JP2005272871A - Method for manufacturing tin-plated steel sheet - Google Patents

Method for manufacturing tin-plated steel sheet Download PDF

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JP2005272871A
JP2005272871A JP2004084435A JP2004084435A JP2005272871A JP 2005272871 A JP2005272871 A JP 2005272871A JP 2004084435 A JP2004084435 A JP 2004084435A JP 2004084435 A JP2004084435 A JP 2004084435A JP 2005272871 A JP2005272871 A JP 2005272871A
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plating
tin
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steel sheet
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Motohiro Yoshimura
元宏 吉村
Fumio Aoki
文男 青木
Katsuto Kawamura
勝人 河村
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JFE Steel Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for stably manufacturing a tin-plated steel sheet, by establishing a technique for surely controlling a coating mass in a horizontal tin-plating line. <P>SOLUTION: When plating a steel sheet with tin by passing it in the horizontal tin-plating line having a plurality of plating cells and having a part of the cells energized, this manufacturing method includes controlling the final coating mass into a target range, by plating the steel sheet in an energized cell so as to acquire the previously calculated coating mass that includes both of the amount of tin which will dissolve in an unenergized cell placed in a downstream of the energized cell and the target coating mass. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、複数のめっきセルを水平に並べた水平型めっきタンクを用いた水平型錫めっきラインにおいて、錫めっき鋼板を製造する方法に関するものである。   The present invention relates to a method for producing a tin-plated steel sheet in a horizontal tin plating line using a horizontal plating tank in which a plurality of plating cells are arranged horizontally.

一般的な水平型めっきラインの構成を、図1に示すように、脱脂および酸洗された鋼板(ぶりき原板)1は、まず下段に配置した、複数のめっきセル2a〜2jを水平に並べた水平型めっきタンク2に入り、ここで下側に向けた鋼板1の片面に、錫めっきが施される。その後、該片面に錫めっきを施された鋼板1は、反転されたのち、上段に配置した、複数のめっきセル3a〜3jを水平に並べた水平型めっきタンク3に入り、反転後に下側に向いた鋼板1の他方の面に、錫めっきが施される。   As shown in FIG. 1, the structure of a general horizontal plating line is as follows. A steel plate (cover plate) 1 that has been degreased and pickled is first arranged horizontally in a plurality of plating cells 2a to 2j. Then, tin plating is applied to one side of the steel plate 1 facing the lower side. After that, the steel plate 1 plated with tin on one side is inverted, and then enters the horizontal plating tank 3 in which a plurality of plating cells 3a to 3j are arranged horizontally, and is placed on the lower side after the inversion. Tin plating is applied to the other surface of the steel plate 1 facing.

この水平型錫めっきラインには、塩化第一錫と酸性ふっ化ナトリウムを主成分としたハロゲン浴またはメタンスルフォン酸(MSA)浴が用いられ、これらのめっき液は、高電流密度での操業が可能であり、まためっきタンクが水平型で構造が比較的単純であるため、鋼板の通板制御が容易であり、錫めっき鋼板を高速で製造するのに適している。   This horizontal tin plating line uses a halogen bath or methanesulfonic acid (MSA) bath mainly composed of stannous chloride and acidic sodium fluoride, and these plating solutions can be operated at a high current density. Further, since the plating tank is horizontal and the structure is relatively simple, it is easy to control the passing of the steel plate, and it is suitable for producing a tin-plated steel plate at a high speed.

そのために、水平型錫めっきラインでは、錫めっき付着量の異なった種々の錫めっき鋼板が製造されていて、錫めっき付着量および通板速度に応じて電解電流を通電する、めっきセル数を制御している。例えば、図1では、下段の10個のめっきセル2a〜2jのうちセル2aおよび2bを通電し、上段の10個のめっきセル3a〜3jのうちセル3cおよび3dを通電しているが、このように通電するセルを選択して、主に錫めっき付着量の制御を行っている。なお、めっき液4は、各めっきセルと貯蔵タンク5との間で、例えばポンプを介して、循環供給されている。   Therefore, in the horizontal tin plating line, various tin-plated steel sheets with different tin-plating amounts are manufactured, and the number of plating cells is controlled by passing an electrolysis current according to the tin-plating amount and the plate feed speed. doing. For example, in FIG. 1, the cells 2a and 2b are energized among the lower ten plating cells 2a to 2j, and the cells 3c and 3d are energized among the upper ten plating cells 3a to 3j. Thus, the cell to be energized is selected, and the tin plating adhesion amount is mainly controlled. The plating solution 4 is circulated and supplied between each plating cell and the storage tank 5 via, for example, a pump.

かように、水平型錫めっきラインにおいては、通電セル数の増減によってめっき付着量を制御しているが、所期しためっき付着量を得ることが極めて難しいところに、水平型錫めっきラインにおける1つの問題があった。   As described above, in the horizontal tin plating line, the plating adhesion amount is controlled by increasing or decreasing the number of energized cells. However, it is extremely difficult to obtain the desired plating adhesion amount. There were two problems.

