JP2005222961A - Logic plate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a logic plate of a device or the like of a fuel cell power generation system in which complicated piping, a part of components, and wiring or the like are built in a plate, and in which assembling is easier and safe, and downsizing of the device is realized. <P>SOLUTION: These are logic plates 1A, 1B formed by joining two sheets of plates 2, 3, while component equipment 11, 12, 26a, 26b of the device are arranged and installed on the surface of these logic plates 1A, 1B, a groove 8 to be flow passage of a fluid is formed at a joining face of the plate 2, and the logic plates 1A, 1B constituted in the equipment 11, 12, 26a, 26b by the groove 8 are made as a three-dimensional module 15 by integrally fixing in a state that their back faces are attached to each other. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a logic plate, and more specifically, to a logic plate such as a fixed unit in which piping / wiring and the like are incorporated in an apparatus and a unit and the like integrated so as to be assembled and transported.

  The prior art of the fuel cell power generation system will be described as an application example of a fixed unit in which piping and wiring are incorporated in the apparatus and a unit integrated so as to be assembled and transported.

  FIG. 40 shows an example of a flowchart of a conventional fuel cell power generation system. As shown in the figure, the liquid fuel 41 a such as methanol is vaporized by the vaporizer 42 using the exhaust heat of the reformer 49, heated by the heat exchanger 43, and then rich in hydrogen from the CO converter 46. Together with a part of the gas, it is introduced into the desulfurizer 44, and the sulfur content is removed. In the case of gaseous fuel 41b such as natural gas, the vaporizer 42 is bypassed and supplied directly to the heat exchanger 43. In the case of using a fuel having a low sulfur content, the desulfurization device 44 may be omitted. is there.

  The desulfurized fuel gas is heated by the heat exchanger 48 together with the water vapor 47 generated by the steam separator 45 and then sent to the reformer 49. The reformer 49 reforms the fuel gas to generate a hydrogen-rich reformed gas. After the temperature of the reformed gas emitted from the reformer 49 is lowered by the heat exchanger 50, the carbon monoxide in the reformed gas is changed to carbon dioxide in the CO converter 46.

  The reformed gas exiting the CO converter 46 is further lowered in temperature by the heat exchanger 51 and then introduced into the condenser 52, where unreacted water vapor is condensed and removed. The condensed water separated by the condenser 52 is sent to the steam separator 45 and again sent to the reformer 49 as water vapor 47. The reformed gas exiting the condenser 52 is heated by the heat exchanger 53 and then sent to the hydrogen electrode 55 of the fuel cell main body 54, and hydrogen in the reformed gas is used for the cell reaction.

  The fuel cell main body 54 includes a hydrogen electrode 55, an electrolyte 56, and an oxygen electrode 57. Hydrogen ions generated at the hydrogen electrode 55 move through the electrolyte 56 to reach the oxygen electrode 57, and are supplied as an oxidant. The temperature of 58 is raised by the heat exchanger 59, and the battery reaction is carried out with oxygen in the air 58 introduced into the oxygen electrode 57.

  The temperature of the exhaust gas from the oxygen electrode 57 is lowered by the heat exchanger 60, the produced water is condensed and removed by the condenser 61, and then discharged outside the system. The produced water here is also sent to the steam separator 45 and used as the water vapor 47. Since the cell reaction in the fuel cell main body 54 is an exothermic reaction, the fuel cell main body 54 and peripheral devices are generally provided with a cooling device 62 using water or air as a refrigerant.

  The fuel cell main body 54 generates DC power 63, which may be used as the DC power 63, or may be converted into AC power 65 by the inverter 64 and supplied to the load 66. .

  On the other hand, the exhaust gas containing unreacted hydrogen from the hydrogen electrode 55 of the fuel cell main body 54 is used together with the external air 68 as the heating fuel 67 of the reformer 49 which is an endothermic reaction through the flow divider 72, and the remaining exhaust gas is burner 73. After being processed, it is discharged. At this time, if the heated fuel 67 is insufficient, a part of the outlet gas of the desulfurizer 44 is used as the auxiliary fuel 76. Part of the combustion exhaust gas from the reformer 49 is used as a heat source for the vaporizer 42. Others, after the temperature is lowered by the heat exchanger 74, are sent to the condenser 75 to release the produced water into the atmosphere after separation, and the produced water is returned to the steam separator 45.

  Next, an outline of control in this fuel cell power generation system will be described. First, the flow rate of the reformed gas supplied to the fuel cell main body 54 is determined by detecting the load current with respect to the load 66 by the ammeter I, sending the signal to the control device 69, and based on the signal from the control device 69. Or it opens and closes 70b. Further, the supply amount of the water vapor 47 required for reforming the fuel gas is detected by the flow meter F, and the water vapor flow rate adjusting valve 71 is controlled to open and close by a signal from the control device 69. The temperature in the reformer 49 is constantly monitored by the temperature sensor T and controlled by the flow rate adjusting valves 71a and 70b of the fuels 41a and 41b.

Japanese Patent Publication No.49-13651

  As described above, the fuel cell power generation system is composed of many devices and parts having various functions, and some of them are exposed to high temperatures. In order for liquids or gas bodies of various properties, temperatures and pressures to continuously flow between these devices, large and small pipes are provided in a complicated manner vertically and horizontally. Furthermore, sensors and control devices for always operating the fuel cell system normally are also provided, and many wirings necessary for these are laid out. In particular, fuel cell power generation systems that are assembled and assembled to be transportable for the purpose of in-vehicle use, etc., are strongly required to reduce the size of the device. Therefore, a large number of devices, parts, piping, etc. are required in a narrow space. Efforts are being made to place in density.

  However, it is difficult to reduce the size of the apparatus by disposing the above-described constituent devices, sensors, control devices, and the like in a narrow space and connecting them with piping.

  Also, piping work in confined spaces is inefficient, time consuming, and requires a lot of time, and excessive piping in confined spaces can cause hydrogen and other fluids to leak from joints. There were many problems such as high.

  Therefore, in view of the circumstances as described above, the present invention incorporates complicated piping, some components, wiring, and the like in the plate, facilitating assembly, and making it possible to reduce the size of the device safely. It is an object to provide a logic plate for a battery power generation system device or the like.

  The logic plate of the first invention that solves the above-mentioned problems is a logic plate formed by joining two or more plates, and component devices or components of the apparatus are arranged on one or both surfaces of the logic plate. In addition, a groove serving as a fluid flow path is formed on the joint surface of the plate, and one or more logic plates configured to connect the devices or parts by the groove are provided, and the surface of the groove is anticorrosive. A layer is formed.

  The logic plate of the second invention is characterized in that in the logic plate of the first invention, an anticorrosion layer is also formed on the joint surface of the plate.

The logic plate of the third invention is the logic plate of the first or second invention.
The anticorrosion layer is formed by applying a fluororesin coating or a fluororesin lining.

The logic plate of the fourth invention is the logic plate of the first or second invention.
The anticorrosion layer is formed by performing an aluminum oxide film treatment.

  In addition, the logic plate of the fifth invention is a logic plate formed by joining two or more plates, and the constituent devices or parts of the apparatus are disposed on one or both surfaces of the logic plate, A groove serving as a fluid flow path is formed on the joint surface of the plate, and one or a plurality of logic plates configured to connect the devices or parts by the groove are provided, and a welding line surrounding the groove is formed. The plate is welded at a position, and the fluid flowing in the groove is sealed at the weld line portion.

  A logic plate according to a sixth aspect of the present invention is a logic plate formed by joining two or more plates. The component plate of the apparatus is arranged on one surface of the logic plate, and the plate In the state where a plurality of logic plates configured to connect the devices or parts by the grooves are formed on the joint surface of the liquid crystal, and the back surfaces of the plurality of logic plates are combined. The plurality of sets of logic plates are integrally fixed to form a three-dimensional module.

  According to a seventh aspect of the present invention, there is provided the logic plate according to the sixth aspect, wherein a heat insulating solid module is provided by interposing a heat insulating material between the back surfaces of the plurality of sets of logic plates.

  The logic plate according to an eighth aspect of the present invention is the logic plate according to the sixth aspect, wherein a heat insulating three-dimensional module is provided by interposing a spacing member between the back surfaces of the plurality of sets of logic plates.

  According to a ninth aspect of the invention, in the logic plate of the eighth aspect, a heat insulating material is interposed between the back surface of the plurality of sets of logic plates and the separating member.

  According to a tenth aspect of the present invention, there is provided a logic plate according to the sixth aspect, wherein constituent devices or parts of the device are interposed between the back surfaces of the plurality of sets of logic plates.

  The logic plate of the eleventh aspect of the invention is the logic plate of the tenth aspect of the invention, wherein a heat insulating material is interposed between the back surface of the plurality of sets of logic plates and components or parts interposed between the back surfaces. It is characterized by.

  A logic plate according to a twelfth aspect of the invention is a logic plate formed by joining two or more plates, wherein the component device or part of the apparatus is disposed on one surface of the logic plate, and the plate A plurality of logic plates configured to connect the devices or parts by the grooves are formed on the joint surface of the two, and the plurality of logic plates are provided on the same base with a heat insulation interval. It is characterized by being arranged above.

  According to a thirteenth aspect of the invention, in the logic plate of the twelfth aspect, a heat insulating material is interposed between the plurality of sets of logic plates and the mount.

  The logic plate according to the fourteenth aspect of the invention is a logic plate formed by joining two or more plates, and the component devices or parts of the apparatus are disposed on one or both surfaces of the logic plate, A high temperature in which a groove serving as a fluid flow path is formed on the joining surface of the plate, and one or more logic plates configured to connect the device or component by the groove are provided, and a high temperature device or component is disposed. A heat blocking groove is provided between the zone and the low temperature zone in which the low temperature equipment or parts are arranged.

