JP2005191366A - Semiconductor manufacturing system - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing system in which a smooth mass-production control transfer of a semiconductor device is made possible. <P>SOLUTION: In the semiconductor manufacturing system wherein a trial article management computer 10 and a mass-production management computer 30 are connected via a network 20, result and recipe information is transferred from the trial article management computer 10 to the mass-production management computer 30, and mechanical difference correction information for correcting a difference in the result of the semiconductor device caused by a mechanical difference of manufacturing devices is accepted and stored in a database 40 that the mass-production management computer 30 can access. If the control-transferred result information is different from the result of the semiconductor device manufactured by a manufacturing device 7, the mechanical difference correction information in the database 40 is searched using as a search key search request data generated by a search request data generating means 42, recipe data are corrected on the basis of an acquired result of the search, and recipe data of the manufacturing device 7 are rewritten. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a semiconductor manufacturing system for transferring mass production of semiconductor devices.

  In recent years, many semiconductor device manufacturers manufacture system LSIs represented by SOC (system on chip) as main products. In many cases, the number of lifetime production of such a system LSI is determined at the start of construction. For this reason, in order to obtain as much profit as possible, it is important for semiconductor device manufacturers to start production at an appropriate amount from the beginning and end production in a short period even when producing a new product. . Therefore, there is a demand for rapid mass production transfer after completion of the prototype.

Traditionally, mass production of new products has been transferred by transferring workmanship information and recipe information. However, in actual mass production transfer, it is not sufficient to transfer only the quality information and recipe information. This is because the quality of the semiconductor device is different depending on the difference in the manufacturer of the semiconductor manufacturing apparatus (hereinafter referred to as “manufacturing apparatus”) or the specification of the manufacturing apparatus, that is, the “machine difference” existing between the manufacturing apparatuses. .
As a method for solving this machine difference problem, Copy Exactly of Intel Corporation is known (for example, see Non-Patent Document 1). In this method, a large number of manufacturing apparatuses of the same manufacturer are purchased at a time, and the specifications of the manufacturing apparatuses are matched to details, thereby reducing the occurrence of machine differences as much as possible.

"Producing the industry's first flash memory using the 0.25 micron process", search February 3, 1998, December 9, 2003, Internet <URL: http://www.intel.co.jp/ jp / intel / pr / press98 / 025FLASH.htm>

However, since the above-described method requires an enormous amount of investment at a time, most semiconductor device manufacturers cannot practically adopt it.
Therefore, at the time of actual mass production transfer, engineers who were involved in the development / prototyping of new products were dispatched to the mass production transfer destination to solve the above machine difference problem. That is, mass production transfer was performed by absorbing the above-mentioned problem of machine difference by the know-how in the head of the engineer and realizing the same quality as the prototype at the mass production transfer destination.

  In addition, since the semiconductor device manufacturing process involves many microfabrications, it is more susceptible to the above machine differences compared to other manufacturing fields, and it is essential to absorb the above machine difference problems.

  The present invention has been made to solve the above-described conventional problems, and an object of the present invention is to provide a semiconductor manufacturing system that enables smooth mass production transfer of semiconductor devices.

In a semiconductor manufacturing system according to the present invention, a prototype management computer that manages information generated or acquired in the process of manufacturing a prototype of a semiconductor device and a mass production management computer that manages a mass production process of the semiconductor device are connected via a network. A connected semiconductor manufacturing system,
The prototype management computer transfers the quality and recipe information received by the quality / recipe information input receiving means to the mass production management computer and corrects the difference in the quality of the semiconductor device due to the difference in the semiconductor manufacturing equipment. Is received by the machine difference correction information input receiving means, and the received machine difference correction information is stored in a database accessible to the mass production transfer destination management computer by the machine difference correction information providing means,
The mass production management computer stores the quality and recipe information received by the quality / recipe information receiving means in the storage device, the quality information read from the storage device, and the quality of the semiconductor device manufactured by the semiconductor manufacturing device in the mass production process. If there is a difference, search request data is generated by search request data generation means, machine difference correction information stored in the database is searched using the generated search request data as a search key, and search result data is Acquired by the search result data acquisition means, correct the recipe data based on the acquired search result data by the recipe correction means, and send the corrected recipe data to the semiconductor manufacturing apparatus by the correction recipe transmission means,
The semiconductor manufacturing apparatus in the mass production process is characterized in that the recipe data transmitted by the corrected recipe data transmitting means is received by the corrected recipe receiving means, and the recipe data of the semiconductor manufacturing apparatus is rewritten to the received recipe data. .

In the semiconductor manufacturing system according to the present invention, the test / inspection result transmitted by the semiconductor test / inspection apparatus in the mass production process is received by the test / inspection result receiving means,
It is preferable to compare the received test / inspection result with the performance information read from the storage device, and if there is a difference, search request data is generated by the search request data generation means.

In the semiconductor manufacturing system according to the present invention, the parameter data for the semiconductor manufacturing apparatus is corrected by the apparatus parameter correcting means based on the search result data acquired by the search result data acquiring means, and the corrected parameter data is corrected by the correction parameter. Send to the semiconductor manufacturing equipment by the transmission means,
It is preferable that the semiconductor manufacturing apparatus in the mass production process receives the parameter data transmitted by the correction parameter transmitting means by the correction parameter receiving means, and changes the parameter data of the semiconductor manufacturing apparatus to the received parameter data.

The semiconductor manufacturing system according to the present invention further includes machine difference correction information generating means connected to the prototype management computer via a network and generating machine difference correction information.
The machine difference correction information generating means receives the detailed event data of the semiconductor manufacturing apparatus in the prototype process by the event data receiving means, generates the apparatus detailed data from the received detailed event data by the apparatus detailed data generating means, The generated device detailed data is transmitted to the prototype management computer by the device detailed data transmitting means,
It is preferable that the device difference correction information input accepting means of the prototype management computer receives the device detailed data and accepts the received device detailed data as the device difference correction information.

In the semiconductor manufacturing system according to the present invention, the input of the product name or wafer ID together with the machine difference correction information is received by the machine difference correction information input receiving means, and the machine difference correction information is stored in the database for each received product name or wafer ID. Stored in the machine difference correction information providing means,
The product name or wafer ID is preferably generated as search request data by the search request data generation means of the mass production management computer.

In the semiconductor manufacturing system according to the present invention, the machine difference correction information input acceptance unit further accepts the input of the priority order of the machine difference correction information together with the product name or wafer ID,
It is preferable that the machine difference correction information providing means of the prototype management computer stores the machine difference correction information in the database in association with the priority received by the machine difference correction information input means.

  As described above, the present invention corrects the recipe data based on the machine difference correction information as the search result data, thereby making the quality information transferred in mass production equivalent to the quality of the semiconductor device manufactured in the mass production process. Therefore, smooth mass production transfer of semiconductor devices is possible.

Embodiment 1 FIG.
First, in the first embodiment of the present invention, a semiconductor device manufacturing workflow in a semiconductor device manufacturer will be described.
FIG. 1 is a diagram for explaining a semiconductor device manufacturing workflow in a semiconductor device manufacturer according to Embodiment 1 of the present invention.
As shown in FIG. 1, when a specification of a semiconductor device is examined between a designer and a customer and the specification is determined, circuit design involving circuit simulation is executed. When the circuit design converges, pattern data for each layer is created. The created pattern data is transmitted to a mask design department or a mask trader in the semiconductor device manufacturer and processed into mask data. Thereafter, a photomask is created by a mask supplier based on the mask data. In parallel with the creation of the photomask, process design using process simulation is executed, and a prototype primary specification plan is determined.

  Based on this prototype primary specification proposal, an integration engineer (hereinafter referred to as “I-Eng”) that is responsible for the design of modules such as transistors and capacitors and the entire product process in which the modules are assembled, lithography, Detailed examination will be conducted by multiple engineers such as element engineer (hereinafter referred to as “E-Eng”) engaged in technical departments with equipment operations such as dry etching.

Specifically, I-Eng extracted differences from the base process, extracted differences from existing manufacturing specifications, derived weak points, examined PQC (process quality control) specifications, and performed wafer edge design. Above, create a provisional flow. In addition, I-Eng will collaborate with E-Eng to examine the provisional flow that has been created, special specifications, risk allocation, and PQC items and quantities. E-Eng extracts differences from the base process and existing product specifications in the range of elemental technology in charge, determines processing equipment (manufacturing equipment), and performs process development.
In this process development stage, I-Eng and E-Eng perform process condition determination and acquire data for the condition determination, and acquire process margin data by allocating process conditions.
When the prototype is ready, E-Eng creates a manufacturing specification document and a manufacturing device recipe. After the manufacturing apparatus recipe is created, the semiconductor device trial manufacture is started.
In this process development to trial production stage, I-Eng cooperates with E-Eng to acquire PQC data, confirm the wafer appearance, confirm the wafer back surface, confirm the weak point, and confirm the wafer edge. At the same stage, E-Eng will develop and improve elemental technologies such as shape processing & CD (critical dimension), particles, static electricity, peeling, flattening, cleaning, materials, and thermal budget. In other words, prototypes that can be evaluated as semiconductor devices with respect to clarified specifications are sent to customers as necessary, and operations are confirmed on customer systems. If there is no problem with the operation check, the prototype is completed after the prototype certification. Thereafter, from the viewpoint of yield improvement and productivity improvement, adjustment to the process of completion of trial manufacture certification, that is, process tuning is performed. When the reliability is evaluated and the product reaches a stage where it can be delivered to the customer as a product, the commercial sample is certified and the mass production trial is completed.

Next, the mass production transfer to the mass production line is executed.
Here, in the present invention, in order to smoothly transfer the mass production from the prototype line to the mass production line, in addition to the quality information and recipe information (described later), the machine difference correction information (described later) obtained at the development / prototype stage. To be transferred. In other words, conventionally, there is know-how in the heads of engineers engaged in the development / prototyping of new products, and machine difference correction information for correcting differences in the performance of semiconductor devices due to machine differences between manufacturing equipment has been transferred. We decided to transfer it first.
Then, after the mass production transfer is completed, mass production of the semiconductor device is started in the mass production line.

  In addition to the case where mass production is transferred from the prototype line to the mass production line as described above, from one mass production line (one mass production factory) to a semiconductor device manufacturer to another mass production line (other mass production factory). On the other hand, mass production may be transferred. For example, it is a case where a product with many inquiries from customers is deployed in a plurality of mass production factories. Also in this case, it is necessary to complete lifetime production early without waiting for the entry of other companies, and since smooth mass production transfer is desired, the present invention can be applied.

By the way, in particular, for semiconductor devices using a new generation process after the 90 nm node, in order to improve investment efficiency, a plurality of semiconductor device manufacturers set up a joint development company with the capital of each company. In some cases, the development of various element processes is executed, and the development results are brought back to each semiconductor device manufacturer. In other words, mass production may be transferred from a joint development company to each semiconductor device manufacturer that is a consignor. In this case, mass production at each semiconductor device manufacturer is equivalent to a completely new line from the viewpoint of new products and processes, so unlike the mass production transfer work within the same company, the above manufacturing workflow is executed from the beginning. There is a need to. Therefore, it is necessary to realize operational efficiency in the manufacturing workflow.
In addition, the development of cutting-edge semiconductor devices is often the result of a combination of optimum conditions for manufacturing equipment and process specifications. The inventors of the present invention, from the viewpoint of the quality information of the prototype, pay attention to the fact that the following machine difference correction information such as device detailed data is comprehensively reflected in the manufacturing conditions, and has not been performed conventionally. did.

FIG. 2 is a diagram showing quality information and recipe information transferred to the mass production line.
The quality information and recipe information shown in FIG. 2 are general information transferred at the time of mass production transfer.
As shown in FIG. 2, the quality information includes data on device characteristics, dimensions, and film thickness. The recipe information includes basic document data that is a manufacturing specification and a manufacturing device recipe that is downloaded to the manufacturing device in order to realize the manufacturing specification. The basic document data includes process specification data, layout rules, TEG (test element group) design data, process quality control (PQC) data for process management, layout / mask change / correction data, and the like.