ここに、電気めっきにおけるめっき付着量の制御については、例えば特許文献1および2に、めっき条件としてめっき電流を制御することが提案されている。
特開昭63−282296号公報 特開昭64−17890号公報
Here, with respect to the control of the plating adhesion amount in electroplating, for example, Patent Documents 1 and 2 propose controlling the plating current as a plating condition.
JP 63-282296 A JP-A-64-17890

しかしながら、上掲の電気めっき一般のめっき付着量制御を水平型錫めっきラインに適用しても、実効効果は乏しいものであり、水平型錫めっきラインにおけるめっき付着量の制御は、未だ十分に実現されていないのが現状である。   However, even if the above general electroplating control is applied to the horizontal tin plating line, the effective effect is poor, and the control of the electroplating amount in the horizontal tin plating line is still fully realized. The current situation is not.

そこで、本発明の目的は、水平型錫めっきラインにおいてめっき付着量を確実に制御するための手法を確立することによって、錫めっき鋼板を安定して製造する方法を提供することにある。   Accordingly, an object of the present invention is to provide a method for stably producing a tin-plated steel sheet by establishing a technique for reliably controlling the amount of plating adhesion in a horizontal tin plating line.

発明者らは、水平型錫めっきラインにおけるめっき付着量の制御について鋭意究明したところ、水平型錫めっきラインを構成する複数のめっきセルにおけるめっき条件を如何様に調整したとしても、めっき付着量制御が実現しない理由は、水平型錫めっきラインにおいては通電していないめっきセルにも鋼板が通ることから、この際に鋼板に形成されためっき層がめっき液で溶解されることが主原因であること、そして、ここでのめっき層の溶解を考慮することによって、めっき付着量の制御が水平型錫めっきラインにおいても可能であることを見出し、本発明を完成するに至った。   The inventors diligently studied the control of the amount of plating in the horizontal tin plating line, and no matter how the plating conditions in the plurality of plating cells constituting the horizontal tin plating line were adjusted, the amount of plating adhesion was controlled. This is because the steel sheet passes through the plating cell that is not energized in the horizontal tin plating line, and the main reason is that the plating layer formed on the steel sheet is dissolved by the plating solution. In consideration of the dissolution of the plating layer here, it was found that the amount of plating adhesion can be controlled even in the horizontal tin plating line, and the present invention has been completed.

すなわち、本発明の要旨構成は、次のとおりである。
(1)複数のめっきセルを有し、その一部のセルを通電した水平型錫めっきラインに、鋼板を通して錫めっきを施す錫めっき鋼板の製造方法において、
通電セルにおけるめっき付着量を、該通電セルの下流にある通電していないセルでの錫めっきの溶解量を予め目標錫めっき付着量に加算した量として錫めっきを行って、最終錫めっき付着量を目標範囲内に制御することを特徴とする錫めっき鋼板の製造方法。
That is, the gist configuration of the present invention is as follows.
(1) In a method for manufacturing a tin-plated steel sheet, which has a plurality of plating cells, and tin-plats through the steel sheet to a horizontal tin plating line in which some of the cells are energized.
The final tin plating adhesion amount is obtained by performing the tin plating with the plating adhesion amount in the energized cell as the amount obtained by adding the dissolution amount of tin plating in the non-energized cell downstream of the energization cell to the target tin plating adhesion amount in advance. Is controlled to be within a target range.

(2)前記めっきセルのpHが4以下であることを特徴とする上記(1)に記載の錫めっき鋼板の製造方法。 (2) The method for producing a tin-plated steel sheet according to (1) above, wherein the pH of the plating cell is 4 or less.

(3)前記通電していないセルでの錫めっきの溶解量:α(g/m)を、当該セルでの鋼板の浸漬時間:t1(s)および当該セルのめっき液のpH:pH1から、下記式(1)に従って求めることを特徴とする上記(1)または(2)に記載の錫めっき鋼板の製造方法。

α=(−0.004×pH1+0.0370)×t1----(1)
(3) The amount of tin plating dissolved in the non-energized cell: α (g / m 2 ), the immersion time of the steel plate in the cell: t1 (s), and the pH of the plating solution in the cell: pH1 The method for producing a tin-plated steel sheet according to (1) or (2) above, wherein the method is obtained according to the following formula (1).
Α = (− 0.004 × pH1 + 0.0370) × t1 ---- (1)

(4)複数のめっきセルを有する水平型錫めっきラインで鋼板の一方の面に錫めっきを施したのち、該鋼板にめっき液をスプレー供給しながら鋼板の表裏を反転し、その後鋼板の他方の面に錫めっきを施す錫めっき鋼板の製造方法において、
通電セルにおけるめっき付着量を、該通電セルの下流にある通電していないセルでの錫めっきの溶解量と、めっき液のスプレー供給による錫めっきの溶解量とを予め目標錫めっき付着量に加算した量として錫めっきを行って、最終錫めっき付着量を目標範囲内に制御することを特徴とする錫めっき鋼板の製造方法。
(4) After applying tin plating to one side of a steel sheet in a horizontal tin plating line having a plurality of plating cells, the steel sheet is turned over while the plating solution is sprayed onto the steel sheet, and then the other side of the steel sheet is reversed. In the method for producing a tin-plated steel sheet in which the surface is tin-plated,
Add the plating adhesion amount in the current-carrying cell to the target tin-plating adhesion amount beforehand by adding the dissolution amount of tin plating in the non-energized cell downstream of the conduction cell and the dissolution amount of tin plating by spraying the plating solution. A method for producing a tin-plated steel sheet, characterized in that tin plating is performed as an amount, and a final tin plating adhesion amount is controlled within a target range.

