JP2005225059A - Method for manufacturing inkjet head, inkjet head and inkjet recording device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing an inkjet head, by which a nozzle with high ink discharge performance can be formed and a high yield output can be ensured. <P>SOLUTION: In this method, a process to form a recessed part 6b which becomes a first nozzle aperture part 6 by an anisotropic etching; a step to form an etching mask on the side surface and bottom surface of the recessed part 6b which becomes the first nozzle aperture part 6; a step to remove the etching mask formed on the bottom surface of the recessed part 6b which becomes the first nozzle aperture part 6; and a step to form a recessed part 7a which becomes a second nozzle aperture part 7 by performing an isotropic etching, starting with the part wherein the etching mask is removed, are provided. Also, the inkjet head and the inkjet recording device are provided. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an ink jet head manufacturing method, an ink jet head, and an ink jet recording apparatus.

  The ink jet recording apparatus has many advantages such as high-speed printing, extremely low noise during recording, high degree of freedom of ink, and use of inexpensive plain paper. In recent years, so-called ink-on-demand ink jet recording apparatuses, which eject ink droplets only when recording is necessary, have become mainstream among ink jet recording apparatuses. This ink-on-demand ink jet recording apparatus has an advantage that it does not require collection of ink droplets unnecessary for recording.

  As an ink-on-demand type ink jet recording apparatus, there is a so-called electrostatic driving type ink jet recording apparatus using electrostatic force as a driving means as a method of ejecting ink droplets. In addition, there are so-called piezoelectric drive type ink jet recording apparatuses that use piezoelectric elements (piezo elements) as driving means, and so-called bubble jet (registered trademark) type ink jet recording apparatuses that use heating elements and the like.

In the ink jet recording apparatus as described above, ink droplets are generally ejected from nozzles of an ink jet head. There are two types of ink jet heads in which nozzles are provided: a side eject type that ejects ink droplets from the side surface of the ink jet head, and a face eject type that ejects ink droplets from the surface side of the ink jet head.
In the face eject type ink jet head, it is desirable to adjust the thickness of the nozzle substrate so as to optimize the length of the nozzle by adjusting the flow resistance of the nozzle hole.

  In a conventional face ejection type nozzle (inkjet head) nozzle forming method, a first nozzle hole and a second nozzle having different inner diameters are formed by anisotropic dry etching using ICP discharge from one surface of a silicon substrate. After the holes are formed in two steps, the opposite surface is dug down by anisotropic wet etching to adjust the length of the nozzle (for example, see Patent Document 1).

In the conventional method of manufacturing a nozzle plate for an ink jet head of face eject type, after the silicon substrate is ground to a desired thickness, the first nozzle hole and the second nozzle hole are formed by dry etching on both sides of the silicon substrate. (For example, refer to Patent Document 2).
Japanese Patent Laid-Open No. 11-28820 (FIGS. 1 to 4) Japanese Patent Laid-Open No. 9-57981 (FIGS. 1 and 2)

  In the conventional nozzle forming method of an injection device and the manufacturing method of a nozzle plate for an inkjet head (see, for example, Patent Document 1 and Patent Document 2), patterning of an etching mask (silicon oxide film) during dry etching is performed by photolithography. It was. For this reason, if the alignment of the mask patterns of the first nozzle hole and the second nozzle hole is shifted during exposure, the central axes of the first nozzle hole and the second nozzle hole are shifted, and ink droplets are ejected. In this case, there is a problem in that the direction in which the ink droplets fly is bent and the ink ejection performance is deteriorated.

  Further, in a conventional method for manufacturing a nozzle plate for an ink jet head (see, for example, Patent Document 2), the silicon substrate is ground and thinned before the first nozzle hole and the second nozzle hole are formed by dry etching. There is a problem that the silicon substrate may be broken or chipped during the manufacturing process. Furthermore, this manufacturing method has a problem in that the manufacturing cost increases because the yield decreases.

  The present invention provides a method of manufacturing an ink jet head that can form nozzles with high ink discharge performance and has a high yield, an ink jet head manufactured by the method of manufacturing an ink jet head, and an ink jet recording apparatus equipped with the ink jet head. The purpose is to provide.

