JP2005250003A - Optical semiconductor device, optical interconnection system, and optical wiring module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an optical semiconductor device capable of packaging a light emitting device or a light receiving device and a fiber (optical fiber) highly precisely in a short time. <P>SOLUTION: On a surface emitting laser substrate (2) on which surface emitting laser diodes (1) of a light emitting device are formed, ring-shaped projections (3a) are provided in alignment as correctly as the surface emitting laser diodes are formed. Thus, an optical fiber (5) can be connected with sufficient positional accuracy by locating the ring-shaped projection (3a) around the surface emitting laser diode (1), and utilizing a self-alignment function of a fixing material (11). <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an optical semiconductor device, an optical interconnection system, and an optical wiring module.

  Recently, an optical interconnection technology for connecting an optical device and an optical fiber has attracted attention. Light can transfer a large amount of data at a higher speed than electricity. However, light is required to be connected with high precision while electricity can be easily connected. For this reason, high-precision mounting is required between the optical device and the optical fiber.

  Currently, most of these requirements are addressed using a technique called active alignment. In this technology, for example, light emitted from an optical device is incident on an optical fiber, monitored at the output end of the optical fiber, and the optical device and the optical fiber are relatively moved so that the output is maximized, and the output is maximized. This is a technique of fixing the optical device and the optical fiber. However, this method has no problem in terms of performance, but it takes a very long time for adjustment, resulting in poor efficiency and an increase in cost.

  For this reason, a technique for reducing the adjustment time by passive alignment using a V-groove or the like has been studied. For example, as disclosed in Patent Document 1 (FIG. 10) and Patent Document 2 (FIG. 11), there is a technique in which a lens is provided between an optical device and an optical fiber and is fixed by a V-groove to shorten the mounting time. . However, in these examples, the lens is very small, the handling of the lens is very difficult, and it is not easy to arrange it.

In order to eliminate such inconveniences, there is also a proposal in which a photosensitive resin fiber guide is formed on a surface-emitting light emitting device and directly connected to the fiber, as in Patent Document 3 (FIG. 12). However, in this example, since it is a photosensitive resin, it is weak to physical force, and when inserting the fiber, the guide hole is damaged and spreads, which may deteriorate the position accuracy.
JP-A-7-199006 JP 11-295561 A JP 2002-214485 A

  An object of the present invention is to provide an optical semiconductor device, an optical interconnection system, and an optical wiring module capable of mounting a light emitting device or a light receiving device and a fiber (optical fiber) with high accuracy and in a short time. It is said.

  In order to achieve the above object, in the optical semiconductor device having the light emitting device or the light receiving device, the invention described in claim 1 is a light emitting device or a light emitting device around the light emitting device or the light receiving device as means used for positioning the fiber. The protrusion is provided so that the distance from the light receiving device to the protrusion side surface is equal.

  According to a second aspect of the present invention, in the optical semiconductor device according to the first aspect, the protrusions are connected in a ring shape with the same width.

  According to a third aspect of the present invention, in the optical semiconductor device according to the first aspect, a plurality of the protrusions are regularly present in a ring shape.

  According to a fourth aspect of the present invention, in the optical semiconductor device according to any one of the first to third aspects, an annular fiber guide is provided to face the protrusion. It is characterized by.

  According to a fifth aspect of the present invention, in the optical semiconductor device according to the fourth aspect, the fiber guide is self-aligned with the protrusion by a predetermined fixing material.

  According to a sixth aspect of the present invention, in the optical semiconductor device according to the fourth or fifth aspect, the projection is provided with a recess on a surface facing the fiber guide.

  According to a seventh aspect of the present invention, in the optical semiconductor device according to the fourth or fifth aspect, the fiber guide is provided with a concave portion on a surface facing the protrusion.

  According to an eighth aspect of the present invention, in the optical semiconductor device according to the fourth or fifth aspect, a taper is provided on an inner surface of the fiber guide.

  According to a ninth aspect of the present invention, in the optical semiconductor device according to the fourth or fifth aspect, a fiber side abutting and fixing surface is provided on the inner surface of the fiber guide. .

