JP2005228769A - Molding method and molding apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent a scuff mark or the remain of a bending mark on a wiring board when a gate, a runner, and a cull sections are removed, after a semiconductor chip mounted on a film-like wiring board is sealed by a transfer mold. <P>SOLUTION: Before the semiconductor chip is sealed, an opening 2C, penetrated at the rear face from a plane on which the semiconductor chip is mounted, is formed on the region overlapped with the runner of an insulating board 2. After sealing with resin, a load is applied to a mold 7A from the component side of the insulating board, a load is applied to the runner 7C filled in the opening 2C from the rear surface of the insulating board, an angle formed between the region overlapped with the mold 7A of the insulating board and the region overlapped with the gate 7B; and the runner 7C is set to a predetermined angle, and the gate 7B and the runner 7C are released from the insulating board 2. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a molding method and a molding apparatus, and more particularly to a technique effective when applied to a method of molding a semiconductor chip mounted on a film-like wiring board by transfer molding.

  Conventionally, in a semiconductor device in which a semiconductor chip is mounted on a wiring board in which a conductor pattern is formed on a lead frame or an insulating substrate, a semiconductor device in which the periphery of the semiconductor chip is molded with an insulating resin material (mold material) ( Hereinafter, it is referred to as a resin-encapsulated semiconductor device. In the resin-encapsulated semiconductor device, the semiconductor chip is sealed with the molding material, thereby protecting the semiconductor chip and the connection part between the conductor pattern of the wiring board and the semiconductor chip.

  Further, when the semiconductor chip is sealed with the molding material, it is generally sealed with a transfer mold using a molding die. In the transfer mold, a lead frame or a wiring board on which the semiconductor chip is mounted is sandwiched between the molding dies, for example, a mold material (insulating resin) melted using a plunger is moved from the molding die to a runner, The semiconductor chip in the cavity is sealed by pressurizing and moving from the runner to the gate and from the gate to the cavity. Therefore, after the semiconductor chip is sealed, the wiring board has a molding material (hereinafter referred to as a gate portion, a runner portion, and a cull portion) cured inside the gate, runner, and cull of the molding die. Remaining. Therefore, an apparatus for sealing with the transfer mold is generally provided with a removing means for removing the gate portion, the runner portion, and the cull portion after sealing. The cull is an area of the molding die where the resin remains on the lower surface of the plunger without being filled into the runner at the time of resin injection, and the runner is a path of the molten material flowing into the cavity by the molding die. Of these, it is a region from the cull to the gate, and the gate is an injection port through which molten resin is injected into the cavity in the molding die, and is a path including a predetermined region from the runner to the cavity.

  When the semiconductor chip is mounted on a lead frame, the removing means is a means that drops the gate portion, the runner portion, and the cull portion by applying an impact such as hitting the lead frame. . However, such a method is effective only when the rigidity is high as in the case of the lead frame, and a semiconductor chip mounted on a wiring board having a conductor pattern formed on a film-like insulating substrate such as an interposer is sealed. It cannot be applied if stopped.

When the semiconductor chip is mounted on a wiring board in which a conductor pattern is formed on the film-like insulating substrate, for example, the cull part and the runner part are rotated with the wiring board fixed, and the runner There is a method in which the part and the gate part are removed by peeling off from the insulating substrate. On the contrary, there is also a method of removing the runner part and the gate part from the insulating substrate by rotating the wiring board with the cull part fixed. In addition, for example, the insulating substrate is bent by pressing a roller from the back surface (hereinafter referred to as the second main surface) of the surface (hereinafter referred to as the first main surface) of the insulating substrate on which the semiconductor chip is mounted. There is a method of removing the runner part and the gate part (see, for example, Patent Document 1).
Japanese Patent No. 3333912

  However, among the conventional techniques, when the semiconductor chip is mounted on a wiring board in which a conductor pattern is formed on the film-like insulating substrate, the method of removing the gate part, the runner part, and the cull part, A tool or roller is bent in direct contact with the insulating substrate. Therefore, there is a problem that the insulating substrate is easily scratched.

