JP2005235286A - Method and device for manufacturing information recording medium - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing an information recording medium, capable of preventing the peeling-off of a resin layer during manufacturing, and the remaining of a resin layer to be peeled-off in the vicinity of a loading center hole. <P>SOLUTION: The base material cutting processing for cutting off the center from the disk base material 11 by ultrasonic-vibrating a disk base material 11 while pressing one surface of the disk base material 11 having a light transmission layer 13 formed on one surface, and pushing a cylindrical base material cutter part into the center of the disk substrate 11 from the other surface side of the disk base material 11, and the resin layer cut processing for cutting the light transmission layer 13 by ultrasonic-vibrating a light transmission layer cutter part 32a (ultrasonic horn 32) formed larger in diameter than the base material cutter part, surrounding the center cut off by the base material cutter, and pushing it into the light transmission layer 13 from one surface side, are sequentially executed. Thus, an optical recording medium 10 having a loading central hole 10a formed and constituted so as to be able to reproduce at least information is manufactured. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an information recording medium manufacturing method and an information recording medium manufacturing apparatus for manufacturing an information recording medium such as an optical disk.

A manufacturing method for manufacturing this type of information recording medium (optical disk) is disclosed in Japanese Patent Laid-Open No. 10-40584. In this manufacturing method, first, a disk substrate (base material) having a diameter larger than that of the optical disk and having no mounting center hole is formed by injection molding. Next, a first layer (dielectric layer), a second layer (recording layer), a third layer (dielectric layer), and a fourth layer (reflection layer) are formed in this order on the surface of the disk substrate. Next, the outer edge portion and the center portion of the disk substrate are punched out along the outer circumferential groove and the inner circumferential groove formed in the disk substrate. As a result, a disk having the same diameter as the optical disk is formed, and a mounting center hole is formed at the center thereof. Subsequently, an overcoat layer is formed on the surface of the disk in this state. Thereby, the fourth layer is sealed by the overcoat layer, and the optical disc is completed.
JP 10-40584 A

  However, the conventional manufacturing method has the following problems. That is, in this conventional manufacturing method, the first to fourth layers are sequentially formed on the disk substrate, and then the center portion is punched to form a mounting center hole, and then the fourth layer is covered so as to cover the fourth layer. Is forming. In this case, when manufacturing this type of optical disc, an overcoat layer is formed by spin-coating an electron beam curable resin material and then irradiating the electron beam to cure the resin material. In this case, the resin material dripped onto the disk during spin coating is prevented from entering the mounting center hole and adhering to the rim of the mounting center hole and the back side of the disk and becoming dirty. Therefore, it is necessary to block the mounting center hole with the mask member until the irradiation of the electron beam is completed. For this reason, in the conventional manufacturing method, when the mask member is peeled off after the electron beam irradiation to the resin layer is completed, the resin layer on the disc may be peeled off together with the resin layer on the mask member. Exists.

  On the other hand, prior to forming the mounting center hole in the base material for the information recording medium (disc substrate in the above example: hereinafter also referred to as “base material”) (punching the base material), the resin layer An information recording medium manufacturing method for avoiding peeling of the resin layer during formation of the mounting center hole by cutting the (overcoat layer in the above example) into a circle having a diameter slightly larger than the mounting center hole Has proposed. Specifically, in this method, first, a resin layer is formed on one surface of a substrate. At this time, since the mounting center hole is not formed, a situation in which the resin material adheres to the rim portion of the mounting center hole or the back surface of the base material and gets dirty is avoided. Next, a cylindrical notch forming blade portion whose outer diameter is slightly larger than the mounting center hole is pushed into the resin layer while being ultrasonically vibrated. At this time, a circular cut is formed in the resin layer by pushing the cutting edge of the cutting forming blade portion so as to reach the surface of the substrate (the resin layer is cut into a circle). Next, the punching blade portion is pushed into the base material from the other surface side while ultrasonically vibrating the base material. In this case, when the cutting edge of the punching blade portion reaches the back surface of the resin layer (when the cutting of the base material is completed), by the force applied in the direction of pushing the punching blade portion into the base material, The resin layer peels from the substrate along the cut. Thereby, the mounting center hole is formed without peeling the resin layer from the base material on the outer peripheral side of the cut.

  In this case, in the above manufacturing method proposed by the applicant, the blade portion for cutting is ultrasonically vibrated at the time of forming the cut, so that the resin layer (resin of the portion in contact with the blade for cutting is formed) The resin material forming the layer is melted. In addition, since the resin layer that has been melted at the time of cutting is solidified by the temperature being lowered by the time when the substrate is cut by the punching blade, the resin layer is partially formed at the bottom of the cutting when the substrate is punched. In particular, it may be in close contact with the surface of the substrate (in a broken line). In such a state, there is a possibility that the resin layer to be peeled from the base material inside the notch is left behind in close contact with the base material. For this reason, it is preferable to improve this point.

