JP2005169437A

JP2005169437A - High frequency soldering iron device

Info

Publication number: JP2005169437A
Application number: JP2003411116A
Authority: JP
Inventors: Tsutomu Miyazaki; 力宮崎
Original assignee: Miyaden Co Ltd
Current assignee: Miyaden Co Ltd
Priority date: 2003-12-10
Filing date: 2003-12-10
Publication date: 2005-06-30

Abstract

<P>PROBLEM TO BE SOLVED: To provide a high frequency soldering iron which is capable of controlling the temperature at an iron tip with high accuracy, favorably used for soldering various kinds of electronic components or the like, and enables exchange of a heating coil so as to provide excellent maintainability and convenience. <P>SOLUTION: The soldering iron comprises a heat generating body having an iron tip piece with a heating coil coiled therearound, a grip part to hold the heat generating body, a high frequency power supply to supply high frequency current to the heating coil, a temperature sensor to detect the temperature of the iron tip piece, and a control circuit to control the high frequency power supply based on the temperature detected by the temperature sensor. The heat generating body is attachably/detachably supported by the grip part via a cylindrical supporting member. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明は、高周波の誘導加熱を利用して発熱体の鏝先を加熱することにより、各種電子部品等の半田付けに好適に使用し得る高周波半田鏝装置に関する。 The present invention relates to a high-frequency soldering iron apparatus that can be suitably used for soldering various electronic components and the like by heating the tip of a heating element using high-frequency induction heating.

従来、高周波式の半田鏝としては、例えば特許文献１に開示のものが提案されている。この半田鏝は、内部に加熱コイルが巻回状態で配置された筒状のケース体と、該ケース体の嵌合孔に挿脱され先端に着脱可能な鏝先を有するカートリッジ式の被加熱体と、加熱コイルに高周波電流を供給するトランジスタインバータ回路等を備え、加熱コイルへの高周波電流の供給により、被加熱体を誘導加熱して鏝先を所定温度に維持するようにしたものである。
特開２００１−２９８２６８号公報 Conventionally, as a high-frequency soldering iron, for example, one disclosed in Patent Document 1 has been proposed. This soldering iron has a cylindrical case body in which a heating coil is wound inside, and a cartridge-type heated body having a hook that is inserted into and removed from the fitting hole of the case body and can be attached to and detached from the tip. And a transistor inverter circuit for supplying a high-frequency current to the heating coil, and by supplying the high-frequency current to the heating coil, the object to be heated is inductively heated to maintain the tip at a predetermined temperature.
JP 2001-298268 A

しかしながら、この半田鏝においては、被加熱体がカートリッジ式に形成されて握持部に設けたケース体に対して着脱できるものの、非加熱体自体が握持部に対して固定的に配置されているため、加熱コイルの交換・修理等のメンテナンスの作業性が劣り、例えば巻数（加熱効率）の異なる加熱コイルへの交換等が困難であるという問題点を有している。 However, in this soldering iron, although the heated body is formed in a cartridge type and can be attached to and detached from the case body provided in the gripping portion, the non-heating body itself is fixedly arranged with respect to the gripping portion. Therefore, the workability of maintenance such as replacement / repair of the heating coil is inferior. For example, it is difficult to replace the heating coil with a different number of turns (heating efficiency).

また、鏝先の温度を検出するセンサを被加熱体に埋設しているものの、被加熱体の先端の温度で鏝先の温度を代用しているため、鏝先先端の温度を精度良く検出することが困難で、半田鏝の温度管理を高精度に行うことが難しいという問題点を有している。特に、この種の半田鏝においては、電子部品の半田耐熱性等の観点から鏝先先端の温度管理が極めて重要視されており、その改善が望まれているのが実情である。 In addition, although the sensor for detecting the tip temperature is embedded in the object to be heated, the tip temperature is used instead of the tip temperature of the object to be heated, so the tip tip temperature is accurately detected. However, it is difficult to control the temperature of the soldering iron with high accuracy. In particular, in this type of soldering iron, temperature management at the tip of the iron tip is regarded as extremely important from the viewpoint of solder heat resistance of electronic components, and the improvement is desired.