  Further, in the conventional method, when the insulating substrate is bent, the bending angle may be large and bending larger than the plastic limit angle of the insulating substrate may be applied. For this reason, there is a problem that the trace of bending remains on the insulating substrate, which hinders the subsequent transfer operation.

  An object of the present invention is to scratch the wiring board (insulating substrate) when a semiconductor chip mounted on a film-like wiring board is sealed with a transfer mold and then the gate part, runner part, and cull part are removed. It is an object of the present invention to provide a technique capable of preventing a mark or a folding mark from remaining.

  The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

  The outline of the invention disclosed in the present application will be described as follows.

  (1) After a semiconductor chip mounted on a wiring board having a conductor pattern formed on a film-like insulating substrate is sealed with a transfer mold using a molding die, the gate, runner, and calf of the molding die A molding method in which a mold material hardened inside (hereinafter referred to as a gate portion, a runner portion, and a cull portion, respectively) is separated from a mold material (hereinafter referred to as a mold portion) for sealing the semiconductor chip and removed. Before sealing the semiconductor chip, the surface (hereinafter referred to as the first main surface) on which the semiconductor chip is mounted in the region overlapping the runner portion of the insulating substrate to the back surface (hereinafter referred to as the second main surface). And after the semiconductor chip is sealed, a load is applied to the mold portion from the first main surface side of the insulating substrate, and the insulation An angle formed between a region overlapping the mold portion of the insulating substrate and a region overlapping the gate portion and the runner portion by applying a load to the runner portion filled in the opening from the second main surface side of the plate Is a molding method in which the gate portion and the runner portion are peeled off from the insulating substrate at a predetermined angle.

  (2) After sealing with a sealing means for sealing a semiconductor chip mounted on a wiring board having a conductor pattern formed on a film-like insulating substrate with a transfer mold using a molding die The molding material cured inside the gate, the runner, and the cull of the molding die (hereinafter referred to as the gate portion, the runner portion, and the cull portion, respectively) is used as the molding material that seals the semiconductor chip (hereinafter, the mold portion). And removing means for separating and removing the load from the surface on which the semiconductor chip of the insulating substrate is mounted (hereinafter referred to as the first main surface). A mold part load member to be applied, a runner part load member for applying a load to the runner part from the back surface of the first main surface (hereinafter referred to as second main surface) of the insulating substrate, and the cull part. An opening penetrating from the first main surface to the second main surface in a region overlapping with the runner portion of the insulating substrate before the semiconductor chip is sealed by the sealing means. The runner portion loading means applies a load to the runner portion filled in the opening of the insulating substrate, overlaps the mold portion of the insulating substrate, and the gate portion and the runner portion. In the molding apparatus, the gate portion and the runner portion are peeled off from the insulating substrate by setting an angle formed with the overlapping region to a predetermined angle.

  The molding method of the present invention applies a load to the mold part from the first main surface side of the insulating substrate as in the means of (1), and the opening portion from the second main surface side of the insulating substrate. A load is applied to the runner portion filled in the substrate, and the gate portion and the runner portion are peeled off from the insulating substrate. At this time, the load applied from the first main surface side of the insulating substrate and the load applied from the second main surface side have opposite directions and are applied to different positions on the insulating substrate. Therefore, the portion of the insulating substrate that overlaps with the mold portion is inclined with respect to the portion of the gate portion and the runner portion that overlaps, and stress concentrates on the boundary between the mold portion and the gate portion to cause cracks. Thereafter, if the load is continued, the direction of the load applied to the insulating substrate and the direction of the load applied to the runner portion and the gate portion are opposite directions, so the runner portion and the gate portion are peeled off from the insulating substrate. At this time, the load is applied to the runner part filled in the mold part and the opening part of the insulating substrate, so that the insulating substrate can be prevented from being scratched. Further, the inclination of the portion of the insulating substrate that overlaps the mold portion with respect to the portion that overlaps the gate portion and the runner portion may be inclined by several degrees because a crack may be generated at the boundary between the mold portion and the gate portion. For this reason, it is possible to prevent bending marks from remaining on the insulating substrate.

