JP2005243497A - Organic el panel and its manufacturing method - Google Patents

Organic el panel and its manufacturing method Download PDF

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JP2005243497A
JP2005243497A JP2004053464A JP2004053464A JP2005243497A JP 2005243497 A JP2005243497 A JP 2005243497A JP 2004053464 A JP2004053464 A JP 2004053464A JP 2004053464 A JP2004053464 A JP 2004053464A JP 2005243497 A JP2005243497 A JP 2005243497A
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electrode
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Raiei Cho
来英 張
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Nippon Seiki Co Ltd
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Nippon Seiki Co Ltd
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<P>PROBLEM TO BE SOLVED: To provide an organic EL panel capable of reducing a driving voltage by suppressing an occurrence of the voltage drop phenomenon in a wiring portion without complicating a manufacturing process of the organic EL panel, and its manufacturing method. <P>SOLUTION: The organic EL panel A includes an organic EL element formed by layering a first electrode 2 formed on a translucent substrate 1, an organic layer having at least a luminous layer formed on the first electrode 2, and a second electrode 4 formed on the organic layer and facing to the first electrode 2. Frame-like partitions W1 and W2 are formed on the side of the organic EL element formed on the substrate 1. Connection portions Lc1 and Lc2 are connected to the first electrode and formed of a part of a fourth electrode 4 isolated from the second electrode 4 by the partitions W1 and W2. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明は、有機EL(エレクトロルミネセンス)素子を透光性の基板上に配設してなる有機ELパネルおよびその製造方法に関する。   The present invention relates to an organic EL panel in which an organic EL (electroluminescence) element is disposed on a translucent substrate and a method for manufacturing the same.

従来、図5で示すように、透光性の基板1上に、ITO(Indium Tin Oxide)等の透光性の第一の金属材料からなり、陽極となる第一電極2と、少なくとも発光層を有する有機層3と、アルミニウム(Al)あるいはマグネシウム銀(Mg:Ag)等の前記第一の金属材料よりも抵抗率の低い第二の金属材料からなり、陰極となる第二電極4と、を順次形成した有機EL素子を配設してなる有機ELパネルが知られており、有機層3は、例えば正孔注入層,正孔輸送層,発光層及び電子輸送層から構成されている(例えば特許文献1参照)。   Conventionally, as shown in FIG. 5, a light-transmitting first metal material such as ITO (Indium Tin Oxide) is formed on a light-transmitting substrate 1, and at least a light emitting layer. An organic layer 3 having a second metal material having a lower resistivity than the first metal material, such as aluminum (Al) or magnesium silver (Mg: Ag), and a second electrode 4 serving as a cathode; An organic EL panel in which organic EL elements are sequentially formed is known, and the organic layer 3 includes, for example, a hole injection layer, a hole transport layer, a light emitting layer, and an electron transport layer ( For example, see Patent Document 1).

かかる有機ELパネルは、第一電極2と第二電極4との間に、直流電源を接続して両電極間2,4に電流を供給することにより、有機層3が発光して、その発光を基板1を通して外部へ照射するものであり、その発光部Sは、第一電極2,有機層3及び第二電極4の積層個所となる。   In such an organic EL panel, a direct current power source is connected between the first electrode 2 and the second electrode 4 and current is supplied between the electrodes 2 and 4, whereby the organic layer 3 emits light, and the light emission. Is emitted to the outside through the substrate 1, and the light emitting portion S is a laminated portion of the first electrode 2, the organic layer 3, and the second electrode 4.

発光部Sの形状は、第一電極2の形状と、第一電極2と有機層3との間に形成される絶縁層5によって定められる。すなわち、基板1上には、表示部Dを有する第一電極2と、第一電極2と同一材料からなり、第一電極2に電流を供給するための配線部Lとが形成されており、第一電極2及び配線部Lと有機層3との間には、ポリイミド系、アクリル系、フェノール系等の絶縁材料をスピンコートやロールコート等の適宜手段により成膜形成された絶縁層5が位置している。絶縁層5は、所望する発光形状を除いて形成されており、絶縁層5が形成されない個所が発光部Sとなる。なお、表示部Dの発光部S以外の部分(絶縁層5がカバーしている部分)は、配線部Lの一部となる。   The shape of the light emitting portion S is determined by the shape of the first electrode 2 and the insulating layer 5 formed between the first electrode 2 and the organic layer 3. That is, on the substrate 1, a first electrode 2 having a display portion D and a wiring portion L made of the same material as the first electrode 2 for supplying a current to the first electrode 2 are formed. Between the first electrode 2 and the wiring part L and the organic layer 3, an insulating layer 5 is formed by forming an insulating material such as polyimide, acrylic or phenol based on an appropriate means such as spin coating or roll coating. positioned. The insulating layer 5 is formed except for a desired light emission shape, and a portion where the insulating layer 5 is not formed becomes the light emitting portion S. Note that a portion of the display portion D other than the light emitting portion S (a portion covered by the insulating layer 5) is a part of the wiring portion L.