FIG. 3 is a diagram showing machine difference correction information transferred to the mass production line.
Here, the machine difference correction information is detailed information generated or acquired at the mass production transfer source in the development / prototype stage, and is information transferred from the transfer source to the transfer destination at the time of mass production transfer in the present invention. In the present invention, machine difference correction information refers to the quality and mass production of a semiconductor device manufactured at a mass production transfer source, which accompanies a “machine difference” that may occur between the mass production transfer source manufacturing apparatus and the mass production transfer destination manufacturing apparatus. This is information for correcting a difference from the quality of the semiconductor device manufactured at the transfer destination.
As shown in FIG. 3, the machine difference correction information includes element technology data, newly developed content related data, shape matching data, device characteristic matching data, mask creation data, and apparatus detailed data.
In the first embodiment, all the machine difference correction information shown in FIG. 3 is transferred to the computer that manages the mass production process. However, in the second and third embodiments described later, only the searched machine difference correction information is stored. Will be transferred on demand to a computer that manages the mass production process.

The elemental technical data includes process margin data acquired by changing process conditions (gas flow rate, pressure, temperature, and high-frequency power), data for condition determination, and shot matrix data (dummy shots) indicating chip placement positions. ), Edge design data indicating how to use the wafer edge portion where the chip cannot be obtained, confirmation data thereof, and aperture ratio data of each layer.
New development content related data includes data indicating the history of newly developed technology, data indicating the contents adjusted at the time of development, data confirming the development results, newly introduced equipment (for example, manufacturing equipment), and the like. It includes the safety data, the newly introduced material, the process up to the approval of the material introduction, the safety data of the material, and the cross-sectional SEM photograph data of the part having the new device structure.
Shape fitting data is data related to newly developed content-related data, the adjustment items determined to be necessary for shape fitting, their target values, and the process developed to realize those values. And detailed data.
The device characteristic adjustment data is the data on the spacer shape and the line width (around the gate electrode) so that the characteristics, operation margin and reliability of semiconductor elements (modules) such as transistors / capacitors / resistances are required. (Including gate length) and data indicating the contents adjusted for ion implantation conditions.
The mask creation data includes mask data created based on the pattern data and optical proximity effect data necessary for each stepper when the mask data is created.
The detailed apparatus data will be described in detail later, but it is represented by time-varying performance adjustment data, NPW (non-product wafer such as dummy wafer) control data, chamber cleaning control data, apparatus maintenance data, and emission monitor technology. Process sensing technology data.

  Such machine difference correction information is generated or acquired by an engineer such as I-Eng or E-Eng as described above, is input to the terminal by the engineer, and is registered in a database accessible from a mass production transfer destination computer. (See below). Note that, as will be described in detail in a fourth embodiment to be described later, the device detailed data can also be generated by utilizing EES. A mass production transfer destination engineer can search and obtain machine difference correction information registered in the database as necessary. The input of the machine difference correction information is not limited to after completion of the prototype, but may be performed sequentially during the prototype.

  The machine difference correction information includes non-success cases and non-complete cases. Here, for unsuccessful cases and unfinished cases, in addition to the data that became official reports, evaluation result data that was evaluated for improvement, evaluation result data that was not adopted without improvement, or experiments Data and result data that failed in examination due to problems with the evaluation method are included. Thereby, the engineer of the mass production transfer destination can search and acquire not only the successful case and the completed case but also the unsuccessful case and the non-completed case. Therefore, when deriving a countermeasure at the mass production transfer destination, it is possible to prevent the waste phenomenon that has occurred in the past from recurring or repeating the same experiment and wasting time, thereby improving operational efficiency. Can be improved. This is particularly suitable when mass production is transferred from a joint development company to a contractor (semiconductor device manufacturer).

FIG. 4 is a block diagram for explaining the mass production transfer support system according to the first embodiment.
As shown in FIG. 4, a prototype management computer that manages a trial production line as a mass production transfer source management computer 10 and a mass production management computer that manages a mass production line as a mass production transfer destination management computer 30 are connected via a network 20. ing. A database 40 that can be accessed by the mass production management computer 30 is connected to the mass production management computer 30, and the machine difference correction information shown in FIG. 3 is registered in the database 40. The machine difference correction information is registered for each product name or wafer ID, for example. That is, the machine difference correction information registered in the database 40 is searched using the product name and wafer ID as search keys. The network 20 may be either wired or wireless.
A plurality of terminals 2a, 2b,... Are connected to the prototype management computer 10 via a network. The terminals 2a, 2b,... Are used for inputting performance information, recipe information, and machine difference correction information to the prototype management computer 10.

The prototype management computer 10 receives the input of the quality information and recipe information by the terminals 2a, 2b,... And the recipe information input reception means 11 and the quality / reception information of the received quality information and recipe information in the storage device 17. A recipe information storage unit 12 and a workmanship / recipe information transmission unit 13 for transmitting the quality information and recipe information to the mass production management computer 30 via the network 20 are provided.
Further, the prototype management computer 10 has a machine difference correction information input receiving unit 14 that receives input of machine difference correction information from the terminals 2a, 2b,..., And a machine difference that stores the received machine difference correction information in the storage device 17. The correction information storage means 15 and the stored machine difference correction information are read from the storage device 17, and the machine difference correction information providing means 16 that registers the read machine difference correction information in the database 40, that is, the mass production management computer 30. A machine difference correction information providing means 16 for transmitting machine difference correction information via the network 20 is further provided.
The storage device 17 may be provided outside the prototype management computer 10. In addition, the prototype management computer 10 may include a plurality of storage devices 17, and the performance information, recipe information, and machine difference correction information may be stored in each storage device.

The mass production management computer 30 receives the quality / recipe information receiving means 31 for receiving the quality information and recipe information via the network 20, and the quality / recipe information storage means 32 for storing the received quality information and recipe information in the storage device 33. And.
Further, the mass production management computer 30 receives machine difference correction information via the network 20, and registers the received machine difference correction information in the database 40, and a search request such as a product name or wafer ID. Search request data input receiving means 35 for receiving data input, and when the input of the search request data is received, the machine difference correction information registered in the database 40 is searched using the received search request data as a search key. In addition, data search means 36 for outputting the machine difference correction information as the search results and search result data storage means 37 for storing the search results in the storage device 33 are further provided.

Next, the operation of the mass production transfer support system, specifically, mass production transfer using the mass production transfer support system will be described.
First, transfer of performance information and recipe information will be described.
When completion information and recipe information are input to the terminals 2a, 2b,... By an engineer (I-Eng, E-Eng) who is engaged in development / prototyping of a new product after completion of the prototype, the input information and recipe are input. The information is received by the performance / recipe information input receiving means 11 of the prototype management computer 10. The accepted performance information and recipe information are stored in the storage device 17 by the performance / recipe information storage means 12. The stored quality information and recipe information are read from the storage device 33 by the quality / recipe information transmission means 13 and transmitted to the mass production management computer 30 via the network 20. The performance information and recipe information transmitted by the performance / recipe information transmitting means 13 of the prototype management computer 10 are received by the performance / recipe information receiving means 31 of the mass production management computer 30 via the network 20. The received performance information and recipe information are stored in the storage device 33 by the performance / recipe information storage means 32 and output. Of the output recipe information, the recipe data for manufacturing apparatus (hereinafter abbreviated as “recipe data”) is subjected to format conversion as necessary, and then downloaded to the mass production line manufacturing apparatus. Thereby, workmanship information and recipe information are transferred to the mass production line.

Next, transfer of machine difference correction information will be described.
When the machine difference correction information is input to the terminals 2a, 2b,... Together with the product name or wafer ID by the engineer (I-Eng, E-Eng) after the completion of the prototype, or during the trial production, the entered machine difference correction is performed. Information is received by the machine difference correction information input receiving means 14 of the prototype management computer 10. The accepted machine difference correction information is stored in the storage device 17 by the machine difference correction information storage means 15. The stored machine difference correction information is read from the storage device 17 by the machine difference correction information providing means 16, and the read machine difference correction information is transmitted to the mass production management computer 30 via the network 20. . The transmitted machine difference correction information is received by the database registration unit 34 of the mass production management computer 30 via the network 20, and the received machine difference correction information is received by the database registration unit 34 for each product name or wafer ID. Registered in the database 40. Thereby, the machine difference correction information is transferred to the mass production line.

When the performance of a semiconductor device manufactured on a mass production line differs from a prototype due to the presence of machine differences, that is, when the performance of a manufactured semiconductor device differs from the performance information, it is connected to a mass production management computer 30 by an engineer of the mass production line. When search request data such as a product name or wafer ID is input to a terminal (not shown), the input search request data is received by the search request data input receiving means 35 of the mass production management computer 30. Using the received search request data (that is, product name or wafer ID) as a search key, the machine difference correction information registered in the database 40 is searched by the data search means 36, and the machine difference correction information as search result data is obtained. At the same time, the machine difference correction information as the search result data is stored in the storage device 33 by the search result data storage means 37.
After that, the engineer of the mass production line selects necessary machine difference correction information from the output machine difference correction information, corrects the recipe data for the manufacturing apparatus based on the selected machine difference correction information, and corrects the correction. Downloaded recipe data to the manufacturing apparatus. Alternatively, the engineer of the mass production line changes a parameter (also referred to as “constant”) set in the manufacturing apparatus based on the selected machine difference correction information. Thus, the machine difference which existed between the manufacturing apparatus of a trial production line and a mass production line is correct | amended by correcting recipe data or changing an apparatus parameter based on machine difference correction information. Thus, mass production transfer is completed if the performance of the semiconductor device manufactured on the mass production line can be made equivalent to that of the prototype.

The engineer of the mass production line may request additional trial production as necessary (the same applies to the embodiments described later).
Specifically, although not shown in the drawing, the mass production management computer 30 receives additional prototype request data input receiving means for receiving the input of additional prototype request data, and the received additional prototype request data is sent to the prototype management computer 10 via the network 20. And a trial manufacture request data transmission means for transmitting the data, and the trial management computer 10 may further comprise a supplementary trial request data receiving means for receiving and outputting the transmitted trial manufacture request data. .
When the additional prototype request data is input to the terminal (not shown) by the engineer of the mass production line, the input additional prototype request data is received by the additional prototype request data input receiving means, and the received additional prototype request is received. Data is transmitted to the prototype management computer 10 via the network 20 by means of additional prototype request data transmission means. The transmitted additional prototype request data is received and output by the additional prototype request data receiving means. Thereafter, on the basis of the output additional prototype request data, an additional prototype of the semiconductor device is executed by an engineer involved in the prototype. The quality information, recipe information, and machine difference correction information associated with the additional prototyping are input to the terminal 2a by the engineer who performed the additional prototyping, and transferred to the mass production management computer 30 as described above.

As described above, in the first embodiment, when mass production is transferred from the prototype line to the mass production line, the machine difference correction information generated or acquired in the prototype stage is transferred together with the quality information and the recipe information. . Thereby, the engineer of the mass production line can search and acquire the machine difference correction information that is registered in the database 40 and is necessary for realizing the same quality as the prototype using the mass production management computer 30. Therefore, problems due to machine differences between manufacturing equipment will always occur, but mass production line engineers can smoothly transfer mass production even if engineers involved in the development / prototyping of new products are not dispatched to mass production transfer destinations when problems occur. Can be done.
In addition, it is possible to consult with mass production line engineers by providing machine difference correction information interactively. Therefore, inquiries from engineers on mass production lines to engineers engaged in development / prototyping are also unnecessary.

  In the first embodiment, the case where mass production is transferred from the prototype line to the mass production line has been described. However, as described above, from one mass production line (one mass production factory) to another semiconductor device manufacturer, The first embodiment can also be applied when mass production is transferred to a mass production line (another mass production factory) (the same applies to embodiments described later).

The first embodiment can also be applied to mass production transfer from a joint development company to each semiconductor device manufacturer that is a consignor (the same applies to the embodiments described later).
All development information including the unsuccessful cases and unfinished cases mentioned above is transferred to each semiconductor device manufacturer as machine error correction information, so that each semiconductor manufacturer can easily experience past defect phenomena when developing new technologies and products. Recurrence and repetition of the same experiment can be prevented, and wasted time can be prevented. Conventionally, the unsuccessful case and the unfinished case are so-called tacit knowledge and often disappear without being transferred to the technology. However, the present invention solves this problem.
In addition, by transferring the elemental technology data to each semiconductor device manufacturer as machine difference correction information, each semiconductor device manufacturer can grasp the steady state of products and processes, and shorten the analysis man-hours when trouble occurs. can do.
Further, device detailed data including operation history is transferred to each semiconductor device manufacturer as machine difference correction information, so that the performance of the semiconductor device using the device detailed data can be reproduced. Therefore, it is possible to accurately reproduce the performance of the semiconductor device.