  Further, when the gate part and the runner part are peeled off from the insulating substrate by the method (1), a removing means such as the means (2) may be provided in the molding apparatus. At this time, a load surface that applies a load to the mold part that is continuous with the runner part by the gate part of the mold part load member includes an inclined part or a step that makes the mold part have a predetermined angle. Then, the angle formed by the portion of the insulating substrate that overlaps the mold portion and the portion of the gate portion and the runner portion can be easily controlled, and the bending trace remains on the insulating substrate or the insulating substrate is cut off. I can prevent it.

Hereinafter, the present invention will be described in detail together with embodiments (examples) with reference to the drawings.
In all the drawings for explaining the embodiments, parts having the same function are given the same reference numerals and their repeated explanation is omitted.

  In the molding method of the present invention, when a semiconductor chip mounted on a film-like wiring board is sealed with a transfer mold, an opening is formed at a position overlapping the runner of the wiring board (insulating substrate), and the sealing is performed. The runner portion of the mold material is exposed on the back surface (second main surface) of the surface (first main surface) on which the semiconductor chip to be stopped is mounted. Then, after sealing the semiconductor chip, a tool (load) that applies a load by applying an opposite load to the portion of the molding material sealing the semiconductor chip (mold portion) and the runner portion is applied. The unnecessary portion of the molding material is removed without bringing the means into contact with the insulating substrate.

1 to 5 are schematic diagrams for explaining the principle of the molding method of the present invention. FIG. 1 is a diagram showing a schematic configuration of a molding apparatus, and FIG. 2A is a wiring immediately after molding by a molding means. FIG. 2 (b) is a bottom view of FIG. 2 (a), FIG. 2 (c) is a cross-sectional view taken along the line AA 'of FIG. 2 (a), and FIG. 3 (a). 3 (b), 4 (a), and 4 (b) are diagrams for explaining the operation of peeling the gate portion and the runner portion from the insulating substrate, and FIG. 5 is a diagram showing a modification.
In FIG. 1, 1A and 1B are reels, 2 is a wiring board, 3 is a loader section, 4 is a mold section, 4A is a molding means, 4B is an unnecessary resin removing means, 401 and 402 are molding dies, and 403 is a mold section load. A member, 404 is a runner load member, 405 is an unnecessary resin recovery means, 406 is a tension adjusting roller, and 5 is an unloader. 2A, 2B, and 2C, 2A is the first main surface of the wiring board, 2B is the second main surface of the wiring board, 2C is the opening of the wiring board, 6 is a semiconductor chip, 7A is a mold part, 7B is a gate part, 7C is a runner part, and 7D is a cull part. 3A, 3B, 4A, and 4B, 403A, 403B, and 403C are load surfaces, 404A is a load pin, and 404B is a load pin fixing plate. It is.

  The molding method of the present invention is a method of sealing a semiconductor chip mounted on a film-like wiring board with a transfer mold using a molding die. At this time, for example, as shown in FIG. 1, the molding apparatus used for sealing includes a loader unit 3 that pulls out the film-like wiring board 2 on which the semiconductor chip is mounted, which is wound around a reel 1 </ b> A, Mold part 4 having sealing means (molding means) 4A for sealing the semiconductor chip of the drawn wiring board 2 with a molding material and unnecessary resin removing means 4B for removing unnecessary portions of the molding material (resin) after sealing. And an unloader portion 5 for winding the wiring board 2 in which the semiconductor chip is sealed by the mold portion 4 around a reel.

  The molding means 4A is means for sealing the semiconductor chip by transfer molding, and includes a pair of molding dies 401 and 402. Further, the unnecessary resin removing means 4B removes from the wiring board 2 the molding material hardened by the gate, runner and cull of the molding dies 401 and 402 (hereinafter referred to as the gate portion, runner portion and cull portion). A mold part load member 403 for applying a load to a mold material (hereinafter referred to as a mold part) sealing the semiconductor chip, and a runner part load means 404 for applying a load to the runner part. An unnecessary resin collecting means 405 for collecting the gate portion, the runner portion, and the cull portion is provided. The mold unit 4 includes a tension adjusting roller 406 that adjusts the tension applied to the wiring board (insulating substrate) to be conveyed, in addition to the above means.

