JP2005183647A - Printed wiring board and its connection method, and repairing method - Google Patents

Printed wiring board and its connection method, and repairing method Download PDF

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Publication number
JP2005183647A
JP2005183647A JP2003421914A JP2003421914A JP2005183647A JP 2005183647 A JP2005183647 A JP 2005183647A JP 2003421914 A JP2003421914 A JP 2003421914A JP 2003421914 A JP2003421914 A JP 2003421914A JP 2005183647 A JP2005183647 A JP 2005183647A
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printed wiring
wiring board
electrode terminal
wiring boards
length
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Yoshihito Seki
善仁 関
Hiroki Maruo
弘樹 圓尾
Tomohito Kitada
智史 北田
Yoshiharu Unami
義春 宇波
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Fujikura Ltd
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Fujikura Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a printed wiring board provided with a connection structure for easing repair, and its connection method, a repairing method. <P>SOLUTION: When an electrode terminal is formed in the connection part of the printed wiring board, a conductor is exposed by a length necessary for connecting wiring boards plus the same length and an excessive length. When the electrode terminals are bonded with each other to connect the wiring boards, a joint part and a non-joint part are formed in the electrode terminals, and the non-joint part is made larger than a length necessary for connecting the wiring boards. Further, when the printed wiring board is repaired, it is cut to remove the bonded part, thereby obtaining the printed wiring board that is provided with an electrode terminal having at least a length enough to connect the wiring boards, and the wiring board provided with the electrode terminal having such the length is used to connect the printed wiring boards again. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明は、電子機器の内部配線に使用されるプリント配線板において、リペアを容易に実現できる接続部の構造を具備するプリント配線板、およびその接続方法、並びにリペア方法に関するものである。   The present invention relates to a printed wiring board having a connection structure that can easily realize repair in a printed wiring board used for internal wiring of an electronic device, a connection method thereof, and a repair method.

従来、フレキシブルプリント配線板(FPC)同士、あるいはフレキシブルプリント配線板と他のプリント配線板を接続するにあたって、一方の配線板に、その配線板のコンタクトピッチの適合したコネクタを実装した後、そのコネクタに他方の配線板を挿入して、配線板同士の電気的導通性の確保および接続部の強度を保持していた。(例えば、特許文献1を参照)
また近年では、コネクタを使用しないプリント配線板同士の接続方法が提案されている。(例えば、特許文献2を参照)
図5は、コネクタを使用しない配線板同士の接続方法の従来技術を説明する図である。
図5(a)に示すように、絶縁基材101上に導体102を形成するとともに、その導体102の表面にレジスト103を被覆したプリント配線板100において、その接続部(端部)に、導体を露出させた電極端子部104を形成する。
そして、前記電極端子部を備えるプリント配線板同士100a,100bを接続するにあたって、配線板の電極端子部104a,104b同士を対峙させるとともに(図5(b)を参照)、この電極端子部104a,104b間に半田や異方性導電膜(ACF)などの導電性の接着材料を介在させ、この接着材料を介して電極端子部同士104a,104bを直接接合する(図5(c)を参照)。
なおプリント基板の接続部に電極端子部104を形成するにあたって、配線板同士の接続に必要な長さ(部分)の導体102を露出させ、これによって配線板同士の電気的導通性の確保および接続部の強度を保持していた。
特開2000−188487号公報 特開平9−160064号公報
Conventionally, when connecting a flexible printed wiring board (FPC) to each other or a flexible printed wiring board and another printed wiring board, a connector having a contact pitch suitable for the wiring board is mounted on one wiring board, and then the connector is connected. The other wiring board was inserted into the wiring board, ensuring electrical continuity between the wiring boards and maintaining the strength of the connecting portion. (For example, see Patent Document 1)
In recent years, methods for connecting printed wiring boards that do not use connectors have been proposed. (For example, see Patent Document 2)
FIG. 5 is a diagram for explaining the prior art of a method for connecting wiring boards without using a connector.
As shown in FIG. 5A, in the printed wiring board 100 in which the conductor 102 is formed on the insulating base material 101 and the surface of the conductor 102 is coated with the resist 103, the conductor is connected to the connecting portion (end portion). The electrode terminal part 104 which exposed is formed.
When connecting the printed wiring boards 100a and 100b having the electrode terminal portions, the electrode terminal portions 104a and 104b of the wiring boards face each other (see FIG. 5B), and the electrode terminal portions 104a, A conductive adhesive material such as solder or anisotropic conductive film (ACF) is interposed between 104b, and the electrode terminal portions 104a and 104b are directly bonded to each other via this adhesive material (see FIG. 5C). .
When forming the electrode terminal portion 104 in the connection portion of the printed circuit board, the conductor 102 having a length (part) necessary for connection between the wiring boards is exposed, thereby ensuring and connecting the electrical conductivity between the wiring boards. The strength of the part was maintained.
JP 2000-188487 A Japanese Patent Laid-Open No. 9-160064