  According to a tenth aspect of the present invention, in an optical semiconductor device having a light emitting device or a light receiving device, wettability with respect to a predetermined fixing material is good as a means used for positioning a fiber around the light emitting device or the light receiving device. An area is provided, and other areas are characterized by poor wettability with respect to a predetermined fixing material.

  An eleventh aspect of the invention is an optical interconnection system using the optical semiconductor device according to any one of the first to tenth aspects and an optical fiber.

According to a twelfth aspect of the present invention, there is provided an optical wiring module using the optical semiconductor device according to any one of the first to tenth aspects and an optical fiber.

  According to the first to ninth aspects of the present invention, in the optical semiconductor device having the light emitting device or the light receiving device, the light emitting device or the light receiving device is disposed around the light emitting device or the light receiving device as the means used for positioning the fiber. Since the protrusion is provided so that the distance from the protrusion to the side surface of the protrusion is equal, the fiber (optical fiber) can be positioned with high accuracy using this protrusion.

  In particular, according to the invention described in claim 2, in the optical semiconductor device according to claim 1, since the protrusions are connected in a ring shape with the same width, a fixing material such as an adhesive is uniformly applied to the protrusions. The fiber (optical fiber) can be positioned with high accuracy.

  According to a third aspect of the present invention, in the optical semiconductor device according to the first aspect, since a plurality of the protrusions are regularly present in an annular shape, wiring can be freely made at locations other than the protrusions such as surface wiring.

  According to the invention of claim 4 or 5, in the optical semiconductor device according to any one of claims 1 to 3, an annular fiber guide is provided facing the protrusion. Thus, high-precision positioning of the fiber (optical fiber) can be performed in a short time by self-alignment based on the surface tension of the fixing material.

  According to a sixth aspect of the present invention, in the optical semiconductor device according to the fourth or fifth aspect, since the protrusion is provided with a concave portion on the surface facing the fiber guide, the fixing material is controlled. The amount tolerance can be expanded.

  According to a seventh aspect of the present invention, in the optical semiconductor device according to the fourth or fifth aspect, since the fiber guide is provided with the concave portion on the surface facing the protrusion, the fixing material is controlled. The amount tolerance can be expanded.

  According to an eighth aspect of the present invention, in the optical semiconductor device according to the fourth or fifth aspect, the inner surface of the fiber guide is tapered, so that the positioning of the fiber (optical fiber) can be performed. Easier to plug in.

  According to the invention of claim 9, in the optical semiconductor device of claim 4 or claim 5, the inner surface of the fiber guide is provided with a fiber side abutment fixing surface. (Optical fiber) is easy to insert when positioning.

  According to the invention of claim 10, in the optical semiconductor device having the light emitting device or the light receiving device, a predetermined fixing material (for example, an adhesive) is used around the light emitting device or the light receiving device as a means used for positioning the fiber. Areas with good wettability to fixing materials such as adhesives are provided, and other areas have poor wettability to predetermined fixing materials, so it is easy to attach adhesives and other fixing materials to areas with good wettability The fiber (optical fiber) can be positioned with high accuracy by using this.

  According to the invention described in claim 11, there is provided an optical interconnection system characterized in that the optical semiconductor device according to any one of claims 1 to 10 and an optical fiber are used. Since the optical fiber can be positioned with high accuracy, it can be mounted with high accuracy in a short time.

  According to a twelfth aspect of the present invention, there is provided an optical wiring module characterized in that the optical semiconductor device according to any one of the first to tenth aspects and an optical fiber are used. Since the fiber can be positioned with high accuracy, it can be mounted with high accuracy in a short time.

  Hereinafter, the best mode for carrying out the present invention will be described.

(First form)
According to a first aspect of the present invention, in an optical semiconductor device having a light emitting device or a light receiving device, as means used for positioning a fiber, the light emitting device or the light receiving device is disposed around the light emitting device or the light receiving device to the protruding side surface. Protrusions are provided so that the distances are equal.

  In the first embodiment, as a means used for positioning the fiber, a protrusion is provided around the light emitting device or the light receiving device so that the distance from the light emitting device or the light receiving device to the side surface of the protrusion is equal. Using the protrusion, the fiber (optical fiber) can be positioned with high accuracy.

