JP2005259767A - Semiconductor manufacturing system - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing system that can improve the uniformity of the dimensions of resist patterns among wafers, by fixing wafer pulling and placing time, after exposure. <P>SOLUTION: The semiconductor manufacturing system generates exposure end time data, based on the exposing condition data read from a storage device 73 by means of the exposure end time data generating means 71 of an exposure system 70. Then the system transmits the generated exposure end time data to a coating and development device 20 by means of an exposure end time data transmitting means 72. In addition, the system temporarily stops a wafer transfer cycle, by means of a transfer cycle temporarily stop means 22, based on the exposure end time data received by a means of an exposure end time data receiving means 21; and, at the same time, causes a transfer device to stand by, in matching with the transfer of wafers from the exposure system 70. After the exposed wafer is transferred to a heating and cooling unit, the system resumes the temporarily stopped wafer transfer cycle, by means of a wafer transfer cycle resuming means 23. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a semiconductor manufacturing system having a coating and developing apparatus and an exposure apparatus, and more particularly to control of a holding time after exposure.

  In a lithography process of a semiconductor device manufacturing process, a semiconductor manufacturing system having a coating and developing apparatus and an exposure apparatus is used (for example, refer to Patent Document 1).

Along with the miniaturization of the resist pattern, it is required to improve the in-plane uniformity of pattern dimensions and the dimensional uniformity between wafers.
In order to improve in-plane uniformity of pattern dimensions, uniformity of coating thickness of resist and antireflection film, uniformity of hot plate used for baking after resist coating and baking after exposure (PEB), developer And a method of improving the discharge uniformity of the rinsing liquid.

  Multiple units used in the same process, such as uniformity between heating plate heating units, uniformity between coating and developing units, uniformity between cooling plate cooling units, etc. to improve dimensional uniformity between wafers A method for reducing the performance difference between them is mentioned.

Further, in order to improve the dimensional uniformity between wafers, there is a method of making the wafer exposure time (post exposure delay, hereinafter referred to as “PED”) after exposure constant. In order to make the PED constant, there is a method of making the time (cycle time) remaining in each unit used in the same process constant. In this method, the unit A having the longest processing time T _A is used as a reference, and in the unit _B having the processing time TB shorter than the unit A, an extra dwell time T _W is retained after the processing. That is, the relationship T _A = T _B + T _W is obtained.
The exposure apparatus is also considered as one unit, not limited to the unit in the coating and developing apparatus. Therefore, in order to make PED constant, it is necessary to make the cycle time of the exposure apparatus constant.

Japanese Patent Laying-Open No. 2003-77820 (6th page, FIG. 14)

However, the cycle time is not constant when performing laser gas exchange or gas activation (injection) before or during exposure, or when alignment requires time.
Further, when the first wafer of the lot is exposed, measurement / correction that is not performed when the second and subsequent wafers are exposed is performed in the exposure apparatus. For example, focus position measurement / correction, focus sensor brightness / darkness measurement, focus sensor pattern offset measurement, alignment baseline measurement, alignment optical system focus correction, and the like. Also in this case, the cycle time is not constant.
Thus, in the exposure apparatus, it is difficult to make the cycle time constant, and the exposure end time does not become a constant interval.

Incidentally, the wafer conveyance cycle in the coating and developing apparatus is performed at regular intervals. That is, the transport device of the coating and developing apparatus picks up the exposed wafer at regular intervals and transports it to the heating unit. Therefore, when the wafer transfer cycle is adjusted to the exposure processing time T _E1 of the first wafer, the second and subsequent wafers whose exposure processing time T _E2 is shorter than this T _E1 are transferred until the start of transfer to the heating unit. It stays in the exposure apparatus for a period of T _E1 -T _E2 . Therefore, there is a problem that the PED cannot be made constant between the first wafer and the second and subsequent wafers. Therefore, there is a problem that the uniformity of resist pattern dimension between wafers is poor.

  The present invention has been made to solve the above-described conventional problems, and an object thereof is to improve the uniformity of resist pattern dimensions between wafers by making the wafer holding time after exposure constant.

A semiconductor manufacturing system according to the present invention is a semiconductor manufacturing system in which a coating and developing apparatus having a heating unit and an exposure apparatus are connected via a communication line,
The exposure apparatus includes:
A storage device for storing exposure condition data;
Exposure end time data generating means for reading exposure condition data from the storage device, estimating an exposure end time based on the read exposure condition data, and generating exposure end time data;
Exposure end time data transmitting means for transmitting the exposure end time data generated by the exposure end time data generating means to the coating and developing apparatus via the communication line, and
The coating and developing apparatus includes:
Exposure end time data receiving means for receiving the exposure end time data transmitted by the exposure end time data transmitting means of the exposure apparatus via the communication line;
Based on the exposure end time data received by the exposure end time data receiving means, the transfer cycle for temporarily stopping the wafer transfer cycle in the coating and developing apparatus and waiting for the transfer mechanism in accordance with the wafer transfer from the exposure apparatus. A suspension means;
A transfer cycle restarting unit for restarting the wafer transfer cycle temporarily stopped by the transfer cycle temporary stop unit after transferring the wafer unloaded from the exposure apparatus to the heating unit; .

A semiconductor manufacturing system according to the present invention is a semiconductor manufacturing system in which a coating and developing apparatus having a heating unit and an exposure apparatus are connected via a communication line,
The coating and developing apparatus includes:
A storage device for storing transfer timing data of a wafer transfer cycle of the coating and developing apparatus;
Conveyance timing data transmitting means for reading conveyance timing data from the storage device and transmitting the read conveyance timing data to the exposure apparatus via the communication line;
A transport cycle control means for controlling a wafer transport cycle in the coating and developing apparatus based on the transport timing data;
The exposure apparatus includes:
Transport timing data receiving means for receiving the transport timing data transmitted by the transport timing data transmitting means of the coating and developing apparatus via the communication line;
Exposure start time determining means for determining the start time of exposure processing based on the transport timing data received by the transport timing data receiving means,
The transfer cycle control means transfers the wafer unloaded from the exposure apparatus to the heating unit based on transfer timing data.