本発明は、このような事情に鑑みてなされたもので、その目的は、鏝先の温度管理を高精度に行うことができて、各種電子部品等の半田付けに好適に使用し得る高周波半田鏝装置を提供することにある。また、他の目的は、前記目的に加え、加熱コイルの交換等が可能となってメンテナンス性と使い勝手に優れた高周波半田鏝を提供することにある。 The present invention has been made in view of such circumstances, and an object of the present invention is to provide high-frequency soldering that can perform temperature management of the tip with high accuracy and can be suitably used for soldering various electronic components and the like. It is to provide a dredge device. Another object of the present invention is to provide a high-frequency soldering iron excellent in maintainability and ease of use since the heating coil can be replaced in addition to the above object.

かかる目的を達成すべく、本発明のうち請求項１に記載の発明は、外周面に加熱コイルが巻回配置され鏝先ピースを有する発熱体と、該発熱体を保持する握持部と、前記加熱コイルに高周波電流を供給する高周波電源と、前記鏝先ピースの温度を検出する温度センサと、該温度センサで検出された温度に基づいて前記高周波電源を制御する制御回路と、を備えたことを特徴とする。 In order to achieve such an object, the invention described in claim 1 of the present invention includes a heating element in which a heating coil is wound around an outer peripheral surface and having a tip piece, and a gripping part that holds the heating element, A high frequency power source for supplying a high frequency current to the heating coil, a temperature sensor for detecting a temperature of the tip piece, and a control circuit for controlling the high frequency power source based on the temperature detected by the temperature sensor. It is characterized by that.

また、請求項２に記載の発明は、前記発熱体が筒状支持部材を介して握持部に着脱可能に配設されていることを特徴とし、請求項３に記載の発明は、前記鏝先ピースが発熱体に着脱可能に配設されていることを特徴とする。 The invention according to claim 2 is characterized in that the heating element is detachably disposed on a gripping part via a cylindrical support member, and the invention according to claim 3 The tip piece is detachably disposed on the heating element.

また、請求項４に記載の発明は、前記握持部の内部に、高周波電源と加熱コイルとを整合させる整合回路が設けられていることを特徴とし、請求項５に記載の発明は、前記温度センサが発熱体から鏝先ピースに貫通配置された状態で配設されていることを特徴とする。 The invention according to claim 4 is characterized in that a matching circuit for matching a high-frequency power source and a heating coil is provided inside the gripping part, and the invention according to claim 5 is characterized in that The temperature sensor is disposed in a state where the temperature sensor penetrates from the heating element to the tip piece.

本発明の請求項１に記載の発明によれば、鏝先ピースの温度が該ピース内に配設された温度センサで検出され、この検出温度に基づいて制御回路によって高周波電源の出力が調整（制御）されるため、温度センサで検出した温度に基づいて発熱体の鏝先ピース先端の温度を高精度に管理することができて、例えば半導体電子部品等であっても、最適温度で素早く半田付けすることができる。 According to the first aspect of the present invention, the temperature of the tip piece is detected by the temperature sensor disposed in the piece, and the output of the high frequency power source is adjusted by the control circuit based on the detected temperature ( Therefore, the temperature of the tip of the tip of the heating element can be managed with high accuracy based on the temperature detected by the temperature sensor. Can be attached.

また、請求項２に記載の発明によれば、請求項１に記載の発明の効果に加え、発熱体が筒状支持部材を介して握持部に着脱可能に支持されているため、加熱コイルが巻回されている発熱体を握持部から取り外しできて、例えば巻数の異なる発熱体に交換できて、所望の加熱効率の発熱体を使用できたり加熱コイルの保守が可能になる等、半田鏝のメンテナンス性と使い勝手の向上を図ることができる。 According to the invention described in claim 2, in addition to the effect of the invention described in claim 1, since the heating element is detachably supported by the gripping part via the cylindrical support member, the heating coil Can be removed from the gripping part, for example, it can be replaced with a heating element with a different number of windings, a heating element with a desired heating efficiency can be used, and the heating coil can be maintained. It is possible to improve the maintainability and usability of the bag.

また、請求項３に記載の発明によれば、請求項１または２に記載の発明の効果に加え、鏝先ピースが発熱体に着脱可能に配設されているため、摩耗した鏝先ピースの交換が簡単に行えると共に、所望の温度状態が得られる所望材質の鏝先ピースを使用できる等、半田鏝のメンテナンス性と使い勝手の一層の向上を図ることができる。 According to the invention described in claim 3, in addition to the effect of the invention described in claim 1 or 2, since the tip piece is detachably attached to the heating element, the worn tip piece It is possible to easily improve the maintainability and usability of the soldering iron, such as using a tip piece of a desired material that can be easily exchanged and obtain a desired temperature state.