An ink jet head manufacturing method according to the present invention includes a nozzle substrate made of silicon subjected to predetermined processing and having a plurality of nozzles, and each nozzle includes at least a first nozzle hole portion and the first nozzle. A method of manufacturing an ink jet head having a second nozzle hole portion communicating with a hole portion, the step of forming a concave portion to be the first nozzle hole portion by anisotropic etching, and the first nozzle hole portion Forming an etching mask on the side surface and bottom surface of the recess, removing the etching mask formed on the bottom surface of the recess serving as the first nozzle hole portion, and isotropic etching from the removed portion of the etching mask And a step of forming a recess to be the second nozzle hole portion.
A concave portion that becomes the first nozzle hole portion is formed by anisotropic etching, and an etching mask is formed in the concave portion. Thereafter, the etching mask on the bottom surface of the concave portion is removed, and a concave portion serving as a second nozzle hole portion is formed therefrom by isotropic etching. For this reason, the central axes of the first nozzle hole portion and the second nozzle hole portion do not shift, and there is no variation in the direction in which the ink droplets fly when the ink droplets are discharged. Get higher.

The method for manufacturing an inkjet head according to the present invention is to manufacture a plurality of nozzle substrates from a single silicon substrate.
Since a plurality of nozzle substrates are manufactured from one silicon substrate, a large number of nozzle substrates can be manufactured, and the manufacturing cost can be reduced.

In addition, in the method of manufacturing an ink jet head according to the present invention, the nozzle penetrates the nozzle substrate by grinding the surface of the silicon substrate opposite to the surface where the concave portion serving as the first nozzle hole portion is formed. It is to make.
For example, after forming a concave portion to be a first nozzle hole portion and a concave portion to be a second nozzle hole portion on a silicon substrate, the opposite side of the surface on which the concave portion to be a first nozzle hole portion of the silicon substrate is formed The surface is ground so that the nozzle penetrates the nozzle substrate. As a result, a relatively thick silicon substrate can be used, and the silicon substrate can be prevented from cracking or chipping during manufacturing, and the yield can be increased.

In addition, the ink jet head manufacturing method according to the present invention forms a concave portion as a separation portion in the silicon substrate when performing the anisotropic etching and isotropic etching described above, and separates nozzles from the separation portion during grinding. The substrate is separated.
When performing anisotropic etching and isotropic etching, it is necessary to cut the silicon substrate by dicing in order to form a recess as a separation part in the silicon substrate and separate individual nozzle substrates from the separation part during grinding. The manufacturing process can be simplified and the manufacturing cost can be reduced.

In addition, in the method for manufacturing an ink jet head according to the present invention, a concave crater is formed on the silicon substrate, and a concave portion to be a first nozzle hole portion is formed in the crater portion.
In order to form the concave portion which becomes the first nozzle hole portion in the concave crater portion, for example, the peripheral portion of the nozzle is worn by contact with the printing paper, or the water repellent layer applied to the periphery of the nozzle is worn. It can be prevented from being trapped.

In the inkjet head manufacturing method according to the present invention, the etching mask is made of a silicon oxide film.
If an etching mask made of a silicon oxide film is formed, a highly accurate etching mask can be easily formed.

Moreover, the manufacturing method of the inkjet head which concerns on this invention forms said etching mask by thermal oxidation.
If the etching mask is formed by thermal oxidation, the etching mask can be easily formed as compared with CVD (Chemical Vapor Deposition) or the like.

In the method of manufacturing an ink jet head according to the present invention, the anisotropic etching is dry etching.
By forming the concave portion serving as the first nozzle hole portion by dry etching, a highly accurate concave portion can be formed in a short time.

In the inkjet head manufacturing method according to the present invention, the anisotropic etching is dry etching by ICP discharge.
By forming the concave portion serving as the first nozzle hole portion by dry etching using ICP (Inductively Coupled Plasma) discharge, a highly accurate concave portion can be formed in a short time.

In the ink jet head manufacturing method according to the present invention, the isotropic etching is dry etching.
By forming the concave portion to be the second nozzle hole portion by dry etching, the second nozzle hole portion having a diameter larger than that of the first nozzle hole portion can be formed with high accuracy in a short time.