しかしながら、コネクタを使用して配線板同士を接続したプリント配線板では、コネクタのコスト、およびその実装コストがかかり、低価格化が困難であった。さらにコネクタの実装スペースの確保とコネクタ自体の嵩から、プリント配線板の軽薄小型化が困難であった。
また、コネクタを使用しないで配線板同士を接続したプリント配線板でも、従来技術による接続方法を利用した場合、プリント配線板をリペアするのが困難であった。
例えば、電極端子部同士を半田を介して接合したプリント配線板をリペアする場合、接続した配線板同士を剥離するために、電極端子部間に介在する半田を再溶融させるための半田ごてや、ウェルダーなどの加熱装置が必要であるとともに、電極端子部同士を再び接合するにあたって、半田の層厚を制御するためフラックス塗布をしなければならなかった。
また例えば、電極端子部同士を異方性導電膜を介して接合したプリント配線板をリペアする場合も、異方性導電膜(樹脂)を除去するための特殊な溶剤を使用して、接合した電極端子部同士を剥離するといった特殊な工程を経なければならなかった。特に近年では、プリント配線板の製品仕様が厳しく、接続部の補強、耐リフロー性、隣接端子間の絶縁性保持のために異方性導電膜(熱硬化性樹脂)を施したプリント配線板があり、それらのプリント配線板の電極端子部間に介在する異方性導電膜のみを前記溶剤を用いて除去し、配線板同士を剥離してリペアすることはほぼ不可能であった。
However, in the printed wiring board in which the wiring boards are connected using the connector, the cost of the connector and the mounting cost are high, and it is difficult to reduce the price. Furthermore, it is difficult to reduce the size and size of the printed wiring board because of the space for mounting the connector and the bulk of the connector itself.
Further, even with a printed wiring board in which wiring boards are connected without using a connector, it is difficult to repair the printed wiring board when the connection method according to the prior art is used.
For example, when repairing a printed wiring board in which the electrode terminal portions are bonded together via solder, a soldering iron for remelting the solder interposed between the electrode terminal portions in order to peel off the connected wiring boards. In addition, a heating device such as a welder is required, and when the electrode terminal portions are joined again, flux coating must be applied to control the layer thickness of the solder.
In addition, for example, when repairing a printed wiring board in which the electrode terminal portions are bonded via an anisotropic conductive film, the bonding is performed using a special solvent for removing the anisotropic conductive film (resin). A special process such as peeling the electrode terminal parts from each other had to be performed. In recent years, product specifications for printed wiring boards have been particularly strict, and printed wiring boards with an anisotropic conductive film (thermosetting resin) have been used to reinforce connection, reflow resistance, and maintain insulation between adjacent terminals. In other words, it was almost impossible to remove and repair only the anisotropic conductive film interposed between the electrode terminal portions of the printed wiring boards using the solvent, and to peel off the wiring boards.

そこで本発明では、絶縁基材の上に形成した導体の表面にレジストを被覆したプリント配線板において、プリント配線板の接続部に、レジストが除去され導体が露出した電極端子部を形成するにあたって、配線板同士を接続するために必要な長さに、その長さ以上の余長部を加えた長さの導体を露出させたプリント配線板を提供する。
また電極端子部同士を接合してプリント配線板同士を接続するにあたって、プリント配線板の接続部において電極端子部に接合部と非接合部とが形成され、かつ前記非接合部が配線板同士を接続するために必要な長さ以上となるように、プリント配線板を接続する。
また上記プリント配線板をリペアするにあたって、プリント配線板を切断することによって接合部を除去し、少なくとも配線板同士を接続するために必要な長さの電極端子部を備えたプリント配線板を取得するとともに、この少なくとも配線板同士を接続するために必要な長さの電極端子部を備えたプリント配線板を使用し、再びプリント配線板を接続する。
Therefore, in the present invention, in the printed wiring board in which the surface of the conductor formed on the insulating base material is coated with a resist, in forming the electrode terminal portion where the resist is removed and the conductor is exposed at the connection portion of the printed wiring board. Provided is a printed wiring board in which a conductor having a length obtained by adding a surplus portion longer than the length necessary for connecting the wiring boards to each other is exposed.
Further, when connecting the printed wiring boards by joining the electrode terminal parts, a joined part and a non-joined part are formed in the electrode terminal part at the connecting part of the printed wiring board, and the non-joined part connects the wiring boards to each other. Connect the printed wiring board so that it is longer than the length necessary for connection.
Further, when repairing the printed wiring board, the printed wiring board is cut to remove the joining portion, and at least a printed wiring board having an electrode terminal portion having a length necessary for connecting the wiring boards is obtained. At the same time, a printed wiring board having an electrode terminal portion having a length necessary for connecting at least the wiring boards is used, and the printed wiring boards are connected again.

