦力を軽減する工程を含んでいることを特徴とする電子装置における薄膜評価方法が得られる。ここで、前記潤滑液は水であることが望ましい。   According to one aspect of the present invention, there is provided a method for evaluating the adhesion of a thin film included in an electronic device, wherein a cutting blade is brought into contact with the thin film and then moved in a cutting direction so that the thin film is cut into the cutting device. A moving peeling step for peeling by a blade, wherein the moving peeling step supplies a lubricating liquid between the cutting blade and the thin film when the cutting blade is moved, A method for evaluating a thin film in an electronic device is provided, which includes a step of reducing the frictional force therebetween. Here, the lubricating liquid is preferably water.

本発明の他の態様によれば、前記薄膜は感光性樹脂であり、当該感光性樹脂を前記切刃により剥離している間、前記切刃に加わる水平力を実質的に一定に保つことができることを特徴とする電子装置における薄膜評価方法が得られる。   According to another aspect of the present invention, the thin film is a photosensitive resin, and the horizontal force applied to the cutting blade can be kept substantially constant while the photosensitive resin is peeled off by the cutting blade. A thin film evaluation method for an electronic device can be obtained.

本発明の更に他の態様によれば、電子装置に含まれている薄膜を評価する評価装置において、前記薄膜を剥離する切刃と、当該切刃を前記薄膜を下地となる層に沿って剥離するように、所定の方向に移動させる手段と、前記切刃の移動中、前記切刃と前記薄膜との間に、潤滑液を供給する手段とを備えていることを特徴とする電子装置における薄膜評価装置が得られる。   According to still another aspect of the present invention, in an evaluation apparatus for evaluating a thin film included in an electronic device, a cutting blade for peeling the thin film, and the cutting blade for peeling the thin film along a layer serving as a base In an electronic apparatus, comprising: means for moving in a predetermined direction; and means for supplying a lubricating liquid between the cutting blade and the thin film during movement of the cutting blade A thin film evaluation apparatus is obtained.

本発明の別の態様によれば、基板上に薄膜を順次積層して電子装置を製造する電子装置製造システムにおいて、前記薄膜の一部を剥離して、前記薄膜の密着性を測定・評価するステージを含んでいることを特徴とする電子装置製造システムが得られる。   According to another aspect of the present invention, in an electronic device manufacturing system for manufacturing an electronic device by sequentially laminating thin films on a substrate, a part of the thin film is peeled to measure and evaluate the adhesion of the thin film. An electronic device manufacturing system including a stage is obtained.

更に、本発明の他の態様によれば、薄膜を含む素子領域と、当該素子領域の周辺に設けられた非素子領域とを有する基板を用意し、前記基板の非素子領域を部分的に切刃を用いて剥離することにより、前記素子領域の薄膜の密着性を測定する基板薄膜の測定方法が得られる。   Further, according to another aspect of the present invention, a substrate having an element region including a thin film and a non-element region provided around the element region is prepared, and the non-element region of the substrate is partially cut. By peeling using a blade, a method for measuring a substrate thin film that measures the adhesion of the thin film in the element region is obtained.

本発明では、切刃の移動に伴う水平力の変化を抑えることにより、電子装置における薄膜、特に、１０μｍ以下の膜厚を有する薄膜の密着性を測定する際に特有に発生する現象による影響を軽減し、これによって、薄膜の密着性を精度良く評価、測定できる薄膜評価装置及び評価方法が得られる。   In the present invention, by suppressing the change in the horizontal force accompanying the movement of the cutting blade, the influence due to the phenomenon that occurs specifically when measuring the adhesion of a thin film in an electronic device, particularly a thin film having a film thickness of 10 μm or less. Thus, a thin film evaluation apparatus and an evaluation method capable of accurately evaluating and measuring the adhesion of the thin film can be obtained.