(Second form)
According to a second aspect of the present invention, in the optical semiconductor device according to the first aspect, the protrusions are connected in an annular shape with the same width.

  In the second embodiment, in the optical semiconductor device of the first embodiment, the protrusions are connected in a ring shape with the same width, and thus a fixing material such as an adhesive can be uniformly applied to the protrusions. The optical fiber) can be positioned with high accuracy.

(Third form)
According to a third aspect of the present invention, in the optical semiconductor device according to the first aspect, a plurality of the protrusions are regularly present in an annular shape.

  In the third embodiment, in the optical semiconductor device of the first embodiment, since the plurality of protrusions are regularly present in an annular shape, wiring can be freely made at places other than the protrusions such as surface wiring.

(4th form)
According to a fourth aspect of the present invention, in the optical semiconductor device according to any one of the first to third aspects, an annular fiber guide is provided to face the protrusion.

  Here, the fiber guide is made of single crystal silicon, glass, ceramics, or the like by a semiconductor etching technique.

  In the fourth embodiment, since an annular fiber guide is provided to face the protrusion, high-precision positioning of the fiber (optical fiber) can be performed in a short time by self-alignment by the surface tension of the fixing material. Can be done.

(5th form)
According to a fifth aspect of the present invention, in the optical semiconductor device according to the fourth aspect, the fiber guide is self-aligned with the protrusion by a predetermined fixing material (for example, a fixing material such as an adhesive). It is characterized by that.

  In the fifth embodiment, high-precision positioning of the fiber (optical fiber) can be performed in a short time by self-alignment due to the surface tension of the fixing material.

(Sixth form)
According to a sixth aspect of the present invention, in the optical semiconductor device of the fourth or fifth aspect, the protrusion is provided with a recess on a surface facing the fiber guide.

  In the sixth embodiment, since the protrusion is provided with a recess on the surface facing the fiber guide, the allowable range of the control amount of the fixing material can be widened.

(7th form)
According to a seventh aspect of the present invention, in the optical semiconductor device of the fourth or fifth aspect, the fiber guide is provided with a recess on a surface facing the protrusion.

  In the seventh embodiment, the fiber guide is provided with a recess on the surface facing the protrusion, so that the allowable range of the control amount of the fixing material can be widened.

(8th form)
According to an eighth aspect of the present invention, in the optical semiconductor device of the fourth or fifth aspect, a taper is provided on the inner surface of the fiber guide.

  In the eighth embodiment, since the taper is provided on the inner surface of the fiber guide, it is easy to insert the fiber (optical fiber) at the time of positioning.

(9th form)
According to a ninth aspect of the present invention, in the optical semiconductor device according to the fourth or fifth aspect, a fiber side abutting and fixing surface is provided on the inner surface of the fiber guide.

  In the ninth embodiment, since the fiber side abutting and fixing surface is provided on the inner surface of the fiber guide, insertion during positioning of the fiber (optical fiber) is facilitated.

(10th form)
According to a tenth aspect of the present invention, in an optical semiconductor device having a light emitting device or a light receiving device, a predetermined fixing material (fixing of an adhesive or the like) is used as a means for positioning a fiber around the light emitting device or the light receiving device. An area having good wettability with respect to the material is provided, and other areas are characterized by poor wettability with respect to the fixing material.

  In the tenth embodiment, an area having good wettability with respect to a predetermined fixing material (for example, a fixing material such as an adhesive) is provided around the light emitting device or the light receiving device as a means used for positioning the fiber. Since the wettability with respect to a given fixing material is poor in this area, a fixing material such as an adhesive can be easily applied to an area with good wettability, and this can be used to make a fiber (optical fiber). Can be positioned with high accuracy.

  Note that the tenth embodiment can have the same configuration as the second to fifth, seventh to ninth embodiments (configuration corresponding to the second to fifth, seventh to ninth embodiments). . In this case, the same effects as those of the second to fifth and seventh to ninth modes can be obtained.