(5)前記めっきセルのpHが4以下であることを特徴とする上記(4)に記載の錫めっき鋼板の製造方法。 (5) The method for producing a tin-plated steel sheet according to (4) above, wherein the pH of the plating cell is 4 or less.

(6)前記通電していないセルでの錫めっきの溶解量:α(g/m)を、当該セルでの鋼板の浸漬時間:t1(s)および当該セルのめっき液のpH:pH1から、下記式(1)に従って求めるとともに、めっき液のスプレー供給による錫めっきの溶解量β(g/m)を、めっき液のスプレー供給時間:t2およびスプレー供給されるめっき液のpH:pH2から、下記式(2)に従って求めることを特徴とする上記(4)または(5)に記載の錫めっき鋼板の製造方法。

α=(−0.004×pH1+0.0370)×t1----(1)
β=(−0.0044×pH2+0.0304)×t2----(2)
(6) The amount of tin plating dissolved in the non-energized cell: α (g / m 2 ), the immersion time of the steel plate in the cell: t 1 (s), and the pH of the plating solution in the cell: pH 1 The amount of tin plating dissolved β (g / m 2 ) by the plating solution spray supply is calculated from the following formula (1), and the plating solution spray supply time: t2 and the pH of the plating solution supplied by spraying: pH2 The method for producing a tin-plated steel sheet according to the above (4) or (5), wherein the method is obtained according to the following formula (2).
Α = (− 0.004 × pH1 + 0.0370) × t1 ---- (1)
β = (− 0.0044 × pH2 + 0.0304) × t2 −−−− (2)

本発明によって、水平型錫めっきラインにおいてめっき付着量を確実に制御するための手法が確立するため、所望のめっき付着量の錫めっきを有する鋼板を安定して提供することができる。   According to the present invention, since a method for reliably controlling the amount of plating adhesion in a horizontal tin plating line is established, it is possible to stably provide a steel sheet having tin plating with a desired plating adhesion amount.

さて、水平型錫めっきラインにおいてめっき付着量を確実に制御することが難しいのは、上述したように、通電していないめっきセルを、めっき後の鋼板が通る際に、形成されためっき層がめっき液で溶解されることが主原因であり、従って、ここでのめっき層の溶解を考慮することが肝要である。そこで、本発明では、通電セルの下流にある通電していないセルでの錫めっきの溶解量を、予め目標錫めっき付着量に加算した、錫めっき付着量にて錫めっきを行うこととした。   Now, it is difficult to reliably control the amount of plating in the horizontal tin plating line, as described above, when the plated steel plate passes through the plating cell that is not energized, The main reason is that it is dissolved in the plating solution. Therefore, it is important to consider the dissolution of the plating layer here. Therefore, in the present invention, the tin plating is performed with the tin plating adhesion amount obtained by adding the tin plating dissolution amount in the non-energized cell downstream of the energization cell to the target tin plating adhesion amount in advance.

すなわち、図1に示した水平型錫めっきラインを例に説明すると、このラインでの通電めっきセルは、まずめっきセル2aおよび2bであり、その下流にあるめっきセル2c〜2j、3aおよび3bは通電されていない。従って、通電されていないめっきセル2c〜2j、3aおよび3bでの錫めっきの溶解量を、予め上流のめっきセル2aおよび2bにおける、目標錫めっき付着量に加算した錫めっき付着量にて、めっきセル2aおよび2bで錫めっきを行う。その後の工程においても同様に、通電めっきセル3cおよび3dの下流にある、通電されていないめっきセル3e〜3jでの錫めっきの溶解量を、予め上流のめっきセル3cおよび3dにおける、目標錫めっき付着量に加算した錫めっき付着量にて、めっきセル3cおよび3dで錫めっきを行う。   In other words, taking the horizontal tin plating line shown in FIG. 1 as an example, the energization plating cells in this line are first plating cells 2a and 2b, and the plating cells 2c to 2j, 3a and 3b downstream thereof are Not energized. Accordingly, the amount of tin plating dissolved in the plating cells 2c to 2j, 3a, and 3b that are not energized is preliminarily added to the target tin plating adhesion amount in the upstream plating cells 2a and 2b. Tin plating is performed in the cells 2a and 2b. Similarly, in the subsequent steps, the amount of tin plating dissolved in the non-energized plating cells 3e to 3j downstream of the energizing plating cells 3c and 3d is preliminarily determined as the target tin plating in the upstream plating cells 3c and 3d. Tin plating is performed in the plating cells 3c and 3d with the tin plating adhesion amount added to the adhesion amount.