図１を参照すると、本発明において使用される薄膜評価装置の概略構成が示されており、図２には、図1に示された薄膜評価装置における電子装置薄膜の測定動作が示されている。まず、図１に示されているように、本発明に係る薄膜評価装置は支持台１０、当該支持台１０に設けられた試料載置台１２、切刃１４、当該切刃１４を図の水平方向並び垂直方向に駆動する駆動装置１６、１７とを備え、更に、切刃１４には、当該切刃１４に加わる垂直分力を検知する垂直分力検知器１８、垂直方向の変位を検出する変位検出計２０が取り付けられて、更に、試料載置台１２には水平分力検知器２２が取り付けられている。この構成では、試料載置台１２上に試料として載置された半導体装置等の電子装置２５を切刃１４により部分的に剥離することによって薄膜の密着性を検出することができる。即ち、図示された例では、切刃１４を図の水平方向、即ち、切削方向に駆動装置により移動させ、この剥離、移動の際における切刃１４に加わる抵抗力を水平分力検知器２２及び垂直分力検知器１８によって読み取ることによって、薄膜の密着性を水平力として定量的に決定することができる。   Referring to FIG. 1, there is shown a schematic configuration of a thin film evaluation apparatus used in the present invention, and FIG. 2 shows an electronic apparatus thin film measuring operation in the thin film evaluation apparatus shown in FIG. . First, as shown in FIG. 1, the thin film evaluation apparatus according to the present invention includes a support 10, a sample mounting table 12 provided on the support 10, a cutting edge 14, and the cutting edge 14 in the horizontal direction in the figure. And a driving device 16 and 17 that drive in the vertical direction. Further, the cutting blade 14 includes a vertical component force detector 18 that detects a vertical component force applied to the cutting blade 14, and a displacement that detects a displacement in the vertical direction. A detector 20 is attached, and a horizontal component force detector 22 is attached to the sample mounting table 12. In this configuration, the adhesiveness of the thin film can be detected by partially peeling the electronic device 25 such as a semiconductor device mounted as a sample on the sample mounting table 12 with the cutting blade 14. That is, in the illustrated example, the cutting blade 14 is moved by a driving device in the horizontal direction of the drawing, that is, the cutting direction, and the resistance force applied to the cutting blade 14 at the time of separation and movement is determined by the horizontal component force detector 22 and By reading with the vertical component force detector 18, the adhesion of the thin film can be quantitatively determined as a horizontal force.

図２をも参照して、本発明に係る薄膜評価方法を説明する。まず、本発明で評価、測定される電子装置の一例が示されており、図示された電子装置は、ガラス基板３０、当該ガラス基板３０上に形成された透明導電性膜であるＩＴＯ膜３２、及び、ＩＴＯ膜等の透明導電性膜３２上に形成された絶縁膜３４とを有している。この構成からも明らかな通り、図示された電子装置はＴＦＴ（薄膜トランジスタ）等を含むフラットパネルディスプレイ装置に適用できる。   The thin film evaluation method according to the present invention will be described with reference to FIG. First, an example of an electronic device that is evaluated and measured in the present invention is shown. The electronic device shown in the figure includes a glass substrate 30, an ITO film 32 that is a transparent conductive film formed on the glass substrate 30, And an insulating film 34 formed on a transparent conductive film 32 such as an ITO film. As is apparent from this configuration, the illustrated electronic device can be applied to a flat panel display device including a TFT (thin film transistor).

図示された例では、ＩＴＯ膜３２上に形成された絶縁膜３４を切刃１４により切削、剥離することによって、絶縁膜３４の密着性を評価、測定する。この場合、切刃１４は絶縁膜３４を図の左から右方向に切削して、ＩＴＯ膜３２に切刃１４が達すると、絶縁膜３４を剥離する状態になる。この実施形態では、絶縁膜３４を剥離している状態における切刃１４に加わる力のうち、水平力ＦＨを検出することによって、絶縁膜３４の密着性を評価する。 In the illustrated example, the insulating film 34 formed on the ITO film 32 is cut and peeled by the cutting blade 14 to evaluate and measure the adhesion of the insulating film 34. In this case, the cutting blade 14 cuts the insulating film 34 from the left to the right in the drawing, and when the cutting blade 14 reaches the ITO film 32, the insulating film 34 is peeled off. In this embodiment, the adhesiveness of the insulating film 34 is evaluated by detecting the horizontal force F H out of the forces applied to the cutting blade 14 in a state where the insulating film 34 is peeled off.