  When the semiconductor chip mounted on the wiring board is sealed using the molding apparatus as shown in FIG. 1, first, the semiconductor chip wound around the reel 1A is mounted by the loader unit 3. The formed wiring board 2 is pulled out and conveyed to the mold part 4. At this time, since the wiring board is wound around the reel 1A with the embossed tape overlapped, the loader unit 3 pulls out and conveys the wiring board 2, while the embossed tape is put on another reel. Wind up and collect.

  In the wiring board 2 pulled out from the reel 1A and transported to the mold section 4, the semiconductor chip mounted on the wiring board 2 is sealed with a molding material in the molding means 4A. At this time, the molding means 4 seals the semiconductor chip by transfer molding, and first, the wiring board 2 on which the semiconductor chip is mounted is sandwiched between the molding dies 401 and 402 and fixed. Then, the mold material (insulating resin) heated and melted is poured from the cull of the molding dies 401 and 402 to the runner, from the runner to the gate, and from the gate to the cavity by a plunger (not shown), and the semiconductor chip in the cavity. Is sealed.

  Further, in the case of transfer molding using the molding dies 401 and 402, the wiring board 2 taken out from the molding dies 401 and 402, that is, the wiring board 2 immediately after sealing the semiconductor chip, As shown in FIGS. 2A and 2B, in addition to the mold portion 7A for sealing the periphery of the semiconductor chip 6, the gates, runners, and culls of the molding dies 401 and 402 are used. The hardened gate portion 7B, runner portion 7C, and cull portion 7D remain. In particular, since the cull portion 7D is outside the wiring board 2, it cannot be wound around the reel as it is. Therefore, after taking out from the molding dies 401 and 402, the unnecessary resin removing means 4B removes unnecessary resin from the gate portion 7B, the runner portion 7C, and the cull portion 7D.

  Further, in the molding method of the present invention, when the unnecessary resin is removed from the gate portion 7B, the runner portion 7C, and the cull portion 7D using the unnecessary resin removing means 4B, the wiring board 2 has the structure shown in FIG. As shown in FIG. 2A, FIG. 2B, and FIG. 2C, the surface (hereinafter referred to as the first main surface) 2A on which the semiconductor chip 6 is mounted to the back surface (hereinafter referred to as the second main surface). ) An opening 2C penetrating 2B is formed. At this time, if the opening 2C is formed in the wiring board 2, when the semiconductor chip 6 is sealed by the molding means 4A, the runner portion 7C is moved as shown in FIG. It exists also in the opening 2 </ b> C and is exposed from the second main surface 2 </ b> B of the wiring board 2.

  The unnecessary resin removing means 4B in the molding apparatus of the present invention includes, for example, a mold part load member 403 that applies a load to the mold part 7A of the wiring board 2 and a runner part load member 404 that applies a load to the runner part 7C. . At this time, the runner load member 404 is, for example, on the second main surface 2B side of the wiring board 2 and inside the opening 2C of the wiring board 2 as shown in FIG. A pin-shaped member (hereinafter referred to as a push-up pin) 404A that contacts the portion 7C and applies a load, and a holding plate 404B that integrally holds the push-up pin 404A are provided.

  Further, as shown in FIG. 3A, for example, the mold part load member 403 is formed on the mold part 7A that is continuous with the runner part 7C that is in contact with the push-up pin 404A and the gate 7B. A load surface 403A parallel to the conveyance direction of the wiring board 2 and a load surface 403B inclined at a predetermined angle are provided. Further, for example, when viewed from the runner portion 7C, on the mold portion 7A in the direction opposite to the protruding direction of the gate 7B, it is parallel to the conveyance direction of the wiring board 2, and for example, the wiring board 2 A load surface 403C is provided such that the distance from the reference surface such as the first main surface 2A is greater than the load surface 403A.