かように、錫めっき付着量制御を阻害していた、通電していないセルでの錫めっきの溶解量を、通電していないセルの上流の通電セルでのめっき付着量に予め上乗せすることによって、最終的には錫めっき付着量を目標範囲内に制御した錫めっき鋼板を得ることができる。
ここに、目標範囲とは、前記の目標錫めっき付着量に対して許容される上、下限の範囲の錫めっき付着量を言う。
Thus, by adding the amount of tin plating dissolved in the non-energized cell that hinders tin plating adhesion amount control to the amount of plating adhered in the energized cell upstream of the non-energized cell in advance. Finally, it is possible to obtain a tin-plated steel sheet in which the amount of tin plating is controlled within a target range.
Here, the target range refers to a tin plating adhesion amount that is allowed and is in a lower limit range with respect to the target tin plating adhesion amount.

ここで、通電していないセルでの錫めっきの溶解量について、セル内のめっき液のpHを種々に変化させた上で、該セルへの浸漬時間を1sに固定して調査した。その結果を、図2に示すように、通電していないセルでの錫めっきの溶解量:α(g/m)は当該セルのめっき液のpHと相関があり、当該セルでの鋼板の浸漬時間:t1(s)および当該セルのめっき液のpH:pH1から、次式(1)
α=(−0.004×pH1+0.0370)×t1----(1)
に従って求められる。
Here, the amount of tin plating dissolved in a non-energized cell was investigated by varying the pH of the plating solution in the cell and fixing the immersion time in the cell to 1 s. As shown in FIG. 2, the dissolution amount of tin plating in a cell that is not energized: α (g / m 2 ) is correlated with the pH of the plating solution in the cell, and the result is shown in FIG. From the immersion time: t1 (s) and the pH of the plating solution in the cell: pH1, the following formula (1)
α = (− 0.004 × pH1 + 0.0370) × t1 ---- (1)
As required.

従って、上記の式(1)に従って、通電していないセルでの錫めっきの溶解量を求め、また通電していないセルが複数であれば各セルでの溶解量を合計し、かくして得られた溶解量を、上流の通電セルでのめっき付着量に予め上乗せすればよい。   Therefore, according to the above formula (1), the dissolution amount of the tin plating in the non-energized cell was obtained, and if there were a plurality of non-energized cells, the dissolution amount in each cell was totaled and thus obtained. What is necessary is just to add the amount of melt | dissolution beforehand to the plating adhesion amount in an upstream electricity supply cell.

なお、上式(1)によれば、通電していないセルでの錫めっきの溶解量は当該セルのめっき液のpHに比例しているから、めっきセル内のめっき液が同じpHである場合は、最初の通電セル(またはセル群)の下流にある全ての通電していないセルでの錫めっきの溶解量を合算し、これを最終的な目標めっき付着量に加算した結果に基づいて、全通電セルを対象としてめっき条件を調整すればよい。
一方、めっきセル内のめっき液のpHが異なる場合は、通電セル(またはセル群)と、その下流にある通電していないセル(またはセル群)とを組とし、この組毎に、下流にある通電していない各セルでの錫めっきの溶解量を合計したものを、上流の通電セル(またはセル群)における目標めっき付着量に加算しためっき付着量に基づいてめっき条件を調整すればよい。
According to the above formula (1), the amount of tin plating dissolved in a cell that is not energized is proportional to the pH of the plating solution in the cell, so the plating solution in the plating cell has the same pH. Is based on the result of adding the amount of tin plating dissolved in all non-energized cells downstream of the first energized cell (or group of cells) and adding this to the final target plating adhesion, The plating conditions may be adjusted for all energized cells.
On the other hand, when the pH of the plating solution in the plating cell is different, the energized cell (or cell group) and the non-energized cell (or cell group) located downstream of the cell are paired, and for each group, downstream What is necessary is just to adjust plating conditions based on the plating adhesion amount which added the total amount of dissolution of the tin plating in each non-energized cell to the target plating adhesion amount in the upstream energization cell (or cell group) .

また、水平型錫めっきラインでは、図1に示したように、下段の水平型めっきタンク2で一方の面にめっきを施された鋼板1は、反転されたのち、上段の水平型めっきタンク3にて、反転後に下側に向いた鋼板1の他方の面に錫めっきが施されるが、この鋼板の反転過程において、鋼板表面が乾燥して汚染されないように、図3に示すように、主にめっき液をノズル6からスプレー供給することが、一般的に行われている。   In the horizontal tin plating line, as shown in FIG. 1, the steel plate 1 plated on one surface in the lower horizontal plating tank 2 is inverted, and then the upper horizontal plating tank 3. Then, tin plating is performed on the other surface of the steel sheet 1 facing downward after the reversal, but in the reversal process of the steel sheet, as shown in FIG. In general, the plating solution is mainly sprayed from the nozzle 6.