A semiconductor manufacturing system according to the present invention is a semiconductor manufacturing system in which a coating and developing apparatus having a heating unit and an exposure apparatus are connected via a communication line,
The coating and developing apparatus includes:
A storage device for storing transfer timing data of a wafer transfer cycle of the coating and developing apparatus;
Conveyance timing data transmitting means for reading conveyance timing data from the storage device and transmitting the read conveyance timing data to the exposure apparatus via the communication line;
A transport cycle control means for controlling a wafer transport cycle in the coating and developing apparatus based on the transport timing data;
The exposure apparatus includes:
Transport timing data receiving means for receiving the transport timing data transmitted by the transport timing data transmitting means of the coating and developing apparatus via the communication line;
Exposure start time determining means for determining an exposure processing start time based on the transport timing data received by the transport timing data receiving means;
A storage device for storing exposure condition data;
Exposure end time data generating means for reading exposure condition data from the storage device, estimating an exposure end time based on the read exposure condition data, and generating exposure end time data;
Exposure end time data transmitting means for transmitting the exposure end time data generated by the exposure end time data generating means to the coating and developing apparatus via the communication line, and
The transport cycle control means of the coating and developing apparatus includes:
Exposure end time data receiving means for receiving the exposure end time data transmitted by the exposure end time data transmitting means via the communication line;
When the exposure end time data received by the exposure end time data receiving means is different from the transfer timing data, the wafer transfer cycle in the coating and developing apparatus is temporarily stopped and the wafer is transferred from the exposure apparatus. A transport cycle suspension means for waiting the transport mechanism;
A transfer cycle restarting unit for restarting the wafer transfer cycle temporarily stopped by the transfer cycle temporary stop unit after transferring the wafer unloaded from the exposure apparatus to the heating unit; .

A semiconductor manufacturing system according to the present invention is a semiconductor manufacturing system having a coating and developing apparatus having a heating unit, an exposure apparatus, and a control apparatus connected to the coating and developing apparatus and the exposure apparatus through a communication line. ,
The coating and developing apparatus includes a transfer cycle control unit that controls a wafer transfer cycle in the coating and developing apparatus,
The exposure apparatus includes:
A storage device for storing exposure condition data;
Exposure end time data generating means for reading exposure conditions from the storage device, estimating exposure end time based on the read exposure conditions, and generating exposure end time data;
Exposure end time data transmitting means for transmitting the exposure end time data generated by the exposure end time data generating means to the control device via the communication line;
The control device includes:
Exposure end time data receiving means for receiving the exposure end time data transmitted by the exposure end time data transmitting means of the exposure apparatus via the communication line;
Based on the exposure end time data received by the exposure end time data receiving means, the transfer cycle for temporarily stopping the wafer transfer cycle in the coating and developing apparatus and waiting for the transfer mechanism in accordance with the wafer transfer from the exposure apparatus. A temporary stop signal transmitting means for transmitting a temporary stop signal to the transport cycle control means via the communication line;
After the wafer unloaded from the exposure apparatus is transferred to the heating unit, a transfer cycle restart signal for restarting the wafer transfer cycle temporarily stopped by the transfer cycle pause signal is sent to the transfer cycle control means. And a resumption signal transmission means for transmitting via.

A semiconductor manufacturing system according to the present invention is a semiconductor manufacturing system having a coating and developing apparatus having a heating unit, an exposure apparatus, and a control apparatus connected to the coating and developing apparatus and the exposure apparatus through a communication line. ,
The coating and developing apparatus includes:
A storage device for storing transfer timing data of a wafer transfer cycle of the coating and developing apparatus;
Conveyance timing data transmitting means for reading conveyance timing data from the storage device and transmitting the read conveyance timing data to the control device via the communication line;
A transport cycle control means for controlling a wafer transport cycle in the coating and developing apparatus based on the transport timing data;
The control device includes:
Transport timing data receiving means for receiving the transport timing data transmitted by the transport timing data transmitting means of the coating and developing apparatus via the communication line;
Exposure start time determining means for determining an exposure processing start time based on the transport timing data received by the transport timing data receiving means;
Exposure start time transmitting means for transmitting the exposure start time determined by the exposure start time determining means to the exposure apparatus via the communication line;
The exposure apparatus includes exposure start time receiving means for receiving the exposure start time transmitted by the exposure start time transmitting means of the control device via the communication line, and performs an exposure process based on the received exposure start time. Done
The transfer cycle control means transfers the wafer unloaded from the exposure apparatus to the heating unit based on transfer timing data.

