JP2005243804A - Heating piping structure of semiconductor manufacturing apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To increase temperature required for bake-out over the entire piping route of a semiconductor manufacturing apparatus, and to improve working efficiency by reducing maintenance work for cleaning. <P>SOLUTION: A heating means 5 is provided at the outer periphery of the middle section 4 of a piping module 1 having a connection flange 2 at both the ends, a cooling means 7 is provided at the outer periphery of the end 6 of the piping module 1, and a liner 9 that straddles the end 6 and forms a gap 8 at an area to the inner periphery is provided between respective middle sections 4 of the adjacent piping modules 1. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a piping structure having a heating function used in an exhaust path or the like of a semiconductor manufacturing apparatus.

  In the exhaust path of a semiconductor manufacturing apparatus such as an MOCVD apparatus used for manufacturing a compound semiconductor, unreacted arsenic, phosphorus, and the like condense as the gas temperature decreases and adhere to the inner wall of the pipe. If deposits occur on the inner wall of the pipe, the flow of gas changes, which adversely affects the upstream semiconductor manufacturing equipment. By heating the pipe, the amount of deposit on the inner wall of the pipe is suppressed by suppressing the temperature drop of the gas. Furthermore, when the amount of deposits reaches a certain level, it is necessary to perform so-called bake-out in which the piping is heated to a predetermined temperature or higher to remove the deposits with a carrier gas.

The bakeout temperature depends on the composition of the deposit, but for example, when the deposit is arsenic, it must be 400 ° C. or higher.
As a heating means provided in the piping of the exhaust path of the conventional semiconductor manufacturing apparatus, a line heater can be mentioned. A general line heater is necessary when arsenic is attached at a heating temperature of about 100 ° C. 400 It did not reach far to ℃.

In recent years, a high-temperature line heater has been proposed that can increase the temperature up to 400 ° C. by placing a cord heater around the pipe and providing a soaking layer, a heat insulating layer, and a protective cover on the outer periphery (Patent Document). 1).
However, the piping of the exhaust path of the semiconductor manufacturing apparatus is configured by connecting a large number of unit pipes, and a packing is provided at a flange portion that is a connection location. Since the heat-resistant temperature of the packing is about 200 ° C, even if the entire piping of the exhaust path including the connecting part is covered with this high-temperature line heater, the temperature can be increased up to the heat-resistant temperature of the packing, and baking at 400 ° C is possible. Can't do out.

  Even if the exhaust pipe is not connected to the exhaust pipe and only the other parts are covered with a high-temperature line heater and the temperature is raised to 400 ° C, the temperature distribution is not uniform over the entire pipe. You cannot bake out. In this case, even in a normal heating state in which the temperature is not raised to 400 ° C., the temperature distribution in the pipe becomes non-uniform, and a large amount of deposits are generated at the connecting portion having a low temperature. .

As described above, since the conventional piping heating means cannot be baked out at 400 ° C., it is necessary to frequently disassemble the piping to remove the deposits, which causes the working efficiency to deteriorate.
In addition, it is necessary to periodically clean the piping of the exhaust path, which is a semiconductor manufacturing device and its ancillary equipment, but disassembling and assembling the pipe covered with the line heater is troublesome. Disassembling and assembling when covered with a heater was a very complicated and troublesome task.
JP 2002-228081 A

  The present invention solves the above problem in the piping of the exhaust path of a semiconductor manufacturing apparatus, and can raise the temperature up to the temperature required for baking out over the entire piping path, and can perform maintenance work for cleaning. It aims at providing the heating piping structure of the semiconductor manufacturing apparatus which can reduce and improve work efficiency.

In the heating piping structure of the semiconductor manufacturing apparatus of the present invention, the heating means is provided on the outer periphery of the intermediate portion of the piping module having the connecting flanges at both ends, the cooling means is provided on the outer periphery of the end portion of the piping module, and adjacent to each other. The above-mentioned problem is solved by providing a liner that spans the end portion and forms a gap between the intermediate portions of each piping module to be formed.
In this heating piping structure, since the cooling means is provided on the outer periphery of the end of the piping module between the heating means and the flange, even if the heating means is heated to a temperature at which the piping can be baked out, the temperature of the flange Will not rise above the heat resistance temperature of the packing.

In addition, since a liner is provided between each intermediate portion of the adjacent piping modules so as to straddle the end portion and to form an air gap with the inner periphery thereof, the heat applied by the heating means is transferred from the intermediate portion to the liner. Conduct. Since the gap between the end cooled by the cooling means and the liner is thermally blocked by a gap, the liner can be heated to the bakeout temperature.
When the heating means is an electric heater, the cooling means is a water cooling jacket, and the electrodes of the electric heaters of the adjacent piping modules and the cooling water pipes of the water cooling jacket are connected to each other, disassembly for cleaning that is performed periodically.・ Assembly can be simplified, and it is possible to respond flexibly to changes in the piping route.

  The heating piping structure of the semiconductor manufacturing apparatus of the present invention can raise the temperature to the temperature required for baking out over the entire piping path, and can reduce maintenance work for cleaning and improve work efficiency.

FIG. 1 is a sectional view of a heating piping structure of a semiconductor manufacturing apparatus showing an embodiment of the present invention.
In this heating piping structure, the piping module 1 includes connecting flanges 2 at both ends, and a packing 3 is inserted between the flanges 2 of the adjacent piping modules 1.
A heating means 5 is provided on the outer periphery of the intermediate portion 4 of the piping module 1, and a cooling means 7 is provided on the outer periphery of the end portion 6. In addition, a liner 9 is provided between the intermediate portions 4 of the piping modules 1 adjacent to each other so as to straddle the end portion 6 and to form a gap 8 between the inner periphery thereof.