また、請求項４に記載の発明によれば、請求項１ないし３に記載の発明の効果に加え、握持部の内部に高周波電源と加熱コイルとを整合させる整合回路が設けられているため、握持部の内部空間を有効利用しつつ、加熱コイルにできるだけ近い位置での整合が可能となり、伝達ロス等を抑えて発熱体に効率的な加熱状態を容易に得ることができる。 According to the invention described in claim 4, in addition to the effects of the invention described in claims 1 to 3, a matching circuit for matching the high frequency power source and the heating coil is provided inside the gripping portion. Alignment at a position as close as possible to the heating coil is possible while effectively using the internal space of the gripping portion, and an efficient heating state can be easily obtained in the heating element while suppressing transmission loss and the like.

また、請求項５に記載の発明によれば、請求項１ないし４に記載の発明の効果に加え、温度センサが発熱体から鏝先ピースに貫通配置された状態で配設されているため、例えば発熱体を着脱式に構成する場合であっても、温度センサを鏝先ピース内に確実に位置させることができて、鏝先ピース先端の温度管理を一層良好に行うことができる。 According to the invention described in claim 5, in addition to the effects of the invention described in claims 1 to 4, the temperature sensor is disposed in a state of being penetrating from the heating element to the tip piece, For example, even when the heating element is configured to be detachable, the temperature sensor can be reliably positioned in the tip piece, and the temperature management of the tip of the tip can be performed more satisfactorily.

以下、本発明を実施するための最良の形態を図面に基づいて詳細に説明する。
図１〜図５は、本発明に係わる高周波半田鏝装置の一実施形態を示し、図１がその一部を破断した側面図、図２がその要部の拡大断面図、図３が図１のＡ−Ａ矢視図、図４が図２のＢ−Ｂ矢視図、図５が高周波半田鏝装置のブロック図である。 The best mode for carrying out the present invention will be described below in detail with reference to the drawings.
1 to 5 show an embodiment of a high-frequency soldering apparatus according to the present invention, FIG. 1 is a side view with a part broken away, FIG. 2 is an enlarged sectional view of the main part, and FIG. FIG. 4 is a view taken along the line A-B of FIG. 2, and FIG. 5 is a block diagram of the high-frequency soldering apparatus.

図１〜図４において、高周波半田鏝装置１（以下、半田鏝装置１という）は、半田付け時に作業者が手で握ると共に、その長手方向の一端部に着脱可能に配設された鏝部３を有する握持部２と、この握持部２の長手方向の他方の端部から引き出されたケーブル５に接続された電源部４等を備えている。 1 to 4, a high-frequency soldering apparatus 1 (hereinafter referred to as a soldering apparatus 1) is gripped by an operator during soldering and detachably disposed at one end in the longitudinal direction. 3 and a power supply unit 4 connected to a cable 5 drawn from the other end in the longitudinal direction of the grip 2.

前記握持部２は、図１及び図２に示すように、例えば樹脂、木材等によって中央部分に凹部が形成された一対の板状部材を、４隅に設けた取付孔６を利用してネジ（図示せず）で合わせ固定することにより、内部に前記一対の凹部からなる空洞部７を有する略角柱形状に形成され、空洞部７内には後述する整合回路９等が構築されたプリント基板８が内蔵されている。 As shown in FIGS. 1 and 2, the gripping portion 2 uses a pair of plate-like members having recesses formed in the central portion, for example, by resin, wood, etc., using attachment holes 6 provided at four corners. Printed in which a matching prism 9 or the like, which will be described later, is formed in the cavity portion 7 by being fixed together with screws (not shown) to form the hollow portion 7 formed of the pair of recesses therein. A substrate 8 is built in.

また、握持部２の長手方向の一方の端面である前面には、円形の嵌合孔１０が前記空洞部７に連通状態で設けられると共に、嵌合孔１０の空洞部７側の端部には、コネクタ１１が嵌合孔１０に嵌め込み状態で固定されている。このコネクタ１１は、例えば雌型コネクタで形成され、その端子に接続されたフラットケーブル１３の各リード線が前記プリント基板８に接続されている。さらに、握持部２の前端側の上面には、その下端が前記嵌合孔１０に連通するネジ孔１４が形成されており、このネジ孔１４には鏝部３を固定するためのねじ１５がねじ込まれている。 In addition, a circular fitting hole 10 is provided in communication with the cavity portion 7 on the front surface which is one end surface in the longitudinal direction of the gripping portion 2, and an end portion of the fitting hole 10 on the cavity portion 7 side. The connector 11 is fixed in a fitted state in the fitting hole 10. The connector 11 is formed of, for example, a female connector, and each lead wire of the flat cable 13 connected to the terminal is connected to the printed board 8. Further, a screw hole 14 whose lower end communicates with the fitting hole 10 is formed on the upper surface on the front end side of the gripping portion 2, and a screw 15 for fixing the collar portion 3 to the screw hole 14. Is screwed.