A semiconductor manufacturing system according to the present invention is a semiconductor manufacturing system having a coating and developing apparatus having a heating unit, an exposure apparatus, and a control apparatus connected to the coating and developing apparatus and the exposure apparatus through a communication line. ,
The coating and developing apparatus includes:
A storage device for storing transfer timing data of a wafer transfer cycle of the coating and developing apparatus;
Conveyance timing data transmitting means for reading conveyance timing data from the storage device and transmitting the read conveyance timing data to the control device via the communication line;
A transport cycle control means for controlling a wafer transport cycle in the coating and developing apparatus based on the transport timing data;
The control device includes:
Transport timing data receiving means for receiving the transport timing data transmitted by the transport timing data transmitting means of the coating and developing apparatus via the communication line;
Exposure start time determining means for determining an exposure processing start time based on the transport timing data received by the transport timing data receiving means;
Exposure start time transmitting means for transmitting the exposure start time determined by the exposure start time determining means to the exposure apparatus via the communication line;
The exposure apparatus includes:
Exposure start time receiving means for receiving the exposure start time transmitted by the exposure start time transmitting means of the control device via the communication line;
A storage device for storing exposure condition data;
Exposure end time data generating means for reading exposure condition data from the storage device, estimating an exposure end time based on the read exposure condition data and the received exposure start time, and generating exposure end time data;
Exposure end time data transmitting means for transmitting the exposure end time data generated by the exposure end time data generating means to the control device via the communication line;
The control device includes:
Exposure end time data receiving means for receiving the exposure end time data transmitted by the exposure end time data transmitting means of the exposure apparatus via the communication line;
When the exposure end time data received by the exposure end time data receiving means is different from the transfer timing data, the wafer transfer cycle in the coating and developing apparatus is temporarily stopped and the wafer is transferred from the exposure apparatus. A suspension signal transmission means for transmitting a conveyance cycle pause signal for waiting the conveyance mechanism to the conveyance cycle control means via the communication line;
After the wafer unloaded from the exposure apparatus is transferred to the heating unit, a transfer cycle restart signal for restarting the wafer transfer cycle temporarily stopped by the transfer cycle stop signal is sent to the transfer cycle control means. It is further characterized by further comprising a restart signal transmitting means for transmitting via a line.

  According to the present invention, the uniformity of the resist pattern dimension between wafers can be improved by making the wafer holding time after exposure constant.

  Embodiments of the present invention will be described below with reference to the drawings. In the drawings, the same or corresponding parts are denoted by the same reference numerals, and the description thereof may be simplified or omitted.

Embodiment 1 FIG.
FIG. 1 is a schematic diagram for explaining a semiconductor manufacturing system according to Embodiment 1 of the present invention. FIG. 2 is a top view of the semiconductor manufacturing system shown in FIG. FIG. 3 is a flowchart for explaining the operation of the semiconductor manufacturing system according to the first embodiment.

As shown in FIGS. 1 and 2, a cassette 11 for storing a plurality of wafers W is mounted on the mounting table 10. The coating and developing apparatus 20 includes a plurality of coating and developing units 30, a plurality of heating and cooling units 40, and a transfer arm 50 that transfers the wafer W in the coating and developing apparatus 20.
In the coating and developing unit 30, a resist coating process on the wafer W and a developing process for the wafer W after exposure are performed. Instead of performing both the resist coating process and the developing process in the coating and developing unit 30, a coating unit 30a that performs the resist coating process and a developing unit 30b that performs the developing process may be configured separately (described later). The same applies to the second embodiment).
In the heating / cooling unit 40, pre-baking after resist coating (also referred to as “soft baking”), post-exposure PEB (post exposure bake), and cooling of the wafer after baking (pre-baking, PEB) are performed. Although not shown, a heating unit that performs heat treatment (soft bake, PEB) and a cooling unit that performs cooling may be configured separately (the same applies to Embodiment 2 described later).
The interface unit 60 is for transferring a wafer between the coating and developing apparatus 20 and the exposure apparatus 70. The interface unit 60 includes a stock unit 61 that stocks the wafer after resist coating before exposure, and an arm 62 that transfers the wafer.
The exposure apparatus 70 exposes a circuit pattern to the wafer W coated with a resist using a mask. The exposure apparatus 70 and the coating and developing apparatus 20 are connected via a communication line 81. The communication line 81 may be either wired or wireless.

As shown in FIG. 3, the wafer W accommodated in the cassette 11 placed on the placing table 10 is first transported to the coating / developing unit 30 of the coating / developing apparatus 20, and the resist is spin-coated. In the coating and developing unit 30, a hydrophobic treatment or an antireflection film can be applied before resist application.
Next, the wafer W is transferred to the heating / cooling unit 40, pre-baked before exposure, and then cooled. After cooling, the wafer W is transferred into the exposure apparatus 70 via the interface unit 60, and exposure processing is performed. Although details will be described later, the exposure processing end time is estimated in the exposure apparatus 70 before or during exposure, and is transmitted to the coating and developing apparatus 20 via the communication line 81.
The exposed wafer W is again transferred to the heating / cooling unit 40 via the interface unit 60 without a transfer waiting time (described later), and cooled after PEB is performed. After cooling, the wafer W is transferred to the coating and developing unit 30 and subjected to development processing. Thereafter, the wafer W is returned to the cassette 11.

FIG. 4 is a block diagram showing a coating and developing apparatus and an exposure apparatus connected via an electric line in the first embodiment.
As shown in FIG. 4, exposure condition data is stored in the storage device 73 of the exposure apparatus 70. The exposure condition data is information relating to the performance of the exposure apparatus 70 such as the power of the laser that is the light source, the number of exposure shots, and the exposure speed.
The exposure end time data generation means 71 reads the exposure condition data from the storage device 73, estimates the exposure end time of the wafer that is being exposed or is exposed based on the read exposure condition data, and obtains the exposure end time data. Generate. The generated exposure end time data is transmitted to the coating and developing apparatus 20 via the communication line 81 by the exposure end time data transmitting means 72. The exposure end time data may be the time when the wafer W is unloaded from the exposure apparatus 70 instead of the actual exposure process end time in the exposure apparatus 70.