本発明によれば、プリント配線板をリペアするにあたって、プリント配線板を切断して接合部を除去し、プリント配線板を再利用することができるため、プリント配線板のリペア工程において、加熱装置の必要性や特殊溶剤の必要性がなく、作業が容易である。
また、接続部の補強、耐リフロー性、隣接端子間の絶縁性保持のために異方性導電膜(熱硬化性樹脂)を施したプリント配線板についても、容易にリペアを実現することができる。
According to the present invention, when repairing a printed wiring board, the printed wiring board can be cut to remove the joint, and the printed wiring board can be reused. There is no need for special solvents, and work is easy.
In addition, it is possible to easily repair a printed wiring board on which an anisotropic conductive film (thermosetting resin) is applied in order to reinforce a connection part, reflow resistance, and maintain insulation between adjacent terminals. .

本発明によるプリント配線板およびその接続方法、並びにそのリペア方法について、図1〜図4を参照して説明する。
なお、この発明においてプリント配線板とは、フレキシブルプリント配線板(FPC),リジット基板、リジットフレックス基板、フレキシブル・フラット・ケーブル(FFC),メンブレン基板、セラミック基板、テープ・キャリア・パッケージ(TCP)など、各種配線板や電気部品を含めると定義する。
A printed wiring board, a connection method thereof, and a repair method thereof according to the present invention will be described with reference to FIGS.
In the present invention, the printed wiring board means a flexible printed wiring board (FPC), a rigid board, a rigid flex board, a flexible flat cable (FFC), a membrane board, a ceramic board, a tape carrier package (TCP), etc. Defined to include various wiring boards and electrical components.

本発明によるプリント配線板の実施例を図1に示す。
この実施例は、絶縁基材1の上に形成した導体2の表面にレジスト3を被覆したプリント配線板10において、その接続部(端部)に、レジスト3が除去され導体2が露出した電極端子部4を形成したプリント配線板であって、前記電極端子部4を形成するにあたって、配線板同士を接続するために必要な長さ(端子同士の接合に必要な長さ)に、その長さ以上の余長部を加えた長さの導体を露出させたものである。
なお余長部とは、導体2が露出した電子端子部4において、配線板同士を接続するために必要な長さ(端子同士の接合に必要な長さ)以上の導体露出部をもつものをいい(図1(a)を参照)、例えば、配線板同士を接続するために必要な長さ(端子同士の接合に必要な長さ)に1mm以上を加えた長さの導体露出部をいう。
つまり余長部を加えた長さの導体を露出させることによって、プリント配線板の接続部に、配線板同士を接続するために必要な長さ(端子同士の接合に必要な長さ)の2倍以上の長さの導体を露出させた電極端子部4が形成される。
An embodiment of a printed wiring board according to the present invention is shown in FIG.
In this embodiment, in a printed wiring board 10 in which the surface of a conductor 2 formed on an insulating substrate 1 is coated with a resist 3, an electrode in which the conductor 3 is exposed at the connecting portion (end) thereof. It is a printed wiring board in which the terminal portion 4 is formed, and when the electrode terminal portion 4 is formed, the length required for connecting the wiring boards (the length necessary for joining the terminals) is The conductor of the length which added the extra length part more than this is exposed.
The surplus length part is an electronic terminal part 4 where the conductor 2 is exposed and has an exposed part longer than the length necessary for connecting the wiring boards (the length necessary for joining the terminals). Okay (see FIG. 1A), for example, a conductor exposed portion having a length obtained by adding 1 mm or more to a length necessary for connecting wiring boards (a length necessary for joining terminals). .
In other words, by exposing the conductor of the length including the extra length, 2 of the length necessary for connecting the wiring boards to the connection portion of the printed wiring board (the length necessary for joining the terminals) is 2 An electrode terminal portion 4 is formed in which a conductor having a length more than double is exposed.

図1(a)は、プリント配線板の接続部構造の第1実施例を示すものである。
この実施例によるプリント配線板の接続部では、レジスト3を除去して導体2を露出させた電極端子部4を形成するにあたって、配線板同士を接続するために必要な長さに、その長さ以上の余長部を加えた長さのレジスト3を除去することによって、配線板同士を接続するために必要な長さの2倍以上の導体2を露出させた。
導体2を露出させた部分には、必要に応じてAuメッキ、Au/Niメッキ、Snメッキ、半田メッキ、防錆処理等を行なう。
なお、前記電極端子部4の長さ(余長部を含む)は、プリント配線板10のリペアを1回行なう場合は、少なくとも配線板同士を接続するために必要な長さの2倍以上とし、プリント配線板10のリペアをN回行なう場合は、少なくと配線板同士を接続するために必要な長さのN+1倍以上とする。
FIG. 1A shows a first embodiment of a printed wiring board connecting portion structure.
In the connection part of the printed wiring board according to this embodiment, when forming the electrode terminal part 4 from which the resist 3 is removed and the conductor 2 is exposed, the length is required to connect the wiring boards. By removing the resist 3 having a length including the above extra length portion, the conductor 2 more than twice as long as necessary to connect the wiring boards was exposed.
The exposed portion of the conductor 2 is subjected to Au plating, Au / Ni plating, Sn plating, solder plating, rust prevention treatment, or the like as necessary.
The length of the electrode terminal portion 4 (including the extra length portion) is at least twice the length necessary for connecting the wiring boards when the printed wiring board 10 is repaired once. When the printed wiring board 10 is repaired N times, at least N + 1 times the length necessary for connecting the wiring boards to each other is set.