ここで、絶縁膜３４を切削、剥離している状態で、切刃１４に加わる水平力ＦＨを検討すると、絶縁膜３４を切削している状態では、切り込み深さに応じて、増大する。その後、切刃１４により絶縁膜３４が剥離される状態になると、水平力、即ち、水平荷重ＦＨは急激に低下し、この低下した状態における水平力ＦＨを検出することによって、密着性を評価できる筈である。 Here, when the horizontal force F H applied to the cutting blade 14 is examined in a state where the insulating film 34 is being cut and peeled, in the state where the insulating film 34 is being cut, it increases according to the depth of cut. Thereafter, the insulating film 34 by the cutting edge 14 is ready to be peeled, the horizontal force, i.e., by decreases in horizontal load F H rapidly detects the horizontal force F H in the state that the reduced adhesion You should be able to evaluate.

しかしながら、本発明者等の実験によれば、図３に示すように、絶縁膜３４が感光性透明樹脂等のように１０μｍ以下の薄膜である場合、水平荷重ＦＨは切削状態から剥離状態になると、一旦、低下するが、低下後、水平荷重ＦＨは再度、上昇して安定しない現象が見出され、この結果、絶縁膜３４の密着性を測定できないことが判明した。 However, according to the experiments by the present inventors, as shown in FIG. 3, when the insulating film 34 is a thin film of 10 μm or less such as a photosensitive transparent resin, the horizontal load F H is changed from the cutting state to the peeling state. As a result, once lowered, the horizontal load F H rises again, and a phenomenon that is unstable is found. As a result, it has been found that the adhesion of the insulating film 34 cannot be measured.

本発明者等は、上記した現象に着目して、絶縁膜３４の剥離状態における水平荷重ＦＨの変化を最小限に留めることにより、絶縁膜３４の密着性を正確に測定、評価できる手法を提案する。 The present inventors have been focusing on the phenomenon described above, by minimizing the change in the horizontal load F H in the release state of the insulating film 34, accurately measure the adhesion of the insulating film 34, a technique that can be evaluated suggest.

図４に示されているように、剥離状態において、絶縁膜３４によって、幅ｗの切刃１４に加わる力は、摩擦力、抗力、サイド引き裂き力、及び剥離力であり、水平荷重ＦＨは摩擦力、抗力、サイド引き裂き力、及び剥離力の和であらわすことができる。これらの力のうち、剥離力だけを検出できれば、即ち、摩擦力、抗力、サイド引き裂き力を低減できれば、図３に示した剥離後における水平荷重ＦＨが上昇する現象を軽減できるものと考えられる。 As shown in FIG. 4, in the peeled state, the force applied to the cutting blade 14 having the width w by the insulating film 34 is a frictional force, a drag force, a side tearing force, and a peeling force, and the horizontal load F H is It can be expressed as the sum of frictional force, drag, side tearing force, and peeling force. Of these forces, if only the peeling force can be detected, that is, if the frictional force, drag, and side tearing force can be reduced, the phenomenon that the horizontal load F H after peeling shown in FIG. 3 increases can be reduced. .

ここで、サイド引き裂き力は切刃１４の側面が絶縁膜３４を引き裂くことによって生じる力であり、このサイド引き裂き力の影響は、絶縁膜３４に切刃１４と等しい幅を有する切込みを入れることにより低減できる。   Here, the side tearing force is a force generated when the side surface of the cutting edge 14 tears the insulating film 34, and the influence of the side tearing force is obtained by making a cut having a width equal to the cutting edge 14 in the insulating film 34. Can be reduced.

また、抗力は切刃１４のすくい角θを大きくすることによって低減できるものと考えられる。例えば、２０°のすくい角θを有する切刃１４を４０°のすくい角θを有する切刃１４に代えることによって、抗力の影響を軽減できるものと推測される。   Further, it is considered that the drag can be reduced by increasing the rake angle θ of the cutting edge 14. For example, it is presumed that the influence of the drag can be reduced by replacing the cutting edge 14 having a rake angle θ of 20 ° with the cutting edge 14 having a rake angle θ of 40 °.