なお、握持部２に設けられる前記嵌合孔１０は、コネクタ１１部分の内径が前方側の内径に対して段差１６（図２参照）を有するように小径に形成されており、この段差１６によって、鏝部３を握持部２の嵌合孔１０に挿入して装着する際の位置決めがなされるようになっている。 The fitting hole 10 provided in the grip portion 2 is formed with a small diameter so that the inner diameter of the connector 11 portion has a step 16 (see FIG. 2) with respect to the inner diameter on the front side. Thus, positioning is performed when the flange 3 is inserted into the fitting hole 10 of the grip 2 and attached.

この握持部２に着脱可能に装着される前記鏝部３は、例えば電熱用マイカ等で形成された所定長さでその内部に断熱材１８が充填された筒状支持部材１７を有し、この筒状支持部材１７の先端部内には、例えばスターバックス材等の渦電流を誘起し得る金属製の発熱体１９がねじ２０により着脱可能に装着されている。この発熱体１９は、先端側が筒状支持部材１７の内径と同一の外径形状に形成されて筒状支持部材１７内にねじ２０で固定支持されると共に、後端側が径小に形成され、この径小部分の外周面にマイカ２６を介して加熱コイル２１が所定回数巻回されている。 The flange portion 3 that is detachably attached to the gripping portion 2 includes a cylindrical support member 17 having a predetermined length formed of, for example, electric heating mica and the like, and a heat insulating material 18 filled therein. A metal heating element 19 capable of inducing an eddy current, such as a Starbucks material, is detachably mounted with a screw 20 in the distal end portion of the cylindrical support member 17. The heating element 19 has a distal end formed in the same outer diameter as the inner diameter of the cylindrical support member 17 and fixedly supported by the screw 20 in the cylindrical support member 17, and a rear end side formed in a small diameter. The heating coil 21 is wound around the outer peripheral surface of the small-diameter portion through a mica 26 a predetermined number of times.

また、発熱体１９の先端面には軸方向にネジ部１９ａが形成され、このネジ部１９ａに銅材で形成された鏝先ピース２２のネジ部２２ａがねじ込まれている。さらに、前記筒状支持部材１７の後端部には、例えば雄型コネクタで形成されたコネクタ１２が固定されており、このコネクタ１２が前記コネクタ１１に嵌合されるようになっている。この筒状支持部材１７のコネクタ１２の端子には、前記加熱コイル２１の両端部に接続された電線２１ａが接続されると共に、先端部が鏝先ピース２２の略先端まで挿通されたシース熱電対からなる温度センサ２３のリード線が接続されている。 Further, a screw portion 19a is formed in the axial direction on the distal end surface of the heating element 19, and the screw portion 22a of the tip piece 22 made of a copper material is screwed into the screw portion 19a. Further, a connector 12 formed of, for example, a male connector is fixed to the rear end portion of the cylindrical support member 17, and the connector 12 is fitted to the connector 11. The sheath 12 is connected to the terminal of the connector 12 of the cylindrical support member 17 with the electric wire 21a connected to both ends of the heating coil 21 and the distal end of which is inserted to the substantially distal end of the tip piece 22. The lead wire of the temperature sensor 23 consisting of is connected.