Next, a first modification of the first embodiment will be described.
In the first embodiment described above, the case where mass production is transferred after the completion of mass production trial production has been described. By the way, in recent years, since the product life of semiconductor devices tends to be further shortened, it is required to reduce the total time required for development / trial production of semiconductor devices and transfer of mass production. Therefore, in order to satisfy this requirement, in the first modification, the mass production transfer support system according to the first embodiment is used, and the reproducibility is sequentially confirmed on the mass production line while performing the mass production trial on the prototype line. explain.

During the mass production trial, the engineer sequentially inputs the quality information and recipe information during the trial production to the terminals 2a, 2b,. Further, the machine difference correction information generated or acquired during mass production trial production by the engineer is sequentially input to the terminals 2a, 2b,... Together with the product name or wafer ID.
As described above, the input information about the quality of the trial production and the recipe information are received by the trial production management computer 10 and transmitted to the mass production management computer 30 via the network 20. The transmitted quality information and recipe information are received and output by the mass production management computer 30.
Of the output recipe information, the recipe data for the manufacturing apparatus is subjected to format conversion as necessary and then downloaded to the manufacturing apparatus of the mass production line. Then, the reproducibility of the mass production trial in the trial production line, that is, the difference between the quality of the semiconductor device manufactured in the mass production line and the production information in the middle of the trial production in the trial production line is confirmed in the mass production line.
On the other hand, the input machine difference correction information is received by the prototype management computer 10 and transmitted to the mass production management computer 30 via the network 20. The transmitted machine difference correction information is received by the mass production management computer 30 and registered in the database 40 for each product name or wafer ID.
When reproducibility of mass production prototype is not obtained in the mass production line (that is, reproducibility of performance during the trial production), when search request data such as product name or wafer ID is input to the terminal by the mass production line engineer, As described above, the input search request data is received by the mass production management computer 30, and the machine difference correction information registered in the database 40 is searched using the received search request data as a search key, Machine difference correction information is output.
After that, the mass production line engineer corrects the recipe data for the manufacturing apparatus based on the output machine difference correction information, and downloads the corrected recipe data to the manufacturing apparatus. Alternatively, a mass production line engineer changes a parameter set in the manufacturing apparatus based on the output machine difference correction information. In this way, by correcting the recipe data or changing the parameters based on the machine difference correction information, the machine difference that exists between the prototype line and the mass production line manufacturing apparatus is corrected. Thereby, the reproducibility of the mass production prototype is obtained in the mass production line.
As described above, in the first modification, mass production trial production on the trial production line and mass production transfer (reproducibility confirmation) on the mass production line are performed in parallel with a small time lag. Therefore, the total time required for the development / trial production of the semiconductor device and the mass production transfer can be shortened as compared with the case where the mass production is transferred after the mass production trial production is completed as in the first embodiment.

Next, a second modification of the first embodiment will be described.
In the second modified example, when excellent results are obtained by a mass production line engineer at the time of confirming the reproducibility of a mass production prototype as in the first modified example, the machine difference correction information input by the engineer is stored in a database. 40, and the registered machine difference correction information can be retrieved and acquired by the prototype management computer 10. Hereinafter, a description will be given focusing on the differences from the first embodiment.
FIG. 5 is a block diagram for explaining a second modification of the first embodiment of the present invention.
As shown in FIG. 5, the database registration unit 34 of the mass production management computer 30 receives the input machine difference correction information and registers the received machine difference correction information in the database 40. Further, the mass production management computer 30 reads the search result data stored in the storage device 33 and transmits the machine difference correction information as the read search result data to the prototype management computer 10 via the network 20. Data transmission means 45 is further provided. Further, the prototype management computer 10 has a search request data transmission means 18a for transmitting the search request data input from the terminals 2a, 2b,... To the mass production management computer 30 via the network 20, and a search for receiving the search result data. Result data receiving means 18b and machine difference correction information storage means 18c for storing the received search result data in the storage device 17 are further provided.

When the machine difference correction information acquired or generated by a mass production line engineer is input to the terminal together with the product name or wafer ID, the input machine difference correction information is received by the database registration unit 34 and registered in the database 40. The
When search request data such as a product name or wafer ID is input to the terminals 2a, 2b,... By an engineer of the prototype / development line, the input search request data is the search request data transmission means 18a of the prototype management computer 10. Is transmitted to the mass production management computer 30 via the network 20. The transmitted search request data is received by the search request data input receiving means 35. By using the accepted search request data as a search key, the machine difference correction information registered in the database 40 is searched by the data search means 36 and the search result data storage means 37 stores the search result data in the storage device 33. The stored search result data is read from the storage device 33 by the search result data transmitting means 45, and the read search result data is transmitted to the prototype management computer 30 via the network 20. The transmitted search result data is received and output by the search result data receiving means 18b. The received search result data is stored in the storage device 17 by the search result data storage means 18c.
In the second modification, the machine difference correction information obtained in the mass production line is registered in the database 40 and can be retrieved and acquired by the prototype management computer 10. As a result, development can be executed in parallel on both the trial production line and the mass production line, so that the total time required for the development / trial production of semiconductor devices and the transfer of mass production can be further reduced.

Embodiment 2. FIG.
FIG. 6 is a block diagram for explaining a mass production transfer support system according to the second embodiment of the present invention.
As shown in FIG. 6, the database 40 in which the machine difference correction information is stored is not connected to the mass production management computer 30 as in the first embodiment, but is connected to the prototype management computer 10. The mass production management computer 30 can access the database 40 via the network 20. In the second embodiment, necessary machine difference correction information is transferred on demand. Hereinafter, a description will be given focusing on the differences from the first embodiment.

  In the prototype management computer 10 that manages the prototype line that is the mass production transfer source, the machine difference correction information providing unit 16 stores the machine difference correction information stored in the storage device 17 by the machine difference correction information storage unit 15 from the storage device 17. The database registration means 16a for reading and registering the read machine difference correction information in the database 40 for each product name or wafer ID and the search request data such as the product name or wafer ID are received via the network 20. When the search request data is received by the search request data receiving means 16b and the search request data receiving means 16b, the machine difference correction information registered in the database 40 is searched using the received search request data as a search key. Machine difference correction information as a search result is transmitted to the mass production management computer 30 via the network 20. And a chromatography data retrieval means 16c.

  The mass production management computer 30 that manages the mass production line to which the mass production is transferred receives the retrieval request received when the retrieval request data input accepting means 35 accepts the retrieval request data such as the product name or the wafer ID. Search request data transmitting means 38 for transmitting data to the prototype management computer 10 via the network 20; Search result data receiving means 39 for receiving and outputting machine difference correction information as a search result via the network 20; It has. The search result data storage unit 37 of the mass production management computer 30 stores the machine difference correction information that is the search result received by the search result data receiving unit 39 in the storage device 33.

Next, mass production transfer using the mass production transfer support system will be described.
Since the transfer of the quality information and the recipe information is the same as that of the first embodiment, the description thereof is omitted.
Hereinafter, transfer of machine difference correction information on demand will be described.
When the machine difference correction information is input to the terminals 2a, 2b,... Together with the product name or the wafer ID by the engineer (I-Eng, E-Eng) after the prototype is completed or during the prototype, the input machine difference correction information is input. Is received by the machine difference correction information input receiving means 14 of the prototype management computer 10. The accepted machine difference correction information is stored in the storage device 17 by the machine difference correction information storage means 15. The stored machine difference correction information is read from the storage device 17 by the database registration unit 16a of the machine difference correction information providing unit 16, and the read machine difference correction information is stored in the database 40 for each product name or wafer ID. Registered in
At the time of mass production transfer, if the performance of the semiconductor device differs from the prototype due to machine differences, a product name or wafer ID is displayed on a terminal (not shown) connected to the mass production management computer 30 by a mass production line engineer. When the search request data is input, the input search request data is received by the search request data input receiving means 35 of the mass production management computer 30. The accepted search request data is transmitted to the prototype management computer 10 via the network 20 by the search request data transmission means 38. When the transmitted search request data is received by the search request data receiving means 16b of the prototype management computer 10 via the network 20, the data search means 16c uses the received search request data as a search key to store it in the database 40. The registered machine difference correction information is searched, and the machine difference correction information as a search result is transmitted to the mass production management computer 30 via the network 20 by the data search means 16c. The machine difference correction information as the transmitted search result data is received and output by the search result data receiving means 39 of the mass production management computer 30 via the network 20, and the received machine difference correction information is stored in the search result data storage. The data is stored in the storage device 33 by the means 37. Thereby, the machine difference correction information is transferred to the mass production line on demand.
Thereafter, the engineer of the mass production line corrects the recipe data for the manufacturing apparatus based on the output machine difference correction information, and downloads the corrected recipe data to the manufacturing apparatus. Alternatively, a mass production line engineer changes a parameter set in the manufacturing apparatus based on the output machine difference correction information. Thus, the machine difference which existed between the manufacturing apparatus of a trial production line and a mass production line is correct | amended by correcting recipe data or changing an apparatus parameter based on machine difference correction information. Thus, mass production transfer is completed if the performance of the semiconductor device manufactured on the mass production line can be made equivalent to that of the prototype.

  As described above, in the second embodiment, when mass production is transferred from a prototype line to mass production line, quality information and recipe information are transferred, and machine difference correction information generated or acquired in the prototype stage is transferred on demand. It was decided to transfer. Thereby, the engineer of the mass production line can search and acquire the machine difference correction information that is registered in the database 40 and is necessary for realizing the same quality as the prototype using the mass production management computer 30. Therefore, even if an engineer who is involved in the development / prototyping of a new product is not dispatched to a mass production transfer destination, mass production line engineers can smoothly carry out mass production transfer.

Next, a first modification of the second embodiment will be described.
As described in the first modification of the first embodiment described above, it is required to reduce the total time required for development / trial production of semiconductor devices and mass production transfer. Therefore, in order to satisfy this requirement, in the first modification, the mass production transfer support system according to the second embodiment is used, and the reproducibility is sequentially confirmed on the mass production line while performing the mass production trial on the trial production line. explain.

During the mass production trial, the engineer sequentially inputs the quality information and recipe information during the trial production to the terminals 2a, 2b,. Further, machine difference correction information acquired during mass production trial production by the engineer is sequentially input to the terminals 2a, 2b,... Together with the product name or wafer ID.
As described above, the input quality information and recipe information are received by the prototype management computer 10 and transmitted to the mass production management computer 30 via the network 20. The transmitted quality information and recipe information are received by the mass production management computer 30, and are output and stored.
The output recipe information for the manufacturing apparatus as the output recipe information is format-converted as necessary and then downloaded to the manufacturing apparatus of the mass production line. And the reproducibility of the mass production prototype in the prototype line is confirmed in the mass production line.
On the other hand, the input machine difference correction information is received by the prototype management computer 10 and registered in the database 40 for each product name or wafer ID.

When reproducibility of mass production prototype is not obtained in the mass production line (that is, reproducibility of performance during the trial production), when search request data such as product name or wafer ID is input to the terminal by the mass production line engineer, As described above, the input search request data is received by the mass production management computer 30 and transmitted to the prototype management computer 10 via the network 20. When the transmitted search request data is received by the prototype management computer 10, the machine difference correction information registered in the database 40 is searched using the received search request data as a search key, and machine difference correction as search result data is performed. Information is transmitted to the mass production management computer 30 via the network 20. The transmitted machine difference correction information is received and output by the mass production management computer 30.
After that, the mass production line engineer corrects the recipe data for the manufacturing apparatus based on the output machine difference correction information, and downloads the corrected recipe data to the manufacturing apparatus. Alternatively, a mass production line engineer changes a parameter set in the manufacturing apparatus based on the output machine difference correction information. In this way, by correcting the recipe data or changing the parameters based on the machine difference correction information, the machine difference that exists between the prototype line and the mass production line manufacturing apparatus is corrected. Thereby, the reproducibility of the mass production prototype is obtained in the mass production line.

  As described above, in the first modified example, mass production trial production on the trial production line and mass production transfer (reproducibility confirmation) on the mass production line are performed in parallel with a small time lag. Therefore, the total time required for development / trial production of semiconductor devices and mass production transfer can be shortened as compared to the case where mass production is transferred after completion of mass production trial production as in the second embodiment.