更に、切刃１４と絶縁膜３４との間の摩擦力を低下させるために、切削速度を低下させることが考えられる。本発明では、切刃１４の水平速度及び垂直速度を１.０μｍ／ｓ及び０.０５μｍ／ｓからそれぞれ０.２μｍ／ｓ及び０.０２μｍ／ｓに低下させることによって、摩擦力の影響を低下させた。   Furthermore, in order to reduce the frictional force between the cutting blade 14 and the insulating film 34, it is conceivable to reduce the cutting speed. In the present invention, the influence of the frictional force is reduced by reducing the horizontal speed and vertical speed of the cutting blade 14 from 1.0 μm / s and 0.05 μm / s to 0.2 μm / s and 0.02 μm / s, respectively. I let you.

次に、摩擦力を更に低下させるために、本発明では、切刃１４と絶縁膜３４との間に潤滑剤を与えることを検討した。実際には、潤滑剤として、水滴を切刃１４と絶縁膜３４との間の接触面に供給することによって、摩擦力を低下させることができた。また、潤滑剤を用いることで、湿度差による水平荷重ＦＨの変化を抑制できることも判明した。 Next, in order to further reduce the frictional force, in the present invention, it was considered to apply a lubricant between the cutting edge 14 and the insulating film 34. Actually, by supplying a water droplet as a lubricant to the contact surface between the cutting blade 14 and the insulating film 34, the frictional force could be reduced. In addition, by using the lubricant, it was also found to be able to suppress a change in horizontal load F H due to humidity difference.

ここで、実際の実験結果について説明する。具体的には、絶縁膜３４として、１．５μｍの膜厚を有する感光性透明樹脂を刃幅１ｍｍの単結晶ダイヤモンド製切刃１４により、切削、剥離した。この場合、切刃１４として２０°のすくい角を有するものを使用した。この結果、絶縁膜３４にサイドカットを施し、水滴を滴下すると共に、水平速度及び垂直速度をそれぞれ０.２μｍ／ｓ及び０．０２μｍ／ｓにした場合、安定した測定結果が得られることが判明した。このように、本発明者等の実験では、切刃１４のすくい角θを大きくしなくても安定に密着性を測定できた。   Here, actual experimental results will be described. Specifically, as the insulating film 34, a photosensitive transparent resin having a film thickness of 1.5 μm was cut and peeled by the single crystal diamond cutting blade 14 having a blade width of 1 mm. In this case, a cutting edge 14 having a rake angle of 20 ° was used. As a result, it was found that a stable measurement result can be obtained when the insulating film 34 is side-cut, a water droplet is dropped, and the horizontal velocity and the vertical velocity are 0.2 μm / s and 0.02 μm / s, respectively. did. Thus, in the experiments by the present inventors, the adhesion could be measured stably without increasing the rake angle θ of the cutting edge 14.

図５を参照すると、本発明に係る薄膜評価方法によって、感光性透明樹脂膜の剥離強度を水平荷重（ｋＮ）の時間的変化を観測することによって評価した結果が示されている。図５に示された横軸の切刃１４の移動時間は前述した切刃１４の移動速度に対応している。   Referring to FIG. 5, there is shown a result of evaluating the peel strength of the photosensitive transparent resin film by observing a temporal change in horizontal load (kN) by the thin film evaluation method according to the present invention. The moving time of the cutting blade 14 on the horizontal axis shown in FIG. 5 corresponds to the moving speed of the cutting blade 14 described above.

図５に示された評価結果は脂環式オレフィン重合体を含む組成物を含む２種類の感光性透明樹脂薄膜における剥離強度を測定した結果である。図示された例は、各感光性透明樹脂薄膜にサイドカットを施すと共に、すくい角２０°で刃幅１ｍｍの単結晶ダイヤモンド製切刃１４を使用し、切刃１４と薄膜との接触面に水滴を滴下した場合における測定結果である。更に、各感光性透明樹脂薄膜の温度を室温に保つと共に、湿度を５３％、７０％に変化させた。図からも明らかな通り、本発明では、湿度には実質的に影響を受けることなく、感光性透明樹脂薄膜の剥離強度を安定に測定できることが分る。   The evaluation results shown in FIG. 5 are the results of measuring the peel strength in two types of photosensitive transparent resin thin films containing a composition containing an alicyclic olefin polymer. In the illustrated example, each photosensitive transparent resin thin film is side-cut and a single crystal diamond cutting blade 14 having a rake angle of 20 ° and a blade width of 1 mm is used, and water droplets are formed on the contact surface between the cutting blade 14 and the thin film. It is a measurement result in the case of dropping. Further, the temperature of each photosensitive transparent resin thin film was kept at room temperature, and the humidity was changed to 53% and 70%. As is apparent from the figure, it can be seen that in the present invention, the peel strength of the photosensitive transparent resin thin film can be stably measured without being substantially affected by humidity.

