JP2005179442A - Method and apparatus for adhesion underwater - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for securely attaching an object on the surface of a sunken or wet object within a short time using an instantaneous adhesive. <P>SOLUTION: The instantaneous adhesive is applied onto the object to be attached and covered with a non-water-permeable sheet before it solidifies, the sheet is removed as soon as the object reaches the adherend underwater, and the surface of the object onto which the adhesive is applied is pressed against the adherend. Alternatively, the object to be attached is soaked into the instantaneous adhesive and kept watertight in a non-water-permeable capsule, the capsule is unsealed as soon as the object reaches the adherend underwater, and the object to which the adhesive is attached is directly pressed against the adherend. The object to be attached is a waterproof strain gauge, and the adherend is a wall of a pilot pore formed on a borehole bottom. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a method and an apparatus for adhering another object to the surface of an object that is submerged or wet. For example, in a hole wall strain method, a waterproof strain gauge is quickly attached to a pilot hole of a boring hole. It is applied to the technology that can be securely bonded.

  Among the stress relief methods, the hole wall strain method using a submerged borehole causes the water in the borehole to become an obstacle when installing a strain gauge or a displacement gauge. The test was carried out using a borehole that was excavated and drained by gravity. For this reason, the drilling hole for testing could not be excavated in an arbitrary direction. In this regard, if a strain gauge or a displacement gauge is installed in the pilot hole using an instantaneous adhesive, the stress release test can be performed in a very short time. However, since the instantaneous adhesive loses its bonding ability due to contact with water. It was not easy to apply the stress release test to the downward bore hole where the bore hole is filled with water.

  Therefore, when a strain gauge is bonded to a downward pilot hole filled with water, the strain gauge is embedded in an epoxy resin body smaller than the pilot hole diameter in advance, and the gap between the epoxy resin body and the pilot hole wall surface is embedded. A method of substituting, filling, and adhering water present in the epoxy resin with an epoxy resin (referred to as Prior Art 1) is also used.

  Moreover, in order to adhere a strain gauge to the surface of a wet bedrock, an epoxy-based putty-like underwater adhesive is also used (referred to as Prior Art 2).

  Furthermore, a method of embedding a strain gauge or a displacement gauge in a pilot hole with cement is also performed (referred to as Prior Art 3).

  Among the above-described conventional techniques, in the method of Prior Art 1, it takes several days for the epoxy resin to be completely cured depending on the water temperature. Moreover, since the capsule which accommodated the adhesive agent also has to be inserted in a pilot hole structurally, a longer pilot hole must be excavated. In addition, since the adhesive used in the prior art 2 is putty-like, it does not fit well with a strain gauge or rock, and it takes several days until the underwater adhesive is completely cured to become an elastic body. Furthermore, in the method of the prior art 3, as in the method of embedding a strain gauge in an epoxy resin, since the strain gauge is not directly bonded to the rock, the sensitivity of the measurement is compared with the method of directly bonding the strain gauge to the hole wall. Is low.

  In short, in the prior art, since it took several days for the adhesive or curing agent for installing the strain gauge to the pilot hole to become an elastic body, there was a problem that the construction cost was increased. Further, in the conventional bonding method in which the gap between the strain gauge and the pilot hole wall surface is filled, it is necessary to insert a capsule containing the adhesive into the pilot hole, and therefore it is necessary to drill a relatively long pilot hole. Furthermore, in the prior art, since the strain gauge could not be directly bonded to the wall surface of the pilot hole wetted with the strain gauge, the measurement sensitivity was not necessarily high.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a method for reliably bonding another object to the surface of a submerged / wet object in a short time with an instantaneous adhesive. More specifically, the waterproof strain gauge and the instantaneous adhesive that maintains the adhesive ability are transported into the pilot hole filled with water, and directly onto the pilot hole wall by the instantaneous adhesive. A bonding device for bonding a waterproof strain gauge is provided, and a stress release test is reliably performed in a short time.

  In order to achieve the above object, according to the present invention, an instantaneous adhesive is applied to an adhesive body, and the instantaneous adhesive is coated with a water-impermeable sheet before solidification, and the adhesive body is underwater. When the adhesive body was reached, the sheet was removed and the surface of the adhesive body to which the instantaneous adhesive was applied was pressed against the adherend. Here, the application of the instantaneous adhesive to the adhesive is performed on the ground. After this coating operation, the instantaneous adhesive is coated with a non-water-permeable sheet. At this time, since the instantaneous adhesive is in an unsolidified state, the effect of bonding the sheet and the adhesive is not exhibited. In addition, since the instantaneous adhesive is coated with a water-impermeable sheet, water does not directly touch the instantaneous adhesive even in water, and the bonding ability is not lost. Then, when the adhesive body is brought close to the vicinity of the adherend, the adhesive body and the adherend can be bonded instantaneously by quickly removing the sheet and joining them almost simultaneously.