  The logic plate of the fifteenth aspect of the invention is the logic plate of the fourteenth aspect of the invention, wherein the heat blocking groove is filled with a heat insulating material.

  According to a sixteenth aspect of the present invention, there is provided the logic plate according to the fourteenth aspect, wherein a coolant is caused to flow through the heat blocking groove.

  The logic plate according to the seventeenth aspect of the invention is a logic plate formed by joining two or more plates, and the components or components of the apparatus are disposed on one or both surfaces of the logic plate, Forming grooves that serve as fluid flow paths on the joint surfaces of the plates, and including one or more logic plates configured to connect the devices or components by the grooves, devices, components, and controls that constitute the device A device, electrical wiring or the like is incorporated in any or all of the plates.

  The logic plate according to the eighteenth aspect of the invention is a logic plate formed by joining two or more plates, and the component devices or parts of the apparatus are disposed on one or both surfaces of the logic plate. A groove serving as a fluid flow path is formed on the joint surface of the plate, and one or a plurality of logic plates configured to connect the devices or parts by the groove are provided, and part or all of the groove is corrosion resistant. It is characterized in that a pipe is housed and a corrosive fluid is allowed to flow through the corrosion-resistant pipe.

  According to a nineteenth aspect of the present invention, there is provided the logic plate according to the eighteenth aspect, wherein a material having flexibility is used as a material for the corrosion-resistant piping.

  Further, the logic plate of the twentieth aspect of the invention is the logic plate of the eighteenth or nineteenth aspect of the invention, wherein the end portion of the corrosion-resistant piping has a first joint member having a through hole with a conical surface formed on the inner peripheral surface, and an outer periphery. And a second joint member having a conical surface formed on the surface, the conical surface of the first joint member supports the outer diameter side of the end portion, and the conical surface of the second joint member has an inner diameter side of the end portion. It is characterized by being joined so as to support.

  According to a twenty-first aspect of the present invention, in the logic plate of the twentieth aspect, the first joining member is formed integrally with the plate.

  According to a twenty-second aspect of the invention, in the logic plate of the twentieth aspect, the second joining member is formed integrally with a device or a part.

  The logic plate of the twenty-third invention is the logic plate of the twentieth invention, wherein the first joining member is formed integrally with the plate, and the second joining member is formed integrally with a device or a part. And

  According to a twenty-fourth aspect of the invention, in the logic plate of the twentieth or twenty-second aspect, the first joining member is divided into a plurality of parts.

  In addition, the logic plate of the 25th invention is a logic plate formed by joining three or more plates, and the component devices or parts of the apparatus are disposed on one or both surfaces of the logic plate, A groove serving as a fluid flow path is formed on the joint surface of the plate, and one or more logic plates configured to connect the devices or parts by the groove are provided.

  The logic plate of the twenty-sixth invention is characterized in that, in the logic plate of the twenty-fifth invention, a plurality of stages of grooves formed on each plate joint surface are divided into a high temperature zone and a low temperature zone.

  The logic plate used in the fuel cell power generation system of the twenty-seventh aspect is a logic plate formed by joining two or more plates, and the surface of the fuel cell power generation system is attached to one or both surfaces of the logic plate. A component device or component is provided, and a groove serving as a fluid flow path is formed on the joint surface of the plate, and one or more logic plates configured to connect the device or component by the groove are provided. It is characterized by being configured.

  According to the logic plate of the first invention, it is a logic plate formed by joining two or more plates, and the constituent devices or parts of the apparatus are disposed on one or both surfaces of the logic plate, A groove serving as a fluid flow path is formed on the joint surface of the plate, and one or a plurality of logic plates configured to connect the devices or parts by the groove are provided, and a corrosion prevention layer is formed on the surface of the groove. Therefore, the flow path corresponding to the conventional piping is provided in the logic plate, and the entire apparatus such as the fuel cell power generation system can be easily modularized and can be downsized. Further, each component device or part is only assembled at a predetermined position, and there is no complicated piping work in a narrow space, so that the assembly work is easy and the work efficiency is increased. Furthermore, there is less seam and there is less risk of fluid leaking. And corrosion by the fluid which flows through a groove | channel can be prevented by a corrosion prevention layer, and the lifetime of a logic plate can be achieved.

  According to the logic plate of the second invention, in the logic plate of the first invention, the corrosion prevention layer is also formed on the bonding surface of the plate, so that the corrosion caused by the components in the adhesive joining the plates is prevented by the corrosion prevention layer. By preventing this, the life of the logic plate can be extended.

  In the logic plate of the third or fourth invention, the anticorrosion layer is formed by applying a fluororesin coating or a fluororesin lining in the logic plate of the first or second invention, or an aluminum oxide film treatment is applied. Therefore, the corrosion of the fluid flowing in the groove and the components in the adhesive can be prevented by the anticorrosive layer, and the life of the logic plate can be extended.

  Further, according to the logic plate of the fifth invention, the logic plate is formed by joining two or more plates, and the component devices or parts of the apparatus are disposed on one or both surfaces of the logic plate. In addition, a groove that forms a fluid flow path is formed on the joint surface of the plate, and one or a plurality of logic plates configured to connect the devices or parts by the groove are provided, and welding surrounding the periphery of the groove Since the plate is welded at the position of the wire and the fluid flowing in the groove is sealed at the weld line portion, the fluid can be reliably sealed.

  Further, according to the logic plate of the sixth aspect of the invention, a logic plate formed by joining two or more plates, on which one of the components of the apparatus or parts is disposed on the surface of the logic plate, A groove serving as a fluid flow path is formed on the joint surface of the plate, and a plurality of logic plates configured to connect the devices or parts by the groove are provided, and the back surfaces of the logic plates of the plurality of sets are combined. Since the three-dimensional module is formed by integrally fixing the plurality of sets of logic plates in a state, the device can be further downsized, the fluid flow path and the control system can be shortened, and the response is quick and easy to control. become.

  Further, according to the logic plate of the seventh invention, in the logic plate of the sixth invention, a heat insulating solid module is provided by interposing a heat insulating material between the back surfaces of the plurality of sets of logic plates. A low temperature device such as a control device can be disposed on another logic plate by approaching the disposed high temperature device.

  Further, according to the logic plate of the eighth invention, in the logic plate of the sixth invention, a high-temperature device is arranged by providing a heat insulating three-dimensional module by interposing a separating material between the back surfaces of the plurality of sets of logic plates. Since the provided high temperature side logic plate and the low temperature side logic plate provided with the low temperature device can be separated by the separating material, it is possible to avoid the influence of heat.

  According to the logic plate of the ninth invention, in the logic plate of the eighth invention, the heat insulating effect is further improved because the heat insulating material is interposed between the back surface of the plurality of sets of logic plates and the spacing member.

  Further, according to the logic plate of the tenth aspect of the invention, in the logic plate of the sixth aspect of the invention, since the constituent devices or parts of the apparatus are interposed between the back surfaces of the plurality of sets of logic plates, the space between the logic plates is effectively used. In addition, the apparatus can be further downsized. In addition, since the logic plates are separated by component devices or parts, a heat insulating effect can be expected.

  According to the logic plate of the eleventh aspect of the invention, in the logic plate of the tenth aspect of the invention, a heat insulating material is interposed between the back surface of the plurality of sets of logic plates and a component device or component interposed between the back surfaces. Therefore, the heat insulation effect becomes remarkable.

  According to the logic plate of the twelfth aspect of the present invention, a logic plate is formed by joining two or more plates, and the constituent devices or parts of the apparatus are disposed on any one surface of the logic plate, A groove serving as a fluid flow path is formed on the joint surface of the plate, and a plurality of logic plates configured to connect the devices or parts by the groove are provided, and the plurality of logic plates are kept at a heat insulating interval. Since these logic plates are arranged on the same mount, the influence of heat on each other can be ignored (prevented).

  According to the logic plate of the thirteenth aspect of the invention, in the logic plate of the twelfth aspect of the invention, since the heat insulating material is interposed between the plurality of sets of logic plates and the gantry, the heat insulating effect is further improved.

  Further, according to the logic plate of the fourteenth aspect of the present invention, a logic plate is formed by joining two or more plates, and component devices or parts of the apparatus are disposed on one or both surfaces of the logic plate. In addition, a groove serving as a fluid flow path is formed on the joint surface of the plate, and one or a plurality of logic plates configured to connect the device or component by the groove are provided, and a high temperature device or component is disposed. Since the heat insulation groove is provided between the high temperature zone and the low temperature zone where the low temperature equipment or parts are installed, the heat from the high temperature zone can be cut off so that the low temperature zone is not affected by heat. .

  According to the logic plate of the fifteenth aspect of the invention, in the logic plate of the fourteenth aspect of the invention, since the heat blocking groove is filled with a heat insulating material, the heat blocking effect between the high temperature zone and the low temperature zone is further increased.

  According to the logic plate of the sixteenth aspect of the invention, in the logic plate of the fourteenth aspect of the invention, since the refrigerant is caused to flow through the heat blocking groove, the heat blocking effect between the high temperature zone and the low temperature zone can be further increased. it can.

  According to the logic plate of the seventeenth aspect of the present invention, the logic plate is formed by joining two or more plates, and the component devices or parts of the device are disposed on one or both surfaces of the logic plate. In addition, a device that forms a device is provided with one or more logic plates configured to form a groove serving as a fluid flow path on the joint surface of the plate and to connect the device or component by the groove. In addition, since the control device or electric wiring is incorporated in any or all of the plates, the entire apparatus such as the fuel cell power generation system can be further downsized.