  The present invention has been made in view of such problems, and information recording that prevents the resin layer from being peeled off during manufacturing and avoids a situation in which the resin layer to be peeled off in the vicinity of the mounting center hole is left behind. A main object is to provide a medium manufacturing method and an information recording medium manufacturing apparatus.

  To achieve the above object, an information recording medium manufacturing method according to the present invention ultrasonically vibrates the information recording medium substrate while pressing the one surface of the information recording medium substrate having a resin layer formed on one surface. In addition, a cylindrical base cutting blade is pushed into the center of the information recording medium substrate from the other side of the information recording medium base to cut the center from the information recording medium base. The base material cutting process, and the cylindrical resin layer cutting blade portion formed larger in diameter than the base material cutting blade portion is ultrasonically vibrated so as to surround the central portion from the one surface side. A mounting center hole having a diameter equal to the outer diameter of the base material cutting blade portion is executed in this order by pressing into the resin layer and cutting the resin layer on the outer peripheral side of the center portion in this order. Is formed at the center and at least information can be reproduced. Manufacturing configuration information recording medium.

  In this case, it is preferable that the substrate cutting blade portion is pushed into the information recording medium substrate while longitudinally vibrating the information recording medium substrate during the substrate cutting process.

  Further, it is preferable that the resin layer cutting blade portion is pushed into the resin layer while torsionally vibrating during the resin layer cutting treatment.

  An information recording medium manufacturing apparatus according to the present invention is configured to be able to manufacture the information recording medium according to the information recording medium manufacturing method described above, and ultrasonically vibrates the information recording medium substrate while pressing the one surface. And a base material cutting device that pushes the base material cutting blade portion into the central portion from the other surface side of the information recording medium base material to cut the central portion from the information recording medium base material, The blade for cutting the resin layer is ultrasonically vibrated so as to surround the center portion, and the blade for cutting the resin layer is pushed into the resin layer from the one surface side so that the resin layer is disposed on the outer peripheral side of the center portion. A resin layer cutting device for cutting, and a base material cutting process for cutting the central portion from the base material for the information recording medium with respect to the base material cutting device; On the outer periphery side And a control unit for executing the resin layer cutting process for cutting the resin layer Te.

  According to the information recording medium manufacturing method and the information recording medium manufacturing apparatus according to the present invention, the base cutting blade is pushed from the other surface side of the information recording medium base to cut the center from the information recording medium base. In this order, the base material cutting process is performed, and the resin layer cutting blade part is pressed into the resin layer from one side of the information recording medium base material to cut the resin layer on the outer peripheral side of the center part. Since the cutting of the information recording medium substrate is completed during the cutting process of the resin layer, the resin material melted by the ultrasonic vibration of the resin layer cutting blade is the surface of the information recording medium substrate. Prior to hardening in a state of being in close contact with the substrate, the center portion of the information recording medium substrate and the cut resin layer can be removed. Therefore, it is possible to avoid a situation in which the resin layer is partially left in the vicinity (mouth edge portion) of the formed mounting center hole. As a result, it is possible to form a mounting center hole with a clean mouth edge portion. . Also, unlike the conventional manufacturing method of forming a resin layer (overcoat layer) after the formation of the mounting center hole, without causing peeling in the portion of the resin layer covering the data recording area, The information recording medium can be manufactured by forming the mounting center hole without staining the edge of the mounting center hole or the back surface of the base material for the information recording medium with the resin material for forming the resin layer.

  Further, according to the information recording medium manufacturing method of the present invention, the substrate for information recording medium is pushed into the substrate for information recording medium by pushing the substrate cutting blade while longitudinally vibrating the substrate for information recording medium during the substrate cutting process. The mounting center hole can be formed without applying stress. Therefore, it can be punched neatly without causing chipping or the like at the rim of the center hole for mounting, and reduces the stress applied to the cutting edge of the cutting blade for cutting the substrate, thereby reducing the wear of the cutting blade for cutting the substrate. Can be reduced.

  Furthermore, according to the information recording medium manufacturing method according to the present invention, the resin layer can be reliably cut by pressing the resin layer cutting blade while torsionally vibrating during the resin layer cutting process. It is possible to avoid a situation in which the resin layer is partially left at the edge of the center hole. In addition, since the resin layer can be easily cut, the stress applied to the information recording medium base material during the resin layer cutting process can be reduced, and the stress applied to the cutting edge of the blade for cutting the resin layer can be reduced. Wear of the cutting blade can be reduced.