これにより、握持部２の嵌合孔１０に筒状支持部材１７の後端部を挿入してそのコネクタ１２をコネクタ１１に嵌合させることにより、加熱コイル２１や温度センサ２３がプリント基板８に電気的に接続されると共に、ねじ１５をネジ孔１４にねじ込んでその下端を筒状支持部材１７に当接させることにより、鏝部３が握持部２に支持されるようになっている。また、ねじ１５を緩めて筒状支持部材１７を引っ張ることにより、コネクタ１１、１２の嵌合状態が解除されて鏝部３が握持部２から取り外しできると共に、鏝先ピース２２を発熱体１９に対して回転操作することにより着脱できて、鏝部３自体の取り外しや交換あるいは鏝先ピース２２の交換等が可能となっている。 Thus, the heating coil 21 and the temperature sensor 23 are connected to the printed circuit board 8 by inserting the rear end portion of the cylindrical support member 17 into the fitting hole 10 of the gripping portion 2 and fitting the connector 12 to the connector 11. And the flange 3 is supported by the grip portion 2 by screwing the screw 15 into the screw hole 14 and bringing the lower end thereof into contact with the cylindrical support member 17. . Further, by loosening the screw 15 and pulling the cylindrical support member 17, the fitting state of the connectors 11 and 12 is released so that the collar part 3 can be detached from the grip part 2 and the collar piece 22 is attached to the heating element 19. It is possible to detach and replace the collar 3 itself, or to replace the collar piece 22 or the like.

前記電源部４は、図５に示すように、高周波電源回路２４と温度制御回路２５等を有し、図示しない筐体の操作パネルには、電源スイッチや加熱スイッチ、鏝先ピース２２の温度を設定する温度設定器、この温度設定器で設定した設定温度や鏝先ピース２２の温度（温度センサ２３の温度）を表示する温度表示器等が設けられている。前記高周波電源回路２４は、例えばＦＥＴ、ＩＧＢＴ、ＳＩＴ等の半導体スイッチング素子を有するトランジスタインバータ回路で構成され、所定周波数の高周波電流を加熱コイル２１に供給できるようになっている。 As shown in FIG. 5, the power supply unit 4 includes a high frequency power supply circuit 24, a temperature control circuit 25, and the like. The operation panel of the casing (not shown) has a power switch, a heating switch, and the temperature of the tip piece 22 A temperature setter to be set, a temperature indicator for displaying the set temperature set by the temperature setter and the temperature of the tip piece 22 (the temperature of the temperature sensor 23) are provided. The high frequency power supply circuit 24 is constituted by a transistor inverter circuit having semiconductor switching elements such as FET, IGBT, SIT, etc., and can supply a high frequency current of a predetermined frequency to the heating coil 21.

また、温度制御回路２５は、例えばリレーやシーケンサーあるいはマイコン等が使用され、温度センサ２３から入力される鏝先ピース２２の温度信号に基づいて高周波電源回路２４の出力を増減させて、加熱コイル２１による発熱体１９の加熱温度を増減させるようになっており、この温度制御回路２５により、鏝先ピース２２の温度が高精度に制御されて、例えば温度が低下した場合の瞬時の復帰等が可能となっている。 The temperature control circuit 25 uses, for example, a relay, a sequencer, a microcomputer, or the like, and increases or decreases the output of the high frequency power supply circuit 24 based on the temperature signal of the tip piece 22 input from the temperature sensor 23, thereby heating the coil 21. The heating temperature of the heating element 19 is increased or decreased, and the temperature control circuit 25 controls the temperature of the tip piece 22 with high accuracy so that, for example, an instantaneous return when the temperature is lowered is possible. It has become.

前記握持部２に内蔵されたプリント基板８上に構築されている整合回路９は、図示しない整合トランス等を有し、電源部４の高周波電源回路２４の出力と加熱コイル２１とを整合（マッチング）させて、所定周波数で所定電力の高周波電流を加熱コイル２１に効率的に供給するためのものである。また、この整合回路９が構築されるプリント基板８には、整合回路９の他に、温度センサ２３の温度信号を温度制御回路２５に送信するための図示しない回路等も構築されている。なお、前記温度制御回路２５は、電源部４に設けることなくプリント基板８上に設け、ケーブル５を介して電源部４としての高周波電源回路２４を制御するように構成しても良い。 The matching circuit 9 built on the printed circuit board 8 built in the gripping unit 2 has a matching transformer (not shown) and matches the output of the high-frequency power circuit 24 of the power supply unit 4 and the heating coil 21 ( Matching) to efficiently supply a high-frequency current of a predetermined power at a predetermined frequency to the heating coil 21. In addition to the matching circuit 9, a circuit (not shown) for transmitting the temperature signal of the temperature sensor 23 to the temperature control circuit 25 is also constructed on the printed circuit board 8 on which the matching circuit 9 is constructed. The temperature control circuit 25 may be provided on the printed circuit board 8 without being provided in the power supply unit 4 and may be configured to control the high-frequency power supply circuit 24 as the power supply unit 4 via the cable 5.

