JP2005228774A - Method of manufacturing printed circuit board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To enable a printed circuit board to be readily attached of an IC tag in the printed circuit board, before the component mounting. <P>SOLUTION: An antenna pattern 2 is formed simultaneously with a circuit pattern on the substrate and is made to stick to the core and is located about the IC tag 3. Since the antenna pattern 2 and the IC tag 3 perform data transmission and transfer of the electric power by uncontacting according to the electromagnetic induction, what is necessary is just to stick the IC tag 3 to the antenna pattern 2; and it is not necessary that direct connection be made. The antenna pattern 2 is manufactured by the same method as that for the circuit pattern, printing alternatively etching is performed, and a copper foil is produced. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a method of manufacturing a printed circuit board in which a wiring pattern is printed on a PCB substrate in which glass fibers are hardened with an epoxy resin or a flexible FPC substrate and electronic components such as ICs and connectors are mounted.

Unlike conventional barcodes, IC tags that perform ID identification in a non-contact manner can be read even when the surface is dirty or multiple layers of film are placed on the surface, such as a liquid crystal glass substrate. Widely applied to the center.
When this IC tag is attached to a printed circuit board, in the manufacturing process from wiring pattern inspection to surface mounting parts, machine insertion parts, manual insertion parts, etc., and soldering such as cream solder printing, reflow soldering, and flow soldering Management tasks can be automated.
Also, by using this IC tag to accumulate history information from printed circuit board distribution, inventory, sales, and disposal in a database and adding various search and inquiry functions, a mechanism for realizing traceability can be created.

However, in recent years, it has become difficult to secure a space for attaching an IC tag with high-density mounting of a printed board.
Further, when the IC tag is brought into close contact with metal, the frequency of radio waves may be shifted due to the influence, communication may not be performed due to reflection, and the communication distance may be extremely shortened.
For this reason, since the attachment position is limited, it is very difficult to attach the IC tag to the printed circuit board as a retrofit.
It is easy to attach an IC tag to a printed circuit board after mounting components, for example, by attaching it to an IC package. However, although history management after the manufacturing process can be performed, management of the manufacturing process cannot be performed.

  The problem to be solved is that it is difficult to attach the IC tag to the printed circuit board before mounting the components by retrofitting due to space and layout problems. The present invention easily attaches the IC tag to the printed circuit board before mounting the components. It was made for the purpose of being able to be attached.

  In the printed circuit board manufacturing method of the present invention, in the printed circuit board manufacturing process before mounting electronic components, the antenna pattern is formed on the circuit board simultaneously with the wiring pattern, and the IC tag is adhered and fixed to the antenna pattern. Features.

The present invention performs design in consideration of the antenna space at the design stage of the printed circuit board, and incorporates the antenna pattern into the wiring pattern at the initial stage of the manufacturing process.
Therefore, the IC tag can be attached to the antenna in the same manner as mounting a normal electronic component, and the ID can be read without contact and without power from the initial stage of the manufacturing process.
Further, it is not necessary to imprint the product NO of the printed board.
Therefore, it is possible to easily manage slightly different parts and processes according to destinations in conjunction with the computer, and to flexibly deal with additions and changes during the process.
In addition, it is possible to easily select a shipping item and check management items.
As a result, the production efficiency of printed circuit boards with a large variety of small-quantity production is greatly improved.
Furthermore, maintenance management including inventory management, shipping management, sales management, and recycling becomes easy, and a series of management can be performed in real time, thereby improving traceability.
Of course, a security function can be added.