  The best mode of an information recording medium manufacturing method and an information recording medium manufacturing apparatus according to the present invention will be described below with reference to the accompanying drawings.

  First, a configuration of an optical recording medium manufacturing apparatus (an example of an information recording medium manufacturing apparatus according to the present invention, hereinafter also referred to as “manufacturing apparatus”) 1 that manufactures an information recording medium according to the information recording medium manufacturing method according to the present invention, The configuration of the optical recording medium 10 manufactured by the manufacturing apparatus 1 will be described with reference to the drawings.

  A manufacturing apparatus 1 shown in FIG. 1 has an optical recording medium 10 shown in FIG. 2 (in the present invention) by punching and forming a mounting center hole 10a in an intermediate 10x (see FIG. 3) according to the information recording medium manufacturing method of the present invention. An example of an information recording medium) is an apparatus for manufacturing an injection molding device 2, a functional layer forming device 3, a light transmitting layer forming device 4, a base material cutting device 5, a light transmitting layer cutting device 6, a transport device 7, and a control. A device 8 is provided. In this case, the optical recording medium 10 is a write-once optical disc capable of recording and reproducing recorded data as an example, and as shown in FIG. 2, a reflective layer is formed on one surface (the upper surface in FIG. 2) of the disk substrate 11. And a functional layer 12 such as a recording layer, and a light transmission layer 13 (an example of a resin layer in the present invention) is formed so as to cover the functional layer 12. Further, the mounting center hole 10a is formed so that its diameter L1 is 15.04 mm as an example. Further, the light transmission layer 13 is formed with a center hole 13a having a diameter L2 slightly larger than the diameter L1 of the mounting center hole 10a (for example, the diameter L2 is 16 mm).

  The injection molding apparatus 2 performs injection molding of the disk substrate 11 using a resin material such as polycarbonate. In this case, the disk substrate 11 corresponds to the substrate for information recording medium according to the present invention, and as shown in FIG. 4, a circular recess is formed on the back surface side (the other surface side in the present invention: the lower surface side in the same drawing). 15 is formed, and a protrusion 16 is formed on the surface side (one surface side in the present invention: the upper surface side in the figure). The circular recess 15 is formed, for example, so that its diameter becomes 15.0565 mm, which is slightly larger than the diameter L1 of the mounting center hole 10a. The circular recess 15 forms a part of the mounting center hole 10 a by punching the bottom surface thereof by the base material cutting device 5. The protrusions 16 position the disk substrate 11 (intermediate body 10x) with respect to the substrate cutting blade 22 during the cutting process of the disk substrate 11 by the substrate cutting device 5, and the light transmission layer cutting device 6 A positioning hole 17 for positioning the disk base material 11 (intermediate body 10x) with respect to the light transmission layer cutting blade portion 32a (ultrasonic horn 32) is formed during the cutting process of the light transmission layer 13 by the cylinder. It is formed in a shape. In this case, as an example, the positioning hole 17 is formed so that its diameter L3 is 5 mm and its center coincides with the center of the circular recess 15.

  The functional layer forming apparatus 3 forms (deposits) the functional layer 12 on the surface of the disk substrate 11 by, for example, sputtering various optical materials. In order to facilitate understanding of the present invention, description of the configuration and forming method of each thin film constituting the functional layer 12 is omitted. The light transmission layer forming device 4 forms the light transmission layer 13 by, for example, spin-coating and curing an ultraviolet curable resin material so as to cover the functional layer 12 formed by the functional layer forming device 3. In this case, the light transmission layer 13 is a resin layer for protecting the functional layer 12 formed on the disk substrate 11 and transmitting a laser beam at the time of recording / reproducing recorded data. It is formed to be about 100 μm.

  As shown in FIG. 3, the base material cutting device 5 includes a base portion 21, a base material cutting blade portion 22, a positioning convex portion 23, a spring 24, air cylinders 25, 25,. A sonic horn 27, an ultrasonic wave generation source 28, and a vertical movement mechanism 29 are provided. As shown in FIG. 4, the base material cutting blade portion 22 has a bottomed cylindrical shape with a base (diameter (outer diameter) L4) of 15.06 mm, which is substantially equal to the diameter (inner diameter) of the circular recess 15 in the disk base material 11. And is fixed to the base portion 21 as shown in FIG. As shown in FIG. 4, the cutting edge of the base material cutting blade 22 has a diameter (outer diameter) L5 equal to the diameter (inner diameter) L1 of the mounting center hole 10a and slightly smaller than the diameter L4 of the base. It is formed to have a small diameter of 15.04 mm. The base material cutting blade 22 is pressed into (pressed into) the intermediate body 10x pushed down by the vertical movement mechanism 29 to cut the disk base material 11 into a circular shape.