Next, a second modification of the second embodiment will be described.
Similar to the second modification of the first embodiment, the second modification is a case where an excellent result is obtained by a mass production line engineer at the time of confirming the reproducibility of the mass production prototype as in the first modification. The machine difference correction information input by the engineer is registered in the database 40, and the registered machine difference correction information can be retrieved and acquired by the prototype management computer 10. Hereinafter, a description will be given focusing on the differences from the second embodiment.
FIG. 7 is a block diagram for explaining a second modification of the second embodiment of the present invention.
As shown in FIG. 7, the mass production management computer 30 includes a machine difference correction information input receiving unit 46 that receives input of machine difference correction information, and machine difference correction information that stores the received machine difference correction information in the storage device 33. Storage unit 47 and machine difference correction information for reading the stored search result data from storage device 33 and transmitting machine difference correction information as the read search result data to prototype management computer 10 via network 20 Providing means 48. The database registration unit 16 a of the prototype management computer 10 receives the machine difference correction information via the network 20 and registers the received machine difference correction information in the database 40. The prototype management computer 10 further includes search result data storage means 18a for storing and outputting the machine difference correction information as search result data by the data search means 16c in the storage device 17.

When machine difference correction information acquired or generated by a mass production line engineer is input to the terminal together with the product name or wafer ID, the input machine difference correction information is received by the machine difference correction information input means 46 and is received. The machine difference correction information is stored in the storage device 33 by the machine difference correction information storage means 47. The stored machine difference correction information is read by the machine difference correction information providing means 48, and the read machine difference correction information is transmitted to the prototype management computer 10 via the network 20. The transmitted machine difference correction information is received by the database registration means 16a, and the received machine difference correction information is registered in the database 40 for each product name or wafer ID by the database registration means 16a.
When the search request data such as the product name or wafer ID is input to the terminals 2a, 2b,... By the engineers on the prototype / development line, the input search request data is received by the search request data receiving means 16b. Using the received search request data as a search key, the machine difference correction information registered in the database 40 is searched by the data search unit 16c, and the search result data is stored in the storage device 17 by the search result data storage unit 18a. Is output.
In the second modification, the machine difference correction information obtained in the mass production line is registered in the database 40 and can be retrieved and acquired by the prototype management computer 10. As a result, development can be executed in parallel on both the trial production line and the mass production line, so that the total time required for the development / trial production of semiconductor devices and the transfer of mass production can be further reduced.

Embodiment 3 FIG.
FIG. 8 is a block diagram for explaining a mass production transfer support system according to the third embodiment.
As shown in FIG. 8, the database 40 in which the machine difference correction information is stored is a computer different from both the prototype management computer 10 and the mass production management computer 30 and is connected to a remote computer 50 connected to the network 20. Yes. The mass production management computer 30 can access the database 40 via the network 20. Hereinafter, the third embodiment will be described with a focus on the differences from the first and second embodiments.

  The machine difference correction information providing means 16 of the prototype management computer 10 reads the machine difference correction information stored in the storage device 17 by the machine difference correction information storage means 15 and sends the read machine difference correction information to the remote computer 50. It transmits via the network 20.

  The remote computer 50 receives machine difference correction information transmitted from the prototype management computer 10 via the network 20 and registers the received machine difference correction information in the database 40 for each product name or wafer ID. 51, search request data receiving means 52 for receiving search request data via the network 20, and when the search request data is received, the machine difference correction information registered in the database 40 is searched, and the search result Data search means 53 for outputting machine difference correction information, and search result data transmission means 54 for sending machine difference correction information as the output search result to the mass production management computer 30 via the network 20. I have.

  The search result data receiving unit 39 of the mass production management computer 30 receives the machine difference correction information as the search result transmitted by the search result data transmitting unit 54 of the remote computer 50 via the network 20.

Next, the operation of the mass production transfer support system, specifically, mass production transfer using the mass production support system will be described.
Since the transfer of the quality information and the recipe information is the same as that of the first embodiment, the description thereof is omitted.
Hereinafter, transfer of machine difference correction information will be described.
When the terminal 2a, 2b,... Machine difference correction information is input together with the product name or wafer ID by the engineer (I-Eng, E-Eng) after the prototype is completed or during the prototype, the input machine difference correction information is It is received by the machine difference correction information input receiving means 14 of the prototype management computer 10. The accepted machine difference correction information is stored in the storage device 17 by the machine difference correction information storage means 15. The stored machine difference correction information is read by the machine difference correction information providing means 16, and the read machine difference correction information is transmitted to the remote computer 50 via the network 20. The transmitted machine difference correction information is received by the database registration means 51 of the remote computer 50 via the network 20, and the received machine difference correction information is stored in the database 40 by the database registration means 51 for each product name or wafer. Registered for each ID.
At the time of mass production transfer, if the performance of the semiconductor device differs from the prototype due to machine differences, a product name or wafer ID is displayed on a terminal (not shown) connected to the mass production management computer 30 by a mass production line engineer. When the search request data is input, the input search request data is received by the search request data input receiving means 35 of the mass production management computer 30. The accepted search request data is transmitted to the remote computer 50 via the network 20 by the search request data transmitting means 38. When the transmitted search request data is received by the search request data receiving means 52 of the remote computer 50 via the network 20, it is registered in the database 40 by the data search means 53 using the received search request data as a search key. The machine difference correction information thus obtained is searched, and the machine difference correction information as a search result is transmitted to the mass production management computer 30 via the network 20 by the search result data transmission means 54. The transmitted machine difference correction information as a search result is received and output by the search result data receiving means 39 of the mass production management computer 30 via the network 20, and the received machine difference correction information is the search result data storage means. 37 is stored in the storage device 33. Thereby, the machine difference correction information is transferred to the mass production line on demand.
Thereafter, the engineer of the mass production line corrects the recipe data for the manufacturing apparatus based on the output machine difference correction information, and downloads the corrected recipe data to the manufacturing apparatus. Alternatively, a mass production line engineer changes a parameter set in the manufacturing apparatus based on the output machine difference correction information. Thus, the machine difference which existed between the manufacturing apparatus of a trial production line and a mass production line is correct | amended by correcting recipe data or changing an apparatus parameter based on machine difference correction information. Thus, mass production transfer is completed if the performance of the semiconductor device manufactured on the mass production line can be made equivalent to that of the prototype.

  As described above, in the third embodiment, when mass production is transferred from the trial production line to the mass production line, the machine difference correction information generated or acquired in the trial production stage is transferred together with the quality information and the recipe information on demand. It was decided. Thereby, the engineer of the mass production line can search and acquire the machine difference correction information that is registered in the database 40 and is necessary for realizing the same quality as the prototype using the mass production management computer 30. Therefore, even if an engineer who is involved in the development / prototyping of a new product is not dispatched to a mass production transfer destination, mass production line engineers can smoothly carry out mass production transfer.

Next, a first modification of the third embodiment will be described.
As described in the first modification of the first embodiment described above, it is required to reduce the total time required for development / trial production of semiconductor devices and mass production transfer. Therefore, in order to satisfy this requirement, in the first modified example, the mass production transfer support system according to the third embodiment is used, and the reproducibility is sequentially confirmed on the mass production line while performing the mass production trial on the prototype line. explain.

During the mass production trial, the engineer sequentially inputs the quality information and recipe information during the trial production to the terminals 2a, 2b,. Further, machine difference correction information acquired during mass production trial production by the engineer is sequentially input to the terminals 2a, 2b,... Together with the product name or wafer ID.
As described above, the input quality information and recipe information are received by the prototype management computer 10 and transmitted to the mass production management computer 30 via the network 20. The transmitted quality information and recipe information are received by the mass production management computer 30, and are output and stored.
The output recipe information for the manufacturing apparatus as the output recipe information is format-converted as necessary and then downloaded to the manufacturing apparatus of the mass production line. And the reproducibility of the mass production prototype in the prototype line is confirmed in the mass production line.
On the other hand, the input machine difference correction information is received by the prototype management computer 10 and transmitted to the remote computer 50 via the network 20. The transmitted machine difference correction information is received by the remote computer 50 and registered in the database 40 for each product name or wafer ID.

When reproducibility of mass production prototype is not obtained in the mass production line (that is, reproducibility of the quality during the trial production), when search request data such as product name or wafer ID is input to the terminal by the mass production line engineer, As described above, the input search request data is received by the mass production management computer 30, and the received search request data is transmitted to the remote computer 50 via the network 20. When the transmitted search request data is received by the prototype management computer 50, the machine difference correction information registered in the database 40 is searched by using the received search request data as a search key, and the machine difference correction as a search result is performed. Information is transmitted to the mass production management computer 30 via the network 20. The transmitted machine difference correction information is received and output by the mass production management computer 30.
After that, the mass production line engineer corrects the recipe data for the manufacturing apparatus based on the output machine difference correction information, and downloads the corrected recipe data to the manufacturing apparatus. Alternatively, a mass production line engineer changes a parameter set in the manufacturing apparatus based on the output machine difference correction information. In this way, by correcting the recipe data or changing the parameters based on the machine difference correction information, the machine difference that exists between the prototype line and the mass production line manufacturing apparatus is corrected. Thereby, the reproducibility of the mass production prototype is obtained in the mass production line.

  As described above, in the first modified example, mass production trial production on the trial production line and mass production transfer (reproducibility confirmation) on the mass production line are performed in parallel with a small time lag. Therefore, the total time required for the development / trial production of the semiconductor device and the mass production transfer can be shortened as compared with the case where the mass production is transferred after completion of the mass production trial production as in the third embodiment.

Next, a second modification of the third embodiment will be described.
Similar to the second modification of the first embodiment, the second modification is a case where an excellent result is obtained by a mass production line engineer at the time of confirming the reproducibility of the mass production prototype as in the first modification. The machine difference correction information input by the engineer is registered in the database 40, and the registered machine difference correction information can be retrieved and acquired by the prototype management computer 10. Hereinafter, a description will be given focusing on the parts different from the third embodiment.
FIG. 9 is a block diagram for explaining a second modification of the third embodiment of the present invention.
As shown in FIG. 9, the mass production management computer 30 includes machine difference correction information input receiving means 46 that receives input of machine difference correction information, and machine difference correction information that stores the received machine difference correction information in the storage device 33. Storage means 47 and machine difference correction information providing means 48 for reading the stored machine difference correction information from the storage device 33 and transmitting the read machine difference correction information to the remote computer 50 via the network 20. In addition. The database registration unit 51 of the remote computer 50 receives the machine difference correction information transmitted by the machine difference correction information providing unit 48 via the network 20 and registers the received machine difference correction information in the database 40. The prototype management computer 10 receives search request data transmission means 18a for transmitting search request data input from the terminals 2a, 2b,... To the remote computer 50 via the network 20, and search result data reception for receiving search result data. Means 18b and machine difference correction information storage means 18c for storing the received search result data in the storage device 17 are further provided.

When the machine difference correction information is input to the terminal by the engineer of the mass production line, the input machine difference correction information is received by the machine difference correction information input means 46, and the received machine difference correction information is the machine difference correction information. The data is stored in the storage device 33 by the storage means 47. The stored machine difference correction information is read from the storage device 33 by the machine difference correction information providing means 48, and the read machine difference correction information is transmitted to the remote computer 50 via the network 20. The transmitted machine difference correction information is received by the database registration means 51 and registered in the database 40.
When search request data such as a product name or wafer ID is input to the terminals 2a, 2b,... By a prototype / development line engineer, the input search request data is accepted by the search request data transmission means 18a. The accepted search request data is transmitted to the remote computer 50 via the network 20. The transmitted search request data is received by the search request data receiving means 52, and the machine difference correction information registered in the database 40 is searched by the data search means 53 using the received search request data as a search key. Result data is transmitted to the prototype management computer 10 via the network 20 by the search result data transmission means 54. The transmitted search result data is received by the search result data receiving unit 18b, and the received search result data is stored in the storage unit 17 and output by the search result data storage unit 18c.
In the second modification, the machine difference correction information obtained in the mass production line is registered in the database 40 and can be retrieved and acquired by the prototype management computer 10. As a result, development can be executed in parallel on both the trial production line and the mass production line, so that the total time required for the development / trial production of semiconductor devices and the transfer of mass production can be further reduced.

Embodiment 4 FIG.
In the first to third embodiments described above, the machine difference correction information input to the terminals 2a, 2b,... By the engineer is received by the machine difference correction information input receiving means 14 of the prototype management computer 10. In the fourth embodiment of the present invention, device detailed data, which is one piece of machine difference correction information, is generated using an EES (equipment engineering system).
Here, as shown in FIG. 3, the detailed apparatus data includes data indicating the number of processed sheets in each chamber of the manufacturing apparatus, data indicating control (seasoning control) by NPW (non-product wafer such as a dummy wafer), Operation history data including data indicating dry cleaning control and equipment maintenance data indicating wet cleaning in the chamber and replacement of equipment components, data indicating the construction of the production equipment, distance from the production equipment to the factory main exhaust, It includes installation status data indicating lift (cooling water temperature, inert gas pressure, etc.), process monitor data represented by a luminescence monitor, and particle data.