この半田鏝装置１を使用する場合は、先ず、電源部４の電源スイッチをオンさせ、温度設定器により半田付けする電子部品の最適半田付け温度を設定し、加熱スイッチをオンさせる。加熱スイッチがオンすると、高周波電源回路２４から設定温度に応じた高周波電流がケーブル５、整合回路９及びコネクタ１１、１２等を介し加熱コイル２１に供給されて加熱コイル２１から磁力線が発生する。この磁力線により、発熱体１９に渦電流が誘起されて該発熱体１９が所定温度まで誘導加熱され、この発熱体１９の加熱温度が鏝先ピース２２に伝熱されて、鏝先ピース２２の鏝先が所定温度まで加熱される。 When using this soldering apparatus 1, first, the power switch of the power supply unit 4 is turned on, the optimum soldering temperature of the electronic component to be soldered is set by the temperature setting device, and the heating switch is turned on. When the heating switch is turned on, a high frequency current corresponding to the set temperature is supplied from the high frequency power supply circuit 24 to the heating coil 21 via the cable 5, the matching circuit 9, the connectors 11, 12, etc., and magnetic lines of force are generated from the heating coil 21. Due to the magnetic lines of force, an eddy current is induced in the heating element 19 to inductively heat the heating element 19 to a predetermined temperature, and the heating temperature of the heating element 19 is transferred to the tip piece 22 so that the tip piece 22 The tip is heated to a predetermined temperature.

この加熱された鏝先ピース２２により電子部品が半田付けされ、この半田付け時に鏝先ピース２２が、電子部品やプリント基板のパターンに接触することで熱が奪われてその温度が低下すると、この温度低下が温度センサ２３で検出されて温度制御回路２５に入力され、高周波電源回路２４の出力電流が所定量増加されて、鏝先ピース２２が設定した温度に瞬時に復帰する。 An electronic component is soldered by the heated tip piece 22, and when the tip piece 22 comes into contact with the pattern of the electronic component or the printed circuit board during the soldering, the heat is taken and the temperature is lowered. The temperature drop is detected by the temperature sensor 23 and input to the temperature control circuit 25, the output current of the high frequency power supply circuit 24 is increased by a predetermined amount, and the tip piece 22 instantaneously returns to the set temperature.

この時、温度センサ２３が鏝先ピース２２の先端に埋設されていることから、鏝先ピース２２の鏝先先端部の温度を高精度に検出できて、鏝先ピース２２の温度を設定温度に維持しつつ半田付け作業が行え、低温度による半田付け作業の能率低下が防止されると共に、高温度による電子部品への熱的ストレスの印可等が確実に防止されることになる。 At this time, since the temperature sensor 23 is embedded at the tip of the tip piece 22, the temperature of the tip portion of the tip piece 22 can be detected with high accuracy, and the temperature of the tip piece 22 is set to the set temperature. The soldering operation can be performed while maintaining it, and the efficiency reduction of the soldering operation due to the low temperature is prevented, and the application of the thermal stress to the electronic component due to the high temperature is surely prevented.

このように、上記実施形態の半田鏝装置１にあっては、鏝先ピース２２内に埋設した温度センサ２３により鏝先先端の温度が検出され、この検出温度に基づいて温度制御回路２５によって高周波電源回路２４の出力が調整（制御）されるため、温度センサ２３で検出した温度に基づいて鏝先ピース２２の鏝先先端の温度を高精度に管理しつつ、電子部品等を半田付けすることができる。 As described above, in the soldering iron device 1 of the above-described embodiment, the temperature of the tip of the tip is detected by the temperature sensor 23 embedded in the tip piece 22, and the temperature control circuit 25 performs high frequency based on this detected temperature. Since the output of the power supply circuit 24 is adjusted (controlled), the temperature of the tip end of the tip piece 22 is managed with high accuracy based on the temperature detected by the temperature sensor 23, and the electronic components are soldered. Can do.

