JP2005277411A5 - - Google Patents

Claims (4)

A semiconductor die having a plurality of microchannels;
A condenser fluidly connected to the microchannel;
A wicking structure for transporting fluid between the condenser and the semiconductor die by capillary action, the wicking structure selected from porous materials, powders, fibers, nets, and mixtures thereof ,
A loop thermosyphon system, wherein the fluid dissipates heat from the semiconductor die .   Capillary transport of fluid from a condenser to flow into one or more microchannels of a semiconductor die, selected from porous materials, powders, fibers, nets, and mixtures thereof Carrying, including utilizing a wicking structure;
  Conveying heated fluid from the semiconductor die to the condenser;
  Cooling fluid with said condenser,
  A method of cooling a semiconductor die, wherein the fluid removes heat from the semiconductor die.   A semiconductor die having a plurality of microchannels;
  A fluid flow suppressing material provided at the inlet of at least one of the microchannels and allowing fluid to flow preferentially along one direction of the at least one microchannel;
  A condenser fluidly connected to the microchannel, for cooling the heated fluid from the semiconductor die and flowing into the microchannel;
A loop thermosyphon system characterized by comprising:   Conveying fluid from the condenser by capillary action to flow into one or more microchannels of the semiconductor die;
  Disposing a fluid flow inhibiting material at an inlet of the one or more microchannels such that fluid preferentially flows along the one or more microchannels;
  Conveying heated fluid from the semiconductor die to the condenser;
  Cooling fluid with said condenser,
  A method of cooling a semiconductor die, wherein the fluid removes heat from the semiconductor die.