FIG. 10 is a block diagram for explaining machine difference correction information generation means in the fourth embodiment.
As shown in FIG. 10, the EES 80 as the machine difference correction information generating unit includes a manufacturing apparatus 81, an EES server 82, and an EES terminal 83. The manufacturing apparatus 81, the EES server 82, and the EES terminal 83 constituting the EES 80 are connected to the prototype management computer 10 via a network. The prototype management computer 10 is connected to a mass production management computer (not shown) via the network 20 as described in the first to third embodiments.

  The manufacturing apparatus 81 includes DEE data transmission means 81 a that transmits DEE (detailed equipment events) data indicating an operation or state change in the manufacturing apparatus 81 to the EES server 82. Here, as DEE data, for example, wafer ID data, wafer processing time, gas supply valve open / close signal, gate valve open / close signal, pump ON / OFF signal, atmospheric pressure switch ON / OFF signal, wafer transfer Data indicating an arm detection signal, a wafer stage position detection signal, and the like.

The DEE server 82 receives the DEE data transmitted by the DEE data transmitting unit 81a, selects the required DEE data from the received DEE data, and selects a device from the selected DEE data. Device detailed data generating means 82b for generating detailed data and storing the generated device detailed data in the storage device 82d, and reading the stored device detailed data from the storage device 82d, and reading the device detailed data Is transmitted to the prototype management computer 10 via a network.
For example, the apparatus detailed data generation unit 82b generates NPW control data indicating the number of dummy wafers required for chamber conditioning (seasoning) based on the selected plurality of wafer ID data. Further, the generation unit 82b generates operational history data indicating the wet cleaning cycle in the chamber based on, for example, the ON / OFF signal of the pump and the ON / OFF signal of the atmospheric pressure switch.
The EES terminal 83 is a terminal that performs various inputs to the EES server 82. As in the case of the terminals 2a, 2b,..., The device detailed data can be input to the EES terminal 83 by an engineer, and the input data can be received by the prototype management computer 10.

Next, the operation of the machine difference correction information generation means, that is, generation and input of device detailed data will be described.
When a wafer is processed in the manufacturing apparatus 81 connected to the manufacturing apparatus 81 constituting the prototype line, that is, the prototype management computer 10, DEE data is generated. The generated DEE data is transmitted to the EES server 82 by the DEE data transmission unit 81a for each process of one wafer or for each of a plurality of processes. The transmitted DEE data is received by the DEE data receiving means 82a of the EES server 82, and necessary DEE data is selected from the received DEE data by the device detailed data generating means 82b, and the selected DEE data is selected. Device detail data is generated from the data. The generated device detailed data is stored in the storage device 82d by the device detailed data generating means 82b. The stored device detailed data is read by the device detailed data transmitting means 82c, and the read device detailed data is transmitted to the prototype management computer 10. The transmitted device detailed data is received by the machine difference correction information input receiving means 14 of the prototype management computer 10, and the received device detailed data is received as machine difference correction information. The device detailed data as the accepted machine difference correction information is stored in the storage device 17 by the machine difference correction information storage means 15.
Subsequent registration in the database 40 and retrieval of machine difference correction information are the same as those in the first to third embodiments, and a description thereof will be omitted.

As described above, in the fourth embodiment, device detailed data as machine difference correction information is generated based on DEE data generated in the manufacturing device 81, and the generated device detailed data is stored in the prototype management computer 10. The machine difference correction information input accepting means 14 accepts it. The device detailed data is registered in the database 40 and can be searched using the mass production management computer 30. Therefore, a mass production line engineer can acquire device detailed data as device difference correction information and correct the device difference.
Along with this, the engineer of the mass production line can grasp the adjustment area and the performance area of the manufacturing apparatus constituting the mass production line. For example, after a quartz part is replaced due to maintenance, the amount of consumption of the quartz part placed in the chamber can be estimated depending on how many (how many times) processes have been performed, and further depends on the amount of consumption. Thus, the possibility that the process margin is reduced can be estimated.

  In the fourth embodiment, when mass production is transferred from one mass production line (one mass production factory) to another mass production line (other mass production factory), that is, when deployed in a plurality of mass production factories. Can be applied. In this case, device detailed data can be generated based on DEE data acquired from a plurality of manufacturing devices in one mass production line (one mass production factory) previously mass-produced. Therefore, more device detailed data can be generated than when device detailed data is generated in a prototype line, and an engineer of a mass production line can acquire a large amount of device detailed data as machine difference correction information.

  The fourth embodiment can also be applied to the case where mass production is transferred from a joint development company to a semiconductor device manufacturer as a consignor as described above. In this case, even if a new manufacturing apparatus is introduced in the mass production line of each semiconductor device manufacturer that is a consignor, the adjustment area and performance area of the manufacturing apparatus can be grasped early.

By the way, in order to actually operate the manufacturing equipment in the mass production line, as described above, not only the equipment difference between the production equipment at the mass production transfer source and the mass production transfer destination at the time of mass production transfer, but also the same production after the mass production transfer. There are in-device machine differences that occur within the device. The in-device difference refers to a difference in the performance of the current manufacturing device with respect to the performance of the manufacturing device at the start-up, and is often a change that occurs with a change in the manufacturing device over time or a failure. Even in the case where the difference between the devices in the apparatus occurs, the difference in the performance of the semiconductor device is different from the case where the difference between the apparatuses in the device occurs. Therefore, it is necessary to manage the difference between the apparatuses in the manufacturing apparatus.
The fourth embodiment can also be applied when such a device difference occurs. That is, in order to correct the difference in the performance of the semiconductor device due to the difference between the devices in the apparatus, the device detailed data as the machine difference correction information generated by the EES 80 in the fourth embodiment can be effectively used. In other words, the device detailed data as machine difference correction information registered in the database 40 can be searched and acquired using the mass production management computer 30 after mass production transfer. Therefore, even if an engineer who is involved in the development / prototyping of a new product is not dispatched to a mass production transfer destination, the difference in the quality of the semiconductor device due to the difference in the equipment in the device can be corrected by the engineer of the mass production line.

  The machine difference correction information generating means described in the fourth embodiment can be applied to a semiconductor manufacturing system described later. That is, the device detailed data generated by the EES 80 as the machine difference correction information generating means is received as the machine difference correction information by the machine difference correction information input receiving means 14 of the prototype management computer 10 of the semiconductor manufacturing system.

Embodiment 5 FIG.
FIG. 11 is a block diagram for explaining a semiconductor manufacturing system according to the fifth embodiment of the present invention.
As shown in FIG. 11, a prototype management computer 10 that manages prototype lines and a mass production management computer 30 that manages mass production lines are connected via a network 20. A database 40 that can be accessed by the mass production management computer 30 is connected to the mass production management computer 30, and the above-described machine difference correction information (see FIG. 3) is registered in the database 40. The machine difference correction information is registered for each product name or wafer ID, for example. That is, the machine difference correction information registered in the database 40 is searched using the product name and wafer ID as search keys.

  As described in the first embodiment, the prototype management computer 10 is connected to a plurality of terminals 2a, 2b,. Further, the prototype management computer 10 is a performance / recipe information input receiving means 11, a performance / recipe information storage means 12, a workmanship / recipe information transmitting means 13, a machine difference correction information input receiving means 14, and a machine difference correction information. A storage unit 15, a machine difference correction information providing unit 16, and a storage device 17 are provided.

A test / inspection device 5 and a manufacturing device 7 are connected to the mass production management computer 30 via a network. A plurality of test / inspection apparatuses 5 and manufacturing apparatuses 7 exist, and the plurality of test / inspection apparatuses 5 and manufacturing apparatuses 7 constitute a mass production line.
As described in the first embodiment, the mass production management computer 30 includes the quality / recipe information receiving means 31, the quality / recipe information storage means 32, the storage device 33, the database registration means 34, and the search request data input acceptance. Means 35, data search means 36, and search result data storage means 37 are provided.
Further, the mass production management computer 30 receives the test / inspection result data receiving means 41 for receiving the test / inspection result data transmitted by the test / inspection apparatus 5, and whether the received test / inspection result data satisfies a predetermined standard. A search request data generation means 42 for determining whether or not the search request data is generated. Specifically, the search request data generation means 42 reads out the quality information transferred from the prototype management computer 10 from the storage device 33, compares the read quality information with the test / inspection result data, and is equivalent. That is determined to satisfy a predetermined standard.
The search request data input receiving unit 35 of the mass production management computer 30 receives the search request data generated by the search request data generating unit 42. When the search request data is received by the search request data input receiving means 35, the data search means 36 searches for machine difference correction information registered in the database 40.
Further, the mass production management computer 30 reads the recipe data of the recipe information stored in the storage device 33 by the quality / recipe information storage means 32 from the storage device 33, and sends the read recipe data to the manufacturing device 7. Recipe transmission means 61 for transmitting, and recipe correction means for reading the machine difference correction information stored in the storage device 33 by the search result data storage means 37 and correcting the recipe data based on the read machine difference correction information. 62 and a modified recipe transmitting unit 63 that transmits recipe data corrected by the recipe correcting unit 62 (hereinafter referred to as “modified recipe data”) to the manufacturing apparatus 7.

  The test / inspection device 5 is a device that performs a test / inspection of a semiconductor device or wafer that has been subjected to a predetermined process by the manufacturing device 7. For example, a logic test device, a memory test device, or a length measurement SEM device that performs an electrical test. Etc. The test / inspection apparatus 5 includes test / inspection result data transmission means 55 for transmitting test / inspection result data indicating the quality of the semiconductor device to the mass production management computer 30.

  The manufacturing apparatus 7 is an apparatus that executes processing based on recipe data, and is, for example, a CVD apparatus, a PVD apparatus, an etching apparatus, a CMP apparatus, an annealing apparatus, or the like. The manufacturing apparatus 7 receives the recipe data transmitted by the recipe transmission means 61 of the mass production management computer 30 and stores the received recipe data in the storage device 74, and the modified recipe transmission of the mass production management computer 30. A modified recipe receiving means 72 for receiving the modified recipe data transmitted by the means 62 and a recipe rewriting means 73 for rewriting the recipe data by storing the received modified recipe data in the storage device 74 are provided.

Next, the operation of the semiconductor manufacturing system, specifically, a method for manufacturing a semiconductor device using the semiconductor manufacturing system will be described.
First, transfer of performance information and recipe information will be described.
When the performance information and recipe information are input into the terminals 2a, 2b,. / Received by the recipe information input receiving means 11 The accepted performance information and recipe information are stored in the storage device 17 by the performance / recipe information storage means 12. The stored quality information and recipe information are read from the storage device 33 by the quality / recipe information transmission means 13 and transmitted to the mass production management computer 30 via the network 20. The transmitted quality information and recipe information are received by the quality / recipe information receiving means 31 of the mass production management computer 30 via the network 20. The received quality information and recipe information are stored in the storage device 33 by the quality / recipe information storage means 32. Of the stored recipe information, the recipe data for the manufacturing apparatus is read from the storage device 33 by the recipe transmitting means 61, and the read recipe data is subjected to format conversion as necessary, and then sent to the manufacturing apparatus 7. Sent to. The transmitted recipe data is received by the recipe receiving means 72 of the manufacturing apparatus 7, and the received recipe data is stored in the storage device 75. Thereby, workmanship information and recipe information are transferred to the mass production line.

  Since the transfer of machine difference correction information is the same as that described in the first embodiment, the description thereof is omitted.

And in the manufacturing apparatus 7, a predetermined | prescribed process process is performed based on the transferred recipe data.
After the process is executed, the semiconductor device or wafer (not shown) is transferred to the test / inspection apparatus 5, and the semiconductor device or wafer is tested / inspected in the test / inspection apparatus 5. After the test / inspection is completed, the test / inspection result data indicating the performance of the semiconductor device is transmitted to the mass production management computer 30 by the test / inspection result data transmission means 55. The transmitted test / inspection result data is received by the test / inspection result data receiving means 41 of the mass production management computer 30, and whether or not the received test / inspection result data satisfies a predetermined standard is search request data. It is determined by the generation means 42. Here, if the standard is satisfied, it is assumed that the quality of the semiconductor device manufactured on the mass production line is not different from the quality of the prototype, that is, the quality of the semiconductor device manufactured on the mass production line is equivalent to the prototype. Complete the mass production transfer. On the other hand, if the standard is not met, the difference between the quality of the semiconductor device manufactured on the mass production line and the quality of the prototype will be explained as described below. Search and obtain correction information.

