JP2005222807A - Sealing structure, electronic equipment, and image forming apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an inexpensive and reliable sealing structure for improving sealing properties for solving these problems, and to provide electronic equipment and an image forming apparatus. <P>SOLUTION: An electron device or a light-emitting element 30 is included between a pair of substrates 11, 13, and the above problems are solved by the sealing structure in which the outer periphery of the pair of substrates 11, 13 is sealed by a sealing member 15 whose section is nearly in a T shape or nearly in an E shape. The distance between the pair of substrates 11, 13 is retained by the projection of the sealing member 15 whose section is nearly in the T shape, or a projection section 16 at the center whose section is nearly in the E shape. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a sealing structure, an electronic apparatus, and an image forming apparatus, and more particularly, to an inexpensive and highly reliable sealing structure with improved sealing performance, an electronic apparatus, and an image forming apparatus.

  An organic EL element is a self-luminous element that emits light by flowing an electric current. A display device using the organic EL element is thinner than a display device such as an LCD (liquid crystal) that uses external light to display an image. Is possible. In addition, since it has excellent features such as low power consumption, fast response speed, and wide viewing angle, it attracts attention as a display device that replaces CRT (CRT) and LCD.

Organic EL elements are easily affected by moisture and oxygen. Sealing using a cap (sealing can) as generally disclosed in Japanese Patent Application Laid-Open No. 2000-173766 (Patent Document 1) in order to protect the organic EL element from the influence of such moisture and oxygen. Has been made. Japanese Patent Laid-Open No. 8-302340 (Patent Document 2) discloses that an organic EL element sandwiched between plates or films is surrounded by a spacer, and a joint between the spacer and the plate or film is a thermosetting adhesive. An example of joining and sealing is disclosed.
JP 2000-173766 A JP-A-8-302340

  However, the sealing method using the sealing can as in Patent Document 1 is not suitable for reducing the cost because the cost of the sealing can is high. In addition, when a sealing can is used, since the bonding area with the substrate on which the organic EL element is formed (organic EL substrate) is small, the sealing performance against moisture entering from the outside cannot be said to be sufficient.

  Further, even in the configuration described in Patent Document 2, it cannot be said that the adhesion area is sufficient, and the sealing property is not sufficient against moisture entering from the outside.

  In addition, for example, in the image display device, there is a demand for making the non-effective display area (frame portion) other than the effective display area as small as possible from the viewpoint of enlarging the effective display area. Therefore, the conventional sealing member cannot provide a sufficient adhesion area with the substrate, and there is room for improvement in terms of sealing strength.

  In order to solve such problems, an object of the present invention is to provide an inexpensive and highly reliable sealing structure, electronic apparatus, and image forming apparatus with improved sealing performance.

  In order to solve the above problems, a first aspect of the present invention includes a sealing member including an electronic element or a light emitting element between a pair of substrates, the outer periphery of the pair of substrates having a substantially T-shaped or substantially E-shaped cross section. The sealing structure sealed by is provided.

  According to this, since the outer periphery of the pair of substrates is sealed by the sealing member having a substantially T-shaped or substantially E-shaped cross section, the contact area between the substrate and the sealing member is larger than that of the conventional method. Become. Therefore, the area contributing to sealing is increased, and the path required for moisture and the like to enter the inside from the outside becomes long, so that the entry of moisture and the like can be sufficiently prevented. Moreover, since the periphery of the substrate is supported by the sealing member, the sealing strength is increased. Therefore, deterioration of the electronic device or the light-emitting device due to moisture can be avoided, so that when such a sealing structure is used, a highly reliable product can be obtained. Moreover, since expensive members such as a sealing can are not used, the cost of the product can be reduced. Here, examples of the electronic element include a transistor, a diode, a capacitor, a resistor, and an inductor.

  The material which comprises a sealing member is not specifically limited, As long as the sealing effect is acquired, resin, a metal, a ceramic, etc. can be used. However, from the viewpoint of avoiding distortion due to heat or the like, it is preferable that the thermal expansion coefficient is substantially equal to or close to the thermal expansion coefficient of the substrate.

  It is preferable that the distance between the pair of substrates is held by a protruding portion having a substantially T-shaped cross section or a central protruding portion of the sealing member having a substantially E-shaped cross section. Thereby, since the distance between the substrates can be maintained without using other members, it is possible to reduce the size of the sealing structure or increase the effective area on the substrate.