このように、鋼板の反転工程が通電しためっきセルの下流にある場合は、このめっき液のスプレー供給による吹き付け過程においても錫めっきが溶解するため、このめっき液の吹き付けによる錫めっきの溶解量も考慮する必要がある。従って、上記した通電セルの下流にある通電していないセルでの錫めっきの溶解量に加えて、めっき液のスプレー供給による錫めっきの溶解量とを、予め目標錫めっき付着量に加算した、錫めっき付着量にて錫めっきを行って、最終錫めっき付着量を目標範囲内に制御することが肝要である。   Thus, when the steel plate reversal process is downstream of the energized plating cell, tin plating dissolves even in the spraying process by spray supply of this plating solution. It is necessary to consider. Therefore, in addition to the amount of tin plating dissolved in the non-energized cell downstream of the above-described energized cell, the amount of tin plating dissolved by spray supply of the plating solution was added in advance to the target tin plating adhesion amount, It is important to control the final tin plating adhesion amount within the target range by performing tin plating with the tin plating adhesion amount.

ここで、スプレー供給による錫めっきの溶解量について、スプレー供給されるめっき液のpHを種々に変化させた上で、めっき液のスプレー供給時間を1sに固定して調査した。その結果を、図4に示すように、スプレー供給による錫めっきの溶解量β(g/m)はスプレー供給されるめっき液のpHと相関があり、めっき液のスプレー供給時間t2(s)およびスプレー供給されるめっき液のpH:pH2から、次式
β=(−0.0044×pH2+0.0304)×t2
に従って求められる。
Here, the amount of tin plating dissolved by spray supply was investigated by varying the pH of the plating solution supplied by spraying and fixing the spray supply time of the plating solution to 1 s. As shown in FIG. 4, the dissolution amount β (g / m 2 ) of tin plating by spray supply correlates with the pH of the plating solution supplied by spray supply, and the plating solution spray supply time t 2 (s) And the pH of the plating solution supplied by spraying: From pH 2, the following formula: β = (− 0.0044 × pH 2 +0.0304) × t 2
As required.

そして、上記の式に従って求めた、スプレー供給による錫めっきの溶解量を、上記した通電セルの下流にある通電していないセルでの錫めっきの溶解量とともに、上流の通電セルでのめっき付着量に予め上乗せすれば、錫めっき付着量を目標範囲内に制御することが可能となる。   Then, the amount of tin plating dissolved by spray supply, obtained in accordance with the above equation, together with the amount of tin plating dissolved in the non-energized cell downstream of the above-described energized cell, as well as the amount of plating deposited in the upstream energized cell If it is added in advance, it becomes possible to control the tin plating adhesion amount within the target range.

図5に示す水平型錫めっきライン(めっきセル長:各2500mm)において、ぶりき原板(低炭素鋼板)の表裏面に、下記の条件にて錫めっきを表1に示す目標めっき付着量の下で施すに当たり、表2に示す通電していないセルでの錫めっきの溶解量を加味した補正を、表3に示すように行った。かくして得られた、錫めっき鋼板について、めっき付着量について調査した結果を、表4に示す。また、比較として、通電していないセルでの錫めっきの溶解量を加味した補正を行わない場合について、同様にめっき付着量を調査した。この比較例における、無通電セルによる溶解量を表5に、実測しためっき付着量を表6に示す。なお、鋼板の反転過程において、純水を供給して鋼板の乾燥を防止した。

めっき液組成:
塩化第一すず:75g/l
弗化ナトリウム:25g/l
弗化水素カリウム:55g/l
塩化ナトリウム:45g/l
Sn2+:36g/l
Sn4+:1g/l
pH:3.5
添加剤(界面活性剤):1〜2g/l
温度:65℃
電流密度:60〜70A/dm2
通板速度:3333 mm/s (200m/min)
In the horizontal tin plating line (plating cell length: 2500 mm each) shown in FIG. 5, tin plating is applied to the front and back surfaces of the tin plate (low carbon steel plate) under the following conditions as shown in Table 1. As shown in Table 3, correction was made in consideration of the dissolution amount of tin plating in the non-energized cells shown in Table 2. Table 4 shows the results of the investigation on the amount of coating on the tin-plated steel sheet thus obtained. Further, as a comparison, the amount of plating adhesion was similarly investigated in the case where no correction was made in consideration of the dissolution amount of tin plating in a non-energized cell. In this comparative example, the dissolution amount by the non-energized cell is shown in Table 5, and the measured plating adhesion amount is shown in Table 6. In addition, in the inversion process of the steel plate, pure water was supplied to prevent the steel plate from drying.
Plating solution composition:
First tin chloride: 75g / l
Sodium fluoride: 25g / l
Potassium hydrogen fluoride: 55 g / l
Sodium chloride: 45g / l
Sn 2+ : 36g / l
Sn 4+ : 1g / l
pH: 3.5
Additive (surfactant): 1-2 g / l
Temperature: 65 ℃
Current density: 60 to 70 A / dm 2
Feeding speed: 3333 mm / s (200m / min)