The exposure end time data receiving unit 21 of the coating and developing apparatus 20 receives the exposure end time data transmitted by the exposure end time data transmitting unit 72 via the communication line 81. The transfer cycle temporary stopping means 22 temporarily stops the wafer transfer cycle in the coating and developing apparatus 20 based on the received exposure end time data and makes the transfer apparatus 50 stand by in accordance with the wafer carry-out from the exposure apparatus 70. That is, the wafer W after exposure is transferred to the heating / cooling unit 40 with priority over the normal wafer transfer cycle so that the wafer unloaded from the exposure apparatus 70 is not in a waiting state for transfer. In addition, as long as the wafer W after exposure does not wait for conveyance, a normal wafer conveyance cycle can be performed until just before temporary stop. That is, the wafer W is prevented from being unloaded from the exposure apparatus 70 during execution of the wafer transfer cycle.
The transfer cycle restarting means 23 restarts the wafer transfer cycle that has been temporarily stopped after the wafer W after exposure carried out from the exposure apparatus 70 is transferred to the heating / cooling unit 40 by the transfer apparatus 50.

  As described above, in the first embodiment, the exposure apparatus 70 estimates the exposure end time based on the exposure condition data and transmits it to the coating and developing apparatus 20, and the coating and developing apparatus 20 approaches the estimated exposure end time. The wafer transfer cycle is temporarily stopped, and the transfer apparatus 50 is put on standby in accordance with the wafer transfer from the exposure apparatus 70. Thereby, since the wafer W after exposure carried out from the exposure apparatus 70 is transferred to the heating / cooling unit 40 without waiting for transfer, the PEB can be made constant between the wafers. Dimensional uniformity can be improved.

Embodiment 2. FIG.
The difference between the second embodiment of the present invention and the first embodiment described above is in the conveyance control of the coating and developing apparatus 20 and the exposure apparatus 70. Hereinafter, this difference will be mainly described.
FIG. 5 is a block diagram showing a coating and developing apparatus and an exposure apparatus connected via an electric line in the second embodiment.
As shown in FIG. 5, transport timing data is stored in the storage device 26 of the coating and developing apparatus 20. The transfer timing data is data indicating the timing at which the transfer apparatus 50 delivers a wafer to each unit.

  The conveyance timing data transmission unit 24 reads the conveyance timing data from the storage device 26 and transmits the read conveyance timing data to the exposure apparatus 70 via the communication line 81. The transfer cycle control means 25 controls the wafer transfer cycle in the coating and developing apparatus 20 based on the transfer timing.

The conveyance timing data receiving unit 74 of the exposure apparatus 70 receives the conveyance timing data transmitted by the conveyance timing data transmission unit 24 via the communication line 81. The exposure start time determination unit 75 determines a time for starting the exposure process in the exposure apparatus 70 based on the received conveyance timing data. That is, the start time of the exposure process is determined so that the exposure process is completed slightly before the timing at which the transfer device 50 picks up the wafer W unloaded from the exposure apparatus 70. Note that the exposure start time is determined in consideration of the time required for various measurements and corrections, and further in consideration of exposure conditions (number of exposure shots, exposure speed, etc.).
The exposure apparatus performs an exposure process based on the determined exposure start time. The wafer W after the exposure processing is transferred to the heating / cooling unit 40 by the transfer device 50 without waiting for transfer.

  As described above, in the second embodiment, the transfer timing data in the coating and developing apparatus 20 is transmitted to the exposure apparatus 70, and the exposure apparatus 70 sets the exposure processing start time so that the exposed wafer W does not wait for transfer. It was decided to decide. Thereby, since the wafer conveyance cycle of the coating and developing apparatus 20 and the unloading timing of the wafer from the exposure apparatus 70 are synchronized, the exposed wafer W can be conveyed to the heating / cooling unit 40 without waiting for conveyance. Therefore, since PEB can be made constant between wafers, uniformity of resist pattern dimensions between wafers can be improved.

Embodiment 3 FIG.
The difference between the third embodiment of the present invention and the first and second embodiments described above is in the conveyance control of the coating and developing apparatus 20 and the exposure apparatus 70. Hereinafter, this difference will be mainly described.
FIG. 6 is a block diagram showing a coating and developing apparatus and an exposure apparatus connected via an electric line in the third embodiment.
As shown in FIG. 6, transport timing data is stored in the storage device 26 of the coating and developing apparatus 20.
The conveyance timing data transmission unit 24 reads the conveyance timing data from the storage device 26 and transmits the read conveyance timing data to the exposure apparatus 70 via the communication line 81.
The transfer cycle control means 27 controls the wafer transfer cycle in the coating and developing apparatus 20 by drivingly controlling the transfer apparatus 50 based on the transfer timing data.

  The conveyance timing data receiving unit 74 of the exposure apparatus 70 receives the conveyance timing data transmitted by the conveyance timing data transmission unit 24 via the communication line 81. The exposure start time determination unit 75 determines a time for starting the exposure process in the exposure apparatus 70 based on the received conveyance timing data. Exposure condition data is stored in the storage device 73 of the exposure apparatus 70. The exposure end time data generation means 71 reads the exposure condition data from the storage device 73, estimates the exposure end time of the wafer that is being exposed or is exposed based on the read exposure condition data, and obtains the exposure end time data. Generate. The generated exposure end time data is transmitted to the coating and developing apparatus 20 via the communication line 81 by the exposure end time data transmitting means 72.

  The transport cycle control unit 27 receives the exposure end time data transmitted by the exposure end time data transmission unit 72 via the communication line 81. When the received exposure end time data and the transfer timing data are different, the transfer cycle temporary stopping unit 27b temporarily stops the wafer transfer cycle in the coating and developing apparatus 20 and transfers the wafer in accordance with the wafer transfer from the exposure apparatus 70. The apparatus 50 is put on standby. That is, the wafer transfer cycle is temporarily stopped when the transfer of the wafer W from the exposure apparatus 70 is later than the timing at which the transfer apparatus 50 takes the wafer W after exposure. Transfer of the wafer W after exposure to the heating / cooling unit 40 is performed with priority over the normal wafer transfer cycle so that the wafer unloaded from the exposure apparatus 70 is not in a waiting state for transfer.