  According to the logic plate of the eighteenth aspect of the present invention, a logic plate is formed by joining two or more plates, and component devices or parts of the device are disposed on one or both surfaces of the logic plate. In addition, a groove serving as a fluid flow path is formed on the joint surface of the plate, and one or more logic plates configured to connect the devices or parts by the groove are provided, and a part or all of the groove is provided. Corrosion-resistant piping is housed and the corrosive fluid is made to flow through the corrosion-resistant piping, so even if there are many and complicated grooves (channels), it is easily corrosive without requiring advanced processing technology. Corrosion resistance to the fluid can be ensured. In addition, since corrosion-resistant piping made of a material that matches the properties of the corrosive fluid can be selected and used, the reliability of the corrosion resistance is improved. Moreover, since it is only necessary to perform the anticorrosion treatment (formation of the flow path by the corrosion-resistant piping) limited to the flow path of the corrosive fluid, the number of processing steps can be reduced and the logic plate can be provided at a low cost. Furthermore, when the corrosion resistance is deteriorated due to aging, the maintenance cost can be reduced because the corrosion resistance can be restored by replacing only the corrosion-resistant piping stored in the logic plate instead of replacing the logic plate. .

  According to the logic plate of the nineteenth aspect of the invention, in the logic plate of the eighteenth aspect, a material having flexibility is used as the material of the corrosion-resistant pipe, so that the corrosion-resistant pipe is integrated after the logic plate is integrated. Since it can be inserted into the groove or the corrosion-resistant piping can be replaced, workability can be improved.

  According to the logic plate of the twentieth aspect of the invention, in the logic plate of the eighteenth or nineteenth aspect of the invention, the end portion of the corrosion-resistant pipe is a first joining member having a through hole with a conical surface formed on the inner peripheral surface. And a second joint member having a conical surface formed on the outer peripheral surface, the conical surface of the first joint member supports the outer diameter side of the end, and the conical surface of the second joint member By joining so as to support the inner diameter side, the joining work of the corrosion-resistant piping can be easily performed, and the fluid leakage can be surely prevented.

  According to the logic plate of the twenty-first, twenty-second or twenty-third invention, in the logic plate of the twentieth invention, the first joining member is formed integrally with the plate, or the second joining member is a device. Alternatively, the number of parts is reduced by being formed integrally with a part, or the first joining member is formed integrally with a plate, and the second joining member is formed integrally with a device or part. Joining work is also easy.

  According to the logic plate of the twenty-fourth aspect of the invention, in the logic plate of the twentieth or twenty-second aspect of the invention, the first joining member is divided into a plurality of parts. When the route is complicated, the joining work efficiency can be improved.

  According to the logic plate of the twenty-fifth aspect of the present invention, there is provided a logic plate formed by joining three or more plates, and component devices or parts of the apparatus are disposed on one or both surfaces of the logic plate. In addition, a plurality of devices and parts are provided by forming one or a plurality of logic plates configured to form a groove serving as a fluid flow path on the joint surface of the plate and connect the devices or parts by the groove. Even when a large number of grooves are provided corresponding to the above, it is possible to simplify the arrangement of the grooves and arrange devices and parts in a compact manner.

  According to the logic plate of the twenty-sixth aspect of the invention, in the logic plate of the twenty-fifth aspect of the invention, the plurality of grooves formed on each plate joint surface are divided into a high temperature zone and a low temperature zone, so Can be eliminated.

  The logic plate used in the fuel cell power generation system of the twenty-seventh aspect is a logic plate (logic plate used in the fuel cell power generation system) formed by joining two or more plates. A component or part of the fuel cell power generation system is disposed on one or both surfaces, and a groove serving as a fluid flow path is formed on the joint surface of the plate, and the apparatus or component is connected by the groove. Since the logic plate configured as described above is provided with one set or a plurality of sets, the fuel cell power generation system can be downsized.

  Embodiments of the present invention will be described below in detail with reference to the drawings.

<Configuration>
FIG. 1 shows a configuration of a logic plate according to an embodiment of the present invention. Based on FIG. 1, the configuration of the logic plate according to the embodiment of the present invention will be described in detail by taking a fuel cell power generation system as an example.

  As shown in FIG. 1, the logic plate 1 is formed by joining a plate 2 and a plate 3 with an appropriate adhesive 4, and a fuel disposed on the surface (upper surface in FIG. 1) 3 a of the plate 3. Each component device and components (shown by a one-dot chain line in FIG. 1) including the component device 5 of the battery power generation system are integrally fixed together with the plates 2 and 3 by the studs 6 and nuts 7.

  And the joining surface (upper surface in FIG. 1) 2a of the plate 2 with the plate 3 has a predetermined cross-sectional area suitable for the velocity of the corresponding fluid, and the device 5 arranged on the surface 3a of the plate 3 or the like Grooves 8 are formed in appropriate lengths and directions corresponding to the positions of the piping ports of the components and parts. The groove 8 functions as a pipe through which liquid and gas necessary for the fuel cell power generation system flow. Therefore, the cross-sectional area of the groove 8 is determined from the properties of the flowing fluid, the flow velocity, the pressure loss, and the like, and the length and direction thereof are determined by the arrangement of components and components including the device 5 arranged on the plate 3.

  In FIG. 1, the groove 8 is provided on the plate 2 side, but the groove 8 may be provided on the plate 3 side. In other words, the groove 8 may be provided in the joint surface (lower surface in FIG. 1) 3a of the plate 3 with the plate 2. Although specific examples will be described later (see FIG. 3), each component device and component of the fuel cell power generation system is not limited to the surface 3a of the plate 3, but is disposed on the surface 2b (the lower surface in FIG. 1) 2b. May be. That is, each component device or component may be disposed on either the surface 2b of the plate 2 or the surface 3a of the plate 3, or may be disposed on both.

  The material of the plates 2 and 3 is not particularly limited, but the aluminum plate and the aluminum alloy plate are most effective for the purpose of reducing the weight for movement and the easiness of the processing of the groove 8. Due to the ease of molding, castings and the like are also effective. Further, the use of synthetic resin or the like as the material for the plates 2 and 3 can further reduce the weight.

  In the present embodiment, each component device or component such as the device 5 is mounted on the plate 3, and the stud bolt 6 is provided to tighten the plate 2 and the plate 3 to prevent leakage of fluid flowing in the groove 8. However, the fixing of the components and components on the plate 3 and the fixing of the plate 2 and the plate 3 may be performed by through bolts or other fixing means penetrating the plates 2 and 3. .

  The plate 3 is a flat plate having an appropriate thickness, and a bolt hole 9 for inserting the implantation bolt 6 and the like penetrates in a plate thickness direction at a predetermined position. Each component device and component such as the device 5 is formed with a through hole 37 through which the implantation bolt 6 is inserted. The plate 3 is also provided with communication holes 10 for allowing fluid to flow through the components 8 such as the device 5 attached to the surface 3 a and the parts 8 and the grooves 8 of the plate 2.

  In assembling the logic plate 1, first, the plate 2 and the plate 3 are bonded to each other through the adhesive 4. As the adhesive 4, a commercially available thermosetting adhesive is usually used, but depending on the type of fuel used in the fuel cell and the material of the plates 2 and 3, the plate 2 may be bonded by welding, brazing or welding. The method of joining 3 is also effective.

  Next, the planting bolt 6 is inserted into the bolt hole 9 of the plate 3 to be implanted into the plate 2, and the planted bolt 6 is inserted into the through hole 37 of the device 5, and then the nut 7 is screwed into the end of the planting bolt 6. As a result, the device 5 is fastened to the logic plate 1. For other components and parts, similar operations are sequentially performed to complete the assembly.

  FIG. 2 generally illustrates the structure of the logic plate from the cross-sectional structure. 2B is a cross-sectional view taken along line EE in FIG. The logic plate 1 shown in FIG. 2 is assembled by fixing the A device 11 and the B device 12, the plate 2, and the plate 3, for example, by fastening the nut 7 to the stud bolt 6.

  A fluid can flow between the A device 11 and the B device 12 by the grooves 8 formed in the plate 2 and the communication holes 10 processed in the plate 3. That is, the A device 11 and the B device 12 are connected by the groove 8. Since the plate 2 and the plate 3 are in close contact with each other by the adhesive 4, the fluid flowing in the groove 8 is sealed. Further, the space between the devices 11 and 12 and the plate 3 is sealed by an O-ring 13 or the like.

  FIG. 3 shows an example in which devices are arranged on both surfaces of the logic plate. In the logic plate 1 shown in FIG. 3, the devices 15 and 16 are disposed on the surface 3 a of the plate 3, and the devices 106 and 107 are disposed on the surface 2 b of the plate 2. Grooves 8A, 8B, 8C serving as liquid flow paths are formed on the joint surface 2a of the plate 2, and these grooves 8A, 8B, 8C and the devices 105, 106, 107, 108 are formed on the plate 2 and the plate 3. A communication hole 10 is formed to communicate with the. That is, the plate 105 side device 105 and the plate 2 side device 107 are connected by the groove 8A, the plate 2 side device 107 and 108 are connected by the groove 8B, and the plate 3 side device 106 and the plate 2 side device 108 are connected. Are connected by a groove 8C.

  In addition, although illustration is abbreviate | omitted, an apparatus and components are not provided in the surface 3a of the plate 3, but an apparatus and components can also be arrange | positioned only on the surface 2b of the plate 2. FIG.

  FIG. 4 shows an example of a logic plate on which a corrosion treatment layer is formed by performing a surface treatment. In addition, FIG.4 (b) is FF arrow directional cross-sectional view of Fig.4 (a). In the logic plate 1 shown in FIG. 4, the bonding surfaces (adhesion surfaces) 2a and 3b of the plate 2 and the plate 3, the groove 8 serving as a fluid flow path, and the surface of the communication hole 10 are coated with fluorine resin such as polytetrafluoroethylene or the like. The anticorrosion layer 29 is formed by applying a fluororesin lining or an aluminum oxide film treatment. By forming the anticorrosion layer 29 in this manner, corrosion due to the fluid flowing in the grooves 8 and the communication holes 10 and components in the adhesive 4 can be prevented, and the life of the logic plate 1 can be extended. it can.