  As shown in FIG. 3, the positioning convex portion 23 is formed in a truncated cone shape and disposed inside the base material cutting blade portion 22 and is urged by the spring 24 in the directions of arrows A <b> 1 and A <b> 2. Yes. The positioning convex portion 23 is inserted into (inserted into) the positioning hole 17 of the intermediate body 10x (disk base material 11) when the mounting center hole 10a is formed. Then, the intermediate body 10x is positioned. As an example, the air cylinder 25 is configured such that, for example, compressed air is supplied to the air chamber on the side of the base cradle 26 by a pressure feed pump (not shown) when the intermediate body 10x is moved downward, and the base cradle for the base portion 21 is supplied. 26 is allowed to translate in the direction of arrow A1 (downward), and when the intermediate body 10x is moved upward, compressed air is supplied to the air chamber on the base portion 21 side by the pumping pump, and the base portion 21 is The parallel movement of the material support 26 in the direction of arrow A2 (upward) is allowed.

  The base material pedestal 26 is formed in a cylindrical shape as a whole, and a central hole that allows the base material cutting blade portion 22 to be inserted is formed in the central portion thereof, and the side surface of the base material cutting blade portion 22 is formed. Are attached to the base portion 21 via air cylinders 25, 25,. In this case, the upper surface of the base material base 26 is formed flat, and the back surface of the intermediate body 10x is brought into surface contact. Further, the base plate 26 is formed with a plurality of intake holes 26a, 26a,... For sucking the intermediate body 10x by sucking air between its upper surface and the back surface of the intermediate body 10x. . As shown in the figure, the base material pedestal 26 is normally in the height direction so that the cutting edge of the base material cutting blade portion 22 does not protrude from the upper surface (contact surface with the intermediate body 10x). The arrangement position is defined.

  The ultrasonic horn 27 is formed in a cylindrical shape as a whole, and is attached to the vertical movement mechanism 29 together with the ultrasonic wave generation source 28. The ultrasonic horn 27 is supersonic while pressing the upper surface of the intermediate body 10x downward when forming the mounting center hole 10a. The ultrasonic wave generated by the sound wave generation source 28 is transmitted to the intermediate 10x (the intermediate 10x is ultrasonically vibrated). In addition, a concave portion 27 a into which the protruding portion 16 of the intermediate body 10 x can enter is formed on the lower surface of the ultrasonic horn 27. The ultrasonic wave generation source 28 vibrates the intermediate body 10x via the ultrasonic horn 27 by generating an ultrasonic wave and vibrating the ultrasonic horn 27. In this case, as an example, the ultrasonic wave generation source 28 has a vibration frequency of about 28 kHz, and the vibration direction is a longitudinal vibration in the direction along the arrows A1 and A2 that are the pressing directions of the intermediate body 10x by the ultrasonic horn 27 ( (Single vibration) is generated to ultrasonically vibrate the ultrasonic horn 27. The vertical movement mechanism 29 moves (moves) the ultrasonic wave generation source 28 and the ultrasonic horn 27 in the directions of arrows A1 and A2.

  The light transmission layer cutting device 6 corresponds to the resin layer cutting device in the present invention, and includes a base cradle 31, an ultrasonic horn 32, an ultrasonic wave generation source 33, and a vertical movement mechanism 34 as shown in FIG. It is configured. As for the base material base 31, the upper surface is formed flat, and the back surface of the intermediate body 10x is brought into surface contact. In the base material base 31, the intermediate body 10 x is inserted into the positioning hole 17 of the intermediate body 10 x (disk base material 11) when the center hole 13 a is formed (inserted) with respect to the ultrasonic horn 32. Positioning convex portions 31a for positioning the are formed. Further, the base plate 31 is formed with a plurality of intake holes 31b, 31b,... For sucking the intermediate body 10x by sucking air between its upper surface and the back surface of the intermediate body 10x. .

  The ultrasonic horn 32 is formed in a cylindrical shape as a whole and is attached to the vertical movement mechanism 34 together with the ultrasonic generation source 33, and the ultrasonic generation source while pressing the upper surface of the intermediate body 10x downward when the center hole 13a is formed. The ultrasonic vibration is generated by the ultrasonic wave generated at 33. The ultrasonic horn 32 has a light transmitting layer cutting blade portion 32a formed on the bottom surface for forming the center hole 13a in the light transmitting layer 13. In this case, as shown in FIG. 6, the light transmitting layer cutting blade portion 32 a has a diameter L6 of 16 mm and a height H (amount of protrusion from the bottom surface of the ultrasonic horn 32) of the thickness of the light transmitting layer 13. It is formed to be equal to (equal or slightly higher) 100 μm. In this light transmission layer cutting device 6, the ultrasonic horn 32 on which the light transmission layer cutting blade portion 32a is formed constitutes the resin layer cutting blade portion of the present invention as a whole. Further, the ultrasonic horn 32 sucks air in the vicinity of the protrusion 16 in the intermediate body 10x (air between the bottom surface of the ultrasonic horn 32 and the surface of the light transmission layer 13), and a punched piece to be described later is provided. An intake hole 32b for adsorbing is formed.

