JP2005238676A - Resin feeder - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a resin feeder which forms a protective resin for coating a part of a display cell or an IC chip and can effectively control the occurrence of bubbles in the protective resin. <P>SOLUTION: The resin feeder has a resin holding part 10 which holds the protective resin, a needle 19 which discharges the protective resin from the resin holding part 10 through a nozzle 18, and an ejection opening 10a which surrounds the needle 19 and ejects gas from the periphery of the tip of the needle 19. The feeder is composed of a chamber 1 having a heater 20 for heating the inside and a gas supply means 4 for supplying the gas to the chamber 1. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  In the present invention, a display cell such as a liquid crystal display device, a plasma display device, an EL display device, and the like and a circuit substrate on which a display driving circuit for driving the display cell is formed are juxtaposed, and both are connected by a wire. In addition, the present invention relates to a resin supply device for supplying a protective resin to the wire or the like.

  Conventionally, a driving IC chip that controls display of a display device, for example, a liquid crystal display cell, is provided with wiring on a glass substrate of the liquid crystal display cell, for example, and is mounted in the vicinity of or on the wiring. The driving IC chip and the wiring are electrically connected through an anisotropic conductive film. They were also electrically connected by wires.

  As another connection structure, a driving IC chip is mounted on a circuit board separate from the liquid crystal display cell, and a pad of the driving IC chip and a pad terminal formed on the glass substrate of the liquid crystal display cell are made of wire such as gold. Was electrically connected by.

  Furthermore, as another connection structure, a TAB (Tape Auto Bonding) terminal in which a driving IC chip is mounted on a polyimide film and a pad terminal of a glass substrate of a liquid crystal display cell are connected by an anisotropic conductive film. .

  Regardless of the connection structure, electrical connection means such as wires, anisotropic conductive films, wiring and pad terminals on glass substrates that contribute to this connection, and specific positions on the driving IC chip are protected. Resin was applied and then the resin was cured.

  FIG. 4 shows a cross-sectional structure of a liquid crystal display device having, for example, a liquid crystal display cell and a circuit board. The liquid crystal display device includes a liquid crystal display cell 30, a circuit board 31, and a support plate 35 that mechanically couples both. Thereby, the liquid crystal display cell 30 and the circuit board 31 are arranged side by side.

  A plurality of pad terminals 36 are formed on a part of the glass substrate of the liquid crystal display cell 30, and a driving IC chip 32 is mounted on the circuit substrate 31. The driving IC chip 32 and the surface wiring layer formed on the surface of the circuit board 31 are connected by an input side wire 33, and the driving IC chip 32 and the pad terminal 36 of the liquid crystal display cell 30 are output side. They are connected by wires 34.

  A part of the liquid crystal display cell 30, that is, a region where the pad terminal 36 is formed and a surface region of the circuit board 31 are, for example, a protective resin so as to cover the wires 33 and 34 and the driving IC chip 32. 38 is coated.

An apparatus for supplying such a protective resin is disclosed in JP-A-9-289220.
JP-A-9-289220

  When supplying and applying protective resin to the resin application area including electrical connection means such as this wire, the gas fluid pressure and application weight during application of the protective resin can be controlled with predetermined values, but control of resin viscosity, etc. Have difficulty. As a result, bubbles or voids are formed in the applied protective resin, particularly in the protective resin supplied to the lower regions of the wires 33 and 34, and the bubbles are formed in the protective resin while the protective resin is cured. It rises to the surface. And when it hardens | cures with the shape maintained, the wires 33 and 34 may be exposed outside and a wiring part may be exposed.

  In addition, the wires 33 and 34 are corroded by voids formed in the protective resin and humidity in the air, causing problems such as disconnection and short circuit.

  In addition, the wires 33 and 34 may not be exposed depending on the degree of bubbles or voids, but even in that case, if a little external force is applied to the corresponding part, the wires 33 and 34 fall down, and only the wires contact each other. A short circuit will occur.

  Further, there is a problem that the pad terminal 36 and the wire 34 are disconnected and disconnected.

  Therefore, in any case, it is necessary to reduce the supply amount and the scanning speed of the needle, and to repeatedly apply and cure the protective resin a plurality of times so that bubbles and voids do not occur.