First, search request data is generated by the search request data generating means 42. The search request data is, for example, a product name or a wafer ID. The generated search request data is received by the search request data input receiving means 35.
Thereafter, as described in the first embodiment, the difference search information registered in the database 40 is searched by the data search means 36 using the received search request data as a search key, and the difference correction as a search result is performed. The information is stored in the storage device 33 by the search result data storage means 37. Here, when a plurality of machine difference correction information are registered, for example, the data search means 36 outputs them in order from the latest registration time. The stored machine difference correction information is read by the recipe correction means 62, and the recipe data is corrected by the recipe correction means 62 based on the read machine difference correction information. The corrected recipe data is transmitted to the manufacturing apparatus 7 by the corrected recipe transmitting means 63. The transmitted corrected recipe data is received by the corrected recipe data receiving means 72 of the manufacturing apparatus 7, and the received corrected recipe data is stored in the storage device 74 by the recipe rewriting means 73. Thereby, the recipe data of the manufacturing apparatus 7 is rewritten.
Thereafter, a processing process is executed in the manufacturing apparatus 7 based on the corrected recipe data, and a test / inspection is executed in the test / inspection apparatus 5. Then, as described above, the test / inspection result data is transmitted to the mass production management computer 30, and the mass production management computer 30 determines whether or not the test / inspection result data satisfies a predetermined standard. If the standard is satisfied, the mass production transfer is completed assuming that the difference in performance is corrected. On the other hand, when the standard is not satisfied, the search / acquisition of machine difference correction information is executed again.

  As described above, in the fifth embodiment, when mass production is transferred from the prototype line to the mass production line, quality information and recipe information are transferred, and machine difference correction information generated or acquired in the prototype stage is transferred on demand. It was decided to transfer. If the performance of a semiconductor device manufactured on a mass production line is different from the performance of a prototype, machine difference correction information for correcting this difference in performance is retrieved and acquired from the database 40, and the acquired machine The recipe data of the manufacturing apparatus 7 is corrected based on the difference correction information, and the semiconductor device is manufactured using the corrected recipe data. Therefore, mass production transfer from the prototype line to the mass production line can be automatically performed without the engineers involved in the development / trial production of the new product and the engineers of the mass production line, and smooth mass production transfer is possible.

Similarly to the modification of the first embodiment, the semiconductor manufacturing system according to the fifth embodiment may be used to sequentially confirm the reproducibility of the mass production prototype on the mass production line while performing the mass production prototype on the prototype production line. Yes (the same applies to Embodiments 6 and 7 described later).
Specifically, when the performance information and recipe information during the trial production and the machine difference correction information generated or acquired during the trial production are sequentially input to the terminal 2a, the inputted information is received by the trial production management computer 10. And transmitted to the mass production management computer 30 via the network 20. The transmitted quality information and recipe information are received by the mass production management computer 30.
Of the received recipe information, the recipe data for the manufacturing apparatus is transmitted to the manufacturing apparatus 7. In the manufacturing apparatus 7, a process process is performed based on the received recipe data. Thereafter, the test / inspection apparatus 5 performs a test / inspection of the semiconductor device or the wafer. Test / inspection result data indicating the performance of the semiconductor device is transmitted to the mass production management computer 30, and the search request data generating means 42 determines whether the test / inspection result data satisfies a predetermined standard. Here, when the standard is satisfied, the reproducibility of the mass production prototype is obtained. On the other hand, if the standard is not satisfied, the reproducibility of the mass production prototype cannot be obtained, and as described in the fifth embodiment, the search / acquisition of the machine difference correction information for correcting the difference in performance is executed. To do.
In this way, the total time required for semiconductor device development / prototyping and mass production transfer is shortened by performing mass production trial production on the prototype line and mass production transfer (reproducibility confirmation) on the mass production line in parallel with a small time lag. Can do.

Next, a modification of the fifth embodiment will be described.
Embodiment 5 mentioned above demonstrated the case where the recipe data of a manufacturing apparatus were corrected based on the acquired machine difference correction information. In this modification, a case will be described in which a parameter set in the manufacturing apparatus is changed based on the acquired machine difference correction information. Hereinafter, a description will be given focusing on the parts different from the fifth embodiment.

FIG. 12 is a block diagram for explaining a modification of the fifth embodiment of the present invention.
As shown in FIG. 12, the mass production management computer 30 is parameter data set in the manufacturing apparatus 7 and is stored in the storage device 33 by the search result data storage means 37 and data stored in the storage device 33 in advance. The machine parameter correction information is read from the storage device 33 and the parameter data is corrected based on the machine difference correction information, and the corrected parameter data (hereinafter referred to as “corrected parameter data”). A correction parameter transmission means 65 for transmitting to the manufacturing apparatus 7 is further provided.
In addition, the manufacturing apparatus 7 connected to the mass production management computer 30 via the network includes the correction parameter receiving means 75 for receiving the correction parameter data transmitted by the correction parameter transmission means 65 of the mass production management computer 30, and the received correction. Parameter changing means 76 for changing the parameter data by storing the parameter data in the storage device 74 is provided.

Next, search / acquisition of machine difference correction information and change of parameters in the manufacturing apparatus will be described.
When the search request data generation unit 42 of the mass production management computer 30 determines that the test / inspection result data does not satisfy the predetermined reference value, and the generated search request data is received by the search request data input reception unit 35, the implementation As described in the first embodiment, using the received search request data as a search key, the machine difference correction information registered in the database 40 is searched by the data search means 36, and the machine difference correction information as the search result is the search result. The data is stored in the storage device 33 by the data storage means 37. The parameter data set in the manufacturing apparatus 7 and stored in the storage device 33 in advance and the machine difference correction information stored in the storage device 33 by the search result data storage means 37 are the device parameter correction means 64. Thus, the parameter data is corrected based on the machine difference correction information. The correction parameter data is transmitted to the manufacturing apparatus 7 by the correction parameter transmission means 65. The transmitted correction parameter data is received by the correction parameter receiving means 75 of the manufacturing apparatus 7, and the received correction parameter data is stored in the storage device 74 by the parameter changing means 76. Thereby, the parameter data set in the manufacturing apparatus 7 is changed.

  Even with this modification, the mass production line can be automatically transferred from the prototype line to the mass production line, regardless of the engineers involved in the development / prototyping of new products and the mass production line, enabling smooth mass production transfer. Become.

Embodiment 6 FIG.
FIG. 13 is a block diagram for explaining a semiconductor manufacturing system according to the sixth embodiment of the present invention.
As shown in FIG. 13, the database 40 in which the machine difference correction information is stored is not connected to the mass production management computer 30 as in the fifth embodiment, but is connected to the prototype management computer 10. The mass production management computer 30 can access the database 40 via the network 20. In the sixth embodiment, necessary machine difference correction information is transferred on demand. Hereinafter, a description will be given focusing on the parts different from the fifth embodiment.

As described in the second embodiment, the machine difference correction information providing unit 16 of the prototype management computer 10 includes the database registration unit 16a, the search request data receiving unit 16b, and the data search unit 16c. Further, the mass production management computer 30 includes a quality / recipe information receiving means 31, a quality / recipe information storage means 32, a storage device 33, a database registration means 34, a search request data input receiving means 35, and a data search means 36. And a search result data storage means 37.
Further, as described in the fifth embodiment, the mass production management computer 30 receives the test / inspection result data receiving means 41 for receiving the test / inspection result data transmitted by the test / inspection apparatus 5, and the received test / inspection data / A search request data generating unit 42 is provided for determining whether or not the inspection result data satisfies a predetermined standard and generating search request data when the test result data does not satisfy the predetermined standard.
Further, as described in the fifth embodiment, the mass production management computer 30 reads recipe data out of the recipe information stored in the storage device 33 by the quality / recipe information storage means 32 from the storage device 33, and reads the read data. The machine difference correction information stored in the storage device 33 is read by the recipe transmission means 61 for transmitting the recipe data to the manufacturing apparatus 7 and the search result data storage means 37, and the read machine difference correction information is used as the read machine difference correction information. A recipe correction unit 62 that corrects recipe data based on the recipe data, and a correction recipe transmission unit 63 that transmits recipe data corrected by the recipe correction unit 62 (hereinafter referred to as “corrected recipe data”) to the manufacturing apparatus 7. In addition. The mass production management computer 30 is connected to a test / inspection device 5 and a manufacturing device 7 via a network. Since the test / inspection apparatus 5 and the manufacturing apparatus 7 are the same as those in the fifth embodiment, description thereof is omitted.

Next, the operation of the semiconductor manufacturing system, specifically, a method for manufacturing a semiconductor device using the semiconductor manufacturing system will be described.
Since the transfer of the quality information and the recipe information is the same as that of the fifth embodiment, the description thereof is omitted.
After the transfer of the quality information and the recipe information, a predetermined processing step is executed in the manufacturing apparatus 7 based on the transferred recipe data.
After execution of the process, as in the fifth embodiment, whether or not the test / inspection result data satisfies a predetermined standard is determined by the search request data generation unit 42 of the mass production management computer 30, and if the standard is not satisfied, As described below, it is assumed that the performance of the semiconductor device manufactured on the mass production line is different from that of the prototype, and machine difference correction information for correcting this difference in performance is searched and acquired.

First, search request data is generated by the search request data generating means 42. The search request data is, for example, a product name or a wafer ID. The generated search request data is received by the search request data input receiving means 35.
Thereafter, as described in the second embodiment, the accepted search request data is transmitted to the prototype management computer 10 by the search request data transmitting means 38. When the transmitted search request data is received by the search request data receiving means 16b, the data search means 16c searches the machine difference correction information registered in the database 40 using the received search request data as a search key. Machine difference correction information as result data is transmitted to the mass production management computer 30 via the network 20. Here, when a plurality of machine difference correction information is registered, for example, the data search means 36 searches and outputs them in order from the newest registration time. The transmitted search result data is received by the search result data receiving means 39, and the received search result data is stored in the storage device 33 by the search result data storage means 37. The stored machine difference correction information is read by the recipe correcting means 62, and the recipe data is corrected by the recipe correcting means 62 based on the read machine difference correction information. The corrected recipe data is transmitted to the manufacturing apparatus 7 by the corrected recipe transmitting means 63. The transmitted corrected recipe data is received by the corrected recipe data receiving means 72 of the manufacturing apparatus 7, and the received corrected recipe data is stored in the storage device 74 by the recipe rewriting means 73. Thereby, the recipe data of the manufacturing apparatus 7 is rewritten.
Thereafter, a processing process is executed in the manufacturing apparatus 7 based on the corrected recipe data, and a test / inspection is executed in the test / inspection apparatus 5. Then, as described above, the test / inspection result data is transmitted to the mass production management computer 30, and the mass production management computer 30 determines whether or not the test / inspection result data satisfies a predetermined standard. If the standard is satisfied, the mass production transfer is completed assuming that the difference in performance is corrected. On the other hand, when the standard is not satisfied, the search / acquisition of the machine difference correction information is executed again.

  As described above, in the sixth embodiment, when mass production is transferred from the prototype line to the mass production line, the machine difference correction information generated or acquired in the prototype stage is transferred together with the quality information and the recipe information. . If the performance of a semiconductor device manufactured on a mass production line is different from the performance of a prototype, machine difference correction information for correcting this difference in performance is retrieved and acquired from the database 40, and the acquired machine The recipe data of the manufacturing apparatus 7 is corrected based on the difference correction information, and the semiconductor device is manufactured using the corrected recipe data. Therefore, mass production transfer from the prototype line to the mass production line can be automatically performed without the engineers involved in the development / trial production of the new product and the engineers of the mass production line, and smooth mass production transfer is possible.

Next, a modification of the sixth embodiment will be described.
Embodiment 6 mentioned above demonstrated the case where the recipe data of a manufacturing apparatus were corrected based on the acquired machine difference correction information. In the present modification, as in the modification of the fifth embodiment, a case where a parameter set in the manufacturing apparatus is changed based on the acquired machine difference correction information will be described. Hereinafter, a description will be given focusing on the differences from the sixth embodiment.

FIG. 14 is a block diagram for explaining a modification of the sixth embodiment of the present invention.
As described in the modification of the fifth embodiment, the mass production management computer 30 further includes device parameter correction means 64 and correction parameter transmission means 65. The manufacturing apparatus 7 connected to the mass production management computer 30 via a network further includes a correction parameter receiving unit 75 and a parameter changing unit 76.