図1(b)は、プリント配線板の接続部構造の第2実施例を示すものである。
この実施例によるプリント配線板の接続部では、第1実施例と同様に、配線板同士を接続するために必要な長さに余長部を加えた長さの導体2を露出させた電極端子部4を形成するとともに、前記余長部に部分的にレジストを残存させることによって電極端子部4を複数に区切り、少なくとも配線板同士を接続するために必要な長さをもつ露出部を複数形成した。
なおこの実施例でも、導体2を露出させた部分に、必要に応じてAuメッキ、Au/Niメッキ、Snメッキ、半田メッキ、防錆処理等を行なった。
FIG. 1B shows a second embodiment of the printed wiring board connecting portion structure.
In the connection portion of the printed wiring board according to this embodiment, as in the first embodiment, the electrode terminal exposing the conductor 2 having a length obtained by adding the extra length portion to the length necessary for connecting the wiring boards to each other. In addition to forming the portion 4 and partially leaving the resist in the surplus length portion, the electrode terminal portion 4 is divided into a plurality of portions, and at least a plurality of exposed portions having a length necessary for connecting the wiring boards are formed. did.
In this example as well, Au plating, Au / Ni plating, Sn plating, solder plating, rust prevention treatment, etc. were performed on the exposed portion of the conductor 2 as necessary.

図1(b)に示す実施例では、プリント配線板10の接続部において、レジスト3を除去して導体を露出させた電極端子部4を形成するにあたって、部分的に3箇所のレジストを残存させ(第1〜第3残存レジスト31〜33)、これら残存レジストによって電極端子部4を4つに区切った(第1〜第4露出部41〜44)。
つまり、第1〜第3残存レジスト31〜33を等間隔に配置することによって、第1〜第4露出部41〜44を形成し、少なくとも配線板同士の接続に必要な長さの導体が露出した露出部を4つ形成した。
そして、レジストが除去され導体が露出した第1露出部41を接続部の先端に形成するとともに、第1残存レジスト31を介して第1露出部41の隣に第2露出部42を形成し、第2残存レジスト32を介して第2露出部44の隣に第3露出部43を形成し、第3残存レジスト33を介して第3露出部43の隣に第4露出部44を形成した。
In the embodiment shown in FIG. 1B, in forming the electrode terminal portion 4 from which the conductor 3 is exposed by removing the resist 3 at the connection portion of the printed wiring board 10, the resist is partially left at three places. (The 1st-3rd remaining resists 31-33) and the electrode terminal part 4 were divided into four by these remaining resists (1st-4th exposed parts 41-44).
That is, by arranging the first to third remaining resists 31 to 33 at equal intervals, the first to fourth exposed portions 41 to 44 are formed, and at least a conductor having a length necessary for connecting the wiring boards is exposed. Four exposed portions were formed.
Then, the first exposed portion 41 where the resist is removed and the conductor is exposed is formed at the tip of the connecting portion, and the second exposed portion 42 is formed next to the first exposed portion 41 through the first remaining resist 31. A third exposed portion 43 was formed next to the second exposed portion 44 via the second remaining resist 32, and a fourth exposed portion 44 was formed next to the third exposed portion 43 via the third remaining resist 33.

次に、プリント配線板の接続部に、配線板同士を接続するために必要な長さの2倍以上の導体2を露出させた電極端子部4を形成したプリント配線板の接続方法とリペア方法について、図2ないし図4を参照して説明する。   Next, a printed wiring board connection method and a repair method in which the electrode terminal portion 4 in which the conductor 2 is exposed at least twice the length necessary for connecting the wiring boards to the connection portion of the printed wiring board is formed. Will be described with reference to FIGS.

図2に示すプリント配線板の接続方法は、プリント配線板10の接続部に、第1〜第4露出部44〜44を形成したプリント配線板10を使用するものである(図1(b)を参照)。つまり、プリント配線板の接続部に電極端子部を形成するにあたって、第1〜第3残存レジスト31a〜33aを設けて第1〜第4露出部41a〜44aを形成した第1プリント配線板10aを使用するとともに、同じく、第1〜第3残存レジスト31b〜33bを設けて第1〜第4露出部41b〜44bを形成した第2プリント配線板10bとを使用する。
なお前記各露出部では、少なくとも配線板同士を接続するために必要な長さの導体が露出している。
The printed wiring board connecting method shown in FIG. 2 uses the printed wiring board 10 in which the first to fourth exposed portions 44 to 44 are formed in the connecting portion of the printed wiring board 10 (FIG. 1B). See). That is, in forming the electrode terminal portion at the connection portion of the printed wiring board, the first printed wiring board 10a in which the first to third remaining resists 31a to 33a are provided to form the first to fourth exposed portions 41a to 44a is formed. Similarly, the second printed wiring board 10b provided with the first to third remaining resists 31b to 33b to form the first to fourth exposed portions 41b to 44b is used.
In each of the exposed portions, at least a conductor having a length necessary for connecting the wiring boards is exposed.