  Regarding air bubbles and voids generated at the time of application, for example, in Japanese Patent Laid-Open No. 9-289220, a resin-coated part is put into a vacuum deaerator, and the air bubbles after application by heating with a heater and vacuuming with a vacuum pump are applied. Means have been proposed to eliminate voids.

  However, there is a problem that a vacuum defoamer is required separately from the resin supply device, and the equipment cost is increased, and the production tact is increased and the production efficiency is decreased due to the insertion and removal of parts into and from the vacuum defoamer.

  The present invention has been devised in view of the above-described problems, and an object thereof is to provide a resin supply device in which bubbles and voids are not easily generated in the applied resin without lowering the application efficiency of the resin application. There is to do.

The present invention provides a display cell, a driving IC chip for supplying a display signal to the display cell, and electrically connecting the display cell and the driving IC chip, and the display cell and the driving IC chip. A resin supply device for use in a display device comprising a connecting means and a protective resin covering a driving IC chip,
A resin holding portion that holds the protective resin, a needle that discharges the protective resin from the resin holding portion through a nozzle, a jet port that surrounds the needle and jets gas from the periphery of the needle tip, and heats the inside And a gas supply means for supplying a gas fluid to the chamber.

  Further, the gas supply means includes a regulator for precisely adjusting the pressure of the gas fluid supplied into the chamber.

  Further, a plurality of fins for controlling the flow of the gas fluid are provided on the inner wall of the chamber.

Further, the heater is attached to the outer wall of the chamber and includes a control device for controlling the temperature.

  Further, the gas fluid supplied to the chamber is ejected from the ejection port independently of the application timing of the protective resin.

  According to such a resin supply device of the present invention, in particular, the scanning (movement) control of the needle, the discharge start and discharge end control of the protective resin discharged from the needle, and the heat discharged from the chamber outlet are heated. The control of the start and end of gas ejection can be controlled separately.

  Accordingly, the protective resin can be supplied and applied to the predetermined application region while discharging the protective resin from the needle while moving the needle and simultaneously ejecting the heated gas from the outlet of the chamber.

  Moreover, the application area | region can be heated previously and protective resin can be supplied to the heated area | region. For example, while a needle that moves integrally with the chamber is scanned over a region to be coated, a heated gas is ejected from the ejection port of the chamber to heat the coating region, and then the needle is applied to the heated coating region. Scan and discharge protective resin.

  Further, while scanning the needle that moves integrally with the chamber against the already applied protective resin, the heated gas is ejected from the outlet of the chamber, and the already applied protective resin is heated to soften the protective resin. It can be activated to release bubbles.

  According to the resin supply device of the present invention, the chamber is arranged so as to surround the needle that the resin discharges. The chamber is supplied with a gas fluid whose pressure is adjusted, and has a spout for ejecting a heated gas. For this reason, when applying and supplying the protective resin while discharging the protective resin so as to cover the protective resin on the connecting means portion of the display device or the like, for example, the wire, even if the bitch between adjacent wires has a narrow pitch, the needle The protective resin discharged from the gas is heated from the outlet of the chamber, and the gas is forcibly softened by the gas, and the lower part of the wire loop between narrow pitches, for example, display cells and circuits It is possible to stably wrap around the protective resin up to a complicated structure such as a distance between the substrate and the like. In particular, it is possible to eject heated gas while discharging and applying and supplying the protective resin, and it is possible to eject heated gas to the applied protective resin, so that it is taken into the protective resin. Air bubbles and voids can be easily released to the outside.

  Further, since the chamber itself is formed so as to surround the needle, the protective resin itself discharged from the needle can be heated, so that the viscosity of the discharged protective resin itself can be kept low, so that it easily flows in the application region. Thus, the protective resin can be stably supplied to the complicated structure portion, and at the same time, the gas taken into the protective resin can be easily released to the outside.

  As a result, while preventing the exposure of wiring such as wires and pad terminals as connection means, it is possible to prevent problems such as disconnection and short circuit due to corrosion of the wire and wiring, and there is no gap in the resin, and the wire due to external force It is also possible to prevent short circuiting and disconnection of the pad terminal.