かかる有機ELパネルにおいては、前述のように第一電極2に電流を供給するための配線部Lを光の透過率が高い前記第一の金属材料によって形成するが、前記第一の金属材料は抵抗率が高く、表示部Dの形成位置によって配線部Lの面積が大きくなる場合に配線部L中で電圧降下現象が生じてしまい、また、この電圧降下現象を補うために駆動電圧を高くする必要があるという問題点があった。   In such an organic EL panel, the wiring portion L for supplying a current to the first electrode 2 is formed of the first metal material having a high light transmittance as described above. When the resistivity is high and the area of the wiring portion L increases depending on the position where the display portion D is formed, a voltage drop phenomenon occurs in the wiring portion L, and the drive voltage is increased to compensate for this voltage drop phenomenon. There was a problem that it was necessary.

本願出願人は、前述の問題点を解決するために、特許文献2において、陽極(第一電極)を表示に係る形状の表示部と電圧印加のための端子部とで構成し、前記表示部と前記端子部との間にエッチングによってアルミニウム(Al)等からなる抵抗率の低い金属材料からなる補助通電層を形成する方法を提案している。
特開平5−234681号公報 特開2001−15268号公報
In order to solve the above-mentioned problems, the applicant of the present application disclosed in Patent Document 2 that an anode (first electrode) is composed of a display unit having a shape related to display and a terminal unit for voltage application, and the display unit And a method of forming an auxiliary energization layer made of a metal material having a low resistivity made of aluminum (Al) or the like by etching between the first and second terminal portions.
Japanese Patent Laid-Open No. 5-234681 JP 2001-15268 A

しかしながら、前述方法は、前記補助通電層となる前記金属材料を層状に設ける工程と、前記金属材料の不要部分をエッチングによって除去して前記補助通電層を形成する工程と、を必要とし、有機ELパネルの製造工程が煩雑となるとともに製造コストが上昇するという問題点があった。   However, the above method requires a step of providing the metal material to be the auxiliary energization layer in layers, and a step of removing unnecessary portions of the metal material by etching to form the auxiliary energization layer. The manufacturing process of the panel becomes complicated and the manufacturing cost increases.

本発明は、このような問題に着目して、有機ELパネルの製造工程を煩雑とすることなく、配線部中で電圧降下現象が生じることを抑制することを可能とする有機ELパネル及びその製造方法を提供することを目的とする。   The present invention pays attention to such a problem, and without complicating the manufacturing process of the organic EL panel, it is possible to suppress the occurrence of a voltage drop phenomenon in the wiring portion and the manufacturing thereof. It aims to provide a method.

前記課題を解決するため、本発明の有機ELパネルは、透光性の基板上に形成される第一電極と、この第一電極上に形成される少なくとも発光層を有する有機層と、この有機層上に形成され前記第一電極と対向する第二電極と、を積層形成してなる有機EL素子と、前記基板の前記有機EL素子形成面側に形成される枠状の隔壁部と、前記第一電極と接続され、前記隔壁部によって前記第二電極と隔離される前記第二電極の一部からなる接続部と、を備えてなることを特徴とする。   In order to solve the above problems, an organic EL panel of the present invention includes a first electrode formed on a light-transmitting substrate, an organic layer having at least a light emitting layer formed on the first electrode, and the organic layer. An organic EL element formed by laminating a second electrode formed on a layer and facing the first electrode; a frame-shaped partition wall formed on the organic EL element forming surface side of the substrate; And a connecting portion formed of a part of the second electrode connected to the first electrode and separated from the second electrode by the partition wall.

また、前記第二電極及び前記接続部は、前記第一電極よりも抵抗率の低い金属材料からなることを特徴とする。   Further, the second electrode and the connection portion are made of a metal material having a resistivity lower than that of the first electrode.