  That is, in the tenth embodiment, the areas with good wettability can be configured to be connected in an annular shape with the same width.

  In the tenth embodiment, a plurality of the wettable areas may be configured to regularly exist in a ring shape.

  Moreover, it can comprise so that an annular fiber guide may be provided facing the said area with good wettability. Here, the fiber guide is self-aligned with a fixing material such as an adhesive in the area with good wettability.

  The fiber guide may be provided with a recess on a surface facing the wettable area.

  Further, a taper may be provided on the inner surface of the fiber guide.

  Further, a fiber side abutting and fixing surface may be provided on the inner surface of the fiber guide.

(Eleventh form)
An eleventh aspect of the present invention is an optical interconnection system characterized in that the optical semiconductor device according to any one of the first to tenth aspects and an optical fiber are used.

(Twelfth embodiment)
A twelfth aspect of the present invention is an optical wiring module using the optical semiconductor device according to any one of the first to tenth aspects and an optical fiber.

  As described above, according to the present invention, in an optical semiconductor device having a light emitting device or a light receiving device, a protrusion is provided around the light emitting device or the light receiving device, or an area having good wettability to a fixing material such as an adhesive is provided. The positioning structure by self-alignment using the surface tension of the fixing material such as adhesive is used for alignment with the fiber guide, and after self-aligning and hardening the fixing material, the optical fiber is passed through the fiber guide and light is transmitted. The fiber can be fixed. By doing in this way, an optical fiber can be connected physically strong and with sufficient position accuracy.

  1 and 2 are diagrams showing an optical semiconductor device of Example 1. FIG. 1 and 2 show examples in which the light emitting device or the light receiving device is a surface emitting laser. FIG. 1A is a plan view of the optical semiconductor device according to the first embodiment, and FIG. 1B is a cross-sectional view taken along the line AA in FIG. FIG. 2 is a perspective view of each component.

  Referring to FIGS. 1A, 1B, and 2, when a surface emitting laser is formed on a surface emitting laser substrate (2) on which a surface emitting laser (1) that is a light emitting device is formed, Similarly, an annular protrusion (3a) is formed that is precisely aligned. That is, an annular protrusion (3a) is provided around the surface emitting laser (1). The surface of the annular protrusion (3a) is subjected to a surface treatment that improves wettability to the fixing material (11) such as an adhesive, and a small amount of the fixing material (11) is applied thereto. For example, an epoxy-based adhesive is used for the fixing material (11), and when the fixing material (11) is applied to the annular protrusion (3a), the surface tension is as shown in FIG. In addition, since the protrusion (3a) is annular, even if there is application unevenness during application, the fixing material (11) spreads by itself and becomes uniform. Here, an annular fiber guide (4) (which has the same shape as the annular protrusion (3a) and the surface is treated so as to improve the wettability to the fixing material (11)). 4) is manufactured by using a semiconductor process using single crystal silicon as a material), and the fiber guide (4) is formed into an annular shape by the self-alignment function due to the surface tension of the fixing material (11). The center of the annular protrusion (3a) coincides with the center of the fiber guide (4) because it moves to match the shape of the protrusion (3a). That is, at this time, the center of the surface emitting laser (1) and the center of the fiber guide (4) coincide. Thereafter, the fixing material (11) is cured by heat. After curing, when the optical fiber (5) is inserted into the fiber guide (4), the centers of the optical fiber (5) and the surface emitting laser (1) coincide. At this time, since the fixing member (11) has a bulging portion (14) that is smaller than the inner diameter of the fiber guide (4), when the optical fiber (5) is inserted, the tip of the optical fiber (5) It stops at the bulge (14) and does not collide with the surface emitting laser (1).

  Thus, in Example 1, the annular protrusion (3a) is installed around the surface emitting laser (1), the self-alignment function of the fixing member (11) is used, and the optical fiber (5) is positioned with high positional accuracy. Can be connected.

  In other words, the fiber guide is manufactured using a semiconductor technology using a material that is strong against physical force such as single crystal silicon, glass, ceramics, etc., and is positioned using a self-alignment function to perform positioning of the optical fiber. Since highly accurate connection is possible, highly efficient optical fiber connection is possible.