この実施例では、プリント配線板同士10a,10bを接続するにあたって、接続部の先端に形成された第1露出部同士41a,41bを対峙させるとともに(図2(a)を参照)、この第1露出部間に半田や異方性導電膜(ACF)などの導電性の接着材料を介在させ、この接着材料を介して前記第1露出部同士41a,41bを直接接合した(図2(b)を参照)。
なお、第1露出部同士41a,41bを接合することによってプリント配線板同士を接続した場合、前記第1露出部41,41bでは、少なくとも配線板同士を接続するのに必要な長さの導体が露出しているため、配線板同士の電気的導通性の確保および接続部の強度を保持することができる。
In this embodiment, when connecting the printed wiring boards 10a and 10b, the first exposed portions 41a and 41b formed at the tips of the connecting portions face each other (see FIG. 2A), and the first A conductive adhesive material such as solder or anisotropic conductive film (ACF) is interposed between the exposed portions, and the first exposed portions 41a and 41b are directly bonded to each other through the adhesive material (FIG. 2B). See).
When the printed wiring boards are connected to each other by joining the first exposed portions 41a and 41b, the first exposed portions 41 and 41b have a conductor having a length necessary to connect at least the wiring boards. Since it is exposed, the electrical continuity between the wiring boards can be ensured and the strength of the connecting portion can be maintained.

続いて、図2に示す接続方法によって接続したプリント配線板をリペアする方法について図3を参照して説明する。
プリント配線板のリペアは、接続したプリント配線板同士を剥離する剥離工程と、再びプリント配線板同士を接続する再接続工程とからなる。
Next, a method for repairing a printed wiring board connected by the connection method shown in FIG. 2 will be described with reference to FIG.
The repair of the printed wiring board includes a peeling process for peeling the connected printed wiring boards and a reconnecting process for connecting the printed wiring boards again.

この実施例では、接続部の先端に形成された第1露出部同士41a,41bを接合したプリント配線板同士を剥離するにあたって、図3(a)に示すように、前記第1露出部41a,41bを除去するように、第1プリント配線板10aと第2プリント配線板10bを切断した。
つまり、プリント配線板を切断し、第1露出部41a,41bを除去することによって、接合部が除去され、互いに接続しているプリント配線板同士10a,10bを剥離することができる。
なお、各プリント配線板に形成されている第2露出部41a,42bの先端で、それぞれのプリント配線板10a,10bを切断することによって、接合部(第1露出部)が除去されてプリント配線板が剥離されるとともに、接続部の先端に第2露出部42aが形成された第1プリント配線板10aと、同じく接続部の先端に第2露出部42bが形成された第2プリント配線板10bとを取得することができる。
In this embodiment, when peeling the printed wiring boards formed by joining the first exposed portions 41a and 41b formed at the tips of the connecting portions, as shown in FIG. The first printed wiring board 10a and the second printed wiring board 10b were cut so as to remove 41b.
That is, by cutting the printed wiring board and removing the first exposed portions 41a and 41b, the joint portion is removed, and the printed wiring boards 10a and 10b connected to each other can be peeled off.
The printed wiring boards 10a and 10b are cut at the tips of the second exposed portions 41a and 42b formed on the printed wiring boards, so that the joint portions (first exposed portions) are removed and the printed wiring is provided. The first printed wiring board 10a in which the board is peeled off and the second exposed portion 42a is formed at the tip of the connecting portion, and the second printed wiring board 10b in which the second exposed portion 42b is also formed at the tip of the connecting portion. And can get.

プリント配線板を剥離した後、再びプリント配線板同士10a,10bを接続するにあたって、この実施例では、接続部の先端に形成された第2露出部同士42a,42bを対峙させるとともに(図3(b)を参照)、この第2露出部間に半田や異方性導電膜(ACF)などの導電性の接着材料を介在させ、この接着材料を介して前記第1露出部同士41a,41bを直接接合した(図3(a)を参照)。   In this embodiment, the second exposed portions 42a and 42b formed at the front ends of the connecting portions are opposed to each other when the printed wiring boards 10a and 10b are connected again after the printed wiring boards are peeled off (FIG. 3 ( b)), a conductive adhesive material such as solder or anisotropic conductive film (ACF) is interposed between the second exposed portions, and the first exposed portions 41a and 41b are connected to each other through the adhesive material. It joined directly (refer Fig.3 (a)).