また、前記接続部を前記第一電極に接続するための電極端子部及び/あるいは前記接続部と接続され前記基板上の端部に形成される電源端子部を備えてなることを特徴とする。   In addition, an electrode terminal portion for connecting the connection portion to the first electrode and / or a power supply terminal portion connected to the connection portion and formed at an end portion on the substrate is provided.

また、本発明の有機ELパネルの製造方法は、透光性の基板上に第一電極を形成する工程と、前記基板の前記第一電極形成面側に枠状の隔壁部を形成する工程と、前記第一電極上に少なくとも発光層を有する有機層を形成する工程と、前記有機層及び前記隔壁部上に第二電極を形成するとともに、前記隔壁部によって前記第二電極の一部を前記第二電極と隔離して前記第一電極と接続される接続部を形成する工程と、を少なくとも含むことを特徴とする。   Moreover, the manufacturing method of the organic electroluminescent panel of this invention has the process of forming a 1st electrode on the translucent board | substrate, the process of forming a frame-shaped partition part on the said 1st electrode formation surface side of the said board | substrate, A step of forming an organic layer having at least a light-emitting layer on the first electrode; a second electrode on the organic layer and the partition; and a part of the second electrode by the partition And a step of forming a connection portion that is isolated from the second electrode and connected to the first electrode.

また、前記第二電極及び前記接続部は、前記第一電極よりも抵抗率の低い金属材料からなることを特徴する。   Further, the second electrode and the connection portion are made of a metal material having a resistivity lower than that of the first electrode.

また、前記基板上に前記接続部を前記第一電極に接続する電極端子部を形成する工程及び/あるいは前記基板上の端部に前記接続部と接続される電源端子部を形成する工程を含むことを特徴とする。   A step of forming an electrode terminal portion for connecting the connection portion to the first electrode on the substrate; and / or a step of forming a power supply terminal portion connected to the connection portion at an end portion on the substrate. It is characterized by that.

本発明は、有機EL(エレクトロルミネセンス)素子を透光性の基板上に配設してなる有機ELパネル及びその製造方法に関し、有機ELパネルの製造工程を煩雑とすることなく、配線部中で電圧降下現象が生じることを抑制することを可能とする。   The present invention relates to an organic EL panel in which an organic EL (electroluminescence) element is disposed on a light-transmitting substrate and a method for manufacturing the same, and without complicating the manufacturing process of the organic EL panel. This makes it possible to suppress the occurrence of the voltage drop phenomenon.

以下、添付図面に基づいて本発明の実施形態について説明する。が、前述の従来技術と同一若しくは相当個所には、同一の符号を付してその詳細な説明を省く。   Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. However, the same reference numerals are given to the same or corresponding parts as those of the above-described conventional technology, and detailed description thereof is omitted.

有機ELパネルAは、図1及び図2に示すように、透光性の基板1上に、表示部D1,D2を有する第一電極2と、表示部D1,D2と定電流源(図示しない)とを接続するための配線部L1,L2と、第一電極2の発光部S1,S2を除く表示部D1,D2上に位置し開口部5a1,5a2を有する絶縁層5と、絶縁層上に形成される枠状の隔壁部W1,W2と、有機層3と、第二電極4と、を設けてなるものである。なお、図2には、表示部D1,発光部S1,配線部L1及び隔壁部W1のみが図示されているが、他の表示部D2,発光部S2,隔壁部W2及び配線部L2も同様に形成されるものである。   As shown in FIGS. 1 and 2, the organic EL panel A includes a first electrode 2 having display portions D1 and D2, a display portion D1 and D2, and a constant current source (not shown) on a translucent substrate 1. ), The insulating layer 5 having openings 5a1 and 5a2 located on the display portions D1 and D2 excluding the light emitting portions S1 and S2 of the first electrode 2, and the insulating layer 5 The frame-shaped partition walls W1 and W2, the organic layer 3, and the second electrode 4 are provided. In FIG. 2, only the display part D1, the light emitting part S1, the wiring part L1, and the partition part W1 are shown. However, the other display part D2, the light emitting part S2, the partition part W2, and the wiring part L2 are the same. Is formed.