  FIG. 3 is a diagram showing an optical semiconductor device according to Embodiment 2 of the present invention.

  The optical semiconductor device of Example 2 shown in FIG. 3 has a plurality of regular (3) annular projections around the surface emitting laser (1) and the optical semiconductor device of Example 1 of FIGS. Is different. In the optical semiconductor device of Example 2, since there is a gap (10), it is possible to install wiring or the like on the surface using this portion.

  Thus, also in Example 2, the fiber guide is manufactured using a semiconductor technology using a material that is strong against physical force such as single crystal silicon, glass, and ceramics, and is positioned using a self-alignment function. Since the optical fiber can be connected with high accuracy, the optical fiber can be connected with high efficiency. Further, in the second embodiment, the degree of freedom of wiring can be increased.

  FIG. 4 is a diagram showing an optical semiconductor device according to Embodiment 3 of the present invention. FIG. 4 shows an example in which the light emitting device or the light receiving device is a surface emitting laser.

  Referring to FIG. 4A, on the surface emitting laser substrate (2) on which the surface emitting laser (1) as a light emitting device is formed on the surface, it is accurately aligned in the same manner as in the surface emitting laser formation. A formed annular protrusion (3b) is provided.

  By the way, in Example 3, the annular protrusion (3b) is provided with a recess (6a).

  The surface of the annular protrusion (3b) is subjected to a surface treatment that improves wettability to the fixing material (11) such as an adhesive, and a small amount of the fixing material (11) is applied thereto. . For example, an epoxy adhesive is used for the fixing material (11). When the fixing material (11) is applied to the annular protrusion (3b), the surface tension is as shown in FIG. In addition, since the protrusion (3b) is annular, even if there is application unevenness during application, the fixing material (11) spreads by itself and becomes uniform. Here, an annular fiber guide (4a) whose bottom surface has the same shape as the annular protrusion (3b) and whose surface is treated so as to improve the wettability with respect to the fixing material (11). The fiber guide (4a) is manufactured by using a semiconductor process using single crystal silicon as a material, and has a recess (6b)). Since the fiber guide (4a) moves to match the shape of the annular protrusion (3b) by the alignment function, the centers of the annular protrusion (3b) and the fiber guide (4a) coincide. That is, at this time, the center of the surface emitting laser (1) and the center of the fiber guide (4a) coincide. Thereafter, the fixing material (11) is cured by heat. After curing, when the optical fiber (5) is inserted into the fiber guide (4a), the centers of the optical fiber (5) and the surface emitting laser (1) coincide. At this time, since the fixing member (11) has a bulging portion (14) that is smaller than the inner diameter of the fiber guide (4a), when the optical fiber (5) is inserted, the tip of the optical fiber (5) It stops at the bulge (14) and does not collide with the surface emitting laser (1). Further, since the annular protrusion (3b) and the fiber guide (4a) are provided with the recess (6a) and the recess (6b), respectively, the allowable range of the control amount of the fixing material (11) is widened and can be easily controlled. Become.

  Thus, also in Example 3, an annular protrusion (3b) is installed around the surface emitting laser (1), and the self-alignment function of the fixing material (11) is used to position the optical fiber (5) with high positional accuracy. Can be connected.

  In other words, the fiber guide is manufactured using semiconductor technology using a material that is resistant to physical forces such as single crystal silicon, glass, ceramics, etc., and is positioned using the self-alignment function to increase the height of the optical fiber. Since accurate connection is possible, highly efficient optical fiber connection is possible. Furthermore, in Example 3, since the recesses (6a) and (6b) are provided where the fixing material (11) is applied, the allowable range of the control amount of the fixing material (11) is widened and easily controlled. The variation due to the difference can be minimized.

  FIG. 5 is a diagram showing an optical semiconductor device according to Example 4 of the present invention. FIG. 5 shows an example in which the light emitting device or the light receiving device is a surface emitting laser.