  The ultrasonic wave generation source 33 generates ultrasonic waves and torsionally vibrates the ultrasonic horn 32. In this case, as an example, the ultrasonic wave generation source 33 has a vibration frequency of about 28 kHz, and the vibration axis is the pressing direction of the intermediate 10x by the ultrasonic horn 32, and the light transmitting layer cutting blade portion 32a The ultrasonic horn 32 is torsionally vibrated (angular vibration) so as to coincide with or substantially coincide with the center (that is, the center of the center hole 13a formed in the light transmission layer 13). The vertical movement mechanism 34 moves (moves) the ultrasonic horn 32 and the ultrasonic wave generation source 33 in the directions of arrows A1 and A2.

  The transport device 7 transports the intermediate 10x on which the light transmissive layer 13 is formed by the light transmissive layer forming device 4 to the base material cutting device 5, and the cutting processing of the disk base material 11 by the base material cutting device 5 is completed. The intermediate body 10x is conveyed to the light transmission layer cutting device 6. The control device 8 comprehensively controls the entire manufacturing apparatus 1. Further, as will be described later, the control device 8 controls the base material cutting device 5 for the intermediate 10x in which the light transmission layer 13 is formed on the disk base material 11 by the light transmission layer forming device 4. A base material cutting process for cutting the disk base material 11 and a light transmitting layer cutting process (resin layer cutting process in the present invention) for controlling the light transmitting layer cutting device 6 to cut the light transmitting layer 13 are executed in this order. Thus, the optical recording medium 10 is manufactured.

  Next, a method for manufacturing the optical recording medium 10 by the manufacturing apparatus 1 will be described with reference to the drawings.

  First, the injection molding device 2 performs injection molding of the disk base material 11. Next, the functional layer forming apparatus 3 forms the functional layer 12 on the disk substrate 11. Next, the light transmission layer forming device 4 forms the light transmission layer 13 on the disk substrate 11 so as to cover the functional layer 12. At this time, the light transmission layer forming apparatus 4 drops and stretches the resin material around the protrusions 16 in the disk substrate 11 when applying the resin material by spin coating. Thereby, the light transmission layer 13 is formed so as to cover the functional layer 12, and the intermediate 10x is completed.

  Next, as shown in FIG. 3, the transport device 7 transports the intermediate body 10 x according to the control of the control device 8, and the base material base of the base material cutting device 5 with the formation surface of the light transmission layer 13 facing upward. 26 and the ultrasonic horn 27 are set. At this time, the positioning convex portion 23 of the base material cutting device 5 is fitted into the positioning hole 17 from the back side of the intermediate body 10x, so that the center of the intermediate body 10x and the center of the base material cutting blade portion 22 are Are generally matched. Next, the vertical movement mechanism 29 moves the ultrasonic generation source 28 and the ultrasonic horn 27 downward toward the intermediate body 10 x under the control of the control device 8. In this case, first, the lower surface of the ultrasonic horn 27 abuts against the surface of the intermediate body 10x, and in this state, the ultrasonic horn 27 is further moved downward, so that the spring 24 is compressed and contracted. 10x is moved down. Next, when the intermediate body 10 x (ultrasonic horn 27) is further moved downward by the vertical movement mechanism 29, the spring 24 is further compressed, and the positioning convex portion 23 causes the center and base of the intermediate body 10 x to be compressed. The center of the blade part 22 for material cutting | disconnection is made to correspond (positioning). Next, when the intermediate body 10x is further moved downward by the vertical movement mechanism 29, the air cylinders 25, 25,... Are compressed as shown in FIG. It is translated downward together with the body 10x. At this time, the blade edge of the base material cutting blade portion 22 enters the circular recess 15 of the intermediate body 10x.

  In this case, since the cutting edge of the base material cutting blade portion 22 is formed to have a diameter L5 slightly smaller than the diameter L2 of the circular concave portion 15, the peripheral surface of the base material cutting blade portion 22 is the same as that of the circular concave portion 15. It can be moved up relative to the intermediate 10x without rubbing against the inner wall surface. Further, since the base portion of the base material cutting blade portion 22 is formed to have a diameter L4 substantially equal to the diameter L2 of the circular recess portion 15, the rim portion of the circular recess portion 15 contacts the base portion of the base material cutting blade portion 22. Thus, the position of the intermediate 10x with respect to the base material cutting blade 22 is finely adjusted (the center position is accurately aligned). In this state, a suction pump (not shown) sucks air between the back surface of the intermediate body 10x and the upper surface of the base cradle 26 through the intake holes 26a, 26a,. As a result, the back surface of the intermediate body 10x (around the circular recess 15) is in surface contact with the upper surface of the base cradle 26, and is in close contact with the suction force of air through the intake holes 26a, 26a,. The intermediate body 10 x is held on the base material cradle 26.