配線部L1,L2は、第一電極2と同一の前記第一の金属材料からなる陽極端子部(電極端子部)La1,La2及び電源端子部Lb1,Lb2と、前記第二の金属材料からなる接続部Lc1,Lc2と、からなり、前記定電流源からの定電流を第一電極2の表示部D1,D2に印加するためのものである。陽極端子部La1,La2は、一端が第一電極2の表示部D1,D2とそれぞれ接続され、また、他端の一部が絶縁層5の開口部5a1,5a2から露出するように形成されており、この他端が接続部Lc1,Lc2と重なり合って接続されている。電源端子部Lb1,Lb2は、基板1上の端部に形成されるものであり、一端が所定の回路基板を介して前記定電流源とそれぞれ接続され、また、他端の一部が絶縁層5の開口部5a1,5a2から露出するように形成されており、この他端が接続部Lc1,Lc2と重なり合って接続されている。接続部Lc1,Lc2は、第二電極4の一部が後述する隔壁部W1,W2によって第二電極4と隔離(段切れ)されてたものであり、前記第二の金属材料からなる。例えば、図2(b)に示すように、絶縁層5の開口部5a1は隔壁部W1によって囲まれており、隔壁部W1によって囲まれる開口部5a1内の基板1上に形成される接続部5c1は、隔壁部W1によって周囲の第二電極4と隔離されている。また、接続部Lc1,Lc2は、一端が陽極端子部La1,La2を介して第一電極の表示部D1,D2とそれぞれ接続され、他端が電源端子部Lb1,Lb2と接続される。   The wiring parts L1 and L2 are made of the same metal material as that of the first electrode 2, the anode terminal parts (electrode terminal parts) La1 and La2 and the power supply terminal parts Lb1 and Lb2, and the second metal material. The connection portion Lc1 and Lc2 are used to apply a constant current from the constant current source to the display portions D1 and D2 of the first electrode 2. The anode terminal portions La1 and La2 are formed such that one end is connected to the display portions D1 and D2 of the first electrode 2 and a part of the other end is exposed from the openings 5a1 and 5a2 of the insulating layer 5. The other end overlaps and is connected to the connection portions Lc1 and Lc2. The power supply terminal portions Lb1 and Lb2 are formed at the end portions on the substrate 1, one end of which is connected to the constant current source via a predetermined circuit board, and the other end is an insulating layer. 5 is exposed from the openings 5a1 and 5a2, and the other end is overlapped and connected to the connecting portions Lc1 and Lc2. The connecting portions Lc1 and Lc2 are parts of the second electrode 4 separated from the second electrode 4 by the partition walls W1 and W2 (discussed later), and are made of the second metal material. For example, as shown in FIG. 2B, the opening 5a1 of the insulating layer 5 is surrounded by the partition wall W1, and the connection portion 5c1 formed on the substrate 1 in the opening 5a1 surrounded by the partition wall W1. Is separated from the surrounding second electrode 4 by the partition wall W1. Further, one end of each of the connection portions Lc1 and Lc2 is connected to the display portions D1 and D2 of the first electrode via the anode terminal portions La1 and La2, and the other end is connected to the power supply terminal portions Lb1 and Lb2.

隔壁部W1,W2は、絶縁層5上に開口部5a1,5a2を囲むように設けられており、ノボラック樹脂等の絶縁材料からなる。また、接続部5a1,5a2を確実に第二電極4と隔離するため、隔壁部W1,W2は断面の形状が上方の辺が下方の辺よりも長い、すなわち、絶縁層5に対して逆テーパー状になるように形成されることが望ましい。   The partition walls W1 and W2 are provided on the insulating layer 5 so as to surround the openings 5a1 and 5a2, and are made of an insulating material such as a novolac resin. Further, in order to reliably isolate the connection portions 5a1 and 5a2 from the second electrode 4, the partition wall portions W1 and W2 have a cross-sectional shape whose upper side is longer than the lower side, that is, reversely tapered with respect to the insulating layer 5 It is desirable to form so that it may become a shape.

第二電極4は、有機層3及び絶縁層5上に形成されITO等の導電材料からなる陰極端子部4aと接続される。陰極端子部4aは所定の回路基板を介して前記定電流源と接続されるものである。また、第二電極4を形成する際に、絶縁層5上の隔壁部W1,W2によって囲まれる個所、すなわち開口部5a1,5a2内の基板1上においては、第二電極4の一部は、隔壁部W1,W2によって陰極端子部4aと接続される第二電極4と隔離(段切れ)され、それぞれ第二電極4とは隔離された接続部Lc1,Lc2が形成されることとなる。   The second electrode 4 is formed on the organic layer 3 and the insulating layer 5 and is connected to a cathode terminal portion 4a made of a conductive material such as ITO. The cathode terminal portion 4a is connected to the constant current source via a predetermined circuit board. When the second electrode 4 is formed, a part of the second electrode 4 is surrounded by the partition walls W1 and W2 on the insulating layer 5, that is, on the substrate 1 in the openings 5a1 and 5a2. The partition portions W1 and W2 are separated (staged) from the second electrode 4 connected to the cathode terminal portion 4a, and connection portions Lc1 and Lc2 are formed separately from the second electrode 4, respectively.