  In the following description, in order to distinguish between the mold portion 7A that applies a load on the load surfaces 403A and 403B and the mold portion 7A that applies a load on the load surface 403C, the conveyance direction of the wiring board 2 is shown in FIG. ), The mold part 7A that applies the load on the load surfaces 403A and 403B is the mold part 7A (1) on the upstream side, and the mold part 7A that applies the load on the load surface 403C. Is referred to as a downstream mold portion 7A (2).

  Here, for example, when a load is applied by the mold part load member 403 with the runner part load member 404 fixed, the periphery of the runner part 7C in contact with the push-up pin 404A in the wiring board 2 Is restrained, the upstream mold portion 7A (1) receiving the load from the load surface 403A rotates and, as shown in FIG. 3B, the upstream mold portion 7A (1). Is in contact with the load surface 403B. When the load continues, the downstream mold portion 7A (2) and the load surface 403C come into contact with each other.

  At this time, the mold part 7A (1) on the upstream side is in contact with the load surface 403B, and is inclined by a predetermined angle with respect to the transport direction of the wiring board 2. Therefore, in the vicinity of the boundary between the upstream mold part 7A (1) and the gate part 7B, for example, as shown in FIG. 4A, the wiring board 2 is warped, and the mold part 7A (1) and the gate Stresses in opposite directions are applied to the portions 7B. As a result, a crack 8 is generated near the boundary between the mold part 7A (1) and the gate part 7B.

  At this time, an angle θ formed by a region overlapping the conveyance direction of the wiring board 2 and the upstream mold part 7A (1) may be, for example, about 2 degrees to 10 degrees, and if it is bent to that extent It is within the elastic limit of the wiring board 2 (insulating substrate), and it is possible to prevent the bending trace from being caused by plastic deformation.

  After that, when the load by the mold part load member 403 is continued, the upstream mold part 7A (1) and the downstream mold part 7A (2) are separated from the first main surface 2A of the wiring board 2, respectively. 2 receives an external force in the direction of the main surface 2B (downward on the paper surface). On the other hand, the runner portion 7C that is in contact with the fixed push-up pin 404A has an external force in the direction from the second main surface 2B to the first main surface 2A of the wiring board 2 (upward on the paper surface) from the push-up pin 404A. Receive. As a result, the runner portion 7C and the gate portion 7B are peeled off from the wiring board 2 as shown in FIG. And although illustration is omitted, after recovering (removing) the peeled runner portion 7C and gate portion 7B together with the cull portion 7D, the mold portion load member 403 is returned to the original position, and the gate portion 7B , The removal of the runner portion 7C and the cull portion 7D is completed. Thereafter, the wiring board 2 is transported by a predetermined distance, and the above operation is repeated.

  In this way, the mold part load member 403 applies a load to the mold part 7A, and the runner part 7C filled in the opening 2C of the wiring board (insulating substrate) has a direction opposite to the mold part 7A. By applying a load, the gate portion 7B and the runner portion 7C can be peeled off from the wiring board 2 without bringing the load means 403 and 404A into contact with the wiring board 2 (insulating substrate). Therefore, it is possible to prevent the wiring board (insulating substrate) from being scratched.

  Then, after the removal of the gate portion 7B, the runner portion 7C, and the cull portion 7D is completed by the above procedure, the unloader portion 5 superimposes the embossed tape and winds it on the reel 1B.

  In the above description, the load surface for applying a load to the mold part 7A continuous with the gate 7B is, as shown in FIG. 3A, a load surface 403A parallel to the conveying direction and an inclined load surface. Although not limited to this, for example, as shown in FIG. 5, a load surface 403A for applying a load at a position far from the gate portion 7B of the mold portion 7A continuous with the gate portion 7B, It consists of two independent load surfaces, a second load surface 403D that applies a load at a position close to the gate portion 7B, and the mold portion 7A is predetermined between the first load surface 403A and the second load portion 403D. You may provide the level | step difference d which only makes it incline to an angle.