Figure 2005272871
Figure 2005272871

Figure 2005272871
Figure 2005272871

Figure 2005272871
Figure 2005272871

Figure 2005272871
Figure 2005272871

Figure 2005272871
Figure 2005272871

Figure 2005272871
Figure 2005272871

図6に示す水平型錫めっきライン(めっきセル長:各2500mm)において、ぶりき原板(低炭素鋼板)の表裏面に、下記の条件にて錫めっきを表7に示す目標めっき付着量の下で施すに当たり、表8に示す通電していないセルでの錫めっきの溶解量並びにめっき液のスプレー供給による錫めっきの溶解量を加味した補正を、表9に示すように行った。かくして得られた、錫めっき鋼板について、めっき付着量について調査した結果を、表10に示す。また、比較として、通電していないセルでの錫めっきの溶解量を加味した補正を行わない場合について、同様にめっき付着量を調査した。この比較例における、無通電セルによる溶解量を表11に、実測しためっき付着量を表12に示す。

めっき液組成:
塩化第一すず:75g/l
弗化ナトリウム:25g/l
弗化水素カリウム:55g/l
塩化ナトリウム:45g/l
Sn2+:36g/l
Sn4+:1g/l
添加剤(界面活性剤):1〜2g/l
pH:3.5
温度:65℃
電流密度:60〜70A/dm2
通板速度:3333 mm/s (200m/min)
反転時スプレー供給めっき液のpH:3.5
反転時めっき液スプレー供給時間:1.14s
In the horizontal tin plating line (plating cell length: 2500 mm each) shown in FIG. 6, tin plating is applied to the front and back surfaces of the tin plate (low carbon steel plate) under the following conditions under the target plating adhesion amount shown in Table 7. As shown in Table 9, corrections were made in consideration of the dissolution amount of tin plating in a non-energized cell shown in Table 8 and the dissolution amount of tin plating by spray supply of the plating solution. Table 10 shows the results of the investigation on the amount of coating on the tin-plated steel sheet thus obtained. Further, as a comparison, the amount of plating adhesion was similarly investigated in the case where no correction was made in consideration of the amount of tin plating dissolved in a non-energized cell. Table 11 shows the dissolution amount of the non-energized cell in this comparative example, and Table 12 shows the measured plating adhesion amount.
Plating solution composition:
First tin chloride: 75g / l
Sodium fluoride: 25g / l
Potassium hydrogen fluoride: 55 g / l
Sodium chloride: 45g / l
Sn 2+ : 36g / l
Sn 4+ : 1g / l
Additive (surfactant): 1-2 g / l
pH: 3.5
Temperature: 65 ℃
Current density: 60 to 70 A / dm 2
Feeding speed: 3333 mm / s (200m / min)
PH of spray supply plating solution during reversal: 3.5
Inversion plating spray supply time: 1.14s

Figure 2005272871
Figure 2005272871

Figure 2005272871
Figure 2005272871

Figure 2005272871
Figure 2005272871

Figure 2005272871
Figure 2005272871

Figure 2005272871
Figure 2005272871

Figure 2005272871
Figure 2005272871

図5に示す水平型錫めっきライン(めっきセル長:各2500mm)において、ぶりき原板(低炭素鋼板)の表裏面に、下記の条件にて錫めっきを表13に示す目標めっき付着量の下で施すに当たり、表14に示す通電していないセルでの錫めっきの溶解量を加味した補正を、表15に示すように行った。かくして得られた、錫めっき鋼板について、めっき付着量について調査した結果を、表16に示す。また、比較として、通電していないセルでの錫めっきの溶解量を加味した補正を行わない場合について、同様にめっき付着量を調査した。この比較例における、無通電セルによる溶解量を表17に、実測しためっき付着量を表18に示す。なお、鋼板の反転過程において、純水を供給して鋼板の乾燥を防止した。

めっき液組成:
メタンスルフォン酸:20〜50ml/l
Sn2+:20〜30g/l
光沢剤:40〜60ml/l
酸化防止剤(錫イオンの酸化防止):15〜25ml/l
H2SO4 (96mass%):0.5〜1.6ml/l
pH:1.0
電流密度:60〜70A/dm2
通板速度:3333 mm/s (200m/min)
In the horizontal tin plating line (plating cell length: 2500 mm each) shown in FIG. 5, tin plating is performed on the front and back surfaces of the tin plate (low carbon steel plate) under the following conditions as shown in Table 13 As shown in Table 15, correction was made in consideration of the dissolution amount of tin plating in the non-energized cell shown in Table 14. Table 16 shows the results of investigating the coating adhesion amount of the tin-plated steel sheet thus obtained. Further, as a comparison, the amount of plating adhesion was similarly investigated in the case where no correction was made in consideration of the amount of tin plating dissolved in a non-energized cell. In this comparative example, the dissolution amount by the non-energized cell is shown in Table 17, and the actually measured plating adhesion amount is shown in Table 18. In addition, in the inversion process of the steel plate, pure water was supplied to prevent the steel plate from drying.
Plating solution composition:
Methanesulfonic acid: 20-50ml / l
Sn 2+ : 20-30g / l
Brightener: 40-60ml / l
Antioxidant (antioxidation of tin ion): 15-25ml / l
H 2 SO 4 (96 mass%): 0.5-1.6ml / l
pH: 1.0
Current density: 60 to 70 A / dm 2
Feeding speed: 3333 mm / s (200m / min)