  The present invention is particularly suitable when the electronic element or light emitting element is an organic EL element. Since the organic EL element dislikes the influence of moisture and the like remarkably, it is necessary to improve the sealing property in particular, and the deterioration of the organic EL element can be reduced.

  It is preferable that the sealing member is bonded to the outer periphery of the pair of substrates via an adhesive. Thereby, it becomes possible to improve the adhesiveness of a sealing member and a board | substrate.

  It is preferable that an adhesive reservoir is formed on the contact surface of the sealing member with the substrate. According to this, since it becomes possible to accommodate an excessive adhesive agent in the adhesive reservoir, it is possible to avoid the influence on the elements and the like due to the excessive adhesive protruding from the joint surface.

  Examples of the sealing member include a frame body that is integrally formed or formed by combining a plurality of members. When the integrally formed frame is used as the sealing member, since there is no joint, the sealing performance is improved, and thus a further sealing effect can be expected. In addition, when a frame body formed by combining a plurality of members is used, it becomes easy to mount the pair of substrates on the outer periphery, so that workability can be improved.

  It is preferable that the sealing member is a frame configured by combining a plurality of members that can be fitted at the end. Thereby, it becomes possible to improve the joining property between each member.

  It is preferable that the sealing member is a frame configured by combining a plurality of members, and each member has a structure in which one member covers another member at the end. Thereby, it becomes possible to make it difficult for water to enter from the outside.

  The 2nd aspect of this invention is an electronic device provided with the sealing structure in any one of the said. Since the sealing structure as described above is provided, an inexpensive and highly reliable electronic device can be provided. Examples of the electronic device include a mobile phone, a video camera, a portable personal computer (so-called PDA), a head mounted display, a television, a roll-up television, and the like.

  According to the third aspect of the present invention, it is possible to provide an image forming apparatus including the sealing structure according to any one of the above and having an exposure light source. Since the exposure light source is configured including the sealing structure as described above, an inexpensive and highly reliable image forming apparatus can be provided.

  The present invention will be described below with reference to the drawings.

  FIG. 1 is a cross-sectional view for explaining a sealing portion of the sealing structure of the present invention.

  FIG. 1A shows an example in which a sealing member having a substantially T-shaped cross section is used. As shown in FIG. 1A, the sealing structure of this example includes an element forming substrate 11 on which an electronic element or light emitting element (not shown) is formed, and an electronic element or light emitting element formed on the element forming substrate 11. The sealing substrate 13 for sealing is sealed with a sealing member 15 having a substantially T-shaped cross section via an adhesive 17.

  Thus, when the sealing member 15 having a substantially T-shaped cross section is used, the sealing member 15 has two surfaces, that is, the upper surfaces (or bottom surfaces) 11a and 13a and the side surfaces 11b and 13b of the element forming substrate 11 and the sealing substrate 13. Will come into contact. In the conventional method of sealing with a spacer, since the bonding is performed only on one surface, the area contributing to sealing is small. However, it is possible to increase the area that contributes to sealing by bringing the sealing member 15 into contact with the element forming substrate 11 and the side surfaces 11b and 13b of the sealing substrate 12 in this way, and thus sealing (sealing) Can be improved. Further, according to such a structure, the contact area can be increased by making good use of the side walls of the element forming substrate 11 and the sealing substrate 12 without narrowing the regions inside the element forming substrate 11 and the sealing substrate 12. Therefore, it becomes possible to reduce the size of the sealing structure or increase the effective area of the element formation substrate 11 and the sealing substrate 12.

  In addition, the distance (distance) between the element formation substrate 11 and the sealing substrate 13 can be maintained at a predetermined distance by using the protruding portion 16 of the sealing member 15, so that the distance between the two substrates is maintained. Therefore, it is not necessary to use other members, and the effective areas of the element formation substrate 11 and the sealing substrate 13 can be increased. Here, the effective region and the effective area refer to a region and an area that can be used for forming elements, connection terminals, and the like on the element formation substrate 11 and the sealing substrate 13. Moreover, the constituent material of the element formation board | substrate 11 and the sealing substrate 12 is not specifically limited, For example, a glass substrate, a silicon substrate, a film substrate etc. are used.