次に、図3及び図4を用いて、第一の実施形態である有機ELパネルの製造方法を説明する。なお、図3及び図4においては、表示部D1,発光部S1,配線部L1及び隔壁部W1のみが図示されているが、他の表示部D2,発光部S2,隔壁部W2及び配線部L2も同様に形成されるものである。   Next, the manufacturing method of the organic EL panel which is 1st embodiment is demonstrated using FIG.3 and FIG.4. 3 and 4, only the display part D1, the light emitting part S1, the wiring part L1, and the partition part W1 are shown, but the other display part D2, the light emitting part S2, the partition part W2, and the wiring part L2 are shown. Is formed in the same manner.

まず、透光性の基板1上に、スパッタリングあるいは蒸着法等の手段によって、ITO等の透光性の金属材料からなる第一の金属層を形成し、この第一の金属層をフォトリソグラフィー法等の手段によってパターン形成して、表示部D1(D2)を有する第一電極2と、表示部D1(D2)にそれぞれ接続される陽極端子部La1(La2)と、電源端子部Lb1(Lb2)と、後述する第二電極4と接続される陰極端子部4aと、を得る(図3(a)及び図4(a)参照)。なお、陽極端子部La1(La2)及び電源端子部Lb1(Lb2)は、前記第一の金属材料に例えばクロム(Cr)等の第一電極2とは異なる材料を積層して形成されるものであってもよい。   First, a first metal layer made of a light-transmitting metal material such as ITO is formed on the light-transmitting substrate 1 by means such as sputtering or vapor deposition, and this first metal layer is formed by a photolithography method. The first electrode 2 having the display part D1 (D2), the anode terminal part La1 (La2) connected to the display part D1 (D2), and the power supply terminal part Lb1 (Lb2), respectively And a cathode terminal portion 4a connected to the second electrode 4 described later (see FIGS. 3A and 4A). The anode terminal portion La1 (La2) and the power supply terminal portion Lb1 (Lb2) are formed by laminating a material different from the first electrode 2 such as chromium (Cr) on the first metal material. There may be.

次に、ポリイミド系、アクリル系、フェノール系等の絶縁材料をスピンコートやロールコート等の手段により絶縁層5を成膜形成し、フォトリソグラフィー法等の手段によって各発光部S1(S2)となる個所及び開口部5a1(5a2)となる個所を除去し、さらに、ノボラック樹脂等の絶縁材料を絶縁層5上に成膜形成し、フォトリソグラフィー法等の手段によって、絶縁層5の開口部5a1(5a2)を囲む枠状の隔壁部W1(W2)を形成する(図3(b)及び図4(b)参照)。なお、隔壁部W1(W2)は断面の形状が絶縁層5に対して逆テーパー状となるように形成される。   Next, an insulating layer 5 is formed by means of spin coating, roll coating or the like using an insulating material such as polyimide, acrylic or phenol, and each light emitting portion S1 (S2) is formed by means such as photolithography. The portions to be the portions and the openings 5a1 (5a2) are removed, and an insulating material such as a novolac resin is formed on the insulating layer 5, and the openings 5a1 (in the insulating layer 5) by means such as photolithography. 5a2) is formed to form a frame-shaped partition wall W1 (W2) (see FIGS. 3B and 4B). The partition wall portion W1 (W2) is formed so that the cross-sectional shape is a reverse taper with respect to the insulating layer 5.