  Referring to FIG. 5A, on the surface emitting laser substrate (2) on which the surface emitting laser (1), which is a light emitting device, is formed, it is accurately aligned as in the surface emitting laser formation. The formed wettability area (7) (area (7) with good wettability with respect to the fixing material (11)) is provided, and other areas are wetted with respect to the fixing material (11). The nature is bad. A small amount of the fixing material (11) is applied to the area (7) having good wettability with respect to the fixing material (11). For example, a low-viscosity UV curable thermosetting adhesive is used for the fixing material (11). When the fixing material (11) is applied to an area (7) having good wettability, the surface tension shown in FIG. It is like that. In addition, since the area (7) with good wettability is annular, the fixing material (11) spreads by itself and becomes uniform even if there is uneven application during application. Here, an annular fiber guide (4) (single crystal silicon is used as the material), the area (7) having good wettability and the bottom surface having the same shape and the surface treated with the fixing material (11) to improve wettability. The fiber guide (4) is shaped into the area (7) with good wettability by the self-alignment function by the surface tension of the fixing material (11). The area (7) with good wettability and the center of the fiber guide (4) coincide with each other because they move so as to match. That is, at this time, the center of the surface emitting laser (1) and the center of the fiber guide (4) coincide. Thereafter, the fixing material (11) is temporarily cured by UV and is finally cured by heat. After curing, when the optical fiber (5) is inserted into the fiber guide (4), the centers of the optical fiber (5) and the surface emitting laser (1) coincide. At this time, since the fixing member (11) has a bulging portion (14) that is smaller than the inner diameter of the fiber guide (4), when the optical fiber (5) is inserted, the tip of the optical fiber (5) becomes the bulging portion. It stops at (14) and does not collide with the surface emitting laser (1). Moreover, since the area (7) with good wettability is made in the flat part, the application becomes easy.

  Thus, in Example 4, the area (7) with good wettability with respect to the fixing material (11) is provided around the surface emitting laser (1), and the other areas have wettability with respect to the fixing material (11). By using the self-alignment function of the fixing material (11), the optical fiber (5) can be connected with high positional accuracy.

  In other words, in Example 4, the fiber guide is manufactured using semiconductor technology using a material that is strong against physical force such as single crystal silicon, glass, and ceramics, and is positioned using a self-alignment function. Therefore, since the optical fiber can be connected with high accuracy, the optical fiber can be connected with high efficiency. Moreover, the area (7) with good wettability is made in a flat part, and for example, the fixing material is fixed only to the area (7) with good wettability by immersing the substrate (2) in the fixing material and pulling up the substrate. Since it becomes easy to apply, tact can be shortened.

  6 and 7 are views showing an optical semiconductor device according to a fifth embodiment of the present invention. 6 and 7 are examples in the case where the light emitting device or the light receiving device is a surface emitting laser. FIG. 6A is a plan view of the optical semiconductor device of Example 5, and FIG. 6B is a cross-sectional view taken along the line AA in FIG. FIG. 7 is a perspective view of each component.

  Referring to FIGS. 6A, 6B, and 7, when a surface emitting laser is formed on a surface emitting laser substrate (2) on which a surface emitting laser (1) that is a light emitting device is formed, Similarly, an annular protrusion (3c) is provided that is precisely aligned. The surface of the annular protrusion (3c) is subjected to a surface treatment that improves wettability to the fixing material (11), and a small amount of the fixing material (11) is applied thereto. For example, an epoxy adhesive is used for the fixing material (11). When the fixing material (11) is applied to the annular protrusion (3c), the surface tension is the same as that shown in FIG. 1 (c). In addition, since the protrusion (3c) is annular, even if there is application unevenness at the time of application, the fixing material (11) spreads by itself and becomes uniform. Here, the annular fiber guide (4b) (the fiber guide (3)) has the same shape as the bottom surface of the annular protrusion (3c) and the surface is surface-treated so as to improve the wettability to the fixing material (11). 4b) is made of single crystal silicon as a material using a semiconductor process and placed in contact with each other, the fiber guide (4b) is formed into an annular protrusion by the self-alignment function by the surface tension of the fixing material (11). Since it moves so as to match the shape of (3c), the center of the annular protrusion (3c) and the fiber guide (4b) coincide. That is, at this time, the center of the surface emitting laser (1) and the center of the fiber guide (4b) coincide.