  In the present invention, the control of the discharge of the protective resin discharged from the needle, the scanning control of the needle, and the ejection of the heated gas from the chamber are controlled separately, for example, while scanning to a predetermined position for protection. In addition to discharging the resin and simultaneously spraying the heated gas to the applied resin, a preheated gas is jetted to the coating area of the protective resin, and then the protective resin is applied to the heated coating area -It can be supplied, or a heated gas can be ejected to the applied protective resin to soften and flow the protective resin itself, and the gas taken inside can be released to the outside.

  Hereinafter, the resin supply apparatus of this invention is explained in full detail based on drawing.

  FIG. 1 is a schematic view showing a schematic configuration of a resin supply apparatus of the present invention and a partial cross section of a chamber, and FIG. 2 is a cross sectional view of the chamber.

  The resin supply device of the present invention mainly holds a protective resin, for example, a resin holding portion that is a mixing block 10, a needle 19 that discharges the protective resin from the mixing block 10 that is the resin holding portion via a nozzle 18, A chamber 1 that surrounds the needle 19 and has a spout 1 a that ejects gas from the periphery of the tip of the needle 19, a heater 20 that is disposed in the chamber 1 and heats the inside of the chamber 1, and supplies a gas fluid to the chamber 1 It comprises a gas fluid pipe 4 and a regulator 2 which are gas supply means.

  The chamber 1 is formed in a shape that covers the needle 19 that constitutes the tip of the nozzle 4, and is attached so as to surround the needle 19. The chamber 1 is connected to a gas fluid pipe 4 which is a gas supply means, and a predetermined gas fluid is supplied thereto. Further, at the lower end of the chamber 1, for example, around the tip of the needle 19, an ejection port 1 a is formed through which this gas is heated and ejected.

  The gas fluid piping 4 is provided with a precision regulator 2 for adjusting the pressure of the gas fluid in the middle thereof, and an air compressor, a cylinder of a predetermined gas, and a tank are connected to the other end of the gas fluid piping 4.

  The chamber 1 is provided with a heater 20. In FIG. 1, the heater 20 is provided so as to surround the periphery of the chamber 1. And while heating the gas supplied as the gas fluid inside the chamber 1, the needle 19 is heated to a fixed temperature.

  The heater 20 is maintained at a preset temperature in the chamber 1 by a temperature control device.

  In addition, as shown in FIG. 2, the inside of the chamber 1 is attached with four thin plate-like fins 3 twisted about 45 ° to the left, for example, on its inner wall. When the gas fluid supplied through the gas fluid pipe 4 is ejected as a heated gas by the fins 3, the ejection direction is stabilized and corresponds to the discharge direction of the protective resin. In addition, the temperature distribution of the gas is made uniform by heating.

  The resin holding part that holds the protective resin is, for example, the mixing block 10. The protective resin to be discharged is, for example, a mixture of two liquid resins, and the A agent material and the B agent material are uniformly mixed in the mixing block 10. Specifically, the mixing block 10 includes an A agent discharge valve 12, a B agent discharge valve 13, a tank in which each of the A agent material and the B agent material is accommodated, and a metering pump for each resin material in the tank. And the piping parts 14 and 15 which send out to the mixing block 10 and the piping parts 16 and 17 which circulate from the mixing block 10 to the tank.

At the time of circulation, two types of materials, agent A material and agent B material, are sent from the tank to the discharge valves 12 and 13 via the metering pump. Circulate.

  The application and supply of the mixed protective resin is performed when the resin discharge instruction is issued from the control device 21 and the motor 11 on the upper side of the mixing block 10 starts to rotate. According to the pressure, the protective resin mixed from the needle 19 at the tip of the nozzle 18 is discharged while feeding and mixing each resin into the mixing block 10.

  Such a protective resin supply device is used, for example, in the process of forming the protective resin of the display device shown in FIG.

  FIG. 4 shows a liquid crystal display device having a liquid crystal display cell 30 and a circuit board 31. That is, the circuit board 31 and the liquid crystal display cell 30 are affixed to the support plate 35, and the input side electrode pad of the driving driver IC chip 32 mounted on the circuit board 31 and the pad of the circuit board 31 are connected. And an output wire 34 connecting the output side electrode pad of the driver IC chip 32 for driving and the pad of the liquid crystal display cell 30.