次に、少なくとも発光層を有する有機層3を蒸着法等の手段によって積層形成し、さらに、アルミニウム(Al)あるいはマグネシウム銀(Mg:Ag)等の前記第二の金属材料を蒸着法等の手段によって層状に形成し、第二電極4を形成して有機EL素子を得る。(図3(c)及び図4(c)参照)。このとき、絶縁層5の隔壁部W1(W2)によって囲まれる個所においては、第二電極4の一部は、隔壁部W1(W2)によって第二電極4と隔離され、陽極端子部La1(La2)及び電源端子部Lb12(Lb2)とそれぞれ接続される接続部Lc1(Lc2)を形成し、表示部D1(D2)と前記定電流源とをそれぞれ接続するための配線部L1(L2)を得る。また、有機層3の経時劣化を抑制するために、基板1上に、前記有機EL素子を気密的に覆う封止部材(図示しない)を配設する。   Next, an organic layer 3 having at least a light emitting layer is laminated by means such as vapor deposition, and further the second metal material such as aluminum (Al) or magnesium silver (Mg: Ag) is vapor deposited. To form an organic EL element by forming the second electrode 4. (See FIG. 3C and FIG. 4C). At this time, in the part surrounded by the partition wall portion W1 (W2) of the insulating layer 5, a part of the second electrode 4 is isolated from the second electrode 4 by the partition wall portion W1 (W2), and the anode terminal portion La1 (La2). ) And the power supply terminal portion Lb12 (Lb2), respectively, and a connection portion Lc1 (Lc2) is formed, and wiring portions L1 (L2) for connecting the display portion D1 (D2) and the constant current source are obtained. . In addition, a sealing member (not shown) that hermetically covers the organic EL element is disposed on the substrate 1 in order to suppress the deterioration of the organic layer 3 over time.

以上の工程によって、第一電極2,有機層3及び第二電極4の積層個所からなる発光部S1(S2)を有する有機ELパネルAを得ることができる。   Through the above steps, the organic EL panel A having the light emitting portion S1 (S2) composed of the laminated portion of the first electrode 2, the organic layer 3, and the second electrode 4 can be obtained.

かかる有機ELパネルA及びその製造方法は、基板1の前記有機EL素子形成面側に枠状の隔壁部W1,W2を形成し、第二電極4の一部を前記第二電極4から隔離することで接続部Lc1,Lc2を形成し、この接続部Lc1,Lc2を配線部L1,L2の少なくとも一部として利用することにより、配線部L1,L2の少なくとも一部が前記第一の金属材料よりも抵抗率の低い前記第二の金属材料からなる接続部Lc1,Lc2で構成されることから配線部L1,L2の配線抵抗値を低減することができ、配線部L1,L2中で電圧降下現象が生じることを抑制することができる。また、第二電極4の形成と同時に接続部La1,La2を形成することができるため、有機ELパネルAの製造工程を煩雑とすることがない。また、配線部L1,L2は、前記第一の金属材料からなる従来の配線部と比較して抵抗率が低いため、同じ値の電圧によって定電流を印加する場合、従来の配線部と比較して断面積を小さくすることが可能であり、配線部L1,L2に要する基板1上のスペースを低減でき、配線部L1,L2の形状の自由度が増すことで有機ELパネルの商品性を向上させることが可能となる。   In the organic EL panel A and the manufacturing method thereof, frame-shaped partition walls W1 and W2 are formed on the organic EL element forming surface side of the substrate 1, and a part of the second electrode 4 is isolated from the second electrode 4. Thus, the connection portions Lc1 and Lc2 are formed, and by using the connection portions Lc1 and Lc2 as at least a part of the wiring portions L1 and L2, at least a part of the wiring portions L1 and L2 is made of the first metal material. Since the connection portions Lc1 and Lc2 are made of the second metal material having a low resistivity, the wiring resistance values of the wiring portions L1 and L2 can be reduced, and a voltage drop phenomenon occurs in the wiring portions L1 and L2. Can be prevented from occurring. Further, since the connection portions La1 and La2 can be formed simultaneously with the formation of the second electrode 4, the manufacturing process of the organic EL panel A is not complicated. In addition, since the wiring portions L1 and L2 have a lower resistivity than the conventional wiring portion made of the first metal material, when applying a constant current with the same voltage, the wiring portions L1 and L2 are compared with the conventional wiring portion. The cross-sectional area can be reduced, the space on the substrate 1 required for the wiring portions L1 and L2 can be reduced, and the degree of freedom of the shape of the wiring portions L1 and L2 is increased, thereby improving the commerciality of the organic EL panel. It becomes possible to make it.