  6 to 13 are schematic views for explaining a method for removing unnecessary resin in the molding method according to an embodiment of the present invention. FIG. 6 is a diagram showing an overall configuration of unnecessary resin removing means, and FIG. Is a plan view showing the structure of the wiring board immediately after sealing, FIG. 8 is a view for explaining a method of supporting the wiring board, and FIGS. 9 to 13 are views for explaining an operation for removing unnecessary resin.

  The removal method of the unnecessary resin in the molding method of the present embodiment is a method in which the four gate portions 7B and the runner portion 7C are peeled and removed in one operation, and the unnecessary resin removal means is the runner portion load. As shown in FIG. 7, the push-up pins 404A of the member 404 are provided at positions corresponding to the four runner portions 7C along the conveyance direction of the wiring board 2.

  Further, the mold part load member 403 is formed on the mold part 7A continuous with the runner part 7C and the gate part 7B in contact with the push-up pin 404A, and the first load surface 403A and the second load surface 403A shown in FIG. Load surfaces 403A and 403D having the same configuration as the load surface 403D are provided. At this time, it is assumed that a step d1 is provided between the first load surface 403A and the second load surface 403D on each mold portion 7A so as to incline the mold portion 7A at a predetermined angle. Further, it is assumed that a step d2 having a predetermined distance is provided between the first load surfaces 403A on the adjacent mold parts 7A. At this time, as shown in FIG. 6, the conveyance direction of the wiring board 2 is the direction from the left to the right of the paper surface, and the mold portion 7A for peeling the gate portion 7B and the runner portion 7C is from the upstream side (the left side of the paper surface) The first mold part 7A (1), the second mold part 7A (2), the third mold part 7A (3), and the fourth mold part 7A (4) are called and distinguished in order.

  In addition to the four sets of load surfaces 403A and 403D, the mold portion load member 403 is provided with a load surface 403C for applying a load to the mold portion on the downstream side (right side of the paper surface) of the fourth mold portion 7A (4). It has been.

  When the unnecessary resin removing means 4B of this embodiment is used, when the semiconductor chip 6 mounted on the wiring board 2 is sealed with the molding dies 401 and 402, the cull portion 7D is shown in FIG. As shown, the wiring boards 2 protrude alternately from the longitudinal ends 2D and 2E. Then, when the gate portion 7B, the runner portion 7C, and the cull portion 7D are removed by the unnecessary resin removing means 4B, as shown in FIG. 8, the cull portion 7D protruding from the end portions 2D, 2E of the wiring board is removed. The wiring board 2 is supported in a state where it is sandwiched between the gripping mechanisms 9 and suspended in the air. At this time, as shown in FIG. 7, if the cull portion 7B protrudes alternately from both end portions 2D and 2E of the wiring board 2, the wiring board 2 can be kept horizontal.

  When removing the gate portion 7B, the runner portion 7C, and the cull portion 7D using the unnecessary resin removing means 4B of this embodiment, the runner portion load member 404 is connected to the wiring board 2 side as shown in FIG. The push pin 404A is brought into contact with the runner portion 7C of the opening 2C of the wiring board 2 and the mold portion load member 403 is moved to the wiring board 2 side. At this time, as shown in FIG. 9, for example, the mold part load member 403 is configured such that the most upstream first mold part 7A (1) and the upper load surface 403A come into contact with each other, and then the first mold part 7A. (1) is inclined at a predetermined angle with respect to the conveying direction, and the second mold portion 7A (2) and the load surface 403A on the upper side thereof contact. A crack is generated near the boundary between the first mold part 7A (1) and the gate part 7B.

  Thereafter, when the mold part load member 403 is further moved to the wiring board side, as shown in FIG. 10, the gate part 7B and the runner part 7C which are continuous with the first mold part 7A (1) are connected to the wiring. Peel from the plate 2. Then, this time, the second mold part 7A (2) is inclined at a predetermined angle with respect to the transport direction, and the third mold part 7A (3) and the load surface 403A on the upper side thereof contact each other. A crack is generated near the boundary between the second mold part 7A (2) and the gate part 7B.