  Next, after the intermediate body 10x is further moved downward by the vertical movement mechanism 29, the cutting edge of the base material cutting blade portion 22 is brought into contact with the bottom surface of the circular concave portion 15, and then the ultrasonic wave generation source 28 is controlled by the control device. The ultrasonic wave is generated according to the control of 8. At this time, the ultrasonic horn 27 is longitudinally vibrated by the ultrasonic wave generated by the ultrasonic wave generation source 28, and this vibration is transmitted to the intermediate 10x. Next, as shown in FIG. 8, the intermediate body 10 x is further moved downward to push the cutting edge of the base material cutting blade portion 22 into the disk base material 11. At this time, since the base cradle 26 is translated along the side surface of the base material cutting blade 22 as the ultrasonic horn 27 moves downward, the base cradle 26 is brought into surface contact with the upper surface of the base cradle 26. The intermediate body 10x is translated in the thickness direction. Further, the ultrasonic vibration transmitted through the ultrasonic horn 27 causes the intermediate body 10x to vibrate longitudinally along the pressing direction of the ultrasonic horn 27 (that is, the direction in which the base material cutting blade 22 is pushed into the intermediate body 10x). Therefore, the cutting edge of the base material cutting blade 22 is smoothly pushed into the disk base material 11. Therefore, unlike the method of punching the intermediate body 10x without vibrating, even if the force in the direction of the arrow A2 applied to the intermediate body 10x is small, the base material cutting blade 22 is reliably pushed into the disk base material 11. The central portion of the disc base material 11 is cut from the disc base material 11. Thereby, the cutting | disconnection (base material cutting process in this invention) of the disk base material 11 is completed.

  Next, the transport device 7 transports the intermediate 10x according to the control of the control device 8, and the base plate 31 and the ultrasonic horn 32 of the light transmissive layer cutting device 6 are disposed with the light transmissive layer 13 forming surface facing upward. Set between. At this time, the positioning convex portion 31a of the base material base 31 is fitted into the positioning hole 17 from the back side of the intermediate body 10x, so that the center of the intermediate body 10x and the center of the ultrasonic horn 32 coincide. Next, a suction pump (not shown) sucks air between the back surface of the intermediate body 10x and the upper surface of the base material base 31 through the suction holes 31b, 31b,. Subsequently, the vertical movement mechanism 34 moves the ultrasonic generation source 33 and the ultrasonic horn 32 downward toward the intermediate body 10x according to the control of the control device 8, and the ultrasonic generation source 33 is controlled under the control of the control device 8. A sound wave is generated and the ultrasonic horn 32 is torsionally vibrated. At this time, first, the light transmitting layer cutting blade portion 32a comes into contact with the surface of the intermediate body 10x, and in this state, the ultrasonic horn 32 is further moved downward by the vertical movement mechanism 34, whereby the intermediate body 10x. The back surface (around the circular recess 15) is in surface contact with the top surface of the substrate cradle 31, and the light transmitting layer cutting blade 32a is pushed into the light transmitting layer 13 of the intermediate 10x as shown in FIG. It is.

  In this case, in the light transmission layer cutting device 6, the height H of the light transmission layer cutting blade portion 32 a is formed to be equal to the thickness of the light transmission layer 13. Therefore, the blade tip of the light transmitting layer cutting blade portion 32 a can reach the surface of the disk substrate 11 only by bringing the bottom surface of the ultrasonic horn 32 into surface contact with the surface of the light transmitting layer 13. As a result, the circular resin layer at the center of the light transmission layer 13 is cut by the light transmission layer cutting blade portion 32a, so that the cutting of the light transmission layer 13 (resin layer cutting processing in the present invention) is completed, and the light A center hole 13 a is formed in the transmission layer 13. Next, an air pump (not shown) sucks air around the protrusion 16 in the intermediate body 10x through the intake hole 32b. Thereby, the central part (punched piece) of the disk base material 11 cut by the base material cutting device 5 is adsorbed to the ultrasonic horn 32 together with the light transmission layer 13 cut by the light transmission layer cutting blade part 32a. Next, the vertical movement mechanism 34 moves up the ultrasonic generation source 33 and the ultrasonic horn 32 according to the control of the control device 8. At this time, as shown in FIG. 10, the light transmission layer 13 inside the center hole 13 a was peeled off from the surface of the disk base material 11, and the peeled light transmission layer 13 was punched out by the base material cutting device 5. It is moved upward together with the punched piece (the center portion of the disk base material 11). Subsequently, the operation of the ultrasonic wave generation source 33 is stopped and the operation of the air pump is stopped. Thereby, the mounting center hole 10a is formed, and the optical recording medium 10 is completed.