An inkjet head according to the present invention is manufactured by any one of the above-described inkjet head manufacturing methods.
Since the ink jet head is manufactured by any one of the above-described ink jet head manufacturing methods, the center axis of the first nozzle hole portion and the second nozzle hole portion is not displaced, and the ink jet performance is high.

An ink jet recording apparatus according to the present invention is equipped with the above ink jet head.
Since the above-described ink jet head having high ink ejection performance is mounted, the ink jet recording apparatus has high printing performance.

Embodiment 1. FIG.
FIG. 1 is a longitudinal sectional view showing an ink jet head according to Embodiment 1 of the present invention. In FIG. 1, the drive circuit 21 is schematically shown. Further, in FIG. 1, as an example of the ink jet head, a face eject type ink jet head by an electrostatic driving method is shown.
The inkjet head 1 according to the first embodiment is mainly configured by bonding a cavity substrate 2, an electrode substrate 3, and a nozzle substrate 4. The nozzle substrate 4 is made of silicon, and for example, a nozzle 8 having a cylindrical first nozzle hole portion 6 and a bell-shaped second nozzle hole portion 7 is formed. The first nozzle hole portion 6 is formed on the ink discharge surface 10 (the surface opposite to the bonding surface 11 with the cavity substrate 2), and the second nozzle hole portion 7 is the first nozzle hole. The diameter communicates with the portion 6 and increases toward the joint surface 11.
The nozzle substrate 4 is preferably made of single crystal silicon so that predetermined processing described later can be easily performed.

  The cavity substrate 2 is made of, for example, single crystal silicon, and has a plurality of recesses serving as discharge chambers 13 whose bottom wall is the diaphragm 12. The plurality of discharge chambers 13 are formed side by side on the back side or the front side of the page in FIG. In addition, the cavity substrate 2 has a recess serving as a reservoir 14 for supplying a droplet of ink or the like to each discharge chamber 13 and a recess serving as a narrow groove-like orifice 15 that communicates the reservoir 14 with each discharge chamber 13. Is formed. Furthermore, an insulating film 16 made of silicon oxide is formed on the entire surface of the cavity substrate 2 by, for example, thermal oxidation. This insulating film 16 is provided in order to prevent dielectric breakdown or short circuit when the inkjet head 1 is driven.

  An electrode substrate 3 made of borosilicate glass, for example, is bonded to the cavity substrate 2 side of the cavity substrate 2. A plurality of electrodes 17 facing the diaphragm 12 are formed on the electrode substrate 3. The electrode 17 is formed, for example, by sputtering ITO (Indium Tin Oxide). In addition, an ink supply hole 18 communicating with the reservoir 14 is formed in the electrode substrate 3. The ink supply hole 18 is connected to a hole provided in the bottom wall of the reservoir 14 and is provided to supply droplets such as ink to the reservoir 14 from the outside.

In the first embodiment, a method for manufacturing the nozzle substrate 4 will be mainly described. In the nozzle substrate 4 shown in FIG. 1, a concave crater 20 is formed on the ink ejection surface. The crater 20 is formed at the position of the first nozzle hole portion 8. For example, when the printing paper and the nozzle substrate 4 come into contact with each other, the peripheral portion of the nozzle 8 is worn or applied to the peripheral portion of the nozzle 8. It is provided to prevent the water repellent layer from being worn away.
In the inkjet head according to the first embodiment, since the nozzle substrate 4 is manufactured by the manufacturing method described later, the central axes of the first nozzle hole portion 6 and the second nozzle hole portion 7 coincide with each other with high accuracy. Yes.

Here, the operation of the inkjet head shown in FIG. 1 will be described. A drive circuit 21 is connected to the cavity substrate 2 and each electrode 17. When a pulse voltage is applied between the cavity substrate 2 and the electrode 17 by the drive circuit 21, the diaphragm 12 bends toward the electrode 17, and droplets of ink or the like that have accumulated in the reservoir 14 enter the discharge chamber 13. Flows in. When the voltage applied between the cavity substrate 2 and the electrode 17 disappears, the diaphragm 12 returns to its original position, the pressure inside the discharge chamber 13 increases, and a droplet such as ink is discharged from the nozzle 8. Is done.
In the first embodiment, an electrostatic drive type ink jet head is shown as an example of the ink jet head. However, the ink jet head manufacturing method shown in the first embodiment includes a piezoelectric drive method, a bubble jet (registered trademark) method, and the like. It can also be applied to an inkjet head.