さらにこの発明によるプリント配線板によれば、可撓性の優れた絶縁基材1を使用したプリント配線板(例えばフレキシブルプリント配線板)を用いた場合、プリント配線板を折畳んで使用することができる(図4を参照)。
例えば、図1(b)に示すプリント配線板のように、接続部に第1〜第4露出部41〜44を備えたプリント配線板10をSZ方式に折り曲げて使用し、接続部の先端に形成された第1露出部41を接合することによってプリント配線板を接続するとともに、前記第1露出部41を除去することによってプリント配線板を剥離してプリント配線板をリペアする場合、図4(a)に示すように、第2露出部42の先端でフレキシブルプリント配線板10を切断してプリント配線板同士を剥離した後、図4(b)に示すように、折畳み形状を変化させるようにして、フレキシブルプリント配線板10の前記第2露出部42を引き出し、接続部の先端に第2露出部42が形成されたフレキシブルプリント配線板10を使用し、再びフレキシブルプリント配線板を接続する。
なおフレキシブルプリント配線板を折畳んで使用する場合、SZ方式に折り曲げる方法のほかに、図4(c)に示すように、フレキシブルプリント配線板をZ方式に折り曲げてもよい。
Furthermore, according to the printed wiring board according to the present invention, when a printed wiring board (for example, a flexible printed wiring board) using the insulating base material 1 having excellent flexibility is used, the printed wiring board can be folded and used. Yes (see FIG. 4).
For example, like the printed wiring board shown in FIG. 1B, the printed wiring board 10 provided with the first to fourth exposed portions 41 to 44 in the connecting portion is bent and used in the SZ method, and is attached to the tip of the connecting portion. When the printed wiring board is connected by joining the formed first exposed portion 41 and the printed wiring board is peeled off by removing the first exposed portion 41 to repair the printed wiring board, FIG. As shown in a), after the flexible printed wiring board 10 is cut at the tip of the second exposed portion 42 and the printed wiring boards are separated from each other, the folded shape is changed as shown in FIG. Then, the second exposed portion 42 of the flexible printed wiring board 10 is pulled out, and the flexible printed wiring board 10 having the second exposed portion 42 formed at the tip of the connection portion is used again. To connect the door wiring board.
When the flexible printed wiring board is used by being folded, the flexible printed wiring board may be folded in the Z system as shown in FIG.

以上、説明したように、図2ないし図4に示すプリント配線板の接続方法及びリペア方法では、プリント配線板10の接続部に形成された電極端子部4に、第1〜第4露出部41〜44を形成したプリント配線板を使用し、このプリント配線板を接続するにあたって、接続部の先端に形成された第1露出部同士41a,41bを接合する。このとき、第1露出部41のみが接合し(接合部)、第2〜第4露出部42〜44は接合していない(非接合部)。
そしてプリント配線板をリペアするにあたって、第2露出部42の先端でプリント配線板を切断し、第1露出部41を除去することによって、接合部が除去されるためプリント配線板を容易に剥離することができる。またプリント配線板の接合部の先端に第2露出部42が形成されたプリント配線板を取得することができるため、前記第2露出部42を接合することによって、再びプリント配線板を接続することができる。このとき、第2露出部42のみが接合し(接合部)、第3〜第4露出部43〜44は接合していないため(非接合部)、更にリペアすることが可能である。
すなわち、所望のリペア回数にあわせて露出部を形成すればよく、プリント配線板10のリペアを1回行なう場合は、少なくとも配線板同士を接続するために必要な長さをもつ露出部を2個形成し、プリント配線板10のリペアをN回行なう場合は、少なくと配線板同士を接続するために必要な長さをもつ露出部をN+1個形成するようにする。
As described above, in the printed wiring board connection method and the repair method shown in FIGS. 2 to 4, the first to fourth exposed portions 41 are formed on the electrode terminal portions 4 formed on the connection portions of the printed wiring board 10. When the printed wiring board formed with .about.44 is used and this printed wiring board is connected, the first exposed portions 41a and 41b formed at the tips of the connecting portions are joined. At this time, only the first exposed portion 41 is joined (joined portion), and the second to fourth exposed portions 42 to 44 are not joined (non-joined portion).
Then, when repairing the printed wiring board, the printed wiring board is cut at the tip of the second exposed portion 42 and the first exposed portion 41 is removed, so that the joint portion is removed, so that the printed wiring board is easily peeled off. be able to. Moreover, since the printed wiring board in which the second exposed portion 42 is formed at the tip of the joint portion of the printed wiring board can be obtained, the printed wiring board is connected again by joining the second exposed portion 42. Can do. At this time, since only the second exposed portion 42 is joined (joined portion) and the third to fourth exposed portions 43 to 44 are not joined (non-joined portion), it is possible to further repair.
That is, the exposed portion may be formed in accordance with the desired number of repairs. When the printed wiring board 10 is repaired once, at least two exposed portions having a length necessary for connecting the wiring boards to each other are provided. When forming and repairing the printed wiring board 10 N times, at least N + 1 exposed portions having a length necessary for connecting the wiring boards are formed.