  FIG. 1B shows an example using a sealing member having a substantially E-shaped cross section. As shown in FIG. 1B, the sealing structure of this example is different from FIG. 1A in that a sealing member 15 having a substantially E-shaped cross section is used. By using the sealing member 15 having a substantially E-shaped cross section in this way, as in the case of FIG. 1A, it contributes to sealing without reducing the effective area of the element formation substrate 11 and the sealing substrate 12. The area can be increased. In addition, since it comes into contact with the top surface, the side surface, and the bottom surface of the element forming substrate 11 and the sealing substrate 13, the area contributing to the sealing is further expanded than in the case of a substantially T-shaped cross section, and further sealing is performed. An effect can be obtained. Similarly, the sealing member 15 having a substantially E-shaped cross section can similarly hold the distance between the element forming substrate 11 and the sealing substrate 13 at a predetermined distance by using the central protrusion 16.

  Next, the schematic shape of the sealing member will be described with reference to the drawings.

  FIG. 2 is a top view for explaining the schematic shape of the sealing member, and FIGS. 3 to 5 are perspective views for explaining the schematic shape of the sealing member.

  As shown in FIG. 2A, the sealing member 15 may be an integrally formed rectangular frame. FIG. 3A and FIG. 3B are perspective views of such an integrally formed rectangular frame. FIGS. 3A and 3B show examples of frames having a substantially T-shaped cross section and a substantially E-shaped cross section, respectively. Thus, when the sealing member 15 is integrally formed, since there is no joint, it is possible to improve the sealing performance. Therefore, a further sealing effect can be obtained. The material used for the sealing member 15 is not particularly limited, but is desirably a material that can be expected to have a sealing effect (a highly airtight material). The material of the sealing member 15 is appropriately selected according to the usage mode, shape, and the like. For example, in the case of a frame having a substantially T-shaped cross section as shown in FIG. 3A, the element forming substrate and the sealing substrate may be inserted from the upper and lower sides of the frame, respectively. Will not receive. However, in the case of a frame having a substantially E-shaped cross section, the element forming substrate and the sealing substrate cannot be fitted as they are, and therefore both materials are stretched using a stretchable material (eg, rubber) while extending the frame. It is necessary to fit in the substrate. Therefore, the material may be restricted by the shape as described above. Further, from the viewpoint of avoiding distortion due to heat or the like, it is preferable that the thermal expansion coefficient of the sealing member is approximately equal to or close to the thermal expansion coefficient of the substrate (the element formation substrate and the sealing substrate).

  Moreover, as shown in FIG.2 (b) thru | or FIG.2 (d), the sealing member 15 may be comprised combining the some member.

  As described above, by combining a plurality of members, mounting on the element formation substrate and the sealing substrate is facilitated. Therefore, workability is improved, which can contribute to cost reduction.

  As shown in FIG. 2B and FIG. 4A, for example, the sealing member 15 is composed of a total of four members, that is, a pair of vertical members 15a and a pair of horizontal members 15b constituting each side. May be. Moreover, as shown in FIG.2 (c) and FIG.4 (b), a total of two members, the U-shaped member 15c and the rod-shaped member 15d which seals the opening part of the U-shaped member 15c. You may be comprised from. Moreover, the edge part of each member may be comprised so that it can fit mutually. In particular, it is preferable that one member among the members constituting the frame is configured to cover the other member. Specifically, for example, as shown in FIGS. 2D and 5A, it is preferable that the end of the horizontal member 15f covers the end of the vertical member 15e. Thus, it becomes possible to prevent further the penetration | invasion of the water | moisture content etc. from the outside by comprising so that one member and another member may overlap. In addition, although not shown in figure, each member may be comprised so that it can fit mutually in an edge part.

  Moreover, as shown in FIG.5 (b), the sealing member 15 may be comprised so that a frame may be formed by bending using flexible members, such as resin. According to this, since there are few joint parts, hermeticity can be improved. Moreover, since it is formed continuously (tape shape), it can be easily attached to the substrate.

  Further, as shown in FIGS. 6A and 6B, excessive adhesive 17 protrudes outside the contact surface of the sealing member 15 with the element formation substrate 11 and / or the sealing substrate 13. An adhesive reservoir 19 for preventing this may be formed. As a result, it is possible to further avoid the possibility of contamination of the elements and poor connection terminals due to the adhesive 17 protruding to the outside. The position where the adhesive pool is formed is not particularly limited. However, if the adhesive reservoir 19 is provided on the front end side of the projecting portion, all excess adhesive 17 is pushed out to the front end side (outside of the seal) of the sealing member 15, thus preventing further protrusion. The effect can be expected.