  5 and 6 show an example in which the plate 2 and the plate 3 are welded. 6 is a cross-sectional view taken along line AA in FIG. As shown by a solid line in FIG. 5, along the groove 8 formed in the plate 2, a welding line 30 surrounding the periphery of the groove 8 with an appropriate distance from the groove 8 is applied to the hybrid welding method of electromagnetic force control. The plate 2 and the plate 3 are sequentially welded in a state where they are held with a strong pressure. As a result, as shown in FIG. 6, the plate 2 and the plate 3 are welded at the position of the weld line 30, and the fluid flowing in the groove 8 can be reliably sealed at the weld line 30 portion.

  FIG. 7 shows an example of a three-dimensional module as an application example of the logic plate. The solid module 15 shown in FIG. 7 is a state in which the back surfaces of the two logic plates 1A and 1B are combined, that is, the surface 2b of the plate 2 in one logic plate 1A and the surface 2b of the plate 2 in the other logic plate 1B. And the through bolts 14 are inserted into the through holes 101 penetrating these two sets of logic plates 1A, 1B (entire plates 2 and 3), and nuts 102 are provided at both ends of the through bolts 14. It is three-dimensionalized by screwing and fixing two sets of logic plates 1A and 1B integrally.

  In FIG. 7, the auxiliary parts or auxiliary devices 26a, 26b, etc. are arranged on the lower logic plate 1B in the drawing so that they are located on the back of the devices 11, 12 provided on the upper logic plate 1A in the drawing. It is three-dimensional, and this can greatly reduce the size.

  In the logic plate 1, when devices and parts are not arranged on the surface 3 a of the plate 3 and devices and parts are arranged on the surface 2 b of the plate 2, the surface 3 a of the plate 3 is of course the surface of the logic plate 1. This is the back surface, and this surface is the connection surface with the other logic plate 1.

  In FIG. 7, two sets of logic plates 1A and 1B are integrated. However, of course, the present invention is not limited to this, and the backs of arbitrary plural sets of logic plates such as three sets and four sets are combined. The plurality of sets of logic plates may be integrated (three-dimensional).

  For example, in the example of the three-dimensional module 15A shown in FIG. 8, a relatively large logic plate 1A on which the devices 109, 110, 111, and 112 are disposed is disposed on the upper side in the drawing, and the devices 113 and 114, the devices 115 and 116, and the devices A relatively small logic plate 1B, 1C, 1D having 117 and 118 disposed thereon is arranged on the lower side in the figure, and the back surfaces 2b of these four sets of logic plates 1A, 1B, 1C, 1D are combined. The four sets of logic plates 1A, 1B, 1C, and 1D are integrally fixed to form a solid body.

  Further, in the example of the three-dimensional module 15B shown in FIG. 9, the large and small logic plates 1A, 1B, and 1C in which the devices 119 and 120, the devices 121 and 122, and the devices 123 and 124 are respectively arranged are arranged on the upper side in the drawing. The large and small logic plates 1D and 1E on which the devices 125 and 126 and the devices 127, 128 and 129 are respectively arranged are arranged on the lower side in the figure, and the five sets of the logic plates 1A, 1B, 1C, 1D and 1E are arranged. The five sets of logic plates 1A, 1B, 1C, 1D, and 1E are integrally fixed in a state in which the back surfaces 2b are combined with each other to form a three-dimensional shape.

  FIG. 10 shows an example of a heat insulating solid module as an application example of the logic plate. The heat insulating solid module 18A shown in FIG. 10 has two sets of logic plates 1A and 1B, the back surfaces (surfaces of the plates 2 of the logic plates 1A and 1B) 2b aligned with each other, and an appropriate heat insulating material between the back surfaces 2b. With the 16a and the like interposed, the through bolts 17 are inserted into the through holes 103 penetrating these two sets of logic plates 1A and 1B (plates 2 and 3 as a whole), and both ends of the through bolts 17 are insulated. By screwing the nut 104 through the material 16b, the two logic plates 1A and 1B are integrally fixed and three-dimensionalized.

  In this heat insulation three-dimensional module 18A, two sets of logic plates 1A and 1B are joined via heat insulation materials 16a and 16b, so that the heat insulation layer is provided. Therefore, the high temperature apparatus 27a disposed on the upper logic plate 1A in the figure. , 27b can be prevented from being transmitted to the lower logic plate 1B in the figure, so that the other low temperature devices 28a, 28b are placed on the logic plate 1B in the vicinity of the high temperature device 27a27b disposed on the logic plate 1A. It can be arranged.

  In this case as well, the present invention is not limited to the two sets of logic plates 1A and 1B, and an arbitrary plurality of sets of logic plates can be integrated. For example, although illustration is omitted, a heat insulating material is interposed between the back surface 2b of the logic plate 1A and the logic plates 1B, 1C, 1D shown in FIG. 8, or the logic plates 1A, 1B, 1C and the logic shown in FIG. A heat insulating material may be interposed between the back surfaces 2b of the plates 1D and 1E.

  FIG. 11 shows another example of the heat insulating solid module as an application example of the logic plate 1. The heat-insulating solid module 18B shown in FIG. 11 aligns the back surfaces (surfaces of the plates 2 of the logic plates 1A and 1B) 2b of the two sets of logic plates 1 and separates the back surfaces 2b with an appropriate length. Two sets of logic plates 1 </ b> A and 1 </ b> B are integrally connected and fixed by the spacing member 31 through a material 31 to form a three-dimensional structure. Further, a heat insulating material 130 is interposed between the separating material 31 and the logic plates 1A and 1B.

  In this heat insulation three-dimensional module 18B, a high temperature part (high temperature equipment 27a, 27b) and a low temperature part (low temperature equipment 28a, 28b) are maintained by maintaining an appropriate distance between the two sets of logic plates 1A, 1B by the separating material 31. The apparatus can be three-dimensionalized and miniaturized at the same time. Further, by providing the heat insulating material 130 between the logic plates 1A and 1B and the separating material 31, the heat insulating effect can be further increased.

  That is, it is not always necessary to provide the heat insulating material 130 as long as a sufficient heat insulating effect can be obtained only by providing the separating material 31, but if the heat transmitted through the separating material 31 needs to be cut off, the separating material 31 is not provided. A heat insulating material 130 is interposed between the material 31 and the logic plates 1A and 1B. Note that the heat insulating material 130 may be provided only between one of the spacing member 31 and the logic plate 1A or between the spacing member 31 and the logic plate 1B.

  Also in this case, the present invention is not limited to the two sets of logic plates 1A and 1B, and an arbitrary plurality of sets of logic plates can be integrated. For example, in the example of the heat insulating solid module 18B shown in FIG. 12, a relatively large logic plate 1A provided with high temperature devices 131a, 131b, 132a, 132b is arranged on the upper side in the drawing, and the low temperature devices 133a, 133b and the low temperature device 134a are arranged. , 134b and relatively small logic plates 1B, 1C are arranged on the lower side in the figure, the back surfaces 2b of these three sets of logic plates 1A, 1B, 1C are combined, and the back surfaces 2b Three pairs of logic plates 1A, 1B, and 1C are integrally connected and fixed by the spacing member 31 with a spacing member 31 interposed therebetween to form a three-dimensional structure.

  FIG. 13 shows an example in which a device is interposed between the logic plates in place of the separating member. In the three-dimensional module 18C shown in FIG. 13, in the three-dimensional module 18B shown in FIG. 11, the devices 139 and 140 are interposed between the back surfaces 2b of the logic plates 1A and 1B in place of the separating material 31. In addition, although illustration is abbreviate | omitted, you may make it connect these apparatuses 139 and 140 also by the groove | channel provided in the logic plate 1A or the logic plate 1B.

  Also in this case, since the devices 139 and 140 separate the logic plates 1A and 1B as in the case where the separating material 31 is interposed, a heat insulating effect can be expected. In particular, a remarkable heat insulating effect can be obtained by interposing the heat insulating material 130 between the devices 139 and 140 and the logic plates 1A and 1B as shown in the figure. In addition, in this case, by arranging the devices 139 and 140 between the logic plates 1A and 1B, since the space between the logic plates 1A and 1B is effectively used, the apparatus can be further downsized.

  Also in this case, of course, the present invention is not limited to the two sets of logic plates 1A and 1B, and an arbitrary plurality of sets of logic plates can be integrated. For example, in the heat-insulating solid module 18B shown in FIG. 12, constituent devices and parts may be interposed instead of the spacer 31.

  FIG. 14 shows an example in which a plurality of sets of logic plates are arranged on the same frame as an application example of the logic plate. In FIG. 14, the logic plate 1A in which the high temperature devices 27a and 27b are arranged and the logic plate 1B in which the low temperature devices 28a and 28b are arranged are arranged on the same base 32 with an appropriate heat insulation interval L. . The logic plates 1A and 1B are fixed to the gantry 32 by appropriate fixing means such as bolts or welding not shown. Further, a heat insulating material 145 is interposed between the logic plates 1A and 1B and the gantry 32.

  By arranging the two logic plates 1A and 1B while keeping the heat insulation interval L in this way, these logic plates 1 can ignore (prevent) the thermal effects of each other. Further, by providing a heat insulating material 145 between the logic plates 1A and 1B and the gantry 32, the heat insulating effect can be further enhanced.

