JP2005236754A - Image sensor module - Google Patents

Image sensor module Download PDF

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Publication number
JP2005236754A
JP2005236754A JP2004044458A JP2004044458A JP2005236754A JP 2005236754 A JP2005236754 A JP 2005236754A JP 2004044458 A JP2004044458 A JP 2004044458A JP 2004044458 A JP2004044458 A JP 2004044458A JP 2005236754 A JP2005236754 A JP 2005236754A
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Japan
Prior art keywords
image sensor
frame
wiring board
sensor module
lens holder
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Pending
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JP2004044458A
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Japanese (ja)
Inventor
Daisuke Miura
大輔 三浦
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Toko Inc
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Toko Inc
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Priority to JP2004044458A priority Critical patent/JP2005236754A/en
Publication of JP2005236754A publication Critical patent/JP2005236754A/en
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Abstract

<P>PROBLEM TO BE SOLVED: To obtain an image sensor module with high workability, wherein no inclination between a lens holder and an image sensor is caused by the unevenness of an adhesive. <P>SOLUTION: In this image sensor module wherein a frame of the lens holder with a lens attached to a hollow frame is mounted on a circuit board having an image pickup element, a groove is provided in a portion of an adhesion surface on a circuit board of the frame, and an adhesive filled in the groove fixes the frame onto the circuit board. Otherwise, a taper part is provided to at least a portion outside the adhesion surface on the circuit board of the frame, and an adhesive filled in the taper part fixes the frame onto the circuit board. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明は、イメージセンサモジュールの構造に係るもので、特にレンズホルダとプリント配線基板との接合構造に関するものである。   The present invention relates to a structure of an image sensor module, and particularly to a joint structure between a lens holder and a printed wiring board.

携帯電話等の用途に小型のカメラモジュールとしてのイメージセンサモジュールが利用される。これは画像をレンズを介してＣＣＤ等の撮像素子に結像させて電機信号に変換して取り出すものである。レンズを支持するレンズホルダをＣＣＤ等の撮像素子を搭載したプリント配線基板に取り付ける構造が採られている。図３はその構造を示す斜視図で、レンズが取り付けられたレンズホルダ31をＣＣＤなどのイメージセンサ33を取り付けたプリント配線基板35に接着するもので、接着面に一様に接着剤を塗布し、レンズホルダとプリント配線基板を接着している。このような接着構造では、以下のような問題が生じている。
（１）レンズホルダとプリント配線基板で接着剤のムラによる傾きが生じ易く撮像の品質が劣化する。
（２）接着剤を塗布してからレンズホルダとプリント配線基板を接着するので作業性が悪くなる。
（３）接合時に接着剤のはみ出しが生じる。
特開２００３−２９１１３号公報 特開２００３−６０１７７号公報 特開２００３−１３１１１２号公報 An image sensor module as a small camera module is used for a cellular phone or the like. In this method, an image is formed on an image pickup device such as a CCD through a lens, converted into an electric signal, and taken out. A structure is adopted in which a lens holder that supports a lens is attached to a printed wiring board on which an image pickup device such as a CCD is mounted. FIG. 3 is a perspective view showing the structure, in which a lens holder 31 to which a lens is attached is bonded to a printed wiring board 35 to which an image sensor 33 such as a CCD is attached. An adhesive is uniformly applied to the adhesive surface. The lens holder and the printed wiring board are bonded. Such an adhesive structure has the following problems.
(1) Inclination due to unevenness of the adhesive tends to occur between the lens holder and the printed wiring board, and the quality of imaging deteriorates.
(2) Since the lens holder and the printed wiring board are bonded after the adhesive is applied, workability deteriorates.
(3) The adhesive protrudes during bonding.
JP 2003-29113 A JP 2003-60177 A JP 2003-131112 A

本発明は、接合面への接着剤の塗布による上記の問題を解決して、レンズとイメージセンサとの傾きの発生を防ぎ、接着剤のはみ出しを防止するとともに、作業性の改善が可能なイメージセンサモジュールの構造を提供するものである。   The present invention solves the above-mentioned problems caused by the application of the adhesive to the joint surface, prevents the inclination of the lens and the image sensor, prevents the adhesive from protruding, and improves the workability. A structure of a sensor module is provided.