特に、温度センサ２３によって検出された温度に基づき加熱コイル２１への通電量が調整され、この加熱コイル２１の通電による磁束で発熱体１９が誘導加熱されると共に、この発熱体１９の温度が銅等の熱伝導率の高い鏝先ピース２２に伝熱されることから、鏝先を従来の電熱式の半田鏝に比較して素早く所定温度まで加熱（昇温）させることができ、温度レスポンスに優れかつ精度良い温度管理が行える半田鏝装置１を容易に得ることができる。これにより、例えば熱的ストレスに弱い半導体電子部品等であっても、最適温度で素早くかつ効率的に半田付け作業を行うことができる等、各種電子部品の半田付け作業に好適に使用することが可能となる。 In particular, the energization amount to the heating coil 21 is adjusted based on the temperature detected by the temperature sensor 23, the heating element 19 is induction-heated by the magnetic flux generated by the energization of the heating coil 21, and the temperature of the heating element 19 is set to copper. Because the heat is transferred to the tip 22 having a high thermal conductivity such as the tip, the tip can be heated (heated up) to a predetermined temperature more quickly than a conventional electrothermal soldering iron, and the temperature response is excellent. And the soldering iron apparatus 1 which can perform temperature control with sufficient precision can be obtained easily. Thus, for example, even semiconductor electronic components that are vulnerable to thermal stress can be used suitably for soldering operations of various electronic components, such as being able to perform soldering operations quickly and efficiently at the optimum temperature. It becomes possible.

また、発熱体１９が筒状支持部材１７を介して握持部２に着脱可能に支持されているため、加熱コイル２１が巻回されている発熱体１７を握持部２から取り外すことができて、例えば巻数の異なる加熱コイル２１を有する発熱体１９に交換できて、電子部品の最適半田付け温度に対応した所望の加熱効率の発熱体１９を使用することができ、汎用性に優れた半田鏝装置１が得られると共に、半田鏝装置１自体の使い勝手を向上させることが可能となる。 Further, since the heating element 19 is detachably supported by the gripping part 2 via the cylindrical support member 17, the heating element 17 around which the heating coil 21 is wound can be removed from the gripping part 2. For example, the heating element 19 having the heating coil 21 having a different number of turns can be replaced, and the heating element 19 having a desired heating efficiency corresponding to the optimum soldering temperature of the electronic component can be used. It is possible to obtain the soldering apparatus 1 and improve the usability of the soldering apparatus 1 itself.

さらに、鏝先ピース２２が発熱体１９に着脱可能に設けられているため、摩耗した鏝先ピース２２の交換を簡単に行うことができると共に、所望の温度状態が得られる所望材質の鏝先ピース２２を使用できる等、半田鏝装置１自体の使い勝手の一層の向上を図ることが可能となる。また、握持部２の内部に高周波電源回路２４と加熱コイル２１とを整合させる整合回路９が構築されたプリント基板８が埋設状態で配設されているため、握持部２の空洞部７を有効利用しつつ、加熱コイル２１にできるだけ近い位置での整合が可能となり、高周波電流の伝達ロス等を抑えて発熱体１９の加熱効率を一層高めることができ、半田付け作業の一層の能率向上を図ることが可能となる。 Furthermore, since the tip piece 22 is detachably provided on the heating element 19, the tip piece 22 made of a desired material which can easily replace the worn tip piece 22 and obtain a desired temperature state. Thus, the usability of the soldering iron device 1 itself can be further improved. Further, since the printed circuit board 8 in which the matching circuit 9 for matching the high frequency power supply circuit 24 and the heating coil 21 is arranged is embedded in the gripping portion 2, the hollow portion 7 of the gripping portion 2 is disposed. It is possible to match the position as close as possible to the heating coil 21 while making effective use of the coil, and further increase the heating efficiency of the heating element 19 by suppressing the transmission loss of the high frequency current, and further improving the efficiency of the soldering operation. Can be achieved.

また、鏝部３が握持部２に対してワンタッチ式に着脱できると共に、筒状支持部材１７に対して発熱体１９がネジ２０を取り外すことで取り外しでき、さらに発熱体１９に対して鏝先ピース２２を回転操作で取り外すことができるため、鏝部３の３つの部材を全て分解状態とすることができて、使用により劣化し易い加熱コイル２１等の修理や交換等のメンテナンス作業を極めて簡単に行うことが可能となる。 In addition, the collar 3 can be attached to and detached from the grip 2 in a one-touch manner, and the heating element 19 can be detached from the cylindrical support member 17 by removing the screw 20. Since the piece 22 can be removed by a rotation operation, all three members of the collar 3 can be disassembled, and maintenance work such as repair and replacement of the heating coil 21 or the like that is likely to deteriorate due to use is extremely simple. Can be performed.