  Thereafter, although repeated description is omitted, when the mold part load member 403 is further moved to the wiring board side, as shown in FIG. 11, the fourth mold part 7A (4) is inclined, The mold part 7A on the downstream side of the fourth mold part 7A (4) and the upper load surface 403C come into contact with each other. A crack is generated near the boundary between the fourth mold part 7A (4) and the gate part 7B. Then, when the mold part load member 403 is further moved to the wiring board side as it is, as shown in FIG. 12, the gate part 7B and the runner part 7C which are continuous with the fourth mold part 7A (4) are The wiring board 2 is peeled off.

  Thus, when the gate part 7B and the runner part 7C that are continuous with the mold parts 7A (1), 7A (2), 7A (3), and 7A (4) are peeled off from the wiring board 2, for example, The unnecessary resin consisting of the gate portion 7B, the runner portion 7C, and the cull portion 7D is recovered by the unnecessary resin recovery means 405 by moving the gripping mechanism 9 that grips the portion 7D.

  When the unnecessary resin is recovered, as shown in FIG. 13, the mold part load member 403 and the runner part load member 404 are returned to their original positions, and the wiring board 2 is moved by four mold parts, Repeat the operation. If it carries out like this, four gate parts 7B and runner parts 7C can be peeled from the said wiring board 2 by one operation | movement, and can be removed.

  As described above, according to the unnecessary resin removing means of the present embodiment, the mold part load member 403 and the runner part load member 404 can be used without touching the wiring board 2 (insulating substrate). The gate portion 7B, the runner portion 7C, and the cull portion 7D can be removed. Therefore, unnecessary scratches on the wiring board 2 can be prevented.

  Further, by applying loads in opposite directions from the mold part 7A and the runner part 7C, the mold part 7A is inclined at a predetermined angle with respect to the transport direction, so that the mold part 7A and the gate part 7B By generating cracks in the vicinity of the boundary, the remaining gate portion 7B can be reduced. At this time, the angle of inclination may be about several degrees, so that the elastic limit of the insulating substrate is not exceeded, and the wiring board 2 can be prevented from being bent due to plastic deformation.

  Further, the unnecessary resin removing means of the present embodiment can remove the four gate portions 7B and the runner portions 7C from the wiring board 2 by one operation. Therefore, the efficiency of the removal work is improved. In the present embodiment, an example in which the four gate portions 7B and the runner portions 7C are peeled off from the wiring board 2 by one operation is shown. However, the present invention is not limited to this, and more gate portions 7B and runners are provided. The part 7C may be removed from the wiring board 2 by a single operation.

  The present invention has been specifically described above based on the above-described embodiments. However, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the present invention. is there.