  Here, the pitch of the output side wires 34 is as narrow as 70 to 100 μm in order to correspond to the number of display electrodes of the liquid crystal display cell 30. Therefore, in particular, it is very difficult to stably supply the protective resin to the lower region of the loop of the output wire 34.

  Although not shown, the resin supply unit includes a transport unit that moves the liquid crystal display device to a predetermined position. Further, at least the needle 19 and the chamber 1 are scanned and moved to a predetermined position of the liquid crystal display device. It has a robot part. That is, the needle 19 and the gas ejection port 1a of the chamber 1 are controlled by the three-axis robot unit in the XYZ directions so that the needle 19 and the gas ejection port 1a of the chamber 1 can move to predetermined positions.

  The overall operation of the resin supply device is controlled by the control device 21. The XYZ three-axis robot unit is controlled by a scanning position instruction from the control device 21. For example, it is controlled according to a preset position coordinate program, and is set to have a trajectory that covers, for example, the coating region at the end of the liquid crystal display cell, the driving IC chip, the input / output side wires, and the like. .

  The resin discharge is controlled so that the resin is discharged at position coordinates set in advance corresponding to the scanning position. Specifically, the rotation control of the motor 11 and the ON / OFF operation of the discharge valves 12 and 13 are controlled.

  Further, the supply of the gas fluid supplied to the chamber 1, that is, the ejection of the heated gas, is controlled so that the gas fluid is ejected at a position coordinate set in advance corresponding to the scanning position. Specifically, it is performed by controlling the precision regulator 2 disposed in the middle of the gas fluid pipe 4 at a predetermined position. The on / off operation of these operations is set in the program. The temperature of the heater 20 is also controlled by the control device 21 at the same time.

Here, the discharge of the protective resin and the ejection of the heated gas are controlled so as to be independently movable by the above-described program.

  Next, the actual operation of the resin supply apparatus of the present invention will be described.

First, although not shown, the liquid crystal display device set in the loader is transported to the coating stage of the resin supply device by the transport unit, and is positioned and held at an accurate coating position.

  For example, as shown in FIG. 3A, the XYZ three-axis robot operates according to the program selected in advance here, the needle 19 is moved to a predetermined position, and scanning / movement is started. When the needle 19 reaches a predetermined position, discharge of the protective resin is started from the needle 19 (resin discharge start), and the protective resin is discharged according to the program pattern.

  When the tip of the needle 19 is scanned to the output wire 34 of the driving IC chip 32, the gas heated to the chamber 1 is ejected from the ejection port 1a of the chamber 1 as programmed. Specifically, the gas fluid whose pressure is adjusted and supplied to the chamber 1 is heated by the heater 20 and blows out to the tip of the needle 19 along the fin 3 in the chamber 1. Thereby, the viscosity of the protective resin is lowered by the heat of the gas discharged from the needle 19 and heated. At the same time, the protective resin whose viscosity has been lowered is forced to be circulated by the pressure of the heated gas, for example, between the narrow pitch wires 34 and the lower region of the loop.

  When the needle 19 passes the wire 34 of the driving IC chip 32 or reaches between the driving IC chips 32, the supply of the gas amount to the chamber 1 is stopped. Even in this stopped state, the discharge of the protective resin is continued as it is. That is, the supply of the gas amount to the chamber 1 operates intermittently according to the presence of the wire 34 and the presence of the driving IC chip 32 by a preset program.

  Further, as shown in FIG. 3B, the heated gas may be ejected from the ejection port 1a of the chamber 1 prior to the start of discharge of the protective resin. In this case, even if the application region to which the protective resin is applied is preheated and the protective resin discharged from the needle 19 is supplied to the heated application region, the fluidity is not easily lowered, and the complicated structure For example, it becomes easy to reliably fill the gap between the liquid crystal display cell 30 and the circuit board 31.

  Further, the heated gas may be ejected from the ejection port 1a of the chamber 1 to the protective resin already applied before the heat curing. In this case, the applied protective resin can be softened and flowed by the heated gas, and bubbles and gas existing in the protective resin can be surely released to the outside. Then, during the scanning of the needle 19, when the application amount of the applied protective resin reaches a small area, the protective resin is re-discharged.