なお、上記実施形態においては、鏝先ピース２２を発熱体１９にねじ込み方式で着脱可能に配設したが、本発明はこれに限定されず、例えば鏝先ピース２２を発熱体１９と同様の材質で一体形成し、この発熱体１９の全体を加熱コイル２１によって誘導加熱するようにしても良い。このようにすれば、鏝先ピース２２として銅等の摩耗し易い金属ではなく、ステンレスや鉄、チタン等の耐久性に優れた金属を使用できて、半田鏝装置１の鏝先の寿命を大幅に伸ばすこと等ができる。 In the above embodiment, the tip piece 22 is detachably disposed on the heating element 19 by screwing. However, the present invention is not limited to this, and for example, the tip piece 22 is made of the same material as the heating element 19. It is also possible to integrally form the heating element 19 by induction heating with the heating coil 21. In this way, a metal having excellent durability such as stainless steel, iron, and titanium can be used as the soldering tip piece 22 instead of a metal that easily wears, such as copper. Can be stretched.

また、上記実施形態における発熱体１９の構造や鏝先ピース２２の形状、筒状支持部材１７の握持部２に対する着脱構造等も一例であって、本発明の各発明に係わる要旨を逸脱しない範囲において適宜に変更することができる。 In addition, the structure of the heating element 19 in the above embodiment, the shape of the tip piece 22, the attachment / detachment structure of the cylindrical support member 17 with respect to the gripping portion 2 are examples, and do not depart from the gist related to each invention of the present invention. The range can be appropriately changed.

本発明は、電源部が握持部と別体で形成された半田鏝装置以外に、電源部を握持部内に内蔵した半田鏝装置にも適用できる。 The present invention can be applied to a soldering iron device in which the power supply unit is built in the gripping unit, in addition to the soldering iron device in which the power supply unit is formed separately from the gripping unit.

本発明に係わる高周波半田鏝装置の一実施形態を示す一部破断した側面図The partially broken side view which shows one Embodiment of the high frequency soldering iron apparatus concerning this invention 同その要部の拡大断面図The enlarged sectional view of the principal part 同図１のＡ−Ａ矢視図AA arrow view of FIG. 同図２のＢ−Ｂ矢視図BB arrow view of Fig. 2 同高周波半田鏝装置のブロック図Block diagram of the high-frequency soldering machine

Explanation of symbols

１・・・高周波半田鏝装置、２・・・握持部、３・・・鏝部、４・・・電源部、５・・・ケーブル、６・・・取付孔、７・・・空洞部、８・・・プリント基板、９・・・整合回路、１０・・・嵌合孔、１１、１２・・・コネクタ、１３・・・フラットケーブル、１５・・・ねじ、１７・・・筒状支持部材、１８・・・断熱材、１９・・・発熱体、１９ａ・・・ネジ部、２１・・・加熱コイル、２２・・・鏝先ピース、２２ａ・・・ネジ部、２３・・・・温度センサ、２４・・・高周波電源回路、２５・・・温度制御回路、２６・・・マイカ。 DESCRIPTION OF SYMBOLS 1 ... High frequency soldering iron apparatus, 2 ... Gripping part, 3 ... Gutter part, 4 ... Power supply part, 5 ... Cable, 6 ... Mounting hole, 7 ... Cavity part 8 ... printed circuit board, 9 ... matching circuit, 10 ... fitting hole, 11, 12 ... connector, 13 ... flat cable, 15 ... screw, 17 ... cylindrical Support member, 18 ... heat insulating material, 19 ... heating element, 19a ... screw part, 21 ... heating coil, 22 ... tip piece, 22a ... screw part, 23 ... -Temperature sensor, 24 ... high frequency power supply circuit, 25 ... temperature control circuit, 26 ... mica.

Claims

A heating element in which a heating coil is wound around the outer peripheral surface and having a tip piece, a gripping part that holds the heating element, a high-frequency power source that supplies a high-frequency current to the heating coil, and a temperature of the tip piece A high-frequency soldering apparatus comprising: a temperature sensor to detect; and a control circuit for controlling the high-frequency power source based on a temperature detected by the temperature sensor.

The high-frequency soldering apparatus according to claim 1, wherein the heating element is detachably supported by a gripping part via a cylindrical support member.

The high-frequency soldering apparatus according to claim 1, wherein the tip piece is detachably attached to the heating element.

4. The high frequency soldering iron device according to claim 1, wherein a matching circuit for matching a high frequency power source and a heating coil is provided inside the gripping portion.

5. The high-frequency soldering apparatus according to claim 1, wherein the temperature sensor is disposed in a state of being penetratingly disposed from the heating element to the tip piece.