It is a schematic diagram for demonstrating the principle of the molding method of this invention, and is a figure which shows schematic structure of a molding apparatus. 2A and 2B are schematic views for explaining the principle of the molding method of the present invention, in which FIG. 2A is a plan view showing a state of a wiring board immediately after being molded by molding means, and FIG. 2B is a plan view of FIG. FIG. 2C is a cross-sectional view taken along the line AA ′ of FIG. FIGS. 3A and 3B are schematic views for explaining the principle of the molding method of the present invention, and FIGS. 3A and 3B are views for explaining the operation of peeling the gate portion and the runner portion from the insulating substrate. FIGS. 4A and 4B are schematic diagrams for explaining the principle of the molding method of the present invention, and FIGS. 4A and 4B are diagrams for explaining the operation of peeling the gate portion and the runner portion from the insulating substrate. It is a schematic diagram for demonstrating the principle of the molding method of this invention, and is a figure which shows the modification of the loading method of a mold part. It is a schematic diagram for demonstrating the removal method of the unnecessary resin in the molding method of one Example by this invention, and is a figure which shows the structure of an unnecessary resin removal means. It is a schematic diagram for demonstrating the removal method of the unnecessary resin in the molding method of one Example by this invention, and is a top view which shows the structure of the wiring board immediately after sealing. It is a schematic diagram for demonstrating the removal method of the unnecessary resin in the molding method of one Example by this invention, and is a figure explaining the support method of a wiring board. It is a schematic diagram for demonstrating the removal method of the unnecessary resin in the molding method of one Example by this invention, and is a figure explaining the operation | movement which removes an unnecessary resin. It is a schematic diagram for demonstrating the removal method of the unnecessary resin in the molding method of one Example by this invention, and is a figure explaining the operation | movement which removes an unnecessary resin. It is a schematic diagram for demonstrating the removal method of the unnecessary resin in the molding method of one Example by this invention, and is a figure explaining the operation | movement which removes an unnecessary resin. It is a schematic diagram for demonstrating the removal method of the unnecessary resin in the molding method of one Example by this invention, and is a figure explaining the operation | movement which removes an unnecessary resin. It is a schematic diagram for demonstrating the removal method of the unnecessary resin in the molding method of one Example by this invention, and is a figure explaining the operation | movement which removes an unnecessary resin.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1A, 1B ... Reel 2 ... Wiring board 3 ... Loader part 4 ... Mold part 4A ... Molding means 4B ... Unnecessary resin removal means 401, 402 ... Molding die 403 ... Mold part load member 404 ... Runner part load member 405 ... Unnecessary resin Collecting means 406 ... tension adjusting roller 5 ... unloader part 6 ... semiconductor chip 7A ... mold part 7B ... gate part 7C ... runner part 7D ... cull part 8 ... crack 9 ... gripping mechanism

Claims (3)

A semiconductor chip mounted on a wiring board having a conductive pattern formed on a film-like insulating substrate is sealed with a transfer mold using a molding die, and then inside the gate, runner, and cull of the molding die. A mold method for separating and removing a cured mold material (hereinafter referred to as a gate part, a runner part, and a cull part, respectively) from a mold material for sealing the semiconductor chip (hereinafter referred to as a mold part),
Before sealing the semiconductor chip, a surface (hereinafter referred to as a first main surface) on which the semiconductor chip is mounted in a region overlapping the runner portion of the insulating substrate to a back surface (hereinafter referred to as a second main surface). Forming an opening that penetrates the
After sealing the semiconductor chip, a load is applied to the mold portion from the first main surface side of the insulating substrate, and a load is applied to the runner portion filled in the opening from the second main surface side of the insulating substrate. Over
The gate portion and the runner portion are peeled off from the insulating substrate at an angle defined by a region overlapping the mold portion of the insulating substrate and a region overlapping the gate portion and the runner portion. Mold method. A sealing means for sealing a semiconductor chip mounted on a wiring board having a conductor pattern formed on a film-like insulating substrate with a transfer mold using a molding die, and after the sealing means, the molding Mold material hardened inside the mold gate, runner, and cull (hereinafter referred to as gate portion, runner portion, and cull portion, respectively) is molded from the mold material that seals the semiconductor chip (hereinafter referred to as mold portion). A mold apparatus comprising a removing means for separating and removing,
The removing means includes a mold part load member that applies a load to the mold part from a surface of the insulating substrate on which the semiconductor chip is mounted (hereinafter referred to as a first main surface), and a back surface of the first main surface of the insulating substrate ( (Hereinafter, referred to as a second main surface) comprising a runner portion load member for applying a load to the runner portion, and a gripping mechanism for gripping the cull portion,
Before sealing the semiconductor chip with the sealing means, an opening that penetrates from the first main surface to the second main surface is formed in a region overlapping the runner portion of the insulating substrate,
The runner portion load member applies a load to the runner portion filled in the opening of the insulating substrate, and an angle formed between a region overlapping the mold portion of the insulating substrate and a region overlapping the gate portion and the runner portion. Is formed at a predetermined angle to peel off the gate portion and the runner portion from the insulating substrate.   A load surface that applies a load to the mold part that is continuous with the runner part by the gate part of the mold part load member includes an inclined part or a step that makes the mold part have a predetermined angle. The molding apparatus according to claim 2.

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