  As described above, according to the method for manufacturing the optical recording medium 10 and the optical recording medium manufacturing apparatus 1, the base material cutting blade 22 is pushed in from the other surface side of the disk base material 11 so that the central portion is removed from the disk base material 11. Substrate cutting process for cutting, and light transmitting layer cutting for cutting the light transmitting layer 13 on the outer peripheral side from the center by pushing the light transmitting layer cutting blade 32a into the light transmitting layer 13 from one side of the disk substrate 11 By executing the processing (resin layer cutting processing) in this order, the cutting processing of the disk base material 11 is completed at the time of the cutting processing of the light transmitting layer 13, and therefore the ultrasonic wave of the light transmitting layer cutting blade portion 32a. Prior to the resin material melted by vibration solidifying in a state of being in close contact with the surface of the disk substrate 11, the central portion of the disk substrate 11 and the cut light transmitting layer 13 can be removed. Therefore, it is possible to avoid a situation in which the light transmission layer 13 is partially left in the vicinity (mouth edge portion) of the formed mounting center hole 10a. As a result, the mounting center hole 10a having a clean mouth edge portion is formed. can do. Further, unlike the conventional manufacturing method of forming the resin layer (overcoat layer) after the formation of the mounting center hole, without causing peeling in the portion of the light transmission layer 13 covering the functional layer 12, Moreover, the optical recording medium 10 is manufactured by forming the mounting center hole 10a with the resin material for forming the light transmission layer 13 without contaminating the rim of the mounting center hole 10a or the back surface of the disk substrate 11. be able to.

  In addition, according to the method for manufacturing the optical recording medium 10 and the optical recording medium manufacturing apparatus 1, the base material cutting blade 22 is pushed in while longitudinally vibrating the base material 11 during base material cutting processing. The mounting center hole 10 a can be formed without applying stress to the material 11. Accordingly, it is possible to cleanly punch the edge portion of the mounting center hole 10a without causing a chip or the like, and reduce the stress applied to the cutting edge of the base material cutting blade portion 22 to reduce the base material cutting blade portion 22. Wear can be reduced.

  Further, according to the method for manufacturing the optical recording medium 10 and the optical recording medium manufacturing apparatus 1, by pressing the light transmitting layer cutting blade 32a (ultrasonic horn 32) while twisting and vibrating during the resin layer cutting process, Since the light transmissive layer 13 can be reliably cut, it is possible to avoid a situation in which the light transmissive layer 13 is partially left at the edge of the mounting center hole 10a. Further, since the light transmission layer 13 can be easily cut, the stress applied to the disk substrate 11 when the center hole 13a is formed can be reduced, and the stress applied to the cutting edge of the light transmission layer cutting blade portion 32a can be reduced. Thus, wear of the light transmitting layer cutting blade portion 32a can be reduced.

  The information recording medium manufacturing method and the optical recording medium manufacturing apparatus 1 according to the present invention are not limited to the above method and configuration. For example, the ultrasonic horn 32 is ultrasonically vibrated only before the blade edge of the light transmitting layer cutting blade portion 32a comes into contact with the surface of the intermediate body 10x until the ultrasonic horn 32 is moved up relative to the intermediate body 10x. Although the present invention has been described above, the present invention is not limited to this, and the ultrasonic horn from the time when the cutting edge of the light transmitting layer cutting blade portion 32a contacts the surface of the intermediate body 10x to immediately before the ultrasonic horn 32 is moved up. It is also possible to adopt a configuration in which the intermediate body 10x is ultrasonically oscillated through the unit 27 or a configuration in which the ultrasonic horn 32 is always ultrasonically oscillated by the ultrasonic wave generation source 33. In addition, the example in which the ultrasonic horn 32 is torsionally vibrated by the ultrasonic wave generation source 33 has been described above, but the present invention is not limited to this. For example, the vibration direction coincides with the pressing direction of the intermediate 10x by the ultrasonic horn 32. Thus, the ultrasonic horn 32 can be vibrated longitudinally.