また、従来の配線部は、第二電極4と絶縁層5を介して対向し、コンデンサ成分が生じて静電容量を有することとなるものである。しかしながら、有機ELパネルAにおいては、配線部L1,L2は、接続部Lc1,Lc2においては、第二電極4と対向しないため、コンデンサ成分(静電容量)が生じることがない。すなわち、配線部L1,L2の静電容量を低減することができる。有機EL素子の発光に関しては、任意の発光部Snの静電容量CSnと発光部Snに対応する配線部Lnの静電容量CLnとの比(CLn/CSn)の値が大きい程発光立上時間は長くなり、CLn/CSnの値が小さい程発光立上時間は短くなる。そのため、任意の配線部Lnの静電容量CLnを低減させることが可能な有機ELパネルAは、任意の発光部Snの発光立上時間を短くすることが可能となる。なお、任意の発光部Snの静電容量CSnと発光部Snに繋がる配線部Lnの静電容量CLnとの比(CLn/CSn)は、0.5以下となることが望ましい。また、発光部が複数設けられる場合は、各発光部の静電容量と発光部と繋がる配線部の静電容量との各比が略一定となるように配線部を形成することが望ましい。   Further, the conventional wiring portion is opposed to the second electrode 4 with the insulating layer 5 interposed therebetween, and a capacitor component is generated to have a capacitance. However, in the organic EL panel A, the wiring portions L1 and L2 do not face the second electrode 4 in the connection portions Lc1 and Lc2, and therefore no capacitor component (capacitance) is generated. That is, the capacitance of the wiring portions L1 and L2 can be reduced. Regarding the light emission of the organic EL element, the light emission rise time increases as the value of the ratio (CLn / CSn) of the capacitance CSn of any light emitting portion Sn and the capacitance CLn of the wiring portion Ln corresponding to the light emitting portion Sn increases. Becomes longer, and the smaller the value of CLn / CSn, the shorter the light emission rise time. Therefore, the organic EL panel A capable of reducing the capacitance CLn of the arbitrary wiring portion Ln can shorten the light emission rise time of the arbitrary light emitting portion Sn. Note that the ratio (CLn / CSn) between the electrostatic capacitance CSn of any light emitting portion Sn and the electrostatic capacitance CLn of the wiring portion Ln connected to the light emitting portion Sn is desirably 0.5 or less. In addition, when a plurality of light emitting units are provided, it is desirable to form the wiring units so that the ratio between the capacitance of each light emitting unit and the capacitance of the wiring unit connected to the light emitting unit is substantially constant.

なお、本発明の実施の形態においては、接続部Lc1,Lc2は、一端が陽極端子部La1,La2と重なり合い、他端が電源端子部Lb1,Lb2と重なり合うものであったが、本発明においては、基板上に第一電極と接続されるとともに前記第一電極と同材料からなる配線部を形成し、この配線部上に隔壁部によって第二電極と隔離された前記第二電極の一部からなる接続部を積層形成するものであってもよい。   In the embodiment of the present invention, the connection portions Lc1 and Lc2 have one end overlapped with the anode terminal portions La1 and La2 and the other end overlapped with the power supply terminal portions Lb1 and Lb2. A wiring portion made of the same material as that of the first electrode and connected to the first electrode is formed on the substrate, and a part of the second electrode separated from the second electrode by a partition portion on the wiring portion. The connecting portion may be formed by stacking.

また、本発明の実施の形態においては、陽極端子部La1,La2及び電源端子部Lb1,Lb2は前記第一の金属材料からなるものであったが、本発明においては、陽極端子部(電極端子部)及び/あるいは電源端子部を抵抗率の低い前記第二の金属材料にて形成するものであってもよい。   In the embodiment of the present invention, the anode terminal portions La1 and La2 and the power supply terminal portions Lb1 and Lb2 are made of the first metal material. However, in the present invention, the anode terminal portion (electrode terminal) Part) and / or the power supply terminal part may be formed of the second metal material having a low resistivity.

本発明の実施形態である有機ELパネルのを説明する平面図。The top view explaining the organic electroluminescent panel which is embodiment of this invention. 同上の有機ELパネルを説明する要部断面図。The principal part sectional view explaining an organic EL panel same as the above. 同上の有機ELパネルの製造方法を説明する要部断面図。Cross-sectional view of relevant parts for explaining the method for producing the organic EL panel of the above. 同上の有機ELパネルの製造方法を説明する要部断面図。Cross-sectional view of relevant parts for explaining the method for producing the organic EL panel of the above. 従来の有機ELパネルの構造を説明する要部断面図。Sectional drawing which shows the principal part explaining the structure of the conventional organic EL panel.