図６を参照すると、上記した実施例１と同様な測定条件の下で、アクリル系樹脂の剥離強度を測定した結果が示されている。図６からも明らかな通り、水滴を滴下した場合、剥離強度を示す水平荷重を安定に測定できる。   Referring to FIG. 6, the result of measuring the peel strength of the acrylic resin under the same measurement conditions as in Example 1 is shown. As is clear from FIG. 6, when a water droplet is dropped, the horizontal load indicating the peel strength can be measured stably.

前述した測定は、基板の一部に剥離強度を測定する剥離強度測定領域を設け、当該剥離強度測定領域を切刃により切削、剥離することによって測定することが望ましい。この場合、薄膜を含む素子領域と、当該素子領域の周辺に設けられた非素子領域とを有する基板を用意し、基板の非素子領域を部分的に切刃を用いて切削、剥離することにより、素子領域の薄膜の密着性を測定することができる。   The above-described measurement is desirably performed by providing a peel strength measurement region for measuring the peel strength on a part of the substrate, and cutting and peeling the peel strength measurement region with a cutting blade. In this case, a substrate having an element region including a thin film and a non-element region provided around the element region is prepared, and the non-element region of the substrate is partially cut and peeled using a cutting blade. The adhesion of the thin film in the element region can be measured.

以上説明したように、本発明は、フラットディスプレイ装置に使用される薄膜の密着性をあらわす剥離強度を安定に測定できる。更に、本発明は、薄膜の密着を測定するステージを含む電子装置の製造システムに適用できる。   As described above, the present invention can stably measure the peel strength that represents the adhesion of a thin film used in a flat display device. Furthermore, the present invention can be applied to an electronic device manufacturing system including a stage for measuring adhesion of a thin film.

本発明において使用される薄膜評価装置の概略構成を示す図である。It is a figure which shows schematic structure of the thin film evaluation apparatus used in this invention. 図１に示された薄膜評価装置の切刃の動作を説明する図である。It is a figure explaining operation | movement of the cutting blade of the thin film evaluation apparatus shown by FIG. 従来の薄膜評価方法において生じる現象を説明するグラフである。It is a graph explaining the phenomenon which arises in the conventional thin film evaluation method. 薄膜剥離時に、切刃に加わる力を説明する図である。It is a figure explaining the force added to a cutting blade at the time of thin film peeling. 本発明の実施例１に係る測定結果を示すグラフである。It is a graph which shows the measurement result which concerns on Example 1 of this invention. 本発明の実施例２に係る測定結果を示すグラフである。It is a graph which shows the measurement result which concerns on Example 2 of this invention.

符号の説明Explanation of symbols

１０ 支持台
１２ 試料載置台１２
１４ 切刃
１６、１７ 駆動装置
１８ 垂直分力検知器
２０ 変位検出計
２２ 水平分力検知器
２５ 測定試料
３０ ガラス基板
３２ ＩＴＯ膜
３４ 絶縁膜 10 Support table 12 Sample mounting table 12
DESCRIPTION OF SYMBOLS 14 Cutting blade 16, 17 Drive device 18 Vertical component force detector 20 Displacement detector 22 Horizontal component force detector 25 Measurement sample 30 Glass substrate 32 ITO film 34 Insulating film

Claims (6)