なお、プリント配線板の接続部に、配線板同士を接続するために必要な長さに、その長さ以上の余長部を加えた長さの導体を露出させた電極端子部4を形成するにあたって、残存レジストを設けず、電極端子部4が区切られていないプリント配線板を使用した場合(図1(a)を参照)、電極端子部同士を接合してプリント配線板同士を接続するにあたって、電極端子部に接合部と非接合部とが形成され、かつ前記非接合部が配線板同士を接続するために必要な長さ以上となるように電極端子部同士を接合することによって、プリント配線板を接続する(図略)。   In addition, the electrode terminal part 4 which exposed the conductor of the length which added the extra length part more than the length to the connection part of a printed wiring board required for connecting wiring boards with each other is formed. In the case of using a printed wiring board in which the remaining resist is not provided and the electrode terminal portion 4 is not divided (see FIG. 1A), the electrode terminal portions are joined to each other to connect the printed wiring boards. By joining the electrode terminal portions to each other so that a joining portion and a non-joining portion are formed in the electrode terminal portion, and the non-joining portion is longer than a length necessary for connecting the wiring boards to each other, printing is performed. Connect the wiring board (not shown).

また、電極端子部に接合部と非接合部とが形成されるようにして配線板同士を接続したプリント配線板をリペアする場合(図略)、プリント配線板を切断することによって接合部を除去し、少なくとも配線板同士を接続するために必要な長さの電極端子部を備えたプリント配線板を取得するとともに(プリント配線板の剥離工程)、前記の少なくとも配線板同士を接続するために必要な長さの電極端子部を備えたプリント配線板を使用し、再びプリント配線板同士を接続する(プリント配線板の再接続工程)。   In addition, when repairing a printed wiring board in which wiring boards are connected so that a joining part and a non-joining part are formed in the electrode terminal part (not shown), the joining part is removed by cutting the printed wiring board. And at least obtaining a printed wiring board having an electrode terminal part of a length necessary for connecting the wiring boards (printing wiring board peeling step), and connecting at least the wiring boards. A printed wiring board provided with an electrode terminal portion of an appropriate length is used, and the printed wiring boards are connected again (printed wiring board reconnection step).

この発明の実施例によるプリント配線板の接続部構造を示す図である。It is a figure which shows the connection part structure of the printed wiring board by the Example of this invention. プリント配線板同士の接続方法の説明図である。It is explanatory drawing of the connection method of printed wiring boards. プリント配線板のリペア方法の説明図である。It is explanatory drawing of the repair method of a printed wiring board. 図3に示すプリント配線板のリペア方法のその他の実施例。FIG. 4 is another embodiment of the printed wiring board repair method shown in FIG. 3. 従来技術によるプリント配線板の接続方法の説明図である。It is explanatory drawing of the connection method of the printed wiring board by a prior art.

符号の説明Explanation of symbols

1,1a,1b 絶縁基板
2,2a,2b 導体
3 レジスト
4 電極端子部
41,42,43,41 露出部
1, 1a, 1b Insulating substrate 2, 2a, 2b Conductor 3 Resist 4 Electrode terminal part 41, 42, 43, 41 Exposed part

Claims (7)