符号の説明Explanation of symbols

1 基板
2 第一電極
3 有機層
4 第二電極
5 絶縁層
D1,D2 表示部
S1,S2 発光部
L1,L2 配線部
La1,La2 陽極端子部(電極端子部)
Lb1,Lb2 電源端子部
Lc1,Lc2 接続部
W1,W2 隔壁部
DESCRIPTION OF SYMBOLS 1 Board | substrate 2 1st electrode 3 Organic layer 4 2nd electrode 5 Insulating layer D1, D2 Display part S1, S2 Light emission part L1, L2 Wiring part La1, La2 Anode terminal part (electrode terminal part)
Lb1, Lb2 Power supply terminal part Lc1, Lc2 Connection part W1, W2 Bulkhead part

Claims (6)

透光性の基板上に形成される第一電極と、この第一電極上に形成される少なくとも発光層を有する有機層と、この有機層上に形成され前記第一電極と対向する第二電極と、を積層形成してなる有機EL素子と、
前記基板の前記有機EL素子形成面側に形成される枠状の隔壁部と、
前記第一電極と接続され、前記隔壁部によって前記第二電極と隔離される前記第二電極の一部からなる接続部と、
を備えてなることを特徴とする有機ELパネル。
A first electrode formed on a light-transmitting substrate; an organic layer having at least a light-emitting layer formed on the first electrode; and a second electrode formed on the organic layer and facing the first electrode An organic EL element formed by stacking and
A frame-shaped partition wall formed on the organic EL element forming surface side of the substrate;
A connecting portion comprising a part of the second electrode connected to the first electrode and separated from the second electrode by the partition;
An organic EL panel comprising:
前記第二電極及び前記接続部は、前記第一電極よりも抵抗率の低い金属材料からなることを特徴とする請求項1に記載の有機ELパネル。 The organic EL panel according to claim 1, wherein the second electrode and the connection portion are made of a metal material having a lower resistivity than the first electrode. 前記接続部を前記第一電極に接続するための電極端子部及び/あるいは前記接続部と接続され前記基板上の端部に形成される電源端子部を備えてなることを特徴とする請求項1または請求項2に記載の有機ELパネル。 2. An electrode terminal portion for connecting the connection portion to the first electrode and / or a power supply terminal portion connected to the connection portion and formed at an end portion on the substrate. Or the organic electroluminescent panel of Claim 2. 透光性の基板上に第一電極を形成する工程と、
前記基板の前記第一電極形成面側に枠状の隔壁部を形成する工程と、
前記第一電極上に少なくとも発光層を有する有機層を形成する工程と、
前記有機層及び前記隔壁部上に第二電極を形成するとともに、前記隔壁部によって前記第二電極の一部を前記第二電極と隔離して前記第一電極と接続される接続部を形成する工程と、を少なくとも含むことを特徴とする有機ELパネルの製造方法。
Forming a first electrode on a translucent substrate;
Forming a frame-shaped partition wall on the first electrode forming surface side of the substrate;
Forming an organic layer having at least a light emitting layer on the first electrode;
A second electrode is formed on the organic layer and the partition wall, and a part of the second electrode is isolated from the second electrode by the partition wall to form a connection portion connected to the first electrode. A process for producing an organic EL panel, comprising at least a step.
前記第二電極及び前記接続部は、前記第一電極よりも抵抗率の低い金属材料からなることを特徴する請求項4に記載の有機ELパネルの製造方法。 5. The method of manufacturing an organic EL panel according to claim 4, wherein the second electrode and the connection portion are made of a metal material having a resistivity lower than that of the first electrode. 前記基板上に前記接続部を前記第一電極に接続する電極端子部を形成する工程及び/あるいは前記基板上の端部に前記接続部と接続される電源端子部を形成する工程を含むことを特徴とする請求項4または請求項5に記載の有機ELパネルの製造方法。 Forming a terminal portion for connecting the connecting portion to the first electrode on the substrate and / or forming a power terminal portion connected to the connecting portion at an end portion on the substrate. 6. The method for producing an organic EL panel according to claim 4 or 5, wherein the organic EL panel is produced.
JP2004053464A 2004-02-27 2004-02-27 Organic el panel and its manufacturing method Pending JP2005243497A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170143066A (en) * 2016-06-17 2017-12-29 삼성디스플레이 주식회사 Display panel, and electronic apparatus including the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170143066A (en) * 2016-06-17 2017-12-29 삼성디스플레이 주식회사 Display panel, and electronic apparatus including the same
KR102592955B1 (en) 2016-06-17 2023-10-24 삼성디스플레이 주식회사 Display panel, and electronic apparatus including the same

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