電子装置に含まれている薄膜の密着性を評価する方法であって、前記薄膜に切刃を当接した後、切削方向に移動させ、前記薄膜を前記切刃により剥離する移動剥離工程を有し、前記移動剥離工程は、前記切刃の移動の際、前記切刃と前記薄膜との間に潤滑液を供給して、前記切刃と前記薄膜との間の摩擦力を軽減する工程を含んでいることを特徴とする電子装置における薄膜評価方法。   A method for evaluating the adhesion of a thin film included in an electronic device, comprising: a moving peeling step in which a cutting blade is brought into contact with the thin film, then moved in a cutting direction, and the thin film is peeled off by the cutting blade. The moving peeling step includes a step of reducing a frictional force between the cutting blade and the thin film by supplying a lubricating liquid between the cutting blade and the thin film when the cutting blade is moved. A thin film evaluation method for an electronic device, comprising: 請求項１において、前記潤滑液は水であることを特徴とする電子装置における薄膜評価方法。   2. The thin film evaluation method for an electronic device according to claim 1, wherein the lubricating liquid is water. 請求項２において、前記薄膜は感光性樹脂であり、当該感光性樹脂を前記切刃により剥離している間、前記切刃に加わる水平力を実質的に一定に保つことを特徴とする電子装置における薄膜評価方法。   3. The electronic device according to claim 2, wherein the thin film is a photosensitive resin, and a horizontal force applied to the cutting blade is kept substantially constant while the photosensitive resin is peeled off by the cutting blade. Thin film evaluation method. 電子装置に含まれている薄膜の密着性を評価する装置において、前記薄膜を剥離する切刃と、当該切刃を前記薄膜を下地となる層に沿って剥離するように、所定の方向に移動させる手段と、前記切刃の移動中、前記切刃と前記薄膜との間に、潤滑液を供給する手段とを備えていることを特徴とする電子装置における薄膜評価装置。   In an apparatus for evaluating the adhesion of a thin film included in an electronic device, a cutting blade for peeling the thin film, and the cutting blade are moved in a predetermined direction so as to peel the thin film along the underlying layer And a means for supplying a lubricating liquid between the cutting blade and the thin film during movement of the cutting blade. 基板上に薄膜を順次積層して電子装置を製造する電子装置製造システムにおいて、前記薄膜の一部を剥離して、前記薄膜の密着性を測定・評価するステージを含んでいることを特徴とする電子装置製造システム。   In an electronic device manufacturing system for manufacturing an electronic device by sequentially laminating thin films on a substrate, the electronic device manufacturing system includes a stage for peeling off a part of the thin film and measuring and evaluating the adhesion of the thin film Electronic device manufacturing system. 薄膜を含む素子領域と、当該素子領域の周辺に設けられた非素子領域とを有する基板を用意し、前記基板の非素子領域を部分的に切刃を用いて剥離することにより、前記素子領域の薄膜の密着性を測定する基板薄膜の測定方法。

A substrate having an element region including a thin film and a non-element region provided around the element region is prepared, and the element region is separated by partially peeling the non-element region of the substrate using a cutting blade. A method for measuring a thin film of a substrate for measuring the adhesion of the thin film.

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010002279A (en) * 2008-06-19 2010-01-07 Toyota Motor Corp Method for measuring fracture strength
JP2011075286A (en) * 2009-09-29 2011-04-14 Daipura Uintesu Kk Method and device for measuring surface adhesion strength
CN104977254A (en) * 2015-07-20 2015-10-14 深圳市华星光电技术有限公司 Method for comparing adhesive force of composite membrane and determining qualified products
JP2021028969A (en) * 2019-08-09 2021-02-25 株式会社カスタム・クール・センター Vertical fin processing machine

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010002279A (en) * 2008-06-19 2010-01-07 Toyota Motor Corp Method for measuring fracture strength
JP2011075286A (en) * 2009-09-29 2011-04-14 Daipura Uintesu Kk Method and device for measuring surface adhesion strength
CN104977254A (en) * 2015-07-20 2015-10-14 深圳市华星光电技术有限公司 Method for comparing adhesive force of composite membrane and determining qualified products
JP2021028969A (en) * 2019-08-09 2021-02-25 株式会社カスタム・クール・センター Vertical fin processing machine
JP7246604B2 (en) 2019-08-09 2023-03-28 株式会社カスタム・クール・センター vertical fin processing machine

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