FIG. 2 is a top view of the nozzle substrate 4 as viewed from the ink ejection surface 10 side. As shown in FIG. 2, a plurality of first nozzle hole portions 6 are opened on the discharge surface 10 side of the nozzle substrate 4. The second nozzle hole portion 7 is formed on the back side of the paper surface of each first nozzle hole portion 6 in FIG. Further, the discharge chamber 13 of the cavity substrate 2 is formed for each of the first nozzle hole portions 6, and each discharge chamber 13 is elongated in the direction of the line AA in FIG.
Further, a concave crater 20 is formed around the first nozzle hole portion 6 of the ink discharge surface 10.

3 and 4 are longitudinal sectional views showing the manufacturing process of the inkjet head according to the first embodiment of the present invention. 3 and 4, only the peripheral portion of one nozzle substrate 4 of the silicon substrate 30 to be the nozzle substrate 4 is shown. Moreover, in FIG.3 and FIG.4, it has shown about the cross section along the AA of FIG.
First, for example, a silicon substrate 30 having a thickness of 525 μm is prepared, a resist 31 is applied to one surface of the silicon substrate 30, and a portion 20a to be the crater 20 is patterned (FIG. 3A). The surface to which the resist 31 is applied becomes the ink ejection surface 10 of the nozzle substrate 4 later.

  Then, using the resist 31 as an etching mask, the crater 20 having a depth of 5 μm is formed, for example, by dry etching (FIG. 3B). When the crater 20 is formed by dry etching, an ICP dry etching apparatus using ICP discharge or a RIE (Reactive Ion Etching) dry etching apparatus using a general parallel plate discharge can be used. This dry etching may be anisotropic etching or isotropic etching. Further, when forming the crater 20, wet etching with a potassium hydroxide aqueous solution or the like may be performed.

  Then, after all the resist 31 formed on the surface of the silicon substrate 30 is removed, the silicon substrate 30 is set in a thermal oxidation apparatus, and a silicon oxide film 32 having a thickness of 1 μm, for example, is uniformly formed on both surfaces of the silicon substrate 30. A film is formed (FIG. 3C). The silicon oxide film 32 is formed by, for example, thermal oxidation for 4 hours in an atmosphere of oxygen and water vapor at a temperature of 1075 ° C.

  Next, a resist (not shown) is applied to the surface on which the crater 20 is formed, and a portion 6a that becomes the first nozzle hole portion 6 and a portion 33a that becomes the separation portion 33 (described later) are patterned. At this time, the portion 6 a to be the first nozzle hole portion 6 is patterned on the crater 20. Then, for example, by etching the silicon oxide film 32 with a buffered hydrofluoric acid solution (mixed liquid of hydrofluoric acid aqueous solution and ammonium fluoride aqueous solution), a portion 6a that becomes the first nozzle hole portion 6 and a portion 33a that becomes the separation portion 33 The silicon oxide film 32 is removed (FIG. 3D). At this time, the silicon oxide film 32 on the surface opposite to the crater 20 is also removed. Thereafter, all the resist is removed.

Then, by dry etching by ICP discharge, anisotropic dry etching is performed vertically at a depth of 20 μm, for example, from the portion 6a that becomes the first nozzle hole portion 6 and the portion 33a that becomes the separation portion 33, and the first nozzle hole portion 6 and the part 33b of the separation part 33 are formed (FIG. 4E). CF ₂ and SF ₆ can be used alternately as an etching gas for this anisotropic dry etching. In this case, CF ₄ is used to protect the sides of the recesses as etching on the side surface direction of a portion 33b of the concave portion 6b and the separation unit 33 comprising a first nozzle hole portion 6 does not proceed, SF ₆ Is used to facilitate the vertical etching of these recesses.
In addition, the recessed part 6b used as the 1st nozzle hole part 6 and the part 33b of the isolation | separation part 33 can also be formed by anisotropic wet etching.

  Thereafter, a silicon oxide film having a thickness of, for example, 0.1 μm is uniformly formed as an etching mask on the side surface and the bottom surface of the concave portion 6b serving as the first nozzle hole portion 6 and the portion 33b of the separation portion 33 (FIG. 4F )). This silicon oxide film can be formed by setting the silicon substrate 30 in a thermal oxidation apparatus and performing thermal oxidation for 3 hours in a mixed atmosphere of oxygen and water vapor at a temperature of 1000 ° C. At this time, the silicon oxide film is also formed on other portions of the silicon substrate 30.