本発明は、接合面に溝あるいはテーパを形成することによって、上記の課題を解決するものである。すなわち、中空の枠体にレンズを取り付けたレンズホルダの枠体を撮像素子を具えた配線基板に搭載したイメージセンサモジュールにおいて、枠体の配線基板との接着面の一部に溝を具え、その溝に充填された接着剤によって枠体が配線基板に固定されたことに特徴を有するものである。   The present invention solves the above problem by forming a groove or a taper on the joint surface. That is, in an image sensor module in which a frame of a lens holder in which a lens is attached to a hollow frame is mounted on a wiring board having an imaging element, a groove is provided on a part of an adhesion surface of the frame to the wiring board. The frame body is fixed to the wiring board by an adhesive filled in the groove.

本発明による効果は以下のとおりである。
（１）接着剤のムラによるレンズホルダとイメージセンサとの間の傾きが生じない。
（２）レンズホルダとプリント配線基板を接合してから接着するので作業性がよくなる。
（３）接合時の接着剤のはみ出しがない。 The effects of the present invention are as follows.
(1) There is no tilt between the lens holder and the image sensor due to unevenness of the adhesive.
(2) Since the lens holder and the printed wiring board are bonded and then bonded, workability is improved.
(3) There is no protrusion of the adhesive during bonding.

本発明を適用するイメージセンサモジュールの接合部の形状と組立方法は以下のとおりである。レンズホルダの４角にプリント配線基板側に突出する位置合わせ用の突起を設けてプリント配線基板に形成した孔に挿入して位置合わせを行う。その４角以外の位置に溝を形成しておき、４角には接着剤を塗布せずに、レンズホルダとプリント配線基板を圧接させた状態でその溝に接着剤を注入する。この溝は２カ所以上設けることが望ましい。溝に代えて、レンズホルダの底部に内側に向かってテーパを形成してその部分に接着剤を注入してもよい。   The shape and assembly method of the joint portion of the image sensor module to which the present invention is applied are as follows. Positioning is performed by providing alignment projections that protrude toward the printed wiring board at the four corners of the lens holder and inserting the projections into holes formed in the printed wiring board. Grooves are formed at positions other than the four corners, and the adhesive is injected into the grooves in a state where the lens holder and the printed wiring board are pressed against each other without applying the adhesive at the four corners. It is desirable to provide two or more grooves. Instead of the groove, a taper may be formed inward at the bottom of the lens holder, and an adhesive may be injected into that portion.

以下、図面を参照して、本発明の実施例について説明する。図１は、本発明の実施例を示す正面図である。レンズホルダ11をプリント配線基板15と接合するものであるが、レンズホルダ11の底面の４角に形成された突起12がプリント配線基板15の孔に挿入されて貫通している。これによってレンズホルダとプリント配線基板の相対位置が決定され、レンズの中心とＣＣＤなどのイメージセンサの中心との位置合わせが行われる。   Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a front view showing an embodiment of the present invention. The lens holder 11 is joined to the printed wiring board 15, and projections 12 formed at the four corners of the bottom surface of the lens holder 11 are inserted into the holes of the printed wiring board 15 and penetrated. As a result, the relative position between the lens holder and the printed wiring board is determined, and the center of the lens is aligned with the center of an image sensor such as a CCD.

レンズホルダ11の底部には溝14が形成される。この溝14はレンズホルダの４角の中間位置に計4カ所以上形成するのが望ましい。この例では1面に2カ所形成している。もちろん各辺に2カ所以上設けたり、対向する辺だけに2カ所ずつ設けたりすることもできる。この溝14に接着剤を注入してレンズホルダ11とプリント配線基板15とを接合固定する。ここで、４角の突起12の部分には接着剤は塗布しない。また、突起12をプリント配線基板の孔に挿入した状態を維持して接着剤の注入を行う。   A groove 14 is formed at the bottom of the lens holder 11. It is desirable to form a total of four or more grooves 14 at the four corners of the lens holder. In this example, two places are formed on one side. Of course, two or more places can be provided on each side, or two places can be provided only on opposite sides. The lens holder 11 and the printed wiring board 15 are bonded and fixed by injecting an adhesive into the groove 14. Here, no adhesive is applied to the quadrangular protrusions 12. Further, the adhesive is injected while maintaining the state where the protrusion 12 is inserted into the hole of the printed wiring board.