  As described above, in the third embodiment, the exposure processing start time is determined based on the conveyance timing data as in the second embodiment, and exposure is performed based on the exposure conditions in the exposure apparatus 50 as in the first embodiment. The end time is estimated and transmitted to the coating and developing apparatus 20. Then, when the exposure end time and the transfer timing data are different, the wafer transfer cycle is temporarily stopped, and the transfer device 50 is made to wait in accordance with the wafer transfer from the exposure device 70. Therefore, since PEB can be made constant between wafers, the uniformity of resist pattern dimensions between wafers can be improved. Furthermore, the accuracy of wafer conveyance control can be improved as compared with the first and second embodiments.

Embodiment 4 FIG.
The fourth embodiment of the present invention is characterized in that the semiconductor manufacturing system of the first embodiment is further provided with a control device that executes transfer control.
FIG. 7 is a schematic diagram for explaining a semiconductor manufacturing system according to the fourth embodiment of the present invention. FIG. 8 is a top view of the semiconductor manufacturing system shown in FIG.
As shown in FIGS. 7 and 8, a control device 80 connected to the coating and developing device 20 and the exposure device 70 via communication lines 82 and 83 is provided. This is different from the first embodiment in which the coating / developing apparatus 20 and the exposure apparatus 70 are connected via the communication line 81.

FIG. 9 is a block diagram showing a coating and developing apparatus, an exposure apparatus, and a control apparatus in the fourth embodiment.
As shown in FIG. 9, exposure condition data is stored in the storage device 73 of the exposure apparatus 70. The exposure condition data is information relating to the performance of the exposure apparatus 70 such as the power of the laser that is the light source, the number of exposure shots, and the exposure speed.
The exposure end time data generation means 71 reads the exposure condition data from the storage device 73, estimates the exposure end time of the wafer that is being exposed or is exposed based on the read exposure condition data, and obtains the exposure end time data. Generate. The generated exposure end time data is transmitted to the control device 80 by the exposure end time data transmitting means 72 via the communication line 83.

  The exposure end time data receiving unit 84 of the control device 80 receives the exposure end time data transmitted by the exposure end time data transmitting unit 72 via the communication line 83. The temporary stop signal transmission means 85 temporarily stops the wafer transfer cycle in the coating and developing apparatus 20 based on the received exposure end time data, and also makes the transfer apparatus 50 stand by in accordance with the wafer unloading from the exposure apparatus 70. A temporary stop signal is transmitted to the coating and developing apparatus 20 via the signal line 82. The transfer cycle temporary stop means 28 a of the transfer cycle control means 28 receives the transfer cycle pause signal via the signal line 82, pauses the wafer transfer cycle, and transfers the wafer in accordance with the wafer transfer from the exposure apparatus 70. Wait 50. In other words, the wafer W after exposure is transferred to the heating / cooling unit 40 with priority over the normal wafer transfer cycle so that the wafer unloaded from the exposure apparatus 70 is not in a waiting state for transfer. As long as the wafer W after exposure is not waiting for transfer, a normal wafer transfer cycle can be executed until just before the temporary stop. That is, the wafer W is prevented from being unloaded from the exposure apparatus 70 during execution of the wafer transfer cycle.

  After the wafer W unloaded from the exposure device 70 is transported to the heating / cooling unit 40 by the transport device 50, the restart signal transmitting means 86 sends a transport cycle restart signal for resuming the wafer transport cycle that has been temporarily stopped. 20 through the signal line 82. The transfer cycle restarting unit 28b of the transfer cycle control unit 28 receives the transfer cycle restart signal via the signal line 82 and restarts the wafer transfer cycle that has been temporarily stopped.

  As described above, in the fourth embodiment, the exposure end time is estimated based on the exposure condition data, and when the estimated exposure end time is approached, the wafer transfer cycle is temporarily stopped, The transfer device 50 is put on standby in accordance with the wafer carry-out. Thereby, since the wafer W after exposure carried out from the exposure apparatus 70 is transferred to the heating / cooling unit 40 without waiting for transfer, the PEB can be made constant between the wafers. Dimensional uniformity can be improved.

  Furthermore, in the fourth embodiment, a control device 80 different from the coating and developing device 20 and the exposure device 70 is provided. Therefore, even when the wafer transfer timing control is not performed between the coating and developing apparatus 20 and the exposure apparatus 70, the wafer transfer control of the present invention can be executed by simply adding the controller 80. Further, even when the manufacturer of the coating and developing apparatus 20 and the manufacturer of the exposure apparatus 70 are different, it is easy to add the control apparatus 80 (the same applies to Embodiments 5 and 6 described later).

Embodiment 5 FIG.
The difference between the fifth embodiment of the present invention and the above-described fourth embodiment is in the conveyance control of the coating and developing apparatus 20, the exposure apparatus 70, and the control apparatus 80. Hereinafter, this difference will be mainly described.
FIG. 10 is a block diagram showing the coating and developing apparatus, the exposure apparatus, and the control apparatus in the fifth embodiment.
As shown in FIG. 10, the storage device 26 of the coating and developing apparatus 20 stores conveyance timing data. The transfer timing data is data indicating the timing at which the transfer apparatus 50 delivers a wafer to each unit.
The conveyance timing data transmission unit 24 reads the conveyance timing data from the storage device 26 and transmits the read conveyance timing data to the control device 80 via the communication line 82. The transfer cycle control means 25 controls the wafer transfer cycle in the coating and developing apparatus 20 based on the transfer timing.