Next, search / acquisition of machine difference correction information and change of parameters in the manufacturing apparatus will be described.
When the search request data generation unit 42 of the mass production management computer 30 determines that the test / inspection result data does not satisfy the predetermined reference value, and the generated search request data is received by the search request data input reception unit 35, the implementation As described in the second embodiment, the accepted search request data is transmitted to the prototype management computer 10 by the search request data transmitting means 38. When the transmitted search request data is received by the search request data receiving means 16b, the difference search information registered in the database 40 is searched by the data search means 16c using the received search request data as a search key, Machine difference correction information as search result data is transmitted to the mass production management computer 30 via the network 20. The transmitted search result data is received by the search result data receiving means 39, and the received search result data is stored in the storage device 33 by the search result data storage means 37. The parameter data set in the manufacturing apparatus 7 and stored in advance in the storage device 33 and the machine difference correction information stored in the storage device 33 by the search result data storage means 37 are used as device parameter correction means. 64 is read from the storage device 33, and the parameter data is corrected based on the machine difference correction information. The correction parameter data is transmitted to the manufacturing apparatus 7 by the correction parameter transmission means 65. The transmitted correction parameter data is received by the correction parameter receiving means 75 of the manufacturing apparatus 7, and the received correction parameter data is stored in the storage device 74 by the parameter changing means 76. Thereby, the parameter data set in the manufacturing apparatus 7 is changed.

  Even with this modification, the mass production line can be automatically transferred from the prototype line to the mass production line, regardless of the engineers involved in the development / prototyping of new products and the mass production line, enabling smooth mass production transfer. Become.

Embodiment 7 FIG.
FIG. 15 is a block diagram for explaining a semiconductor manufacturing system according to the seventh embodiment of the present invention.
As shown in FIG. 15, the database 40 in which the machine difference correction information is stored is a computer different from both the prototype management computer 10 and the mass production management computer 30, and is connected to a remote computer 50 connected to the network 20. Yes. The mass production management computer 30 can access the database 40 via the network 20. Also in the seventh embodiment, necessary machine difference correction information is transferred on demand. Hereinafter, the seventh embodiment will be described with a focus on the differences from the fifth and sixth embodiments.

As described in the third embodiment, the machine difference correction information providing unit 16 of the prototype management computer 10 reads the machine difference correction information stored in the storage device 17 by the machine difference correction information storage unit 15 and reads the machine difference correction information. The machine difference correction information is transmitted to the remote computer 50 via the network 20. The remote computer 50 also includes a database registration unit 51, a search request data receiving unit 52, a data search unit 53, and a search result data transmission unit 54.
Further, as described in the fifth and sixth embodiments, the mass production management computer 30 receives the test / inspection result data receiving means 41 for receiving the test / inspection result data transmitted by the test / inspection apparatus 5, and receives the received data. A search request data generation unit 42 is provided for determining whether or not the test / inspection result data satisfies a predetermined standard and generating search request data when the test / inspection result data does not satisfy the predetermined standard.
Further, as described in the fifth and sixth embodiments, the mass production management computer 30 reads recipe data out of the recipe information stored in the storage device 33 by the quality / recipe information storage means 32 from the storage device 33, and The recipe transmission means 61 for transmitting the read recipe data to the manufacturing apparatus 7 and the machine difference correction information stored in the storage device 33 by the search result data storage means 37 are read, and the read machine difference correction is performed. Recipe correction means 62 for correcting the recipe data based on the information, and corrected recipe transmission means 63 for transmitting the recipe data corrected by the recipe correction means 62 (hereinafter referred to as “corrected recipe data”) to the manufacturing apparatus 7. Are further provided. The mass production management computer 30 is connected to a test / inspection device 5 and a manufacturing device 7 via a network. Since the test / inspection apparatus 5 and the manufacturing apparatus 7 are the same as those in the fifth embodiment, description thereof is omitted.

Next, the operation of the semiconductor manufacturing system, specifically, a method for manufacturing a semiconductor device using the semiconductor manufacturing system will be described.
Since the transfer of the quality information and the recipe information is the same as that of the fifth embodiment, the description thereof is omitted.
After the transfer of the quality information and the recipe information, a predetermined processing step is executed in the manufacturing apparatus 7 based on the transferred recipe data.
After execution of the process, as in the fifth embodiment, whether or not the test / inspection result data satisfies a predetermined standard is determined by the search request data generation unit 42 of the mass production management computer 30, and if the standard is not satisfied, As described below, it is assumed that the performance of the semiconductor device manufactured on the mass production line is different from that of the prototype, and machine difference correction information for correcting this difference in performance is searched and acquired.

First, search request data is generated by the search request data generating means 42. The search request data is, for example, a product name or a wafer ID. The generated search request data is received by the search request data input receiving means 35.
Thereafter, as described in the third embodiment, the accepted search request data is transmitted to the remote computer 50 via the network 20 by the search request data transmitting means 38. When the transmitted search request data is received by the search request data receiving means 52 of the remote computer 50 via the network 20, the machine difference correction registered in the database 40 using the received search request data as a search key. Information is retrieved by the data retrieval means 53, and machine difference correction information as retrieval result data is transmitted to the mass production management computer 30 via the network 20 by the retrieval result data transmission means 54. Here, when a plurality of machine difference correction information is registered, for example, the data search means 36 searches and outputs them in order from the newest registration time. The machine difference correction information as the transmitted search result data is received by the search result data receiving means 39 of the mass production management computer 30 via the network 20, and the received machine difference correction information is received by the search result data storage means 37. The data is stored in the storage device 33. The stored machine difference correction information is read by the recipe correcting means 62, and the recipe data is corrected by the recipe correcting means 62 based on the read machine difference correction information. The corrected recipe data is transmitted to the manufacturing apparatus 7 by the corrected recipe transmitting means 63. The transmitted corrected recipe data is received by the corrected recipe data receiving means 72 of the manufacturing apparatus 7, and the received corrected recipe data is stored in the storage device 74 by the recipe rewriting means 73. Thereby, the recipe data of the manufacturing apparatus 7 is rewritten.
Thereafter, a processing process is executed in the manufacturing apparatus 7 based on the corrected recipe data, and a test / inspection is executed in the test / inspection apparatus 5. Then, as described above, the test / inspection result data is transmitted to the terminal 4, and it is determined whether or not the test / inspection result data satisfies a predetermined standard in the terminal 4. If the standard is satisfied, the mass production transfer is completed assuming that the difference in performance is corrected. On the other hand, when the standard is not satisfied, the search / acquisition of the machine difference correction information is executed again.

  As described above, in the seventh embodiment, when mass production is transferred from the prototype line to the mass production line, the quality information and recipe information are transferred, and the machine difference correction information generated or acquired in the prototype stage is transferred on demand. It was decided to transfer. If the performance of a semiconductor device manufactured on a mass production line is different from the performance of a prototype, machine difference correction information for correcting this difference in performance is retrieved and acquired from the database 40, and the acquired machine The recipe data of the manufacturing apparatus 7 is corrected based on the difference correction information, and the semiconductor device is manufactured using the corrected recipe data. Therefore, mass production transfer from the prototype line to the mass production line can be automatically performed without the engineers involved in the development / trial production of the new product and the engineers of the mass production line, and smooth mass production transfer is possible.

Next, a modification of the seventh embodiment will be described.
Embodiment 7 mentioned above demonstrated the case where the recipe data of a manufacturing apparatus were corrected based on the acquired machine difference correction information. In the present modification, as in the modifications of the fifth and sixth embodiments, a case will be described in which parameters set in the manufacturing apparatus are changed based on the acquired machine difference correction information. Hereinafter, a description will be given focusing on the differences from the seventh embodiment.

FIG. 16 is a block diagram for explaining a modification of the seventh embodiment of the present invention.
The mass production management computer 30 further includes device parameter correction means 64 and correction parameter transmission means 65 as described in the modification of the fifth and sixth embodiments. The manufacturing apparatus 7 connected to the mass production management computer 30 via a network further includes a correction parameter receiving unit 75 and a parameter changing unit 76.

Next, search / acquisition of machine difference correction information and change of parameters in the manufacturing apparatus will be described.
When the search request data generation unit 42 of the mass production management computer 30 determines that the test / inspection result data does not satisfy the predetermined reference value, and the generated search request data is received by the search request data input reception unit 35, the implementation As described in the second embodiment, the accepted search request data is transmitted to the remote computer 50 by the search request data transmitting means 38. When the transmitted search request data is received by the search request data receiving means 52, the data search means 53 searches for the machine difference correction information registered in the database 40 using the received search request data as a search key. Machine difference correction information as search result data is transmitted to the mass production management computer 30 by the search result data transmission means 54 via the network 20. The transmitted search result data is received by the search result data receiving means 39, and the received search result data is stored in the storage device 33 by the search result data storage means 37. The parameter data set in the manufacturing apparatus 7 and stored in advance in the storage device 33 and the machine difference correction information stored in the storage device 33 by the search result data storage means 37 are used as device parameter correction means. 64 is read from the storage device 33, and the parameter data is corrected based on the machine difference correction information. The correction parameter data is transmitted to the manufacturing apparatus 7 by the correction parameter transmission means 65. The transmitted correction parameter data is received by the correction parameter receiving means 75 of the manufacturing apparatus 7, and the received correction parameter data is stored in the storage device 74 by the parameter changing means 76. Thereby, the parameter data set in the manufacturing apparatus 7 is changed.

  Even with this modification, the mass production line can be automatically transferred from the prototype line to the mass production line, regardless of the engineers involved in the development / prototyping of new products and the mass production line, enabling smooth mass production transfer. Become.

Embodiment 8 FIG.
FIG. 17 is a diagram showing the machine difference correction information registered in the database in the eighth embodiment.
As shown in FIG. 17, priority differences such as A, B, C... Are registered in the machine difference correction information in association with each other. The priority is determined on the basis of the degree of influence of the machine difference correction information on the performance of the wafer. When the machine difference correction information is input by the terminals 2a, 2b,. It was input with.
For example, in the case of a film forming process with a large amount of deposit on the side wall in the chamber, the priority of the operation history data on the in-situ dry cleaning of the deposit, wet cleaning of the chamber, and NPW associated with these cleanings May be high.
For example, in the case of an etching process in which the end point is detected by a light emission monitor and the end point is difficult to detect, the priority of process monitor information related to the light emission monitor may be increased.

  When searching for machine difference correction information registered in the database 40, the data search means 36, 16c, and 53 search for machine difference correction information using the search request data as a search key. Search in order. When priority is given as shown in FIG. 17, the data search means 36, 16c and 53 output line width adjustment data with priority A as search result data. Thereafter, when the search request by the same search request data is met, the spacer shape adjustment data with the priority order B is output.

  In this way, since the engineers involved in the development / prototype can acquire the machine difference correction information in the mass production management computer 30 in accordance with the priority order set, the quality of the semiconductor device manufactured on the mass production line can be regarded as a prototype. The time until equalization can be shortened. Therefore, it is possible to smoothly transfer the mass production and manufacture the semiconductor device.

Embodiment 9 FIG.
FIG. 18 is a conceptual diagram for explaining mechanical difference correction in an etching process in the ninth embodiment. The transmission / reception of the machine difference correction information is the same as that in the above-described embodiment 5-8, and thus detailed description thereof is omitted.
As shown in FIG. 18, data for determining the etching process conditions is transmitted by the EES server 82 from an apparatus related to the etching process (hereinafter referred to as “related apparatus”). Examples of the related apparatus include a resist film thickness measuring device 84, an exposure device 85, an overlay measuring device 86, a CD (critical dimension) measuring device 87, and a shape / line width measuring device 88. The related devices are connected to the EES server 82 via a network.

  Each related apparatus has data transmission means, and the data transmission means transmits various data to the EES server 82 via the network. Specifically, film thickness measurement data is transmitted from the resist film thickness measurement device 84, data such as Dose and Offset is transmitted from the exposure device 85, and overlay measurement data is transmitted from the overlay measurement device 86. The CD measurement device 87 transmits CD measurement data, and the shape / line width measurement device 88 transmits shape / line width measurement data. In addition to the DEE data transmitted from the etching apparatus as the manufacturing apparatus 81 as described in the fourth embodiment, the temperature in the etching apparatus (chuck temperature, chamber wall temperature, cooling water temperature, heat exchanger temperature) Etc.), data indicating gas flow rate, high frequency power, etc. are transmitted.