  By the way, since the inner diameters of the fiber guide (4) and the fiber guide (4a) of the embodiment described above are almost the same as the outer diameter of the optical fiber (5), it is difficult to insert the optical fiber (5). On the other hand, in the fiber guide (4b) of Example 5, the tapered portion (8) is formed by the single crystal silicon anisotropic etching technique, and the optical fiber (5) is positioned by the tapered portion (8). . For this reason, the optical fiber (5) can be easily inserted and positioned.

  Thereafter, the fixing material (11) is cured by heat. After curing, when the optical fiber (5) is inserted into the tapered portion (8) of the fiber guide (4b), the centers of the optical fiber (5) and the surface emitting laser (1) coincide. When the optical fiber (5) is inserted, the tip of the optical fiber (5) stops at the tapered portion (8) and does not collide with the surface emitting laser (1).

  Thus, also in Example 5, the annular protrusion (3c) is installed around the surface emitting laser (1), and the self-alignment function of the fixing member (11) is used to position the optical fiber (5) with accuracy. It can be connected well.

  In other words, in the fifth embodiment, the fiber guide is manufactured by using a semiconductor technology using a material that is strong against physical force such as single crystal silicon, glass, ceramics, and the self-alignment function is used for positioning. Therefore, since the optical fiber can be connected with high accuracy, the optical fiber can be connected with high efficiency. Moreover, since it positions by a taper part (8), insertion of an optical fiber (5) becomes easy.

  8 and 9 are views showing an optical semiconductor device according to Embodiment 6 of the present invention. 8 and 9 are examples in the case where the light emitting device or the light receiving device is a surface emitting laser. 8A is a plan view of the optical semiconductor device according to the sixth embodiment, and FIG. 8B is a cross-sectional view taken along the line AA in FIG. 8A. FIG. 9 is a perspective view of each component.

  Referring to FIGS. 8A, 8B, and 9, the surface-emitting laser substrate (2) on which the surface-emitting laser (1) that is a light-emitting device is formed is formed on the surface-emitting laser substrate. Similarly, an annular protrusion (3c) is provided that is precisely aligned. The surface of the annular protrusion (3c) is subjected to a surface treatment that improves wettability to the fixing material (11), and a small amount of the fixing material (11) is applied thereto. For example, an epoxy adhesive is used for the fixing material (11). When the fixing material (11) is applied to the annular protrusion (3c), the surface tension is the same as that shown in FIG. 1 (c). In addition, since the protrusion (3c) is annular, even if there is application unevenness at the time of application, the fixing material (11) spreads by itself and becomes uniform. Here, an annular fiber guide (4c) (which has the same shape as the annular protrusion (3c) and the surface is treated so as to improve the wettability to the fixing material (11)). 4c) is produced by using a semiconductor process using single crystal silicon as a material), and the fiber guide (4c) is formed into an annular protrusion by the self-alignment function by the surface tension of the fixing material (11). Since it moves so as to match the shape of (3c), the center of the annular protrusion (3c) and the fiber guide (4c) coincide. That is, at this time, the center of the surface emitting laser (1) and the center of the fiber guide (4c) coincide.

  By the way, since the inner diameters of the fiber guide (4) and the fiber guide (4a) of the embodiment described above are almost the same as the outer diameter of the optical fiber (5), it is difficult to insert the optical fiber (5). On the other hand, the fiber guide (4c) of Example 6 has an abutting portion (9) formed so as to have a gap (12), and the optical fiber (5) is positioned here. For this reason, the optical fiber (5) can be easily inserted and positioned.

  Thereafter, the fixing material (11) is cured by heat. After curing, when the optical fiber (5) is inserted so as to hit the abutting portion (9) of the fiber guide (4c), the centers of the optical fiber (5) and the surface emitting laser (1) coincide. When the optical fiber (5) is inserted, the tip of the optical fiber (5) stops at the abutting surface (13) and does not collide with the surface emitting laser (1).