The transport timing data receiving unit 87 of the control device 80 receives the transport timing data transmitted by the transport timing data transmitting unit 24 via the communication line 82. The exposure start time determination unit 88 determines a time for starting the exposure process in the exposure apparatus 70 based on the received conveyance timing data. That is, the start time of the exposure process is determined so that the exposure process is completed slightly before the timing at which the transfer device 50 picks up the wafer W unloaded from the exposure apparatus 70. Note that the exposure start time is determined in consideration of the time required for various measurements and corrections, and further in consideration of exposure conditions (number of exposure shots, exposure speed, etc.). Various data necessary for determining the exposure start time is stored in a storage device (not shown) of the control device 80.
The determined exposure start time data is transmitted to the exposure apparatus 70 via the communication line 83 by the exposure start time transmission means 89.

  The exposure start time receiving unit 76 of the exposure apparatus 70 receives exposure start time data via the communication line 83. The exposure apparatus 70 performs an exposure process based on the received exposure start time data. The wafer W after the exposure processing is transferred to the heating / cooling unit 40 by the transfer device 50 without waiting for transfer.

  As described above, in the fifth embodiment, the transfer timing data in the coating and developing apparatus 20 is transmitted to the control apparatus 80, and the control apparatus 80 sets the exposure processing start time so that the exposed wafer W does not wait for transfer. The exposure process is performed in the exposure apparatus 70 based on the determined exposure process start time. Thereby, since the wafer conveyance cycle of the coating and developing apparatus 20 and the unloading timing of the wafer from the exposure apparatus 70 are synchronized, the exposed wafer W can be conveyed to the heating / cooling unit 40 without waiting for conveyance. Therefore, since PEB can be made constant between wafers, uniformity of resist pattern dimensions between wafers can be improved.

Embodiment 6 FIG.
The difference between the sixth embodiment of the present invention and the above-described fourth and fifth embodiments is in the conveyance control of the coating and developing apparatus 20, the exposure apparatus 70, and the control apparatus 80. Hereinafter, this difference will be mainly described.
FIG. 11 is a block diagram showing a coating and developing apparatus, an exposure apparatus, and a control apparatus in the sixth embodiment.
As shown in FIG. 11, the conveyance timing data is stored in the storage device 26 of the coating and developing apparatus 20.
The conveyance timing data transmission unit 24 reads the conveyance timing data from the storage device 26 and transmits the read conveyance timing data to the control device 80 via the communication line 82.
The transfer cycle control means 27 controls the wafer transfer cycle in the coating and developing apparatus 20 by drivingly controlling the transfer apparatus 50 based on the transfer timing data.
The transport timing data receiving unit 87 of the control device 80 receives the transport timing data transmitted by the transport timing data transmitting unit 24 via the communication line 82. The exposure start time determining unit 88 determines an exposure start time for starting an exposure process in the exposure apparatus 70 based on the received conveyance timing data. The exposure start time transmission unit 89 transmits the determined exposure start time data to the exposure apparatus 70 via the communication line 83.
The exposure start time receiving means 75 of the exposure apparatus 70 receives exposure start time data via the communication line 83. The exposure apparatus 70 starts an exposure process based on the received exposure start time data. Exposure condition data is stored in the storage device 73 of the exposure apparatus 70. The exposure end time data generation means 71 reads the exposure condition data from the storage device 73, estimates the exposure end time of the wafer that is being exposed or is exposed based on the read exposure condition data, and obtains the exposure end time data. Generate. The generated exposure end time data is transmitted to the control device 80 by the exposure end time data transmitting means 72 via the communication line 83.
The exposure end time data receiving means 84 of the control device 80 receives exposure end time data via the communication line 83.

  The temporary stop signal transmission means 85 temporarily stops the wafer transfer cycle in the coating and developing apparatus 20 based on the received exposure end time data, and also makes the transfer apparatus 50 stand by in accordance with the wafer unloading from the exposure apparatus 70. A temporary stop signal is transmitted to the coating and developing apparatus 20 via the signal line 82. When the transfer cycle temporary stop unit 27 b of the transfer cycle control unit 27 receives the transfer cycle pause signal via the signal line 82, the transfer cycle temporary stop unit 27 b temporarily stops the wafer transfer cycle, and transfers the wafer 50 from the exposure apparatus 70 in accordance with the wafer transfer. To wait. That is, the wafer W after exposure is transferred to the heating / cooling unit 40 with priority over the normal wafer transfer cycle so that the wafer unloaded from the exposure apparatus 70 is not in a waiting state for transfer. In addition, as long as the wafer W after exposure does not wait for conveyance, a normal wafer conveyance cycle can be performed until just before temporary stop. That is, the wafer W is prevented from being unloaded from the exposure apparatus 70 during execution of the wafer transfer cycle.

  After the wafer W unloaded from the exposure device 70 is transported to the heating / cooling unit 40 by the transport device 50, the restart signal transmitting means 86 sends a transport cycle restart signal for resuming the wafer transport cycle that has been temporarily stopped. 20 through the signal line 82. When the transfer cycle restarting unit 27 c of the transfer cycle control unit 27 receives the transfer cycle restart signal via the signal line 82, the transfer cycle restarting unit 27 c restarts the wafer transfer cycle that has been temporarily stopped.

  As described above, in the sixth embodiment, the exposure processing start time is determined based on the conveyance timing data as in the fourth embodiment, and the exposure end time is estimated based on the exposure conditions as in the fifth embodiment. I tried to do it. Then, when the exposure end time and the transfer timing data are different, the wafer transfer cycle is temporarily stopped, and the transfer device 50 is made to wait in accordance with the wafer transfer from the exposure device 70. Therefore, since PEB can be made constant between wafers, uniformity of resist pattern dimensions between wafers can be improved. Furthermore, the accuracy of wafer transfer control can be improved as compared with the fourth and fifth embodiments.