  Also in this case, of course, the present invention is not limited to the two sets of logic plates 1A and 1B, and an arbitrary plurality of sets of logic plates can be arranged on the same frame. For example, in the example shown in FIG. 15, four sets of logic plates 1A, 1B, 1C, and 1D, that is, a logic plate 1A in which high-temperature devices 141a and 141b are arranged, and a logic plate 1B in which low-temperature devices 142a and 142b are arranged. In addition, the logic plate 1C in which the high temperature devices 143a and 143b are arranged and the logic plate 1D in which the low temperature devices 144a and 144b are arranged are arranged on the same frame 32 with a heat insulation interval L maintained.

  16 and 17 show an example in which a high temperature device and a low temperature device are arranged on the same logic plate. 17 is a cross-sectional view taken along line BB in FIG. In the logic plate 1 shown in FIGS. 16 and 17, a high temperature zone in which high temperature devices and parts such as the high temperature devices 33a, 33b, and 33c are arranged on the same logic plate 1, and low temperatures such as the low temperature devices 34a and 34b. A heat blocking groove 35 is provided between the low temperature zone in which the devices and parts are arranged. The heat blocking groove 35 is formed in the plate 2, and the communication hole 36 communicating with both ends of the heat blocking groove 35 is formed in the plate 3.

  According to this logic plate 1, the heat blocking groove 35 forms a heat insulating layer made of air, and becomes a large resistance of heat conduction from the high temperature zone to the low temperature zone. Therefore, even if the low temperature devices 34a, 34b, etc. are disposed in the same logic plate 1 in the vicinity of the high temperature devices 33a, 33b, 33c, etc., they are not affected by the heat.

  In addition, filling the heat blocking groove 35 with an appropriate heat insulating material is also an effective means for preventing thermal influence.

  Further, in order to increase the effect of the heat blocking groove 35, one of the communication holes 36 provided at both ends of the heat blocking groove 35 is changed from one communication hole 36 to the other by a refrigerant reflux means (not shown). The cooling hole 35 may be cooled by flowing a coolant such as cooling air or cooling water toward the communication hole 36.

  18, 19, and 20 show examples in which parts such as a solenoid valve 19, a control device 20 such as a printed chip, an electric wiring 21, and the like are built in the logic plate 1 to save space. 19 is a cross-sectional view taken along the line CC of FIG. 18, and FIG. 20 is a cross-sectional view taken along the line DD of FIG.

  As shown in these drawings, the C device 22 and the D device 23 arranged on the logic plate 1 are connected by a groove 8 provided on the plate 2, and the fluid flowing through the groove 8 is embedded in the plate 3. Detected by the pressure sensor 25a, the detection signal of the pressure sensor 25a is transmitted to the control device 20 embedded in the plate 3, and from the control device 20 to the plate 3 via the electric wiring 21 embedded in the plate 3. The electromagnetic valve 19 is actuated by transmitting a control signal to the embedded electromagnetic valve 19. Similarly, a flow rate sensor 25b for detecting the flow rate of the fluid flowing in the groove 8 and a temperature sensor 25c for detecting the temperature of the fluid are also embedded in the plate 3, and detection signals of these sensors 25b and 25c are also electrically wired (not shown). Are taken into the control device 20 via

  Thus, by incorporating the solenoid valve 19, the control device 20, the electrical wiring 21, and the like in the logic plate 1, further space saving can be achieved. Electrical components such as switches may also be built in the logic plate 1. Note that a printed chip (printed circuit board) that can be embedded in the plate 3 is preferably used as the control device 20. Also, some components can be built in the plate 2. In this case, it is preferable that the plate 3 be an opening for assembly and inspection of parts. That is, equipment, parts, control equipment, electrical wiring, or the like constituting the apparatus may be built in either one of the plates 2 and 3 or may be built in both the plates 2 and 3.

  By the way, as described above, in a fuel cell power generation system or the like, there are a wide variety of fluids flowing through the groove 8 serving as the flow path, and high-temperature and low-temperature fluids, and those containing corrosive substances. There is also. In particular, for a fluid containing a corrosive substance (hereinafter referred to as “corrosive fluid”), special consideration is required for the flow path. Therefore, in the above, as described with reference to FIG. 4, the surface of the groove 8 or the like is subjected to fluorine resin coating such as polytetrafluoroethylene or fluorine resin lining, or an aluminum oxide film treatment to form the anticorrosion layer 29. Thus, the grooves 8 and the like have corrosion resistance against the corrosive fluid.

  However, the technique of providing this anticorrosion layer may be difficult to apply when the arrangement of the grooves 8 (flow paths) is complicated. That is, in the unit of the fuel cell power generation system composed of a large number of devices and parts as shown in FIG. 40, the large number of devices and parts are connected by the grooves 8, and small devices such as valves, sensors, switches For example, as shown in FIG. 21, the number of grooves 8 is very large, and some of the grooves 8 (channels) are used to prevent interference between the grooves 8. ) Must be bypassed. For this reason, many grooves 8 (flow paths) are intricately interlaced and often have a maze-like state.

  The operation of applying such a fluororesin coating or fluororesin lining or an aluminum oxide film treatment to the groove 8 requires a high level of processing technique and requires a large number of processing steps. Furthermore, if the groove 8 (flow path) has a complicated shape, there may be a case where the accuracy and reliability of the product are questioned. Therefore, in such a case, it is effective to provide a corrosion-resistant pipe instead of forming the corrosion-resistant layer 29 in the groove 8.

  FIG. 22 is a configuration diagram of a logic plate provided with corrosion-resistant piping. 23 (a) is an enlarged plan view of the G part in FIG. 22, FIG. 23 (b) is a sectional view taken along line HH in FIG. 23 (a), and FIG. 24 (a) is an enlarged plan view of the I part in FIG. FIG. 24B is a cross-sectional view taken along line JJ in FIG. 25 is a sectional structural view of the logic plate, and FIG. 26 is an enlarged sectional view taken along the line KK in FIG.

  The logic plate 1 shown in FIG. 22 is configured by joining a plate 2 and a plate 3 with an adhesive 4 or the like. Grooves 8 are formed in the joining surface of the plate 2 and the plate 3 (the upper surface 2a of the plate 2 in the illustrated example). And, on the upper surface 3a of the plate 3 (that is, the surface of the logic plate 1), various components 191 and parts 192 (also indicated by a one-dot chain line in FIG. 22) constituting the fuel cell power generation system are arranged. These devices 191 and parts 192 are connected to the grooves 8 through the communication holes 10 formed in the plate 3. As a result, the device 191 and the component 192 are connected by the groove 8. The device 191 or the part 192 and the plate 3 are sealed with a sealing material such as an O-ring (not shown). These structures are the same as those of the logic plate 1 shown in FIG.

  In the logic plate 1 shown in FIG. 22, the cross-sectional area of the groove 8 through which the corrosive fluid flows is made larger than the required cross-sectional area when the fluid flows directly into the groove 8. By accommodating a corrosion-resistant pipe 151 such as a fluororesin pipe made of fluoroethylene or the like, the corrosion-resistant pipe 151 is used as a flow path for the corrosive fluid. The corrosion-resistant pipe 151 is not limited to a fluororesin pipe, and pipes made of other corrosion-resistant materials (vinyl chloride, synthetic rubber, other synthetic resins, etc.) may be used according to the nature of the corrosive fluid. Good. However, since the corrosion resistant pipe 151 may be inserted into the predetermined groove 8 after the logic plate 1 is integrated or the corrosion resistant pipe 151 may be replaced, the material of the corrosion resistant pipe 151 is flexible. It is preferable to select one.

  Both end portions of the corrosion-resistant pipe 151 accommodated in the groove 8 are joined by a metal receiver 152 as a first joining member and a top-piece part 153 as a second joining member. The top piece 153 has a truncated cone-shaped main body (joint) 153b having a conical surface 153a formed on the outer peripheral surface, and a head 153c on the main body 153b. The shape is like a top.

  As shown in FIG. 23 and FIG. 24, the receiving metal 152 uses a single receiving metal 152 for one corrosion-resistant pipe 151 (FIG. 23) or a plurality (two in the illustrated example) of corrosion resistance. There is a case where a single receiving member 152 is used for the pipe 151. These receivers 152 are fitted into fitting holes 3 f provided in the plate 3 and fixed to the plate 2 with screws 155. A stepped portion 152a is formed on the outer peripheral surface of the receiver 152, and the stepped portion 152a comes into contact with a stepped portion 3g formed on the inner peripheral surface of the fitting hole 3f. A through hole 152b is formed in the central portion of the receiver 152, and a conical surface 152c is formed on a part of the inner peripheral surface of the through hole 152b. Furthermore, a step portion 152d is formed on the upper portion of the conical surface 152c by further widening the inner peripheral surface of the through hole 152b. Further, the money receiver 152 is divided into two at the dividing line position.

  Then, both ends of the corrosion-resistant pipe 151 are joined (fixed) by the receiver 152 and the top-of-the-piece parts 153 as shown in FIGS. That is, the end of the corrosion-resistant pipe 151 is inserted into the through-hole 152b of the receiver 152, and the main body 153b of the top piece 153 is inserted into the end of the corrosion-resistant pipe 151 and pressurized. The conical surface 153 a of the portion 153 b pushes the end of the corrosion-resistant pipe 152, and the conical surface 153 a of the main body 153 b is fitted to the conical surface 152 c of the receiver 152. As a result, the end portion of the corrosion-resistant pipe 151 is joined (fixed) in a state where the outer diameter side is supported by the conical surface 152c of the receiver 152 and the inner diameter side is supported by the conical surface 153a of the top piece 153. At this time, the head portion 153 c of the top-shaped component 153 is fitted into the step portion 152 d of the receiver 152. Thus, it is possible to prevent the corrosive fluid from flowing between the device 191 and the component 192 in the corrosion-resistant pipe 151 and leaking from the end of the corrosion-resistant pipe 151 at this time.