  In this way, in the time chart of FIG. 3B, if the operation of the control device 21 is controlled manually, the gas heated at a specific position and the protective resin can be discharged arbitrarily.

  As described above, by providing a plurality of fins 3 for controlling the flow of the gas fluid on the inner wall of the chamber 1, the gas fluid is supplied from the gas supply means, and the gas ejected from the chamber outlet 1a is: The flow direction of the fluid is controlled by the fins 3, the ejection direction is stabilized, and the heated temperature distribution can be made uniform.

  Furthermore, since the heater 20 is attached to the outer wall of the chamber 1 and includes a control device that controls the temperature, the temperature of the gas can be easily controlled according to the softening characteristics of the resin material. It is very easy to replace the heater 20.

  Further, the gas fluid supplied to the chamber is ejected from the ejection port independently of the application timing of the protective resin, and it is possible to supply a highly versatile resin and correct the applied resin by controlling it in advance by a program or manual. Easy to do.

  In this embodiment, a two-component mixed urethane resin manufactured by Sanyu Rec Co., Ltd .; SU-3900A (main agent) and SU-3900B (curing agent) are mixed and discharged at a weight ratio of 30: 100 as a protective resin. Although used, other two-component / one-component resins such as epoxy resin, polyamide resin, and silicone resin can also be used.

  Moreover, when using 1 liquid type resin, it can be set as the structure which abbreviate | omitted complicated components, such as the mixing block 10. FIG. In this embodiment, as the gas heated as the gas fluid, nitrogen gas or the like can be used in addition to air. In this case, any gas can be used as long as it is a gas other than a gas that oxidizes the wire or wiring or changes its quality to a protective resin, a highly flammable gas, or a dangerous gas.

  Further, as shown in FIG. 4, the display device has been described as a display device in which a liquid crystal display cell and a circuit board are arranged side by side. However, a structure in which a driving IC chip is mounted on the substrate of the display device, and a flexible substrate is used for driving. The display cell itself can be widely applied to flat display cells such as plasma display cells and EL display cells as well as the structure in which an IC chip is mounted and connected to the display cell and the flexible substrate. In the case of covering the IC chip itself, it may be applied to any region such as a region covering a wiring portion of a display cell, a region covering an electric connection means such as a wire.

It is the schematic of the resin supply apparatus of this invention. It is sectional drawing of the partially broken state explaining the structure in a chamber. (A) (b) is the schematic which shows the operation | movement timing chart of the resin supply apparatus of this invention. 1 shows a cross-sectional view of a typical liquid crystal display device.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Chamber 2 ... Precision regulator 3 ... Fin 4 ... Gas fluid piping 10 ... Mixing block 11 ... Motor 12, 13 ... Discharge valve 14, 15 ... Delivery piping 16, 17 ... · Return pipe 18 · · Nozzle 19 · · Needle 20 · · Heater 21 · · Control device 30 · · Liquid crystal display cell 31 · · Circuit board 32 · · IC chips 33 and 34 for driving · · Wire

Claims (5)

A resin supply device used for a display device comprising a display cell, a driving IC chip that supplies a display signal to the display cell, and a protective resin that covers the driving IC chip,
A resin holding portion that holds the protective resin, a needle that discharges the protective resin from the resin holding portion through a nozzle, a jet port that surrounds the needle and jets gas from the periphery of the needle tip, and heats the inside A resin supply apparatus comprising: a chamber having a heater for heating; and gas supply means for supplying a gas fluid to the chamber.   2. The resin supply apparatus according to claim 1, wherein the gas supply means includes a regulator that precisely adjusts the pressure of the gas fluid supplied into the chamber.   The resin supply apparatus according to claim 1, wherein a plurality of fins for controlling a flow of a gas fluid are provided on an inner wall of the chamber.   The resin supply apparatus according to claim 1, wherein the heater is attached to an outer wall of the chamber and includes a control device for temperature control.   2. The resin supply apparatus according to claim 1, wherein the gas fluid supplied to the chamber is ejected from the ejection port independently of a timing at which the protective resin is ejected.

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