It is the schematic for demonstrating the semiconductor manufacturing system by Embodiment 1 of this invention. It is a top view of the semiconductor manufacturing system shown in FIG. It is a flowchart for demonstrating operation | movement of the semiconductor manufacturing system by Embodiment 1 of this invention. In Embodiment 1 of this invention, it is a block diagram which shows the coating / developing apparatus and exposure apparatus which were connected through the electrical line. In Embodiment 2 of this invention, it is a block diagram which shows the coating / developing apparatus and exposure apparatus which were connected via the electrical line. In Embodiment 3 of this invention, it is a block diagram which shows the coating / developing apparatus and exposure apparatus which were connected through the electrical line. It is the schematic for demonstrating the semiconductor manufacturing system by Embodiment 4 of this invention. It is a top view of the semiconductor manufacturing system shown in FIG. In Embodiment 4 of this invention, it is a block diagram which shows a coating / developing apparatus, an exposure apparatus, and a control apparatus. In Embodiment 5 of this invention, it is a block diagram which shows a coating / developing apparatus, an exposure apparatus, and a control apparatus. In Embodiment 6 of this invention, it is a block diagram which shows a coating / developing apparatus, an exposure apparatus, and a control apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Mounting stand 11 Cassette 20 Coating development apparatus 21 Exposure completion time receiving means 22 Conveyance cycle temporary stop means 23 Conveyance cycle resumption means 24 Conveyance timing data transmission means 25 Conveyance cycle control means 26 Storage device 27, 28 Conveyance cycle control means 27a Exposure end Time data receiving means 27b, 28a Conveying cycle temporary stopping means 27c, 28b Conveying cycle restarting means 30 Coating / developing unit 30a Coating unit 30b Developing unit 40 Heating / cooling unit 50 Conveying device (conveying arm)
DESCRIPTION OF SYMBOLS 60 Interface part 61 Stocker 70 Exposure apparatus 71 Exposure end time data generation means 72 Exposure end time data transmission means 73 Memory | storage device 74 Conveyance timing data reception means 75 Exposure start time determination means 76 Exposure start time reception means 80 Controller 81,82, 83 Communication line 84 Exposure end time data receiving means 85 Temporary stop signal transmitting means 86 Restart signal transmitting means 87 Transport timing data receiving means 88 Exposure start time determining means 89 Exposure start time transmitting means

Claims (6)