  The EES server 82 has data receiving means, and receives various data transmitted from the related apparatus by the data receiving means. Further, the EES server 82 generates device detailed data from the DEE data received from the etching device 81 as described in the fourth embodiment. Further, the EES server 82 transmits the received various data and the generated device detailed data to the prototype management computer 10. The transmitted data is received by the receiving means 14 as machine difference correction information and registered in the database 40. This machine difference correction information is used, for example, to correct a difference in performance due to an inter-apparatus difference when using an etching apparatus of a different manufacturer, that is, equivalent performance. This is information for obtaining (shape / line width).

After etching is performed using an etching apparatus 7 which is a mass production line manufacturing apparatus 7, the shape / line width is measured using the shape / line width measuring apparatus 5, thereby determining the quality. The determination of the quality is performed by comparing the transferred quality information and the measurement result in the mass production management computer 30. When it is determined that the performance is different, the performance is improved by correcting the etching recipe or changing the apparatus parameters based on the machine difference correction information as described in the above-described embodiment 5-8 or the modification thereof. To correct the difference. For example, by changing the chuck temperature and high-frequency power set in the recipe, the equivalent quality (shape / line width) can be achieved.
As described above, in the ninth embodiment, the data obtained by the related apparatuses 84 to 88 can be acquired, and the process conditions of the etching apparatus can be grasped including the acquired data.

Next, a modification of the ninth embodiment will be described.
FIG. 19 is a block diagram for explaining a modification of the ninth embodiment of the present invention.
As shown in FIG. 19, in this modification, the EES 90 is used to generate device detailed data for the mass production line manufacturing device 7, the generated device detailed data, device detailed data as machine difference correction information, Compare The EES 90 includes a manufacturing apparatus 7 and an EES server 92. Similar to the manufacturing apparatus 7, the EES server 92 is connected to the mass production management computer 30 via a network.

  The manufacturing apparatus 7 further includes DEE data transmission means 77 that transmits DEE data to the EES server 92. Since DEE data is the same as that in the fourth embodiment, the description thereof is omitted.

The DEE server 92 selects DEE data receiving means 92a for receiving the DEE data transmitted by the DEE data transmitting means 77, and selects necessary DEE data from the received DEE data, and the device details are selected from the selected DEE data. The device detailed data generating unit 92b that generates data and stores the generated device detailed data in the storage device 92d, and reads the stored device detailed data from the storage device 92d, and mass-produces the read device detailed data. The apparatus detailed data transmission means 92c which transmits to the management computer 30 via a network is provided.
The apparatus detailed data generation unit 92b uses the operation signal of each valve, the wafer movement time, the wafer stagnation time, the time from completion of loading into the chamber to the end of processing or unloading (wafer processing status time), etc. Generate as

  The mass production management computer 30 receives device detailed data receiving means 66 for receiving device detailed data transmitted by the device detailed data transmitting means 92c via the network, the received device detailed data, and machine difference correction information as a search result. Device detailed data comparing means 66 for comparing the device detailed data acquired as described above. Based on the comparison result of the device detailed data comparison unit 66, the recipe data is corrected by the recipe correction unit 62, or the parameter data is corrected by the device parameter correction unit 63.

  As described above, in this modification, the device detailed data of the mass production line manufacturing device 7 is acquired by using the EES 90, and the acquired device detailed data is compared with the device detailed data as the machine difference correction information. Differences between devices can be grasped, and the quality can be made equal by recipe correction or parameter change. From the comparison of the detailed apparatus data, for example, it can be understood that the difference in performance is caused by the difference in the etching rate due to the difference in wafer temperature between the apparatuses in the etching apparatus.

  In this modification, the device detailed data received from the EES server 92 by the device detailed data comparison unit 66 is compared with the device detailed data as the machine difference correction information. However, the present invention is not limited to this. A comparison with previously received device detail data may be made. Thereby, it is possible to grasp the difference between the devices in the apparatus, and to correct the difference in performance in a short time. For example, it can be grasped that the difference in performance is caused by a difference in etching rate due to a change in wafer temperature with time in the etching apparatus (difference in the apparatus).

It is a figure for demonstrating the manufacturing workflow of the semiconductor device by Embodiment 1 of this invention. It is a figure which shows the quality information and recipe information which are transferred to a mass production line. It is a figure which shows the machine difference correction information transferred to a mass production line. It is a block diagram for demonstrating the mass production transfer assistance system by Embodiment 1 of this invention. It is a block diagram for demonstrating the 2nd modification of Embodiment 1 of this invention. It is a block diagram for demonstrating the mass production transfer assistance system by Embodiment 2 of this invention. It is a block diagram for demonstrating the 2nd modification of Embodiment 2 of this invention. It is a block diagram for demonstrating the mass production transfer assistance system by Embodiment 3 of this invention. It is a block diagram for demonstrating the 2nd modification of Embodiment 3 of this invention. In Embodiment 4 of this invention, it is a block diagram for demonstrating a machine difference correction information generation means. It is a block diagram for demonstrating the semiconductor manufacturing system by Embodiment 5 of this invention. It is a block diagram for demonstrating the modification of Embodiment 5 of this invention. It is a block diagram for demonstrating the semiconductor manufacturing system by Embodiment 6 of this invention. It is a block diagram for demonstrating the modification of Embodiment 6 of this invention. It is a block diagram for demonstrating the semiconductor manufacturing system by Embodiment 7 of this invention. It is a block diagram for demonstrating the modification of Embodiment 7 of this invention. In Embodiment 8 of this invention, it is a figure which shows the machine difference correction information registered into the database. In Embodiment 9 of this invention, it is a conceptual diagram for demonstrating the machine difference correction | amendment of an etching process. It is a block diagram for demonstrating the modification of Embodiment 9 of this invention.

Explanation of symbols

2a, 2b Terminal 5 Test / inspection device 7 Manufacturing device 10 Mass production transfer source management computer (prototype management computer)
DESCRIPTION OF SYMBOLS 11 Performance / recipe information input reception means 12 Performance / recipe information storage means 13 Performance / recipe information transmission means 14 Machine difference correction information input reception means 15 Machine difference correction information storage means 16 Machine difference correction information provision means 16a Database registration means 16b Search Request data reception means 16c Data search means 17 Storage device 18a Search request data transmission means 18b Search result data reception means 18c Search result data storage means 20 Network 30 Mass production transfer destination management computer (mass production management computer)
31 Performance / recipe information receiving means 32 Performance / recipe information storage means 33 Storage device 34 Database registration means 35 Search request data input acceptance means 36 Data search means 37 Search result data storage means 40 Database 41 Test / inspection result reception means 42 Search request Data generation means 46 Machine difference correction information input acceptance means 47 Machine difference correction information storage means 48 Machine difference correction information provision means 50 Remote computer 51 Database registration means 52 Search request data reception means 53 Data search means 54 Search result data transmission means 55 Test / Inspection result transmission means 61 Recipe transmission means 62 Recipe correction means 63 Correction recipe transmission means 64 Device parameter correction means 65 Correction parameter transmission means 66 Device detailed data reception means 67 Device detailed data comparison means 71 Recipe Shin means 72 fixes the recipe receiving unit 73 recipe rewriting means 74 storage device 75 fixes the parameter receiving unit 76 the parameter changing section 77 DEE data transmission means 80 EES
81 Manufacturing equipment (etching equipment)
81a DEE data transmitting means 82 EES server 82a DEE data receiving means 82b Device detailed data generating means 82c Device detailed data transmitting means 82d Storage device 83 EES terminal 84 Resist film thickness measuring device 85 Exposure device 86 Overlay measuring device 87 CD measuring device 88 Shape / line width measuring device 92 EES server 92a DEE data receiving means 92b Device detailed data generating means 92c Device detailed data transmitting means 92d Storage device

Claims (6)

A semiconductor device manufacturing system in which a prototype management computer that manages information generated or acquired in the process of manufacturing a prototype of a semiconductor device and a mass production management computer that manages the mass production process of the semiconductor device are connected via a network. There,
The prototype management computer is:
A performance / recipe information input receiving means for receiving the input of performance information representing the performance of the semiconductor device and the input of recipe information for realizing the performance of the semiconductor device;
The quality / recipe information transmitting means for transmitting the quality and recipe information received by the quality / recipe information input receiving means to the mass production management computer via the network;
Machine difference correction information input receiving means for receiving input of machine difference correction information for correcting a difference in performance of a semiconductor device due to a machine difference that may occur in a semiconductor manufacturing apparatus in charge of an element process of the semiconductor device;
Machine difference correction information storage means for storing the machine difference correction information received by the machine difference correction information input receiving means in a predetermined storage device;
Machine difference correction information providing means for reading the machine difference correction information stored in the storage device by the machine difference correction information storage means from the storage device and storing it in a database accessible by the mass production management computer;
The mass production management computer is
The quality / recipe information receiving means for receiving the quality / recipe information transmitted by the quality / recipe information transmitting means via the network;
The performance / recipe information storage means for storing the performance and recipe information received by the performance / recipe information reception means in a predetermined storage device;
Recipe data transmitting means for reading recipe data out of the recipe information stored in the storage device by the quality / recipe information storage means and transmitting the read recipe data to the semiconductor manufacturing apparatus in the mass production process; ,
The quality information stored in the storage device by the quality / recipe information storage means is read from the storage device, and the read quality information is compared with the quality of the semiconductor device manufactured by the semiconductor manufacturing apparatus in the mass production process. If there is a difference, search request data generating means for generating search request data,
Search result data acquisition means for searching the machine difference correction information stored in the database and acquiring search result data using the search request data generated by the search request data generation means as a search key;
Recipe correction means for correcting the recipe data based on the search result data acquired by the search result data acquisition means;
A correction recipe transmission means for transmitting the recipe data corrected by the recipe correction means to the semiconductor manufacturing apparatus of the mass production process;
The semiconductor manufacturing apparatus of the mass production process is
Modified recipe receiving means for receiving recipe data transmitted by the modified recipe transmitting means;
A semiconductor manufacturing system, comprising: recipe rewriting means for rewriting recipe data of the semiconductor manufacturing apparatus by storing the recipe data received by the modified recipe receiving means in a predetermined storage device. The semiconductor manufacturing system according to claim 1,
The mass production management computer further comprises a test / inspection result receiving means for receiving a test / inspection result transmitted by the semiconductor test / inspection apparatus in the mass production process,
The search request data generating means compares the quality information read from the storage device with the test / inspection result received by the test / inspection result receiving means, and generates the search request data. Semiconductor manufacturing system. In the semiconductor manufacturing system according to claim 1 or 2,
The mass production management computer is
Based on the search result data acquired by the search result data acquisition means, apparatus parameter correction means for correcting parameter data for a semiconductor manufacturing apparatus in the mass production process;
A correction parameter transmitting means for transmitting the parameter data corrected by the apparatus parameter correcting means to the semiconductor manufacturing apparatus in the mass production process;
The semiconductor manufacturing apparatus of the mass production process is
Modified parameter receiving means for receiving parameter data transmitted by the modified parameter transmitting means;
A semiconductor manufacturing system, further comprising: parameter changing means for changing parameter data of the semiconductor manufacturing apparatus by storing the parameter data received by the modified parameter receiving means in the storage device. In the semiconductor manufacturing system according to any one of claims 1 to 3,
Machine difference correction information generating means connected to the prototype management computer via a network and generating machine difference correction information;
The machine difference correction information generating means includes:
Event data receiving means for receiving detailed event data of a semiconductor manufacturing apparatus in a prototype process;
Device detailed data generating means for generating device detailed data from the detailed event data received by the event data receiving means;
Device detailed data transmitting means for transmitting the device detailed data generated by the device detailed data generating means to the prototype management computer,
The device difference correction information input receiving means of the prototype management computer receives the device detailed data transmitted by the device detailed data transmitting means, and receives the received device detailed data as device difference correction information. Semiconductor manufacturing system. In the semiconductor manufacturing system according to claim 1,
The machine difference correction information input receiving means of the prototype management computer receives an input of a product name or wafer ID together with the machine difference correction information,
The machine difference correction information providing means of the prototype management computer stores the machine difference correction information in the database for each product name or wafer ID received by the machine difference correction information input means,
The semiconductor manufacturing system according to claim 1, wherein the search request data generation means of the mass production management computer generates the product name or wafer ID as the search request data. The semiconductor manufacturing system according to claim 5,
The machine difference correction information input receiving means of the prototype management computer further receives an input of the priority order of the machine difference correction information together with the product name or wafer ID,
The machine difference correction information providing means of the prototype management computer stores the machine difference correction information in the database in association with the priority received by the machine difference correction information input means.

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