  Furthermore, the ultrasonic horn only from the time when the intermediate 10x contacts the cutting edge of the base material cutting blade 22 until the cutting of the disk base material 11 is completed (until the punching of the mounting center hole 10a is completed). Although the example in which the intermediate body 10x is ultrasonically vibrated through the above 27 is described above, the present invention is not limited to this, and the mounting center hole is immediately before the cutting edge of the base material cutting blade portion 22 enters the recess 15. A configuration in which the intermediate 10x is ultrasonically oscillated through the ultrasonic horn 27 only until the punching formation of 10a is completed, or a configuration in which the ultrasonic horn 27 is always oscillated by the ultrasonic generation source 28 is adopted. You can also Further, although the example in which the ultrasonic horn 27 is longitudinally vibrated by the ultrasonic wave generation source 28 has been described above, the present invention is not limited to this. For example, the vibration axis and the pressing direction of the intermediate 10x by the ultrasonic horn 27 are used. Then, the ultrasonic horn 27 can be torsionally vibrated (angular vibration) so that the center of the base material cutting blade portion 22 (that is, the center of the mounting center hole 10a to be formed) matches or substantially matches.

1 is a block diagram showing a configuration of an optical recording medium manufacturing apparatus 1. FIG. 1 is a cross-sectional view of an optical recording medium 10 manufactured by an optical recording medium manufacturing apparatus 1. FIG. 3 is a cross-sectional view illustrating a configuration of a base material cutting device 5 in the manufacturing apparatus 1. FIG. 3 is a cross-sectional view showing a base material cutting blade 22 and a disk base material 11 of the base material cutting device 5. FIG. 3 is a cross-sectional view showing a configuration of a light transmission layer cutting device 6 in the manufacturing apparatus 1. FIG. 3 is a cross-sectional view showing an ultrasonic horn 32 (light transmitting layer cutting blade portion 32a) of the light transmitting layer cutting device 6 and a disk substrate 11. FIG. FIG. 3 is a cross-sectional view of a state where the optical recording medium 10 is pressed against a base cradle 26 via an ultrasonic horn 27. It is sectional drawing of the state which pushed the blade part 22 for base material cutting into the disk base material 11 of the intermediate body 10x. FIG. 3 is a cross-sectional view of a state where the optical recording medium 10 is pressed against the substrate cradle 31 via the ultrasonic horn 32. It is sectional drawing of the state which completed formation of the center hole 13a (mounting center hole 10a), and moved the ultrasonic horn 32 up.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Optical recording medium manufacturing apparatus 5 Base material cutting device 6 Light transmission layer cutting device 8 Control apparatus 10 Optical recording medium 10a Mounting center hole 10x Intermediate body 11 Disk base material 12 Functional layer 13 Light transmission layer 13a Center hole 22 Base material cutting Blade part 27, 32 Ultrasonic horn 28, 33 Ultrasonic wave generation source 32a Light transmission layer cutting blade part L1-L6 Diameter

Claims (4)

The information recording medium substrate is ultrasonically vibrated while pressing the one surface of the information recording medium substrate having a resin layer formed on one surface, and the information recording is performed from the other surface side of the information recording medium substrate. A base material cutting process in which a cylindrical base material cutting blade portion is pushed into the central portion of the medium base material to cut the central portion from the information recording medium base material;
A cylindrical resin layer cutting blade portion having a diameter larger than that of the base material cutting blade portion is ultrasonically vibrated so as to surround the center portion and is pushed into the resin layer from the one side to the center. A resin layer cutting process for cutting the resin layer on the outer peripheral side of the part is executed in this order, and a mounting center hole having a diameter equal to the outer diameter of the base material cutting blade part is formed in the center part. And an information recording medium manufacturing method for manufacturing an information recording medium configured to be capable of reproducing at least information.   The information recording medium manufacturing method according to claim 1, wherein the base material cutting blade portion is pushed into the information recording medium base material while longitudinally vibrating the information recording medium base material during the base material cutting process.   3. The information recording medium manufacturing method according to claim 1, wherein the resin layer cutting blade portion is pushed into the resin layer while torsionally vibrating during the resin layer cutting treatment. The information recording medium can be manufactured according to the information recording medium manufacturing method according to claim 1,
While pressing the one surface, the information recording medium substrate is ultrasonically vibrated, and the substrate cutting blade portion is pushed into the center portion from the other surface side of the information recording medium substrate, and the center portion is A substrate cutting device for cutting from the information recording medium substrate;
The resin layer cutting blade portion is pressed on the resin layer from the one surface side so as to surround the center portion while ultrasonically vibrating the resin layer cutting blade portion, and the resin layer on the outer peripheral side of the center portion. A resin layer cutting device for cutting
After causing the base material cutting device to perform a base material cutting process for cutting the central portion from the base material for the information recording medium, the resin layer cutting device is configured such that the resin is disposed on the outer peripheral side of the central portion. The information recording medium manufacturing apparatus provided with the control apparatus which performs the resin layer cutting process which cut | disconnects a layer.

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