A semiconductor manufacturing system in which a coating and developing apparatus having a heating unit and an exposure apparatus are connected via a communication line,
The exposure apparatus includes:
A storage device for storing exposure condition data;
Exposure end time data generating means for reading exposure condition data from the storage device, estimating an exposure end time based on the read exposure condition data, and generating exposure end time data;
Exposure end time data transmitting means for transmitting the exposure end time data generated by the exposure end time data generating means to the coating and developing apparatus via the communication line, and
The coating and developing apparatus includes:
Exposure end time data receiving means for receiving the exposure end time data transmitted by the exposure end time data transmitting means of the exposure apparatus via the communication line;
Based on the exposure end time data received by the exposure end time data receiving means, the transfer cycle for temporarily stopping the wafer transfer cycle in the coating and developing apparatus and waiting for the transfer mechanism in accordance with the wafer transfer from the exposure apparatus. A suspension means;
A semiconductor manufacturing system comprising: a transfer cycle restarting unit for restarting a wafer transfer cycle temporarily stopped by the transfer cycle temporary stopping unit after the wafer transferred from the exposure apparatus is transferred to the heating unit. . A semiconductor manufacturing system in which a coating and developing apparatus having a heating unit and an exposure apparatus are connected via a communication line,
The coating and developing apparatus includes:
A storage device for storing transfer timing data of a wafer transfer cycle of the coating and developing apparatus;
Conveyance timing data transmitting means for reading conveyance timing data from the storage device and transmitting the read conveyance timing data to the exposure apparatus via the communication line;
A transport cycle control means for controlling a wafer transport cycle in the coating and developing apparatus based on the transport timing data;
The exposure apparatus includes:
Transport timing data receiving means for receiving the transport timing data transmitted by the transport timing data transmitting means of the coating and developing apparatus via the communication line;
Exposure start time determining means for determining the start time of exposure processing based on the transport timing data received by the transport timing data receiving means,
The semiconductor manufacturing system according to claim 1, wherein the transfer cycle control unit transfers a wafer unloaded from the exposure apparatus to the heating unit based on transfer timing data. A semiconductor manufacturing system in which a coating and developing apparatus having a heating unit and an exposure apparatus are connected via a communication line,
The coating and developing apparatus includes:
A storage device for storing transfer timing data of a wafer transfer cycle of the coating and developing apparatus;
Conveyance timing data transmitting means for reading conveyance timing data from the storage device and transmitting the read conveyance timing data to the exposure apparatus via the communication line;
A transport cycle control means for controlling a wafer transport cycle in the coating and developing apparatus based on the transport timing data;
The exposure apparatus includes:
Transport timing data receiving means for receiving the transport timing data transmitted by the transport timing data transmitting means of the coating and developing apparatus via the communication line;
Exposure start time determining means for determining an exposure processing start time based on the transport timing data received by the transport timing data receiving means;
A storage device for storing exposure condition data;
Exposure end time data generating means for reading exposure condition data from the storage device, estimating an exposure end time based on the read exposure condition data, and generating exposure end time data;
Exposure end time data transmitting means for transmitting the exposure end time data generated by the exposure end time data generating means to the coating and developing apparatus via the communication line, and
The transport cycle control means of the coating and developing apparatus includes:
Exposure end time data receiving means for receiving the exposure end time data transmitted by the exposure end time data transmitting means via the communication line;
When the exposure end time data received by the exposure end time data receiving means is different from the transfer timing data, the wafer transfer cycle in the coating and developing apparatus is temporarily stopped and the wafer is transferred from the exposure apparatus. A transport cycle suspension means for waiting the transport mechanism;
A semiconductor manufacturing system comprising: a transfer cycle restarting unit for restarting a wafer transfer cycle temporarily stopped by the transfer cycle temporary stopping unit after the wafer transferred from the exposure apparatus is transferred to the heating unit. . A semiconductor manufacturing system having a coating and developing apparatus having a heating unit, an exposure apparatus, and a control apparatus connected to the coating and developing apparatus and the exposure apparatus via a communication line,
The coating and developing apparatus includes a transfer cycle control unit that controls a wafer transfer cycle in the coating and developing apparatus,
The exposure apparatus includes:
A storage device for storing exposure condition data;
Exposure end time data generating means for reading exposure conditions from the storage device, estimating exposure end time based on the read exposure conditions, and generating exposure end time data;
Exposure end time data transmitting means for transmitting the exposure end time data generated by the exposure end time data generating means to the control device via the communication line;
The control device includes:
Exposure end time data receiving means for receiving the exposure end time data transmitted by the exposure end time data transmitting means of the exposure apparatus via the communication line;
Based on the exposure end time data received by the exposure end time data receiving means, the transfer cycle for temporarily stopping the wafer transfer cycle in the coating and developing apparatus and waiting for the transfer mechanism in accordance with the wafer transfer from the exposure apparatus. A temporary stop signal transmitting means for transmitting a temporary stop signal to the transport cycle control means via the communication line;
After the wafer unloaded from the exposure apparatus is transferred to the heating unit, a transfer cycle restart signal for restarting the wafer transfer cycle temporarily stopped by the transfer cycle pause signal is sent to the transfer cycle control means. A semiconductor manufacturing system comprising restart signal transmitting means for transmitting via A semiconductor manufacturing system having a coating and developing apparatus having a heating unit, an exposure apparatus, and a control apparatus connected to the coating and developing apparatus and the exposure apparatus via a communication line,
The coating and developing apparatus includes:
A storage device for storing transfer timing data of a wafer transfer cycle of the coating and developing apparatus;
Conveyance timing data transmitting means for reading conveyance timing data from the storage device and transmitting the read conveyance timing data to the control device via the communication line;
A transport cycle control means for controlling a wafer transport cycle in the coating and developing apparatus based on the transport timing data;
The control device includes:
Transport timing data receiving means for receiving the transport timing data transmitted by the transport timing data transmitting means of the coating and developing apparatus via the communication line;
Exposure start time determining means for determining an exposure processing start time based on the transport timing data received by the transport timing data receiving means;
Exposure start time transmitting means for transmitting the exposure start time determined by the exposure start time determining means to the exposure apparatus via the communication line;
The exposure apparatus includes exposure start time receiving means for receiving the exposure start time transmitted by the exposure start time transmitting means of the control device via the communication line, and performs an exposure process based on the received exposure start time. Done
The semiconductor manufacturing system according to claim 1, wherein the transfer cycle control unit transfers a wafer unloaded from the exposure apparatus to the heating unit based on transfer timing data. A semiconductor manufacturing system having a coating and developing apparatus having a heating unit, an exposure apparatus, and a control apparatus connected to the coating and developing apparatus and the exposure apparatus via a communication line,
The coating and developing apparatus includes:
A storage device for storing transfer timing data of a wafer transfer cycle of the coating and developing apparatus;
Conveyance timing data transmitting means for reading conveyance timing data from the storage device and transmitting the read conveyance timing data to the control device via the communication line;
A transport cycle control means for controlling a wafer transport cycle in the coating and developing apparatus based on the transport timing data;
The control device includes:
Transport timing data receiving means for receiving the transport timing data transmitted by the transport timing data transmitting means of the coating and developing apparatus via the communication line;
Exposure start time determining means for determining an exposure processing start time based on the transport timing data received by the transport timing data receiving means;
Exposure start time transmitting means for transmitting the exposure start time determined by the exposure start time determining means to the exposure apparatus via the communication line;
The exposure apparatus includes:
Exposure start time receiving means for receiving the exposure start time transmitted by the exposure start time transmitting means of the control device via the communication line;
A storage device for storing exposure condition data;
Exposure end time data generating means for reading exposure condition data from the storage device, estimating an exposure end time based on the read exposure condition data and the received exposure start time, and generating exposure end time data;
Exposure end time data transmitting means for transmitting the exposure end time data generated by the exposure end time data generating means to the control device via the communication line;
The control device includes:
Exposure end time data receiving means for receiving the exposure end time data transmitted by the exposure end time data transmitting means of the exposure apparatus via the communication line;
When the exposure end time data received by the exposure end time data receiving means is different from the transfer timing data, the wafer transfer cycle in the coating and developing apparatus is temporarily stopped and the wafer is transferred from the exposure apparatus. A suspension signal transmission means for transmitting a conveyance cycle pause signal for waiting the conveyance mechanism to the conveyance cycle control means via the communication line;
After the wafer unloaded from the exposure apparatus is transferred to the heating unit, a transfer cycle restart signal for restarting the wafer transfer cycle temporarily stopped by the transfer cycle stop signal is sent to the transfer cycle control means. A semiconductor manufacturing system, further comprising restart signal transmission means for transmitting via a line.

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