  Thus, also in Example 6, the annular protrusion (3a) is installed around the surface emitting laser (1), the self-alignment function of the fixing material (11) is used, and the optical fiber (5) is positioned accurately. It can be connected well.

  In other words, in Example 6, the fiber guide is manufactured using semiconductor technology using a material that is strong against physical force such as single crystal silicon, glass, and ceramics, and is positioned using the self-alignment function. Therefore, since the optical fiber can be connected with high accuracy, the optical fiber can be connected with high efficiency. Further, since the positioning is performed by the abutting portion (9), the optical fiber (5) can be easily inserted.

  As described above, the light emitting device (surface emitting laser) and the optical fiber have been described for explaining the present invention, but a light receiving device may be used instead of the light emitting device.

  In addition, although an epoxy adhesive is used as the fixing material, the fixing material may be an acrylic adhesive, other adhesives, or low-temperature solder.

  In addition, although expressed as a protrusion in the embodiment, it is needless to say that the protrusion may be a relative protrusion, and the protrusion may be formed by carving the substrate.

As described above, by using the present invention, since a physically strong and highly accurate connection can be made, a highly efficient connection can be made in a short time.

1 is a diagram illustrating an optical semiconductor device of Example 1. FIG. 1 is a diagram illustrating an optical semiconductor device of Example 1. FIG. 6 is a diagram illustrating an optical semiconductor device of Example 2. FIG. 6 is a diagram illustrating an optical semiconductor device according to Example 3. FIG. FIG. 6 is a diagram showing an optical semiconductor device of Example 4. FIG. 10 is a diagram illustrating an optical semiconductor device of Example 5. FIG. 10 is a diagram illustrating an optical semiconductor device of Example 5. FIG. 10 is a diagram showing an optical semiconductor device of Example 6. FIG. 10 is a diagram showing an optical semiconductor device of Example 6. It is a figure which shows an example of the conventional optical semiconductor device. It is a figure which shows an example of the conventional optical semiconductor device. It is a figure which shows an example of the conventional optical semiconductor device.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Light emitting device or light receiving device 2 Board | substrate 3 Protrusion 3a Annular protrusion 3b Annular protrusion 3c Annular protrusion 4 Fiber guide 4a Fiber guide 4b Fiber guide 4c Fiber guide 5 Optical fiber 6a Recess 6b Recess 7 Area with good wettability 8 Taper part 9 Butting Part 10 Crevice 11 Fixing material 12 Crevice 13 Abutting surface 14 Swelling part

Claims (12)

In an optical semiconductor device having a light emitting device or a light receiving device, a protrusion is provided around the light emitting device or the light receiving device so that the distance from the light emitting device or the light receiving device to the side surface of the protrusion is equal as a means used for positioning the fiber. An optical semiconductor device. 2. The optical semiconductor device according to claim 1, wherein the protrusions are connected in a ring shape with the same width. 2. The optical semiconductor device according to claim 1, wherein a plurality of the protrusions are regularly present in an annular shape. 4. The optical semiconductor device according to claim 1, wherein an annular fiber guide is provided so as to face the protrusion. 5. The optical semiconductor device according to claim 4, wherein the fiber guide is self-aligned with the protrusion by a predetermined fixing material. 6. The optical semiconductor device according to claim 4, wherein the protrusion is provided with a recess on a surface facing the fiber guide. 6. The optical semiconductor device according to claim 4, wherein the fiber guide is provided with a recess on a surface facing the protrusion. 6. The optical semiconductor device according to claim 4, wherein a taper is provided on an inner surface of the fiber guide. 6. The optical semiconductor device according to claim 4, wherein a fiber side abutting and fixing surface is provided on the inner surface of the fiber guide. In an optical semiconductor device having a light emitting device or a light receiving device, an area having good wettability with respect to a predetermined fixing material is provided around the light emitting device or the light receiving device as a means used for positioning the fiber, An optical semiconductor device, wherein wettability with respect to a predetermined fixing material is deteriorated. An optical interconnection system, wherein the optical semiconductor device according to any one of claims 1 to 10 and an optical fiber are used. An optical wiring module, wherein the optical semiconductor device according to any one of claims 1 to 10 and an optical fiber are used.

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