  According to the present invention, since the sealing member 15 having a substantially T-shaped or substantially E-shaped cross section is used as described above, the contact area between the element forming substrate and the sealing substrate and the sealing member is smaller than that of the conventional method. growing. Therefore, the area contributing to sealing is increased, and the path required for moisture and the like to enter the inside from the outside becomes long, so that the entry of moisture and the like can be sufficiently prevented. Moreover, since the periphery of the substrate is supported by the sealing member, the sealing strength is increased. Therefore, deterioration of the electronic device or the light-emitting device due to moisture can be avoided, so that when such a sealing structure is used, a highly reliable product can be obtained. Moreover, since expensive members such as a sealing can are not used, the cost of the product can be reduced.

  FIG. 7 shows an example in which such a sealing structure is applied to an electro-optical device (organic EL display device).

  As shown in FIG. 7, the electro-optical device according to this embodiment is configured such that an element formation substrate 11 made of glass or the like on which an organic EL electroluminescence element (organic EL element) 30 is formed and a sealing substrate 13 are bonded. It has the structure sealed by the sealing member 15 having an E-shaped cross section as described above via the agent 17.

  The organic EL element 30 includes a first electrode 32, a light emitting layer 34, and a second electrode (transparent cathode) 36. More specifically, in the present embodiment, the first electrode 32, the light emitting layer 34, and the second electrode (transparent cathode) 36 are stacked in this order on the element formation substrate 11. The first electrode 32 is made of, for example, Al / ITO (or IZO or the like), and the second electrode 36 is made of ITO or IZO or the like. In the present example, a conventionally known organic compound such as polyfluorene is used as the light emitting layer 34. In addition, the organic EL element 30 may include an electron transport layer, a hole transport layer, an electron injection layer, a hole injection layer, and the like as necessary. Examples of the combination of the organic layers including the light emitting layer 34 interposed between the first electrode 32 and the second electrode 36 include the following. For example, single layer type consisting of light emitting layer, two layer type consisting of light emitting layer + electron transport layer / hole transport layer, three layer type consisting of electron transport layer / light emitting layer / hole transport layer, electron injection layer / light emitting layer / hole Examples include a four-layer type composed of a transport layer / hole injection layer and a five-layer type composed of an electron injection layer / electron transport layer / light emitting layer / hole transport layer / hole injection layer. Such an organic layer can be formed by, for example, an inkjet method.

  The electrical connection between the organic EL element formed between the element formation substrate 11 and the sealing substrate 13 and the outside is achieved by, for example, providing a through hole in the element formation substrate 11 and exposing the connection terminal to the outside. Is possible. Further, as shown in FIG. 8, a part of the sealing member 15 has a substantially L-shaped cross section, and the wiring is extended on the element forming substrate to bring out the terminal outside the substantially L-shaped sealing member 15. Connection with the outside may be attempted. In that case, the connection portion between the outside of the sealing member 15 and the external terminal 27 is sealed with the resin 29.

  Next, specific examples of electronic apparatuses to which such an electro-optical device can be applied will be described with reference to FIGS. 9 and 10 are diagrams illustrating examples of various electronic apparatuses configured to include the electro-optical device 100 (example: organic EL display device).

  FIG. 9A shows an application example to a mobile phone, and the mobile phone 830 includes an antenna portion 831, an audio output portion 832, an audio input portion 833, an operation portion 834, and the electro-optical device 100 of the present invention. . FIG. 9B shows an application example to a video camera. The video camera 840 includes an image receiving unit 841, an operation unit 842, an audio input unit 843, and the electro-optical device 100. FIG. 9C shows an application example to a portable personal computer (so-called PDA). The computer 850 includes a camera unit 851, an operation unit 852, and the electro-optical device 100. FIG. 9D shows an application example to a head-mounted display. The head-mounted display 860 includes a band 861, an optical system storage portion 862, and the electro-optical device 100.

  FIG. 10A shows an application example to a television, and the television 900 includes an electro-optical device 600. The electro-optical device 100 can be similarly applied to a monitor device used for a personal computer or the like. FIG. 10B shows an application example to a roll-up television, and the roll-up television 910 includes the electro-optical device 100.

  The electronic device according to the present invention is not limited to the above example. That is, the electro-optical device 100 according to the present invention is not limited to the above-described example, but includes, for example, a workstation, a digital still camera, an in-vehicle monitor, a viewfinder type video tape recorder, a monitor direct-view type video tape recorder, a car navigation device, a pager. It can be widely applied to electronic devices such as electronic notebooks, calculators, word processors, and POS terminals.