  In general, instantaneous adhesives are generally “adhesives with extremely fast adhesion rates. The monomer of the main component cyanoacrylate adsorbs moisture in the air and polymerizes, and solidifies within a few seconds to 3 minutes. It is understood that it has been established as a technical term with the definition of “used for medical and crafting in addition to bonding machines” (see Kojien 5th edition). In addition, there is a chapter on instant adhesives in the “New Edition / Aluminum Technology Handbook” edited by the Light Metal Association. Therefore, in the present invention, the term “instant adhesive” is used as defined in various documents. As a specific example, the instant adhesive sold under the trade name “Aron Alpha” (registered trademark). Can be illustrated.

  Further, in the present invention, the adhesive body is kept watertight in a water-impermeable capsule in a state where it is immersed in the instantaneous adhesive, and the capsule is torn or opened at the same time as it reaches the adherend in water. Then, means for directly pressing the adhesive body against the adherend with the instantaneous adhesive attached thereto is used.

  These means are targeted for waterproof strain gauges as adhesives, and are submerged in the stress release method by targeting the hole walls of pilot holes provided at the bottoms of the boreholes as adherends. It is applied to the hole wall strain method using a borehole.

  In the bonding apparatus of the present invention for carrying out the above method, a plurality of waterproof strain gauges are arranged on a flexible outer pipe having a slit in the axial direction, and slides in the axial direction of the outer pipe inside the outer pipe. Then, the outer pipe is expanded to form a double pipe structure having an inner pipe for pressing the waterproof strain gauge against the wall surface of the pilot hole.

  The instant adhesive for adhering the waterproof strain gauge to the wall of the pilot hole submerged loses its adhesive strength when exposed to water, so in the present invention, the device body arrives at the pilot hole at the bottom of the borehole, The adhesive strain gauge is held in a state where the waterproof strain gauge is immersed in the adhesive until just before the waterproof strain gauge is attached, and has an adhesive capsule for preventing the adhesive and water from contacting each other.

  Thus, when the attaching device is lowered to the pilot hole by an appropriate transport device, first, the stopper of the outer pipe on which the waterproof strain gauge is arranged comes into contact with the bottom of the large bore hole, that is, the pilot hole. Next, the inner pipe pushes down the adhesive capsule by sliding inside the outer pipe, and at the same time, the outer pipe is spread toward the wall surface of the pilot hole, and the waterproof strain is placed on the outer pipe and the adhesive is attached. The gauge is quickly bonded to the pilot hole wall.

  As described above, according to the present invention, the waterproof strain gauge can be securely bonded to the hole wall of the relatively short pilot hole by the instantaneous adhesive, so that the stress release test can be performed within a short time after the gauge is bonded. Can start.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. FIG. 1 shows a first embodiment of the method of the present invention. This embodiment shows a general concept of the method of the present invention and corresponds to the invention according to claim 1. That is, in this method, first, the instantaneous adhesive a is applied to an appropriate surface of the object A (adhesive) (see FIG. 1A), and the instantaneous adhesive a is applied to the non-permeable sheet s before polymerization and solidification. (Refer to the figure (b)). This embodiment is supported by an experiment using Aron Alpha (registered trademark) as the instantaneous adhesive and a vinyl sheet as the water-impermeable sheet s.

  Next, the object A is put in water and brought close to the vicinity of the object B (adhered object) (see FIG. 10C), the sheet s is removed, and the surface of the object A to which the instantaneous adhesive a is applied is removed. By quickly pressing against the object B, both A and B can be bonded instantaneously (see FIG. 4D).

  FIG. 2 shows a bonding apparatus according to the second embodiment of the present invention. This apparatus corresponds to the method of the present invention according to claim 2. That is, as shown in FIG. 2, this bonding apparatus is roughly composed of an outer pipe 1, an inner pipe 2, and an adhesive capsule 3 provided at the tip of the inner pipe 2. The inner pipe 2 is inscribed in the inner wall of the outer pipe 1 to form a double pipe structure, and is slidable in the major axis direction of the outer pipe 1.

  More specifically, the distal end of the outer pipe 1 includes a bulging portion 1b that bulges inward via the inner tapered surface 1a, and a strain gauge 4 is set on the outer tapered surface 1c of the bulging portion 1b. Yes. Further, a step is provided in the middle portion of the inner pipe 2 via a tapered surface 2a. When the inner pipe 2 is slid, the tapered surface 2a abuts against the inner tapered surface 1a of the outer pipe 1, and the possibility is increased. The bulging portion 1b is pushed outward in accordance with the flexibility, and the strain gauge 4 set on the outer tapered surface 1c can be appropriately pressed against the adherend such as the inner wall of the pilot hole.