Figure 2005272871
Figure 2005272871

Figure 2005272871
Figure 2005272871

Figure 2005272871
Figure 2005272871

Figure 2005272871
Figure 2005272871

Figure 2005272871
Figure 2005272871

Figure 2005272871
Figure 2005272871

図6に示す水平型錫めっきライン(めっきセル長:各2500mm)において、ぶりき原板(低炭素鋼板)の表裏面に、下記の条件にて錫めっき表19に示す目標めっき付着量の下でを施すに当たり、表20に示す通電していないセルでの錫めっきの溶解量並びにめっき液のスプレー供給による錫めっきの溶解量を加味した補正を、表21に示すように行った。かくして得られた、錫めっき鋼板について、めっき付着量について調査した結果を、表22に示す。また、比較として、通電していないセルでの錫めっきの溶解量を加味した補正を行わない場合について、同様にめっき付着量を調査した。この比較例における、無通電セルによる溶解量を表23に、実測しためっき付着量を表24に示す。

めっき液組成:
メタンスルフォン酸:20〜50ml/l
Sn2+:20〜30g/l
光沢剤:40〜60ml/l
酸化防止剤(錫イオンの酸化防止):15〜25ml/l
H2SO4 (96mass%):0.5〜1.6ml/l
pH:1.0
電流密度:60〜70A/dm2
通板速度:3333 mm/s (200m/min)
反転時スプレー供給めっき液のpH:1.0
反転時めっき液スプレー供給時間:1.14s
In the horizontal tin plating line (plating cell length: 2500 mm each) shown in FIG. 6, on the front and back surfaces of the tin plate (low carbon steel plate) under the target plating adhesion amount shown in tin plating table 19 under the following conditions: As shown in Table 21, corrections were made in consideration of the dissolution amount of tin plating in a non-energized cell shown in Table 20 and the dissolution amount of tin plating by spray supply of the plating solution. Table 22 shows the results of investigating the amount of coating on the tin-plated steel sheet thus obtained. Further, as a comparison, the amount of plating adhesion was similarly investigated in the case where no correction was made in consideration of the amount of tin plating dissolved in a non-energized cell. Table 23 shows the dissolution amount of the non-energized cell in this comparative example, and Table 24 shows the actually measured plating adhesion amount.
Plating solution composition:
Methanesulfonic acid: 20-50ml / l
Sn 2+ : 20-30g / l
Brightener: 40-60ml / l
Antioxidant (antioxidation of tin ion): 15-25ml / l
H 2 SO 4 (96 mass%): 0.5-1.6ml / l
pH: 1.0
Current density: 60 to 70 A / dm 2
Feeding speed: 3333 mm / s (200m / min)
PH of spray supply plating solution during reversal: 1.0
Inversion plating spray supply time: 1.14s

Figure 2005272871
Figure 2005272871

Figure 2005272871
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Figure 2005272871
Figure 2005272871

Figure 2005272871
Figure 2005272871

Figure 2005272871
Figure 2005272871

Figure 2005272871
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以上に示す様に実施例では水平型めっきラインにおいて、めっき付着量を確実に制御することができた。一方、比較例では通電しないセル又はめっき液スプレーによる溶解によってめっき付着量の制御が不充分であった。   As described above, in the examples, the amount of plating adhesion could be reliably controlled in the horizontal plating line. On the other hand, in the comparative example, control of the amount of plating was insufficient due to dissolution by a non-energized cell or plating solution spray.

本発明は、ハロゲン浴およびMSA浴について説明したが、これら以外にもフェロスタン浴(フェノールスルフォン酸すず浴)、アルカリ浴(すず酸ソーダ、苛性ソーダ浴)を用いた水平型すずめっき方法への適用が可能である。   Although the present invention has been described with respect to the halogen bath and the MSA bath, the present invention can be applied to a horizontal tin plating method using a ferrostan bath (phenol sulfonic acid tin bath) or an alkaline bath (sodium stannate or caustic soda bath). Is possible.

水平型すずめっきラインの構成を示す図である。It is a figure which shows the structure of a horizontal type | mold tin plating line. 通電していないセルでの錫めっきの溶解速度を示す図である。It is a figure which shows the dissolution rate of the tin plating in the cell which is not supplying with electricity. 水平型すずめっきラインの別の構成を示す図である。It is a figure which shows another structure of a horizontal type | mold tin plating line. めっき液のスプレー供給による錫めっきの溶解速度を示す図である。It is a figure which shows the melt | dissolution rate of the tin plating by the spray supply of a plating solution. 実施例1と2に用いた水平型すずめっきラインの構成を示す図である。It is a figure which shows the structure of the horizontal type | mold tin plating line used for Example 1 and 2. FIG. 実施例2と4に用いた水平型すずめっきラインの構成を示す図である。It is a figure which shows the structure of the horizontal tin-plating line used for Example 2 and 4. FIG.