Next, dry etching by ICP discharge is performed using CF ₄ and SF ₆ as the etching gas in the same manner as in the process of FIG. 4E described above, so that the recesses 6b serving as the first nozzle hole portions 6 and the separation portions 33 are formed. While protecting the silicon oxide film on the side surface of the portion 33b, the silicon oxide film on the bottom surface of the concave portion 6b serving as the first nozzle hole portion 6 and the portion 33b of the separation portion 33 is removed.
Then, the etching gas is switched to only SF ₆ , and isotropic dry etching is performed from the bottom surface of the concave portion 6 b that becomes the first nozzle hole portion 6 and the part 33 b of the separation portion 33, thereby forming the second nozzle hole portion 7. The concave portion 7a and a part 33c of the separation portion 33 are formed (FIG. 4G). At this time, when the silicon substrate 30 having a large thickness (for example, having a thickness of 525 μm) is used as in the first embodiment, the silicon substrate 30 is separated from the concave portion 7a to be the second nozzle hole portion 7. A part 33c of the portion 33 becomes a spherical cavity (which may be slightly vertically long) as shown in FIG.
In addition, when a thin silicon substrate 30 is used, the concave portion 7 a that becomes the second nozzle hole portion 7 and the part 33 c of the separation portion 33 are formed on the crater 20 of the nozzle substrate 30. Reach the other side of the surface. In this case, the nozzle substrate 4 may be completed by peeling the silicon oxide film 32 from the silicon substrate 30 after the step of FIG. 4G and performing an ink repellent treatment or the like on the silicon substrate 30.
Note that the concave portion 7a to be the second nozzle hole portion 7 and a part 33c of the separation portion 33 may be formed by isotropic dry etching with XeF2 (xenon fluoride) or the like.

Then, after all the silicon oxide film formed on the surface of the silicon substrate 30 is peeled off with a hydrofluoric acid aqueous solution or the like, the surface opposite to the surface on which the concave portion 6b to be the first nozzle hole portion 6 is formed is ground. Thus, the silicon substrate 30 is thinned to a thickness of, for example, 70 μm (FIG. 4H). At this time, as shown in FIG. 4H, since the grinding is performed up to the concave portion 7a which becomes the second nozzle hole portion 7, the nozzle 8 penetrates the silicon substrate 30 (nozzle substrate 4). Further, since the grinding is performed up to the part 33 c of the separation part 33, the individual nozzle substrates 4 are separated from the separation part 33.
Finally, the nozzle substrate 4 is completed by forming an ink-resistant protective film made of a silicon oxide film or the like on each nozzle substrate 4 or applying an ink repellent treatment to the ink discharge surface 10.
Note that the individual nozzle substrates 4 may be separated by dicing in the process of FIG. 4H without forming the separation part 33 (part 33b of the separation part 33, part 33c of the separation part 33). For the reason that the manufacturing process can be simplified, it is desirable to form the separation portion 33.

In the first embodiment, the concave portion 6b to be the first nozzle hole portion 6 is formed by anisotropic etching, and after forming an etching mask in the concave portion 6b, the etching mask on the bottom surface of the concave portion 6b is removed, From there, a recess 7a to be the second nozzle hole portion 7 is formed by isotropic etching. For this reason, the central axes of the first nozzle hole portion 6 and the second nozzle hole portion 7 do not deviate, and there is no variation in the direction in which the ink droplets fly when ink droplets are discharged. Increases performance.
In addition, after forming the recess 6 b to be the first nozzle hole portion 6 and the recess 7 a to be the second nozzle hole portion 7 in the silicon substrate 30, the recess 6 b to be the first nozzle hole portion 6 of the silicon substrate 30 is formed. Since the surface opposite to the formed surface is ground so that the nozzle 8 penetrates the nozzle substrate 30, a relatively thick silicon substrate 30 can be used. 30 can be prevented from cracking or chipping, and the yield can be increased.