  In addition, it is usually preferable to form the receiver 152 integrally. However, when the corrosion-resistant pipe 151 made of a highly rigid material is used, the end of the corrosion-resistant pipe 151 is in a collapsed state as shown in FIG. When joining a plurality of corrosion-resistant pipes 151 with a single metal receiver 152, the end directions of the corrosion-resistant pipes 151 are not aligned. Difficult to join (There is also a method of cutting the end of the corrosion-resistant pipe 151 after making the corrosion-resistant pipe 151 long and inserting it into the receiver 152, but it is difficult because the cutting position is inside the receiver 152. Will be a difficult task) In such a case, the receiving member 152 is divided into two as in this embodiment, and after the one-side receiving member 152 is first inserted into the fitting hole 3f, the remaining one-side receiving member 152 is inserted into the fitting hole. By inserting in 3f, joining work efficiency improves. In this case, the number of divisions of the receipt 152 is not limited to two, and may be three or more.

  28 and 29 show another example of joining the end of the corrosion-resistant pipe 151. FIG. These are useful when the piping path (groove 8) is simple or when a corrosion-resistant piping 151 made of a material having low rigidity is used.

  The logic plate 1 shown in FIG. 28 has a configuration in which the metal receiver 152 and the plate 3 shown in FIG. 26 are integrally formed. That is, a through hole 3c is formed in the plate 3, and a conical surface 3d is formed on a part of the inner peripheral surface of the through hole 3c. A step portion 3e is formed on the upper portion of the conical surface 3d by further widening the inner peripheral surface of the through hole 3c.

  In this case, the end portion of the corrosion-resistant pipe 151 is inserted into the through hole 3c of the plate 3, and the body portion 153b of the top-piece part 153 is inserted into the end portion of the corrosion-resistant pipe 151 and pressurized. Then, the end portion of the corrosion-resistant pipe 152 is expanded by the conical surface 153a of the main body portion 153b, and the conical surface 153a of the main body portion 153b is fitted to the conical surface 3d of the plate 3. At this time, the head 153 c of the top-shaped part 153 is fitted into the step 3 e of the plate 3. Thus, the end portion of the corrosion-resistant pipe 151 is firmly joined so that the fluid does not leak in a state where the outer diameter side is supported by the conical surface 3d of the plate 3 and the inner diameter side is supported by the conical surface 153a of the top piece 153. The

  The logic plate 1 shown in FIG. 29 has a configuration in which the metal receiver 152 and the plate 3 shown in FIG. 26 are integrally formed, and the self-form component 153 and the device 191 or the component 192 are integrally formed. That is, a through hole 3c is formed in the plate 3, a conical surface 3d is formed on a part of the inner peripheral surface of the through hole 3c, and a conical surface is formed on the lower surface of the device 191 or the component 192. A frustoconical joint 154 having a surface 154 a is formed integrally with the device 191 or the part 192.

  In this case, the end of the corrosion-resistant pipe 151 is inserted into the through hole 3c of the plate 3, and the joint 154 of the device 191 or the component 192 is inserted into the end of the corrosion-resistant pipe 151 and pressurized. Thus, the end portion of the corrosion-resistant pipe 152 is expanded by the conical surface 154 a of the joint portion 154, and the conical surface 154 a of the joint portion 154 is fitted to the conical surface 3 d of the plate 3. Thus, the end of the corrosion-resistant pipe 151 is firmly joined so that the fluid does not leak while the outer diameter side is supported by the conical surface 3d of the plate 3 and the inner diameter side is supported by the conical surface 154a of the joint portion 154. .

  Further, as described above, in the unit of the fuel cell power generation system configured by a large number of devices and parts as shown in FIG. 40, since the large number of devices and parts are connected by the grooves 8, for example, FIG. As shown in FIG. 4, the number of the grooves 8 becomes very large, and some of the grooves 8 need to be largely detoured in order to avoid the intersection and contact between the grooves 8 and 8. In addition, these grooves 8 (flow paths) are designed by calculating their cross-sectional areas so as to ensure an appropriate flow rate according to the application. Accordingly, there is a case where the wide groove 8 is required. In this case, it is necessary to secure a sufficient space for forming the wide groove 8. Furthermore, since some of the fluids flowing through these grooves 8 (flow paths) have different temperatures, it is necessary to ensure an appropriate separation dimension so as not to affect each other.

  For this reason, the groove 8 (flow path) becomes complicated and often has to be arranged like a maze. In this case, the design and production (processing of the groove) of the logic plate becomes complicated. In some cases, the size of the plate, that is, the size of the logic plate becomes very large in order to bypass the groove 8 or widen the width of the groove 8. Therefore, hereinafter, even in such a case, a configuration of a three-dimensional logic plate capable of simplifying the arrangement of the grooves 8 (flow paths) and making them compact will be described with reference to FIGS. 30 to 35.

  30 is a configuration diagram of a three-dimensional logic plate, FIG. 31 is a sectional view taken along line MM in FIG. 30, FIG. 32 is a sectional view taken along line NN in FIG. 30, and FIG. FIG. 34 is a cross-sectional view taken along the line OO in FIG. 33, and FIG. 35 is a cross-sectional view taken along the line P-P in FIG.

  In FIG. 30, an intermediate plate 161 is provided between the plate 2 and the plate 3, and these three plates 2, 3, 161 are joined and integrated with an adhesive 4 or the like, thereby forming a three-dimensional logic plate 1. Is configured. A part 162A, a device 162B, and a device 162C of the fuel cell power generation system are arranged on one surface of the three-dimensional logic plate 1 (outside surface of the plate 3) and fixed by a fixing means such as a not-shown implantation bolt and nut, Parts 162D, 162E, and 162F of the fuel cell power generation system are arranged on the other surface of the three-dimensional logic plate 1 (the outer surface of the plate 2), and are fixed by fixing means such as a not-shown bolt and nut. .

  A fluid flow path is formed between the joint surface of the plate 3 and the intermediate plate 161 (the joint surface of the plate 3 in the illustrated example) and the joint surface of the plate 2 and the intermediate plate 161 (the joint surface of the plate 2 in the illustrated example). The grooves 8 are formed, and these grooves 8 are connected to the component 162A, the device 162B, the device 162C, the component 162D, the component 162E, and the device 162F by the communication holes 10 formed in the plates 2, 3, 161. That is, the component 162A, the device 162B, the device 162C, the component 162D, the component 162E, and the device 162F are three-dimensionally connected by the two upper and lower grooves 8 formed on the two plate joining surfaces. The cross-sectional area of the groove 8 is determined by appropriately calculating for each fluid.

  30, 31, and 32, the groove 8 serving as a path such as the fluid supply port 164 → part 162 A → device 162 F → device 162 B → device 162 C → component 162 E → component 162 D → fluid discharge port 165 and the communication hole 10. The arrangement relation among the component 162A, the device 162B, the device 162C, the component 162D, the component 162E, and the device 162F is illustrated. This route will be described in detail with reference to FIGS. 31 and 32. The route is the fluid supply port 164 → the groove 8A → the communication hole 10A → the component 162A → the communication hole 10B → the groove 8B → the communication hole 10C → the groove 8C → the communication hole 10D. -> Device 162F-> Communication hole 10E-> Groove 8D-> Communication hole 10F-> Device 162B-> Communication hole 10G-> Groove 8E-> Communication hole 10H-> Device 16C-> Communication hole 10I-> Groove 8F-> Communication hole 10J-> Groove 8G-> Communication hole 10K-> Component 162E → communication hole 10L → groove 8H → communication hole 10M → component 162D → communication hole 10N → groove 8I → fluid discharge port 165.

  In FIG. 33, an intermediate plate 161 is provided between the plate 2 and the plate 3, and these three plates 2, 3, 161 are joined and integrated with an adhesive 4 or the like, thereby integrating the three-dimensional logic plate 1. The component 166A, the device 166B, the device 166C, the component 166D, the component 166E, and the device 166F of the fuel cell power generation system are arranged only on one surface of the three-dimensional logic plate 1 (the outer surface of the plate 3). It is fixed by fixing means such as a non-planting bolt and nut.

  A fluid flow path is formed between the joint surface of the plate 3 and the intermediate plate 161 (the joint surface of the plate 3 in the illustrated example) and the joint surface of the plate 2 and the intermediate plate 161 (the joint surface of the plate 2 in the illustrated example). The grooves 8 are respectively formed, and these grooves 8 are connected to the parts 166A, the equipment 166B, the equipment 166C, the parts 166D, the parts 166E, and the equipment 166F by the communication holes 10 formed in the plates 2, 3, 161. That is, the component 166A, the device 166B, the device 166C, the component 166D, the component 166E, and the device 166F are three-dimensionally connected by the two-step grooves 8 formed on the two plate joint surfaces. The cross-sectional area of the groove 8 is determined by appropriately calculating for each fluid.

  33, 34, and 35, the groove 8 that forms a path such as the fluid supply port 167 → the component 166A → the device 166F → the device 166B → the device 166C → the component 166E → the component 166D → the fluid discharge port 168 and the communication hole 10 are provided. And the arrangement relationship of the component 166A, the device 166B, the device 166C, the component 166D, the component 166E, and the device 166F. This route will be described in detail with reference to FIGS. 34 and 35. The route is the fluid supply port 167 → the groove 8A → the communication hole 10A → the component 166A → the communication hole 10B → the groove 8B → the communication hole 10C → the device 166F → the communication hole 10D. → groove 8C → communication hole 10E → device 166B → communication hole 10F → groove 8D → communication hole 10G → device 166C → communication hole 10H → groove 8E → communication hole 10I → component 166E → communication hole 10J → groove 8F → communication hole 10K → The part 166D → the communication hole 10L → the groove 8G → the fluid discharge port 168.