  Next, a specific example of an image forming apparatus to which the electro-optical device according to the invention can be applied will be described with reference to FIG. FIG. 11 is a schematic diagram illustrating an example of an image forming apparatus including an electro-optical device (for example, an organic EL display device).

  As shown in FIG. 11, the image forming apparatus 500 writes a photosensitive member 501 that forms a latent image, a charging unit (charging roller) 502 that charges the photosensitive member 501, and light corresponding to image data to the photosensitive member 501. , An exposure unit (printer head) 503 to which the electro-optical device of the present invention is applied, a condensing unit (rod lens array) 504 that collects light emitted from the exposure unit 503, and a toner image is formed on the photosensitive member 501. A developing means 505 for transferring, a transfer means (transfer roller) 506 for transferring the toner image formed on the photoreceptor 501 to the transfer paper, and a transfer paper conveying means 507 for conveying the transfer paper. In the image forming apparatus 500 having such a configuration, a toner image is printed on a transfer sheet through processes of charging, exposure, development, and transfer.

FIG. 1 is a cross-sectional view for explaining a sealing portion of the sealing structure of the present invention. FIG. 2 is a top view for explaining a schematic shape of the sealing member. FIG. 3 is a perspective view for explaining a schematic shape of the sealing member. FIG. 4 is a perspective view for explaining a schematic shape of the sealing member. FIG. 5 is a perspective view for explaining a schematic shape of the sealing member. FIG. 6A and FIG. 6B are diagrams showing an example in which an adhesive reservoir is provided on the sealing member. FIG. 7 is a diagram illustrating an example in which the sealing structure of the present invention is applied to an electro-optical device (example: organic EL display device). FIG. 8 is a diagram for explaining a connection portion of the electro-optical device with the outside. FIG. 9 is a diagram illustrating examples of various electronic apparatuses configured to include an electro-optical device (for example, an organic EL display device). FIG. 10 is a diagram illustrating examples of various electronic apparatuses configured to include an electro-optical device (for example, an organic EL display device). FIG. 11 is a schematic diagram illustrating an example of an image forming apparatus including an electro-optical device (for example, an organic EL display device).

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 ... Element formation substrate, 12 ... Sealing substrate, 13 ... Sealing substrate, 15 ... Sealing member, 16 ... Projection part, 17 ... Adhesive, 27 ... External terminal, 29 ... resin, 30 ... electronic element or light emitting element, 32 ... first electrode, 34 ... light emitting layer, 36 ... second electrode, 100 ... electro-optical device, DESCRIPTION OF SYMBOLS 500 ... Image forming apparatus, 501 ... Photoconductor, 503 ... Exposure means, 505 ... Development means, 507 ... Transfer paper conveyance means, 600 ... Electro-optical device, 830 ... Cellular phone, 831 ... antenna unit, 832 ... audio output unit, 833 ... audio input unit, 834 ... operation unit, 840 ... video camera, 841 ... image receiving unit, 842 ... Operation unit, 843 ... voice input unit, 850 ... computer, 851 ... camera unit 852 ... the operation unit, 860 ... head-mounted display, 861 ... band, 862 ... optical system housing, 900 ... television, 910 ... roll-up television

Claims (10)

  A sealing structure comprising an electronic element or a light emitting element between a pair of substrates, wherein the outer periphery of the pair of substrates is sealed by a sealing member having a substantially T-shaped or substantially E-shaped cross section.   The sealing structure according to claim 1, wherein a distance between the pair of substrates is held by a projecting portion of the sealing member having a substantially T-shaped cross section or a central projecting portion having a substantially E-shaped cross section.   The sealing structure according to claim 1, wherein the light emitting element is an organic EL element.   The sealing structure according to claim 1, wherein the sealing member is bonded to the outer periphery of the pair of substrates via an adhesive.   The sealing structure according to claim 1, wherein an adhesive reservoir is formed on a contact surface of the sealing member with the substrate.   The sealing structure according to any one of claims 1 to 5, wherein the sealing member is a frame formed integrally or by combining a plurality of members.   The sealing structure according to any one of claims 1 to 5, wherein the sealing member is a frame configured by combining a plurality of members that can be fitted at an end portion.   The sealing member according to any one of claims 1 to 5, wherein the sealing member is a frame body configured by combining a plurality of members, and each member has a structure in which one member covers another member at an end portion. The sealing structure according to 1.   An electronic apparatus comprising the sealing structure according to claim 1. An image forming apparatus comprising an encapsulating structure according to claim 1, wherein an exposure light source is configured.

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