  Further, an instantaneous adhesive is enclosed in the adhesive capsule 3, and the strain gauge 4 is immersed in the instantaneous adhesive together with the expanded portion 1 b of the outer pipe 1. The capsule 3 is configured to be open upward, but a water-impermeable sheet 5 is provided in the open portion to keep the inside of the capsule 3 watertight.

  In the figure, reference numeral 6 denotes a stopper provided on the outer pipe 1 so as to protrude outward. The stopper 6 incorporates a chassis pin 7 that engages with the pin hole 2b of the inner pipe 2, and the engagement is defined as an initial setting of the outer pipe 1 and the inner pipe 2 to the lower side of the inner pipe 2. At the time of sliding, the chassis pin 7 is disengaged from the pin hole 2b and allowed to slide.

  Subsequently, an embodiment of the method of the present invention using the bonding apparatus having the above configuration will be described with reference to FIGS. In this embodiment, the waterproof strain gauge 4 corresponds to the bonded body, and the inner wall of the pilot hole P corresponds to the bonded body. First, the bonding device set as described above is lowered to the pilot hole P by an appropriate transport device (see FIG. 3). Since the diameter of the stopper 6 is larger than the diameter of the pilot hole P, when the bonding device is inserted into the pilot hole P, the stopper 6 comes into contact with the inlet of the pilot hole P, and the insertion of the outer pipe 1 is prevented at this stage. (See FIG. 4). When the bonding device is further inserted, the shear pin 7 is sheared, the inner pipe 2 inscribed in the outer pipe 1 and the adhesive capsule 3 connected thereto are pushed down in the axial direction of the pilot hole P, and the lowering In the process, the expanded portion 1b of the outer pipe 1 breaks the water-impermeable sheet 5, the waterproof strain gauge 4 to which the instantaneous adhesive is applied is exposed from the adhesive capsule 3, and the tapered surface of the inner pipe 2 is further removed. 2a contacts the inner taper 1a of the outer pipe 1 and pushes the expanded portion 1b of the flexible outer pipe 1 to the pilot hole P side. By performing the process from the breaking of the sheet 5 described above to the expansion of the expanded portion 1b, that is, the lowering operation of the inner pipe 2 in the meantime, the waterproof strain gauge 4 to which the instantaneous adhesive is applied is removed. It is possible to quickly press and adhere to the wall surface of the pilot hole P.

Process drawing of the adhesion | attachment method which concerns on 1st embodiment of this invention. Schematic of the bonding apparatus according to the second embodiment of the present invention. Explanatory drawing which showed the 1st process of the method of this invention by the apparatus Explanatory drawing showing the second step Explanatory drawing showing the third step

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Outer pipe 2 Inner pipe 3 Adhesive capsule 4 Waterproof type strain gauge 5 Water-impermeable sheet 6 Stopper 7 Chassis pin

Claims (5)

While applying the instantaneous adhesive to the adhesive, and coating the instantaneous adhesive with a water-impermeable sheet before solidifying, and removing the sheet when the adhesive reaches the adherend under water, A bonding method under water, wherein the surface of the bonded body to which the instantaneous adhesive is applied is pressed against the bonded body. The adhesive is immersed in an instantaneous adhesive and kept watertight in a non-permeable capsule. When the adhesive reaches the adherend to be bonded under water, the capsule is broken or opened to bond the adhesive. An underwater bonding method, wherein the body is directly pressed against an adherend with an instantaneous adhesive attached. The bonding method under water according to claim 1 or 2, wherein the bonded body is a waterproof strain gauge, and the bonded body is a hole wall of a pilot hole provided at the bottom of the borehole. A flexible outer pipe having a slit in the axial direction, an inner pipe inserted into the outer pipe and slidable to expand the outer pipe, and provided at the tip of the inner pipe, the adhesive body is watertight It consists of a capsule of instantaneous adhesive that is accommodated in an immersed state, and when the inner pipe slides, the adhesive capsule is pushed down to expand the diameter of the outer pipe, and the capsule is opened by this expansion, and the adhesive is An underwater bonding apparatus characterized in that the adhered adhesive body can be directly pressed against an adherend. 5. The underwater bonding apparatus according to claim 4, wherein the bonded body is a waterproof strain gauge, and the bonded body is a hole wall of a pilot hole provided at the bottom of the borehole.

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