  For comparison, FIG. 36 shows the case where the component 162A, the device 162B, the device 162C, the component 162D, the component 162E, and the device 162F shown in FIG. 30 are arranged on the logic plate 1 formed by joining two plates. An example is shown, and FIG. 37 shows a case where the component 166A, the device 166B, the device 166C, the component 166D, the component 166E, and the device 166F shown in FIG. 33 are arranged on the logic plate 1 formed by joining two plates. An example is shown.

  36, the fluid supply port 169 → the groove 8A → the communication hole A → the part 162A → the communication hole B → the groove 8162B → the communication hole 10C → the device 162F → the communication hole 10D → the groove 8C → the communication hole E → the device 162B → the communication hole F. → groove 8D → communication hole 10G → device 162C → communication hole 10H → groove 8E → communication hole 10I → component 162E → communication hole 10J → groove 8F → communication hole K → component 162D → communication hole 10L → groove 8G → fluid discharge port 170 The route has become. In FIG. 37, the fluid supply port 171 → the groove 8A → the communication hole A → the component 166A → the communication hole B → the groove 8162B → the communication hole 10C → the device 166F → the communication hole 10D → the groove 8C → the communication hole E → the device 166B → the communication hole F. → groove 8D → communication hole 10G → device 166C → communication hole 10H → groove 8E → communication hole 10I → part 166E → communication hole 10J → groove 8F → communication hole K → part 166D → communication hole 10L → groove 8G → fluid discharge port 172 The route has become.

  In this way, in the logic plate 1 in which the two plates are joined, all the grooves 8 (flow paths) are formed in one plane, so the grooves 8 (flow paths) may have to be bypassed, In some cases, the size of the logic plate 1 must be increased in order to bypass the groove 8.

  36 and 37, since the number of devices and parts is small and the number of grooves 8 (flow paths) is small, the difference is not so remarkable, but in practice, many devices and parts as shown in FIG. 40 are not connected. For this reason, as shown in FIG. 21, the number of grooves 8 (channels) is large, and it becomes a maze, so that the required channel cross-sectional area and the separation between fluids having different temperatures can be accommodated in a compact manner. Is often difficult. On the other hand, in the three-dimensional logic plate 1 of FIGS. 30 to 35, since the devices and parts are three-dimensionally connected by the two-step grooves 8 (flow paths), the arrangement of the grooves 8 is simplified, and the devices and parts are arranged. Can be arranged compactly. 30 to 35, the grooves 8 are provided on the joining surface on the plate 2 side and the joining surface on the plate 3 side, but the grooves 8 may be formed on the joining surface on the intermediate plate 161 side.

  FIG. 38 and FIG. 39 show a configuration example when a three-dimensional logic plate is used to divide into a high temperature zone and a low temperature zone.

  In FIG. 38, a low-temperature / high-temperature mixing device 181, a low-temperature device 182, a low-temperature / high-temperature mixing device 183, and a high-temperature device 184 of the fuel cell power generation system are arranged on one surface (surface of the plate 3) of the three-dimensional logic plate 1. Yes. Then, the groove 8 connecting these devices is formed by joining the plate 3 and the intermediate plate (joint surface of the intermediate plate 161 in the illustrated example) and the joint surface of the plate 2 and intermediate plate 161 (joint surface of the plate 2 in the illustrated example). 2), the upper groove 8 is a low temperature zone through which a low temperature fluid flows, and the lower groove 8 is a high temperature zone through which a high temperature fluid flows.

  In FIG. 39, a low-temperature / high-temperature mixing device 185, a low-temperature device 186, and a low-temperature / high-temperature mixing device 187 of the fuel cell power generation system are arranged on one surface (surface of the plate 3) of the three-dimensional logic plate 1, and the other surface ( A high temperature device 188 and a high temperature device 189 are disposed on the surface of the plate 2. Then, the groove 8 connecting these devices is formed by joining the joining surface of the plate 3 and the intermediate plate 161 (the joining surface of the intermediate plate 161 in the illustrated example) and the joining surface of the plate 2 and the intermediate plate 161 (joining of the plate 2 in the illustrated example). The upper groove 8 is a low temperature zone in which a low temperature fluid flows, and the lower groove 8 is a high temperature zone in which a high temperature fluid flows.

  In this case, although not shown, it is also effective to provide a heat insulating material between the plate 2 and the intermediate plate 161.

  In the above description, the case where the single intermediate plate 161 is provided between the plate 2 and the plate 3 has been described. Of course, the present invention is not limited to this. 3 may be provided. That is, a three-dimensional logic plate may be configured by joining four or more plates. When two or more intermediate plates are provided, grooves 8 (channels) can be formed on the joint surface between the intermediate plate and the intermediate plate, and more grooves 8 (channels) can be accommodated.

<Action and effect>
As described above, according to the logic plate according to the embodiment of the present invention, since each component device or component is connected by the groove 8 provided in the plate 2 or the plate 3, the flow path corresponding to the conventional piping is the logic plate. In addition, electrical components such as valves, sensors, switches, and electrical components and electrical wiring can be incorporated in the plate 2 or the plate 3 or the plate 2 and the plate 3. For this reason, the entire apparatus such as the fuel cell power generation system can be easily modularized and further downsized. In addition, since each component device or part is only assembled at a predetermined position and there is no complicated piping work in a narrow space, the assembling work is easy and the work efficiency is increased. Furthermore, there is less seam and the risk of fluid leakage is reduced.

  Further, the anticorrosive layer 29 is formed by applying a fluororesin coating such as polytetrafluoroethylene or a fluororesin lining or an aluminum oxide film treatment on the joining surfaces 2a and 3b of the plate 2 and the plate 3 and the groove 8 or the like. The life of the logic plate 1 can be extended by preventing the corrosion of the groove 8 due to the corrosive fluid flowing through the groove 8 and the corrosion of the plate joint surface due to the components in the adhesive 4. Of course, the technique of providing the anticorrosion layer is not limited to one set of logic plates, but can be applied to a case where a plurality of sets of logic plates are provided. For example, although illustration is omitted, a corrosion-resistant layer may be provided on the groove and plate joint surface in the three-dimensional module of FIGS. 7 to 13, or a corrosion-resistant layer may be provided on the groove and plate joint surface in the gantry module of FIG. 12. . Furthermore, even in a three-dimensional logic plate provided with an intermediate plate as shown in FIGS. 30 to 35, 38, and 39, an anticorrosion layer can be applied to the groove and the plate joint surface.

  Further, by welding the plate 2 and the plate 3 at the position of the weld line 30 surrounding the periphery of the groove 8, the fluid flowing in the groove 8 can be reliably sealed in the weld line 30 portion. Of course, this welding seal technique is not limited to the logic plate having the configuration shown in FIG. 5 and is not shown. For example, the three-dimensional module shown in FIGS. 7 to 13, the mount module shown in FIG. 12, and FIG. 30. It can be applied to any configuration logic plate such as the three-dimensional logic plate shown in FIG.

  Further, by combining the back surfaces of a plurality of sets of logic plates 1 (1A, 1B, etc.) assembled with respective components and devices into a three-dimensional module, it is possible to further reduce the size, The control system can be shortened, the response is fast, and the control becomes easy.

  Further, by configuring the heat insulating solid module 18A by integrally fixing a plurality of sets of logic plates 1 (1A, 1B, etc.) via the heat insulating material 16a, for example, the high temperature equipment 27a disposed on the logic plate 1A, The low temperature devices 28a and 28b, such as control devices, can be disposed on the logic plate 1B by approaching 27b and the like.

  Further, the heat insulation solid module 18B is configured by integrally connecting and fixing a plurality of sets of logic plates 1 (1A, 1B, etc.) via the separating material 31, thereby arranging, for example, high temperature devices 27a, 27b, etc. Since the logic plate 1A on the high temperature side and the logic plate 1 on the low temperature side where the low temperature devices 28a, 28b and the like are disposed can be separated by the separating material 31, it is possible to avoid the influence of heat on each other. Moreover, since the heat insulating material 130 is interposed between the back surface 2b of the plurality of sets of logic plates 1 (1A, 1B, etc.) and the separating material 31, the heat insulating effect is further improved.

  Further, by interposing the device components 139 and 140 between the back surfaces 2b of a plurality of sets of logic plates 1 (1A, 1B, etc.), the space between the logic plates can be effectively used, and the device can be further reduced in size. it can. In addition, since the logic plates are separated by the component devices 139 and 140, a heat insulating effect can be expected. In particular, the heat insulating effect is obtained by interposing the heat insulating material 130 between the devices 139 and 140 and the logic plates 1A and 1B. Become prominent.

  In addition, by arranging a plurality of sets of logic plates 1 (1A, 1B, etc.) on the same mount 32 with a heat insulation interval L, these logic plates 1 (1A, 1B, etc.) ignore the heat effects of each other. (Prevent). When the heat insulating material 145 is interposed between the logic plate 1 (1A, 1B, etc.) and the mount 32, the heat insulating effect is further improved.

  Further, in the same logic plate 1, by providing a heat blocking groove 35 between a high temperature zone in which the high temperature devices 33a, 33b, 33c and the like are disposed and a low temperature zone in which the low temperature devices 34a, 34b and the like are disposed, It is possible to block the heat from the high temperature zone so as not to affect the low temperature zone. Furthermore, the heat insulation effect becomes very large by filling the heat insulation groove 35 with a heat insulating material or flowing a refrigerant such as air or water.