The heating means 5 includes an electric heater 10 spirally provided on the outer periphery of the intermediate portion 4 of the piping module 1, heater electrodes 11 connected to both ends of the electric heater 10, and a cover 12 covering these. The electric heater 10 has a heating capability of raising the temperature inside the piping module 1 to a high temperature of 400 ° C. or higher.
The cooling means 7 is connected to a water cooling jacket 13 disposed at the end 6 between the heating means 5 and the flange 2 and covering the outer periphery, and a cooling water pump (not shown) and a cooling water tank (not shown). It consists of a cooling water pipe 14 for supplying cooling water to the water cooling jacket 13.

  By connecting a plurality of the piping modules 1, the piping of the exhaust path of the semiconductor manufacturing apparatus is configured. At this time, the heater electrodes 11 and the cooling water pipings 14 of the piping modules 1 adjacent to each other are connected to each other. . The heating means 5 and the cooling means 7 are each provided with a temperature sensor (not shown) for monitoring the temperature.

Next, the case where semiconductor gas is heated with this piping module 1 is demonstrated.
During normal operation, the voltage applied to the electric heater 10 is adjusted based on the detection value of the temperature sensor, and the temperature at which unreacted substances in the exhaust gas are less likely to condense and adhere to the inner wall of the pipe (about 200 ° C to 300 ° C) Heat to.
The cooling means 7 constantly circulates cooling water between the cooling water pump and the cooling water tank, and adjusts the amount of water based on the detection value of the temperature sensor.

  Even if the pipe is heated from about 200 ° C. to about 300 ° C. by the heating means 5, the cooling means 7 is provided between the flange 2 and the heating means 5 at both ends, so It does not rise to temperature. Between each intermediate part 4 of the piping modules 1 adjacent to each other, there is provided a liner 9 that spans the end part 6 and forms a gap 8 between the inner periphery thereof, so that the heat applied by the heating means 5 is intermediate. Conducted from part 4 to liner 9. Since the gap between the end 6 cooled by the cooling means 7 and the liner 9 is thermally blocked by the air gap 8, the liner 9 that directly contacts the exhaust gas inside has a temperature of 200 ° C. to 300 ° C. exceeding the heat resistance temperature of the packing 3. It becomes possible to heat up to about ° C.

Even if the semiconductor manufacturing device is operated under the above heating conditions, it is impossible to completely eliminate the deposits on the inner wall of the pipe, and the amount of deposits gradually increases with the operation of the device. When it reaches, it is necessary to bake out.
At the time of baking out, the voltage applied to the electric heater 10 is adjusted based on the detected value of the temperature sensor as in the normal operation, and heating is performed at 400 ° C. or higher. The cooling means 7 increases the amount of cooling water as the heating temperature rises based on the detection value of the temperature sensor. A carrier gas such as N ₂ is allowed to flow through the pipe.

  Even if the piping is heated to 400 ° C. or higher by the heating means 5, the cooling means 7 is provided between the flange 2 and the heating means 5 at both ends, so that the temperature of the flange 2 rises to the heat resistance temperature of the packing 3. Never do. Between each intermediate part 4 of the piping modules 1 adjacent to each other, there is provided a liner 9 that spans the end part 6 and forms a gap 8 between the inner periphery thereof, so that the heat applied by the heating means 5 is intermediate. Conducted from part 4 to liner 9. Since the gap between the end 6 cooled by the cooling means 7 and the liner 9 is thermally blocked by the gap 8, the liner 9 can be heated to 400 ° C. or more exceeding the heat resistance temperature of the packing 3. Become.

Deposits such as arsenic and phosphorus adhering to the inner wall of the pipe are heated to 400 ° C. or higher to become vapor and are removed by the carrier gas. Since the bakeout can be performed, the frequency of disassembling and cleaning the pipe is remarkably reduced as compared with the conventional case, and the work efficiency is greatly improved.
As described above, it is possible to operate while controlling under normal heating conditions and different baking conditions under different heating conditions, but it is possible to always operate under controlled heating conditions during baking out. .

Between the piping modules 1 adjacent to each other, the heater electrodes 11 and the cooling water pipes 14 are connected to each other, and they do not cross each other in a complicated manner. Further, the liner 9 is fitted to the inner periphery of the piping module 1 with an upstream side with respect to the gas flow, and the downstream side is fitted to the inner periphery of the piping module 1 with a gap fit or an intermediate fit. Therefore, it is possible to prevent the adhering material from entering the gap 8 without impairing the assembling property. Therefore, the pipe modules 1 can be easily disassembled and assembled, the cleaning operation can be performed in a short time, and the pipe route can be flexibly changed.
Furthermore, in order to prevent burns and improve heating efficiency, the pipe wall of the pipe module 1 may be a vacuum heat insulating structure.

It is sectional drawing of the heating piping structure of the semiconductor manufacturing apparatus which shows embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Piping module 2 Flange 3 Packing 4 Middle part 5 Heating means 6 End part 7 Cooling means 8 Space | gap 9 Liner 10 Electric heater 11 Heater electrode 12 Cover 13 Water cooling jacket 14 Cooling water piping

Claims (2)

  Heating means is provided on the outer periphery of the intermediate portion of the piping module having connecting flanges at both ends, and cooling means is provided on the outer periphery of the end portion of the piping module. A heating piping structure for a semiconductor manufacturing apparatus, characterized in that a liner is provided to form a gap between the inner circumference and the inner circumference.   2. The heating means is an electric heater, and the cooling means is a water cooling jacket, and the electrodes of the electric heaters of the piping modules adjacent to each other and the cooling water pipes of the water cooling jacket are connected to each other. Heating piping structure of semiconductor manufacturing equipment.

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