接着面積を広げて接着強度を高めるためには、溝に代えてレンズホルダの底部に外側から内側にテーパを形成するとよい。図２はそのテーパを形成した構造を示すもので、レンズホルダ21に底部の側面にテーパ部26が形成されている。この、テーパ部に接着剤を注入すればほぼ全周にわたって接着することができる。   In order to increase the adhesion area by increasing the adhesion area, it is preferable to form a taper from the outside to the inside at the bottom of the lens holder instead of the groove. FIG. 2 shows the structure in which the taper is formed. The lens holder 21 is formed with a taper portion 26 on the side surface of the bottom portion. If an adhesive is injected into the taper portion, it can be bonded over substantially the entire circumference.

本発明によれば、小型化の要求の高い携帯機器等に適したイメージセンサモジュールが得られ、部品点数も少なく、組立も容易で低コストの要求を満たす装置が得られる。   According to the present invention, it is possible to obtain an image sensor module suitable for a portable device or the like that is highly demanded for miniaturization, and to obtain a device that has a small number of parts, is easy to assemble, and satisfies low-cost requirements.

本発明の実施例を示す正面図Front view showing an embodiment of the present invention 本発明の他の実施例を示す正面断面図Front sectional view showing another embodiment of the present invention 従来のイメ０ジセンサモジュールを示す分解斜視図An exploded perspective view showing a conventional image sensor module

符号の説明Explanation of symbols

11、31：レンズホルダ
12：突起
33：イメージセンサ
14：溝
15、35：プリント配線基板
26：テーパ部 11, 31: Lens holder
12: Protrusion
33: Image sensor
14: Groove
15, 35: Printed circuit board
26: Taper

Claims (3)

中空の枠体にレンズを取り付けたレンズホルダの枠体を撮像素子を具えた配線基板に搭載したイメージセンサモジュールにおいて、
上記枠体の配線基板との接着面の一部に溝を具え、その溝に充填された接着剤によって枠体が配線基板に固定されたことを特徴とするイメージセンサモジュール。 In an image sensor module in which a frame of a lens holder in which a lens is attached to a hollow frame is mounted on a wiring board having an image sensor,
An image sensor module comprising a groove in a part of an adhesion surface of the frame body to the wiring board, and the frame body fixed to the wiring board by an adhesive filled in the groove. 前記溝が枠体に複数形成された請求項１記載のイメージセンサモジュール。   The image sensor module according to claim 1, wherein a plurality of the grooves are formed in the frame. 中空の枠体にレンズを取り付けたレンズホルダの枠体を撮像素子を具えた配線基板に搭載したイメージセンサモジュールにおいて、
上記枠体の配線基板との接着面の外側の少なくとも一部にテーパ部を具え、そのテーパ部に塗布された接着剤によって枠体が配線基板に固定されたことを特徴とするイメージセンサモジュール。 In an image sensor module in which a frame of a lens holder in which a lens is attached to a hollow frame is mounted on a wiring board having an image sensor,
An image sensor module comprising a taper portion at least at a part of an outer surface of the frame body that is bonded to the wiring board, and the frame body fixed to the wiring board by an adhesive applied to the taper portion.
JP2004044458A 2004-02-20 2004-02-20 Image sensor module Pending JP2005236754A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004044458A JP2005236754A (en) 2004-02-20 2004-02-20 Image sensor module

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JP2004044458A JP2005236754A (en) 2004-02-20 2004-02-20 Image sensor module

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7626774B2 (en) 2007-03-28 2009-12-01 Sharp Kabushiki Kaisha Solid-state imaging device and electronic device including same
CN109643004A (en) * 2016-08-29 2019-04-16 京瓷株式会社 Camera model, photographic device and moving body

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7626774B2 (en) 2007-03-28 2009-12-01 Sharp Kabushiki Kaisha Solid-state imaging device and electronic device including same
CN109643004A (en) * 2016-08-29 2019-04-16 京瓷株式会社 Camera model, photographic device and moving body
JPWO2018043172A1 (en) * 2016-08-29 2019-06-24 京セラ株式会社 Camera module, imaging device, and moving body
US20190222729A1 (en) * 2016-08-29 2019-07-18 Kyocera Corporation Camera module, imaging apparatus, and vehicle
US10715710B2 (en) * 2016-08-29 2020-07-14 Kyocera Corporation Camera module, imaging apparatus, and vehicle
CN109643004B (en) * 2016-08-29 2021-07-20 京瓷株式会社 Camera module, imaging device, and moving object

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