  In addition, instead of forming a corrosion-resistant layer in the groove 8, the corrosion-resistant pipe 151 is accommodated in the groove 8, and a corrosive fluid is allowed to flow through the corrosion-resistant pipe 151, so that there are many grooves 8 (flow paths). Even if it is complicated, corrosion resistance to corrosive fluids can be easily ensured without requiring advanced processing techniques. In addition, since the corrosion resistant pipe 151 made of a material that matches the properties of the corrosive fluid can be selected and used, the reliability of the corrosion resistance is improved. Moreover, since it is only necessary to perform the anti-corrosion treatment (the formation of the flow path by the corrosion-resistant piping) only for the flow path of the corrosive fluid, the number of processing steps can be reduced, and the logic plate 1 can be provided at low cost. Furthermore, when the corrosion resistance is deteriorated due to secular change, the corrosion resistance can be restored by replacing only the corrosion resistant pipe 151 housed in the logic plate 1 instead of replacing the logic plate 1, thereby reducing the maintenance cost. be able to.

  In addition, when a flexible material is used as the material of the corrosion resistant pipe 151, the corrosion resistant pipe 151 is inserted into the groove 8 after the logic plate 1 is integrated, or the corrosion resistant pipe 151 is replaced. Therefore, workability can be improved.

  Further, the end portion of the corrosion-resistant pipe 151 is joined by using a receiver 152 having a through hole 152b having a conical surface 152c formed on the inner peripheral surface and a self-shaped part 153 having a conical surface 153a formed on the outer peripheral surface. Thus, the joining work of the corrosion-resistant pipe 151 can be easily performed, and the leakage of the fluid can be surely prevented. Further, as shown in FIG. 28, the receiving member 152 and the plate 3 are formed integrally, and as shown in FIG. 29, the device 191 or the part 192 and the top-piece part 153 are formed integrally. As a result, the number of parts is reduced and the joining work is facilitated. Further, when the corrosion resistant pipe 151 made of a highly rigid material is used or when the pipe path is complicated, the work efficiency can be improved by dividing the receiver 152 into a plurality of parts.

  Further, the three-dimensional logic plate 1 is formed by joining three or more plates 2, 3, 161, the joining surface of the plate 2 and the intermediate plate 161, the joining surface of the plate 3 and the intermediate plate 161, and the intermediate plate 161. When two or more sheets are provided, the grooves 8 are formed on the joining surface of the intermediate plate 161 and the intermediate plate 161, so that the grooves 8 can be arranged even when a large number of grooves 8 are provided corresponding to a large number of devices and parts. It is simple and equipment and parts can be arranged compactly. Further, in this three-dimensional logic plate 1, by dividing the plurality of grooves 8 into a high temperature zone and a low temperature zone as illustrated in FIG. 38 and FIG.

  In the above description, the implanted bolt 6 is used as a mounting bolt for equipment or components. However, the present invention is not limited to this, and a general bolt, a through bolt, or the like may be used. In the above description, the O-ring 13 is used for sealing devices and components. However, the present invention is not limited to this, and a gasket or the like may be used.

  Further, the fuel cell power generation system has been described above. However, the present invention is not limited to this, and the present invention incorporates piping, wiring, etc. in the apparatus, such as a general industrial air or hydraulic control device or combustion device. It is also effective for various devices such as a fixed unit and an integrated unit that can be assembled and transported.

  Moreover, although the logic plate of various structures was demonstrated above, these structures may be combined suitably.

It is a block diagram of the logic plate which concerns on embodiment of this invention. It is sectional structure drawing of the logic plate which concerns on embodiment of this invention, (b) is the EE arrow directional cross-sectional view of (a). It is a block diagram of the logic plate which has arrange | positioned an apparatus on both surfaces. It is a block diagram of the logic plate which performed the surface treatment, (b) is FF arrow directional cross-sectional view of (a). It is a block diagram of the logic plate of a welding structure. FIG. 6 is a cross-sectional view taken along line AA in FIG. 5. It is a block diagram of a solid module. It is a block diagram of the solid module which consists of 4 sets of logic plates. It is a block diagram of the solid module which consists of 5 sets of logic plates. It is a block diagram of the heat insulation three-dimensional module which has a heat insulation layer. It is a block diagram of the heat insulation solid | solid module which isolate | separated the logic plate of the high temperature side and the logic plate of the low temperature side. It is a block diagram of the heat insulation three-dimensional module which consists of 3 sets of logic plates. It is a block diagram of the three-dimensional module which provided the apparatus between logic plates. It is a block diagram of the logic plate which isolate | separated the high temperature part and the low temperature part on the same mount frame. It is a block diagram at the time of arrange | positioning 4 sets of logic plates on the same mount. It is a block diagram of the logic plate which has a heat insulation groove | channel. FIG. 17 is a cross-sectional view taken along line B-B in FIG. 16. It is a block diagram of the logic plate which incorporated the control apparatus etc. It is CC sectional view taken on the line of FIG. It is the DD sectional view taken on the line of FIG. It is a top view which shows the example of the logic plate which has many grooves. It is a block diagram of the logic plate which provided corrosion resistant piping. (A) is the G section enlarged plan view of Drawing 22, and (b) is a HH line arrow sectional view of (a). (A) is an I section enlarged plan view of Drawing 22, and (b) is a JJ line arrow sectional view of (a). It is sectional drawing of the said logic plate. FIG. 26 is an enlarged sectional view taken along line KK in FIG. 25. It is explanatory drawing at the time of using the corrosion-resistant piping of a material with high rigidity. It is sectional drawing which shows another example of joining of the edge part of corrosion-resistant piping. It is sectional drawing which shows another example of joining of the edge part of corrosion-resistant piping. It is a block diagram of a three-dimensional logic plate. FIG. 31 is a cross-sectional view taken along line MM in FIG. 30. It is a NN arrow directional cross-sectional view. It is a block diagram of another three-dimensional logic plate. FIG. 34 is a cross-sectional view taken along line OO in FIG. 33. It is PP sectional view taken on the line of FIG. It is explanatory drawing in the case of connecting the apparatus and components shown in FIG. 30 with the groove | channel formed in 1 plane. It is explanatory drawing in the case of connecting the apparatus and components shown in FIG. 33 with the groove | channel formed in 1 plane. It is a block diagram at the time of classifying into a high temperature zone and a low temperature zone using a three-dimensional logic plate. It is another block diagram at the time of classifying into a high temperature zone and a low temperature zone using a three-dimensional logic plate. It is an example of the flowchart of the conventional fuel cell power generation system.

Explanation of symbols

1, 1A, 1B, 1C, 1D, 1E Logic plate 2 Plate 2a Joining surface 2b Surface 3 Plate 3a Surface 3b Joining surface 3c Through hole 3d Conical surface 3e Step part 3f Fitting hole 3g Step part 4 Adhesive 5 Device 6 Implantation Bolt 7 Nut 8, 8A to 8I Groove 9 Bolt hole 10, 10A to 10N Communication hole 11 A equipment 12 B equipment 13 O-ring 14 Through bolt 15, 15A, 15B Solid module 16a, 16b Heat insulating material 17 Through bolt 18A, 18B, 18C heat insulation three-dimensional module 19 solenoid valve 20 control device 21 electrical wiring 22 C device 23 D device 25a pressure sensor 25b flow sensor 25c temperature sensor 26a, 26b auxiliary device 27a, 27b high temperature device 28a, 28b low temperature device 29 corrosion protection layer 30 welding line 31 Separating material 32 Mount 33 , 33b, 33c High temperature equipment 34a, 34b Low temperature equipment 35 Heat blocking groove 36 Communication hole 37 Through hole 101 Through hole 102 Nut 103 Through hole 104 Nut 105-129 Equipment 130 Thermal insulation 131a, 131b High temperature equipment 132a, 132b High temperature equipment 133a, 133b Low-temperature equipment 134a, 134b Low-temperature equipment 139, 140 Equipment 141a, 141b High-temperature equipment 142a, 142b Low-temperature equipment 143a, 143b High-temperature equipment 144a, 144b Low-temperature equipment 145 Heat insulating material 151 Corrosion-resistant piping 152 Receptacle 152a Step portion 152c Conical hole 152b Surface 152d Step 153 Top-of-the-piece parts 153a Conical surface 153b
153c Head 154 Joint 154a Conical surface 155 Screw 161 Intermediate plate 162A Component 162B Device 162C Device 162D Component 162E Component 162F Device 164 Fluid supply port 165 Fluid discharge port 166D Component 166B Device 166C Component 166B Device 166C Component 166B 168 Fluid discharge port 169 Fluid supply port 170 Fluid discharge port 171 Fluid supply port 172 Fluid discharge port 181 Low temperature / high temperature mixing device 182 Low temperature device 183 Low temperature / high temperature mixing device 184 High temperature device 185 Low temperature / high temperature mixing device 186 Low temperature device 187 Low temperature / High temperature mixing equipment 188 High temperature equipment 189 High temperature equipment 191 Equipment 192 Parts

Claims (6)

  It is a logic plate formed by joining two or more plates, and device components or parts are disposed on one surface of the logic plate, and a fluid flow path is formed on the joining surface of the plate. A plurality of logic plates configured to form grooves and connect the devices or parts by the grooves are provided, and the plurality of logic plates are integrated in a state where the back surfaces of the plurality of logic plates are aligned. A logic plate characterized by being a solid module by fixing. In the logic plate according to claim 1,
A logic plate characterized in that a heat insulating solid module is formed by interposing a heat insulating material between the back surfaces of the plurality of sets of logic plates. In the logic plate according to claim 1,
A logic plate, characterized in that a heat insulating solid module is formed by interposing a separating material between the back surfaces of the plurality of sets of logic plates. In the logic plate according to claim 3,
A logic plate, wherein a heat insulating material is interposed between a back surface of the plurality of sets of logic plates and the spacing member. In the logic plate according to claim 1,
A logic plate comprising apparatus devices or parts interposed between the back surfaces of the plurality of sets of logic plates. The logic plate according to claim 5,
A logic plate, wherein a heat insulating material is interposed between a back surface of the plurality of sets of logic plates and components or parts interposed between the back surfaces.

Images