Embodiments of the present invention will be described below.
FIG. 1 shows a plan view of a printed circuit board embodying the present invention.
The printed circuit board 1 has a configuration in which the antenna pattern 2 is formed on the circuit board simultaneously with the wiring pattern, and the IC tag 3 is disposed in close contact with the circular core portion.
Since the antenna pattern 2 and the IC tag 3 perform data transmission and power transmission in a non-contact manner by electromagnetic induction, the IC tag 3 may be in close contact with the antenna pattern 2 and does not need to be directly connected.
The antenna pattern 2 is produced by printing or etching a copper foil by the same method as the wiring pattern. Although a spiral air-core coil is shown in the figure, a linear dipole antenna or a circular or square loop antenna can be employed depending on the space and arrangement.

FIG. 2 shows a configuration diagram of an IC tag implementing the present invention.
The IC tag 3 incorporates an antenna 31 integrally, receives a radio wave from a reader / writer (not shown) once with the antenna pattern 2 to enhance the electric field strength, and receives the enhanced radio wave with the antenna 31 to generate an excitation voltage. This is rectified by the rectifier 32 to obtain an operating power source. Further, the received radio wave is demodulated by the demodulator 33, the ID read signal of the reader / writer is taken out, and the ID is modulated by the modulator 35 as a response signal under the control of the control unit 34 and re-launched without power amplification. To do.

FIG. 3 is a process cross-sectional view of a printed circuit board embodying the present invention.
In the present embodiment, a manufacturing process using a subtractive method will be described as an example.
First, as shown in (1), a copper foil 20 is formed on the insulating substrate 10 by sputtering, for example, to form a copper-clad laminate.
The insulating substrate 10 may be either a PCB substrate or an FPC substrate.
Next, as shown in (2), a resist material 30 is applied on the copper foil 20, and then exposed to form a pattern.
Next, as shown in (3), etching is performed to dissolve and remove the copper foil 20 other than the pattern.
Next, as shown in (4), the resist material 30 is peeled and removed to expose the pattern.
Next, as shown in (5), a UV curable adhesive 40 is applied to the insulating substrate 10.
Next, as shown in (6), the IC tag 3 is brought into close contact with the UV curable adhesive 40.
Next, as shown in (7), the UV photosensitive adhesive 40 is cured by UV heating, and the IC tag 3 is fixed to the insulating substrate 10.

FIG. 4 shows a configuration diagram of a system in which the inspection of the wiring pattern is automated using the printed circuit board of the present invention.
This system includes a control computer 4, an image processing device 5 that performs a matching process between a reference image and an inspection image, a line camera 6 that captures the surface of the printed circuit board 1 and captures the inspection image, and a stage 7 on which the printed circuit board 1 is placed. A controller 8 that moves the stage 7 and a reader / writer 9 that reads an ID from an IC tag attached to the printed circuit board 1.
The system is configured as described above. First, the reader / writer 9 reads the ID of the printed circuit board 1 and the computer 4 extracts a reference image prepared in advance corresponding to the wiring pattern of the printed circuit board 1.
Next, the reference image taken out by the image processing device 5 is compared with the inspection image taken in from the line camera 6 to detect defects such as missing wiring patterns or short circuits.
The inspection result is written in the IC tag by the computer 4 via the reader / writer 9.
By using the printed circuit board of the present invention as described above, it is possible to automate the inspection of the wiring pattern in the printed circuit board manufacturing process before mounting the electronic component.

It is a top view of the printed circuit board which implemented this invention. It is a block diagram of the IC tag which implemented this invention. It is process sectional drawing of the printed circuit board which implemented this invention. It is a block diagram of the system which automated the test | inspection of the wiring pattern using the printed circuit board of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Printed circuit board 2 Antenna pattern 3 IC tag 4 Computer 5 Image processing device 6 Line camera 7 Stage 8 Controller 9 Reader / writer 10 Insulating substrate 20 Copper foil 30 Resist material 40 UV curable adhesive

Claims (1)

In the printed circuit board manufacturing process before mounting electronic components,
A patterning step of forming an antenna pattern simultaneously with the wiring pattern on the substrate;
An attaching step for fixing the IC tag in close contact with the antenna pattern;
A method of manufacturing a printed circuit board, comprising:

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