  In FIG. 1 of the first embodiment, an electrostatic drive type ink jet head is shown as an example of the ink jet head. However, the method of manufacturing the ink jet head shown in the first embodiment is characterized by the method of manufacturing the nozzle substrate. The present invention can also be applied to an inkjet head such as a piezoelectric drive system or a bubble jet (registered trademark) system.

Embodiment 2. FIG.
FIG. 5 is a view showing an example of an ink jet recording apparatus according to Embodiment 2 of the present invention. An ink jet recording apparatus 100 shown in FIG. 5 is an ink jet printer, and includes an ink jet head obtained by the ink jet head manufacturing method of the first embodiment. Since the inkjet head obtained by the inkjet head manufacturing method of Embodiment 1 includes a nozzle substrate with high ink ejection performance, the inkjet recording apparatus 100 of Embodiment 2 has high printing performance.

  In addition to the inkjet printer as shown in FIG. 5, the inkjet recording apparatus according to Embodiment 2 of the present invention includes an organic electroluminescence display apparatus manufacturing apparatus, a color filter manufacturing apparatus for a liquid crystal display apparatus, and a DNA device manufacturing process. There are devices.

1 is a longitudinal sectional view showing an inkjet head according to Embodiment 1 of the present invention. FIG. 4 is a top view of the nozzle substrate as viewed from the ink ejection surface side. FIG. 3 is a longitudinal sectional view showing a manufacturing process of the inkjet head according to the first embodiment. FIG. 4 is a longitudinal sectional view showing a manufacturing process that follows the manufacturing process of FIG. 3. FIG. 5 is a diagram illustrating an example of an ink jet recording apparatus according to a second embodiment of the invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Inkjet head, 2 cavity board | substrate, 3 electrode board | substrate, 4 nozzle board | substrate, 6 1st nozzle hole part, 7 2nd nozzle hole part, 8 nozzle, 10 ink discharge surface, 11 joint surface, 12 diaphragm, 13 discharge Chamber, 14 Reservoir, 15 Orifice, 16 Insulating film, 17 Electrode, 18 Ink supply hole, 20 Crater, 21 Drive circuit, 30 Silicon substrate, 100 Inkjet recording apparatus.

Claims (12)

A nozzle substrate made of silicon subjected to predetermined processing and having a plurality of nozzles, each nozzle being at least a first nozzle hole portion and a second nozzle hole portion communicating with the first nozzle hole portion A method of manufacturing an inkjet head having
Forming a recess to be the first nozzle hole portion by anisotropic etching; forming an etching mask on a side surface and a bottom surface of the recess to be the first nozzle hole portion; and the first nozzle hole. Removing the etching mask formed on the bottom surface of the concave portion to be a portion, and forming the concave portion to be the second nozzle hole portion by performing isotropic etching from the removed portion of the etching mask. A method for manufacturing an ink-jet head, comprising:   2. The method of manufacturing an ink jet head according to claim 1, wherein a plurality of nozzle substrates are manufactured from a single silicon substrate.   The said nozzle penetrates a nozzle board | substrate by grinding the surface on the opposite side to the surface in which the recessed part used as the 1st nozzle hole part of the said silicon substrate was formed. A method for manufacturing an inkjet head.   A concave portion serving as a separation portion is formed in the silicon substrate when the anisotropic etching and the isotropic etching are performed, and individual nozzle substrates are separated from the separation portion during the grinding. Item 4. A method for producing an inkjet head according to Item 3.   5. The method of manufacturing an ink jet head according to claim 2, wherein a concave crater is formed on the silicon substrate, and a concave portion to be the first nozzle hole portion is formed in the crater portion. .   The method of manufacturing an ink jet head according to claim 1, wherein the etching mask is made of a silicon oxide film.   The method of manufacturing an ink jet head according to claim 6, wherein the etching mask is formed by thermal oxidation.   The method for manufacturing an ink jet head according to claim 1, wherein the anisotropic etching is dry etching.   9. The method of manufacturing an ink jet head according to claim 8, wherein the anisotropic etching is dry etching by ICP discharge.   The method of manufacturing an ink jet head according to claim 1, wherein the isotropic etching is dry etching.   An ink jet head manufactured by the method for manufacturing an ink jet head according to claim 1. An ink jet recording apparatus comprising the ink jet head according to claim 11.

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