符号の説明Explanation of symbols

1 鋼板
2、3 水平型めっきタンク
2a〜2j、3a〜3j めっきセル
4 めっき液
5 貯留タンク
DESCRIPTION OF SYMBOLS 1 Steel plate 2, 3 Horizontal type plating tank 2a-2j, 3a-3j Plating cell 4 Plating solution 5 Storage tank

Claims (6)

複数のめっきセルを有し、その一部のセルを通電した水平型錫めっきラインに、鋼板を通して錫めっきを施す錫めっき鋼板の製造方法において、
通電セルにおけるめっき付着量を、該通電セルの下流にある通電していないセルでの錫めっきの溶解量を予め目標錫めっき付着量に加算した量として錫めっきを行って、最終錫めっき付着量を目標範囲内に制御することを特徴とする錫めっき鋼板の製造方法。
In the method for producing a tin-plated steel sheet, which has a plurality of plating cells, and in which a tin plate is plated through a steel sheet to a horizontal tin plating line energized through some of the cells,
The final tin plating adhesion amount is obtained by performing the tin plating with the plating adhesion amount in the energized cell as the amount obtained by adding the dissolution amount of tin plating in the non-energized cell downstream of the energization cell to the target tin plating adhesion amount in advance. Is controlled to be within a target range.
前記めっきセルのpHが4以下であることを特徴とする請求項1に記載の錫めっき鋼板の製造方法。   The method for producing a tin-plated steel sheet according to claim 1, wherein the pH of the plating cell is 4 or less. 前記通電していないセルでの錫めっきの溶解量:α(g/m)を、当該セルでの鋼板の浸漬時間:t1(s)および当該セルのめっき液のpH:pH1から、下記式(1)に従って求めることを特徴とする請求項1または2に記載の錫めっき鋼板の製造方法。

α=(−0.004×pH1+0.0370)×t1----(1)
The dissolution amount of tin plating in the non-energized cell: α (g / m 2 ), the immersion time of the steel plate in the cell: t 1 (s) and the pH of the plating solution in the cell: pH 1 The method for producing a tin-plated steel sheet according to claim 1 or 2, wherein the method is obtained according to (1).
Α = (− 0.004 × pH1 + 0.0370) × t1 ---- (1)
複数のめっきセルを有する水平型錫めっきラインで鋼板の一方の面に錫めっきを施したのち、該鋼板にめっき液をスプレー供給しながら鋼板の表裏を反転し、その後鋼板の他方の面に錫めっきを施す錫めっき鋼板の製造方法において、
通電セルにおけるめっき付着量を、該通電セルの下流にある通電していないセルでの錫めっきの溶解量と、めっき液のスプレー供給による錫めっきの溶解量とを予め目標錫めっき付着量に加算した量として錫めっきを行って、最終錫めっき付着量を目標範囲内に制御することを特徴とする錫めっき鋼板の製造方法。
After applying tin plating to one side of a steel sheet in a horizontal tin plating line having a plurality of plating cells, the front and back of the steel sheet are reversed while supplying a plating solution to the steel sheet, and then tin is applied to the other side of the steel sheet. In the method for producing a tin-plated steel sheet to be plated,
Add the plating adhesion amount in the current-carrying cell to the target tin-plating adhesion amount beforehand by adding the dissolution amount of tin plating in the non-energized cell downstream of the conduction cell and the dissolution amount of tin plating by spraying the plating solution. A method for producing a tin-plated steel sheet, characterized in that tin plating is performed as an amount, and a final tin plating adhesion amount is controlled within a target range.
前記めっきセルのpHが4以下であることを特徴とする請求項4に記載の錫めっき鋼板の製造方法。   The method for producing a tin-plated steel sheet according to claim 4, wherein the plating cell has a pH of 4 or less. 前記通電していないセルでの錫めっきの溶解量:α(g/m)を、当該セルでの鋼板の浸漬時間:t1(s)および当該セルのめっき液のpH:pH1から、下記式(1)に従って求めるとともに、めっき液のスプレー供給による錫めっきの溶解量β(g/m)を、めっき液のスプレー供給時間:t2およびスプレー供給されるめっき液のpH:pH2から、下記式(2)に従って求めることを特徴とする請求項4または5に記載の錫めっき鋼板の製造方法。

α=(−0.004×pH1+0.0370)×t1----(1)
β=(−0.0044×pH2+0.0304)×t2----(2)
The dissolution amount of tin plating in the non-energized cell: α (g / m 2 ), the immersion time of the steel plate in the cell: t 1 (s) and the pH of the plating solution in the cell: pH 1 In accordance with (1), the dissolution amount β (g / m 2 ) of tin plating by spray supply of the plating solution is calculated from the following formula using the spray supply time of the plating solution: t2 and the pH of the plating solution supplied: pH2. The method for producing a tin-plated steel sheet according to claim 4 or 5, wherein the method is obtained according to (2).
Α = (− 0.004 × pH1 + 0.0370) × t1 ---- (1)
β = (− 0.0044 × pH2 + 0.0304) × t2 −−−− (2)
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102469695A (en) * 2010-10-29 2012-05-23 海尔集团公司 Printed circuit board, tinning line thereof and tinning method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102469695A (en) * 2010-10-29 2012-05-23 海尔集团公司 Printed circuit board, tinning line thereof and tinning method thereof

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