絶縁基材(1)の上に形成した導体(2)の表面にレジスト(3)を被覆したプリント配線板(10)において、
プリント配線板の接続部に、レジストが除去され導体が露出した電極端子部(4)を形成するにあたって、配線板同士を接続するために必要な長さに、その長さ以上の余長部を加えた長さの導体を露出させたことを特徴とするプリント配線板。
In the printed wiring board (10) in which the surface of the conductor (2) formed on the insulating substrate (1) is coated with the resist (3),
In forming the electrode terminal part (4) from which the resist is removed and the conductor is exposed at the connection part of the printed wiring board, an extra length part longer than that length is required to connect the wiring boards to each other. A printed wiring board in which a conductor having an added length is exposed.
部分的にレジストを残存させることによって電極端子部(4)を複数に区切り、少なくとも配線板同士を接続するために必要な長さをもつ露出部(41〜44)を複数形成したことを特徴とする請求項1に記載のプリント配線板。   The electrode terminal part (4) is divided into a plurality by partially leaving the resist, and at least a plurality of exposed parts (41 to 44) having a length necessary for connecting the wiring boards are formed. The printed wiring board according to claim 1. 可撓性を有する絶縁基材(1)を使用したことを特徴とする請求項1又は2に記載のプリント配線板。   The printed wiring board according to claim 1 or 2, wherein a flexible insulating substrate (1) is used. プリント配線板の接続部に、配線板同士を接続するために必要な長さに、その長さ以上の余長部を加えた長さの導体を露出させた電極端子部(4)を形成したプリント配線板の接続方法であって、
電極端子部同士を接合してプリント配線板同士を接続するにあたって、
前記端子電極部(4)に接合部と非接合部とが形成され、かつ非接合部が配線板同士を接続するために必要な長さ以上となるように電極端子部同士を接合することを特徴とするプリント配線板の接続方法。
An electrode terminal portion (4) was formed by exposing a conductor having a length obtained by adding an extra length portion equal to or longer than the length necessary for connecting the wiring boards to the connection portion of the printed wiring board. A printed wiring board connection method,
In joining electrode terminal parts and connecting printed wiring boards,
Joining the electrode terminal portions so that a joining portion and a non-joining portion are formed in the terminal electrode portion (4), and the non-joining portion is longer than a length necessary for connecting the wiring boards. A method for connecting a printed wiring board.
プリント配線板の接続部に、配線板同士を接続するために必要な長さに、その長さ以上の余長部を加えた長さの導体を露出させた電極端子部(4)を形成するとともに、部分的にレジストを残存させることによって電極端子部(4)を複数に区切り、少なくとも配線板同士を接続するために必要な長さをもつ露出部(41〜44)を複数形成したプリント配線板の接続方法であって、
電極端子部同士を接合してプリント配線板同士(10a,10b)を接続するにあたって、
接続部の先端に配置されている第1露出部同士(41a,41b)のみを接合することを特徴とするプリント配線板の接続方法。
An electrode terminal portion (4) is formed by exposing a conductor having a length obtained by adding a surplus portion equal to or longer than the length necessary for connecting the wiring boards to the connection portion of the printed wiring board. In addition, the printed wiring in which a plurality of exposed portions (41 to 44) having a length necessary for connecting at least wiring boards are formed by partially leaving the resist to divide the electrode terminal portion (4) into a plurality of parts. A board connection method,
When connecting the printed wiring boards (10a, 10b) by joining the electrode terminal parts,
A method for connecting printed wiring boards, wherein only the first exposed portions (41a, 41b) arranged at the tips of the connecting portions are joined together.
請求項4に記載の接続方法によってプリント配線板を接続し、電極端子部(4)に接合部と非接合部とが形成されるようにして配線板同士を接続したプリント配線板をリペアする方法であって、
プリント配線板を切断することによって接合部を除去し、少なくとも配線板同士を接続するために必要な長さの電極端子部(4)を備えたプリント配線板を取得する工程と、
接合部を除去したプリント配線板を使用し、少なくとも配線板同士を接続するために必要な長さの電極端子部同士を接合することによって、再びプリント配線板同士を接続する工程と、
からなることを特徴とするプリント配線板のリペア方法。
The method of repairing the printed wiring board which connected the printed wiring board by the connection method of Claim 4, and connected the wiring boards so that a junction part and a non-joining part may be formed in an electrode terminal part (4). Because
The step of removing the joint by cutting the printed wiring board, obtaining a printed wiring board having an electrode terminal portion (4) of a length necessary to connect at least the wiring boards;
Using the printed wiring board from which the joint portion has been removed, connecting the printed wiring boards again by joining at least the electrode terminal portions of a length necessary for connecting the wiring boards,
A method of repairing a printed wiring board, comprising:
請求項5に記載の接続方法によってプリント配線板を接続し、接続部の先端に配置された第1露出部同士(41a,41b)を接合することによって配線板同士を接続したプリント配線板をリペアする方法であって、
プリント配線板を切断することによって、第1露出部(41a,41b)を除去し、接続部の先端に第2露出部(42a,42b)が形成されたプリント配線板を取得する工程と、
接続部の先端に第2露出部(42a,42b)が形成されたプリント配線板を使用し、第2露出部同士(42a,42b)を接合することによって、再びプリント配線板同士を接続する工程と、
からなることを特徴とするプリント配線板のリペア方法。
The printed wiring board is connected by the connection method according to claim 5, and the printed wiring board in which the wiring boards are connected by repairing the first exposed portions (41 a, 41 b) arranged at the tips of the connecting portions is repaired. A way to
Cutting the printed wiring board to remove the first exposed portions (41a, 41b) and obtaining a printed wiring board having the second exposed portions (42a, 42b) formed at the tips of the connecting portions;
A step of connecting the printed wiring boards again by joining the second exposed portions (42a, 42b) using the printed wiring board in which the second exposed portions (42a, 42b) are formed at the tips of the connecting portions. When,
A method of repairing a printed wiring board, comprising:
JP2003421914A 2003-12-19 2003-12-19 Printed wiring board and its connection method, and repairing method Pending JP2005183647A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010009707A (en) * 2008-06-30 2010-01-14 Hitachi Media Electoronics Co Ltd Connection structure of flexible substrate and optical pickup device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010009707A (en) * 2008-06-30 2010-01-14 Hitachi Media Electoronics Co Ltd Connection structure of flexible substrate and optical pickup device
US8420944B2 (en) 2008-06-30 2013-04-16 Hitachi Media Electronics Co., Ltd. Connection structure of flexible printed circuits and optical pickup device including the connection structure

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